High-temperature structural damage monitoring sensor with micro-channel structure

Abstract

The invention provides a high-temperature structural damage monitoring sensor containing a micro-channel structure. The high-temperature structural damage monitoring sensor comprises a sensor shell, an inner heat insulation assembly, a micro-channel array, a cooling performance controller, an acoustic emission sensor assembly and a plugging head, a thermal protection structure of the sensor is jointly formed by the sensor shell and the inner thermal insulation assembly, and the thermal protection and thermal insulation functions are achieved. A micro-channel array is arranged in the inner heat insulation cover, so that the heat insulation capacity of the inner heat insulation cover is enhanced; and the self-adaptive adjustment of the temperature of the sensor is realized through the cooling performance controller. The sensor is simple in principle, good in reliability, capable of being modularly replaced, small in occupied space and convenient to miniaturize, and the working temperature range of the sensor is greatly widened.

Description

Technical Field

[0001] The present invention belongs to the technical field of high-temperature structural damage monitoring sensors, and relates to a high-temperature structural damage monitoring sensor containing a microfluidic channel structure, and in particular to a sensor proposed to meet the structural damage monitoring needs of aircraft heat-bearing structures under a mechanical-thermal coupling load environment. Background Art

[0002] The loads experienced by near-space high-speed vehicles throughout their life cycle are complex and severe, which poses a huge challenge to the integrity and reliability of the thermal protection system.

[0003] However, the current damage monitoring of thermal protection systems is mainly based on laboratory environments at room temperature, and its results are difficult to reveal the damage characteristics and propagation laws under high temperature conditions. Damage acoustic emission testing under high temperature conditions is a prominent difficulty faced in current research work. For heat-bearing structures, high-temperature force-heat tests that simulate real service environments are an important part of the application process of composite materials, which also poses new challenges to the damage acoustic emission sensing methods under extreme thermal environments. The surface temperature of the test piece in the force-heat coupling test is generally higher than the upper limit operating temperature of ordinary acoustic emission sensors, especially for high temperature environments above 1000°C, and there is currently a lack of available acoustic emission sensing elements. In addition, due to the complexity of the boundaries of this heat-bearing structure itself (reinforcement, bolt / pin connection structure, temperature unevenness, etc.) and the wave propagation path, the propagation characteristics of the acoustic emission wave in the monitored structure are very complex, which greatly affects the accuracy of structural damage location. How to perceive the damage signal of the structure under extreme high temperature conditions and then accurately locate the damaged part urgently needs breakthroughs in theory and method.

[0004] At present, there are some technologies and devices on the market for damage monitoring of heat-bearing structures under mechanical and thermal coupling load environments, such as the design of using metal rods to transmit acoustic emission test signals from the high-temperature end to the low-temperature end. These technologies and devices can realize the testing of damage signals to a certain extent, but due to the existence of the intermediate waveguide rod, the acoustic emission wave suffers large losses during propagation, and the propagation path is changed, resulting in serious distortion of the measured acoustic emission signal waveform, and serious loss of important and useful information about the damage source. Only some inherent acoustic emission signal characteristic parameters can be obtained, such as ringing count, energy, amplitude, frequency, etc., and it is impossible to obtain complete and true acoustic emission signal time domain full waveform data, which is not conducive to engineering promotion and application.

[0005] Therefore, how to design a structural damage monitoring sensor for use in a mechanical-thermal coupling load environment has become an urgent problem to be solved in the field of high-temperature structure research and development. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0007] To this end, the present invention provides a high-temperature structural damage monitoring sensor containing a microfluidic structure. The sensor of the present invention has a simple principle, good reliability, modular replacement, small occupancy, convenience for miniaturization design, and greatly broadens the operating temperature range of the sensor.

[0008] The technical solution of the present invention is as follows: a high-temperature structural damage monitoring sensor containing a microfluidic channel structure is provided, the sensor comprising a sensor housing, an internal heat insulation component, a microfluidic channel array, a cooling performance controller, an acoustic emission sensor component and a plugging head;

[0009] The sensor housing is used for external heat insulation and supporting the internal components of the entire sensor, and includes a lower shell and an upper cover, wherein the upper cover is used to close the upper end opening of the lower shell;

[0010] The inner heat insulation component is used for inner heat insulation and supporting the internal components of the sensor, which is arranged in the lower shell, and includes a first inner heat insulation part and a second inner heat insulation part, the first inner heat insulation part is designed to conform to the shape of the lower shell, the first inner heat insulation part has a cavity, and the second inner heat insulation part is arranged in the cavity;

