Silicon wafer loading system, exposure equipment and silicon wafer transmission method

By designing a combination of sealing plate, first moving part and door components in the sheet library, the problem of the inability to keep the internal and external isolation of the exposure equipment when loading the sheet box in the prior art is solved, and the effect of preventing particle contamination and laser leakage is achieved, and the product yield and yield are improved.

CN119644675APending Publication Date: 2025-03-18AMIES TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411749510.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

During the loading of the cartridge, the existing film library cannot keep the internal world of the exposure equipment isolated from the external world, resulting in particle pollution and laser leakage, affecting the yield.

Method used

A sheet library including a sealing plate, a first moving part and a door component is designed, and the door component is sealed by the movement of the first moving part to form a seal; the crossing interface is exposed during the unsealed position, and the box body of the sealing part and the sheet box maintain isolation between the inside and the outside of the exposure device.

Benefits of technology

It effectively prevents particle contamination and laser leakage, keeps the internal environment of the exposure equipment clean, improves product yield, and allows upper and lower sheet operations during exposure, improving yield.

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Abstract

The invention provides a silicon wafer loading system, exposure equipment and a silicon wafer transmission method. The silicon wafer loading system comprises a sealing element, a first moving part, a door part and a loading platform, the sealing piece is provided with a connecting opening, and the first moving part is movably arranged between a sealing position and an unsealing position in the direction close to or away from the loading platform. The door component is arranged on the first moving part and moves along with the first moving part; and the first moving part is configured to drive the door component to move after the wafer box and the sealing piece form sealing. The first moving part capable of moving along the direction close to or away from the loading platform is additionally arranged, so that the sealing element is matched with the box body of the wafer box in the wafer loading and unloading process of the silicon wafer loading system, and the sealing of the exposure equipment is kept; the internal environment of the exposure equipment is improved, and the product yield is improved.
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