Monocrystal cutting device for semiconductor triode production

Abstract

The invention discloses a single crystal cutting device for semiconductor triode production, and belongs to the technical field of semiconductor triode processing, the single crystal cutting device comprises a mounting frame, the top of the mounting frame is provided with a cutting moving assembly for driving the mounting frame to move in the vertical direction, and the mounting frame is internally provided with a line body cutting assembly for cutting a single crystal. The wire body cutting assembly is rotatably connected with the mounting frame, a wire body adjusting assembly for adjusting the wire body cutting assembly is arranged on the mounting frame, the wire body adjusting assembly is in sliding fit with the mounting frame, a cutting liquid spraying assembly is further arranged in the mounting frame, and the cutting liquid spraying assembly is arranged towards the wire body cutting assembly. Two adjusting screw rods are rotated on the mounting frame to drive two sliding blocks to move in two sliding grooves, so that a second rotating wheel is driven to move, the tension of a cutting line is adjusted, and the cutting precision can be ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor triode processing, and in particular relates to a single crystal cutting device for semiconductor triode production. Background Art

[0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions. In the process of processing semiconductor wafers, the wafer needs to be cut by a cutting device. Multi-wire cutting is a high-precision cutting method. It is mainly based on the principle of grinding and cuts semiconductor crystals through multiple high-speed moving cutting wires. These cutting wires are usually high-strength steel wires or diamond wires. Driven by a motor, the cutting wires move at extremely high speeds, generally between hundreds of meters and thousands of meters per minute. At the same time, a cutting fluid containing silicon carbide (SiC) powder is sprayed on the cutting wire. The abrasive in the cutting fluid plays a grinding role between the cutting wire and the crystal. As the cutting wire continues to move, the crystal is gradually cut into thin slices.

[0003] However, in the existing process of cutting a single crystal, the cutting line cannot be adjusted, resulting in the cutting line drooping or loosening, which may easily lead to collision between the cutting line and the crystal, causing damage and breakage of the crystal, affecting the cutting of the crystal. Summary of the invention

[0004] The embodiment of the present invention provides a single crystal cutting device for producing semiconductor triodes to solve the problems in the prior art.

[0005] The embodiment of the present invention adopts the following technical scheme: a single crystal cutting device for producing semiconductor triodes, comprising a mounting frame, a cutting moving component for driving the mounting frame to move in a vertical direction is provided on the top of the mounting frame, a wire cutting component for cutting the single crystal is provided in the mounting frame, the wire cutting component is rotatably connected to the mounting frame, a wire adjustment component for adjusting the wire cutting component is provided on the mounting frame, the wire adjustment component is slidably matched with the mounting frame, a cutting liquid spraying component is also provided in the mounting frame, and the cutting liquid spraying component is arranged toward the wire cutting component.

[0006] Furthermore, the cutting moving assembly includes a positioning frame, a moving cylinder and two sliding rods. The moving cylinder is vertically connected to the positioning frame, and the two sliding rods are symmetrically arranged on the top of the mounting frame. The sliding rods are slidingly matched with the positioning frame, and the telescopic end of the moving cylinder is fixedly connected to the mounting frame.

[0007] Furthermore, the wire cutting assembly includes a cutting line, a first rotating wheel, a second rotating wheel and a cutting motor, the first rotating wheel and the second rotating wheel are symmetrically rotatably connected to the mounting frame, the cutting motor is located on the side wall of the mounting frame and is transmission-connected to the first rotating wheel, and the cutting line is sleeved on the first rotating wheel and the second rotating wheel.

[0008] Furthermore, the line adjustment assembly includes two sliders and two adjustment screws. Two slide grooves are provided on the side walls of the mounting frame. The two sliders are respectively arranged in the two slide grooves. The sliders and the slide grooves are slidably matched. The adjustment screws are horizontally rotatably connected to the mounting frame and are located at the slide grooves. The sliders are threadedly connected to the adjustment screws, and the two ends of the second rotating wheel are rotatably connected to the two sliders.

[0009] Furthermore, the cutting liquid spraying assembly includes a horizontal electric slide, which is horizontally arranged in a mounting frame, and a mounting plate is provided on the moving end of the horizontal electric slide.

[0010] Furthermore, a driving motor is provided on the mounting plate, a driving disk is provided on the main shaft of the driving motor, a rotatably connected swinging plate is provided on the mounting plate, a swinging groove is provided on the swinging plate, a driving column is provided on the driving disk, the driving column and the swinging groove are slidably matched, a swinging arc plate is provided at the bottom of the swinging plate, and a plurality of liquid spray nozzles arranged at equal intervals are provided on the swinging arc plate.

[0011] Furthermore, an ultrasonic cleaning device is provided in the installation frame, and the cutting line passes through the ultrasonic cleaning device.