[0011] The microchannel array is arranged in the cavity and distributed between the first insulation part and the second insulation part. The microchannel array is evenly arranged along the inner wall circumference of the first inner insulation part and along the outer wall circumference of the second inner insulation part according to a set trajectory, and its height is the same as that of the first insulation part; the microchannel array is used to transfer cooling medium inside the sensor, thereby taking away heat;

[0012] The cooling performance controller is embedded in the second inner heat insulating portion and is used to adjust the flow rate inside the microchannel array according to the temperature of the second heat insulating portion to adaptively change the cooling effect;

[0013] The acoustic emission sensor assembly is embedded in the second inner heat insulation part and is located below the cooling performance controller;

[0014] The plugging head is a metal foam structure, which is arranged in the lower shell and is adaptively and evenly filled according to the volume of the inner cavity of the lower shell to isolate and buffer external vibrations.

[0015] Furthermore, the cooling performance controller includes a temperature sensor, a temperature demodulator, a controller and a solenoid valve. The temperature sensor is pasted on the inner wall of the second insulation part. The temperature demodulator is connected to the temperature sensor. The temperature demodulator realizes temperature collection, processing and modulation functions, and feeds back the temperature information to the controller in real time. The controller is used to control the actuation of the solenoid valve according to the temperature information of the inner wall of the second insulation part. The solenoid valve is installed close to the microchannel array and is used to adjust the flow rate of the cooling medium.

[0016] Furthermore, the temperature sensor adopts a K-type thermocouple.

[0017] Furthermore, the acoustic emission sensor assembly includes an acoustic emission sensor and a signal enhancement module. The signal enhancement module is a solid cylinder, which is used to focus the damage signal and transmit it to the acoustic emission sensor. The acoustic emission sensor is used to sense the structural damage signal.

[0018] Furthermore, the sensor housing material includes a high-temperature alloy or a high-temperature ceramic-based composite material.

[0019] Furthermore, the ceramic composite material is zirconia ceramic.

[0020] Furthermore, the inner thermal insulation component is made of zirconia ceramic material.

[0021] Furthermore, the microchannel array is formed by using a soft metal tube.

[0022] Furthermore, the array form of the microfluidic channel array includes a circular array, a cross array or a U-shaped array, and the cross section of the microfluidic channel is circular, cross-shaped or rectangular.

[0023] The above technical solution adopts a special microfluidic array, a cooling performance controller and a thermal insulation component to cooperate, and realizes adaptive adjustment of the sensor temperature by changing the flow rate of the working fluid inside the microfluidic array and other means. That is, the present invention adopts active and passive composite thermal protection technology composed of a sensor housing, an internal thermal insulation component, a microfluidic array and a cooling performance controller, etc., to realize adaptive adjustment of the sensor temperature, greatly broadening the operating temperature range of the sensor. The present invention is modular in design, easy to disassemble, simple in structure, flexible in installation, low in cost, compact in structure and small in space occupation, and has broad application prospects in structural damage monitoring under high temperature environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The included drawings are used to provide a further understanding of the embodiments of the present invention, which constitute a part of the specification, are used to illustrate the embodiments of the present invention, and together with the text description, explain the principles of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 This is the appearance diagram of the high temperature structure damage monitoring sensor of the present invention;

[0026] Figure 2 This is a schematic diagram of the internal structure of the high-temperature structural damage monitoring sensor of the present invention;

[0027] Figure 3 A microfluidic channel array provided according to a specific embodiment of the present invention;

[0028] Among them, (a) circular array, (b) cross array, (c) round array

[0029] Figure 4 This is a schematic diagram of the internal structure of the cooling performance controller of the present invention;

[0030] The following reference numerals are included:

[0031] 1. Sensor housing; 2. Internal insulation assembly; 3. Microchannel array; 4. Microchannel; 5. Cooling performance controller; 6. Temperature sensor; 7. Temperature demodulator; 8. Controller; 9. Solenoid valve; 10. Acoustic emission sensor assembly. DETAILED DESCRIPTION

[0032] It should be noted that, in the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0034] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0035] like Figure 1-4As shown, in one embodiment of the present invention, a high-temperature structural damage monitoring sensor containing a microchannel structure is provided, the sensor comprising a sensor housing 1, an internal insulation component 2, a microchannel array 3, a cooling performance controller 5, an acoustic emission sensor component 10 and a plugging head; the sensor housing 1 is used for external insulation and supporting the entire internal components of the sensor, and comprises a lower shell and an upper cover body, the upper cover body is used to close the upper end opening of the lower shell; the internal insulation component 2 is used for internal insulation and supporting the internal components of the sensor, and is arranged in the lower shell, including a first internal insulation part and a second internal insulation part, the first internal insulation part is designed to conform to the lower shell, the first internal insulation part has a cavity, and the second internal insulation part is arranged in the cavity; the microchannel array 3 is arranged in the cavity The microchannel array 3 is arranged in the cavity and distributed between the first insulation part and the second insulation part, and its height is the same as that of the first insulation part; the microchannel array 3 is used to transfer cooling medium inside the sensor to take away the heat; the cooling performance controller 5 is embedded in the second insulation part, and is used to adjust the flow rate inside the microchannel array 3 according to the temperature of the second insulation part, so as to adaptively change the cooling effect; the acoustic emission sensor assembly 10 is embedded in the second insulation part, and is located below the cooling performance controller 5; the plugging head is a metal foam structure, which is arranged in the lower shell, and is adaptively and evenly filled according to the volume of the cavity inside the lower shell, so as to isolate and buffer external vibrations.

