A device for vertical etching of glass substrate

Abstract

The present application provides a device for vertical etching of a glass substrate, which relates to the field of glass substrate etching, and comprises a base and a nozzle arranged on the base, a spraying mechanism arranged on the base, and a clamping mechanism arranged on the base. In order to solve the problem in the prior art that when the glass substrate is below 0.5 mm, the vertical impact force exerted by the etching liquid is likely to cause damage to the glass substrate, the present application achieves normal etching work even when the glass substrate is below 0.5 mm by setting a spraying mechanism, a clamping mechanism and a mixing mechanism; by setting the upper part to spray the liquid and the lower part to spray pure water, in combination with a compensation etching method, the uniformity of the etching work of the glass substrate is achieved, and the problem of uneven etching of the glass substrate in the prior art is solved; by setting the clamping mechanism and the spraying mechanism, the problem of cracking caused by directly cleaning the etching area of ​​the glass substrate with high-pressure liquid in the prior art is solved.

Description

Technical Field

[0001] The invention relates to the field of glass substrate etching, in particular to a device for vertical etching of a glass substrate. Background Art

[0002] In semiconductor production, a glass substrate is required as an insulating layer. During the etching process of the glass substrate, an etching solution is used to apply a vertical impact force to the surface of the glass substrate, and the etching solution is used to thin the glass substrate. When the glass substrate is below 0.5 mm, the vertical impact force applied by the etching solution is likely to cause damage to the glass substrate, so the production of ultra-thin panels is limited.

[0003] For example, the "Glass Substrate Etching Device" disclosed in the Chinese invention patent (publication number: CN101630635A) discloses in its specification: Since this method applies a vertical impact force to the surface of the glass substrate, the strength of the very thin glass itself is reduced, thereby increasing the probability of breakage. At the same time, from the actual test value, etching operations below 0.5 mm cannot be performed, so the production of ultra-thin panels is limited; the above patent can prove the defects of the prior art.

[0004] Therefore, we have made improvements to this problem and proposed a device for vertical etching of glass substrates. Summary of the invention

[0005] The object of the present invention is to address the problem that when the glass substrate is below 0.5 mm, the vertical impact force applied by the etching solution is likely to cause the glass substrate to be damaged.

[0006] In order to achieve the above-mentioned object of the invention, the present invention provides a device for vertical etching of a glass substrate to improve the above-mentioned problem.

[0007] The specific application is as follows:

[0008] It includes a base and a nozzle arranged on the base, and also includes a spraying mechanism arranged on the base, a clamping mechanism arranged on the base, and a mixing mechanism arranged on the base;

[0009] The spraying mechanism includes a U-shaped seat arranged on the base, a solenoid valve arranged on the nozzle, and a cleaning component arranged on the U-shaped seat;

[0010] The clamping mechanism comprises a clamping seat arranged on the U-shaped seat, a positioning component arranged on the clamping seat, a fixing component arranged on the U-shaped seat, and a coating component arranged on the U-shaped seat.

[0011] As a preferred technical solution of the present application, the spraying mechanism also includes two water inlet pipes, both of which are arranged on the U-shaped seat. The interior of the U-shaped seat is hollow. A plurality of baffles 1 are arranged in the U-shaped seat. A baffle 2 is arranged in the U-shaped seat. A plurality of nozzles are arranged linearly on the U-shaped seat. The solenoid valve and the nozzle are arranged in a wave-like staggered manner.

[0012] As a preferred technical solution of the present application, the cleaning component includes a guide block arranged on the U-shaped seat, the guide block is wedge-shaped, and the clamping seat is slidably arranged on the guide block.

[0013] As a preferred technical solution of the present application, the clamping mechanism also includes a positioning block arranged on the outside of the clamping seat, a clamping plate is slidably arranged on the positioning block, a screw rod is rotatably arranged in the positioning block, the clamping plate is threadedly connected to the screw rod, a knob is arranged at the end of the screw rod, a sliding column is arranged in the positioning block, and the clamping plate is slidably arranged on the outside of the sliding column.

