A semiconductor laser processing machine tool and its usage method

Abstract

The present invention discloses a semiconductor laser processing machine tool and its usage method, including: a bottom frame, the bottom frame being a hollow structure with a slot at the top; a control cabinet, the control cabinet being fixedly connected to one side of the bottom frame; a transmission and feeding structure, the transmission and feeding structure being arranged on one side of the bottom frame, the transmission and feeding structure including a sliding round rod, the bottom end of the sliding round rod being slidably connected to a sliding cylinder, and the bottom of the sliding cylinder being fixedly connected to a hemispherical frame. In the present invention, under the action of the transmission and feeding structure, under the action of the sliding round rod and the sliding cylinder, the rolling ball can be driven to move downward, and then the cut object can be pushed downward and separated from the cutting main board. At the same time, under the action of the inclined plate inside the material pushing and heat dissipation structure, the cut object can be guided to the horizontal position to avoid accumulation under the main board. At this time, under the action of components such as the active fan body and the driven fan body, auxiliary heat dissipation can be carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser machine tools, and particularly to a semiconductor laser processing machine tool and a using method thereof. Background Art

[0002] A semiconductor laser processing machine tool is a cutting machine tool device with a semiconductor-pumped laser as the main body. The application of semiconductor laser processing machine tools in industrial production is becoming more and more extensive, and most processing requirements can be realized. Compared with the tool processing method, semiconductor laser equipment is safer and more efficient.

[0003] Generally, in the actual use process of traditional semiconductor laser processing machine tools, after laser cutting is completed, due to the small gap of the cross-section, burrs of the plate material, etc., there is still frictional force for limiting connection between the cutting object and the main board. At this time, an external force needs to be applied to separate the object from the main board. This process often requires manual intervention, is easy to cause injury, and is very inconvenient. Moreover, when the cut object falls into the inner part of the bottom frame, it will accumulate under the main board. When the accumulation is high, it will affect the cutting efficiency. And after cutting is completed, high temperatures will be generated at the cutting parts of the main board or the cutting parts. At this time, the high temperature is likely to cause edge deformation at the cutting part of the main board or the cutting part of the cutting part, thereby affecting the quality of the object and the main board, which is very inconvenient.

[0004] In summary, it is necessary to propose a semiconductor laser processing machine tool and a using method thereof to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor laser processing machine tool and a using method thereof to solve the problems raised in the above background art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A semiconductor laser processing machine tool and a using method thereof, including:

[0008] A bottom frame, the bottom frame is a hollow structure with a slot at the top;

[0009] A control cabinet, the control cabinet is fixedly connected to one side of the bottom frame;

[0010] A transmission and feeding structure, the transmission and feeding structure is arranged on one side of the bottom frame. The transmission and feeding structure includes a sliding round rod, the bottom end of the sliding round rod is slidably connected to a sliding cylinder, the bottom of the sliding cylinder is fixedly connected to a hemispherical frame, the outer surface bottom of the hemispherical frame is fixedly connected to an annular block, the inner wall of the annular block is fixedly connected to a limiting convex block, and rolling balls are arranged inside the hemispherical frame;

[0011] Pushing and heat dissipation structure, the pushing and heat dissipation structure is arranged on one side of the bottom frame, the pushing and heat dissipation structure includes a pushing frame and a driving rod, a pushing groove is opened on one side of the pushing frame, the pushing groove is composed of two inclined grooves with different slopes, several driven rods are rotatably connected to the top of the pushing frame, driven gears are fixedly connected to the outer surfaces of the driven rods, driven fan bodies are fixedly connected to the tops of the driven rods, a driving fan body is fixedly connected to the top of the driving rod, and a driving gear is fixedly connected to the outer surface of the driving rod;

[0012] Moving clamping structure, the moving clamping structure includes a U-shaped clamping frame, and a support plate is fixedly connected to the bottom of the U-shaped clamping frame;

[0013] Discharge port, the discharge port is opened on one side of the bottom frame.

[0014] Preferably, the transmission and material guiding structure further includes a U-shaped plate, the outer surface of the U-shaped plate is fixedly connected to the outer surface of the bottom frame, a first electric telescopic rod is fixedly installed on one side of the outer surface of the U-shaped plate, the output end of the first electric telescopic rod is fixedly connected to a first connecting block, a first L-shaped plate is fixedly connected to one side of the outer surface of the first connecting block, a second electric telescopic rod is fixedly installed at the bottom of the first L-shaped plate, the output end of the second electric telescopic rod is fixedly connected to a second L-shaped plate, a third electric telescopic rod is fixedly installed on one side of the outer surface of the second L-shaped plate, and the output end of the third electric telescopic rod is fixedly connected to a second connecting block.

[0015] Preferably, a semiconductor laser is fixedly installed at the bottom of the outer surface of the second connecting block, a laser head is arranged at the bottom of the semiconductor laser, an installation block is fixedly connected to the outer surface of the semiconductor laser, the top of the sliding round rod is fixedly connected to the bottom of the outer surface of the installation block, a return spring is sleeved on the outer surface of the sliding round rod, and two ends of the return spring are respectively fixedly connected to the outer surfaces of the installation block and the sliding cylinder.

