Multi-chip stacked package solid state disk with integrated cooling fins

Abstract

The invention discloses a multi-chip stacked package solid state disk with integrated cooling fins, and belongs to the technical field of solid state disks. The multi-chip stacked packaging solid state disk with the integrated cooling fins comprises a bottom plate, an integrated cooling cover and a circuit board, the bottom plate covers the integrated cooling cover, the integrated cooling cover and the bottom plate define a packaging external structure, the circuit board is arranged between the bottom plate and the integrated cooling cover, and a plurality of vertically stacked NAND flash memory chips are arranged on the circuit board. According to the multi-chip stacked packaging solid state disk with the integrated cooling fins, the first cooling fins are arranged at the tops of the NAND flash memory chips, and the chip side heat dissipation structures are arranged on the side faces of the NAND flash memory chips, so that multi-directional heat dissipation design is achieved, it is ensured that heat can be rapidly conducted out from multiple directions, the overall heat dissipation efficiency is improved, and the service life of the solid state disk is prolonged. The heat dissipation problem of the multi-chip stacked packaging solid state disk is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of solid state hard disks, and in particular to a multi-chip stacked package solid state hard disk with an integrated heat sink. Background Art

[0002] With the development of information technology, the demand for data storage is growing. Solid-state drives (SSDs) are widely used in personal computers, servers and various mobile devices due to their advantages such as fast read and write speeds and no mechanical moving parts. However, with the increase in storage density and operating frequency, the heat generated by solid-state drives during operation is gradually increasing, which not only affects the working efficiency of the SSD, but may also shorten its service life.

[0003] A Chinese patent with publication number CN112447621B discloses a semiconductor package, in which a heat dissipation component is disposed on an insulating layer, so that the heat dissipation component includes an area on the upper surface of a first semiconductor chip where a second semiconductor chip is not disposed and an area on the upper surface of the second semiconductor chip. The heat dissipation structure is located on the upper surface of the chip, which makes it difficult to dissipate heat on the side of the chip, and the heat dissipation direction is single. In particular, in a packaging structure where multiple chips are stacked, the demand for heat dissipation is large, and the existing technology is difficult to meet the heat dissipation needs. Summary of the invention

[0004] The purpose of the present invention is to provide a multi-chip stacked packaged solid-state hard disk with an integrated heat sink. By setting a first heat sink on the top of the NAND flash memory chip and setting a chip side heat dissipation structure on the side of the NAND flash memory chip, a multi-directional heat dissipation design is realized, ensuring that heat can be quickly discharged from multiple directions, improving the overall heat dissipation efficiency, solving the heat dissipation problem of the multi-chip stacked packaged solid-state hard disk, and solving the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a multi-chip stacked package solid-state hard disk with an integrated heat sink, comprising a base plate, an integrated heat dissipation cover and a circuit board, the base plate and the integrated heat dissipation cover are covered together, the integrated heat dissipation cover and the base plate form a package external structure, a circuit board is arranged between the base plate and the integrated heat dissipation cover, a plurality of vertically stacked NAND flash memory chips are arranged on the circuit board, the integrated heat dissipation cover is in contact with the NAND flash memory chips, an air dissipation vent structure is arranged on the integrated heat dissipation cover, and a chip side heat dissipation structure connected to the side of the stacked NAND flash memory chips is also arranged on the integrated heat dissipation cover, the air dissipation vent structure simultaneously guides the heat dissipation wind to the top of the integrated heat dissipation cover and the chip side heat dissipation structure inside the integrated heat dissipation cover, so as to dissipate heat for the top and side of the NAND flash memory chip at the same time.

[0006] Preferably, a control chip is also provided on the circuit board, and the control chip is in contact with the integrated heat dissipation cover through heat dissipation columns, and the NAND flash memory chip and the control chip are both mainly cooled through the integrated heat dissipation cover above.

[0007] Preferably, the heat dissipation column body is a heat-conducting rubber, and spiral blades are arranged on the outer wall of the heat-conducting rubber. The heat-conducting rubber absorbs the heat from the control chip and dissipates the heat through the first heat sink. The spiral blades cooperate with the gas flow in the solid state drive to improve the heat dissipation effect.