[0014] As a preferred technical solution of the present application, the positioning component includes a push-type airbag arranged in the clamping seat, a telescopic rod is arranged in the clamping seat, the telescopic rod is connected to the push-type airbag, a guide groove is arranged in the clamping seat, a slider is slidably arranged on the guide groove, the output end of the telescopic rod is connected to the slider, a rotating shaft is rotatably arranged on the slider, a gear is arranged on the rotating shaft, a rack is arranged on the guide groove, the gear and the rack are adapted to each other, and the positioning block is arranged on the gear.

[0015] As a preferred technical solution of the present application, the fixing component includes an arc block slidably arranged in the U-shaped seat, the arc block is provided with a vertical plate, the arc block is provided with a connecting rod 1, and the U-shaped seat is provided with a fixing rod 1, and the ends of the connecting rod 1 and the fixing rod 1 are both wedge-shaped.

[0016] As a preferred technical solution of the present application, the coating component includes a connecting rod 2 slidably arranged in the connecting rod 1, a fixed rod 2 is slidably arranged in the fixed rod 1, the connecting rod 1 is rotatably arranged on the arc block, and the fixed rod 1 is rotatably arranged on the U-shaped seat, and the rotating point of the connecting rod 1 and the arc block and the rotating point of the fixed rod 1 and the U-shaped seat are both connected by a torsion spring.

[0017] As a preferred technical solution of the present application, a pressure relief valve is provided on the clamping seat, the pressure relief valve is connected to the press-type airbag, and the connecting rod 2 is adapted to the pressure relief valve.

[0018] As a preferred technical solution of the present application, the mixing mechanism includes a hole arranged on the second baffle plate, a one-way valve is arranged on the hole, a horizontal plate is arranged on the arc block, and the horizontal plate is slidably arranged on the second baffle plate.

[0019] As a preferred technical solution of the present application, transfer pipes are fixedly passed through the horizontal plate and the vertical plate, and the transfer pipes are adapted to the holes.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] In the scheme of this application:

[0022] 1. In order to solve the problem in the prior art that when the glass substrate is less than 0.5 mm, the vertical impact force exerted by the etching solution is likely to cause the glass substrate to be damaged, the present application provides a spraying mechanism, a clamping mechanism and a mixing mechanism, the glass substrate is positioned and guided by the clamping mechanism, and the mixing ratio of the etching solution and pure water is controlled by the spraying mechanism and the mixing mechanism according to the thickness of the glass substrate, so that the glass substrate can be etched normally even when it is less than 0.5 mm;

[0023] 2. By spraying liquid medicine on the upper part and pure water on the lower part, combined with the compensation etching method, the uniformity of the etching work of the glass substrate is achieved, solving the problem of uneven etching of the glass substrate in the prior art;

[0024] 3. The etched glass substrate is driven to automatically rotate and reset through the provided clamping mechanism and the spraying mechanism is used to clean the unetched area of ​​the glass substrate with pure water, thereby cleaning the etched glass and solving the problem of cracking caused by directly cleaning the etched area of ​​the glass substrate with high-pressure liquid medicine in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of the structure of a device for vertical etching of a glass substrate provided in the present application;

[0026] Figure 2 A schematic diagram of the spray mechanism structure of the device for vertical etching of a glass substrate provided in this application;

[0027] Figure 3 A schematic diagram of the planar structure of a U-shaped seat for a vertical etching device for a glass substrate provided in the present application;

[0028] Figure 4 A schematic diagram of the internal structure of a U-shaped base of a device for vertical etching of a glass substrate provided in the present application;

[0029] Figure 5 A schematic diagram of the structure of the cleaning component of the device for vertical etching of a glass substrate provided in the present application;

[0030] Figure 6 The device for vertical etching of glass substrate provided in the present application Figure 5 Schematic diagram of the enlarged structure of the middle A area;

[0031] Figure 7 A schematic diagram of the structure of the coating leveling component of the device for vertical etching of a glass substrate provided in the present application;

[0032] Figure 8 A schematic diagram of the structure of the clamping mechanism of the device for vertical etching of a glass substrate provided in the present application;

[0033] Fig. 9 This is a schematic diagram of the positioning component structure of the device for vertical etching of a glass substrate provided in the present application.

