Directional arrangement device of chip-type three-terminal multilayer ceramic filter

Abstract

The invention relates to a directional arrangement device for sheet-type three-terminal multi-layer ceramic filters with consistent width and thickness, which comprises a vibration disc, a feeding mechanism and an implanting mechanism, and is characterized in that the vibration disc drives the sheet-type three-terminal multi-layer ceramic filters in the vibration disc to be transversely arranged and lead to a discharge port of the vibration disc; an inlet of the feeding mechanism is connected with a discharge port of the vibration disc, and the feeding mechanism forwards conveys the sheet-type three-terminal multilayer ceramic filters which are transversely arranged; the feeding mechanism is provided with a screening position, and the screening position is provided with a moving-out mechanism. The implanting mechanism is arranged at the tail end of the feeding mechanism; the screening position is arranged on the feeding mechanism for conveying the transversely arranged MLCF chips, the MLCF chips with the non-electrode faces facing upwards are moved out through the moving-out mechanism, the CDs of the MLCF chips entering the implanting mechanism face the cutting inner electrode faces in the vertical direction, directional arrangement of the sheet type three-terminal multi-layer ceramic filter chips with the consistent width and thickness is achieved, and the yield of the chip type three-terminal multi-layer ceramic filter chips is improved. And the arrangement efficiency, the production efficiency and the end sealing accuracy are improved.

Description

Technical Field

[0001] The present application relates to the technical field of slurry dipping of a chip-type three-terminal multilayer ceramic filter, and in particular to a directional arrangement device for a chip-type three-terminal multilayer ceramic filter. Background Art

[0002] With the rapid development of electronic information technology, multi-layer ceramic capacitors (MLCC), as one of the three major electronic components, are constantly developing in the direction of miniaturization, high capacitance, and high frequency. In various electronic circuit applications, a variety of multi-layer ceramic filters (MLCF) with a three-terminal appearance structure have developed rapidly. According to the internal structure, they include T-type multi-layer LC filter, π-type multi-layer LC filter, and C-type multi-layer filter (i.e., three-terminal capacitor filter). Compared with MLCC, three-terminal capacitor filters have better high-frequency characteristics, lower equivalent series inductance (ESL), and less mounting area, and are gradually replacing some high-capacitance MLCCs in some applications.

[0003] Both MLCF and MLCC are made of multi-layer dielectric films that are stacked in an interlaced manner. In addition to leading out the internal electrodes in the length direction of the chip, the internal electrodes are also led out in the width direction. By setting up the ground electrode, the current can flow in from both ends of the MLCF and flow out from the middle ground electrode, thereby shortening the current path by half. At the same time, because the current can flow out from the four electrode directions and the existence of self-inductance, the equivalent series inductance (ESL) of the MLCF can be greatly reduced.

[0004] The MLCF ground electrode dipping operation is usually carried out by arranging the MLCF ceramic chip in an array through a SUS carrier, a JIG carrier, a thin rubber plate, a carrier tape and other tooling, so that the electrode surface to be dipped in the slurry at the waist is exposed, and the ground electrode is coated on the electrode surface of the chip through a specific dipping process. After drying and changing the surface, the ground electrode on the other side is dipped in silver and dried, thereby obtaining an MLCF chip coated with a ground external electrode.

[0005] Usually, for some MLCFs ​​with inconsistent width and thickness, the ground electrode is usually made through physical methods, that is, through processing high-precision tooling, using the size difference of the chip in the width and thickness directions to identify and control the placement direction of the chip. After directional identification of the width and thickness directions of the chip and array arrangement, it can be ensured that when the chip is loaded by SUS carriers, JIG carriers, thin rubber plates, carriers and other tooling, the electrode surface in the thickness direction is exposed at the waist. However, for some MLCFs ​​with consistent width and thickness, there is no dimensional deviation in the width and thickness directions, and it is impossible to identify, orient and arrange the width and thickness directions through simple physical methods. It can only rely on manual visual identification and arrangement to ensure that the electrode surface is exposed at the waist when it is loaded by the tooling, which makes the arrangement time long, the efficiency low, the production cost high, and it is difficult to achieve mass production. Summary of the invention

[0006] Based on this, the present application provides a directional arrangement device for a chip-type three-terminal multilayer ceramic filter that can solve the above-mentioned technical problems, and can directional arrange MLCF chips with consistent width and thickness, thereby improving production efficiency and reducing production costs.