[0008] Preferably, an I-shaped support plate is provided at one end of the base plate, fan slots are symmetrically provided on both sides of the I-shaped support plate, a cooling fan is installed in the fan slot through a bracket, sealing plates are symmetrically provided on both sides of the I-shaped support plate, the I-shaped support plate, the fan slot and the sealing plate are non-planarly connected to form a concave-convex groove, which can increase the heat dissipation area, an air inlet is provided on one side of the fan slot, a first dustproof net is provided at a position of the fan slot near the air inlet, air is supplied to the cooling fan through the air inlet, and the first dustproof net filters the incoming air to prevent dust from entering the fan slot.

[0009] Preferably, a first heat sink is provided on the top of the integrated heat sink, the first heat sink is vertically integrated with the heat sink, and the first heat sinks are distributed at equal distances to form a plurality of heat dissipation channels on the top of the integrated heat sink, and an air dispersion outlet structure is provided at a position of the integrated heat sink close to the fan slot, the air dispersion outlet structure is connected with the fan slot to blow out the heat dissipation air in the fan slot.

[0010] Preferably, the air dissipation outlet structure includes an upper top plate, an inclined panel, a triangular plate and a lower hanging plate, the upper top plate is connected to the first heat sink, one side of the upper top plate covers the upper end of the fan slot, triangular plates are symmetrically arranged on both sides of the lower surface of the upper top plate, the lower end of the triangular plate is fixedly connected to the inclined panel, the lower end of the inclined panel is positioned lower than the lower end of the first heat sink, wind blows from the lower end of the inclined panel to the upper end of the inclined panel, the inclined panel and the triangular plate play a guiding role, which can accelerate the heat dissipation of the first heat sink, the upper top plate can shield the inclined panel to achieve the effect of waterproof and dustproof, and the inclined panel is inclined, which can achieve a water guiding effect to waterproof the circuit board in the solid state hard disk, the lower end of the inclined panel is connected to one side of the fan slot through the lower hanging plate, an air distribution hole is opened on the inclined panel, a waterproof plate is fixedly connected to the side of the air distribution hole away from the fan slot, the air distribution hole is inclined toward the fan slot, and the wind from the air outlet of the fan slot moves along the direction of the inclined panel.

[0011] Preferably, a thermal grease layer is provided on the top and side walls of the NAND flash memory chip, and the thermal grease layer is filled between the NAND flash memory chip and the integrated heat dissipation cover and the chip side heat dissipation structure to reduce thermal resistance and improve heat conduction efficiency. The chip side heat dissipation structure includes a thermally conductive side plate and a second heat sink. The second heat sink is sandwiched between the two layers of thermally conductive side plates. The thermally conductive side plate and the second heat sink form a heat dissipation channel below the air distribution hole.

[0012] Preferably, the second heat sink is a wavy discontinuous structure, and a partition plate is provided in the middle of the heat-conducting side plate, the second heat sinks on both sides of the partition plate are symmetrically arranged, and the positions where the second heat sinks are provided with notches are bent toward the partition plate.

[0013] Preferably, an air outlet structure is provided at one end of the integrated heat dissipation cover away from the air dissipation outlet structure, and the air outlet structure includes a V-shaped plate recessed toward the interior of the integrated heat dissipation cover and a third dust-proof net, the third dust-proof net covers one side of the V-shaped plate, and an air outlet is provided on the side plate above the V-shaped plate, and the air outlet is arranged downward to play a waterproof role, and the third dust-proof net enhances the dust-proof effect.

[0014] Preferably, the integrated heat dissipation cover is provided with a pallet assembly for supporting the circuit board, the pallet assembly includes a guide rod, a pallet body is sleeved on the guide rod, the pallet body is connected to both sides of the circuit board, a support spring is sleeved on the guide rod below the pallet body, the support spring has a buffering effect on the pallet body when vibration occurs, a shock absorbing rod is also provided on the lower surface of the pallet body, the shock absorbing rod is hinged to the pallet body and the bottom plate at the same time, the shock absorbing rod and the support spring work together to reduce the impact of vibration on the circuit board.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention proposes a multi-chip stacked packaged solid-state hard disk with an integrated heat sink. By arranging a first heat sink on the top of the NAND flash memory chip and a chip side heat dissipation structure on the side of the NAND flash memory chip, a multi-directional heat dissipation design is realized, which ensures that heat can be quickly discharged from multiple directions, improves the overall heat dissipation efficiency, and solves the heat dissipation problem of the multi-chip stacked packaged solid-state hard disk. The air vent structure can cool the first heat sink and the second heat sink. At the same time, the design of the inclined panel can play a waterproof role. A support plate assembly is arranged under the circuit board to absorb vibration energy, protect internal components, and improve the seismic performance of the solid-state hard disk. Good heat dissipation design ensures that the chip can still maintain high performance under high load and avoids performance degradation caused by overheating. Uniform heat dissipation and reliable physical protection enable the solid-state hard disk to operate stably in various environments, thereby improving the overall performance and stability of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The overall structure diagram of the multi-chip stacked package solid state hard disk with integrated heat sink of the present invention; Figure 2 An exploded view of a multi-chip stacked package solid-state hard disk with an integrated heat sink of the present invention; Figure 3 This is a diagram showing the internal structure of the bottom plate and the integrated heat dissipation cover of the present invention; Figure 4 The bottom plate structure diagram of the present invention; Figure 5 A cross-sectional view of the base plate and the integrated heat dissipation cover of the present invention; Figure 6 It is a partial structural diagram of the chip side heat dissipation structure of the present invention; Figure 7 It is a structural diagram of the support plate assembly of the present invention.

