Memory chip test fixture

Abstract

The invention provides a memory chip test fixture which comprises an upper cover and an upper mounting plate, the upper cover is mounted on the side surface of the upper mounting plate in an openable and closable manner through a hinge, and the connecting end, far away from the upper mounting plate, of the upper cover is locked through a lock catch structure; a chip groove is formed in one side surface, close to the upper cover, of the upper mounting plate, an opening of the chip groove is upward, and a through hole is formed in the bottom of the chip groove to expose a metal terminal on the printed circuit board; the printed circuit board is inserted into one end, far away from the upper cover, of the upper mounting plate; and a golden finger end on the printed circuit board extends out of the upper mounting plate. According to the invention, the upper mounting plate and the lower mounting plate are utilized to provide the mounting position of the chip to be detected, in addition, the printed circuit board also adopts a pluggable structure between the upper mounting plate and the lower mounting plate, a reflow soldering mode is replaced, reworking and scrapping of products are reduced, rapid mounting of the chip to be detected and a normal chip is realized, and the production efficiency is improved. The chip analysis early-stage preparation steps are simplified, and the analysis efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor module testing, in particular to the technical field of memory bar chip testing, and specifically to a memory bar chip testing fixture. Background Art

[0002] At present, in the application performance test project of semiconductor module test (MOD TEST), in order to analyze whether the chip on the memory stick is abnormal, it is necessary to disassemble the chip, remove the tin, plant the ball, and heat it. At the same time, it is necessary to replace the bad chip with the normal chip after a chip on the normal memory stick is processed in the same way, and then re-mount it on the disassembly position of the good memory stick and the normal memory stick respectively after reflow soldering. After the appearance inspection is normal, the memory stick is analyzed and tested. By confirming the test result file, it is finally determined whether the chip is abnormal. Because the whole process has many steps and takes a long time, the efficiency of defective analysis is low.

[0003] Since the chip needs to be exchanged and then re-mounted on the memory stick through reflow soldering, various defects may easily occur during the process, resulting in the product being scrapped and the next step of analysis being unable to proceed.

[0004] The problems with the current product are:

[0005] 1. Due to differences in equipment parameter settings and personnel placement techniques during the reflow soldering process, short circuits, open circuits, cold solder joints, offsets and other undesirable phenomena are prone to occur;

[0006] 2. When defects occur during the process, rework is required, which affects the analysis efficiency. If rework is not possible, the chip may be scrapped and the next step of analysis cannot be performed.

[0007] 3. The chip may cause the circuit board to be scrapped during the mounting process;

[0008] 4. The process from chip disassembly to ball implantation is performed part-time by appearance inspectors, and the accuracy cannot be guaranteed;

[0009] 5. Since the chip exchange and reflow process takes a long time, the appearance inspection personnel need to wait until it is completed, which will cause a waste of manpower and affect the production efficiency of normal products in their process. Summary of the invention

[0010] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a memory chip test fixture to solve the difficulties of the prior art.

[0011] To achieve the above-mentioned purpose and other related purposes, the present invention provides a memory chip test fixture, comprising an upper cover 1 and an upper mounting plate 2, wherein the upper cover 1 is mounted on the side of the upper mounting plate 2 in an openable manner by a hinge, and the connection end of the upper cover 1 away from the upper mounting plate 2 is locked by a locking structure;

[0012] A chip slot 3 is provided on one side of the upper mounting plate 2 close to the upper cover 1. The chip slot 3 is opened upward. A through hole is provided at the bottom of the chip slot 3 to expose the metal terminal on the printed circuit board 4.

[0013] The printed circuit board 4 is inserted and installed on an end of the upper mounting plate 2 away from the upper cover 1 , and the gold finger end 5 on the printed circuit board 4 extends out of the upper mounting plate 2 .

[0014] According to the preferred solution, a lower mounting plate 6 is mounted on the side of the upper mounting plate 2 away from the upper cover 1 by bolts, and a chip slot 3 is also provided on the side of the lower mounting plate 6 away from the upper mounting plate 2;

[0015] A lower cover 7 is mounted on the lower mounting plate 6 so as to be openable and closable via a hinge;

[0016] A groove for inserting the printed circuit board 4 is provided between the upper mounting plate 2 and the lower mounting plate 6 .

[0017] According to a preferred embodiment, a plurality of chip slots 3 are coaxially opened on the upper mounting plate 2 and the lower mounting plate 6 , and the plurality of chip slots 3 are arranged corresponding to the structures on the printed circuit board 4 .