[0034] Indicated in the figure:

[0035] 1. Base; 101. Nozzle;

[0036] 2. Spraying mechanism; 201. U-shaped seat; 202. Solenoid valve; 203. Water inlet pipe; 204. Baffle 1; 205. Baffle 2; 206. Cleaning component; 2061. Guide block;

[0037] 3. Clamping mechanism; 301. Clamping seat; 302. Positioning block; 303. Clamping plate; 304. Screw rod; 305. Knob; 306. Sliding column; 307. Positioning component; 3071. Press-type airbag; 3072. Telescopic rod; 3073. Guide groove; 3074. Sliding block; 3075. Rotating shaft; 3076. Gear; 3077. Rack; 308. Fixed component; 3081. Arc block; 3082. Vertical plate; 3083. Connecting rod 1; 3084. Fixed rod 1; 309. Coating component; 310. Pressure relief valve; 3091. Connecting rod 2; 3092. Fixed rod 2;

[0038] 4. Mixing mechanism; 401. Hole; 402. One-way valve; 403. Horizontal plate; 404. Transfer pipe. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0040] As described in the background art, when the glass substrate is below 0.5 mm, the vertical impact force exerted by the etching solution is likely to cause the glass substrate to be damaged.

[0041] In order to solve this technical problem, the present invention provides a device for vertically etching a glass substrate, which is applied to etching a glass substrate.

[0042] Specifically, please refer to Figure 1-Figure 9 The device for vertical etching of a glass substrate specifically comprises: a base 1 and a nozzle 101 arranged on the base 1, and further comprises a spraying mechanism 2 arranged on the base 1, a clamping mechanism 3 arranged on the base 1, and a mixing mechanism 4 arranged on the base 1;

[0043] The spray mechanism 2 includes a U-shaped seat 201 disposed on the base 1, a solenoid valve 202 disposed on the nozzle 101, and a cleaning component 206 disposed on the U-shaped seat 201;

[0044] The clamping mechanism 3 includes a clamping seat 301 arranged on the U-shaped seat 201 , a positioning component 307 arranged on the clamping seat 301 , a fixing component 308 arranged on the U-shaped seat 201 , and a coating component 309 arranged on the U-shaped seat 201 .

[0045] The vertical etching device for glass substrates provided by the present invention solves the problem in the prior art that when the glass substrate is less than 0.5 mm, the vertical impact force exerted by the etching solution is likely to cause damage to the glass substrate. The present application provides a spraying mechanism 2, a clamping mechanism 3 and a mixing mechanism 4. The glass substrate is positioned and guided by the clamping mechanism 3, and the mixing ratio of the etching solution and pure water is controlled by the spraying mechanism 2 and the mixing mechanism 4 according to the thickness of the glass substrate, so that the glass substrate can be etched normally even when it is less than 0.5 mm.

[0046] By spraying liquid medicine on the upper part and pure water on the lower part, combined with the compensation etching method, the uniformity of the etching work of the glass substrate is achieved, solving the problem of uneven etching of the glass substrate in the prior art;

[0047] By means of the provided clamping mechanism 3 and the spraying mechanism 2, the etched glass substrate is driven to automatically rotate and reset, and the unetched area of ​​the glass substrate is cleaned with pure water by the spraying mechanism 2, thereby achieving the cleaning of the etched glass and solving the problem of cracking caused by directly cleaning the etched area of ​​the glass substrate with high-pressure liquid medicine in the prior art.

[0048] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0049] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0050] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0051] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 8 A device for vertical etching of a glass substrate, wherein the spray mechanism 2 further comprises two water inlet pipes 203 both arranged on a U-shaped seat 201, the interior of the U-shaped seat 201 is hollow, a plurality of baffles 1 204 are arranged in the U-shaped seat 201, a baffle 2 205 is arranged in the U-shaped seat 201, a plurality of nozzles 101 are arranged, the plurality of nozzles 101 are linearly arranged on the U-shaped seat 201, and the solenoid valves 202 and the nozzles 101 are arranged in a wave-like staggered manner The water inlet pipe 203 at the upper part of the U-shaped seat 201 is used to enter the etching solution, and the water inlet pipe 203 at the lower part of the U-shaped seat 201 is used to enter the pure water. Through the cooperation of the baffle 1 204, the baffle 205 and the water inlet pipe 203, the nozzle 101 provided with the electromagnetic valve 202 sprays out the etching solution, and vice versa, the nozzle 101 without the electromagnetic valve 202 sprays out the pure water, and then the electromagnetic valve 202 and the nozzle 101 are arranged in a wave shape, as shown in FIG. Figure 3 As shown, the uniformity of the etching solution spraying is improved, so that the upper middle area of ​​the U-shaped seat 201 is the etching area, and the lower middle area of ​​the U-shaped seat 201 is the pure water area. The pure water area avoids excessive etching. By controlling the solenoid valve 202, the nozzle 101 can be adjusted separately, and more precise adjustment can be achieved for different situations of the glass substrate. The solenoid valve 202 is used to achieve a compensation etching process to improve the uniformity of the glass substrate;

