Loading port device, front-end loading device, wafer processing equipment and detection method

Abstract

The invention provides a loading port device, a front-end loading device, wafer processing equipment and a detection method. The load port device includes: a main body; the loading platform horizontally protrudes from the main body and is used for placing a wafer box, and the wafer box is constructed to be used for stacking wafers at intervals in the vertical direction; the detection mechanism is movably installed on the main body and can move in the vertical direction to sequentially detect the wafers in the wafer box, and the detection mechanism comprises a warping detector and an analyzer in communication connection with the warping detector; the warpage detector is configured to send a warpage detection signal to the analyzer, and the warpage detection signal increases as the horizontal distance from the warpage detector to the wafer decreases; the analyzer is configured to determine warpage information of the wafer based on the warpage detection signal and a vertical displacement of the warpage detector. According to the technical scheme provided by the invention, the warping condition of the wafer can be quickly and accurately judged, and accurate wafer information is provided for a subsequent wafer transmission process and a subsequent wafer processing process.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular, to a loading port device, a front-end loading device, a wafer processing equipment and a detection method. Background Art

[0002] The load port is an indispensable device in semiconductor equipment, which provides an interactive carrier for the transfer of wafers between different machines. The robot transfers the wafers in the wafer box on the load port device to the processing unit of the processing machine. However, in actual processing, the wafer may be warped due to internal stress or other reasons, or the bonding wafer formed by bonding two wafers may be warped, so that the position of the wafer in the wafer box does not correspond to the wafer picking point of the front-end robot. The front-end robot collides with the wafer when picking it up, or the clamping is unstable during the transmission after picking it up, resulting in wafer damage. At this time, the wafer processing equipment needs to be shut down for cleaning, and the robot needs to be repositioned, which affects the effective operation time of the equipment, reduces the equipment processing efficiency, and increases the equipment maintenance cost. Summary of the invention

[0003] The present application provides a loading port device, a front-end loading device, a wafer processing equipment and a detection method to solve or alleviate at least some of the problems mentioned above.

[0004] According to one aspect of the present application, a loading port device is provided for wafer processing equipment, the loading port device comprising: a main body; a loading platform protruding horizontally from the main body, the loading platform being used to place a wafer box, the wafer box being configured to stack wafers at intervals in a vertical direction; and a detection mechanism, which is movably mounted to the main body and is movable in a vertical direction to sequentially detect the wafers in the wafer box, the detection mechanism comprising a warp detector and an analyzer communicatively connected to the warp detector; the warp detector is configured to send a warp detection signal to the analyzer, the warp detection signal increasing as the horizontal distance from the warp detector to the wafer decreases; the analyzer is configured to determine the warp information of the wafer based on the warp detection signal and the vertical displacement of the warp detector.

[0005] Optionally or alternatively, the analyzer can generate a waveform image of the warpage detection signal as it varies with a vertical displacement of the warpage detector, and determine the warpage information of the wafer based on a shape of the waveform image.

[0006] Optionally or alternatively, the warping information includes a warping degree and / or a warping direction.

[0007] Optionally or alternatively, the analyzer determines that the corresponding wafer is a non-warped wafer based on a convex rectangular wave in the waveform image.

[0008] Optionally or alternatively, the analyzer determines that the corresponding wafer is a warped wafer based on that a convex waveform in the waveform image has a plateau region and a curved region continuous with the plateau region.

[0009] Optionally or alternatively, the analyzer determines that the warpage direction of the corresponding wafer is opposite to the vertical displacement direction of the warpage detector based on the fact that the curve area is downstream of the platform area in the vertical displacement direction of the warpage detector and the curve area gradually descends.

[0010] Optionally or alternatively, the analyzer determines that the warpage direction of the corresponding wafer is the same as the vertical displacement direction of the warpage detector based on the fact that the curve area is upstream of the platform area in the vertical displacement direction of the warpage detector and the curve area gradually rises.

[0011] Optionally or alternatively, the analyzer determines the warpage of the corresponding wafer based on the total width of the platform area and the curved area continuous therewith in the vertical displacement direction of the warpage detector. When the warpage direction is downward warpage, the absolute value of the warpage output by the analyzer based on the same total width value is lower than that of upward warpage.

[0012] Optionally or alternatively, the analyzer is also configured to determine the warpage smoothness of the wafer based on the curvature of the curve zone, determine the warpage smoothness as smooth when the curvature of the curve zone is the same or changes continuously, and determine the warpage smoothness as uneven when there is a sudden change in the curvature of the curve zone.

[0013] Optionally or alternatively, the analyzer is further configured to determine the thickness of the wafer based on the width of a plateau region of a convex waveform in the waveform image.

[0014] Optionally or alternatively, the analyzer is further configured to determine a placement state of the wafer based on the shape of the waveform image, the placement state including a single-wafer state, a stacked-wafer state, and a cross-slot state.

[0015] Optionally or alternatively, the wafer box has a plurality of horizontal slots arranged along the vertical direction for placing wafers, and the analyzer is provided with a preset interval matching the vertical size of the horizontal slots; the analyzer determines that the placement state is a single-piece state based on that the width of the protruding waveform in the waveform image is less than the preset interval, and the width of the platform area of ​​the protruding waveform in the waveform image is less than or equal to the wafer thickness threshold; and / or the analyzer determines that the placement state is a stacked state based on that the width of the protruding waveform in the waveform image is less than the preset interval, and the width of the platform area of ​​the protruding waveform in the waveform image is greater than the wafer thickness threshold; and / or the analyzer determines that the placement state is a cross-slot state based on that the width of the protruding waveform in the waveform image exceeds the preset interval.

[0016] Optionally or alternatively, the detection mechanism includes two or more warp detectors arranged at intervals, and the analyzer determines the warping information of the wafer in the arrangement direction of the two or more warp detectors and in a direction perpendicular to the arrangement direction by analyzing waveform images of the two or more warp detectors.

[0017] Optionally or alternatively, the warpage detector is an infrared sensor.

[0018] Optionally or alternatively, the wafer box has a plurality of horizontal slots arranged in a vertical direction for placing wafers; the detection mechanism also includes a state detector, which is configured to detect the placement state of the wafers in the horizontal slots, and the placement state includes a single-wafer state, a stacked-wafer state and a cross-slot state.

