Wafer nitrogen charging dispergation machine facilitating adjustment of LED ultraviolet lamp

Abstract

The invention discloses a wafer nitrogen charging dispergation machine facilitating adjustment of an LED ultraviolet lamp, and relates to the technical field of wafer dispergation processing, the wafer nitrogen charging dispergation machine facilitating adjustment of the LED ultraviolet lamp comprises a wafer ring clamping and taking mechanism, the wafer ring clamping and taking mechanism is arranged on a mounting shaft, the wafer nitrogen charging dispergation machine facilitating adjustment of the LED ultraviolet lamp comprises a wafer ring clamping and taking mechanism, and the wafer ring clamping and taking mechanism is arranged on the mounting shaft. The wafer ring clamping and taking mechanism is used for automatically clamping and feeding a wafer ring glued with a wafer, then the LED ultraviolet lamp irradiation adjusting mechanism is matched for automatically adjusting the illumination distance of an LED ultraviolet lamp, then the clamped and fed wafer ring is subjected to irradiation dispergation, and after dispergation is completed, a mounting shaft is driven to rotate to the position of the discharging mechanism, so that the wafer ring is automatically discharged. And then the discharging mechanism automatically discharges the wafer on the wafer ring after dispergation and automatically discharges the wafer ring at the same time, so that automatic dispergation of the wafer is realized, and the dispergation efficiency of the wafer is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer debonding processing, and in particular to a wafer nitrogen-filling debonding machine which is convenient for adjusting an LED ultraviolet lamp. Background Art

[0002] In the production process of electronic components such as chips, wafers are important basic raw materials. When processing wafers, in order to avoid damage to the surface of the wafer, a protective film needs to be bonded to the surface of the wafer, and then the protective film is glued to the wafer ring, supported by the wafer ring, and then processed by moving the wafer ring. After the processing is completed, the protective film bonded to the wafer ring needs to be separated from the wafer ring, and the protective film needs to be separated from the wafer. When separating the protective film, since the protective film is fixed to the wafer by gluing, after the protective film is torn, some glue blocks are still adhered to the wafer. For this reason, photo-debonding is often used to bond the protective film to the wafer. Before tearing the protective film, the wafer is placed under a debonding machine for exposure and debonding.

[0003] During use of the current debonding machine, it is usually necessary to manually place the wafer ring with the wafer stuck to it into the debonding machine for debonding, manually remove it after debonding is completed, and then manually tear off the protective film from the wafer ring to recycle the wafer ring. Then, the wafer with the protective film is placed in the separation process for separation. During the entire debonding process, the operation is relatively cumbersome and the degree of automation is low, resulting in low debonding efficiency for the wafer. At the same time, the debonding light source cannot be adjusted during the debonding process, and the uniformity of light irradiating the wafer and the wafer ring is low, resulting in poor debonding effect. Summary of the invention

[0004] The purpose of the present invention is to provide a wafer nitrogen filling and disintegrating machine which is convenient for adjusting LED ultraviolet lamps, so as to solve the shortcomings of the above-mentioned background technology.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A wafer nitrogen filling and dissolving machine that is convenient for adjusting an LED ultraviolet lamp, comprising an installation box body and an installation shaft that is rotatably connected in the installation box body, wherein one end of the installation shaft is fixedly connected to a first transmission motor that is fixedly connected to the installation box body through a coupling;

[0007] A wafer ring clamping and picking mechanism, wherein the wafer ring clamping and picking mechanism is arranged on the mounting shaft, and the wafer ring clamping and picking mechanism is used for automatically clamping and picking the wafer ring;

[0008] An LED ultraviolet lamp irradiation adjustment mechanism, wherein the LED ultraviolet lamp irradiation adjustment mechanism is arranged on the mounting shaft, and the LED ultraviolet lamp irradiation adjustment mechanism is used to irradiate the wafers on the wafer ring and automatically adjust the illumination at the same time;

[0009] A material unloading mechanism is arranged in the installation box body, and is used for automatically unloading wafer rings and wafers.

