Suction nozzle heating eutectic machine

Abstract

The invention relates to the technical field of eutectic machines, in particular to a suction nozzle heating eutectic machine which comprises a feeding mechanism, a transferring mechanism, a supplying mechanism and an eutectic heating mechanism. Wherein the feeding mechanism is used for providing chips; the transfer mechanism comprises a transfer module and a heat adsorption module arranged on the transfer module, the transfer module is used for driving the heat adsorption module to be close to or away from the feeding mechanism, and the heat adsorption module is used for adsorbing chips on the feeding mechanism and preheating the chips; the feeding mechanism comprises a feeding module and a preheating module, the preheating module is arranged on the feeding module, the feeding module is used for providing a substrate, and the preheating module is used for preheating the substrate stored on the feeding module; and the eutectic heating mechanism is arranged between the feeding module and the transfer module, and the eutectic heating module is used for performing heating eutectic on the substrate and the chip. The method has the effect of improving the product quality.

Description

Technical Field

[0001] The present application relates to the technical field of eutectic machines, and in particular to a nozzle-heating eutectic machine. Background Art

[0002] At present, in the field of semiconductor packaging and optoelectronics, eutectic technology is a key connection process, which melts and combines the chip with the PCB board or other substrate materials at a specific temperature to form a stable eutectic point to achieve electrical and mechanical connection. During the eutectic process of the blue film chip and the PCB board, the performance of the eutectic machine directly affects the quality of the eutectic area and the reliability of the product. In related technologies, the eutectic machine usually uses electric heating plates or infrared radiation to directly heat the PCB board to achieve eutectic welding of the blue film chip and the PCB board.

[0003] Regarding the above-mentioned related technologies: using electric heating plates or infrared radiation to directly heat the PCB board can easily cause uneven heating in the eutectic area, which can easily lead to reduced product quality. Summary of the invention

[0004] In order to improve product quality, the present application provides a nozzle heating eutectic machine.

[0005] The present application provides a nozzle heating eutectic machine, which adopts the following technical solution: A nozzle heating eutectic machine, comprising: A feeding mechanism for providing chips; The transfer mechanism comprises a transfer module and a heat adsorption module arranged on the transfer module, wherein the transfer module is used to drive the heat adsorption module to approach or move away from the feeding mechanism, and the heat adsorption module is used to adsorb the chip on the feeding mechanism and preheat the chip; A feeding mechanism, comprising a feeding module and a preheating module, wherein the preheating module is arranged on the feeding module, the feeding module is used to provide a substrate, and the preheating module is used to preheat the substrate stored on the feeding module; The eutectic heating mechanism is arranged between the feeding module and the transfer module, and is used to heat the substrate and the chip to form a eutectic.

[0006] By adopting the above technical solution, the chips provided by the feeding mechanism are adsorbed and preheated by the heat adsorption module of the transfer mechanism, ensuring that the chips will not be damaged by sudden temperature changes during the transfer process. The preheating module preheats the substrate so that the substrate is already at a suitable temperature before entering the eutectic heating mechanism, avoiding the impact of sudden temperature changes on the substrate, thereby improving the stability of the eutectic process and product quality. The eutectic heating mechanism ensures uniform temperature distribution at the eutectic position by precisely heating the substrate and the chip, further improving the eutectic effect. In summary, this technical solution not only improves production efficiency, but also significantly improves product quality and reliability.

[0007] Optionally, the heat adsorption module includes a vacuum suction nozzle and a heating plate arranged in the vacuum suction nozzle, the vacuum suction nozzle is arranged on the transfer module, and the heating plate is used to heat the vacuum suction nozzle.

[0008] By adopting the above technical solution, the heating plate installed inside the vacuum nozzle can preheat the chip while adsorbing it. This can not only increase the initial temperature of the chip and reduce the subsequent heating time, but also ensure that the chip maintains a stable temperature throughout the transfer process, avoiding performance changes caused by temperature fluctuations. In addition, the preheating process reduces the temperature difference between the chip and the substrate, which helps to improve the temperature uniformity and stability during the eutectic process and further improve product quality.

[0009] Optionally, the eutectic heating mechanism includes a carrier frame, a heating module, a translation module and a clamping module. The carrier frame is arranged between the feeding module and the transfer module. The heating module and the translation module are respectively arranged on the carrier frame. The clamping module is slidably arranged on the carrier frame and is slidably connected to the heating module. The clamping module is connected to the translation module. When the substrate is clamped by the clamping module, the substrate can be bonded to the heating module.

[0010] By adopting the above technical solution, the setting of the carrier ensures the structural stability of the entire device, so that the heating module and the translation module can work together accurately. The translation module can drive the clamping module to move, and the clamping module can clamp the substrate, so as to facilitate the substrate to move closer to or away from the transfer module, and then on the one hand, it is convenient for the heat adsorption module to transfer the chip to the substrate, and on the other hand, it enables the substrate to always be in the best heating position during the eutectic process, which enhances the flexibility of the device to a certain extent. And when the substrate is clamped by the clamping module, the substrate and the heating module fit tightly, ensuring the effective transfer of heat, avoiding the problem of local overheating or uneven hot and cold, and thus improving the quality and yield rate of the eutectic.