[0017] In the figure: 1, bottom plate; 11, I-shaped support plate; 12, fan slot; 121, air inlet; 122, first dust screen; 13, sealing plate; 2, integrated heat dissipation cover; 21, first heat sink; 22, air outlet structure; 221, top plate; 222, inclined plate; 2221, air distribution hole; 2222, waterproof plate; 223, triangular plate; 224, lower hanging plate; 2241, second dust screen; 23, chip side heat dissipation structure; 231, heat-conducting side plate; 231 1. Partition plate; 232. Second heat sink; 24. Heat dissipation column; 241. Thermally conductive rubber; 242. Spiral blade; 25. Air outlet structure; 251. V-shaped plate; 2511. Air outlet; 252. Third dust screen; 26. Support plate assembly; 261. Guide rod; 262. Support plate body; 263. Support spring; 264. Shock absorber rod; 3. Circuit board; 31. NAND flash memory chip; 311. Thermally conductive silicone grease layer; 32. Control chip; 4. Cooling fan. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In order to solve the problem that the existing heat dissipation structure is located on the upper surface of the chip, it is difficult to achieve heat dissipation on the side of the chip, and the heat dissipation direction is single. Especially in the packaging structure of multiple chips stacked, the demand for heat dissipation is large, and the existing technology is difficult to meet the heat dissipation needs, please refer to Figure 1-Figure 7 , this embodiment provides the following technical solutions: A multi-chip stacked package solid-state hard disk with an integrated heat sink comprises a base plate 1, an integrated heat dissipation cover 2 and a circuit board 3. The base plate 1 covers the integrated heat dissipation cover 2, the integrated heat dissipation cover 2 and the base plate 1 form a package external structure, and the circuit board 3 is arranged between the base plate 1 and the integrated heat dissipation cover 2.

[0020] A plurality of vertically stacked NAND flash memory chips 31 are arranged on the circuit board 3. The multiple NAND flash memory chips 31 are closely arranged to form a multi-layer storage unit to achieve high-density storage. The NAND flash memory chips 31 are stacked using through silicon via technology or micro-bump technology to save space in the solid state drive. The through silicon via technology is to vertically drill holes inside the chip and fill them with conductive materials to form vertical interconnection channels. The micro-bump technology is to make tiny metal bumps on the surface of the chip to achieve connection between chips through these bumps. The top of the NAND flash memory chip 31 is in contact with the integrated heat dissipation cover 2. A control chip 32 is also arranged on the circuit board 3. The control chip 32 is in contact with the integrated heat dissipation cover 2 through the heat dissipation column 24. The NAND flash memory chip 31 and the control chip 32 are both mainly cooled through the integrated heat dissipation cover 2 above.

[0021] An I-shaped support plate 11 is provided at one end of the base plate 1, and fan slots 12 are symmetrically provided on both sides of the I-shaped support plate 11. A cooling fan 4 is installed in the fan slot 12 through a bracket, and an air inlet 121 is opened on one side of the fan slot 12. A first dustproof net 122 is provided at a position of the fan slot 12 near the air inlet 121, and air is supplied to the cooling fan 4 through the air inlet 121. The first dustproof net 122 filters the incoming air to prevent dust from entering the fan slot 12, and sealing plates 13 are symmetrically provided on both sides of the I-shaped support plate 11. The sealing plate 13 is vertically connected to the I-shaped support plate 11, and the I-shaped support plate 11, the fan slot 12 and the sealing plate 13 are non-planarly connected to form a concave-convex groove, which can increase the heat dissipation area, and a fixing plate connected to the integrated heat dissipation cover 2 is provided near the I-shaped support plate 11, the fan slot 12 and the sealing plate 13.