[0036] For example, the lower shell may be a cylindrical structure with one end open, wherein holes with circular or rectangular cross-sectional shapes may be provided inside the inner thermal insulation component 2 for installing other components.

[0037] By applying the above configuration, a special microfluidic array 3, a cooling performance controller 5 and a heat insulation component are used in combination, and the sensor temperature is adaptively adjusted by changing the flow rate of the working fluid inside the microfluidic array 3 and other means. That is, the embodiment of the present invention adopts the active and passive composite thermal protection technology composed of the sensor housing 1, the internal heat insulation component 2, the microfluidic array 3 and the cooling performance controller 5, etc., to achieve adaptive adjustment of the sensor temperature, which greatly broadens the operating temperature range of the sensor. The embodiment of the present invention is modular in design, easy to disassemble, simple in structure, flexible in installation, low in cost, compact in structure and small in space occupation, and has broad application prospects in structural damage monitoring under high temperature environments.

[0038] In the above embodiment, if Figure 4As shown, in order to adjust the flow rate of the cooling medium, the cooling performance controller 5 includes a temperature sensor 6, a temperature demodulator 7, a controller 8 and a solenoid valve 9. The temperature sensor 6 is attached to the inner wall of the second insulation part, and the temperature demodulator 7 is connected to the temperature sensor 6. The temperature demodulator 7 realizes the functions of temperature acquisition, processing and modulation, and feeds back the temperature information to the controller 8 in real time. The controller 8 is used to control the actuation of the solenoid valve 9 according to the temperature information of the inner wall of the second insulation part. The solenoid valve 9 is installed near the microchannel array 3 (the solenoid valve 9 is installed near the microchannel array 3) to adjust the flow rate of the cooling medium. That is, the flow rate inside the microchannel array 3 is adjusted according to the temperature of the inner insulation part, so as to adaptively change the cooling effect.

[0039] Preferably, the temperature sensor 6 is a K-type thermocouple.

[0040] According to one embodiment of the present invention, the acoustic emission sensor assembly 10 includes an acoustic emission sensor and a signal enhancement module. The signal enhancement module is a solid cylinder for focusing damage signals and transmitting them to the acoustic emission sensor. The acoustic emission sensor is used to sense structural damage signals.

[0041] According to an embodiment of the present invention, the material of the sensor housing 1 includes a high-temperature alloy or a high-temperature ceramic-based composite material.

[0042] That is, the material of the sensor housing 1 can be selected according to the external vibration, force, thermal load characteristics and working environment of the sensor. Preferably, the embodiment of the present invention uses zirconium oxide ceramics.

[0043] Preferably, the inner thermal insulation component 2 is made of zirconia ceramic material to ensure better high temperature resistance and high load-bearing performance.

[0044] like Figure 3 As shown, the array form of the microchannel array 3 includes a circular array, a cross array or a U-shaped array, and the cross section of the microchannel is circular, cross-shaped or rectangular. The microchannel array 3 is preferably formed by a soft metal tube, and the soft metal tube constitutes the microchannel 4.

[0045] In summary, the high-temperature structural damage monitoring function of the sensor of the embodiment of the present invention is realized through the sensor housing, the inner insulation component, the microchannel array, the cooling performance controller, the acoustic emission sensor component and the plugging head. The sensor housing and the inner insulation component jointly form a thermal protection structure of the sensor, realizing the heat protection and heat insulation functions; the microchannel array is arranged inside the inner insulation cover to enhance the heat insulation capacity of the inner insulation cover; the cooling performance controller is used to realize the adaptive adjustment of the sensor temperature. The device design takes into account the rationality of the installation gap, facilitates maintenance and replacement of components, and has broad application prospects and economic benefits.

[0046] Features described and / or illustrated above for one embodiment may be used in the same or similar manner in one or more other embodiments, and / or combined with or used in place of features in other embodiments.