[0016] Preferably, the pushing and heat dissipation structure further includes an inclined plate fixedly connected to the inside of the bottom frame, a first rectangular frame is fixedly connected to one side of the outer surface of the bottom frame, a first motor is fixedly installed at the output end of the first rectangular frame, a first screw rod is fixedly connected to the output end of the first motor, a first screw hole block is threadedly connected to the outer surface of the first screw rod, a sliding groove is opened on one inner wall of the bottom frame, the sliding groove is composed of an inclined groove and a straight groove, a first wheel groove is opened at the bottom of the inner wall of the bottom frame at the connection of the inclined groove and the straight groove of the sliding groove, a first guide wheel is rotatably connected to the inner wall of the first wheel groove, a second wheel groove is opened at the top of the inner wall of the bottom frame at the connection of the inclined groove and the straight groove of the sliding groove, and a second guide wheel is rotatably connected to the inner wall of the second wheel groove.

[0017] Preferably, one side of the outer surface of the first screw hole block is fixedly connected with a third L-shaped plate, the top of the third L-shaped plate is fixedly connected with a sliding rod, the outer surface of the sliding rod is slidably connected with a sliding cylinder, and the top of the outer surface of the sliding cylinder is fixedly connected with a third connecting block.

[0018] Preferably, one side of the outer surface of the third connecting block is fixedly connected with a fixed rod, one end of the fixed rod is rotatably connected with a rotating slider, and one side of the rotating slider is fixedly connected with one side of the material pushing frame.

[0019] Preferably, an installation groove is opened on one side of the outer surface of the material pushing frame, a second motor is fixedly installed on the top of the inner wall of the installation groove, the output end of the second motor is fixedly connected with the bottom end of a driving rod, the driving gear is meshed with the adjacent driven gears on both sides, the adjacent two driven gears are meshed with each other, the top of the outer surface of the material pushing frame is fixedly connected with a protective frame, and heat dissipation holes are opened on the top of the protective frame.

[0020] Preferably, the movable clamping structure further includes a second rectangular frame fixedly connected with one side of the outer surface of the bottom frame, a third motor is fixedly installed on one side of the outer surface of the second rectangular frame, the output end of the third motor is fixedly connected with a second screw rod, the outer surface of the second screw rod is threadedly connected with a second screw hole block, a first rectangular through hole is opened on the top of the outer surface of the second rectangular frame, the inner wall of the first rectangular through hole is slidably connected with a first sliding rod, and the top end of the first sliding rod is fixedly connected with a third rectangular frame.

[0021] Preferably, a fourth motor is fixedly installed on one side of the outer surface of the third rectangular frame, the output end of the fourth motor is fixedly connected with a third screw rod, the thread rotation directions at both ends of the third screw rod are opposite, two third screw hole blocks are symmetrically threadedly connected to the outer surface of the third screw rod, a second rectangular through hole is opened on one side of the third rectangular frame, one side of the outer surface of the third screw hole block is fixedly connected with a second sliding rod, the second sliding rod is slidably arranged on the inner wall of the second rectangular through hole, one end of the second sliding rod is fixedly connected with a U-shaped clamping frame, and a fourth screw rod is threadedly connected to the inner wall of one side of the U-shaped clamping frame, and one end of the fourth screw rod is fixedly connected with a rubber round block.

[0022] Preferably, it further includes a usage method of a semiconductor laser processing machine tool, which includes the following steps:

[0023] S1. During use, place the processing plate between two U-shaped clamping frames. At this time, start the fourth motor, so that the fourth motor can drive the third screw rod to rotate, and then drive the third screw hole block to move, and then drive the second sliding rod to slide on the inner wall of the second rectangular through hole, and then drive the U-shaped clamping frame to move. The support plate can assist in supporting the processing plate. At this time, rotate the fourth screw rod so that the rubber round block can assist in clamping and fixing the processing plate. At this time, start the third motor, so that the third motor can drive the second screw rod to rotate, and then drive the second screw hole block to move, so that the first sliding rod can slide on the inner wall of the first rectangular through hole, and then drive the U-shaped clamping frame and the processing plate to move;

[0024] S2. At this time, start the first electric telescopic rod to drive components such as the first L-shaped plate to drive, and then drive the semiconductor laser to move. At this time, start the second electric telescopic rod, so that the second electric telescopic rod can drive the second L-shaped plate to move, and then drive the semiconductor laser to move up and down. Then start the third electric telescopic rod, and then drive the semiconductor laser to move left and right, and then drive the semiconductor laser to move left and right. When the semiconductor laser is cutting, at this time, it can move under the action of the rolling ball for guiding, and at the same time drive the sliding cylinder to slide on the inner wall of the sliding round rod, and then the return spring deforms. When cutting to separate the object, under the action of the return spring, the rolling ball can be pushed downward, so that the cut object is separated from the main board;