[0007] The above-mentioned purpose of the present application is achieved through the following technical solutions:

[0008] The present application provides a directional arrangement device for a chip-type three-terminal multilayer ceramic filter, wherein the width and thickness of the chip-type three-terminal multilayer ceramic filter are the same, and the inner electrodes are exposed on both sides in the thickness direction; the device comprises:

[0009] A vibration plate, wherein the vibration plate drives a chip-type three-terminal multilayer ceramic filter arranged transversely therein to lead to a discharge port thereof;

[0010] A feeding mechanism, wherein the inlet of the feeding mechanism is connected to the outlet of the vibration plate, and the feeding mechanism conveys the chip-type three-terminal multilayer ceramic filter arranged transversely and entering forward; the feeding mechanism is provided with a screening position, and the screening position is provided with a removal mechanism, and the removal mechanism is used to remove the chip-type three-terminal multilayer ceramic filter placed transversely in a second state from the feeding mechanism; wherein the second state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the width surface;

[0011] An implantation mechanism is arranged at the end of the feeding mechanism, and is used to implant the chip-type three-terminal multilayer ceramic filter which is placed horizontally in the first state and transported by the feeding mechanism into a carrier board; wherein, the first state is that the chip-type three-terminal multilayer ceramic filter is in the up and down directions along both sides of the thickness surface.

[0012] In an optional embodiment, a first CCD camera is arranged above the screening position, and the first CCD camera obtains an image of the chip-type three-terminal multilayer ceramic filter located at the screening position and sends it to the control terminal. The control terminal determines whether the chip-type three-terminal multilayer ceramic filter is in the first state or the second state according to the image, and controls the removing mechanism to remove the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state from the feeding mechanism.

[0013] In an optional embodiment, the control terminal performs the following steps:

[0014] Acquire an original image of the chip-type three-terminal multilayer ceramic filter located at the screening position;

[0015] Converting the original image into a grayscale image;

[0016] Use edge detection algorithms to extract all edges in the grayscale image;

[0017] Detect all contours in the image, filter out irrelevant contours according to preset positions or sizes, and obtain the chip contour;

[0018] Extracting a chip area according to the chip outline;

[0019] Perform secondary contour detection in the chip area to determine whether there is a contour of a preset size at a preset position;

[0020] If yes, it is judged that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the first state; if no, it is judged that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the second state, and the removal mechanism is controlled to remove the chip-type three-terminal multilayer ceramic filter from the feeding mechanism.

[0021] In an optional embodiment, the device also includes a recovery track, which is located on the side of the feeding mechanism, and the recovery track is used to receive the chip-type three-terminal multilayer ceramic filter removed by the removal mechanism and feed it into the vibration disk.

[0022] In an optional embodiment, the feeding mechanism includes a vibrating member and a straight vibration track arranged on the vibrating member;

[0023] The removal mechanism includes an air blowing hole, which is arranged on the side of the straight vibration track opposite to the recovery track. A connecting channel corresponding to the air blowing hole is also arranged on the side of the straight vibration track adjacent to the recovery track, and the connecting channel connects the straight vibration track and the recovery track; the air blowing hole is used to blow out gas to blow the chip-type three-terminal multilayer ceramic filter from the straight vibration track along the connecting channel into the recovery track.

[0024] In an optional embodiment, a magnetic member is provided below the connecting channel, and the magnetic member extends along the direction of the connecting channel to below the feeding mechanism and below the recovery track respectively.

[0025] In an optional embodiment, the implantation mechanism includes an implantation component, a horizontal moving platform and a second CCD camera;

[0026] The horizontal moving platform is provided with a carrier plate fixing position, and the second CCD camera is used to photograph the carrier plate fixed on the carrier plate fixing position and position it;

[0027] The horizontal moving platform moves the carrying plate to a predetermined position according to the positioning information of the second CCD camera;

[0028] The implantation component is connected to the outlet of the feeding mechanism, and the implantation component includes an implantation element, which sequentially implants the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate.

[0029] In an optional embodiment, the implant element is a punch, and the implant assembly further includes an implant port located below the punch, the size of the implant port being larger than the size of the chip-type three-terminal multilayer ceramic filter; the punch can absorb the chip-type three-terminal multilayer ceramic filter that moves from the outlet of the feeding mechanism to above the implant port;

[0030] The horizontal moving platform moves the carrying plate to below the implantation port according to the positioning information of the second CCD camera, so that the unloaded carrying hole on the carrying plate is aligned with the implantation port and the punch;

[0031] The punch moves downward to implant the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate through the implantation opening.

[0032] In an optional embodiment, the implantation element is a magnetic suction head, an implantation nozzle or an implantation manipulator, and the magnetic suction head, the implantation nozzle or the implantation manipulator is used to adsorb or grab the chip-type three-terminal multilayer ceramic filter and implant the chip-type three-terminal multilayer ceramic filter into the corresponding bearing hole on the bearing plate.

[0033] In an optional embodiment, the horizontal moving platform includes an X-axis high-precision servo linear module, a Y-axis high-precision servo linear module and a positioning clamping assembly, the X-axis high-precision servo linear module and the Y-axis high-precision servo linear module drive the carrier plate fixed position to move horizontally along the X direction and the Y direction; the positioning clamping assembly is arranged at the carrier plate fixed position for fixing the carrier plate;

[0034] The device also includes a loading position on the carrier plate, a loading position on the carrier plate, and a loading and unloading manipulator;

[0035] The loading and unloading robot is used to grab the empty loading plate at the loading position of the loading plate to the loading plate fixed position, and the loading and unloading robot is also used to grab the loading plate carrying the chip-type three-terminal multilayer ceramic filter from the loading plate fixed position to the loading plate unloading position.

