Ultrasonic atomizer and self-feedback regulation and control atomization cooling system

Abstract

The invention discloses an ultrasonic atomization heat dissipation technology, particularly relates to an ultrasonic atomizer and a self-feedback regulation and control atomization cooling system, and belongs to the technical field of cooling heat dissipation. The ultrasonic atomizer is composed of a piezoelectric ultrasonic transducer and array micropore silicon wafer grooves which are arranged in a liquid storage cavity; an array ultrasonic atomization module is formed, and then liquid to be atomized is provided for each ultrasonic atomizer through a liquid distribution pipeline; monitoring the temperature of each heat dissipation area of the to-be-cooled object through a temperature monitoring module; the ultrasonic frequency and power are set through the atomization control module according to the temperature of each heat dissipation area, and the corresponding ultrasonic atomizer is controlled to conduct ultrasonic atomization. According to the invention, the cooling intensity can be effectively regulated and controlled aiming at hot spots, the heat exchange uniformity and the cooling efficiency are improved, and high-efficiency and low-energy-consumption intelligent cooling is realized.

Description

Technical Field

[0001] The invention belongs to the technical field of cooling and heat dissipation, and relates to an ultrasonic atomization heat dissipation technology, and in particular to an ultrasonic atomizer and a self-feedback controlled atomization cooling system. Background Art

[0002] With the development of high integration and high power of electronic devices, the heat dissipation problem caused by the high heat flux generated by the operation of the equipment has become a key factor limiting the improvement of device performance. If the heat generated by the equipment during operation cannot be dissipated efficiently, it will cause overheating and the temperature will exceed the safety threshold of the equipment, which will cause serious damage to the life of the equipment.

[0003] The heat exchange capacity of traditional air cooling and single-phase liquid cooling is difficult to meet the growing demand for heat dissipation. Although emerging cooling technologies represented by microchannels, spray cooling and high-speed jets have efficient heat dissipation capabilities, they are still accompanied by low heat exchange uniformity and local hot spots. This makes it impossible to fully develop their heat dissipation potential when the heat dissipation object may also have temporal and spatial non-uniformity in heat dissipation demand. Ultrasonic atomization technology uses piezoelectric ceramics to oscillate high-frequency ultrasound to form tiny droplets. It can control the atomization level and thus the heat dissipation intensity by changing the frequency and voltage of the ultrasound, making it have the great potential to both efficiently dissipate heat and overcome the temporal and spatial non-uniformity of heat dissipation.

[0004] However, the existing cooling systems have not yet fully developed the potential of ultrasonic atomization technology. Faced with increasingly complex heat dissipation needs, it is urgent to develop new ultrasonic atomization cooling technology. Summary of the invention

[0005] One of the purposes of the present invention is to provide an ultrasonic atomizer to solve the problems of high energy consumption and low efficiency of the atomizer in the prior art.

[0006] Another object of the present invention is to provide a self-feedback controlled atomization cooling system, in which the above-mentioned ultrasonic atomizer array is arranged and independently partitioned and controlled, and a temperature monitoring module is used to perform partitioned cooling and temperature reduction, thereby solving the problem of uneven temperature. In particular, when the heat load of the thermal management system changes drastically, the uneven surface temperature poses a great threat to the safe operation of electronic components. The present invention solves the problem of uneven temperature and has great application value.

[0007] Technical solution: The present invention adopts the following technical solution: In one aspect, the present invention provides an ultrasonic atomizer, comprising A liquid storage cavity, one side of which is provided with an atomizing nozzle; a piezoelectric ultrasonic transducer, disposed on a side of the liquid storage chamber opposite to the atomizing nozzle, for generating ultrasonic waves for atomization; and An array microporous silicon wafer is arranged in the liquid storage cavity and covers the atomization nozzle, and a cavity for storing the liquid to be atomized is formed between the piezoelectric ultrasonic transducer and the array microporous silicon wafer; Wherein, at least an array of microporous silicon wafers facing the atomizing nozzle area is provided with microporous nozzles distributed in an array, and the channel size of the microporous nozzles gradually decreases from the inside to the outside.