[0011] Optionally, the clamping module comprises a moving seat, an upper clamping seat, a lower clamping seat and a clamping drive assembly, the moving seat is slidably arranged on the bearing frame and connected to the translation module, a clearance groove is provided on the moving seat, and the heating module is arranged through the clearance groove; The clamping drive assembly and the upper clamping seat are respectively arranged on the moving seat, the lower clamping seat is slidably arranged on the moving seat and arranged opposite to the upper clamping seat, the clamping drive assembly is connected to the lower clamping seat, and the clamping drive assembly is used to drive the lower clamping seat to approach or move away from the upper clamping seat.

[0012] By adopting the above technical solution, when it is necessary to transport the substrate between the upper clamping seat and the lower clamping seat, the clamping drive assembly drives the lower clamping seat to move away from the upper clamping seat, so that the substrate can enter between the upper clamping seat and the lower clamping seat. At this time, the clamping drive assembly drives the lower clamping seat to approach the upper clamping seat, so as to facilitate clamping the substrate and flexibly adjust the clamping force, thereby ensuring stable clamping of the substrate under different thicknesses and sizes, effectively preventing the deformation or displacement of the substrate due to high temperature, and improving the quality and consistency of the eutectic to a certain extent.

[0013] Optionally, the clamping drive assembly includes a clamping drive member and a first elastic member, the clamping drive member is arranged on the movable seat, one end of the first elastic member is connected to the clamping drive member, and the other end of the first elastic member is connected to the lower clamping seat.

[0014] By adopting the above technical solution, when it is necessary to clamp the substrate, the first elastic member can drive the lower clamping seat to cooperate with the upper clamping seat to stably clamp the substrate, and ensure that the lower clamping seat always maintains a certain pressure during the clamping process, so that the substrate can always be in a stable state during the entire eutectic heating process, improving the quality and reliability of the eutectic. And when it is necessary to loosen the substrate, the clamping drive member pulls the lower clamping seat downward through the first elastic member, so that the lower clamping seat no longer presses the substrate against the upper clamping seat, thereby achieving force unloading on the substrate.

[0015] Optionally, the eutectic heating mechanism includes a lifting module, the lifting module includes a lifting drive and a cam, the lifting drive is arranged on the carrier, the cam is rotatably connected to the carrier and connected to the lifting drive, the cam is in conflict with the heating module, and the heating module is slidably arranged on the carrier.

[0016] By adopting the above technical solution, the lifting drive can drive the cam to rotate, and the cam contacts the heating module, so that the heating module can slide on the carrier. The advantage of this design is that the height of the heating module can be accurately adjusted by controlling the movement of the lifting drive to make the substrate contact or separate from the heating module, which is conducive to accurately adjusting the distance between the substrate and the heating module, and further conducive to improving the uniformity and consistency of eutectic heating.

[0017] Optionally, the heating module includes a heating platform and a heating tube, the heating platform is slidably arranged on the supporting frame, a boss is arranged on the heating platform, the boss is used to fit with the substrate, the heating tube is embedded in the heating platform, and the heating tube is used to heat the heating platform.

[0018] By adopting the above technical solution, the heating tube is embedded in the heating platform, and the heating platform is evenly heated to ensure that the surface temperature of the heating platform and the boss is evenly distributed, so that when the substrate and the boss are attached, uniform heat transfer can be obtained, avoiding local overheating or uneven hot and cold, and improving the quality and reliability of the eutectic. At the same time, the boss design on the heating platform enables multiple chips to be eutectic with the substrate in turn, effectively avoiding the non-eutectic part of the substrate from being heated for a long time, which is conducive to reducing the possibility of damage to the substrate.

[0019] Optionally, it includes a material shifting mechanism, which includes a Y-axis module and a material shifting module arranged on the Y-axis module, the Y-axis module is arranged on the side of the supporting frame, the material shifting module includes a mounting seat, a shifting rod, a second elastic member and a monitoring member, one end of the mounting seat is connected to the Y-axis module, and the other end of the mounting seat is provided with a slot, one end of the shifting rod is inserted into the slot and is rotatably connected to the mounting seat, the second elastic member is arranged between the shifting rod and the inner wall of the slot, the monitoring member is arranged in the slot and is electrically connected to the Y-axis module, and the monitoring member is used to monitor the state of the second elastic member.

[0020] By adopting the above technical solution, the setting of the Y-axis module enables the lever to move accurately on the predetermined path, realizing the precise pushing of the substrate, and the rotational connection design between the lever and the mounting seat enables the lever to rotate and apply pressure to the second elastic member when the resistance to the lever reaches a certain value, so that the second elastic member is compressed. At this time, the monitoring component will immediately trigger a signal, causing the Y-axis module to stop driving the lever to move, thereby effectively preventing damage to the substrate. This design not only improves the reliability and stability of the equipment, but also significantly reduces the defective rate during the production process.