[0052] The cleaning component 206 includes a guide block 2061 disposed on the U-shaped seat 201. The guide block 2061 is wedge-shaped. The clamping seat 301 is slidably disposed on the guide block 2061. When the clamping seat 301 slides on the guide block 2061, the position of the glass substrate in the device can be adjusted so that glass substrates of different sizes can be located in the center of the device. The guide block 2061 is used to guide the flow direction of pure water.

[0053] In the initial state, the clamping mechanism 3 places the glass substrate vertically directly below the U-shaped seat 201. When the clamping assembly is working, the solenoid valve 202 is driven to be completely closed through the spraying mechanism 2, and the pure water is driven to be sprayed out. Then, the pure water is guided by the guide block 2061 to pre-clean the glass substrate. The clamping mechanism 3 is started, and the glass substrate is rotated and positioned at the center of the U-shaped seat 201 through the clamping mechanism 3. The upper part of the glass substrate is etched, and the lower part is sprayed with pure water to prevent excessive etching. When the clamping mechanism 3 drives the glass substrate to return to the initial state, the etched area of ​​the upper part of the glass substrate faces downward, and the lower part of the glass substrate is rinsed through the cooperation of the spraying mechanism 2 and the guide block 2061. Because the lower part of the glass substrate is not etched, the glass substrate will not be cracked when rinsed with pure water. The pure water rinses the lower part of the glass substrate and flows into the etched part of the upper part to clean the etched area. Because the glass substrate in the etched area is thinner, the etched area is prevented from being cracked.

[0054] Example 2, the device for vertical etching of glass substrate provided in Example 1 is further optimized, specifically, as follows Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Fig. 9 As shown, the clamping mechanism 3 also includes a positioning block 302 arranged outside the clamping seat 301, a clamping plate 303 is slidably arranged on the positioning block 302, a screw rod 304 is rotatably arranged in the positioning block 302, the clamping plate 303 is threadedly connected to the screw rod 304, a knob 305 is arranged at the end of the screw rod 304, a sliding column 306 is arranged in the positioning block 302, and the clamping plate 303 is slidably arranged outside the sliding column 306. When in use, the glass substrate is inserted into the positioning block 302, and the knob 305 is rotated, the knob 305 drives the screw rod 304 to rotate, and the screw rod 304 drives the clamping plate 303 to slide along the sliding column 306, and the glass substrate is clamped and fixed by squeezing the clamping plate 303, so that the glass substrate is fixed on the positioning block 302;

[0055] The positioning component 307 includes a push-type airbag 3071 arranged in the clamping seat 301, a telescopic rod 3072 is arranged in the clamping seat 301, the telescopic rod 3072 is connected to the push-type airbag 3071, a guide groove 3073 is arranged in the clamping seat 301, a slider 3074 is slidably arranged on the guide groove 3073, the output end of the telescopic rod 3072 is connected to the slider 3074, a rotating shaft 3075 is rotatably arranged on the slider 3074, a gear 3076 is arranged on the rotating shaft 3075, a rack 3077 is arranged on the guide groove 3073, the gear 3076 and the rack 3077 are adapted to each other, the positioning block 302 is arranged on the gear 3076, and the guide The groove 3073 is used to guide the slider 3074. When the spraying mechanism 2 is started, the pure water sprayed by the nozzle 101 impacts the push-type airbag 3071, so that the push-type airbag 3071 inflates the telescopic rod 3072, and the telescopic rod 3072 is unfolded. The unfolded telescopic rod 3072 drives the slider 3074 to slide along the guide groove 3073. The gear 3076 on the slider 3074 cooperates with the rack 3077, thereby causing the gear 3076 to rotate, and the positioning block 302 rotates synchronously with the gear 3076. When the telescopic rod 3072 is fully unfolded, the positioning block 302 rotates 180 degrees, and the glass substrate on the positioning block 302 is located at the center of the U-shaped seat 201.