[0008] Furthermore, the liquid storage chamber is provided with at least one liquid inlet.

[0009] Furthermore, the micro-hole nozzle is a micron-sized conical hole, and the size of one end of the large hole of the conical hole is 40-100 microns.

[0010] Furthermore, the taper of the tapered hole is 50-70 degrees.

[0011] Furthermore, the surface of the piezoelectric ultrasonic transducer is also provided with a metal plate for increasing ultrasonic transmission efficiency. In another aspect, the present invention provides a self-feedback controlled atomization cooling system, comprising: An array ultrasonic atomization module is formed by a plurality of ultrasonic atomizers distributed in an array, each ultrasonic atomizer being located at a heat dissipation area of ​​the object to be cooled; A liquid distribution pipeline, providing each ultrasonic atomizer with liquid to be atomized; A temperature monitoring module, used to monitor the temperature of each heat dissipation area of ​​the object to be cooled; and The atomization control module is used to set the ultrasonic frequency and power according to the temperature of each heat dissipation area, and control the corresponding ultrasonic atomizer to perform ultrasonic atomization.

[0012] Furthermore, the array ultrasonic atomization module includes a cavity body and a plurality of array-distributed grooves arranged on the cavity body, an ultrasonic atomizer is formed in each groove, and the liquid distribution pipeline is opened in the cavity body, including a liquid inlet main pipe, a liquid outlet main pipe and a branch pipe, and the branch pipe is distributed between the liquid inlet main pipe and the liquid outlet main pipe, and is used to connect the liquid inlet of each ultrasonic atomizer.

[0013] Furthermore, the atomization cooling system also includes a liquid circulation module, which includes: a circulation pump, a cooler and a collecting pipe for collecting high-temperature working fluid liquid in the heat dissipation area. The collecting pipe and the liquid outlet main pipe are merged and sent to the cooler through a circulation pipe. After the working fluid is cooled by the cooler, it is pressurized by the circulation pump and sent to the liquid inlet main pipe for circulation.

[0014] Furthermore, the temperature monitoring module is an infrared thermometer, which obtains the temperature distribution of the object to be cooled through infrared temperature measurement technology.

[0015] Furthermore, the atomization control module includes a computer, a signal generator and a power amplifier which are connected in sequence, and the power amplifier is connected to each ultrasonic atomizer through a cable to achieve independent control of each ultrasonic atomizer.

[0016] Compared with the prior art, the present invention has the following beneficial technical effects: (1) Compared with ordinary water-cooled plate heat exchange, microchannel heat exchange, etc., the present invention can automatically adjust the cooling intensity of different areas to meet the spatial and temporal non-uniformity requirements of heat dissipation. By identifying local hot spots and feeding back to the power input signal to adjust the piezoelectric ceramic vibration to change the ultrasonic spray cooling intensity, intelligent and efficient heat dissipation can be achieved.

[0017] (2) Compared with traditional cooling methods, the present invention can achieve higher heat exchange efficiency and lower operating costs. By using ultrasonic waves to form droplets with a larger surface area to impact the surface for heat exchange, the working fluid can be more fully utilized for two-phase heat exchange, and it has a more efficient heat exchange capacity. At the same time, the required liquid volume is small, so the demand for pipeline liquid supply is low, reducing the burden on pipelines and liquid supply, and reducing costs.

[0018] (3) Ultrasonic spray cooling technology can achieve micro-integration and has practical engineering application value, providing technical support for the heat dissipation of compactly integrated high-power micro-electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the ultrasonic atomizer in Example 1 of the present invention.

[0020] Figure 2 This is a top view of the array microporous silicon wafer in Example 1 of the present invention.