[0010] As a further solution of the present invention: the wafer ring clamping and fetching mechanism comprises a plurality of connecting columns fixedly connected to the mounting shaft, one end of the connecting column is fixedly connected to a mounting ring, a mounting groove is provided in the mounting ring, a transmission ring is rotatably connected in the mounting groove, a plurality of first electric telescopic rods are fixedly connected in the transmission ring through a connecting block, one end of the first electric telescopic rod is fixedly connected to a clamping frame, a second electric telescopic rod is fixedly connected in the clamping frame, and one end of the second electric telescopic rod is fixedly connected to a clamping block;

[0011] One side of the transmission ring is transmission-connected with a first transmission mechanism connected to the mounting ring, the first transmission mechanism is used to drive the transmission ring to rotate, and a feeding mechanism is arranged in the mounting box body, the feeding mechanism is used to automatically feed the wafer ring adhered by the protective film.

[0012] As a further solution of the present invention: the feeding mechanism includes a first drawer slidingly connected to the installation box main body, two transmission threaded rods are rotatably connected in the first drawer, a second transmission motor is fixedly connected in the first drawer, the output end of the second transmission motor is fixedly connected to the first transmission shaft through a coupling, the first transmission shaft and the outer surface of the transmission threaded rod are transmission-connected through a transmission wheel and a transmission belt, the outer surface of the transmission threaded rod is threadedly matched with a transmission disk, the top of the transmission disk is slidably connected to a first placing disk through a positioning groove, the first placing disk is slidably connected to a first discharge rod, a plurality of wafer ring bodies are placed in the first discharge rod, wafers are adhered to the wafer ring bodies through a protective film, and a buffer rubber pad is fixedly connected to the wafer ring bodies.

[0013] As a further solution of the present invention: the first transmission mechanism includes a third transmission motor fixedly connected to the mounting ring, the output end of the third transmission motor is fixedly connected to the second transmission shaft through a coupling, the outer surface of the second transmission shaft is fixedly sleeved with a transmission gear, and the outer surface of the transmission gear is meshingly connected with a transmission gear ring fixedly connected to the transmission ring.

[0014] As a further solution of the present invention: the LED ultraviolet lamp irradiation adjustment mechanism includes a functional cavity opened on the installation shaft, a plurality of transmission columns are slidably connected in the functional cavity, one end of the transmission column is fixedly connected to the LED ultraviolet lamp panel body, the outer surface of the transmission column is transmission-connected to the adjustment mechanism connected to the installation shaft, and the adjustment mechanism is used to adjust the irradiation distance of the LED ultraviolet lamp panel body to the wafer.

[0015] As a further solution of the present invention: the adjustment mechanism includes a fourth transmission motor fixedly connected to the mounting shaft, the output end of the fourth transmission motor is fixedly connected to the third transmission shaft rotatably connected to the functional cavity through a coupling, the outer surface of the third transmission shaft is fixedly sleeved with a first bevel gear, the outer surface of the first bevel gear is meshingly connected with a second bevel gear, the middle of the second bevel gear is fixedly sleeved with an adjustment threaded rod rotatably connected to the functional cavity, the outer surface of the adjustment threaded rod is threadedly matched with a transmission frame, the transmission frame is fixedly connected to the transmission column, and a sliding rod fixedly connected to the functional cavity is slidably connected to the transmission frame.

[0016] As a further solution of the present invention: the unloading mechanism includes a third electric telescopic rod fixedly connected to the installation box main body, one end of the third electric telescopic rod is fixedly connected to a transmission plate, the bottom of the transmission plate is fixedly connected to a fourth electric telescopic rod, the bottom end of the fourth electric telescopic rod is fixedly connected to a circle tube through a connecting plate, the outer surface of the circle tube is fixedly connected to a plurality of vacuum suction cups, the outer surface of the circle tube is fixedly connected to a vacuum pump fixedly connected to the installation box main body through a hose, one side of the installation box main body is fixedly connected to a material receiving drawer, and a wafer ring unloading mechanism is provided on the installation box main body, and the wafer ring unloading mechanism is used to unload wafer rings.

[0017] As a further solution of the present invention: the wafer ring unloading mechanism includes a second drawer slidably connected to the installation box main body, a second placing tray is fixedly connected in the second drawer, a second unloading rod is fixedly connected to one side of the second placing tray, a fifth electric telescopic rod is fixedly connected to one side of the second placing tray, one end of the fifth electric telescopic rod is fixedly connected to two sixth electric telescopic rods through a connecting block, and one end of the sixth electric telescopic rod is fixedly connected to an electromagnet plate through a connecting block.