[0012] At least one of the above technical solutions adopted in the embodiments of the present invention can achieve the following beneficial effects:

[0013] Firstly, the cutting motor of the present invention drives the first rotating wheel to rotate, thereby driving the second rotating wheel to rotate on the two sliders through the cutting line. The rotation of the cutting line will cut the single crystal. During cutting, due to the continuous friction between the cutting line and the single crystal, the tightness of the cutting line will be affected. By rotating the two adjusting screws on the mounting frame at the same time, the two sliders will be driven to move in the two slide grooves respectively, thereby driving the position of the second rotating wheel to move. The tension of the cutting line is adjusted to ensure the cutting accuracy. In the single crystal cutting process, the cutting line tension has a key influence on the cutting accuracy. When the cutting line tension is appropriate, the cutting line can maintain a stable state during high-speed movement, making the cutting process smoother. For the single crystal, the accuracy of the crystal orientation is crucial to its electrical performance and subsequent process compatibility. Appropriate cutting line tension helps to cut according to the correct crystal orientation. When the tension is stable, the cutting line can accurately cut the single crystal along the predetermined crystal orientation, avoiding crystal orientation deviation caused by the offset of the cutting line.

[0014] Secondly, the horizontal electric slide of the present invention can drive the positions of several liquid spray nozzles to move horizontally, so that the cutting liquid can be comprehensively sprayed onto the single crystal, thereby improving the comprehensiveness of cutting. Thereafter, the driving motor drives the driving disk to rotate, thereby driving the driving column on the driving disk to rotate. The driving column can rotate in the swinging groove on the swinging plate, thereby driving the swinging plate to swing on the mounting plate. The swinging of the swinging plate will drive the positions of several liquid spray nozzles on the swinging arc plate to swing, and the cutting liquid can be sprayed onto the crystal surface at a wider angle, and the swinging liquid spray nozzle can evenly spray the cutting liquid on the entire crystal cutting area, ensuring that the abrasive in the cutting liquid can play a grinding role in all parts of the crystal, avoiding local lack of cutting liquid and resulting in a decrease in cutting quality; through the swinging of the liquid spray nozzle, the abrasive is more evenly distributed on the crystal surface. This is just like when painting a wall, the pigment in the paint can be evenly distributed by swinging the nozzle; the evenly distributed abrasive can make the grinding between the cutting line and the crystal more uniform, thereby improving the cutting accuracy and making the surface of the crystal smoother after cutting; the swinging cutting fluid spraying method can quickly bring the coolant to the high temperature area to prevent the crystal from generating thermal stress or even cracking due to overheating, and it is also beneficial to protect the cutting line and extend its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 2 It is a sectional view of the three-dimensional structure of the present invention;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the centerline adjustment assembly of the present invention;

[0019] Figure 4 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0020] Figure 5 It is a schematic diagram of the three-dimensional structure of the cutting fluid spraying assembly in the present invention;

[0021] Reference numerals:

[0022] Mounting frame 1, slide groove 11, cutting moving component 2, positioning frame 21, moving cylinder 22, sliding rod 23, wire cutting component 3, cutting line 31, first rotating wheel 32, second rotating wheel 33, cutting motor 34, wire adjustment component 4, slider 41, adjusting screw 42, cutting liquid spraying component 5, horizontal electric slide 50, mounting plate 51, driving motor 52, driving disk 53, swinging plate 54, swinging groove 55, driving column 56, swinging arc plate 57, liquid spraying nozzle 58, ultrasonic cleaning device 6. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0024] The following describes in detail a technical solution of a single crystal cutting device for producing semiconductor triodes according to various embodiments of the present invention in conjunction with the accompanying drawings.

[0025] Reference Figures 1 to 5 As shown, an embodiment of the present invention provides a single crystal cutting device for producing semiconductor triodes, including a mounting frame 1, a cutting moving component 2 for driving the mounting frame 1 to move in a vertical direction is provided on the top of the mounting frame 1, a wire cutting component 3 for cutting the single crystal is provided in the mounting frame 1, the wire cutting component 3 is rotatably connected to the mounting frame 1, a wire adjustment component 4 for adjusting the wire cutting component 3 is provided on the mounting frame 1, the wire adjustment component 4 is slidably matched with the mounting frame 1, a cutting liquid spraying component 5 is also provided in the mounting frame 1, and the cutting liquid spraying component 5 is set toward the wire cutting component 3.

[0026] In this embodiment, the cutting moving assembly 2 includes a positioning frame 21, a moving cylinder 22 and two sliding rods 23. The moving cylinder 22 is vertically connected to the positioning frame 21, and the two sliding rods 23 are symmetrically arranged on the top of the mounting frame 1. The sliding rod 23 is slidingly matched with the positioning frame 21, and the telescopic end of the moving cylinder 22 is fixedly connected to the mounting frame 1.