[0019] Optionally or alternatively, the state detector is a through-beam sensor, which includes a transmitter and a receiver arranged horizontally at intervals, and the receiver receives the through-beam light emitted by the transmitter; when performing wafer inspection, the state detector at least partially extends into the wafer box so that when the inspection mechanism moves in the vertical direction, the wafers in the wafer box pass between the transmitter and the receiver to block the through-beam light, and the through-beam sensor determines the placement state based on the time when the receiver does not receive the through-beam light or the distance moved when the receiver does not receive the through-beam light.

[0020] Optionally or alternatively, the load port device further comprises a display communicatively connected to the detection mechanism, wherein the display is configured to receive and display the warpage information and placement status information of the wafer.

[0021] Optionally or alternatively, the wafer box has a plurality of horizontal slots arranged along the vertical direction for placing wafers, and the horizontal slots extend from the side wall of the wafer box to the interior of the wafer box; the detection mechanism also includes a visual detector, which is arranged toward the side wall of the wafer box; the visual detector is configured to detect the edge of the wafer at the horizontal slot and identify the horizontal distance between the edge of the wafer and the side wall of the wafer box to determine the warping information of the wafer.

[0022] Optionally or alternatively, identifying the horizontal spacing between the edge of the wafer and the side wall of the wafer box includes: the visual detector constructs a first virtual scale in its detection field of view, starting from the inner surface of the side wall of the wafer box and extending horizontally inward, and reads the scale corresponding to the edge of the wafer to determine the horizontal spacing; the visual detector is configured to determine that the corresponding wafer is a warped wafer when the horizontal spacing is greater than a first spacing threshold.

[0023] Optionally or alternatively, the visual detector is also configured to identify the vertical spacing between the edge of the wafer and the horizontal slot, including: the visual detector constructs a second virtual scale in its detection field of view with the upper surface of the horizontal slot as the starting point and extending vertically upward, and reads the scale corresponding to the edge of the wafer to determine the vertical spacing; the visual detector is configured to: determine that the warping direction of the corresponding wafer is upward warping when the horizontal spacing is greater than a first spacing threshold and the vertical spacing is greater than a second spacing threshold; determine that the warping direction of the corresponding wafer is downward warping when the horizontal spacing is greater than the first spacing threshold and the vertical spacing is not greater than the second spacing threshold.

[0024] Optionally or alternatively, identifying the horizontal distance between the edge of the wafer and the side wall of the wafer box includes: the visual detector identifies whether there is a wafer at a first spacing threshold horizontally away from the inner surface of the side wall of the wafer box; if no wafer exists, determining that the horizontal distance between the wafer and the inner surface of the side wall of the wafer box exceeds the first spacing threshold, and then determining that the corresponding wafer is a warped wafer.

[0025] Optionally or alternatively, the main body is configured with a window, and the detection mechanism detects the wafers in the wafer box through the window; the loading port device also includes a door opener mounted to the main body, and the door opener is configured to open a movable door of the wafer box toward the window and move the movable door to expose the wafers in the wafer box toward the loading port device.

[0026] According to another aspect of the present application, a front-end loading device is provided for wafer processing equipment, the front-end loading device comprising: a loading port device according to the aforementioned aspects; a wafer box, which is movably placed on a loading table of the loading port device, the wafer box being configured to stack wafers at intervals in a vertical direction; and a front-end robot configured to take wafers from the wafer box or place wafers into the wafer box.

[0027] According to another aspect of the present application, a front-end loading device and a wafer processing equipment are provided, and the wafer processing equipment includes: a front-end loading device according to the aforementioned aspects; a wafer processing unit; and a wafer transfer device, wherein the wafer transfer device is configured to transfer the wafer from the front-end loading device to the wafer processing unit for wafer processing.

[0028] According to another aspect of the present application, a wafer detection method is provided, which is used for the loading port device as described in the above aspects, and the method includes: opening a movable door of a wafer box to expose the wafers in the wafer box to a detection mechanism; controlling the detection mechanism to move in a vertical direction to detect the wafers in the wafer box in turn; and outputting the detected wafer information.

[0029] Optionally or alternatively, controlling the detection mechanism to move in the vertical direction to sequentially detect the wafers in the wafer box includes: detecting warpage information of the wafers via a warpage detector.

[0030] Optionally or alternatively, controlling the detection mechanism to move in the vertical direction to sequentially detect the wafers in the wafer box includes: detecting a placement state of the wafers via a warpage detector and / or detecting a placement state of the wafers via a state detector.

[0031] Optionally or alternatively, a wafer taking position of a front-end robot for taking wafers from the wafer box is adjusted based on the warpage information of the wafer.

[0032] According to another aspect of the present application, a computer storage medium is provided, on which a computer program is stored. When the program is executed by a processor, the method described in the above aspects is implemented.

[0033] According to the loading port device, front-end loading device, wafer processing equipment and detection method of the present application, by setting up a detection mechanism, automatic detection of wafer warping is achieved, errors in human eye detection are avoided, and the warping condition of the wafer can be judged quickly and accurately, providing accurate wafer information for subsequent wafer transmission and wafer processing processes, thereby facilitating timely adaptive adjustment of corresponding working parameters of the wafer transmission unit and the wafer processing unit, or timely unloading of wafers that do not meet the processing requirements due to excessive warping, avoiding wafer breakage or damage to the wafer processing equipment during processing, improving the processing efficiency of the wafer processing equipment, and improving the yield and service life of the wafer processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0035] Figure 1 is a schematic diagram of a wafer processing device according to an embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of a load port device in which a wafer cassette is shown; Figure 3 for Figure 1 A schematic diagram of a load port device in FIG. 1 , wherein a wafer box is not shown; Figure 4 for Figure 3 A schematic diagram of another angle of the load port device in FIG. Figure 5 A wafer box according to an embodiment of the present application is shown, and the wafer box has been opened; Figure 6 Shows Figure 5 Another angle view of the wafer box, showing Figure 2 A detection mechanism of a load port device; Figure 7 A schematic top view of wafer inspection is shown; Figure 8 for Figure 6 A schematic diagram of a wafer box and a detection mechanism from another angle; Fig. 9 for Figure 5 A cross-sectional view of the middle wafer box at AA; Fig.10 is a schematic diagram of the wafer inspection process; Fig.11A schematic diagram showing a waveform image generated by an analyzer according to an embodiment of the present application; Fig.12 A schematic diagram showing another waveform image generated by an analyzer according to an embodiment of the present application is shown; Fig.13 A schematic diagram showing another waveform image generated by an analyzer according to an embodiment of the present application is shown; Fig.14 Shows Figure 5 A schematic diagram of another angle of the wafer box in FIG. Fig.15 Shows Fig.14 The enlarged view of D in FIG. Fig.16 A flow chart of a wafer inspection method according to an embodiment of the present application is shown; Fig.17 Shows the execution Fig.16 A flowchart of information processing when using a wafer inspection method.