[0018] As a further solution of the present invention: a nitrogen filling inlet pipe and a nitrogen filling exhaust pipe are fixedly connected to one side of the installation box body.

[0019] As a further solution of the present invention: a glass observation window is fixedly connected to one side of the installation box body.

[0020] Beneficial effects of the present invention:

[0021] (1) The first transmission motor drives the installation shaft to rotate, and the installation shaft drives the wafer ring clamping and picking mechanism to rotate. Then, the wafer ring clamping and picking mechanism automatically clamps and loads the wafer ring with the wafer glued thereon, and then cooperates with the LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the lighting distance of the LED ultraviolet lamp, and then irradiates and debonds the clamped wafer ring. When debonding is completed, the installation shaft is driven to rotate to the unloading mechanism position, and then the unloading mechanism automatically unloads the wafer on the wafer ring after debonding, and at the same time, the wafer ring is automatically unloaded, thereby realizing automatic debonding of the wafer, which greatly improves the debonding efficiency of the wafer.

[0022] (2) The wafer ring clamping and picking mechanism can realize automatic clamping and picking of wafer rings of different sizes with wafers attached thereto. After picking up the materials, the wafers are debonded by light irradiation through the main body of the LED ultraviolet lamp panel. At the same time, the clamped wafer ring is driven to rotate by the first transmission mechanism so that the light is evenly irradiated on the surface of the wafer ring, thereby evenly irradiating the wafer ring protective film and the wafers on the protective film with light, greatly improving the debonding effect on the wafers.

[0023] (3) The third transmission shaft is driven to rotate by the fourth transmission motor, and the third transmission shaft drives the transmission frame and the transmission column to move through the first bevel gear, the second bevel gear and the adjusting threaded rod, and the transmission column drives the LED ultraviolet lamp panel body to move, so that the LED ultraviolet lamp panel body 43 can adjust the range of light according to the size of the wafer ring, and at the same time adjust the irradiation intensity of the LED ultraviolet lamp panel body 43 to achieve irradiation and debonding of wafer rings of different sizes. At the same time, by arranging multiple LED ultraviolet lamp panel bodies on the outer surface of the mounting shaft 2, the wafer ring can be debonded during the entire process of clamping and unloading, and loading and unloading and debonding can be carried out simultaneously, which greatly reduces the debonding time and further improves the debonding efficiency of the wafer.

[0024] (4) The wafer ring clamping and picking mechanism is driven to rotate by the mounting shaft so that the wafer ring after debonding is rotated upward, and then the protective film on the wafer ring is sucked by the ring tube and the vacuum suction cup, and then the wafer ring is driven to rotate forward and reverse by the first transmission mechanism, so that the film with the wafer adhered to it after debonding is separated from the wafer ring, and then the protective film with the wafer is put into the receiving drawer 66 to realize automatic unloading of the protective film, and then the position of the wafer ring unloading mechanism is rotated, and then the wafer ring unloading mechanism automatically unloads the wafer ring, thereby realizing automatic unloading and collection of the wafer and wafer ring after debonding, without manual operation, and greatly improving the debonding efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The present invention will be further described below in conjunction with the accompanying drawings.

[0026] Figure 1is a first stereogram of the external structure of the present invention;

[0027] Figure 2 is a second stereoscopic diagram of the external structure of the present invention;

[0028] Figure 3 is a first stereogram of the internal structure of the present invention;

[0029] Figure 4 is a second stereoscopic view of the internal structure of the present invention;

[0030] Figure 5 is a stereoscopic diagram of the external structure of the mounting ring of the present invention;

[0031] Figure 6 is a three-dimensional diagram of the internal structure of the mounting ring of the present invention;

[0032] Figure 7 This is a front view of the internal structure of the mounting shaft of the present invention;

[0033] Figure 8 The present invention Figure 3 A magnified view of middle;

[0034] Fig. 9 The present invention Figure 3 Enlarged view of middle B;

[0035] Fig.10 The present invention Figure 4 Enlarged view of C in the middle.