[0056] The fixing member 308 includes an arc block 3081 slidably disposed in the U-shaped seat 201, a vertical plate 3082 is disposed on the arc block 3081, a connecting rod 3083 is disposed on the arc block 3081, and a fixing rod 3084 is disposed on the U-shaped seat 201. The ends of the connecting rod 3083 and the fixing rod 3084 are both wedge-shaped. When the glass substrate rotates and is positioned at the center of the U-shaped seat 201, the rotating glass substrate squeezes the connecting rod 3083 and the fixing rod 3084. The fixed rod 1 3084 makes the connecting rod 1 3083 connected to the arc block 3081 by sliding. At this time, when the water inlet pipe 203 on the upper part of the U-shaped seat 201 enters the etching solution, the etching solution impacts the vertical plate 3082, and the vertical plate 3082 drives the arc block 3081 to slide along the baffle 205. The sliding arc block 3081 drives the connecting rod 1 3083 to squeeze and fix the glass substrate, so as to prevent the upper part of the glass substrate from being vibrated and cracked during etching;

[0057] The coating evenly component 309 includes a second connecting rod 3091 slidably disposed in the first connecting rod 3083, a second fixed rod 3092 slidably disposed in the first fixed rod 3084, the first connecting rod 3083 is rotatably disposed on the arc block 3081, and the first fixed rod 3084 is rotatably disposed on the U-shaped seat 201. The rotation point of the first connecting rod 3083 and the arc block 3081 and the rotation point of the first fixed rod 3084 and the U-shaped seat 201 are connected by a torsion spring. When the spraying mechanism 2 etches the glass substrate, the first connecting rod 3083 and the first fixed rod 3084 are impacted by the etching liquid, so that the first connecting rod 3083 and the first fixed rod 3084 deflect downward. While the first connecting rod 3083 and the first fixed rod 3084 deflect, they evenly spread the glass substrate to prevent the situation where the etching liquid is too much or too little in a part of the glass substrate, thereby improving the uniformity of etching the glass substrate;

[0058] A pressure relief valve 310 is provided on the clamping seat 301, and the pressure relief valve 310 is connected to the pressing airbag 3071. The second connecting rod 3091 is adapted to the pressure relief valve 310. When the first connecting rod 3083 and the first fixed rod 3084 deflect downward, the second connecting rod 3091 and the second fixed rod 3092 are unfolded due to the action of gravity, and the unfolded second connecting rod 3091 squeezes the pressure relief valve 310, and the gas in the telescopic rod 3072 is discharged through the pressure relief valve 310, thereby resetting the telescopic rod 3072, stopping the spraying mechanism 2, and the positioning block 302 rotates and resets. At the same time, the etched glass substrate is reset, and the glass substrate is cleaned by the spraying mechanism 2. At this time, the power of the sprayed pure water is small, which prevents the pressing airbag 3071 from working;

[0059] The mixing mechanism 4 includes a hole 401 disposed on the baffle plate 205, a one-way valve 402 is disposed on the hole 401, a horizontal plate 403 is disposed on the arc block 3081, and the horizontal plate 403 is slidably disposed on the baffle plate 205. When the vertical plate 3082 and the arc block 3081 are driven to slide by the water inlet pipe 203, the connecting rod 1 3083 and the arc block 3081 slide synchronously and clamp and fix the glass substrate. The arc block 3081 controls the horizontal plate 403 to block according to the thickness of the glass substrate. The area of ​​the hole 401 is such that when the etched portion of the glass substrate gradually becomes thinner, the connecting rod 3083, the arc block 3081 and the horizontal plate 403 slide synchronously, so that the area of ​​the hole 401 blocked by the horizontal plate 403 gradually becomes smaller, thereby causing more and more pure water to enter the etching solution, thereby reducing the concentration of the etching solution, thereby preventing the glass substrate from being damaged due to the high concentration of the etching solution during the etching operation of 0.5 mm, and thereby causing the etching solution concentration to be lower when the glass substrate is thinner;