[0036] This application has the following beneficial effects:

[0037] The directional arrangement device of the chip-type three-terminal multilayer ceramic filter in the embodiment of the present application arranges the MLCF chips laterally through a vibration plate, sets a screening position on the feeding mechanism for conveying the laterally arranged MLCF chips, and removes the MLCF chips laterally placed in the second state through a removal mechanism, so that the CD of the MLCF chip entering the implantation mechanism faces the cut inner electrode surface in the up and down direction, thereby realizing the directional arrangement of chip-type three-terminal multilayer ceramic filter chips with uniform width and thickness, and improving the arrangement efficiency, production efficiency and sealing accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic structural diagram of a chip-type three-terminal multilayer ceramic filter with uniform width and thickness in an exemplary embodiment;

[0039] Figure 2 is a schematic structural diagram of a directional arrangement device of a chip-type three-terminal multilayer ceramic filter in an exemplary embodiment;

[0040] Figure 3 is a schematic structural diagram of a vibrating plate and a feeding mechanism in an exemplary embodiment;

[0041] Figure 4 is a schematic structural diagram of a vibration plate, a feeding mechanism, and an implanting mechanism in an exemplary embodiment;

[0042] Figure 5 is a schematic structural diagram of loading and unloading materials on a carrier plate in an exemplary embodiment;

[0043] Figure 6 is a schematic structural diagram of a carrier plate in an exemplary embodiment;

[0044] Figure 7 Schematic diagram of the structure of an MLCF chip in an exemplary embodiment.

[0045] Description of Figure Numbers:

[0046] 100. Directional arrangement device for chip-type three-terminal multilayer ceramic filter; 110. Workbench;

[0047] 120, vibrating plate; 121, vibrating base; 122, hopper;

[0048] 130, feeding mechanism; 131, vibrating member; 132, straight vibration track; 1321, air blowing hole; 1322, air blowing device; 133, first CCD camera; 134, connecting channel; 135, screening position;

[0049] 140. implantation mechanism; 141. implantation assembly; 1412. punch; 142. horizontal moving platform; 1422. X-axis high-precision servo linear module; 1423. Y-axis high-precision servo linear module; 143. second CCD camera;

[0050] 150, load-bearing plate;

[0051] 160, Recovery track;

[0052] 170, loading position on the carrier plate;

[0053] 180, loading plate unloading position;

[0054] 190. Loading and unloading manipulator;

[0055] 200. Chip-type three-terminal multilayer ceramic filter. DETAILED DESCRIPTION

[0056] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0057] In addition, the terms "first" and "first" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "first" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0059] In response to the technical problems in the background technology, the present application provides a directional arrangement device for chip-type three-terminal multilayer ceramic filters with consistent width and thickness, which can be used to directional arrange chip-type three-terminal multilayer ceramic filters with consistent width and thickness in batches according to the specified width and thickness direction, so that the exposed waist grounding electrode of the chip-type three-terminal multilayer ceramic filters (hereinafter referred to as MLCF chips) with consistent width and thickness can be quickly loaded and the slurry dipping operation can be performed on the exposed waist grounding electrode, thereby improving production efficiency and reducing production costs.

[0060] like Figure 1 As shown, it is a schematic diagram of the structure of the MLCF chip 200 with consistent width and thickness, and its length, width and thickness (height) are a1, b1 and c1 respectively, where a1>b1=c1. The b1=c1 mentioned here does not mean that the absolute values ​​are equal, but that the two values ​​are almost equal or the range is very small, such as the range ≤0.05mm. The tooling obtained by precise processing technology cannot achieve the orientation in the width and thickness direction by the physical method of the difference between the width and thickness of the chip itself, and the two values ​​can be approximately considered to be equal. The production process of MLCF chips usually includes processes such as batching, casting, printing, lamination, lamination, cutting, debinding, sintering, and end-capping. Figure 1 The product form shown is a ceramic semi-finished product formed after sintering and chamfering. Its two ends in the length direction are AB facing the inner electrode surface, exposing the inner electrode, and forming the input electrode at this position; its two ends in the thickness direction are CD facing the cut inner electrode surface, exposing the inner electrode with a waist, and forming the ground electrode at this position; its two ends in the width direction are EF facing the cover surface, without exposing the inner electrode, and the inner electrode inside is parallel to Figure 1 The height direction setting.

[0061] Capping is the process of applying slurry to the inner electrode surface AB and the cut inner electrode surface CD of the ceramic semi-finished product after sintering and chamfering, so as to connect the electrodes exposed on the same side in parallel to form an external electrode. Before performing the capping process of the waist grounding electrode, the MLCF chip 200 needs to be arranged in an array in a uniform arrangement so that the side of the waist with the exposed inner electrode is oriented in a uniform direction, for example, downward, to avoid the simultaneous existence of EF facing the cover surface and CD facing the cutting surface, which will affect the accuracy of the capping.