[0025] S3. When the processing is completed, the object will fall onto the inclined plate and then slide into the interior of the bottom frame. At this time, start the first motor, so that the first motor can drive the first screw rod to move, and then drive the first screw hole block to move, so that the rotating slider can slide on the inner wall of the sliding groove. When sliding to the connection of the inclined groove and the straight groove, the rotating slider can be guided by the first guide wheel and the second guide wheel. At this time, the rotating slider will rotate. When the rotating slider moves on the inner wall of the inclined groove, at this time, it can drive the sliding rod to slide on the inner wall of the sliding cylinder;

[0026] S4. The rotating slider can drive the material pushing frame to move, and then can assist in pushing the object on the inclined plate. At the same time, the second motor can be started, and then drive the driving rod to rotate. At this time, it can drive the driving gear to rotate, and then drive the driven gear to rotate, and at the same time drive the driven rod to rotate, and then drive the driving fan body and the driven fan body to rotate, and then heat dissipation can be carried out. At the same time, when the driving fan body and the driven fan body move on the inclined plate, at this time, the wind directions of the driving fan body and the driven fan body are oblique wind directions, and then can assist in dissipating heat from the semiconductor laser and the processing plate.

[0027] Compared with the prior art, the beneficial effects of the present invention are as follows: Under the action of the transmission and feeding structure, the present invention can drive the rolling balls to move downward under the action of the sliding round rod and the sliding cylinder, thereby pushing the cut object downward, separating it from the cutting main board. At the same time, under the action of the inclined plate inside the feeding and heat dissipation structure, the cut object after cutting can be guided to the horizontal position, avoiding accumulation below the main board. At this time, with the help of components such as the active fan blade body and the driven fan blade body, auxiliary heat dissipation can be carried out. At the same time, under the action of the rotating slider and the sliding groove, the feeding frame can be driven to move, thereby pushing the cut object on the inclined plate onto the horizontal plane, and then cooperating with the discharge port to push it out, preventing the material from accumulating at the bottom of the main board. At the same time, timely heat dissipation can be carried out during cutting. During the process of pushing out the material after cutting, auxiliary heat dissipation can be carried out on the main board. At this time, due to multiple cutting operations, the temperature of the main board is relatively high, and auxiliary heat dissipation can improve production efficiency. Under the action of the moving clamping structure, the main board can be assisted in fixing and moving, which is convenient for cooperating with the semiconductor laser for processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 FIG. is a schematic diagram showing the overall structure of a semiconductor laser processing machine tool and its usage method;

[0029] Figure 2 FIG. is a schematic diagram showing the rear view structure of a semiconductor laser processing machine tool and its usage method;

[0030] Figure 3 FIG. is a schematic diagram showing the structure at the U-shaped plate of a semiconductor laser processing machine tool and its usage method;

[0031] Figure 4 FIG. is a schematic diagram showing the structure at the sliding cylinder of a semiconductor laser processing machine tool and its usage method;

[0032] Figure 5 FIG. is a schematic diagram showing the structure at the inclined plate of a semiconductor laser processing machine tool and its usage method;

[0033] Figure 6 FIG. is a schematic diagram showing the structure at the feeding frame of a semiconductor laser processing machine tool and its usage method;

[0034] Figure 7 FIG. is a schematic diagram showing the structure at the protective frame of a semiconductor laser processing machine tool and its usage method;

[0035] Figure 8 FIG. is a schematic diagram showing a semiconductor laser processing machine tool and its usage method Figure 5 and the enlarged view at A therein;

[0036] Figure 9To show the structural schematic diagram of the bottom frame of a semiconductor laser processing machine tool and its usage method in a bottom-up view;

[0037] Figure 10 To show a semiconductor laser processing machine tool and its usage method Figure 9 The enlarged view at position B in it;

[0038] Figure 11 To show the structural schematic diagram of the second rectangular frame of a semiconductor laser processing machine tool and its usage method;

[0039] Figure 12 To show the structural schematic diagram at the third rectangular frame of a semiconductor laser processing machine tool and its usage method.

[0040] In the figure:

[0041] 1. Bottom frame; 2. Control cabinet;

[0042] 3. Transmission and feeding structure; 31. U-shaped plate; 32. First electric telescopic rod; 33. First connecting block; 34. First L-shaped plate; 35. Second electric telescopic rod; 36. Second L-shaped plate; 37. Third electric telescopic rod; 38. Second connecting block; 39. Semiconductor laser; 310. Mounting block; 311. Sliding round rod; 312. Sliding cylinder; 313. Return spring; 314. Hemispherical frame; 315. Ring block; 316. Limiting convex block; 317. Rolling ball;

[0043] 4. Pushing and heat dissipation structure; 41. Inclined plate; 42. First rectangular frame; 43. First motor; 44. First screw; 45. First screw hole block; 46. Sliding groove; 47. Third L-shaped plate; 48. Sliding rod; 49. Sliding cylinder; 410. Third connecting block; 411. Fixed rod; 412. Rotating slider; 413. Pushing frame; 414. Pushing groove; 415. Protection frame; 416. Heat dissipation holes; 417. Mounting groove; 418. Second motor; 419. Driving rod; 420. Driving gear; 421. Driving fan blade body; 422. Driven rod; 423. Driven gear; 424. Driven fan blade body; 425. First round groove; 426. First guide wheel; 427. Second round groove; 428. Second guide wheel;