[0060] A transfer pipe 404 is fixedly passed through the horizontal plate 403 and the vertical plate 3082. The transfer pipe 404 is adapted to the hole 401. Pure water enters the hole 401 from the one-way valve 402, and enters the transfer pipe 404 through the hole 401. The transfer pipe 404 and the water inlet pipe 203 on the upper part of the U-shaped seat 201 are on the same horizontal line, so that the pure water discharged from the transfer pipe 404 is evenly mixed with the etching solution in the water inlet pipe 203, thereby preventing the situation where the pure water and the etching solution are unevenly mixed;

[0061] The glass substrate is clamped and fixed by the clamping mechanism 3, and is rotated and positioned so that the glass substrate is in the center of the U-shaped seat 201. When the glass substrate is etched and thinned, more and more pure water is driven into the etching solution through the mixing mechanism 4, so that the etching operation of the glass substrate at 0.5 mm can be carried out normally.

[0062] The use process of the device for vertical etching of glass substrate provided by the present invention is as follows:

[0063] When in use, the glass substrate is inserted into the positioning block 302, and the knob 305 is turned to drive the screw 304 to rotate, and the screw 304 drives the clamping plate 303 to slide along the sliding column 306, and the glass substrate is clamped and fixed by squeezing the clamping plate 303, so that the glass substrate is fixed on the positioning block 302, and the spraying mechanism 2 is started, and the pure water sprayed by the nozzle 101 impacts the pressing airbag 3071, so that the pressing airbag 3071 inflates the telescopic rod 3072, and the telescopic rod 3072 is unfolded, and the unfolded telescopic rod 3072 drives the slider 3074 to slide along the guide groove 3073, and the gear 3076 on the slider 3074 cooperates with the rack 3077, so that the gear 3076 rotates, and the positioning block 302 rotates synchronously with the gear 3076. When the telescopic rod 3072 is fully extended, the positioning block 302 rotates 180 degrees, and the glass substrate on the positioning block 302 is at the center of the U-shaped seat 201. The rotating glass substrate squeezes the connecting rod 1 3083 and the fixing rod 1 3084, so that the connecting rod 1 3083 is connected to the arc block 3081 through sliding. At this time, when the water inlet pipe 203 on the upper part of the U-shaped seat 201 enters the etching solution, the etching solution impacts the vertical plate 3082, and the vertical plate 3082 drives the arc block 3081 to slide along the baffle 205. The sliding arc block 3081 drives the connecting rod 1 3083 to squeeze and fix the glass substrate, and at this time, the spray is driven Mechanism 2 etches the glass substrate. The connecting rod 3083 and the fixed rod 3084 are impacted by the etching solution, so that the connecting rod 3083 and the fixed rod 3084 deflect downward. The connecting rod 3083 and the fixed rod 3084 are evenly spread on the glass substrate while deflecting. When the etched part of the glass substrate gradually becomes thinner, the connecting rod 3083, the arc block 3081 and the horizontal plate 403 slide synchronously, so that the area of ​​the hole 401 blocked by the horizontal plate 403 gradually becomes smaller, thereby causing more and more pure water to enter the etching solution, so that the concentration of the etching solution is reduced, so that the etching operation of the glass substrate at 0.5 mm can also be carried out normally. When the connecting rod 3083 and the fixed rod When the first 3084 deflects downward, the second connecting rod 3091 and the second fixed rod 3092 are unfolded due to the action of gravity, and the unfolded second connecting rod 3091 squeezes the pressure relief valve 310, and the gas in the telescopic rod 3072 is discharged through the pressure relief valve 310, so that the telescopic rod 3072 is reset, the spraying mechanism 2 is stopped, the positioning block 302 rotates and resets, and the etched glass substrate is reset at the same time, and the lower part of the glass substrate is rinsed through the cooperation of the spraying mechanism 2 and the guide block 2061. Because the lower part of the glass substrate is not etched, the pure water rinses the lower part of the glass substrate and flows into the etched part of the upper part to clean the etched area, so the pure water rinses the glass substrate without causing cracks.