[0021] Figure 3 Schematic diagram of the use principle of the ultrasonic atomizer in Example 1 of the present invention.

[0022] Figure 4 Schematic diagram of the ultrasonic atomizer in Example 2 of the present invention.

[0023] Figure 5 Schematic diagram of the atomization cooling system with self-feedback control in Example 3 of the present invention.

[0024] Figure 6 Schematic diagram of the array ultrasonic atomization module in Example 3 of the present invention.

[0025] Figure 7 for Figure 6 Middle AA section view.

[0026] Figure 8 for Figure 7 The enlarged schematic diagram of the part is C.

[0027] Fig. 9 for Figure 6 Middle BB section view.

[0028] Fig.10 for Fig. 9 The partially enlarged schematic diagram is D.

[0029] Fig.11 for Figure 5 Schematic diagram after removing the array ultrasonic atomization module.

[0030] 100-ultrasonic atomizer, 110-liquid storage chamber, 120-atomizing nozzle, 130-piezoelectric ultrasonic transducer, 131-piezoelectric ceramic sheet, 132-signal input positive terminal, 133-signal input negative terminal; 140-array microporous silicon sheet, 141-microporous nozzle; 150-liquid inlet; 160-jet; 170-metal plate; 200-array ultrasonic atomization module, 210-cavity body, 220-groove; 300-liquid distribution pipeline; 310-liquid inlet main pipe, 320-liquid outlet main pipe, 330-branch pipe; 400-temperature monitoring module; 500-atomization control module, 510-computer, 520-signal generator, 530-power amplifier, 540-signal input bus; 600-liquid circulation module, 610-circulation pump, 620-cooler, 630-circulation pipe, 640-collection pipe; 700 - object to be cooled, 710 - box body. DETAILED DESCRIPTION

[0031] The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0032] In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Example 1: Figures 1 to 3 As shown, this embodiment provides an ultrasonic atomizer 100, comprising A liquid storage chamber 110, with an atomizing nozzle 120 provided on one side of the liquid storage chamber 110; A piezoelectric ultrasonic transducer 130 is disposed on a side of the liquid storage chamber 110 opposite to the atomizing nozzle 120 and is used to generate ultrasonic waves for atomization; and The array microporous silicon wafer 140 is disposed in the liquid storage cavity 110 and covers the atomizing nozzle 120. A cavity for storing the liquid to be atomized is formed between the piezoelectric ultrasonic transducer 130 and the array microporous silicon wafer 140. Among them, at least the array microporous silicon wafer 140 facing the atomizing nozzle 120 area is provided with array-distributed microporous nozzles 141, and the channel size of the microporous nozzles 141 gradually decreases from the inside to the outside.

[0035] In this embodiment, the liquid storage cavity 110 is formed by cavity milling or other processing methods. Figure 1 is a schematic diagram of the cross section of the cavity. Figure 2 is a schematic diagram of a top view of the array microporous silicon wafer 140, Figure 3 The diagram is a schematic diagram of the ultrasonic atomizer 100 in use. The piezoelectric ultrasonic transducer 130 is installed at the top of the cavity, the atomizing nozzle 120 is opened at the bottom of the cavity, and the liquid storage cavity 110 is fully liquid-filled, which is the most ideal state. In this embodiment, the frequency and power are set for the piezoelectric ultrasonic transducer 130. When the piezoelectric ultrasonic transducer 130 is excited by the alternating electric field of the set frequency and power, the dielectric inside the piezoelectric ultrasonic transducer 130 vibrates mechanically, realizes the electro-mechanical conversion, and generates ultrasonic waves of the required frequency and power. As a vibration source, the piezoelectric material determines the characteristics of the output sound wave. The sound wave is transmitted through the liquid medium and produces a complex physical agitation effect inside the liquid. In the main direction of ultrasonic transmission, the present invention sets a micro-hole nozzle 141 with a gradual change in size. Through the gradual change in size, the sound pressure is focused, a sufficient pressure gradient is formed in the micro-hole nozzle 141, and a pressure peak is formed at the outlet tip of the micro-hole nozzle 141. When the pressure peak acts on the liquid and can overcome the inertia force and surface tension of the liquid, tiny droplets can be excited from the liquid to form a jet 160 of tiny droplets, such as Figure 3 As shown; it has technical advantages such as controllable and miniaturized atomization of working fluid.