[0062] In the conventional technology such as patent number CN117116676A, a through hole for loading MLCF chip is provided on the carrier board, and the MLCF chip is placed in a manner as shown in FIG. Figure 1 After being arranged in an array in the direction of the through hole, they are loaded into the through hole in batches, so that the CD faces the cut inner electrode surface toward the outside of the through hole, and the slurry dipping operation can be performed on the CD facing the cut inner electrode surface.

[0063] The traditional technology adjusts the MLCF chip with inconsistent width and thickness to Figure 1 The arrangement method can be achieved through high-precision tooling, using the size difference of the chip in the width and thickness direction to identify and control the placement direction of the chip, and perform directional identification of the chip width and thickness direction and arrange it in an array. However, for MLCF chips with the same width and thickness, traditional technology cannot arrange them.

[0064] In order to solve this technical problem, the embodiment of the present application provides a directional arrangement device 100 for a three-terminal multilayer ceramic filter having uniform thickness and width, such as Figure 2-Figure 6 As shown, in one embodiment, the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter includes a workbench 110, and a vibration plate 120, a feeding mechanism 130 and an implantation mechanism 140 arranged on the workbench 110. The vibration plate 120 is used to arrange the MLCF chips therein horizontally to its discharge port by vibration, and the inlet of the feeding mechanism 130 is connected to the discharge port of the vibration plate 120, and is used to transport the MLCF chips that are arranged horizontally forward; the implantation mechanism is arranged at the end of the feeding mechanism, and the implantation mechanism is used to implant the horizontally placed MLCF chips into the carrier plate for subsequent slurry dipping operations.

[0065] In an optional embodiment, if Figure 3-Figure 4 As shown, the vibration plate 120 includes a vibration base 121 and a hopper 122. The vibration base 121 is fixed on the workbench 110, and the hopper 122 is fixed at the upper end of the vibration base 121. The bottom of the hopper 122 is a material storage pool, and a spiral ascending discharge track is provided along the inner wall thereof. The vibration base 121 drives the hopper 122 to perform torsional pendulum vibration around its vertical axis. The MLCF chips in the material storage pool of the hopper 122 rise and move one by one along the spiral discharge track with the torsional pendulum vibration, and are arranged in an orderly horizontal manner at the discharge port of the vibration plate 120.

[0066] Preferably, the feeding mechanism 130 can transport the MLCF chip forward by vibration. Figure 3-Figure 4 As shown, in one embodiment, the feeding mechanism 130 includes a vibrating member 131 and a direct vibration track 132 arranged on the vibrating member 131. The direct vibration track 132 is arranged to be inclined downward, and the vibrating member 131 drives the MLCF chip on the direct vibration track 132 to vibrate and move forward.

[0067] In this embodiment, after the MLCF chip enters the feeding mechanism 130 laterally, it presents a first state or a second state. The first state is that the MLCF chip is in the up and down direction along both sides of the thickness surface, for example Figure 1 That is, the MLCF chip is placed in the first state, with the ground electrode at its waist exposed in the up-down direction; the second state is that the two sides along the width face are facing up-down, that is, Figure 1 The MLCF chip has its EF facing the cover surface on the upper and lower sides, and the ground electrode at its waist is exposed on the left and right sides.

[0068] In this embodiment, the MLCF chip placed in the second state needs to be removed from the feeding mechanism 130, such as Figure 3 As shown, a screening position 135 is provided on the feeding mechanism 130, and a removal mechanism is provided on the screening position 135, and the removal mechanism is used to remove the MLCF chip placed in the second state from the feeding mechanism 130. Specifically, when the removal mechanism is in action, the feeding mechanism 130 can suspend the conveying or continue its conveying process according to its conveying speed.

[0069] Specifically, the removal mechanism can be a manipulator, a blowing mechanism, or other related mechanism that can remove the MLCF chip from the feeding mechanism 130. The removal mechanism can specifically move the MLCF chip from the feeding mechanism 130 to the vibration disk 110 for re-screening, or move it to a recovery device for recovery, awaiting the next round of screening.

[0070] In this embodiment, it can be determined by manual visual inspection or machine visual inspection whether the MLCF chip moved to the screening position 135 of the feeding mechanism 130 is placed in the first state or the second state. To realize the state detection of the MLCF chip, if an upper cover is provided above the feeding mechanism 130, a window for observation is provided above the screening position 135.

[0071] The implantation mechanism 140 is used to implant the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state delivered by the feeding mechanism 130 into the carrier board 150; Figure 6 As shown, in this embodiment, a plurality of bearing holes for loading MLCF chips are arranged in an array on the bearing plate 150, and the size of each bearing hole is slightly smaller than the horizontally placed MLCF chip, so that after the MLCF chip is horizontally implanted into the bearing hole by the implantation mechanism 140, the next slurry dipping operation can be carried out more stably in the bearing hole.