[0021] Optionally, the feeding module includes a pushing assembly, a material box and a lifting platform, the pushing assembly is arranged on a side of the eutectic heating mechanism away from the transfer module, the material box is arranged between the pushing assembly and the eutectic heating mechanism, the lifting platform is arranged in the material box, the substrate is placed on the lifting platform, the preheating module is arranged in the material box, and the preheating module is used to heat the inside of the material box.

[0022] By adopting the above technical solution, the setting of the lifting platform can ensure that the substrate is at a suitable height, so that the pushing assembly can push the substrate out of the material box and allow the substrate to enter the eutectic heating mechanism, and the preheating module can preheat the substrate before it enters the eutectic heating mechanism, so that the temperature of the substrate gradually increases, avoiding the stress and damage caused by the sudden temperature change. At the same time, the heating temperature of the preheating module is lower than the heating temperature of the eutectic heating mechanism, which effectively reduces the thermal stress of the substrate in a high temperature environment and improves the service life and reliability of the substrate. In addition, the preheating step can also ensure that the substrate is in a relatively stable temperature state when entering the eutectic heating mechanism, further improving the stability and consistency of the eutectic process and reducing the defective rate.

[0023] Optionally, at least two material boxes are provided, the number of the lifting platforms and the pre-heating modules is equal to the number of the material boxes and are arranged one-to-one, the feeding mechanism includes an X-axis module, the X-axis module is arranged between the pushing assembly and the eutectic heating mechanism, and the plurality of material boxes are respectively arranged on the X-axis modules.

[0024] By adopting the above technical solution, the dual setting of the material box can effectively improve the working efficiency of the eutectic machine. Specifically, one material box is used for feeding and the other material box is used for discharging, so that the material preparation and recycling can be carried out while the eutectic processing is in progress, avoiding the waiting time caused by a single material box and improving the overall operation speed of the production line. In addition, each material box is equipped with an independent lifting platform and preheating module to ensure that the substrate has been properly preheated before entering the eutectic heating platform, making the temperature curve of the substrate smoother, reducing the impact of temperature mutations on the substrate, and further improving the eutectic quality and yield. The setting of the X-axis module enables the material box to move flexibly between the pushing assembly and the eutectic heating mechanism, ensuring the smooth operation of the entire process.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. Through the cooperation between the heat adsorption module and the preheating module, the chip and the substrate can be properly preheated before entering the eutectic heating mechanism, so that the temperature curve of the chip and the substrate is smoother, effectively reducing the adverse effects of temperature mutations on the substrate, which is beneficial to improving the stability of the eutectic process and product quality; 2. Through the cooperation of the carrier, heating module, translation module and clamping module, the clamping module can drive the substrate to approach or move away from the transfer module, so as to facilitate the heat adsorption module to transfer the chip to the substrate, and on the other hand, the substrate can always be in the best heating position during the eutectic process; 3. Through the cooperation of the mounting seat, the lever, the second elastic member and the monitoring member, the lever can push the substrate to move along a predetermined path, and when the lever encounters resistance beyond the set range, the monitoring member will immediately trigger a signal to stop the material shifting action, thereby effectively preventing damage to the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of a nozzle heating eutectic machine in an embodiment of the present application.

[0027] Figure 2 It is a front view of a nozzle heating eutectic machine in an embodiment of the present application.

[0028] Figure 3 is along Figure 2 Partial structural cross-sectional view of the thermal adsorption module of the AA line.

[0029] Figure 4 is along Figure 2 Partial structural cross-sectional view of the material box, lifting platform and preheating module of the BB line.

[0030] Figure 5 It is a structural schematic diagram of the eutectic heating mechanism in an embodiment of the present application.

[0031] Figure 6 It is a structural schematic diagram of the eutectic heating mechanism from another perspective in an embodiment of the present application.

[0032] Figure 7 is along Figure 2 Partial structural cross-sectional view of the material transfer module of the middle BB line.

[0033] Description of reference numerals: 1. Loading mechanism; 11. Cache platform; 12. Rotating arm module; 13. Crystal ring module; 14. Ejector module; 15. Swing arm module; 16. Calibration module; 2. Transfer mechanism; 21. Transfer module; 22. Heat adsorption module; 221. Vacuum nozzle; 222. Heating plate; 3. Feeding mechanism; 31. Feeding module; 311. Pushing assembly; 3111. Pushing drive; 3112. Push rod; 312. Material box; 3121. Limiting piece; 3122. Discharge port; 3123. Pushing port; 313. Lifting platform; 32. Preheating module; 33. X-axis module; 4. Eutectic heating mechanism; 41. Carrier; 42. Heating module; 421. Heating table; 422. Heating tube; 423. Boss; 43. Translation module; 44. Clamping module; 441. Moving seat; 4411. Giving way slot; 442. Upper clamping seat; 443. Lower clamping seat; 444. Clamping drive assembly; 4441. Clamping drive member; 4442. First elastic member; 445. Accommodating slot; 45. Lifting module; 451. Lifting drive member; 452. Cam; 5. Rack; 51. Visual element; 6. Wafer blue film; 7. Material dispensing mechanism; 71. Y-axis module; 72. Material dispensing module; 721. Mounting seat; 7211. Slot; 722. Push rod; 723. Second elastic member; 724. Monitoring member. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-Figure 7 This application is described in further detail.