[0036] The prior art also has two technologies, piezoelectric spray and pressure atomization, which use piezoelectric materials. Piezoelectric spray uses the piezoelectric ceramic sheet 131 to drive the porous sheet to vibrate to "screen" out droplets. Pressure atomization uses the pressure difference to pass the liquid into the nozzle vortex chamber to cause shear atomization and dispersion into a group of tiny droplets. Compared with the prior art, the present invention uses a different atomization mechanism and has the following technical advantages: (1) The ultrasonic atomization of the present invention can accurately control the speed and size of droplets by adjusting the frequency and power of ultrasonic waves, and the achievable working flow rate range is wider, thereby realizing precise thermal control of the heat dissipation object. The generated atomized particles are more uniform in size and distribution, and are particularly suitable for objects with high requirements for temperature uniformity. Piezoelectric spray uses piezoelectric ceramic sheet 131 to drive the porous sheet to vibrate to "screen" out droplets, so that the controllable range is limited. It is difficult to meet the requirements of fine control, and the working flow rate range is limited. The main mechanism of pressure atomization is to disperse the liquid into droplets with the help of pressure difference. The uniformity of its atomized particles is relatively poor, and the particle size is greatly affected by the nozzle diameter and spray pressure.

[0037] (2) The ultrasonic atomization of the present invention does not produce excessive droplet splashing or unnecessary working fluid waste during the atomization process, and can accurately deliver the droplet group to the target area, reducing unnecessary losses. However, piezoelectric atomization and pressure atomization have large spray impact force, and large aerodynamic forces will disturb the sprayed droplets and lead to a conical spray pattern, which is easy to cause splashing and material waste, and the dispersion of the atomized particles leads to a low utilization rate of the cooling working fluid.

[0038] (3) The ultrasonic atomization structure of the present invention is compact, and compared with traditional atomization methods, it avoids the conflict between spatial density and power consumption. Acoustic atomization only requires a small amount of electrical energy to excite droplets during operation, and has low energy consumption. At the same time, ultrasonic atomization has almost no mechanical noise and is suitable for application scenarios that require a quiet working environment. Pressure spraying usually requires compressed air or mechanical drive to generate high-pressure airflow, and the energy consumption is relatively high. Piezoelectric spraying uses piezoelectric ceramic sheets 131 to drive the porous sheet to vibrate, and may generate large mechanical noise during operation.

[0039] As a specific embodiment, the micropore nozzle 141 is a micron-scale conical hole, the size of the large hole end of the conical hole is 40-100 microns, and the size of the small hole end of the conical hole is 4-20 microns; the taper of the conical hole is 50-70 degrees, and the thickness of the array micropore silicon wafer 140 is generally about 20-80 microns; it should be noted that the size of the small hole of the conical hole is related to the contact angle of the micropore nozzle 141, the surface tension of the liquid and the pressure in the liquid storage chamber 110, and at least it needs to meet the working pressure in the liquid storage chamber 110. If the piezoelectric ultrasonic transducer 130 is not started, the liquid (working fluid) will not be ejected from the micropore nozzle 141.

[0040] The conical hole can be a circular cone hole, or a triangular pyramid, a quadrangular pyramid, a pentagonal pyramid or other multi-sided pyramid. For example, the conical hole is a quadrangular pyramid hole, the side length of the large-diameter end of the quadrangular pyramid hole is 50 microns, the taper is 56 degrees, the side length of the small opening end is 5 microns, and the thickness of the array microporous silicon wafer 140 is about 33 microns.