[0044] 5. Moving clamping structure; 51. Second rectangular frame; 52. Third motor; 53. Second screw; 54. Second screw hole block; 55. First rectangular through hole; 56. First sliding rod; 57. Third rectangular frame; 58. Fourth motor; 59. Third screw; 510. Third screw hole block; 511. Second rectangular through hole; 512. Second sliding rod; 513. U-shaped clamping frame; 514. Support plate; 515. Fourth screw; 516. Rubber round block;

[0045] 6. Discharge port. Detailed implementation mode

[0046] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0047] Please refer to Figures 1 to 12 , the present invention provides a technical solution:[[]]END]]

[0048] A semiconductor laser processing machine tool and its use method, including:[[]]END]]

[0049] The bottom frame 1, the bottom frame 1 is a hollow structure with a groove on the top;

[0050] The control cabinet 2, the control cabinet 2 is fixedly connected to one side of the bottom frame 1;

[0051] The transmission and feeding structure 3, the transmission and feeding structure 3 is arranged on one side of the bottom frame 1, the transmission and feeding structure 3 includes a sliding round rod 311, the bottom end of the sliding round rod 311 is slidably connected with a sliding cylinder 312, the bottom of the sliding cylinder 312 is fixedly connected with a hemispherical frame 314, the outer surface bottom of the hemispherical frame 314 is fixedly connected with an annular block 315, the inner wall of the annular block 315 is fixedly connected with a limiting convex block 316, and a rolling ball 317 is arranged inside the hemispherical frame 314;

[0052] The pushing and heat dissipation structure 4, the pushing and heat dissipation structure 4 is arranged on one side of the bottom frame 1, the pushing and heat dissipation structure 4 includes a pushing frame 413 and a driving rod 419, a pushing groove 414 is opened on one side of the pushing frame 413, the pushing groove 414 is composed of two inclined grooves with different slopes, several driven rods 422 are rotatably connected to the top of the pushing frame 413, a driven gear 423 is fixedly connected to the outer surface of the driven rod 422, a driven fan body 424 is fixedly connected to the top end of the driven rod 422, a driving fan body 421 is fixedly connected to the top end of the driving rod 419, and a driving gear 420 is fixedly connected to the outer surface of the driving rod 419;

[0053] The moving clamping structure 5, the moving clamping structure 5 includes a U-shaped clamping frame 513, and a support plate 514 is fixedly connected to the bottom of the U-shaped clamping frame 513;

[0054] The discharge port 6, the discharge port 6 is opened on one side of the bottom frame 1.

[0055] Under the action of the transmission and feeding structure 3, driven by the sliding round rod 311 and the sliding cylinder 312, the rolling ball 317 can be driven to move downward, and then the cut object can be pushed out downward, thus separating from the cutting main board. At the same time, under the action of the inclined plate 41 inside the material pushing and heat dissipation structure 4, the cut object can be guided to the horizontal position to avoid accumulation below the main board. At this time, with the help of components such as the active fan blade body 421 and the driven fan blade body 424, auxiliary heat dissipation can be carried out. At the same time, under the action of the rotating slider 412 and the sliding groove 46, the material pushing frame 413 can be driven to move, and then the cut object on the inclined plate 41 can be pushed onto the horizontal plane, and then cooperate with the discharge port 6 to be pushed out, so that the material will not accumulate at the bottom of the main board. At the same time, timely heat dissipation can be carried out during cutting. During the process of pushing out the material after cutting, auxiliary heat dissipation can be carried out on the main board. At this time, due to multiple cutting operations, the main board has a high temperature, and auxiliary heat dissipation can improve production efficiency. Under the action of the moving clamping structure 5, the main board (the main board is mostly a rectangular raw material board made of metal, not shown in the figure) can be assisted in fixing and moving, so as to facilitate cooperation with the semiconductor laser 39 for processing.

[0056] Reference Figure 3 , the transmission and feeding structure 3 further includes a U-shaped plate 31. The outer surface of the U-shaped plate 31 is fixedly connected to the outer surface of the bottom frame 1. One side of the outer surface of the U-shaped plate 31 is fixedly installed with a first electric telescopic rod 32. The output end of the first electric telescopic rod 32 is fixedly connected to a first connecting block 33. One side of the outer surface of the first connecting block 33 is fixedly connected to a first L-shaped plate 34. The bottom of the first L-shaped plate 34 is fixedly installed with a second electric telescopic rod 35. The output end of the second electric telescopic rod 35 is fixedly connected to a second L-shaped plate 36. One side of the outer surface of the second L-shaped plate 36 is fixedly installed with a third electric telescopic rod 37. The output end of the third electric telescopic rod 37 is fixedly connected to a second connecting block 38;

[0057] By setting the first electric telescopic rod 32, the second electric telescopic rod 35 and the third electric telescopic rod 37, the position of the semiconductor laser 39 can be assisted in adjusting.