[0035] The embodiment of the present application discloses a nozzle heating eutectic machine.

[0036] It should be noted that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] Reference Figure 1A nozzle heating eutectic machine includes a loading mechanism 1, a transfer mechanism 2, a feeding mechanism 3, a eutectic heating mechanism 4 and a frame 5. The loading mechanism 1, the transfer mechanism 2, the feeding mechanism 3 and the eutectic heating mechanism 4 are respectively installed on the frame 5, and the transfer mechanism 2 is located between the loading mechanism 1 and the eutectic heating mechanism 4, and the feeding mechanism 3 is located on the side of the eutectic heating mechanism 4 away from the transfer mechanism 2, so that the transfer mechanism 2 can transfer the chip provided by the loading mechanism 1 to the eutectic heating mechanism 4, and the feeding mechanism 3 can provide a substrate for the eutectic heating mechanism 4, so that the eutectic heating mechanism 4 can eutectically heat the substrate and the chip.

[0038] Reference Figure 1 The feeding mechanism 1 includes a buffer platform 11, a rotating arm module 12, a crystal ring module 13, an ejector module 14, a swing arm module 15 and a calibration module 16. The buffer platform 11, the rotating arm module 12, the crystal ring module 13, the ejector module 14, the swing arm module 15 and the calibration module 16 are respectively installed on the frame 5, and the buffer platform 11, the rotating arm module 12 and the crystal ring module 13 are arranged close to each other.

[0039] The cache platform 11 is used to store the wafer blue film 6. The cache platform 11 has multiple layers, which are arranged in the vertical direction and can move up and down as a whole, so that the rotating arm module 12 can transfer the corresponding wafer blue film 6 from the cache platform 11 to the crystal ring module 13, and then the crystal ring module 13 can position the wafer blue film 6. The ejector module 14 is located at the lower side of the crystal ring module 13, and the ejector module 14 is used to lift the chip to separate the chip from the wafer blue film 6.

[0040] The swing arm module 15 is disposed between the crystal ring module 13 and the calibration module 16 , and is used to transfer the chip lifted by the ejector pin module 14 to the calibration module 16 , so that the calibration module 16 can calibrate the angle of the chip.

[0041] Three visual elements 51 are sequentially mounted on the rack 5, and the three visual elements 51 are sequentially arranged corresponding to the crystal ring module 13, the calibration module 16 and the eutectic heating mechanism 4. In this embodiment, the visual element 51 is a detection camera to ensure accurate positioning of the chip.

[0042] It should be noted that the specific structures and working principles of the cache platform 11, the rotating arm module 12, the crystal ring module 13, the ejector pin module 14, the swing arm module 15, the calibration module 16 and the visual element 51 are conventional technical means for those skilled in the art, and therefore will not be elaborated in detail in the embodiments of the present application.

[0043] Reference Figure 1The transfer mechanism 2 includes a transfer module 21 and a heat adsorption module 22 disposed on the transfer module 21. The transfer module 21 is mounted on the frame 5, and the transfer module 21 is disposed along the direction from the eutectic heating mechanism 4 to the calibration module 16. In this embodiment, the transfer module 21 adopts a linear motor or a ball screw structure, so that the transfer module 21 is used to drive the heat adsorption module 22 to approach or move away from the calibration module 16.

[0044] Reference Figure 2 and Figure 3 The heat adsorption module 22 includes a vacuum nozzle 221 and a heating plate 222 installed in the vacuum nozzle 221 .

[0045] Reference Figure 1 and Figure 3 The vacuum suction nozzle 221 is installed on the transfer module 21 and is offset from the visual element 51, so that when the transfer module 21 drives the vacuum suction nozzle 221 to move, the vacuum suction nozzle 221 is not easy to interfere with the visual element 51. The vacuum suction nozzle 221 is connected to an external vacuum pump through an internal pipe to achieve vacuum adsorption, thereby facilitating the use of the vacuum suction nozzle 221 to transfer the chip from the calibration module 16 to the eutectic heating mechanism 4.

[0046] In this embodiment, the heating plate 222 is made of high-temperature resistant ceramic material and can work for a long time in a high-temperature environment. The heating plate 222 uses a resistive heating effect to convert electrical energy into thermal energy, so that the heating plate 222 can be used to heat the vacuum suction nozzle 221, and the chip can be preheated while the vacuum suction nozzle 221 adsorbs the chip.