[0036] In the figure: 1, installation box body; 2, installation shaft; 3, first transmission motor; 11, connecting column; 12, installation ring; 13, installation groove; 14, transmission ring; 15, first electric telescopic rod; 16, clamping frame; 17, second electric telescopic rod; 18, clamping block; 21, first drawer; 22, transmission threaded rod; 23, second transmission motor; 24, first transmission shaft; 25, transmission plate; 26, first placement plate; 27, first discharge rod; 28, wafer ring body; 29, buffer rubber pad; 31, third transmission motor; 32, second transmission shaft; 33, transmission gear; 34, transmission gear ring; 41. Functional cavity; 42. Transmission column; 43. LED UV lamp panel body; 51. Fourth transmission motor; 52. Third transmission shaft; 53. First bevel gear; 54. Second bevel gear; 55. Adjustment threaded rod; 56. Transmission frame; 61. Third electric telescopic rod; 62. Transmission plate; 63. Fourth electric telescopic rod; 64. Ring tube; 65. Vacuum suction cup; 66. Material receiving drawer; 71. Second drawer; 72. Second placement tray; 73. Second material discharge rod; 74. Fifth electric telescopic rod; 75. Sixth electric telescopic rod; 76. Electromagnetic iron plate; 81. Nitrogen filling inlet pipe; 82. Nitrogen filling exhaust pipe. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Embodiment 1

[0039] See also Figure 1-Figure 10 As shown, the present invention is a wafer nitrogen filling and dissolving machine which is convenient for adjusting the LED ultraviolet lamp, comprising an installation box main body 1, a mounting shaft 2 is rotatably connected inside the installation box main body 1, one end of the installation shaft 2 is fixedly connected to a first transmission motor 3 fixedly connected to the installation box main body 1 through a coupling, the first transmission motor 3 is controlled by a PLC programming program, and the first transmission motor 3 can be controlled to rotate forward and reverse and rotate at an angle, a wafer ring clamping and picking mechanism is arranged on the installation shaft 2, and the wafer ring clamping and picking mechanism is used for automatically clamping and picking the wafer ring, an LED ultraviolet lamp irradiation adjustment mechanism is arranged on the installation shaft 2, and the LED ultraviolet lamp irradiation adjustment mechanism is used for irradiating the wafer on the wafer ring and automatically adjusting the light, and a unloading mechanism is arranged in the installation box main body 1, and the unloading mechanism is used for automatically unloading the wafer ring and the wafer.

[0040] A nitrogen filling inlet pipe 81 and a nitrogen filling exhaust pipe 82 are fixedly connected to one side of the installation box body 1 .

[0041] The first transmission motor 3 drives the installation shaft 2 to rotate, and the installation shaft 2 drives the wafer ring clamping and picking mechanism to rotate, and then the wafer ring clamping and picking mechanism automatically clamps and loads the wafer ring with the wafer glued thereon, and then cooperates with the LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the lighting distance of the LED ultraviolet lamp, and then the clamped and loaded wafer ring is irradiated and debonded. When the debonding is completed, the installation shaft 2 is driven to rotate to the position of the unloading mechanism, and then the unloading mechanism automatically unloads the wafer on the wafer ring after debonding, and at the same time automatically unloads the wafer ring, thereby realizing automatic debonding of the wafer, which greatly improves the debonding efficiency of the wafer.

[0042] At the same time, nitrogen is filled into the installation box body 1 through the cooperation of the nitrogen filling machine, the nitrogen filling inlet pipe 81 and the nitrogen filling exhaust pipe 82, so that the installation box body 1 can be photo-disintegrated under nitrogen.

[0043] Embodiment 2

[0044] Based on Example 1, please refer to Figure 3-Figure 6 , Figure 8 and Fig. 9As shown, the wafer ring clamping and picking mechanism includes a plurality of connecting columns 11 fixedly connected to the mounting shaft 2, one end of the connecting column 11 is fixedly connected to a mounting ring 12, a mounting groove 13 is provided in the mounting ring 12, a transmission ring 14 is rotatably connected in the mounting groove 13, a plurality of first electric telescopic rods 15 are fixedly connected in the transmission ring 14 through a connecting block, one end of the first electric telescopic rod 15 is fixedly connected to a clamping frame 16, a second electric telescopic rod 17 is fixedly connected in the clamping frame 16, and one end of the second electric telescopic rod 17 is fixedly connected to a clamping block 18;