[0058] Reference Figure 3 and Figure 4 , the bottom of the outer surface of the second connecting block 38 is fixedly installed with a semiconductor laser 39. A laser head is arranged at the bottom of the semiconductor laser 39. The outer surface of the semiconductor laser 39 is fixedly connected to a mounting block 310. The bottom of the outer surface of the mounting block 310 is fixedly connected to the top end of the sliding round rod 311. A return spring 313 is sleeved on the outer surface of the sliding round rod 311. The two ends of the return spring 313 are respectively fixedly connected to the outer surface of the mounting block 310 and the outer surface of the sliding cylinder 312;

[0059] Under the action of the sliding round rod 311 and the sliding cylinder 312, the return spring 313 can indirectly drive the rolling ball 317 to move up and down, thereby facilitating the separation of the cut object.

[0060] Reference Figure 5 , Figure 8 , Figure 9 and Figure 10 , the material pushing and heat dissipation structure 4 further includes an inclined plate 41 fixedly connected inside the bottom frame 1. One side of the outer surface of the bottom frame 1 is fixedly connected with a first rectangular frame 42. The output end of the first rectangular frame 42 is fixedly installed with a first motor 43. The output end of the first motor 43 is fixedly connected with a first screw rod 44. The outer surface of the first screw rod 44 is threadedly connected with a first screw hole block 45. A sliding groove 46 is opened on one inner wall of the bottom frame 1. The sliding groove 46 is composed of an inclined groove and a straight groove. The bottom of the inner wall of the bottom frame 1 at the connection of the inclined groove and the straight groove of the sliding groove 46 is provided with a first round groove 425. The inner wall of the first round groove 425 is rotatably connected with a first guide wheel 426. The top of the inner wall of the bottom frame 1 at the connection of the inclined groove and the straight groove of the sliding groove 46 is provided with a second round groove 427. The inner wall of the second round groove 427 is rotatably connected with a second guide wheel 428;

[0061] Under the action of the inclined plate 41, it can drive the cutting component for guiding, avoiding accumulation at the bottom of the main board. At the same time, under the action of the first guide wheel 426 and the second guide wheel 428, the rotating slider 412 can slide more smoothly when sliding at the connection of the inclined groove and the straight groove on the inner wall of the sliding groove 46.

[0062] Reference Figure 5 and Figure 6 , one side of the outer surface of the first screw hole block 45 is fixedly connected with a third L-shaped plate 47. The top of the third L-shaped plate 47 is fixedly connected with a sliding rod 48. The outer surface of the sliding rod 48 is slidably connected with a sliding cylinder 49. The top of the outer surface of the sliding cylinder 49 is fixedly connected with a third connecting block 410;

[0063] Under the action of the sliding rod 48 and the sliding cylinder 49, when the rotating slider 412 moves from the inclined groove of the sliding groove 46 to the straight groove, it can assist the movement.

[0064] Reference Figure 6 , one side of the outer surface of the third connecting block 410 is fixedly connected with a fixed rod 411. One end of the fixed rod 411 is rotatably connected with a rotating slider 412. One side of the rotating slider 412 is fixedly connected with one side of the material pushing frame 413;

[0065] Under the action of the fixed rod 411, the rotating slider 412 can slide on the inner wall of the sliding groove 46, and thus can move in cooperation with the sliding rod 48 and the sliding cylinder 49 according to the actual movement situation.

[0066] ReferenceFigure 6 and Figure 7 On one side of the outer surface of the material pushing frame 413, an installation groove 417 is formed. At the top of the inner wall of the installation groove 417, a second motor 418 is fixedly installed. The output end of the second motor 418 is fixedly connected to the bottom end of the driving rod 419. The driving gear 420 is meshed with the adjacent driven gears 423 on both sides. The two adjacent driven gears 423 are meshed with each other. The top of the outer surface of the material pushing frame 413 is fixedly connected with a protective frame 415. The top of the protective frame 415 is provided with heat dissipation holes 416;

[0067] Under the action of the driving gear 420 and the driven gears 423, the driving rod 419 and the driven rod 422 can be driven to rotate, and then the driving fan blade body 421 and the driven fan blade body 424 can be driven to rotate, thereby assisting in heat dissipation.

[0068] Reference Figure 1 and Figure 11 Refer to and , the moving clamping structure 5 further includes a second rectangular frame 51 fixedly connected to one side of the outer surface of the bottom frame 1. On one side of the outer surface of the second rectangular frame 51, a third motor 52 is fixedly installed. The output end of the third motor 52 is fixedly connected to a second screw rod 53. The outer surface of the second screw rod 53 is threadedly connected with a second screw hole block 54. A first rectangular through hole 55 is formed at the top of the outer surface of the second rectangular frame 51. The inner wall of the first rectangular through hole 55 is slidably connected with a first sliding rod 56. The top end of the first sliding rod 56 is fixedly connected with a third rectangular frame 57;

[0069] Under the action of the second screw rod 53, the second screw hole block 54 can be driven to move, and then the third rectangular frame 57 can be driven to move.