[0036] Reference numerals: Wafer processing equipment 1; front-end loading device 10; front-end robot 101; polishing unit 20; thinning unit 30; wafer transfer unit 40; loading port device 100; main body 110; window 111; door opener 112; loading table 120; detection mechanism 130; horizontal rod 131a; vertical rod 131b; wafer box 200; horizontal slot 210; warp detector 132; state detector 133; visual detector 134; display 140; controller 150; waveform 50; platform area 51; curve area 52; first position P1; second position P2; first virtual scale R1; second virtual scale R2; wafer W. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0038] In the description of the present application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, in the description of the present application, unless otherwise specified and limited, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0040] Figure 1 Schematic diagram of a wafer processing device 1 according to an embodiment of the present application. The wafer processing device 1 includes a front-end loading device 10, a wafer processing unit, and a wafer W transferred between the front-end loading device 10 and the wafer processing unit (see Figure 5 ) of the wafer transfer unit 40. The wafer processing unit may include a thinning unit 30 for grinding and thinning the wafer W and a polishing unit 20 for surface polishing and cleaning the wafer W. It should be understood that in other embodiments, the wafer processing unit may include only one of the thinning unit 30 or the polishing unit 20, or may include processing units that implement other processing techniques, such as a wafer edge polishing unit or a wafer edge cutting unit.

[0041] like Figure 1-4 As shown, the front-end loading device 10 may include a loading port device 100, a wafer box 200 movably placed on a loading platform 120 of the loading port device 100, and a front-end robot 101 for taking wafers W from the wafer box 200 or placing wafers W into the wafer box 200. The wafer box 200 may be a FOUP (Front Open Unified Pod). Specifically, as Figure 2-4 The loading port device 100 mainly includes a main body 110, a loading platform 120 horizontally protruding from the main body 110, and a detection mechanism 130 movably mounted to the main body 110 (see Figure 4). The loading table 120 is used to place the wafer box 200. The main body 110 extends vertically and is configured with a window 111. In the vertical direction, the window 111 is located above the loading table 120, and the opening size of the window 111 matches the size of the wafer box 200. The detection mechanism 130 can detect the wafer W in the wafer box 200 through the window 111, and the front-end robot 101 can enter the wafer box 200 through the window 111 to take and place the wafer. "Movably placed" means that the wafer box 200 can be placed on the loading table 120 of the loading port device 100, for example, to supply wafers W to be processed to the wafer processing unit; it can also be moved away from the loading table 120 of the loading port device 100, for example, to move away the processed wafers W received from the wafer processing unit.

[0042] Figure 5 A wafer box 200 according to an embodiment of the present application is shown, which is opened and only one wafer W is shown for clarity. The wafer box 200 has a size suitable for accommodating the wafer W, and has a plurality of horizontal slots 210 arranged in a vertical direction in its cavity for stacking the wafers W at intervals in the vertical direction. Figure 5 2 shows a horizontal slot 210 formed in the form of a partition, that is, a plurality of partitions are symmetrically arranged on the inner walls of both sides of the wafer box 200, and a horizontal slot 210 is formed between two adjacent partitions in the vertical direction. The wafer box 200 has a detachable movable door (not shown). When the wafer box 200 is placed on the loading platform 120 of the loading port device 100, the movable door faces the loading port device 100, that is, faces the loading port device 100. Figure 1 The loadport device 100 may have a door opener 112 mounted to its body 110 (see Figure 3 ), the door opener 112 can open the movable door of the wafer box 200 and move the movable door so that the movable door avoids blocking the wafer W, so that the wafer W is exposed toward the loading port device 100, so as to facilitate the detection mechanism 130 to detect the wafer W in the wafer box 200, or to facilitate the front-end robot 101 to take and place the wafer W.

[0043] In a specific embodiment, the detection mechanism 130 may be movably mounted to the main body 110 and movable in a vertical direction to sequentially detect the wafers W in the wafer box 200. Figure 4 ,and Figures 6 to 8 As shown, the detection mechanism 130 may include a gantry-shaped detection frame, specifically as shown in FIG. Figure 6, the detection frame has a horizontal rod 131a extending horizontally and a vertical rod 131b extending vertically downward from both ends of the horizontal rod 131a. The detection frame can be movably mounted to the main body 110 via a vertically extending guide rail (not shown). A detector can be set on the detection frame. After the wafer box 200 is placed on the loading platform 120 and the movable door of the wafer box 200 is opened, the detection frame can move vertically along the guide rail, for example, from the top of the window 111 to the bottom of the window 111, so that the detector scans the wafer W in the wafer box 200 from top to bottom in sequence, thereby detecting the placement state or warping state of the wafer W. It should be understood that the width of the detection frame (i.e., the length of the horizontal rod 131a) can be longer or shorter than the width of the window 111, as long as the detector thereon can detect the wafer W.

[0044] In a specific embodiment, Figure 6 , the detection mechanism 130 may include a warp detector 132 and an analyzer (not shown) in communication with the warp detector 132. The warp detector 132 may be disposed in the middle of the horizontal rod 131a of the detection frame. The warp detector 132 is configured to send a warp detection signal to the analyzer, and the magnitude of the warp detection signal is related to the horizontal distance from the warp detector 132 to the wafer W, that is, the smaller the horizontal distance from the warp detector 132 to the wafer W, the larger the warp detection signal. For example, the warp detector 132 may be an infrared sensor, which emits infrared light toward the wafer W and receives infrared light reflected by the wafer W, and then converts the received infrared light into an electrical signal to obtain the warp detection signal. The smaller the horizontal distance from the infrared sensor to the wafer W, the stronger the reflected infrared light, and thus the larger the warp detection signal. In an optional embodiment, the warp detector 132 may also use other detectors having a similar relationship between distance and signal strength, such as an ultrasonic detector.