[0072] The working process of the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter of this embodiment is as follows:

[0073] Step 1: Put the MLCF chip into the vibration plate 120, and vibrate the vibration plate so that the MLCF chip spirally rises in the vibration plate and enters the feeding mechanism 130 in a horizontal manner;

[0074] Step 2: The feeding mechanism 130 transports the MLCF chip forward. When transporting it to its screening position 135, it is inspected visually or by machine vision to see whether the MLCF chip passing through the screening position 135 is in the first state or in the second state and is placed horizontally. If it is in the second state, the removal mechanism removes it from the feeding mechanism 130.

[0075] Step 3: The feeding mechanism 130 continues to transport the MLCF chip placed horizontally in the first state forward to the implanting mechanism 140. The implanting mechanism 140 implants the MLCF chip into the bearing hole of the bearing plate 150 to obtain the MLCF chip that is directionally arranged in the width and thickness direction. Then, the external electrode is coated on the ground electrode at the waist of the MLCF chip through a specific slurry dipping process. After drying and changing the surface, the ground electrode on the other side is coated and dried. After high-temperature sintering, the MLCF chip coated with the grounded external electrode can be obtained.

[0076] The directional arrangement device of the chip-type three-terminal multilayer ceramic filter in the embodiment of the present application arranges the MLCF chips laterally through a vibration plate, sets a screening position on the feeding mechanism for conveying the laterally arranged MLCF chips, and removes the MLCF chips laterally placed in the second state through a removal mechanism, so that the CD of the MLCF chip entering the implantation mechanism faces the cut inner electrode surface in the up and down direction, thereby realizing the directional arrangement of chip-type three-terminal multilayer ceramic filter chips with uniform width and thickness, and improving the arrangement efficiency, production efficiency and sealing accuracy.

[0077] In an optional embodiment, if Figure 3 and Figure 4 As shown, a first CCD camera 133 is arranged above the screening position 135. The first CCD camera 133 obtains an image of the MLCF chip located at the screening position 135 and sends it to the control terminal. The control terminal determines whether the MLCF chip is in the first state or the second state according to the image, and controls the removal mechanism to remove the MLCF chip placed horizontally in the second state from the feeding mechanism 130.

[0078] Reference Figure 7 As shown, it is a schematic diagram of an MLCF chip with inconsistent width and thickness ( Figure 7 The sizes of the multiple MLCF chips in the figure are not the same), where A is placed in the first state and B is placed in the second state. As can be seen from the figure, A exposes a more obvious internal electrode pattern.

[0079] Based on this, in a preferred embodiment, the control terminal performs the following steps:

[0080] S301: Acquire an original image of a chip-type three-terminal multilayer ceramic filter located at a screening position;

[0081] S302: converting the original image into a grayscale image, removing color information in the original color image, so as to simplify subsequent image processing;

[0082] S303: using an edge detection algorithm to extract all edges in the grayscale image; preferably, using a Canny edge detection algorithm to extract all edges in the image to ensure that the outer contour of the chip and any possible internal electrodes are included.

[0083] S304: Detect all contours in the image, filter out irrelevant contours according to preset positions or sizes, and obtain chip contours; preferably, detect all contours in the image using the findContours function.

[0084] S305: Extracting a chip area according to the chip outline;

[0085] S306: Perform secondary contour detection in the chip area to determine whether there is a contour of a preset size at a preset position;

[0086] Preferably, step S306 includes the following sub-steps:

[0087] S3061: performing binarization processing on the extracted chip area so as to distinguish the inner electrode pattern from other areas;

[0088] S3062: In order to remove possible small noise or interference, use morphological operations (such as opening operations) to further clean up debris in the chip area and retain possible electrode patterns;

[0089] S3063: In the cleaned chip area, use the contour detection method to find the inner electrode stripes. Since the inner electrode pattern is a long and thin stripe, it can be identified by its shape characteristics (such as aspect ratio).

[0090] S307: if yes, determining that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the first state;

[0091] S308: If not, determine that the chip-type three-terminal multilayer ceramic filter in the original image is in the second state of being placed horizontally, and control the removal mechanism to remove the chip-type three-terminal multilayer ceramic filter from the feeding mechanism.

[0092] like Figure 3-4As shown, in one embodiment, the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter also includes a recovery track 160, which is located on the side of the feeding mechanism 130. The recovery track 160 is used to receive the MLCF chip removed by the removal mechanism and send it into the vibration disk 120.

[0093] Preferably, the recovery track 160 also drives the MLCF chips thereon to move toward the top of the hopper 122 by vibration so as to be recovered into the hopper 122 .