[0070] Reference Figure 11 and Figure 12 Refer to and , on one side of the outer surface of the third rectangular frame 57, a fourth motor 58 is fixedly installed. The output end of the fourth motor 58 is fixedly connected to a third screw rod 59. The thread directions of the two ends of the third screw rod 59 are opposite. The outer surface of the third screw rod 59 is symmetrically threadedly connected with two third screw hole blocks 510. A second rectangular through hole 511 is formed on one side of the third rectangular frame 57. On one side of the outer surface of the third screw hole block 510, a second sliding rod 512 is fixedly connected. The second sliding rod 512 is slidably arranged on the inner wall of the second rectangular through hole 511. One end of the second sliding rod 512 is fixedly connected to a U-shaped clamping frame 513. One side inner wall of the U-shaped clamping frame 513 is threadedly connected with a fourth screw rod 515. One end of the fourth screw rod 515 is fixedly connected with a rubber round block 516;

[0071] Under the action of the third screw rod 59, the third screw hole block 510 can be driven to move, and then the second sliding rod 512 can be driven to move, so that the U-shaped clamping frame 513 can assist in clamping and limiting the main board.

[0072] The working principle of the above structure is as follows:

[0073] During use, place the processing plate between the two U-shaped clamping frames 513. At this time, start the fourth motor 58, so that the fourth motor 58 can drive the third screw 59 to rotate, and then drive the third screw hole block 510 to move, and then drive the second slide bar 512 to slide on the inner wall of the second rectangular through hole 511, and then drive the U-shaped clamping frame 513 to move. The support plate 514 can assist in supporting the processing plate. At this time, rotate the fourth screw 515 so that the rubber round block 516 can assist in clamping and fixing the processing plate. At this time, start the third motor 52, so that the third motor 52 can drive the second screw 53 to rotate, and then drive the second screw hole block 54 to move, so that the first slide bar 56 can slide on the inner wall of the first rectangular through hole 55, and then drive the U-shaped clamping frame 513 and the processing plate to move;

[0074] At this time, start the first electric telescopic rod 32 to drive components such as the first L-shaped plate 34 to drive, and then drive the semiconductor laser 39 to move. At this time, start the second electric telescopic rod 35, so that the second electric telescopic rod 35 can drive the second L-shaped plate 36 to move, and then drive the semiconductor laser 39 to move up and down. Then start the third electric telescopic rod 37, and then drive the semiconductor laser 39 to move left and right, and then drive the semiconductor laser 39 to move left and right. When the semiconductor laser 39 is cutting, at this time, it can perform a guiding movement under the action of the rolling ball 317, and at the same time drive the sliding cylinder 312 to slide on the inner wall of the sliding round rod 311, and then deform the reset spring 313. When cutting to separate the object, under the action of the reset spring 313, the rolling ball 317 can be pushed out downward, so that the cut object is separated from the main board;

[0075] When the processing is completed, the object will fall onto the inclined plate 41 and then slide into the interior of the bottom frame 1. At this time, start the first motor 43, so that the first motor 43 can drive the first screw 44 to move, and then drive the first screw hole block 45 to move, so that the rotating slider 412 can slide on the inner wall of the sliding groove 46. When sliding to the connection of the inclined groove and the straight groove, the rotating slider 412 can be guided by the first guide wheel 426 and the second guide wheel 428. At this time, the rotating slider 412 will rotate. When the rotating slider 412 moves on the inner wall of the inclined groove, at this time, it can drive the sliding rod 48 to slide on the inner wall of the sliding cylinder 49;

[0076] The rotating slider 412 can drive the material pushing frame 413 to move, thereby assisting in pushing the objects on the inclined plate 41. At the same time, the second motor 418 can be started, which can drive the driving rod 419 to rotate. At this time, the driving gear 420 can be driven to rotate, which can drive the driven gear 423 to rotate. At the same time, the driven rod 422 can be driven to rotate, which can drive the driving fan body 421 and the driven fan body 424 to rotate, thereby dissipating heat. At the same time, when the driving fan body 421 and the driven fan body 424 move on the inclined plate 41, the wind direction of the driving fan body 421 and the driven fan body 424 is an oblique wind direction, thereby assisting in dissipating heat from the semiconductor laser 39 and the processing plate.