[0047] It should be emphasized that the term "include / comprises" when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps, components or combinations thereof.

[0048] The above method of the present invention can be implemented by hardware, or by hardware combined with software. The present invention relates to such a computer-readable program, which, when executed by a logic component, enables the logic component to implement the above-mentioned device or component, or enables the logic component to implement the above-mentioned various methods or steps. The present invention also relates to a storage medium for storing the above program, such as a hard disk, a magnetic disk, an optical disk, a DVD, a flash memory, etc.

[0049] The many features and advantages of these embodiments are apparent from this detailed description, and thus the appended claims are intended to cover all such features and advantages of these embodiments that fall within their true spirit and scope. Furthermore, since numerous modifications and changes will readily occur to those skilled in the art, it is not intended that the embodiments of the invention be limited to the exact construction and operation illustrated and described, but rather all suitable modifications and equivalents falling within the scope thereof are intended to be covered.

[0050] Parts of the present invention that are not described in detail are well known to those skilled in the art.

Claims

1. A high temperature structural damage monitoring sensor containing a microfluidic channel structure, characterized in that: The sensor comprises a sensor housing, an internal heat insulation component, a microchannel array, a cooling performance controller, an acoustic emission sensor component and a plugging head; The sensor housing is used for external heat insulation and supporting the internal components of the entire sensor, and includes a lower shell and an upper cover, wherein the upper cover is used to close the upper end opening of the lower shell; The inner heat insulation component is used for inner heat insulation and supporting the internal components of the sensor, which is arranged in the lower shell, and includes a first inner heat insulation part and a second inner heat insulation part, the first inner heat insulation part is designed to conform to the shape of the lower shell, the first inner heat insulation part has a cavity, and the second inner heat insulation part is arranged in the cavity; The microchannel array is arranged in the cavity and distributed between the first insulation part and the second insulation part. The microchannel array is evenly arranged along the inner wall circumference of the first inner insulation part and along the outer wall circumference of the second inner insulation part according to a set trajectory, and its height is the same as that of the first insulation part; the microchannel array is used to transfer cooling medium inside the sensor, thereby taking away heat; The cooling performance controller is embedded in the second inner heat insulating portion and is used to adjust the flow rate inside the microchannel array according to the temperature of the second heat insulating portion to adaptively change the cooling effect; The acoustic emission sensor assembly is embedded in the second inner heat insulation part and is located below the cooling performance controller; The plugging head is a metal foam structure, which is arranged in the lower shell and is adaptively and evenly filled according to the volume of the inner cavity of the lower shell to isolate and buffer external vibrations.

2. A high temperature structural damage monitoring sensor containing a microfluidic channel structure according to claim 1, characterized in that: The cooling performance controller includes a temperature sensor, a temperature demodulator, a controller and a solenoid valve. The temperature sensor is pasted on the inner wall of the second insulation part. The temperature demodulator is connected to the temperature sensor. The temperature demodulator realizes temperature collection, processing and modulation functions, and feeds back temperature information to the controller in real time. The controller is used to control the actuation of the solenoid valve according to the temperature information of the inner wall of the second insulation part. The solenoid valve is installed close to the microchannel array and is used to adjust the flow rate of the cooling medium.

3. A high temperature structural damage monitoring sensor containing a microfluidic channel structure according to claim 2, characterized in that: The temperature sensor uses a K-type thermocouple.

4. A high temperature structural damage monitoring sensor containing a microfluidic channel structure according to any one of claims 1 to 3, characterized in that: The acoustic emission sensor assembly includes an acoustic emission sensor and a signal enhancement module. The signal enhancement module is a solid cylinder and is used to focus the damage signal and transmit it to the acoustic emission sensor. The acoustic emission sensor is used to sense the structural damage signal.

5. The high-temperature structural damage monitoring sensor containing a microfluidic channel structure according to claim 2, characterized in that: The sensor housing material includes a high-temperature alloy or a high-temperature ceramic-based composite material.

6. A high temperature structural damage monitoring sensor containing a microfluidic channel structure according to claim 5, characterized in that: The ceramic composite material is zirconia ceramic.

7. A high temperature structural damage monitoring sensor containing a microfluidic channel structure according to claim 6, characterized in that: The inner heat insulation component is made of zirconium oxide ceramic material.

8. A high temperature structural damage monitoring sensor with a microfluidic channel structure according to claims 5-7, characterized in that: The microfluidic channel array is formed by using a soft metal tube.

9. A high temperature structural damage monitoring sensor containing a microfluidic channel structure according to claim 8, characterized in that: The array form of the microfluidic channel array includes a circular array, a cross array or a U-shaped array, and the cross section of the microfluidic channel is circular, cross-shaped or rectangular.

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