[0041] As a specific embodiment, the piezoelectric ultrasonic transducer 130 is a piezoelectric ceramic sheet 131, a signal input positive terminal 132 is provided at the top of the piezoelectric ceramic sheet 131, and a signal input negative terminal 133 is provided at the bottom side. The piezoelectric ceramic sheet 131 itself is installed on the top wall of the liquid storage chamber 110 by gluing or other estimated structures.

[0042] As a specific embodiment, the liquid storage chamber 110 is provided with at least one liquid inlet 150 , through which the working fluid is continuously replenished to the liquid storage chamber 110 . Exemplarily, the liquid inlet 150 is arranged on the side wall of the liquid storage chamber 110 .

[0043] It should be noted that the material of the array micropore silicon wafer 140 is not limited. The reason for using a silicon wafer is that micropore nozzles 141 of a required size and shape can be processed efficiently.

[0044] Embodiment 2: Same as embodiment 1, as Figure 4 As shown, the difference is that the surface of the piezoelectric ultrasonic transducer 130 is also covered with a metal plate 170 for increasing the ultrasonic transmission efficiency. Specifically, the metal plate 170 is an aluminum plate attached to the bottom of the piezoelectric ceramic sheet 131.

[0045] Example 3: Figure 5 and Figure 6 As shown, this embodiment provides a self-feedback controlled atomization cooling system, comprising The array ultrasonic atomization module 200 is formed by a plurality of ultrasonic atomizers 100 distributed in an array, each ultrasonic atomizer 100 being directed to a heat dissipation area of ​​the object to be cooled 700; A liquid distribution pipeline 300 provides each ultrasonic atomizer 100 with liquid to be atomized; The temperature monitoring module 400 is used to monitor the temperature of each heat dissipation area of ​​the object to be cooled 700; and The atomization control module 500 is used to set the ultrasonic frequency and power according to the temperature of each heat dissipation area, and control the corresponding ultrasonic atomizer 100 to perform ultrasonic atomization.

[0046] In this embodiment, the ultrasonic atomizers 100 in Embodiment 1 are arranged in an array, and the liquid distribution pipeline 300 is used to provide the liquid to be atomized to each ultrasonic atomizer 100, and the temperature monitoring module 400 is used to monitor the temperature of each heat dissipation area of ​​the object to be cooled 700. The atomization control module 500 is used to set the ultrasonic frequency and power according to the temperature of each heat dissipation area, and control the corresponding ultrasonic atomizer 100 to perform ultrasonic atomization; high-efficiency zoning and precise cooling and heat dissipation of the object to be cooled 700 is achieved, and the heat dissipation cooling capacity can be automatically adjusted according to the heat distribution of the object to be cooled 700, so as to effectively prevent local overheating, and also prevent the local excessive heat dissipation of the object to be cooled 700, resulting in ineffective waste of energy.

[0047] As a preferred embodiment, Figures 6 to 10 As shown, the array ultrasonic atomization module 200 includes a cavity body 210 and a plurality of array-distributed grooves 220 disposed on the cavity body 210. Each groove 220 serves as a liquid storage tank to form an ultrasonic atomizer 100. Figure 8 As shown, the liquid distribution pipeline 300 is opened in the cavity body 210, including a liquid inlet main pipe 310, a liquid outlet main pipe 320 and a branch pipe 330. The branch pipe 330 is distributed between the liquid inlet main pipe 310 and the liquid outlet main pipe 320, and is used to connect the liquid inlet 150 of each ultrasonic atomizer 100.