[0045] One side of the transmission ring 14 is transmission-connected with a first transmission mechanism connected to the mounting ring 12. The first transmission mechanism is used to drive the transmission ring 14 to rotate. The first transmission mechanism includes a third transmission motor 31 fixedly connected to the mounting ring 12. The third transmission motor 31 is controlled by a PLC programming program, and can control the third transmission motor 31 to rotate forward and reverse and rotate at an angle. The output end of the third transmission motor 31 is fixedly connected with a second transmission shaft 32 through a coupling. A transmission gear 33 is fixedly sleeved on the outer surface of the second transmission shaft 32. The outer surface of the transmission gear 33 is meshingly connected with a transmission gear ring 34 fixedly connected to the transmission ring 14. The second transmission shaft 32 is driven to rotate by the third transmission motor 31. The second transmission shaft 32 drives the transmission gear ring 34 to rotate through the transmission gear 33. The transmission gear ring 34 drives the transmission ring 14 to rotate;

[0046] A feeding mechanism is provided in the installation box body 1, and the feeding mechanism is used for automatically feeding the wafer rings adhered by the protective film. The feeding mechanism includes a first drawer 21 slidably connected to the installation box body 1, and two transmission threaded rods 22 are rotatably connected in the first drawer 21. A second transmission motor 23 is fixedly connected in the first drawer 21. The second transmission motor 23 is controlled by a PLC programming program, and the second transmission motor 23 can be controlled to rotate forward and backward and rotate at an angle. The output end of the second transmission motor 23 is fixedly connected to a first transmission shaft 24 through a coupling, and the first transmission shaft 24 is connected to the outer surface of the transmission threaded rod 22 through a transmission wheel and a transmission belt. The outer surface of the transmission threaded rod 22 is threadedly matched with a transmission disk 25, and the top of the transmission disk 25 is slidably connected to a first placement disk 26 through a positioning groove, and a first discharge rod 27 is slidably connected to the first placement disk 26. A plurality of wafer ring bodies 28 are placed in the first discharge rod 27, and wafers are adhered to the wafer ring body 28 through a protective film, and a buffer rubber pad 29 is fixedly connected to the wafer ring body 28.

[0047] The first drawer 21 is pulled out, and then a plurality of wafer rings with wafers stuck thereon are turned over onto the first discharge rod 27 on the first placement tray 26, and then the first drawer 21 is pushed into the installation box body 1, and then the first transmission shaft 24 is driven to rotate by the second transmission motor 23, and the first transmission shaft 24 drives the transmission threaded rod 22 to rotate through the transmission wheel and the transmission belt, and the transmission threaded rod 22 drives the transmission disk 25 to move, and the transmission disk 25 drives the first placement tray 26 to move upward, and the first placement tray 26 drives a plurality of wafer rings on the first discharge rod 27 to move upward, so that the top wafer ring enters the installation ring 12, and then the clamping frame 16 is driven to move by the first electric telescopic rod 15, and then the clamping block 18 is driven to move by the second electric telescopic rod 17. The clamping block 18 clamps and fixes the wafer ring, and then drives the first placement plate 26 to move downward, thereby realizing automatic clamping and picking of wafer rings of different sizes. After the clamping and picking are completed, the first transmission motor 3 drives the installation shaft 2 to rotate, and the LED ultraviolet lamp irradiation adjustment mechanism is used to irradiate and debond the wafer ring. During the debonding process, the first transmission mechanism drives the transmission ring 14 to rotate, the transmission ring 14 drives the first electric telescopic rod 15 to rotate, the first electric telescopic rod 15 drives the clamping frame 16 to rotate, and the clamping frame 16 drives the wafer ring to rotate, so that the light irradiates the surface of the wafer ring evenly, so that the wafer ring protective film and the wafer on the protective film are evenly illuminated and debonded, which greatly improves the debonding effect on the wafer.

[0048] Embodiment 3

[0049] Based on Example 2, please refer to Figure 4 and Figure 7 As shown, the LED ultraviolet lamp irradiation adjustment mechanism includes a functional cavity 41 opened on the installation shaft 2, a plurality of transmission columns 42 are slidably connected in the functional cavity 41, one end of the transmission column 42 is fixedly connected to the LED ultraviolet lamp panel body 43, the outer surface of the transmission column 42 is transmission-connected to the adjustment mechanism connected to the installation shaft 2, the adjustment mechanism is used to adjust the irradiation distance of the LED ultraviolet lamp panel body 43 to the wafer, the adjustment mechanism includes a fourth transmission motor 51 fixedly connected to the installation shaft 2, the fourth transmission motor 51 is controlled by a PLC programming program, and the fourth transmission motor 51 can be controlled to rotate forward and reverse The output end of the fourth transmission motor 51 is fixedly connected to the third transmission shaft 52 rotatably connected to the functional chamber 41 through a coupling, the outer surface of the third transmission shaft 52 is fixedly sleeved with a first bevel gear 53, the outer surface of the first bevel gear 53 is meshingly connected with a second bevel gear 54, the middle of the second bevel gear 54 is fixedly sleeved with an adjusting threaded rod 55 rotatably connected to the functional chamber 41, the outer surface of the adjusting threaded rod 55 is threadedly matched with a transmission frame 56, the transmission frame 56 is fixedly connected to the transmission column 42, and the transmission frame 56 is slidably connected with a sliding rod fixedly connected to the functional chamber 41.