[0018] According to a preferred embodiment, the plurality of chip slots 3 are symmetrically arranged about the center lines of the upper mounting plate 2 and the lower mounting plate 6 .

[0019] According to the preferred solution, a chip fixing block 8 is installed on one side of the upper cover 1 and the lower cover 7 close to the upper mounting plate 2 and the lower mounting plate 6 respectively;

[0020] The chip fixing block 8 is bolted to the upper cover 1 and the lower cover 7 through the base plate 9 , and a spring is arranged between the chip fixing block 8 and the base plate 9 .

[0021] According to a preferred embodiment, a heat dissipation through hole 10 is opened in each chip fixing block 8, one end of the spring is sleeved on the end of the heat dissipation through hole 10 away from the chip slot 3 and located on the inner side of the chip fixing block 8, and the other end is against the substrate 9.

[0022] According to a preferred solution, each of the chip slots 3 is provided with a corresponding chip fixing block 8 .

[0023] According to a preferred embodiment, a discharge chute 11 is formed on all sides of the chip slot 3 and extends outward. The discharge chute 11 is arranged in a circular structure, and its bottom is higher than the bottom of the chip slot 3 but lower than the height of the installed chip.

[0024] According to a preferred embodiment, the locking structure includes:

[0025] A handle 12, wherein the handle 12 is mounted on a side of the upper cover 1 away from the upper mounting plate 2 and extends out of the upper mounting plate 2;

[0026] A connecting piece 13, wherein the connecting piece 13 is L-shaped, the vertical end of which is mounted on the extended end of the handle 12 by bolts, and the horizontal end of which is vertically and extendedly arranged on the upper cover 1, and the horizontal end is arranged vertically to the upper cover 1;

[0027] The abutment piece 14 is L-shaped and is installed in the corresponding locking groove 15 on the upper mounting plate 2 by bolts;

[0028] When the upper cover is closed, the horizontal end of the connecting piece 13 is inserted into the vertical end of the abutting piece 14, and the two are abutted with each other in an interference fit.

[0029] According to a preferred embodiment, the vertical end of the abutting piece 14 is also provided with an outwardly protruding arc structure.

[0030] According to a preferred embodiment, a locking structure is also installed between the lower cover 7 and the lower mounting plate 6 .

[0031] The present invention provides a mounting position for the chip to be detected by using an upper mounting plate and a lower mounting plate. In addition, a plug-in structure is also adopted between the upper mounting plate and the lower mounting plate of the printed circuit board, which replaces the reflow soldering method, reduces product rework and scrapping, realizes rapid installation of the chip to be detected and the normal chip, simplifies the preliminary preparation steps for chip analysis, and improves analysis efficiency.

[0032] The best embodiment for carrying out the present invention will be described in more detail below with reference to the accompanying drawings so that the features and advantages of the present invention can be easily understood. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 Shown is a schematic diagram of the three-dimensional structure of the present invention;

[0034] Figure 2 It is a schematic diagram of a three-dimensional structure from another viewing angle of the present invention;

[0035] Description of symbols

[0036] 1. Upper cover; 2. Upper mounting plate; 3. Chip slot; 4. Printed circuit board; 5. Gold finger end; 6. Lower mounting plate; 7. Lower cover; 8. Chip fixing block; 9. Base plate; 10. Heat dissipation through hole; 11. Discharge chute; 12. Handle; 13. Connecting piece; 14. Retaining piece; 15. Locking groove. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the technical solution of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described in conjunction with the drawings of specific embodiments of the present invention. The same figure marks in the drawings represent the same parts. It should be noted that the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Compared to the embodiments shown in the drawings, feasible embodiments within the scope of the present invention may have fewer components, other components not shown in the drawings, different components, differently arranged components, or differently connected components, etc. In addition, two or more components in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0039] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by persons of ordinary skill in the field to which the present invention belongs. The words "first", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not necessarily indicate a quantity limitation. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0040] The present invention provides a memory chip test fixture for use in a semiconductor module test process. The present invention does not limit the type of chip, but the structure of the memory chip test fixture is particularly suitable for memory application performance testing.

[0041] In general, the memory chip test fixture proposed by the present invention mainly includes an upper cover 1, an upper mounting plate 2, a chip slot 3, a printed circuit board 4, a lower cover 7, a lower mounting plate 6 and a chip fixing block 8. Figure 1 , which shows the arrangement relationship of the upper cover 1, the upper mounting plate 2, the chip slot 3, the printed circuit board 4, the lower cover 7, the lower mounting plate 6 and the chip fixing block 8.