[0047] Reference Figure 1 and Figure 4 The feeding mechanism 3 includes a feeding module 31, a preheating module 32 and an X-axis module 33. The X-axis module 33 is mounted on the frame 5 and is located on the side of the eutectic heating mechanism 4 away from the transfer module 21. The feeding module 31 is arranged on the X-axis module 33. The feeding module 31 is used to provide a substrate. The preheating module 32 is arranged on the feeding module 31 to preheat the substrate to a certain temperature to avoid the influence of sudden temperature change on the substrate.

[0048] The feeding module 31 includes a material pushing assembly 311, a material box 312 and a lifting platform 313. There are multiple material boxes 312, and the multiple material boxes 312 are respectively installed on the X-axis module 33. In this embodiment, there are two material boxes 312, and the X-axis module 33 can be set as a ball screw structure, so that the X-axis module 33 can be used to drive the material box 312 to move.

[0049] Reference Figure 4The number of lifting platforms 313 and preheating modules 32 is equal to the number of material boxes 312 and is arranged one by one. Specifically, the lifting platform 313 is installed in the material box 312, and the preheating module 32 is installed on the lifting platform 313, and the preheating module 32 is used to heat the inside of the material box 312. In other embodiments, the preheating module 32 can also be directly installed in the material box 312 instead of being installed on the lifting platform 313.

[0050] The lifting platform 313 is used to support the substrate, and a limiting piece 3121 is arranged in the material box 312, so that when the lifting platform 313 drives the substrate to move upward for a certain distance, the limiting piece 3121 can contact the lifting platform 313 to limit the lifting platform 313. At this time, the lifting platform 313 drives the substrate to move to a specified position, which is conducive to preventing the substrate from being crushed.

[0051] The preheating module 32 includes a heating plate and a heating wire embedded in the heating plate. The heating plate is installed on the lifting platform 313, and the heating wire is used to heat the heating plate, so that the heating plate can heat the lifting platform 313, so as to heat the substrate by using the lifting platform 313, thereby realizing preheating of the substrate. In other embodiments, the preheating module 32 can also be set to other heating forms, as long as it can achieve heating of the lifting platform 313 or the inside of the material box 312.

[0052] Reference Figure 1 and Figure 4 A discharge port 3122 is provided on the side of the material box 312 close to the eutectic heating mechanism 4, and a push port 3123 is provided on the side of the material box 312 away from the eutectic heating mechanism 4. The push port 3123 is arranged corresponding to the discharge port 3122. When the lifting platform 313 contacts the limiting piece 3121, the substrate on the lifting platform 313 is arranged close to the discharge port 3122.

[0053] The pusher assembly 311 includes a pusher drive 3111 and a push rod 3112. The pusher drive 3111 is mounted on the frame 5 and is located on the side of the X-axis module 33 away from the eutectic heating mechanism 4, and the push rod 3112 is fixedly connected to the pusher drive 3111. In this embodiment, the pusher drive 3111 can be set as a cylinder or a hydraulic cylinder, so that the pusher drive 3111 can be used to drive the push rod 3112 to move. In other embodiments, the pusher drive 3111 can also adopt other pushing methods, which can drive the push rod 3112 to approach or move away from the push port 3123.

[0054] When the substrate needs to be transported to the eutectic heating mechanism 4, the push drive 3111 drives the push rod 3112 to extend into the push port 3123, so that the push rod 3112 pushes the substrate to move toward the discharge port 3122, thereby pushing the substrate out of the material box 312, and then making the substrate fall onto the eutectic heating mechanism 4 to realize the loading of the substrate.

[0055] Reference Figure 1 and Figure 5 The eutectic heating mechanism 4 includes a carrier 41, a heating module 42, a translation module 43, a clamping module 44 and a lifting module 45. The carrier 41 is fixed on the frame 5 and is located between the X-axis module 33 and the transfer module 21, and the heating module 42 and the translation module 43 are respectively arranged on the carrier 41.

[0056] The clamping module 44 includes a moving seat 441, an upper clamping seat 442, a lower clamping seat 443 and a clamping drive assembly 444. The moving seat 441 is slidably disposed on the carrier 41 and connected to the translation module 43. In this embodiment, the translation module 43 is a structure in which a motor drives a transmission belt, so that the translation module 43 is used to drive the moving seat 441 to move between the X-axis module 33 and the transfer module 21.

[0057] The clamping drive assembly 444 and the upper clamping seat 442 are respectively installed on the moving seat 441, and the lower clamping seat 443 is slidably arranged on the moving seat 441 and arranged opposite to the upper clamping seat 442, and the lower clamping seat 443 is located below the upper clamping seat 442. In this embodiment, two upper clamping seats 442 are provided, and the two upper clamping seats 442 are symmetrically arranged, and the number of the lower clamping seats 443 is equal to the number of the upper clamping seats 442 and corresponds to the upper clamping seats 442 one by one, and an accommodating groove 445 is formed between the upper clamping seat 442 and the lower clamping seat 443.