[0022] A first heat sink 21 is provided on the top of the integrated heat sink cover 2. The first heat sink 21 is vertically integrated with the heat sink cover 2, and the first heat sink 21 is evenly distributed to form a plurality of heat dissipation channels on the top of the integrated heat sink cover 2. A wind dissipation outlet structure 22 is provided at a position of the integrated heat sink cover 2 close to the fan slot 12. The wind dissipation outlet structure 22 is connected to the fan slot 12 to blow out the heat dissipation air in the fan slot 12.

[0023] The air dispersing outlet structure 22 includes an upper top plate 221, an inclined panel 222, a triangular plate 223 and a lower hanging plate 224. The upper top plate 221 is connected to the first heat sink 21. One side of the upper top plate 221 covers the upper end of the fan slot 12. The two sides of the lower surface of the upper top plate 221 are symmetrically provided with triangular plates 223. The lower end of the triangular plate 223 is fixedly connected to the inclined panel 222. The lower end of the inclined panel 222 is lower than the lower end of the first heat sink 21. The wind blows from the lower end of the inclined panel 222 to the upper end of the inclined panel 222. The inclined panel 222 and the triangular plate 223 play a guiding role. The inclined panel 222 is tilted to guide water, thereby waterproofing the circuit board 3 in the solid-state hard disk. The lower end of the inclined panel 222 is connected to one side of the fan slot 12 through the lower hanging plate 224 to ensure the sealing of the connection between the bottom plate 1 and the integrated heat dissipation cover 2. A second dustproof net 2241 is provided between the lower hanging plate 224 and the upper top plate 221. The second dustproof net 2241 performs secondary air filtration to prevent water and dust.

[0024] At the same time, in order to improve the heat dissipation inside the solid-state hard disk, an air distribution hole 2221 is opened on the inclined panel 222. A waterproof plate 2222 is fixedly connected to the side of the air distribution hole 2221 away from the fan slot 12. The air distribution hole 2221 is inclined toward the fan slot 12. The wind from the air outlet of the fan slot 12 moves along the inclined panel 222, and part of the wind enters the air distribution hole 2221. The air distribution hole 2221 is connected to the inside of the structure surrounded by the base plate 1 and the integrated heat dissipation cover 2, and a chip side heat dissipation structure 23 connected to the air distribution hole 2221 is provided below the inclined panel 222.

[0025] In order to improve the side heat dissipation effect of the NAND flash memory chip 31, a chip side heat dissipation structure 23 connected to the stacked NAND flash memory chip 31 is provided on the side, and a thermal conductive silicone grease layer 311 is provided on the top and side wall of the NAND flash memory chip 31. The thermal conductive silicone grease layer 311 is filled between the NAND flash memory chip 31 and the integrated heat dissipation cover 2 and the chip side heat dissipation structure 23 to reduce thermal resistance and improve heat conduction efficiency. The specific structure of the chip side heat dissipation structure 23 includes a thermal conductive side plate 231 and a second heat sink 232. The second heat sink 232 is sandwiched between the two layers of thermal conductive side plates 231. The thermal conductive side plate 231 and the second heat sink 232 form a heat dissipation channel below the air distribution hole 2221. The second heat sink 232 is The heat conducting side plate 231 has a wavy discontinuous structure, and a partition plate 2311 is arranged in the middle position of the heat conducting side plate 231. The second heat sinks 232 on both sides of the partition plate 2311 are symmetrically arranged, and the positions where the second heat sinks 232 are provided with notches are bent toward the partition plate 2311. When the air distribution holes 2221 blow air to the chip side heat dissipation structure 23, the air flow in the chip side heat dissipation structure 23 flows, accelerating the heat dissipation of the second heat sink 232. At the same time, the air flow speed in the chip side heat dissipation structure 23 is fast, and the guidance of the second heat sink 232 can attract the air outside the chip side heat dissipation structure 23 to move into the chip side heat dissipation structure 23, thereby accelerating the gas flow in the solid state drive and improving the side heat dissipation effect of the NAND flash memory chip 31.