[0045] like Fig. 9 Shows Figure 5 FIG. 2 is a cross-sectional view of the wafer box 200 at AA, wherein a warped wafer W is shown. Fig.10 The detection process of the warped wafer W is shown, wherein Fig. 9The portion of the wafer box 200 and the wafer W intercepted at the dotted frame B, during the process of the warpage detector 132 moving vertically with the detection frame, for example, from top to bottom as shown by the arrow, the horizontal distance between the warpage detector 132 and the wafer W changes, thereby causing a change in the strength of the warpage detection signal, for example, the warpage detection signal increases as the horizontal distance from the warpage detector to the wafer decreases. The analyzer is configured to determine the warpage information of the wafer W based on the warpage detection signal and the vertical displacement of the warpage detector 132. Specifically, the analyzer can generate a waveform image in which the warpage detection signal changes with the vertical displacement of the warpage detector 132, and determine the warpage information of the wafer W based on the shape of the waveform image. The warpage information of the wafer W may include the degree of warpage and / or the direction of warpage, etc.

[0046] Figure 11-13 Schematic diagrams of three waveform images generated by an analyzer according to an embodiment of the present application are shown, wherein the horizontal axis is the vertical displacement of the warp detector 132, for example, the vertical displacement when moving from top to bottom, and the origin may correspond to the top position of the wafer box 200; the vertical axis represents the magnitude of the warp detection signal. Each figure shows three convex waveforms 50 at intervals, indicating that three vertically spaced wafers W are continuously measured.

[0047] Fig.11 In the waveform image, there is a convex rectangular wave, that is, when the warp detector 132 passes through the wafer W, the horizontal distance between the wafer W and the warp detector 132 remains consistent, and the warp detection signal is consistent in size. Therefore, it can be determined that the wafer W is a non-warped wafer W with a warp degree of 0. The thickness of the wafer W can be determined based on the width of the rectangular wave, that is, the width of the platform area 51 of the rectangular wave.

[0048] Fig.12 and Fig.13 In the waveform image, the waveform 50 protruding from the waveform image has a platform area 51 and a curve area 52 continuous with the platform area 51, that is, when the warp detector 132 passes through the wafer W, the horizontal distance between the wafer W and the warp detector 132 changes, and the warp detection signal changes, thereby determining that the corresponding wafer W is a warped wafer. Among them, the platform area 51 represents the situation where the warp detector 132 passes through the outer peripheral end surface of the wafer W, the width of the platform area 51 can represent the thickness of the wafer W, and the curve area 52 represents the curved surface portion of the warped wafer W detected by the warp detector 132. In the horizontal axis direction, the total width of the platform area 51 and the curve area 52 continuous therewith can represent the warpage of the wafer W, that is, the maximum distance that the wafer W extends in the axial direction (thickness direction) of the wafer W, for example, the maximum distance that the edge of the wafer W deviates from the center of the wafer W in the axial direction of the wafer W.

[0049] More specifically, Fig.12 A waveform 50 with Fig.10When the warpage detector 132 moves from the first position P1 to the second position P2, the detection results between the two dotted lines are roughly consistent. In the vertical displacement direction of the warpage detector 132, the curve area 52 is located downstream of the platform area 51 and the curve area 52 gradually decreases. It can be determined that the warpage direction of the corresponding wafer W is opposite to the vertical displacement direction of the warpage detector 132. For example, the warpage detector 132 moves downward, and the wafer W warps upward, that is, the middle part of the wafer W is concave, as shown in FIG. Fig. 9 The warped state shown is called a bowl shape or a smiley face shape. Fig.13 In the vertical displacement direction of the warpage detector 132, the curve area 52 is located upstream of the platform area 51 and the curve area 52 gradually rises, thereby determining that the warpage direction of the corresponding wafer W is the same as the vertical displacement direction of the warpage detector 132. For example, the warpage detector 132 moves downward, and the wafer W warps downward, that is, the middle part of the wafer W convexes upward, which is similar to the above. Fig. 9 The warping state shown is reversed, such as an inverted bowl shape or a crying face shape. In other embodiments, for wafers with other warping shapes (such as a saddle shape, an irregular bowl shape, or an inverted bowl shape), the specific shape of the waveform image can also be used to determine.

[0050] Furthermore, since wafer W has a certain elasticity and the surface of the warped wafer may have a certain stress, vibration will be generated during the engagement of the wafer box 200 with the main body 110 or the opening of the movable door of the wafer box 200, and the wafer may be affected by gravity, causing the warping state of wafer W to change. When the warping state of wafer W is a crying face, the warping information (warping degree) of wafer W output by the analyzer is calculated and output as 100%-n% of the actual detected warping degree, where n can be calibrated to 0 to 2 based on information such as the material and thickness of wafer W; in other words, when the warping direction is downward warping, the absolute value of the warping degree output by the analyzer based on the total width of the same curve area 52 and the platform area 51 is lower than that of upward warping. When the analyzer determines that the warping direction is a downward crying face, the calculated warping degree is amplified to increase the safety redundancy of the wafer picking position of the front-end robot 101.

[0051] In a preferred embodiment, the smoothness of the warping can be judged by the curvature of the curve area 52, for example, Fig.12 and Fig.13 If the curvature of the curve area 52 is relatively consistent and basically the same, or in other embodiments the curvature changes continuously without a sudden change in curvature, it can be determined that the warping of the wafer is relatively smooth, for example, a smooth, regular bowl shape or an inverted bowl shape; if there is a sudden change in the curvature of the curve area 52, it can be determined that the warping is relatively uneven, and there may be a wavy warping or a bending area.

[0052] Figure 6 and Figure 7Only one warpage detector 132 facing one diameter of the wafer is shown, so that the warpage detector 132 on the diameter can be detected. Figure 7 In a preferred embodiment, the detection mechanism may include two or more warpage detectors 132 arranged at intervals, for example, arranged at equal intervals along the horizontal rod 131a. The analyzer can determine the warpage of the wafer in the arrangement direction (in the vertical direction) of the two or more warpage detectors by analyzing and comparing the waveform images of the two or more warpage detectors 132. Figure 7 The left-right direction in the arrangement direction) and the direction perpendicular to the arrangement direction ( Figure 7 The warpage information of the wafer (up and down directions) can be obtained to obtain more accurate and comprehensive wafer warpage information, reduce detection errors, and provide more accurate and effective information for subsequent transmission and processing.