[0058] Reference Figure 6 The number of the clamping drive components 444 is equal to the number of the lower clamping seats 443 and they are arranged one by one. The clamping drive components 444 include a clamping drive member 4441 and a first elastic member 4442. The clamping drive member 4441 is installed on the moving seat 441. One end of the first elastic member 4442 is fixedly connected to the clamping drive member 4441, and the other end is fixedly connected to the lower clamping seat 443. In this embodiment, the clamping drive member 4441 is a cylinder, and the first elastic member 4442 is a spring.

[0059] Reference Figure 1 and Figure 6When the push rod 3112 pushes the substrate to move into the receiving groove 445, the clamping driving member 4441 drives the lower clamping seat 443 away from the upper clamping seat 442 through the first elastic member 4442, so that the substrate can enter the receiving groove 445. When the substrate enters the designated position in the receiving groove 445, the clamping driving member 4441 drives the lower clamping seat 443 to approach the upper clamping seat 442 through the first elastic member 4442, so that the upper clamping seat 442 and the lower clamping seat 443 can be used to clamp the substrate, thereby fixing the substrate.

[0060] Reference Figure 5 and Figure 6 The movable seat 441 is provided with a clearance groove 4411, and the heating module 42 includes a heating platform 421 and a heating tube 422. The heating platform 421 is slidably arranged on the carrier 41, and one end of the heating platform 421 passes through the clearance groove 4411, so that the heating platform 421 is not easy to interfere with the movement of the movable seat 441.

[0061] Reference Figure 5 The heating tube 422 is embedded in the heating platform 421, and the heating tube 422 is used to heat the heating platform 421. A boss 423 is integrally formed on the heating platform 421, and the heat generated by the heating tube 422 can be transferred to the boss 423 through the heating platform 421, so that the surface temperature of the boss 423 is evenly distributed, so that when the boss 423 contacts the substrate, the boss 423 can heat the substrate. In this embodiment, the design of the boss 423 effectively prevents the non-eutectic part of the substrate from being heated for a long time, which is conducive to reducing the possibility of damage to the substrate.

[0062] Reference Figure 5 and Figure 6 , the lifting module 45 includes a lifting drive 451 and a cam 452. The lifting drive 451 is mounted on the carrier 41, the cam 452 is rotatably connected to the carrier 41 and connected to the lifting drive 451, and the cam 452 is in conflict with the bottom of the heating platform 421. In this embodiment, the lifting drive 451 includes a motor and a transmission belt, and the transmission belt is connected to the motor and the cam 452 respectively, so that the motor drives the cam 452 to rotate through the transmission belt, so that the cam 452 accurately pushes the heating platform 421 up and down.

[0063] Reference Figure 5 and Figure 6When the chip and the substrate need to be eutectic, the lifting drive 451 drives the cam 452 to rotate, and the cam 452 drives the heating platform 421 to rise, so that the boss 423 fits with the substrate, thereby facilitating heating of the substrate to achieve eutectic heating of the chip and the substrate. When the substrate and the chip are eutectic, the lifting drive 451 drives the heating platform 421 to descend through the cam 452, so that the substrate is no longer in contact with the boss 423, which is conducive to reducing the possibility of friction between the boss 423 and the substrate when the substrate moves, causing damage to the substrate.

[0064] In other embodiments, the lifting module 45 may not be provided, and the clamping module 44 can be lifted and lowered synchronously to control the contact or separation between the substrate and the boss 423 .

[0065] The implementation principle of a nozzle heating eutectic machine in the embodiment of the present application is as follows: when it is necessary to eutecticize the chip with the substrate, the rotating arm module 12, the ejector module 14, the swing arm module 15 and the calibration module 16 are first started in sequence, the rotating arm module 12 transfers the wafer blue film 6 from the buffer platform 11 to the wafer ring module 13, the ejector module 14 lifts the chip, and the swing arm module 15 transfers the chip from the ejector module 14 to the calibration module 16. After the calibration module 16 completes the calibration of the chip, the transfer module 21 drives the vacuum nozzle 221 to approach the calibration module 16, and the vacuum nozzle 221 removes the chip from the calibration module 16. At this time, the heat generated by the heating plate 222 is transferred to the chip to preheat the chip.

[0066] At the same time, the lifting platform 313 moves to a position that contacts the limiting piece 3121 to drive the substrate to the specified position, and the preheating module 32 preheats the substrate. The push drive 3111 is then started, and the push drive 3111 pushes the preheated substrate out of the material box 312 from the discharge port 3122 through the push rod 3112, so that the substrate enters the receiving groove 445. After the substrate completely enters the receiving groove 445, the clamping drive 4441 drives the lower clamping seat 443 to approach the upper clamping seat 442 through the first elastic member 4442 to fix the substrate.