[0094] like Figure 3-4 As shown, in a preferred embodiment, the removal mechanism includes a blowing device 1322 and a blowing hole 1321. The blowing hole 1321 is arranged on the side of the straight vibration track 132 opposite to the recovery track. The side of the straight vibration track 132 adjacent to the recovery track is also provided with a connecting channel 134 corresponding to the blowing hole. The connecting channel 134 connects the straight vibration track 132 and the recovery track 160. The blowing hole 1321 is connected to the blowing device 1322. The blowing device 1322 blows out gas through the blowing hole 1321 to blow the MLCF chip from the straight vibration track 132 along the connecting channel 134 to the recovery track 160. In a specific embodiment, the blowing device 1322 can be a nozzle, or a controllable gas source pipeline.

[0095] In a preferred embodiment, the recovery track 160 can be arranged on the side of the direct vibration track 132, the connecting channel can be a through hole that penetrates the recovery track 160 and the direct vibration track 132, the blowing hole 1321 is connected to the blowing device 1322, and the blowing device 1322 blows gas through the blowing hole 1321 to blow the MLCF chip from the connecting through hole 134 into the recovery track 160. Then, the MLCF chip on it is driven to be recovered into the hopper 122 by vibration.

[0096] In order to prevent the blown gas from blowing the MLCF chip out of the outside of the recovery track 160, in a preferred embodiment, a side wall of the recovery track 160 away from the direct vibration track 132 is set to be higher to block the MLCF chip. More preferably, the recovery track is set to be semi-enclosed, which only leaves an opening toward one side of the direct vibration track 132, and the opening is connected to the connecting channel 134.

[0097] In order to alleviate the impact force when the MLCF chip is blown out, in a preferred embodiment, a magnetic member (not shown) is provided below the connecting channel 134, and the magnetic member extends along the direction of the connecting channel to below the feeding mechanism and below the recovery track respectively.

[0098] In a traditional chip-type multilayer ceramic capacitor, the inner electrode is generally made of metal material, and the external magnet has a small magnetic attraction to it. In the embodiment of the present application, in order to increase the magnetic attraction, a nickel inner electrode material can be selected or a magnetic material such as nickel can be added to the inner electrode, so that the inner electrode has a greater magnetism, and there is an inner electrode exposed opposite the CD to increase the magnetic attraction to the magnet. Therefore, in this embodiment, whether CD is facing the cut inner electrode surface or EF is facing the cover surface, it has a certain magnetism. The magnetic part is arranged under the connection channel to alleviate and control the movement speed of the MLCF chip blown to the recovery track to avoid damage caused by excessive impact.

[0099] In one embodiment, a gas valve (not shown) may be installed at the gas blowing device 1322 to control the amount of gas blown out to ensure that the chip is not blown out.

[0100] In one embodiment, if Figure 3-4 As shown, the implantation mechanism 140 includes an implantation component 141, a horizontal moving platform 142 and a second CCD camera 143, wherein the implantation component 141 is connected to the outlet of the feeding mechanism 130, and the implantation component includes an implantation element, which is used to implant the MLCF chips into the bearing holes on the bearing plate 150 in sequence.

[0101] A carrier plate fixing position is provided on the horizontal moving platform 142 , and the second CCD camera 143 is used to photograph the carrier plate 150 fixed on the carrier plate fixing position and position it.

[0102] The horizontal moving platform 142 moves the carrier plate 150 to a predetermined position according to the positioning information of the second CCD camera 143 , so that the implanting element can implant the MLCF chip output by the feeding mechanism 130 into the bearing hole on the carrier plate 150 .

[0103] In a preferred embodiment, Figure 4 As shown, the implant element includes a punch 1412, and the implant component 141 also includes an implant port (not shown) located below the punch 1412. The size of the implant port is larger than the size of the MLCF chip. After the MLCF chip enters the implant mechanism 140 from the direct vibration track 132, it continues to move forward in an orderly manner according to the current arrangement, so that the front MLCF chip moves to the top of the implant port. The punch 1412 can absorb the MLCF chip that moves from the outlet of the feeding mechanism 130 to the top of the implant port.

[0104] In this embodiment, the horizontal moving platform 142 moves the carrier plate 150 to the bottom of the implant component 141 according to the positioning information of the second CCD camera 143, so that the unloaded bearing holes on the carrier plate 150 are aligned with the implantation port and the punch 1412, and the punch 1412 moves downward to implant the MLCF chip located above the implantation port into the corresponding bearing hole on the carrier plate 150 through the implantation port. Specifically, the punch 1412 is a high-speed electromagnet implantation mechanism, which drives the punch 1412 to move up and down by a high-speed electromagnet. During the implantation process, the horizontal moving platform 142 continuously moves the carrier plate 150 according to the positioning information of the second CCD camera 143, so that the bearing holes of the carrier plate 150 that are not loaded with MLCF chips are moved to the bottom of the implantation port in sequence until all the bearing holes are loaded with MLCF chips.