[0053] According to the implementation mode of the present application, the setting mode of the warp detector 132 and the analyzer is simple and realizes automatic detection, avoiding the error of human eye detection, and can quickly and accurately judge the warping information of the wafer W, and provide accurate wafer information for the subsequent wafer transmission process and wafer processing process, so as to facilitate timely adaptive adjustment of the corresponding working parameters of the wafer transmission unit 40 and the wafer processing unit (such as the wafer picking position of the front-end robot 101), which can effectively prevent collision and fragmentation, and can facilitate the timely unloading of wafers that do not meet the processing requirements due to excessive warping, avoid wafer breakage or damage to the wafer processing equipment during the processing, improve the processing efficiency of the wafer processing equipment, and improve the yield rate and service life of the wafer processing equipment.

[0054] When the warpage of wafer W output by the warpage detector 132 is the original value without processing, the wafer picking position setting of the front-end robot 101 should take into account the vibration generated during the engagement of the wafer box 200 and the main body 110 or the opening of the movable door of the wafer box 200, as well as the change in the warping state of wafer W caused by the effect of gravity on the wafer. In particular, when the warping state of wafer W is a crying face, the wafer picking position of the front-end robot 101 should be lower than the actual position of wafer W after engagement rather than just lower than the position information obtained during detection.

[0055] For example, when the warping state of wafer W is detected to be a crying face, the wafer picking position of the front-end robot 101 should consider the warping as X*(1+n)%, where X is the actual warping detected, and according to information such as the material and thickness of wafer W, n can be calibrated to 0 to 2.

[0056] In a preferred embodiment, the analyzer can also determine the placement state of the wafer W based on the waveform image, and the placement state includes a single-chip state, a stacked state, and a cross-slot state. The analyzer can be provided with a wafer thickness threshold, for example, the actual wafer thickness may be 775 microns, 750 microns, or 725 microns, etc., and the wafer thickness threshold may be slightly greater than these thicknesses, for example, 780 microns, 755 microns, 730 microns, etc., or for a bonded wafer, its thickness is twice these values, and the analyzer can be provided with a preset interval that matches the vertical size of the horizontal slot 210 (i.e., the opening size of the horizontal slot 210 in the vertical direction), and the way to determine the placement state is as follows: The analyzer determines that the placement state is a single wafer state based on the fact that the width of the protruding waveform 50 in the waveform image is less than the preset interval, and the width of the platform area 51 of the protruding waveform 50 in the waveform image is less than or equal to the wafer thickness threshold, that is, the wafer W is in one horizontal slot 210 and only the thickness of one wafer W is identified; The analyzer determines that the placement state is a stacked state, i.e., two or more wafers are placed in one horizontal slot, based on the fact that the width of the protruding waveform 50 in the waveform image is less than the preset interval, and the width of the platform area 51 of the protruding waveform 50 in the waveform image is greater than the wafer thickness threshold, i.e., the wafer is in one horizontal slot 210 and the thickness of more than one wafer is identified; The analyzer determines that the placement state is a slot-spanning state based on the fact that the width of the protruding waveform 50 in the waveform image exceeds a preset interval, ie, the wafer W spans over at least two horizontal slots 210 .

[0057] According to the implementation mode of the present application, by integrating the detection of the placement status in the analyzer, the detection function of the detection mechanism 130 is further increased, the effectiveness of its detection of abnormal wafer status is improved, and the abnormal wafer W is further prevented from entering the subsequent processing flow, thereby improving the effectiveness and yield of wafer processing.

[0058] In addition, the analyzer can also detect the presence of a wafer based on the waveform image. For example, if the waveform image does not show a protruding waveform 50 within a preset interval, it can be determined that no wafer is placed in the corresponding horizontal slot 210 .

[0059] In a preferred embodiment, Figure 6 , Figure 7As shown, the detection mechanism 130 may further include a state detector 133 disposed on the horizontal rod 131a, which is configured to detect the placement state of the wafer in the horizontal slot 210. By adding the state detector 133, both the warpage detector 132 and the state detector 133 can perform placement state detection, thereby forming a double detection and reducing the error rate of the detection result. The state detector 133 may have a separate analyzer for data analysis, or may share an analyzer with the warpage detector 132.

[0060] exist Figure 6 and Figure 7 In the illustrated embodiment, the state detector 133 is a through-beam sensor, which may include a transmitter and a receiver arranged horizontally and spaced apart, and the receiver receives the through-beam light emitted by the transmitter. The warpage detector 132 may be arranged between the transmitter and the receiver. When performing wafer inspection, the inspection frame of the inspection mechanism 130 may move a distance toward the wafer box 200 through the window 111, so that the state detector 133 at least partially extends into the wafer box 200 (e.g., Figure 7 ), so that when the detection mechanism 130 moves in the vertical direction, the wafer W in the wafer box 200 passes between the transmitter and the receiver to block the incident light, and the incident sensor determines the placement state of the wafer W based on the time when the receiver does not receive the incident light or the distance moved when the receiver does not receive the incident light. The judgment method of the incident sensor is, for example: The through-beam sensor can determine that the placement state is a cross-slot state based on the fact that the distance moved by not receiving the through-beam light exceeds the preset interval; The through-beam sensor can determine that the placement state is a single-wafer state based on the distance moved by not receiving the through-beam light being less than or equal to the wafer thickness threshold; The through-beam sensor can determine that the placement state is a stacking state based on the fact that the distance moved by not receiving the through-beam light is greater than the wafer thickness threshold and less than the preset interval. It should be understood that for a through-beam sensor that is not equipped with a wafer warpage detection function, when the degree of wafer warpage is small and close to the wafer thickness when stacking, the through-beam sensor may find it difficult to determine whether "the distance moved by not receiving the through-beam light is greater than the wafer thickness threshold and less than the preset interval" is caused by stacking or wafer warpage, and it may be uniformly determined as a stacking state. In this case, the through-beam sensor can be used as a preliminary judgment of the wafer placement state, and in the further judgment process, it can cooperate with the warpage detector 132 to make an accurate judgment.

[0061] Since time is proportional to the moving distance, the judgment method based on the time when the receiver does not receive the incident light is similar to the above and will not be repeated here.