[0042] In order to avoid the need for reflow soldering for chip testing, and to solve the problem in the background technology that the chip needs to be exchanged and then re-mounted on the memory stick by reflow soldering, which may easily cause various defects in the process, resulting in product scrapping and inability to proceed to the next step of analysis, in the technical solution provided in this embodiment, the upper mounting plate 2 and the lower mounting plate 6 are used to provide an installation position for the chip to be tested. In addition, the printed circuit board 4 also directly adopts a plug-in structure on the upper mounting plate 2 and the lower mounting plate 6, instead of the reflow soldering method, thereby reducing product rework and scrapping, realizing the rapid installation of the chip to be tested and the normal chip, simplifying the preliminary preparation steps for chip analysis, and improving analysis efficiency.

[0043] Specifically, Figure 1 As shown, the upper cover 1 is installed on the side of the upper mounting plate 2 by means of a hinge so as to be opened and closed. In order to form consistency with the conventional chip structure on the fixture, a lower mounting plate 6 is installed by bolts on the side of the upper mounting plate 2 away from the upper cover 1, and a lower cover 7 is installed on the lower mounting plate 6 by means of a hinge so as to be opened and closed.

[0044] In order to realize the rapid installation of chips on the upper mounting plate 2 and the lower mounting plate 6, a chip slot 3 is provided on the side surface of the upper mounting plate 2 close to the upper cover 1, and the opening of the chip slot 3 is set upward. Similarly, a chip slot 3 is also provided on the side of the lower mounting plate 6 away from the upper mounting plate 2, and the upper and lower chip slots 3 are set through.

[0045] Since the fixture needs to be inserted into the Test DIMM testing machine equipment for electrical connection to test the functions and characteristics of the chip after installation, the printed circuit board 4 is inserted and installed between the upper mounting plate 2 and the lower mounting plate 6 on the end away from the upper cover 1. Correspondingly, a groove for inserting the printed circuit board 4 is opened between the upper mounting plate 2 and the lower mounting plate 6, wherein the gold finger end 5 on the printed circuit board 4 extends out of the upper mounting plate 2, and the metal terminal used for connecting with the chip can be exposed from the through hole opened between the upper and lower chip slots 3, so as to achieve an effective contact effect with the chip.

[0046] On this basis, in order to facilitate the installation of multiple chips, multiple chip slots 3 are coaxially opened on the upper mounting plate 2 and the lower mounting plate 6. Not only do the multiple chip slots 3 correspond to the structural arrangement on the printed circuit board 4, but the multiple chip slots 3 are also symmetrically arranged about the center lines of the upper mounting plate 2 and the lower mounting plate 6; similarly, in order to facilitate the rapid replacement of chips, the chip slots 3 are extended outward on all sides to form a discharge trough 11. The discharge trough 11 is arranged in a circular structure with a bottom higher than the bottom of the chip slot 3 but lower than the height of the installed chip, so as to avoid affecting the metal terminals of the chip and the bottom printed circuit board 4 when using tools to insert into the discharge trough 11.

[0047] As mentioned above, a chip is installed in the chip slot 3, and the chip is electrically connected to the metal terminals of the printed circuit board 4 below the chip slot 3. During detection, it is necessary to move the fixture to the detection equipment, and the fixture on the detection equipment is placed vertically. Considering that the chip is always in a clamped state, a chip fixing block 8 is installed on the upper cover 1 and the lower cover 7 on one side close to the upper mounting plate 2 and the lower mounting plate 6 respectively. After installation, the chip fixing block 8 is embedded in the chip slot 3 and rests on the chip to form a stable structure.

[0048] Specifically, the chip fixing block 8 is installed on the upper cover 1 and the lower cover 7 by bolts through the base plate 9, and each chip fixing block 8 is provided with a heat dissipation through hole 10. One end of the spring is sleeved on the end of the heat dissipation through hole 10 away from the chip slot 3 and is located on the inner side of the chip fixing block 8, and the other end of the spring is against the base plate 9. During installation, when the upper cover 1 and the lower cover 7 are respectively covered with the chip slot 3, the chip fixing block 8 achieves the effect of resisting the chip under the action of the spring.

[0049] In addition, in the present embodiment, each chip slot 3 is provided with a corresponding chip fixing block 8, which can ensure that no matter which side is used for measurement, the installation consistency of the fixture can be guaranteed, which is conducive to achieving the measurement effect.