[0048] As a preferred embodiment, Figure 5 and Fig.11 As shown, the atomization cooling system also includes a liquid circulation module 600, which includes: a circulation pump 610, a cooler 620 and a collecting pipe 640 for collecting high-temperature working fluid liquid in the heat dissipation area. The collecting pipe 640 and the liquid outlet main pipe 320 are merged and sent to the cooler 620 through the circulation pipe 630. After the working fluid is cooled by the cooler 620, it is pressurized by the circulation pump 610 and sent to the liquid inlet main pipe 310 for circulation.

[0049] like Fig.11As shown, in order to meet the needs of the collection pipe 640 to collect high-temperature working fluid liquid, the object to be cooled 700 is placed in a box body 710, and the cooling working fluid sprayed by the ultrasonic atomizer 100 cools the object to be cooled 700 and is collected through the box body 710. The collection pipe 640 is connected to the low point at the bottom of the box body 710, and the collected high-temperature working fluid liquid is collected and sent to the cooler 620 through the circulation pipe 630 to achieve recycling.

[0050] like Fig.11 As shown, the temperature monitoring module 400 is an infrared thermometer, which obtains the temperature distribution of the object to be cooled 700 by infrared temperature measurement technology. The object to be cooled 700 of the present invention can be an electronic device. It should be noted that the cooling medium should be insulated relative to the electronic device, for example, low-boiling point liquid medium such as R134a, HFE7100, liquid ammonia, n-pentane, or deionized water can be used.

[0051] like Figure 5 As shown, the atomization control module 500 includes a computer 510 , a signal generator 520 and a power amplifier 530 which are connected in sequence. The power amplifier 530 is connected to each ultrasonic atomizer 100 via a cable to achieve independent control of each ultrasonic atomizer 100 .

[0052] The working process of the present invention is as follows: after the atomization cooling system is started, the liquid circulation module 600 starts to operate, and the cooling medium will enter the cavity body 210 through the liquid distribution pipeline 300 and flow out; during the working medium circulation process, the temperature monitoring module 400 starts to operate, and the temperature distribution of the target heat dissipation surface is obtained through infrared imaging technology, and fed back to the atomization control module 500, and the optimized cooling strategy is obtained after analysis, and the input AC power frequency and voltage of each ultrasonic atomizer 100 are controlled, and different electrical signals are input to the corresponding ultrasonic atomizer 100 according to the temperature conditions of different cooling sub-unit areas; each ultrasonic atomizer 100 is driven by its corresponding electrical signal to work, forming tiny droplets that impact the target surface at high speed for cooling. The cooling medium that completes the heat exchange process flows back to the circulation pipe 630 through the drainage pipe to complete the work.

[0053] During specific control, the computer 510 receives the monitoring signal of the temperature monitoring module 400, analyzes the temperature distribution of the target heat dissipation surface, and judges the temperature of each partition unit and the set value difference according to the set partition unit. The set value difference is used as the control signal (proportional control or PID control). The signal generator 520 generates a corresponding control signal, and adjusts the power of the corresponding ultrasonic atomizer 100 through the power amplifier 530.

[0054] On the one hand, the present invention utilizes ultrasonic spray cooling technology, which has the advantages of low power consumption, low working fluid consumption, high heat dissipation efficiency and small device size, which can greatly improve the heat dissipation level of electronic devices and reduce the design cost and operation burden of the cooling system; on the other hand, it utilizes the adjustable characteristics of ultrasonic spray and proposes a self-feedback controlled atomization cooling method. By identifying local hot spots and feeding back to the atomization control module 500, the piezoelectric ceramic vibration is regulated to change the ultrasonic spray cooling intensity, which can realize intelligent control of the cooling intensity of different areas, meet the temporal and spatial non-uniformity requirements of heat dissipation, and realize intelligent and efficient heat dissipation.

[0055] Each ultrasonic atomizer corresponds to a different area of ​​the cooling and heat dissipation surface. The temperature monitoring module monitors the temperature distribution of the heat dissipation surface in real time and feeds back to the atomization control module. The atomization control module adjusts the frequency-voltage input of each ultrasonic atomizer according to the temperature distribution of the heat dissipation surface to change the atomizer spray intensity (injection speed, droplet size, flow rate, etc.) to regulate the cooling intensity, and finally realizes self-feedback regulation of high-speed atomization cooling to meet the temporal and spatial unevenness requirements of heat dissipation.