[0105] In this embodiment, the punch 1412 is magnetic to adsorb the MLCF chip so that it does not fall below the implantation port, or the implantation mechanism 140 further includes a vacuum adsorption component (not shown), which is connected to the adsorption port opened at the bottom of the punch 1412, and adsorbs the MLCF chip through the adsorption port. After the MLCF chip is implanted into the bearing hole, since the size of the bearing hole is slightly smaller than the size of the MLCF chip, when the punch 1412 rises, its adsorption force on the MLCF chip is less than the clamping force of the bearing hole on the MLCF chip, and the MLCF chip is firmly fixed in the bearing hole. In other embodiments, the punch can also stop vacuum adsorption after the MLCF chip is implanted.

[0106] In a specific embodiment, to ensure that the MLCF chip is moved just above the implantation port, the implantation mechanism forms a product flow channel between the outlet of the straight vibration track 132 and the top of the implantation port, and the product flow channel ends above the implantation port. Therefore, the MLCF chips that continuously enter the product flow channel will push the frontmost MLCF chip to the top of the implantation port, thereby facilitating the punch to directly implant it. This driving force can also overcome the adsorption force of the punch 1412 on the MLCF chip, so that when the punch 1412 adsorbs the MLCF chip, the position of the MLCF chip can still move to the top of the implantation port, so that all of them move to the top of the implantation port.

[0107] In other embodiments, the implantation element may also be a magnetic suction head, an implantation nozzle or an implantation manipulator. The magnetic suction head and the implantation nozzle can absorb the MLCF chip, and the implantation manipulator can grab the MLCF chip. After the carrier plate 150 moves to a predetermined position, the magnetic suction head and the implantation nozzle or the implantation manipulator can implant the MLCF chip into the carrying hole of the carrier plate 150.

[0108] In this embodiment, the implantation nozzle or the implantation manipulator can move more flexibly. The implantation nozzle or the implantation manipulator absorbs or grabs the MLCF chip output by the feeding mechanism 130 at a set position, and then implants it into the bearing hole. During the implantation process, the horizontal moving platform 142 can continuously move the carrier plate 150 according to the positioning information of the second CCD camera 143, so that the bearing holes of the carrier plate 150 that are not loaded with MLCF chips are moved to the implantation positions of the implantation nozzle or the implantation manipulator in sequence until all the bearing holes are loaded with MLCF chips. In other examples, the implantation nozzle or the implantation manipulator can also implant the MLCF chips into all the bearing holes of the carrier plate in sequence according to the positioning information of the second CCD camera 143 after the carrier plate moves to a predetermined position.

[0109] Preferably, the implantation nozzle or implantation manipulator is driven by a driving assembly, and the carrying plate 150 moves to a predetermined position under the implantation nozzle or implantation manipulator, so that the implantation nozzle or implantation manipulator can achieve the suction, grasping and implantation of the MLCF chip through lateral and longitudinal movement.

[0110] In this embodiment, the implantation nozzle or implantation manipulator can suck or grab the MLCF chip through visual assistance, or the feeding mechanism 130 can output the MLCF chip to a specified position, and the implantation nozzle or implantation manipulator sucks or grabs at the set position by default.

[0111] In a preferred embodiment, Figure 4 As shown, the horizontal moving platform 142 includes an X-axis high-precision servo linear module 1422, a Y-axis high-precision servo linear module 1423 and a positioning clamping assembly (not shown). The X-axis high-precision servo linear module 1422 and the Y-axis high-precision servo linear module 1423 drive the carrier plate fixed position to move horizontally along the X direction and the Y direction; the positioning clamping assembly is arranged at the carrier plate fixed position for fixing the carrier plate.

[0112] Specifically, the X-axis high-precision servo linear module 1422 and the Y-axis high-precision servo linear module 1423 can be the driving party and the driven party of each other, and the positioning clamping component can be a snap-fit ​​part or a vacuum adsorption part.

[0113] In one embodiment, if Figure 2 and Figure 5 As shown, the directional arrangement device 100 for the chip-type three-terminal multilayer ceramic filter further includes a carrier plate loading position 170 , a carrier plate unloading position 180 and a loading and unloading robot 190 .

[0114] The loading and unloading robot 190 is used to grab the empty carrier plate 150 at the carrier plate loading position 170 to the carrier plate fixed position, and the loading and unloading robot 190 is also used to grab the carrier plate 150 carrying the MLCC chip from the carrier plate fixed position to the carrier plate unloading position 180.

[0115] In one embodiment, according to the actual production efficiency requirements, multiple sets of vibration disks 120 and other spare parts can be combined to realize a mode of synchronous operation of multiple vibration disks, multiple tracks, and multiple implant units, so as to achieve the purpose of improving production efficiency.

[0116] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims, and the description may be used to interpret the contents of the claims.