[0062] In addition, in an alternative embodiment, the state detector 133 can take the form of other sensors, such as a visual sensor, which can accurately judge the wafer placement state through visual image detection. In this case, it can accurately distinguish between the stacking state and the wafer warping, and can accurately distinguish between the single-wafer state without warping and the single-wafer state with warping.

[0063] In terms of the execution steps, the detection of the placement state of the wafer by the state detector 133 can be performed before the warpage detection by the warpage detector 132, so that the warpage detection can be performed after at least one abnormal state in the cross-slot or stacking is eliminated, so as to improve the detection efficiency, and timely feedback abnormal information or abnormal alarm in the case of abnormal placement state, reminding the operator to take timely and appropriate response measures to prevent damage to processing equipment or personnel. In addition, in an optional embodiment, the detection of the placement state of the wafer by the state detector 133 can be performed synchronously with the warpage detection and / or placement state detection of the warpage detector 132, so as to perform dual detection synchronously, improve the detection accuracy, and reduce false alarms.

[0064] By setting the state detector 133 and the warping detector 132, the two can complement each other, perform double detection and judgment on the placement state of the wafer, reduce detection errors, and improve detection accuracy.

[0065] In a preferred embodiment, the load port device 100 further includes a display 140 (see FIG. Fig.17 ), the display 140 is configured to receive and display the warpage information and wafer placement status information of the wafer, so as to provide corresponding information to the operator, or to warn the abnormality of the wafer W in the wafer box 200 with a prominent graphic mark, such as wafer overlap, slot crossing or excessive warpage, etc. Optionally, the display 140 can be equipped with a sound output device to prompt the abnormality of the wafer in the wafer box 200 in the form of an alarm sound.

[0066] In a further embodiment, the detection mechanism 130 may further include a visual detector 134, which is disposed toward the side wall of the wafer box 200 so that its detection field of view may include at least the side wall of the wafer box 200 and at least one horizontal slot 210 at the side wall. Figure 6 As shown, the visual detector 134 can be set at a corner of the detection frame, that is, one end of the horizontal rod 131a or the top of the vertical rod 131b, or set at any suitable position on the vertical rod 131b. The visual detector 134 can be configured to detect the edge of the wafer W at the horizontal slot 210 of the wafer box 200 and identify the horizontal distance between the edge of the wafer W and the side wall of the wafer box 200 to determine the warpage information of the wafer. Fig.14 Shows from Figure 51 is a simplified schematic diagram of the wafer box 200 viewed in the direction of arrow C, wherein the dashed box D indicates the detection field of view of the visual detector 134. It should be understood that in optional embodiments, the detection field of view may be larger or smaller.

[0067] Fig.15 An enlarged view of the dotted box D is shown. The visual detector 134 can construct a first virtual scale R1 in its detection field of view, starting from the inner surface of the side wall of the wafer box and extending horizontally inward, and read the scale corresponding to the edge of the wafer to determine the horizontal spacing. Since the warped wafer is farther from the side wall of the wafer box 200 than the non-warped wafer, the visual detector 134 can be configured to determine that the corresponding wafer is a warped wafer when the horizontal spacing is greater than a preset first spacing threshold, and then the information of the wafer warping can be transmitted to the controller 150 to guide the front-end robot 101 to adjust the position of the wafer (for example, the height of the front-end robot 101 when taking the wafer). Among them, the first spacing threshold can be roughly the horizontal distance between the wafer and the side wall of the wafer box 200 when the wafer is a non-warped wafer.

[0068] Furthermore, the visual detector 134 is also configured to identify the vertical spacing between the edge of the wafer and the horizontal slot 210. Specifically, the visual detector 134 constructs a second virtual scale R2 in its detection field of view, starting from the upper surface of the horizontal slot 210 and extending vertically upward, and reads the scale corresponding to the edge of the wafer W to determine the vertical spacing. When the wafer is warped upward, that is, when it is warped in a bowl shape or a smiley face shape, the edge of the wafer W will be away from the horizontal slot 210; when the wafer is warped downward, that is, when it is warped in an inverted bowl shape or a crying face shape, the edge of the wafer W will be close to the horizontal slot 210. Therefore, the visual detector is configured to: determine that the warping direction of the corresponding wafer is upward warping when the horizontal spacing is greater than the first spacing threshold and the vertical spacing is greater than the preset second spacing threshold; determine that the warping direction of the corresponding wafer is downward warping when the horizontal spacing is greater than the first spacing threshold and the vertical spacing is not greater than the second spacing threshold. Among them, the second spacing threshold can be roughly the vertical distance between the wafer and the horizontal slot 210 when the wafer is a non-warped wafer, and the second spacing threshold can be a smaller value adapted to the slight warping of the wafer allowed when the front-end robot 101 takes the wafer.

[0069] The larger the horizontal spacing between the wafer and the side wall of the wafer box 200, the greater the degree of wafer warpage; the larger the vertical spacing between the wafer and the horizontal slot 210, the greater the degree of wafer warpage. Therefore, the degree of wafer warpage can be judged based on the horizontal spacing and / or the vertical spacing. When it is determined that the degree of warpage is large and exceeds the wafer taking position tolerance of the front-end robot 101, the wafer taking position of the front-end robot 101 can be adjusted to enable the front-end robot 101 to take the wafer accurately and stably, and to prevent the risk of wafer fragmentation caused by impacting the wafer.

[0070] By setting up the visual detector 134, warpage detection can be performed at the edge of the wafer, and the warpage information can be obtained conveniently and quickly by reading the scale. The visual detector 134 can cooperate with the aforementioned warpage detector 132 to perform double detection and verification of warpage information to reduce misjudgment. In addition, for wafers with metal in the device area that is easily photocorroded, the visual detector 134 detects the edge of the wafer, and does not need to irradiate the device area in the middle of the wafer with strong light, so the device area will not be optically damaged, thereby reducing the damage rate of the wafer.

[0071] In an optional embodiment, in addition to setting a virtual scale, the visual detector 134 can be configured to identify whether there is a wafer at a first spacing threshold horizontally away from the inner surface of the side wall of the wafer box 200. If there is no wafer, it is determined that the horizontal distance between the wafer and the inner surface of the side wall of the wafer box exceeds the first spacing threshold, and then the corresponding wafer is determined to be a warped wafer; if a wafer is identified, it can be determined that the horizontal distance between the wafer and the inner surface of the side wall of the wafer box does not exceed the first spacing threshold, and then the corresponding wafer can be determined to be a non-warped wafer. This identification method is simple and convenient, and can improve wafer detection efficiency.