[0050] However, in order to further prevent the spring from returning to its original position due to elastic force, in this embodiment, the connection end of the upper cover 1 away from the upper mounting plate 2 and the lower cover 7 and the lower mounting plate 6 are locked by a locking structure, wherein the locking structure includes a handle 12, a connecting piece 13 and a resisting piece 14 structure. The upper cover 1 is described as an embodiment. The handle 12 is installed on the side of the upper cover 1 away from the upper mounting plate 2 and extends out of the upper mounting plate 2. The connecting piece 13 is L-shaped, and the vertical end is installed with the extended end of the handle 12 by bolts, and the horizontal end is vertically and extended on the upper cover 1, and the horizontal end is vertically arranged with the upper cover 1; and the corresponding resisting piece 14 is L-shaped and is installed in the corresponding locking groove 15 on the upper mounting plate 2 by bolts. When the upper cover is closed, the horizontal end of the connecting piece 13 is inserted into the vertical end of the resisting piece 14, and the two are resisted by interference; preferably, the vertical end of the resisting piece 14 is also provided with an outwardly protruding arc structure, which can increase the connection strength between the resisting piece 14 and the connecting piece 13.

[0051] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A memory chip test fixture, characterized in that: include: An upper cover (1) and an upper mounting plate (2), wherein the upper cover (1) is mounted on the side of the upper mounting plate (2) in an openable and closable manner via a hinge, and the connection end of the upper cover (1) away from the upper mounting plate (2) is locked via a locking structure; A chip slot (3) is provided on one side of the upper mounting plate (2) close to the upper cover (1), the opening of the chip slot (3) is arranged upward, and a through hole is provided at the bottom of the chip slot (3) to expose a metal terminal on the printed circuit board (4); The printed circuit board (4) is inserted and installed on an end of the upper mounting plate (2) away from the upper cover (1), and the gold finger end (5) on the printed circuit board (4) extends out of the upper mounting plate (2).

2. The memory chip test fixture according to claim 1, characterized in that: A lower mounting plate (6) is mounted on the side of the upper mounting plate (2) away from the upper cover (1) by means of bolts, and a chip slot (3) is also provided on the side of the lower mounting plate (6) away from the upper mounting plate (2); A lower cover (7) is mounted on the lower mounting plate (6) so as to be openable and closable via a hinge; A groove for inserting a printed circuit board (4) is provided between the upper mounting plate (2) and the lower mounting plate (6).

3. The memory chip test fixture according to claim 2, characterized in that: A plurality of chip slots (3) are coaxially opened on the upper mounting plate (2) and the lower mounting plate (6), and the plurality of chip slots (3) are arranged corresponding to the structure on the printed circuit board (4).

4. The memory chip test fixture according to claim 3, characterized in that: The upper cover (1) and the lower cover (7) are both provided with a chip fixing block (8) on one side close to the upper mounting plate (2) and the lower mounting plate (6) respectively; The chip fixing block (8) is mounted on the upper cover (1) and the lower cover (7) via bolts on the base plate (9), and a spring is arranged between the chip fixing block (8) and the base plate (9).

5. The memory chip test fixture according to claim 4, characterized in that: Each of the chip slots (3) is provided with a corresponding chip fixing block (8).

6. The memory chip test fixture according to claim 5, characterized in that: The chip slot (3) is surrounded by a discharge slot (11) extending outward to form a discharge slot (11). The discharge slot (11) is arranged in a circular structure, and the bottom is higher than the bottom of the chip slot (3) but lower than the height of the installed chip.

7. The memory chip test fixture according to claim 6, characterized in that: The locking structure comprises: A handle (12), the handle (12) being mounted on a side of the upper cover (1) away from the upper mounting plate (2) and extending out of the upper mounting plate (2); A connecting piece (13), the connecting piece (13) is L-shaped, the vertical end of which is mounted on the extended end of the handle (12) by means of bolts, and the horizontal end of which is vertically and extendedly arranged on the upper cover (1), and the horizontal end is arranged vertically to the upper cover (1); A resisting piece (14), the resisting piece (14) is L-shaped and is installed in a corresponding locking groove (15) on the upper mounting plate (2) by means of bolts; When the upper cover is closed, the horizontal end of the connecting piece (13) is inserted into the vertical end of the abutting piece (14), and the two are abutted with each other in an interference fit.

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