[0026] The main body of the heat dissipation column 24 connected to the control chip 32 is a thermally conductive rubber 241, and a spiral blade 242 is arranged on the outer wall of the thermally conductive rubber 241. The thermally conductive rubber 241 absorbs the heat from the control chip 32 and dissipates the heat through the first heat sink 21. The spiral blade 242 cooperates with the gas flow in the solid state hard disk to improve the heat dissipation effect. A thermally conductive copper wire can also be arranged in the thermally conductive rubber 241, and the lower end of the thermally conductive copper wire passes through the control chip 32 to further improve the heat dissipation effect of the control chip 32.

[0027] An air outlet structure 25 is provided at one end of the integrated heat dissipation cover 2 away from the air dissipation outlet structure 22. The air outlet structure 25 includes a V-shaped plate 251 recessed toward the inside of the integrated heat dissipation cover 2 and a third dustproof net 252 arranged in front of the V-shaped plate 251. An air outlet 2511 is provided on the side panel above the V-shaped plate 251. The air outlet 2511 is set downward to play a waterproof role. The third dustproof net 252 enhances the dustproof effect.

[0028] A support plate assembly 26 for supporting the circuit board 3 is arranged on the integrated heat dissipation cover 2, and the support plate assembly 26 includes a guide rod 261, and a support plate body 262 is sleeved on the guide rod 261, and the support plate body 262 is connected to both sides of the circuit board 3, and a support spring 263 is sleeved on the guide rod 261 below the support plate body 262, and the support spring 263 has a buffering effect on the support plate body 262 when vibration occurs. A shock-absorbing rod 264 is also arranged on the lower surface of the support plate body 262, and the shock-absorbing rod 264 is hinged to the support plate body 262 and the bottom plate 1 at the same time, and the shock-absorbing rod 264 and the support spring 263 work together to reduce the influence of vibration on the circuit board 3.

[0029] Working process: vertically drill holes inside the NAND flash memory chip and fill them with conductive materials to form vertical interconnection channels, vertically stack multiple NAND flash memory chips 31 to form a multi-layer storage unit, fill a thermal conductive silicone grease layer 311 between the top of the NAND flash memory chip 31 and the integrated heat dissipation cover 2 and between the side of the NAND flash memory chip 31 and the chip side heat dissipation structure 23, set a heat dissipation column 24 connected to the top of the integrated heat dissipation cover 2 on the top of the control chip 32, connect the circuit board 3 to the support plate body 262, and cover the bottom plate 1 with the integrated heat dissipation cover 2 for packaging. During the use of the solid-state hard disk, the first heat sink 21 directly provides heat dissipation for the NAND flash memory chip 31. The sheet 31 absorbs heat, and at the same time absorbs the heat on the control chip 32 through the heat dissipation column 24. In order to improve the heat dissipation, the heat dissipation fan 4 can be turned on. The heat dissipation fan 4 blows air. Under the guidance of the air dissipation outlet structure 22, part of the wind blows to the first heat sink 21 to cool the first heat sink 21, and part of the wind blows to the chip side heat dissipation structure 23 to dissipate the side heat of the NAND flash memory chip 31, thereby accelerating the flow of gas inside the solid state drive. At the same time, the internal gas of the solid state drive is discharged from the air outlet 2511 on the V-shaped plate 251. The support plate body 262 is connected to the circuit board 3, and the shock absorbing rod 264 and the support spring 263 work together to reduce the impact of vibration on the circuit board 3.

[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] While the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations can be made to the embodiments without departing from the principles and spirit of the invention.

Claims

1. A multi-chip stacked package solid-state hard disk with an integrated heat sink, comprising a base plate (1), an integrated heat sink cover (2) and a circuit board (3), characterized in that: The bottom plate (1) is covered with the integrated heat dissipation cover (2), and the integrated heat dissipation cover (2) and the bottom plate (1) form a package external structure. A circuit board (3) is arranged between the bottom plate (1) and the integrated heat dissipation cover (2), and a plurality of vertically stacked NAND flash memory chips (31) are arranged on the circuit board (3). The integrated heat dissipation cover (2) is in contact with the NAND flash memory chips (31), and an air dissipation vent structure (22) is arranged on the integrated heat dissipation cover (2). The integrated heat dissipation cover (2) is also provided with a chip side heat dissipation structure (23) connected to the side of the stacked NAND flash memory chips (31). The air dissipation vent structure (22) simultaneously guides heat dissipation air to the top of the integrated heat dissipation cover (2) and the chip side heat dissipation structure (23) inside the integrated heat dissipation cover (2), thereby dissipating heat from the top and side of the NAND flash memory chips (31) at the same time.