[0072] In a preferred embodiment, two visual detectors 134 may be provided to perform wafer inspection at two opposite side walls of the wafer box 200, thereby improving inspection accuracy and reducing misjudgment caused by horizontal wafer displacement. Alternatively, more than two visual detectors 134 may be provided.

[0073] Fig.16 A flow chart of a wafer inspection method according to an embodiment of the present application is shown. The method comprises: S1: opening the movable door of the wafer box 200 to expose the wafers W in the wafer box 200 toward the detection mechanism 130; S2: Control the detection mechanism 130 to move in the vertical direction to detect the wafers W in the wafer box 200 in sequence; S3: Output the detected wafer information.

[0074] Specifically, step S2 may include: detecting warpage information of the wafer W via the warpage detector 132 . Alternatively, step S2 may also include: detecting a placement state of the wafer W via the warpage detector 132 and / or detecting a placement state of the wafer W via the state detector 133 .

[0075] In one embodiment, the method may further include: adjusting the wafer taking position of the front-end robot 101 for taking the wafer from the wafer box 200 based on the wafer warpage information, for example, lowering the wafer taking height of the front-end robot 101 based on the wafer being an upwardly warped wafer (with a concave middle), or raising the wafer taking height of the front-end robot 101 based on the wafer being a downwardly warped wafer (with a convex middle), and the specific adjustment value of the wafer taking height can be further determined based on the wafer warpage. In this way, the front-end robot 101 can be prevented from hitting the warped wafer, reducing the risk of wafer fragments.

[0076] In addition, in a preferred embodiment, step S3 may include sending a signal to the controller 150 (see Fig.17 ) outputs the detected wafer W information, and controls the display 140 through the controller 150 to output an alarm prompt signal in the form of a graphic logo or an alarm sound.

[0077] Fig.17 Shows the execution Fig.16 A flowchart of information processing in a wafer detection method. First, information is collected during the movement of the detection mechanism 130 in the vertical direction, and then the placement state of the wafer W is judged. When it is judged to be in a stacked state or a cross-slot state, the signal can be transmitted to the controller 150, and further transmitted to the display 140; when it is judged to be in a single-wafer state, the warping information can be further detected, and the warping information can be transmitted to the controller 150, and further transmitted to the display 140. Among them, the detection of the warping information can be performed by the warping detector 132, and the detection of the placement state can be performed by both or one of the warping detector 132 and the state detector 133. And, Fig.17 The information processing sequence shown in the figure is merely exemplary. Depending on the actual situation, some information processing sequences may be executed synchronously or in a reversed order.

[0078] The present application also provides a computer storage medium, on which a computer program is stored, and when the program is executed by a processor, the aforementioned wafer detection method is implemented. Specifically, a system or device equipped with a storage medium can be provided, on which a software program code for implementing the functions of any of the above embodiments is stored, and the computer (or CPU or MPU) of the system or device reads out and executes the program code stored in the storage medium. In this case, the program code read from the storage medium itself can implement the functions of any of the above embodiments, so the program code and the storage medium storing the program code constitute a part of the present application. Storage medium embodiments for providing program codes include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD+RW), magnetic tapes, non-volatile memory cards, and ROMs. Optionally, the program code can be downloaded from a server computer by a communication network.

[0079] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A loading port device for wafer processing equipment, characterized in that: The loadport device comprises: main body; A loading platform horizontally protruding from the main body, the loading platform is used to place a wafer box, the wafer box is configured to stack wafers at intervals in a vertical direction; and a detection mechanism movably mounted to the main body and movable in a vertical direction to sequentially detect wafers in the wafer box, the detection mechanism comprising a warpage detector and an analyzer communicatively connected to the warpage detector; The warp detector is configured to send a warp detection signal to the analyzer, wherein the warp detection signal increases as the horizontal distance from the warp detector to the wafer decreases; the analyzer is configured to determine the warp information of the wafer based on the warp detection signal and the vertical displacement of the warp detector.

2. The load port device according to claim 1, characterized in that The analyzer is capable of generating a waveform image of the warpage detection signal as it changes with a vertical displacement of the warpage detector, and determining the warpage information of the wafer based on a shape of the waveform image.

3. The load port device according to claim 2, characterized in that The warping information includes a warping degree and / or a warping direction.

4. The load port device according to claim 2, characterized in that The analyzer determines that the corresponding wafer is a non-warped wafer based on the convex rectangular wave in the waveform image.

5. The load port device according to claim 2, characterized in that The analyzer determines that the corresponding wafer is a warped wafer based on the fact that a convex waveform in the waveform image has a plateau region and a curved region continuous with the plateau region.

6. The load port device according to claim 5, characterized in that The analyzer determines that the warpage direction of the corresponding wafer is opposite to the vertical displacement direction of the warpage detector based on the fact that the curve area is located downstream of the platform area in the vertical displacement direction of the warpage detector and the curve area gradually descends.

7. The load port device according to claim 5, characterized in that The analyzer determines that the warpage direction of the corresponding wafer is the same as the vertical displacement direction of the warpage detector based on the fact that the curved area is located upstream of the platform area in the vertical displacement direction of the warpage detector and the curved area gradually rises.

8. The load port device according to claim 5, characterized in that The analyzer determines the warpage of the corresponding wafer based on the total width of the platform area and the curved area connected thereto in the vertical displacement direction of the warpage detector. When the warpage direction is downward warpage, the absolute value of the warpage output by the analyzer based on the same total width value is lower than that of upward warpage.

9. The load port device according to claim 5, characterized in that The analyzer is also configured to determine the warpage smoothness of the wafer based on the curvature of the curve area, determine the warpage smoothness as smooth when the curvature of the curve area is the same or changes continuously, and determine the warpage smoothness as uneven when there is a sudden change in the curvature of the curve area.

10. The load port device according to claim 2, characterized in that The analyzer is also configured to determine a thickness of the wafer based on a width of a plateau region of a convex waveform in the waveform image.

11. The load port device according to any one of claims 2 to 10, characterized in that: The analyzer is further configured to determine a placement state of the wafer based on a shape of the waveform image, the placement state including a single-wafer state, a stacked-wafer state, and a cross-slot state.