[0077] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser processing machine tool, characterized in that, Including: A bottom frame (1), the bottom frame (1) being a hollow structure with a slot at the top; A control cabinet (2), the control cabinet (2) being fixedly connected to one side of the bottom frame (1); A transmission and feeding structure (3), the transmission and feeding structure (3) being arranged on one side of the bottom frame (1), the transmission and feeding structure (3) including a sliding round rod (311), the bottom end of the sliding round rod (311) being slidably connected to a sliding cylinder (312), the bottom of the sliding cylinder (312) being fixedly connected to a hemispherical frame (314), the outer surface bottom of the hemispherical frame (314) being fixedly connected to an annular block (315), the inner wall of the annular block (315) being fixedly connected to a limiting convex block (316), and a rolling ball (317) being arranged inside the hemispherical frame (314); The transmission and feeding structure (3) further includes a U-shaped plate (31), the outer surface of the U-shaped plate (31) being fixedly connected to the outer surface of the bottom frame (1), a first electric telescopic rod (32) being fixedly installed on one side of the outer surface of the U-shaped plate (31), the output end of the first electric telescopic rod (32) being fixedly connected to a first connecting block (33), a first L-shaped plate (34) being fixedly connected to one side of the outer surface of the first connecting block (33), a second electric telescopic rod (35) being fixedly installed at the bottom of the first L-shaped plate (34), the output end of the second electric telescopic rod (35) being fixedly connected to a second L-shaped plate (36), a third electric telescopic rod (37) being fixedly installed on one side of the outer surface of the second L-shaped plate (36), the output end of the third electric telescopic rod (37) being fixedly connected to a second connecting block (38), a semiconductor laser (39) being fixedly installed at the bottom of the second connecting block (38), a laser head being arranged at the bottom of the semiconductor laser (39), an installation block (310) being fixedly connected to the outer surface of the semiconductor laser (39), the bottom of the outer surface of the installation block (310) being fixedly connected to the top end of the sliding round rod (311), a return spring (313) being sleeved on the outer surface of the sliding round rod (311), and both ends of the return spring (313) being fixedly connected to the outer surfaces of the installation block (310) and the sliding cylinder (312) respectively; A pushing and heat dissipation structure (4), the pushing and heat dissipation structure (4) being arranged on one side of the bottom frame (1), the pushing and heat dissipation structure (4) including a pushing frame (413) and a driving rod (419), a pushing slot (414) being formed on one side of the pushing frame (413), the pushing slot (414) being composed of two inclined slots with different slopes, a plurality of driven rods (422) being rotatably connected to the top of the pushing frame (413), a driven gear (423) being fixedly connected to the outer surface of the driven rod (422), a driven fan body (424) being fixedly connected to the top end of the driven rod (422), a driving fan body (421) being fixedly connected to the top end of the driving rod (419), and a driving gear (420) being fixedly connected to the outer surface of the driving rod (419); Moving clamping structure (5), the moving clamping structure (5) includes a U-shaped clamping frame (513), and a support plate (514) is fixedly connected to the bottom of the U-shaped clamping frame (513); Discharge port (6), the discharge port (6) is opened on one side of the bottom frame (1).

2. The semiconductor laser processing machine tool according to claim 1, characterized in that: The material pushing and heat dissipation structure (4) further includes an inclined plate (41) fixedly connected inside the bottom frame (1), a first rectangular frame (42) is fixedly connected to one side of the outer surface of the bottom frame (1), and an output end of the first rectangular frame (42) is fixedly installed with a first motor (43). An output end of the first motor (43) is fixedly connected to a first screw rod (44). A first screw hole block (45) is threadedly connected to the outer surface of the first screw rod (44). A sliding groove (46) is opened on an inner wall of one side of the bottom frame (1). The sliding groove (46) is composed of an inclined groove and a straight groove. A first wheel groove (425) is opened at the bottom of the inner wall of the bottom frame (1) at the connection of the inclined groove and the straight groove of the sliding groove (46). A first guide wheel (426) is rotatably connected to the inner wall of the first wheel groove (425). A second wheel groove (427) is opened at the top of the inner wall of the bottom frame (1) at the connection of the inclined groove and the straight groove of the sliding groove (46). A second guide wheel (428) is rotatably connected to the inner wall of the second wheel groove (427).

3. The semiconductor laser processing machine tool according to claim 2, characterized in that: A third L-shaped plate (47) is fixedly connected to one side of the outer surface of the first screw hole block (45). A sliding rod (48) is fixedly connected to the top of the third L-shaped plate (47). A sliding cylinder (49) is slidably connected to the outer surface of the sliding rod (48). A third connecting block (410) is fixedly connected to the top of the outer surface of the sliding cylinder (49).

4. The semiconductor laser processing machine tool according to claim 3, characterized in that: A fixing rod (411) is fixedly connected to one side of the outer surface of the third connecting block (410). One end of the fixing rod (411) is rotatably connected to a rotating slider (412). One side of the rotating slider (412) is fixedly connected to one side of the material pushing frame (413).

5. The semiconductor laser processing machine tool according to claim 4, characterized in that: An installation groove (417) is opened on one side of the outer surface of the material pushing frame (413). A second motor (418) is fixedly installed on the top of the inner wall of the installation groove (417). An output end of the second motor (418) is fixedly connected to the bottom end of a driving rod (419). The driving gear (420) is meshed with two adjacent driven gears (423). The two adjacent driven gears (423) are meshed with each other. A protective frame (415) is fixedly connected to the top of the outer surface of the material pushing frame (413). Heat dissipation holes (416) are opened on the top of the protective frame (415).