[0050] According to the size of the wafer ring, the third transmission shaft 52 is driven to rotate by the fourth transmission motor 51, and the third transmission shaft 52 drives the adjusting threaded rod 55 to rotate through the first bevel gear 53 and the second bevel gear 54, and the adjusting threaded rod 55 drives the transmission frame 56 to move, and the transmission frame 56 drives the transmission column 42 to move, and the transmission column 42 drives the LED ultraviolet lamp panel body 43 to move, so that the LED ultraviolet lamp panel body 43 can adjust the range of illumination according to the size of the wafer ring, and adjust the irradiation intensity of the LED ultraviolet lamp panel body 43 at the same time, so as to realize irradiation and debonding of wafer rings of different sizes, and at the same time, by arranging multiple LED ultraviolet lamp panel bodies 43 on the outer surface of the mounting shaft 2, the wafer ring can be debonded during the whole process of clamping and unloading, so that loading and unloading and debonding can be carried out simultaneously, which greatly reduces the debonding time and further improves the debonding efficiency of the wafer.

[0051] Embodiment 4

[0052] Based on Example 2, please refer to Figure 2 , Figure 4 , Figure 8 , Fig. 9 and Fig.10 As shown, the unloading mechanism includes a third electric telescopic rod 61 fixedly connected to the installation box body 1, one end of the third electric telescopic rod 61 is fixedly connected to a transmission plate 62, the bottom of the transmission plate 62 is fixedly connected to a fourth electric telescopic rod 63, the bottom end of the fourth electric telescopic rod 63 is fixedly connected to a ring tube 64 through a connecting plate, the outer surface of the ring tube 64 is fixedly connected to a plurality of vacuum suction cups 65, the outer surface of the ring tube 64 is fixedly connected to a vacuum pump fixedly connected to the installation box body 1 through a hose, one side of the installation box body 1 is fixedly connected to a material receiving drawer 66, and the upper surface of the installation box body 1 is fixedly connected to the material receiving drawer 66. A wafer ring unloading mechanism is provided, which is used for unloading wafer rings. The wafer ring unloading mechanism includes a second drawer 71 slidably connected to the installation box main body 1, a second placement tray 72 is fixedly connected in the second drawer 71, a second placement tray 72 is fixedly connected to one side of the second placement tray 72, a second discharge rod 73 is fixedly connected to one side of the second placement tray 72, a fifth electric telescopic rod 74 is fixedly connected to one side of the second placement tray 72, one end of the fifth electric telescopic rod 74 is fixedly connected to two sixth electric telescopic rods 75 through a connecting block, and one end of the sixth electric telescopic rod 75 is fixedly connected to an electromagnet plate 76 through a connecting block.