Claims

1. A directional arrangement device for a chip-type three-terminal multilayer ceramic filter, wherein the width and thickness of the chip-type three-terminal multilayer ceramic filter are the same, and the inner electrodes are exposed on both sides of the thickness direction; characterized in that: The device comprises: A vibration plate, wherein the vibration plate drives a chip-type three-terminal multilayer ceramic filter arranged transversely therein to lead to a discharge port thereof; A feeding mechanism, wherein the inlet of the feeding mechanism is connected to the outlet of the vibration plate, and the feeding mechanism conveys the chip-type three-terminal multilayer ceramic filter arranged transversely and entering forward; the feeding mechanism is provided with a screening position, and the screening position is provided with a removal mechanism, and the removal mechanism is used to remove the chip-type three-terminal multilayer ceramic filter placed transversely in a second state from the feeding mechanism; wherein the second state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the width surface; An implantation mechanism is arranged at the end of the feeding mechanism, and is used to implant the chip-type three-terminal multilayer ceramic filter which is placed horizontally in the first state and transported by the feeding mechanism into a carrier board; wherein, the first state is that the chip-type three-terminal multilayer ceramic filter is in the up and down directions along both sides of the thickness surface.

2. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: A first CCD camera is arranged above the screening position. The first CCD camera obtains an image of the chip-type three-terminal multilayer ceramic filter located at the screening position and sends it to the control terminal. The control terminal determines whether the chip-type three-terminal multilayer ceramic filter is in the first state or the second state according to the image, and controls the removing mechanism to remove the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state from the feeding mechanism.

3. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 2, characterized in that: The control terminal performs the following steps: Acquire an original image of the chip-type three-terminal multilayer ceramic filter located at the screening position; Converting the original image into a grayscale image; Use edge detection algorithms to extract all edges in the grayscale image; Detect all contours in the image, filter out irrelevant contours according to preset positions or sizes, and obtain the chip contour; Extracting a chip area according to the chip outline; Perform secondary contour detection in the chip area to determine whether there is a contour of a preset size at a preset position; If yes, it is judged that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the first state; if no, it is judged that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the second state, and the removal mechanism is controlled to remove the chip-type three-terminal multilayer ceramic filter from the feeding mechanism.

4. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: The device also includes a recovery track, which is located on the side of the feeding mechanism and is used to receive the chip-type three-terminal multilayer ceramic filter removed by the removal mechanism and feed it into the vibration disk.

5. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 4, characterized in that: The feeding mechanism comprises a vibrating member and a straight vibration track arranged on the vibrating member; The removal mechanism includes an air blowing hole, which is arranged on the side of the straight vibration track opposite to the recovery track. A connecting channel corresponding to the air blowing hole is also arranged on the side of the straight vibration track adjacent to the recovery track, and the connecting channel connects the straight vibration track and the recovery track; the air blowing hole is used to blow out gas to blow the chip-type three-terminal multilayer ceramic filter from the straight vibration track along the connecting channel into the recovery track.

6. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 5, characterized in that: A magnetic piece is arranged below the connecting passage, and the magnetic piece extends along the direction of the connecting passage to below the feeding mechanism and below the recovery track respectively.

7. The directional arrangement device of a chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: The implantation mechanism comprises an implantation component, a horizontal moving platform and a second CCD camera; The horizontal moving platform is provided with a carrier plate fixing position, and the second CCD camera is used to photograph the carrier plate fixed on the carrier plate fixing position and position it; The horizontal moving platform moves the carrying plate to a predetermined position according to the positioning information of the second CCD camera; The implantation component is connected to the outlet of the feeding mechanism, and the implantation component includes an implantation element, which sequentially implants the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate.

8. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The implant element is a punch, and the implant assembly further comprises an implant opening below the punch, the size of the implant opening being larger than the size of the chip-type three-terminal multilayer ceramic filter; the punch can absorb the chip-type three-terminal multilayer ceramic filter that moves from the outlet of the feeding mechanism to above the implant opening; The horizontal moving platform moves the carrying plate to below the implantation port according to the positioning information of the second CCD camera, so that the unloaded carrying hole on the carrying plate is aligned with the implantation port and the punch; The punch moves downward to implant the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate through the implantation opening.

9. The directional arrangement device of a chip-type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The implantation element is a magnetic suction head, an implantation nozzle or an implantation manipulator, and the magnetic suction head, the implantation nozzle or the implantation manipulator is used to adsorb or grab the chip-type three-terminal multilayer ceramic filter, and implant the chip-type three-terminal multilayer ceramic filter into the corresponding bearing hole on the bearing plate.

10. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 7, characterized in that: The horizontal moving platform includes an X-axis high-precision servo linear module, a Y-axis high-precision servo linear module and a positioning clamping assembly. The X-axis high-precision servo linear module and the Y-axis high-precision servo linear module drive the carrier plate fixed position to move horizontally along the X direction and the Y direction; the positioning clamping assembly is arranged at the carrier plate fixed position for fixing the carrier plate; The device also includes a loading position on the carrier plate, a loading position on the carrier plate, and a loading and unloading manipulator; The loading and unloading robot is used to grab the empty loading plate at the loading position of the loading plate to the loading plate fixed position, and the loading and unloading robot is also used to grab the loading plate carrying the chip-type three-terminal multilayer ceramic filter from the loading plate fixed position to the loading plate unloading position.

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