6. The semiconductor laser processing machine tool according to claim 5, characterized in that: The moving clamping structure (5) further includes a second rectangular frame (51) fixedly connected to one side of the outer surface of the bottom frame (1). A third motor (52) is fixedly installed on one side of the outer surface of the second rectangular frame (51). The output end of the third motor (52) is fixedly connected to a second screw rod (53). A second screw hole block (54) is threadedly connected to the outer surface of the second screw rod (53). A first rectangular through hole (55) is formed in the top of the outer surface of the second rectangular frame (51). A first sliding rod (56) is slidably connected to the inner wall of the first rectangular through hole (55). The top end of the first sliding rod (56) is fixedly connected to a third rectangular frame (57).

7. A semiconductor laser processing machine tool according to claim 6, characterized in that: A fourth motor (58) is fixedly installed on one side of the outer surface of the third rectangular frame (57). The output end of the fourth motor (58) is fixedly connected to a third screw rod (59). The thread rotation directions at both ends of the third screw rod (59) are opposite. Two third screw hole blocks (510) are symmetrically threadedly connected to the outer surface of the third screw rod (59). A second rectangular through hole (511) is formed in one side of the third rectangular frame (57). A second sliding rod (512) is fixedly connected to one side of the outer surface of the third screw hole block (510). The second sliding rod (512) is slidably arranged on the inner wall of the second rectangular through hole (511). One end of the second sliding rod (512) is fixedly connected to a U-shaped clamping frame (513). A fourth screw rod (515) is threadedly connected to the inner wall of one side of the U-shaped clamping frame (513). One end of the fourth screw rod (515) is fixedly connected to a rubber round block (516).

8. A method for using a semiconductor laser processing machine tool according to claim 7, comprising the following steps: S1. During use, place the processing plate between the two U-shaped clamping frames (513). At this time, start the fourth motor (58) so that the fourth motor (58) drives the third screw rod (59) to rotate. The third screw rod (59) drives the third screw hole block (510) to move. The third screw hole block (510) drives the second sliding rod (512) to slide on the inner wall of the second rectangular through hole (511). The second sliding rod (512) drives the U-shaped clamping frame (513) to move. The support plate (514) provides auxiliary support for the processing plate. At this time, rotate the fourth screw rod (515) so that the rubber round block (516) provides auxiliary clamping and fixing for the processing plate. At this time, start the third motor (52) so that the third motor (52) drives the second screw rod (53) to rotate. The second screw rod (53) drives the second screw hole block (54) to move, causing the first sliding rod (56) to slide on the inner wall of the first rectangular through hole (55). The first sliding rod (56) drives the U-shaped clamping frame (513) and the processing plate to move; S2. At this time, start the first electric telescopic rod (32). The first electric telescopic rod (32) drives the first L-shaped plate (34) to move, and the first electric telescopic rod (32) drives the semiconductor laser (39) to move. At this time, start the second electric telescopic rod (35) so that the second electric telescopic rod (35) drives the second L-shaped plate (36) to move, and the second L-shaped plate (36) drives the semiconductor laser (39) to move up and down. Start the third electric telescopic rod (37), and the third electric telescopic rod (37) drives the semiconductor laser (39) to move left and right. When the semiconductor laser (39) is cutting, under the action of the rolling ball (317), the semiconductor laser (39) performs a guiding movement. At the same time, the semiconductor laser (39) drives the sliding round rod (311) to slide on the inner wall of the sliding cylinder (312), causing the return spring (313) to deform. When the cutting reaches the separation of the object, under the action of the return spring 313, the sliding cylinder (312) enables the rolling ball (317) to be pushed out downward, separating the cut object from the main board; S3. When the processing is completed, the object first falls onto the inclined plate (41) and then slides into the interior of the bottom frame (1). At this time, start the first motor (43) so that the first motor (43) drives the first screw rod (44) to move, and the first screw rod (44) drives the first screw hole block (45) to move, causing the rotating slider (412) to slide on the inner wall of the sliding groove (46). When the rotating slider (412) slides to the connection of the inclined groove and the straight groove, under the action of the first guide wheel (426) and the second guide wheel (428), the rotating slider (412) will rotate. When the rotating slider (412) moves on the inner wall of the inclined groove, the rotating slider (412) drives the sliding rod (48) to slide on the inner wall of the sliding cylinder (49); S4. The rotating slider (412) drives the material pushing frame (413) to move, and the material pushing frame (413) assists in pushing the object on the inclined plate (41). Start the second motor (418), the second motor (418) drives the driving rod (419) to rotate, the driving rod (419) drives the driving gear (420) to rotate, the driving gear (420) drives the driven gear (423) to rotate, the driven gear (423) drives the driven rod (422) to rotate, the driving rod (419) drives the driving fan body (421) to rotate, and the driven rod (422) drives the driven fan body (424) to rotate for heat dissipation. When the driving fan body (421) and the driven fan body (424) move on the inclined plate (41), the wind direction of the driving fan body (421) and the driven fan body (424) is an oblique wind direction, and the wind direction is used to assist in dissipating heat from the semiconductor laser (39) and the processing plate.

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