[0056] The above embodiments are only used to illustrate the present invention, but not to limit the present invention. Although the present invention is described in detail with reference to the embodiments, it should be understood by those skilled in the art that various combinations, modifications or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and should be included in the scope of the claims of the present invention.

Claims

1. An ultrasonic atomizer, characterized in that: include A liquid storage cavity, one side of which is provided with an atomizing nozzle; a piezoelectric ultrasonic transducer, disposed on a side of the liquid storage chamber opposite to the atomizing nozzle, for generating ultrasonic waves for atomization; and An array microporous silicon wafer is arranged in the liquid storage cavity and covers the atomization nozzle, and a cavity for storing the liquid to be atomized is formed between the piezoelectric ultrasonic transducer and the array microporous silicon wafer; Wherein, at least an array of microporous silicon wafers facing the atomizing nozzle area is provided with microporous nozzles distributed in an array, and the channel size of the microporous nozzles gradually decreases from the inside to the outside.

2. The ultrasonic atomizer according to claim 1, characterized in that: The liquid storage chamber is provided with at least one liquid inlet.

3. The ultrasonic atomizer according to claim 1, characterized in that: The micro-hole nozzle is a micron-sized conical hole, and the size of one end of the large hole of the conical hole is 40-100 microns.

4. The ultrasonic atomizer according to claim 1, characterized in that: The taper of the tapered hole is 50-70 degrees.

5. The ultrasonic atomizer according to claim 1, characterized in that: The surface of the piezoelectric ultrasonic transducer is also provided with a metal plate for increasing ultrasonic transmission efficiency.

6. A self-feedback controlled atomization cooling system, characterized in that: include An array ultrasonic atomization module is formed by a plurality of ultrasonic atomizers distributed in an array, each ultrasonic atomizer being located at a heat dissipation area of ​​the object to be cooled; A liquid distribution pipeline, providing each ultrasonic atomizer with liquid to be atomized; A temperature monitoring module, used to monitor the temperature of each heat dissipation area of ​​the object to be cooled; and The atomization control module is used to set the ultrasonic frequency and power according to the temperature of each heat dissipation area, and control the corresponding ultrasonic atomizer to perform ultrasonic atomization.

7. The atomizing cooling system according to claim 6, characterized in that: The array ultrasonic atomization module includes a cavity body and a plurality of array-distributed grooves arranged on the cavity body, an ultrasonic atomizer is formed in each groove, the liquid distribution pipeline is opened in the cavity body, and includes a liquid inlet main pipe, a liquid outlet main pipe and a branch pipe, and the branch pipe is distributed between the liquid inlet main pipe and the liquid outlet main pipe, and is used to connect the liquid inlet of each ultrasonic atomizer.

8. The atomizing cooling system according to claim 7, characterized in that: It also includes a liquid circulation module, which includes: a circulation pump, a cooler and a collecting pipe for collecting high-temperature working fluid liquid in the heat dissipation area. The collecting pipe and the liquid outlet main pipe are merged and sent to the cooler through a circulation pipe. After the working fluid is cooled by the cooler, it is pressurized by the circulation pump and sent to the liquid inlet main pipe for circulation.

9. The atomizing cooling system according to claim 7, characterized in that: The temperature monitoring module is an infrared thermometer, which obtains the temperature distribution of the object to be cooled through infrared temperature measurement technology.

10. The mist cooling system according to claim 7, characterized in that: The atomization control module comprises a computer, a signal generator and a power amplifier which are connected in sequence. The power amplifier is connected to each ultrasonic atomizer through a cable to realize independent control of each ultrasonic atomizer.

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