[0027] When cutting a single crystal, the movable cylinder 22 drives the installation frame 1 to move downward, which causes the two sliding rods 23 to move downward on the positioning frame 21, thereby driving the wire cutting assembly 3 below the installation frame 1 to move downward to cut the single crystal.

[0028] In this embodiment, the wire cutting assembly 3 includes a cutting line 31, a first rotating wheel 32, a second rotating wheel 33 and a cutting motor 34, the first rotating wheel 32 and the second rotating wheel 33 are symmetrically rotatably connected to the mounting frame 1, the cutting motor 34 is located on the side wall of the mounting frame 1 and is transmission-connected to the first rotating wheel 32, the cutting line 31 is sleeved on the first rotating wheel 32 and the second rotating wheel 33; the wire adjustment assembly 4 includes two sliders 41 and two adjustment screws 42, two slide grooves 11 are provided on the side wall of the mounting frame 1, the two sliders 41 are respectively arranged in the two slide grooves 11, the sliders 41 are slidably matched with the slide grooves 11, the adjustment screw 42 is horizontally rotatably connected to the mounting frame 1 and is located at the slide groove 11, the slider 41 is threadedly connected to the adjustment screw 42, and the two ends of the second rotating wheel 33 are rotatably connected to the two sliders 41.

[0029] The cutting motor 34 drives the first rotating wheel 32 to rotate, thereby driving the second rotating wheel 33 to rotate on the two sliders 41 through the cutting line 31. The rotation of the cutting line 31 will cut the single crystal. During cutting, the friction between the cutting line 31 and the single crystal will continue, which will affect the tightness of the cutting line 31. By rotating the two adjusting screws 42 on the mounting frame 1 at the same time, the two sliders 41 will be driven to move in the two slide grooves 11 respectively, thereby driving the position of the second rotating wheel 33 to move, adjusting the tension of the cutting line 31. The force can be adjusted to ensure the cutting accuracy. In the single crystal cutting process, the tension of the cutting line 31 has a key influence on the cutting accuracy. When the tension of the cutting line 31 is appropriate, the cutting line 31 can maintain a stable state during high-speed movement, making the cutting process smoother. For a single crystal, the accuracy of the crystal orientation is crucial to its electrical performance and subsequent process compatibility. Appropriate tension of the cutting line 31 helps to cut in the correct crystal orientation. When the tension is stable, the cutting line 31 can accurately cut the single crystal along the predetermined crystal orientation, avoiding crystal orientation deviation caused by the offset of the cutting line 31.

[0030] In this embodiment, the cutting liquid spraying assembly 5 includes a horizontal electric slide 50, which is horizontally arranged in the installation frame 1, and a mounting plate 51 is provided on the moving end of the horizontal electric slide 50; a driving motor 52 is provided on the mounting plate 51, and a driving disk 53 is provided on the main shaft of the driving motor 52; a rotatably connected swinging plate 54 is provided on the mounting plate 51, a swinging groove 55 is provided on the swinging plate 54, a driving column 56 is provided on the driving disk 53, and the driving column 56 is slidably matched with the swinging groove 55; a swinging arc plate 57 is provided at the bottom of the swinging plate 54, and a plurality of equally spaced liquid spray nozzles 58 are provided on the swinging arc plate 57.

[0031] In the process of cutting the single crystal through the cutting line 31, a cutting liquid containing silicon carbide SiC powder is sprayed on the cutting line through a plurality of liquid spray nozzles 58; the abrasive in the cutting liquid plays a grinding role between the cutting line and the crystal, and as the cutting line continues to move, the crystal is gradually cut into thin slices.

[0032] While spraying the cutting liquid, the horizontal electric slide 50 can drive the positions of several liquid spray nozzles 58 to move horizontally, so that the cutting liquid can be fully sprayed on the single crystal, thereby improving the comprehensiveness of the cutting. Thereafter, the driving motor 52 works to drive the driving disk 53 to rotate, thereby driving the driving column 56 on the driving disk 53 to rotate, and the driving column 56 can rotate in the swinging groove 55 on the swinging plate 54, thereby driving the swinging plate 54 to swing on the mounting plate 51. The swinging of the swinging plate 54 will drive the positions of several liquid spray nozzles 58 on the swinging arc plate 57 to swing, and the cutting liquid can be sprayed onto the crystal surface at a wider angle, and the swinging liquid spray nozzle 58 can evenly spray the cutting liquid on the entire crystal cutting area, ensuring that the abrasive in the cutting liquid can play a grinding role in all parts of the crystal, avoiding the local lack of cutting liquid and resulting in a decrease in cutting quality; through the swinging of the liquid spray nozzle 58, the abrasive is more evenly distributed on the crystal surface. This is just like when painting a wall, the pigment in the paint can be evenly distributed by swinging the spray nozzle 58; the evenly distributed abrasive can make the grinding between the cutting line and the crystal more uniform, thereby improving the cutting accuracy and making the surface of the crystal after cutting higher. The swinging cutting liquid spraying method can quickly bring the coolant to the high temperature area to prevent the crystal from generating thermal stress or even cracking due to overheating, and it is also beneficial to protect the cutting line 31 and extend its service life.