[0067] Next, the translation module 43 works, and drives the substrate to move toward the transfer module 21 through the moving seat 441, the upper clamping seat 442 and the lower clamping seat 443, so that the vacuum nozzle 221 transfers the chip to the substrate. After the chip transfer is completed, the translation module 43 works in the reverse direction to drive the substrate to move to a position close to the boss 423. Finally, the lifting drive 451 drives the heating platform 421 to rise through the cam 452, so that the boss 423 fits with the substrate, thereby facilitating the heating of the substrate, thereby achieving eutectic heating of the chip and the substrate. Repeat the above steps to complete eutectic heating of multiple chips and substrates in sequence.

[0068] In another preferred embodiment, the nozzle heating eutectic machine includes a material shifting mechanism 7 .

[0069] Reference Figure 1 The material-dispensing mechanism 7 includes a Y-axis module 71 and a material-dispensing module 72 disposed on the Y-axis module 71. The Y-axis module 71 is mounted on the side of the carrier 41, and the material-dispensing module 72 is mounted on the Y-axis module 71, and one end of the material-dispensing module 72 can contact the substrate. In this embodiment, the Y-axis module 71 adopts a structure of a motor-driven transmission belt, so that the Y-axis module 71 can drive the material-dispensing module 72 to move, so that the material-dispensing module 72 can accurately move the substrate.

[0070] Reference Figure 1 and Figure 7 The material shifting module 72 includes a mounting seat 721, a shifting rod 722, a second elastic member 723 and a monitoring member 724. One end of the mounting seat 721 is fixedly connected to the Y-axis module 71, and the other end of the mounting seat 721 is provided with a slot 7211. One end of the shifting rod 722 is inserted into the slot 7211 and is rotatably connected to the mounting seat 721.

[0071] Two second elastic members 723 are provided, and the two second elastic members 723 are respectively provided on both sides of the lever 722, and one end of the second elastic member 723 away from the lever 722 is connected to the inner wall of the slot 7211. In this embodiment, the second elastic member 723 is a spring.

[0072] The monitoring component 724 is disposed in the slot 7211 and is electrically connected to the Y-axis driving component. In the present embodiment, the monitoring component 724 is an electromagnetic switch. When the Y-axis module 71 drives the lever 722 to move through the mounting seat 721, the end of the lever 722 away from the mounting seat 721 can contact the substrate, so that the lever 722 can be used to push the substrate to move. And in this process, when the resistance to the lever 722 reaches a certain value, the lever 722 can rotate and apply pressure to the second elastic component 723, so that the second elastic component 723 is compressed. At this time, the monitoring component 724 will immediately trigger a signal, so that the Y-axis module 71 stops driving the lever 722 to move, thereby effectively preventing the substrate from being damaged.

[0073] Reference Figure 5 and Figure 7 When multiple chips need to be eutectic with the substrate in sequence, the chips are first placed in the designated positions on the substrate in sequence, and the substrate is fitted with the boss 423. After completing one eutectic operation, the clamping drive assembly 444 drives the lower clamping seat 443 away from the upper clamping seat 442 to release the substrate. At the same time, the lifting module 45 drives the heating platform 421 to descend, so that the boss 423 is separated from the substrate. At this time, the Y-axis module 71 (refer to Figure 1) The mounting seat 721 drives the lever 722 to move. After the lever 722 moves the substrate to a specified distance, the lower clamping seat 443 and the upper clamping seat 442 clamp the substrate again, and the boss 423 is also attached to the substrate again, so as to facilitate heating the next position of the substrate to achieve eutectic formation of the next chip and the substrate. Repeat the above steps to sequentially complete eutectic formation of multiple chips and substrates.

[0074] In another preferred embodiment, the eutectic heating mechanism 4 further includes a housing (not shown in the figure). The housing is mounted on the carrier 41, so that a relatively closed chamber is formed between the housing and the carrier 41, which is beneficial to reduce the interference of external factors on the eutectic process on the one hand, and is beneficial to keep the heat in the chamber on the other hand, so as to heat the substrate more evenly. It should be noted that in this embodiment, a corresponding switch door is provided on the housing for the transportation of chips and substrates.

[0075] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A nozzle heating eutectic machine, characterized in that: include: A feeding mechanism (1), used for providing chips; The transfer mechanism (2) comprises a transfer module (21) and a heat adsorption module (22) arranged on the transfer module (21), wherein the transfer module (21) is used to drive the heat adsorption module (22) to approach or move away from the loading mechanism (1), and the heat adsorption module (22) is used to adsorb the chips on the loading mechanism (1) and preheat the chips; A feeding mechanism (3), comprising a feeding module (31) and a preheating module (32), wherein the preheating module (32) is arranged on the feeding module (31), the feeding module (31) is used to provide a substrate, and the preheating module (32) is used to preheat the substrate stored on the feeding module (31); The eutectic heating mechanism (4) is arranged between the feeding module (31) and the transfer module (21), and the eutectic heating mechanism (4) is used to heat the substrate and the chip to form a eutectic.