[0053] The first transmission motor 3 drives the installation shaft 2 to rotate, and the installation shaft 2 drives the wafer ring clamping and picking mechanism to rotate upward. At this time, the clamped wafer ring is basically debonded, and then the third electric telescopic rod 61 drives the transmission plate 62 to move, and the transmission plate 62 drives the fourth electric telescopic rod 63 to move, and the fourth electric telescopic rod 63 drives the circle tube 64 and the vacuum suction cup 65 to move downward, and then the vacuum suction cup 65 sucks the protective film on the wafer ring, and then the transmission ring 14 is driven by the first transmission mechanism to rotate forward and reverse, and the transmission ring 14 drives the first electric telescopic rod 15 and the clamping frame 16 to rotate, and the clamping frame 16 drives the wafer ring to rotate, so that the film with the wafer after debonding is separated from the wafer ring, and then the first electric telescopic rod 15 drives the circle tube 64 to move upward, and at the same time, the transmission plate 62 is driven by the third electric telescopic rod 61 to move, so that the adsorbed protective film with the wafer is placed in the receiving drawer 66, The protective film is now automatically unloaded. After unloading is completed, the mounting shaft 2 is driven to rotate so that it rotates to the position of the wafer ring unloading mechanism. The sixth electric telescopic rod 75 is driven to move by the fifth electric telescopic rod 74. The electromagnet plate 76 is driven to move by the sixth electric telescopic rod 75. The electromagnet plate 76 is then energized, and the electromagnet plate 76 adsorbs the column wafer ring. The clamping block 18 of the clamping frame 16 no longer clamps the wafer ring. The fifth electric telescopic rod 74 drives the sixth electric telescopic rod 75 to move, driving the wafer ring to be inserted into the second discharge rod 73 for collection. The electromagnet plate 76 is then powered off, and the sixth electric telescopic rod 75 drives the electromagnet plate 76 to move downward to unload the next wafer ring, thereby realizing automatic unloading of the wafer ring, thereby realizing automatic unloading and collection of the debonded wafers and wafer rings without manual operation, thereby greatly improving the debonding efficiency of the wafers.

[0054] The working principle of the present invention is as follows: the first transmission motor 3 drives the installation shaft 2 to rotate, and the installation shaft 2 drives the wafer ring clamping and picking mechanism to rotate, and then the wafer ring clamping and picking mechanism automatically clamps and loads the wafer ring with the wafer glued thereon, and then cooperates with the LED ultraviolet lamp irradiation adjustment mechanism to automatically adjust the lighting distance of the LED ultraviolet lamp, and then the clamped and loaded wafer ring is irradiated and debonded, and when the debonding is completed, the installation shaft 2 is driven to rotate to the position of the unloading mechanism, and then the unloading mechanism automatically unloads the wafer on the wafer ring after debonding, and at the same time automatically unloads the wafer ring, thereby realizing automatic debonding of the wafer, and greatly improving the debonding effect of the wafer.

[0055] The above is a detailed description of an embodiment of the present invention, but the content is only a preferred embodiment of the present invention and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A wafer nitrogen filling and disassembling machine that is convenient for adjusting LED ultraviolet lamps, characterized in that: include: An installation box body (1) and an installation shaft (2) rotatably connected inside the installation box body (1), one end of the installation shaft (2) being fixedly connected to a first transmission motor (3) fixedly connected to the installation box body (1) via a coupling; A wafer ring clamping and picking mechanism, the wafer ring clamping and picking mechanism being arranged on the mounting shaft (2), and the wafer ring clamping and picking mechanism being used for automatically clamping and picking the wafer ring; An LED ultraviolet lamp irradiation adjustment mechanism, the LED ultraviolet lamp irradiation adjustment mechanism being arranged on the mounting shaft (2), the LED ultraviolet lamp irradiation adjustment mechanism being used to irradiate the wafers on the wafer ring and to automatically adjust the illumination at the same time; A material unloading mechanism is arranged in the installation box body (1), and is used for automatically unloading wafer rings and wafers.

2. According to claim 1, a wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamps is characterized in that: The wafer ring clamping and picking mechanism comprises a plurality of connecting columns (11) fixedly connected to the mounting shaft (2), one end of the connecting column (11) is fixedly connected to a mounting ring (12), a mounting groove (13) is provided in the mounting ring (12), a transmission ring (14) is rotatably connected in the mounting groove (13), a plurality of first electric telescopic rods (15) are fixedly connected in the transmission ring (14) via a connecting block, one end of the first electric telescopic rod (15) is fixedly connected to a clamping frame (16), a second electric telescopic rod (17) is fixedly connected in the clamping frame (16), and one end of the second electric telescopic rod (17) is fixedly connected to a clamping block (18); One side of the transmission ring (14) is transmission-connected to a first transmission mechanism connected to the mounting ring (12), the first transmission mechanism being used to drive the transmission ring (14) to rotate, and a feeding mechanism being provided in the mounting box body (1), the feeding mechanism being used to automatically feed the wafer ring adhered by the protective film.

3. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 2 is characterized in that: The feeding mechanism comprises a first drawer (21) slidably connected to the installation box body (1); two transmission threaded rods (22) are rotatably connected in the first drawer (21); a second transmission motor (23) is fixedly connected in the first drawer (21); an output end of the second transmission motor (23) is fixedly connected to a first transmission shaft (24) through a coupling; the first transmission shaft (24) is connected to the outer surface of the transmission threaded rod (22) through a transmission wheel and a transmission belt; a transmission disk (25) is threadedly matched to the outer surface of the transmission threaded rod (22); a first placement disk (26) is slidably connected to the top of the transmission disk (25) through a positioning groove; a first discharge rod (27) is slidably connected to the first placement disk (26); a plurality of wafer ring bodies (28) are placed in the first discharge rod (27); wafers are adhered to the wafer ring bodies (28) through a protective film; and a buffer rubber pad (29) is fixedly connected to the wafer ring bodies (28).

4. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 2 is characterized in that: The first transmission mechanism comprises a third transmission motor (31) fixedly connected to the mounting ring (12); an output end of the third transmission motor (31) is fixedly connected to a second transmission shaft (32) via a coupling; a transmission gear (33) is fixedly sleeved on an outer surface of the second transmission shaft (32); and an outer surface of the transmission gear (33) is meshingly connected to a transmission gear ring (34) fixedly connected to the transmission ring (14).

5. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: The LED ultraviolet lamp irradiation adjustment mechanism comprises a functional cavity (41) provided on a mounting shaft (2), a plurality of transmission columns (42) being slidably connected in the functional cavity (41), one end of the transmission column (42) being fixedly connected to an LED ultraviolet lamp panel body (43), an outer surface of the transmission column (42) being transmission-connected to an adjustment mechanism connected to the mounting shaft (2), the adjustment mechanism being used to adjust the irradiation distance of the LED ultraviolet lamp panel body (43) to the wafer.

6. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 5 is characterized in that: The adjustment mechanism comprises a fourth transmission motor (51) fixedly connected to the mounting shaft (2); the output end of the fourth transmission motor (51) is fixedly connected to a third transmission shaft (52) rotatably connected to the functional chamber (41) through a coupling; the outer surface of the third transmission shaft (52) is fixedly sleeved with a first bevel gear (53); the outer surface of the first bevel gear (53) is meshingly connected with a second bevel gear (54); the middle of the second bevel gear (54) is fixedly sleeved with an adjustment threaded rod (55) rotatably connected to the functional chamber (41); the outer surface of the adjustment threaded rod (55) is threadedly matched with a transmission frame (56); the transmission frame (56) is fixedly connected to the transmission column (42); and a sliding rod fixedly connected to the functional chamber (41) is slidably connected to the transmission frame (56).

7. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: The unloading mechanism comprises a third electric telescopic rod (61) fixedly connected to the installation box body (1); one end of the third electric telescopic rod (61) is fixedly connected to a transmission plate (62); the bottom of the transmission plate (62) is fixedly connected to a fourth electric telescopic rod (63); the bottom end of the fourth electric telescopic rod (63) is fixedly connected to a ring tube (64) via a connecting plate; the outer surface of the ring tube (64) is fixedly connected to a plurality of vacuum suction cups (65); the outer surface of the ring tube (64) is fixedly connected to a vacuum pump fixedly connected to the installation box body (1) via a hose; one side of the installation box body (1) is fixedly connected to a material receiving drawer (66); a wafer ring unloading mechanism is provided on the installation box body (1); the wafer ring unloading mechanism is used to unload wafer rings.

8. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 7 is characterized in that: The wafer ring unloading mechanism comprises a second drawer (71) slidably connected to the installation box body (1); a second placement tray (72) is fixedly connected inside the second drawer (71); a second discharge rod (73) is fixedly connected to one side of the second placement tray (72); a fifth electric telescopic rod (74) is fixedly connected to one side of the second placement tray (72); one end of the fifth electric telescopic rod (74) is fixedly connected to two sixth electric telescopic rods (75) via a connecting block; one end of the sixth electric telescopic rod (75) is fixedly connected to an electromagnet plate (76) via a connecting block.

9. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1 is characterized in that: A nitrogen filling air inlet pipe (81) and a nitrogen filling air outlet pipe (82) are fixedly connected to one side of the installation box body (1).

10. The wafer nitrogen filling and dissolving machine that is convenient for adjusting LED ultraviolet lamp according to claim 1, characterized in that: A glass observation window is fixedly connected to one side of the installation box body (1).

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