[0033] In this embodiment, an ultrasonic cleaning device 6 is also provided in the installation frame 1, and the cutting line 31 passes through the ultrasonic cleaning device 6. An ultrasonic generator is provided in the ultrasonic cleaning device 6. At an appropriate stage in the cutting process, ultrasonic cleaning can be used to clean the cutting line. Ultrasonic waves generate high-frequency vibrations in the cleaning liquid. These vibrations can cause the residues attached to the cutting line to be strongly impacted and detached. The frequency and time of ultrasonic cleaning can be determined according to the type and accumulation of the residues. Generally, it is carried out after a certain number of crystals are cut or the cutting line has been working for a certain period of time. For example, after cutting for several hours or cutting a certain area of ​​crystals, the ultrasonic cleaning device 6 is started to clean for 10-15 minutes.

[0034] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A single crystal cutting device for producing semiconductor triodes, characterized in that: The invention comprises an installation frame (1), wherein a cutting moving assembly (2) is provided at the top of the installation frame (1) for driving the installation frame (1) to move in a vertical direction, a wire cutting assembly (3) is provided inside the installation frame (1) for cutting a single crystal, the wire cutting assembly (3) and the installation frame (1) are rotatably connected, a wire adjustment assembly (4) is provided on the installation frame (1) for adjusting the wire cutting assembly (3), the wire adjustment assembly (4) and the installation frame (1) are slidably matched, and a cutting liquid spraying assembly (5) is also provided inside the installation frame (1), and the cutting liquid spraying assembly (5) is arranged toward the wire cutting assembly (3).

2. The single crystal cutting device for producing semiconductor triodes according to claim 1, characterized in that: The cutting moving assembly (2) comprises a positioning frame (21), a moving cylinder (22) and two sliding rods (23); the moving cylinder (22) is vertically connected to the positioning frame (21); the two sliding rods (23) are symmetrically arranged on the top of the mounting frame (1); the sliding rods (23) are slidably matched with the positioning frame (21); and the telescopic end of the moving cylinder (22) is fixedly connected to the mounting frame (1).

3. The single crystal cutting device for producing semiconductor triodes according to claim 1, characterized in that: The wire cutting assembly (3) comprises a cutting wire (31), a first rotating wheel (32), a second rotating wheel (33) and a cutting motor (34); the first rotating wheel (32) and the second rotating wheel (33) are symmetrically rotatably connected to the mounting frame (1); the cutting motor (34) is located on the side wall of the mounting frame (1) and is transmission-connected to the first rotating wheel (32); the cutting wire (31) is sleeved on the first rotating wheel (32) and the second rotating wheel (33).

4. The single crystal cutting device for producing semiconductor triodes according to claim 3, characterized in that: The line adjustment assembly (4) comprises two sliders (41) and two adjustment screws (42). Two slide grooves (11) are provided on the side wall of the installation frame (1). The two sliders (41) are respectively arranged in the two slide grooves (11). The sliders (41) and the slide grooves (11) are slidably matched. The adjustment screw (42) is horizontally rotatably connected to the installation frame (1) and is located at the slide groove (11). The slider (41) and the adjustment screw (42) are threadedly connected. The two ends of the second rotating wheel (33) are rotatably connected to the two sliders (41).

5. The single crystal cutting device for producing semiconductor triodes according to claim 1, characterized in that: The cutting liquid spraying assembly (5) comprises a horizontal electric slide (50), wherein the horizontal electric slide (50) is horizontally arranged in the installation frame (1), and a mounting plate (51) is arranged on the movable end of the horizontal electric slide (50).

6. The single crystal cutting device for producing semiconductor triodes according to claim 5, characterized in that: The mounting plate (51) is provided with a driving motor (52), the main shaft of the driving motor (52) is provided with a driving disk (53), the mounting plate (51) is provided with a rotatably connected swing plate (54), the swing plate (54) is provided with a swing groove (55), the driving disk (53) is provided with a driving column (56), the driving column (56) and the swing groove (55) are slidably matched, the bottom of the swing plate (54) is provided with a swing arc plate (57), and the swing arc plate (57) is provided with a plurality of liquid spray nozzles (58) arranged at equal intervals.

7. The single crystal cutting device for producing semiconductor triodes according to claim 3, characterized in that: An ultrasonic cleaning device (6) is also provided in the installation frame (1), and the cutting line (31) passes through the ultrasonic cleaning device (6).

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