[0064] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0065] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. A device for vertical etching of a glass substrate, comprising a base (1) and a nozzle (101) arranged on the base (1), characterized in that: It also includes a spraying mechanism (2) arranged on the base (1), a clamping mechanism (3) arranged on the base (1), and a mixing mechanism (4) arranged on the base (1); The spraying mechanism (2) comprises a U-shaped seat (201) arranged on the base (1), a solenoid valve (202) arranged on the nozzle (101), and a cleaning component (206) arranged on the U-shaped seat (201); The clamping mechanism (3) comprises a clamping seat (301) arranged on the U-shaped seat (201), a positioning component (307) arranged on the clamping seat (301), a fixing component (308) arranged on the U-shaped seat (201), and a coating component (309) arranged on the U-shaped seat (201); The clamping mechanism (3) further comprises a positioning block (302) arranged outside the clamping seat (301); a clamping plate (303) is slidably arranged on the positioning block (302); a screw rod (304) is rotatably arranged inside the positioning block (302); the clamping plate (303) is threadedly connected to the screw rod (304); a knob (305) is arranged at the end of the screw rod (304); a sliding column (306) is arranged inside the positioning block (302); and the clamping plate (303) is slidably arranged outside the sliding column (306); The positioning component (307) comprises a push-type airbag (3071) arranged in the clamping seat (301); a telescopic rod (3072) is arranged in the clamping seat (301); the telescopic rod (3072) is communicated with the push-type airbag (3071); a guide groove (3073) is arranged in the clamping seat (301); a slider (3074) is slidably arranged on the guide groove (3073); an output end of the telescopic rod (3072) is connected to the slider (3074); a rotating shaft (3075) is rotatably arranged on the slider (3074); a gear (3076) is arranged on the rotating shaft (3075); a rack (3077) is arranged on the guide groove (3073); the gear (3076) and the rack (3077) are adapted to each other; and the positioning block (302) is arranged on the gear (3076); The fixing component (308) comprises an arc-shaped block (3081) slidably arranged in the U-shaped seat (201), the arc-shaped block (3081) being provided with a vertical plate (3082), the arc-shaped block (3081) being provided with a connecting rod 1 (3083), and the U-shaped seat (201) being provided with a fixing rod 1 (3084), and the ends of the connecting rod 1 (3083) and the fixing rod 1 (3084) are both wedge-shaped.

2. The device for vertical etching of a glass substrate according to claim 1, characterized in that: The spraying mechanism (2) further comprises two water inlet pipes (203) both arranged on the U-shaped seat (201); the interior of the U-shaped seat (201) is hollow; a plurality of baffle plates (204) are arranged in the U-shaped seat (201); a second baffle plate (205) is arranged in the U-shaped seat (201); a plurality of nozzles (101) are arranged; the plurality of nozzles (101) are linearly arranged on the U-shaped seat (201); and the solenoid valve (202) and the nozzles (101) are arranged in a wave-like staggered manner.

3. The device for vertical etching of a glass substrate according to claim 2, characterized in that: The cleaning component (206) comprises a guide block (2061) arranged on the U-shaped seat (201), the guide block (2061) is wedge-shaped, and the clamping seat (301) is slidably arranged on the guide block (2061).

4. The device for vertical etching of a glass substrate according to claim 3, characterized in that: The coating evenly-coating component (309) comprises a second connecting rod (3091) slidably arranged in the first connecting rod (3083), a second fixed rod (3092) slidably arranged in the first fixed rod (3084), the first connecting rod (3083) being rotatably arranged on the arc block (3081), the first fixed rod (3084) being rotatably arranged on the U-shaped seat (201), and the rotation point between the first connecting rod (3083) and the arc block (3081) and the rotation point between the first fixed rod (3084) and the U-shaped seat (201) are both connected via a torsion spring.

5. The device for vertical etching of a glass substrate according to claim 4, characterized in that: The clamping seat (301) is provided with a pressure relief valve (310), the pressure relief valve (310) is in communication with the press-type airbag (3071), and the second connecting rod (3091) is adapted to the pressure relief valve (310).

6. The device for vertical etching of a glass substrate according to claim 5, characterized in that: The mixing mechanism (4) comprises a hole (401) arranged on the second baffle plate (205), a one-way valve (402) being arranged on the hole (401), a horizontal plate (403) being arranged on the arc block (3081), and the horizontal plate (403) being slidably arranged on the second baffle plate (205).

7. The device for vertical etching of a glass substrate according to claim 6, characterized in that: A transfer tube (404) is fixedly passed through the horizontal plate (403) and the vertical plate (3082), and the transfer tube (404) is adapted to the hole (401).

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