2. The nozzle heating eutectic machine according to claim 1, characterized in that: The heat adsorption module (22) comprises a vacuum suction nozzle (221) and a heating plate (222) arranged in the vacuum suction nozzle (221); the vacuum suction nozzle (221) is arranged on the transfer module (21); and the heating plate (222) is used to heat the vacuum suction nozzle (221).

3. The nozzle heating eutectic machine according to claim 1, characterized in that: The eutectic heating mechanism (4) comprises a carrier frame (41), a heating module (42), a translation module (43) and a clamping module (44); the carrier frame (41) is arranged between the feeding module (31) and the transfer module (21); the heating module (42) and the translation module (43) are respectively arranged on the carrier frame (41); the clamping module (44) is slidably arranged on the carrier frame (41) and is slidably connected to the heating module (42); the clamping module (44) is connected to the translation module (43); when a substrate is clamped by the clamping module (44), the substrate can be bonded to the heating module (42).

4. The nozzle heating eutectic machine according to claim 3, characterized in that: The clamping module (44) comprises a moving seat (441), an upper clamping seat (442), a lower clamping seat (443) and a clamping drive assembly (444); the moving seat (441) is slidably arranged on the supporting frame (41) and connected to the translation module (43); a clearance groove (4411) is provided on the moving seat (441), and the heating module (42) is arranged through the clearance groove (4411); The clamping drive assembly (444) and the upper clamping seat (442) are respectively arranged on the movable seat (441), the lower clamping seat (443) is slidably arranged on the movable seat (441) and is arranged opposite to the upper clamping seat (442), the clamping drive assembly (444) is connected to the lower clamping seat (443), and the clamping drive assembly (444) is used to drive the lower clamping seat (443) to approach or move away from the upper clamping seat (442).

5. The nozzle heating eutectic machine according to claim 4, characterized in that: The clamping drive assembly (444) includes a clamping drive member (4441) and a first elastic member (4442), wherein the clamping drive member (4441) is arranged on the movable seat (441), one end of the first elastic member (4442) is connected to the clamping drive member (4441), and the other end of the first elastic member (4442) is connected to the lower clamping seat (443).

6. The nozzle heating eutectic machine according to claim 3, characterized in that: The eutectic heating mechanism (4) comprises a lifting module (45), the lifting module (45) comprising a lifting drive member (451) and a cam (452), the lifting drive member (451) being arranged on the carrier frame (41), the cam (452) being rotatably connected to the carrier frame (41) and connected to the lifting drive member (451), the cam (452) being in contact with the heating module (42), and the heating module (42) being slidably arranged on the carrier frame (41).

7. The nozzle heating eutectic machine according to claim 3, characterized in that: The heating module (42) comprises a heating platform (421) and a heating tube (422); the heating platform (421) is slidably arranged on the support frame (41); a boss (423) is arranged on the heating platform (421); the boss (423) is used to fit with a substrate; the heating tube (422) is embedded in the heating platform (421); and the heating tube (422) is used to heat the heating platform (421).

8. The nozzle heating eutectic machine according to claim 3, characterized in that: The invention comprises a material shifting mechanism (7), wherein the material shifting mechanism (7) comprises a Y-axis module (71) and a material shifting module (72) arranged on the Y-axis module (71), wherein the Y-axis module (71) is arranged beside the support frame (41), and the material shifting module (72) comprises a mounting seat (721), a shifting rod (722), a second elastic member (723) and a monitoring member (724), wherein one end of the mounting seat (721) is connected to the Y-axis module (71), and the other end of the mounting seat (721) is connected to the Y-axis module (71). A slot (7211) is provided at one end, one end of the lever (722) is inserted into the slot (7211) and is rotatably connected to the mounting seat (721), the second elastic member (723) is arranged between the lever (722) and the inner wall of the slot (7211), the monitoring member (724) is arranged in the slot (7211) and is electrically connected to the Y-axis module (71), and the monitoring member (724) is used to monitor the state of the second elastic member (723).

9. The nozzle heating eutectic machine according to claim 1, characterized in that: The feeding module (31) comprises a material pushing component (311), a material box (312) and a lifting platform (313); the material pushing component (311) is arranged on a side of the eutectic heating mechanism (4) away from the transfer module (21); the material box (312) is arranged between the material pushing component (311) and the eutectic heating mechanism (4); the lifting platform (313) is arranged in the material box (312); a substrate is placed on the lifting platform (313); the preheating module (32) is arranged in the material box (312); and the preheating module (32) is used to heat the interior of the material box (312).

10. The nozzle heating eutectic machine according to claim 9, characterized in that: At least two material boxes (312) are provided, the number of the lifting platforms (313) and the pre-heating modules (32) is equal to the number of the material boxes (312) and are arranged in one-to-one correspondence, the feeding mechanism (3) comprises an X-axis module (33), the X-axis module (33) is arranged between the pushing assembly (311) and the eutectic heating mechanism (4), and a plurality of the material boxes (312) are respectively arranged on the X-axis modules (33).

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