2. The multi-chip stacked package solid state drive with integrated heat sink according to claim 1, characterized in that: The circuit board (3) is also provided with a control chip (32), and the control chip (32) is in contact with the integrated heat dissipation cover (2) via the heat dissipation column (24).

3. The multi-chip stacked package solid state drive with integrated heat sink according to claim 2, characterized in that: The main body of the heat dissipation column (24) is a heat-conducting rubber (241), and spiral blades (242) are arranged on the outer wall of the heat-conducting rubber (241).

4. The multi-chip stacked package solid state drive with integrated heat sink according to claim 1, characterized in that: An I-shaped support plate (11) is provided at one end of the bottom plate (1), fan slots (12) are symmetrically provided on both sides of the I-shaped support plate (11), a heat dissipation fan (4) is installed in the fan slot (12) via a bracket, sealing plates (13) are symmetrically provided on both sides of the I-shaped support plate (11), an air inlet (121) is provided on one side of the fan slot (12), and a first dustproof net (122) is provided at a position of the fan slot (12) close to the air inlet (121).

5. The multi-chip stacked package solid state drive with integrated heat sink according to claim 1, characterized in that: A first heat sink (21) is provided on the top of the integrated heat dissipation cover (2), and an air dispersion outlet structure (22) is provided at a position of the integrated heat dissipation cover (2) close to the fan slot (12), wherein the air dispersion outlet structure (22) is in communication with the fan slot (12).

6. The multi-chip stack package solid state drive with integrated heat sink according to claim 5, characterized in that: The air dispersing outlet structure (22) comprises an upper top plate (221), an inclined panel (222), a triangular plate (223) and a lower hanging plate (224); the upper top plate (221) is connected to the first heat sink (21); one side of the upper top plate (221) covers the upper end of the fan slot (12); triangular plates (223) are symmetrically arranged on both sides of the lower surface of the upper top plate (221); the lower end of the triangular plate (223) is fixedly connected to the inclined panel (222); the lower end of the inclined panel (222) is connected to one side of the fan slot (12) via the lower hanging plate (224); an air distribution hole (2221) is provided on the inclined panel (222); and a waterproof plate (2222) is fixedly connected to the side of the air distribution hole (2221) away from the fan slot (12).

7. The multi-chip stack package solid state drive with integrated heat sink according to claim 6, characterized in that: The top and side walls of the NAND flash memory chip (31) are provided with a thermally conductive silicone grease layer (311), the thermally conductive silicone grease layer (311) is filled between the chip side heat dissipation structure (23) and the NAND flash memory chip (31), the chip side heat dissipation structure (23) comprises a thermally conductive side plate (231) and a second heat sink (232), the thermally conductive side plate (231) is provided with two layers, and the second heat sink (232) is sandwiched between the two layers of the thermally conductive side plates (231).

8. The multi-chip stacked package solid state drive with integrated heat sink according to claim 7, characterized in that: The second heat sink (232) is a wave-shaped discontinuous structure, and a partition plate (2311) is provided in the middle of the heat-conducting side plate (231), the second heat sinks (232) on both sides of the partition plate (2311) are symmetrically arranged, and the positions where the second heat sinks (232) are provided with notches are all bent in the direction of the partition plate (2311).

9. The multi-chip stacked package solid state drive with integrated heat sink according to claim 8, characterized in that: An air outlet structure (25) is provided at one end of the integrated heat dissipation cover (2) away from the air dissipation outlet structure (22); the air outlet structure (25) comprises a V-shaped plate (251) recessed into the interior of the integrated heat dissipation cover (2) and a third dustproof net (252); the third dustproof net (252) covers one side of the V-shaped plate (251); and an air outlet (2511) is provided on a side plate above the V-shaped plate (251).

10. The multi-chip stacked package solid state drive with integrated heat sink according to claim 9, characterized in that: The integrated heat dissipation cover (2) is provided with a support plate assembly (26) for supporting the circuit board (3), the support plate assembly (26) comprising a guide rod (261), a support plate body (262) being sleeved on the guide rod (261), the support plate body (262) being connected to two sides of the circuit board (3), a support spring (263) being sleeved on the guide rod (261) below the support plate body (262), and a shock absorbing rod (264) being further provided on the lower surface of the support plate body (262).

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