12. The loadport device according to claim 11, characterized in that The wafer box has a plurality of horizontal slots arranged in a vertical direction for placing wafers, and the analyzer is provided with preset intervals matching the vertical dimensions of the horizontal slots; The analyzer determines that the placement state is a single-chip state based on the width of the protruding waveform in the waveform image being less than the preset interval, and the width of the platform area of ​​the protruding waveform in the waveform image being less than or equal to a wafer thickness threshold; and / or The analyzer determines that the placement state is a stacking state based on the fact that the width of the waveform protruding in the waveform image is less than the preset interval, and the width of the platform area of ​​the waveform protruding in the waveform image is greater than a wafer thickness threshold; and / or The analyzer determines that the placement state is a slot-crossing state based on that a width of a protruding waveform in the waveform image exceeds the preset interval.

13. The load port device according to any one of claims 2 to 10, characterized in that: The detection mechanism includes two or more warp detectors arranged at intervals, and the analyzer determines the warp information of the wafer in the arrangement direction of the two or more warp detectors and in the direction perpendicular to the arrangement direction by analyzing the waveform images of the two or more warp detectors.

14. The load port device according to any one of claims 1 to 10, characterized in that: The warpage detector is an infrared sensor.

15. The load port device according to any one of claims 1 to 10, characterized in that: The wafer box has a plurality of horizontal slots arranged along the vertical direction for placing wafers; the detection mechanism also includes a state detector, which is configured to detect the placement state of the wafers in the horizontal slots, and the placement state includes a single-wafer state, a stacked-wafer state and a cross-slot state.

16. The loadport device according to claim 15, characterized in that The state detector is a through-beam sensor, which includes a transmitter and a receiver arranged horizontally at intervals, and the receiver receives the through-beam light emitted by the transmitter. When performing wafer detection, the state detector at least partially extends into the wafer box so that when the detection mechanism moves in the vertical direction, the wafers in the wafer box pass between the transmitter and the receiver to block the through-beam light. The through-beam sensor determines the placement state based on the time when the receiver does not receive the through-beam light or the distance moved when the receiver does not receive the through-beam light.

17. The loadport device according to claim 15, characterized in that The load port device further includes a display communicatively connected to the detection mechanism, wherein the display is configured to receive and display the warpage information and placement status information of the wafer.

18. The load port device according to any one of claims 1 to 10, characterized in that: The wafer box has a plurality of horizontal slots arranged in a vertical direction for placing wafers, and the horizontal slots extend from the side wall of the wafer box to the inside of the wafer box; the detection mechanism also includes a visual detector, and the visual detector is arranged toward the side wall of the wafer box; The visual detector is configured to detect an edge of the wafer at the horizontal slot and identify a horizontal distance between the edge of the wafer and a sidewall of the wafer box to determine warpage information of the wafer.

19. The loadport device according to claim 18, characterized in that Identifying the horizontal distance between the edge of the wafer and the side wall of the wafer box includes: the visual detector constructs a first virtual scale in its detection field of view with the inner surface of the side wall of the wafer box as the starting point and extending horizontally inward, and reading the scale corresponding to the edge of the wafer to determine the horizontal distance; The visual detector is configured to determine that the corresponding wafer is a warped wafer when the horizontal spacing is greater than a first spacing threshold.

20. The loadport device according to claim 19, characterized in that The visual detector is also configured to identify the vertical spacing between the edge of the wafer and the horizontal slot, including: the visual detector constructs a second virtual scale in its detection field of view, starting from the upper surface of the horizontal slot and extending vertically upward, and reads the scale corresponding to the edge of the wafer to determine the vertical spacing; The visual detector is configured to: determine that the warping direction of the corresponding wafer is upward warping when the horizontal spacing is greater than a first spacing threshold and the vertical spacing is greater than a second spacing threshold; and determine that the warping direction of the corresponding wafer is downward warping when the horizontal spacing is greater than the first spacing threshold and the vertical spacing is not greater than the second spacing threshold.

21. The loadport device of claim 18, wherein: Identifying the horizontal distance between the edge of the wafer and the side wall of the wafer box includes: the visual detector identifies whether there is a wafer at a first spacing threshold horizontally away from the inner surface of the side wall of the wafer box; if no wafer exists, determining that the horizontal distance between the wafer and the inner surface of the side wall of the wafer box exceeds the first spacing threshold, and then determining that the corresponding wafer is a warped wafer.

22. The loadport device according to any one of claims 1 to 10, characterized in that: The main body is configured with a window, and the detection mechanism detects the wafers in the wafer box through the window; the loading port device also includes a door opener installed to the main body, and the door opener is configured to open a movable door of the wafer box toward the window and move the movable door to expose the wafers in the wafer box toward the loading port device.

23. A front-end loading device for wafer processing equipment, characterized in that: The front loading device comprises: The load port device according to any one of claims 1-22; A wafer box, which is movably placed on a loading platform of the load port device, and the wafer box is configured to stack wafers at intervals in a vertical direction; A front-end robot is configured to take a wafer from the wafer box or place a wafer into the wafer box.

24. A wafer processing equipment, characterized in that: The wafer processing equipment comprises: The front loading device according to claim 23; Wafer processing units; and A wafer transfer device is configured to transfer wafers from the front end loading device to the wafer processing unit for wafer processing.

25. A wafer inspection method, used in the load port device according to any one of claims 1 to 22, characterized in that: The method comprises: Opening a movable door of a wafer box so that the wafers in the wafer box are exposed toward the detection mechanism; Controlling the detection mechanism to move in a vertical direction to detect the wafers in the wafer box in sequence; Outputs the detected wafer information.

26. The wafer inspection method according to claim 25, characterized in that: Controlling the detection mechanism to move in a vertical direction to sequentially detect the wafers in the wafer box comprises: The warpage information of the wafer is detected by a warpage detector.

27. The wafer inspection method according to claim 26, characterized in that: Controlling the detection mechanism to move in a vertical direction to sequentially detect the wafers in the wafer box comprises: The placement state of the wafer is detected via a warpage detector and / or the placement state of the wafer is detected via a state detector.

28. The wafer inspection method according to claim 26, characterized in that: The method further comprises: The wafer taking position of a front-end robot for taking wafers from the wafer box is adjusted based on the warpage information of the wafer.

29. A computer storage medium, characterized in that The computer storage medium stores a computer program, which, when executed by a processor, implements the wafer detection method as described in any one of claims 25 to 28.

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