Electronic device

Abstract

The invention discloses electronic equipment, and relates to the field of electronic products. The electronic equipment comprises a frame body, a main board, a loudspeaker, a bracket assembly and a sealing element, wherein the frame body, the main board, the bracket assembly, the sealing element and the loudspeaker jointly define a first sound cavity; the support assembly comprises a first sound channel, a second sound channel and a second sound cavity communicated with the first sound channel and the second sound channel, the first sound channel is communicated with the first sound cavity, and the second sound channel is used for outputting sound; in the direction perpendicular to the sound transmission direction, the cross sectional area of the first sound channel is different from the cross sectional area of the second sound cavity, and the cross sectional area of the second sound channel is different from the cross sectional area of the second sound cavity. The battery cover can play a silencing role so as to relieve the problems of vibration and the like of the battery cover.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to an electronic device. Background Art

[0002] With the rapid development of electronic devices (such as mobile phones, tablets, etc.), sound quality has become one of their core functions. According to the design principle of speaker modules, the volume of the sound cavity has an important influence on the sound quality of the speaker. The larger the volume, the lower the low-frequency resonance point of the speaker, and the better the sound effect. In order to expand the volume of the sound cavity, an open sound cavity is proposed in the relevant technology, which can increase the volume of the sound cavity and improve the low-frequency performance of the speaker.

[0003] However, when the above-mentioned open sound cavity is used as the rear sound cavity of the electronic device, the sound emitted by the speaker will directly act on the battery cover of the electronic device through the rear sound cavity, causing the battery cover to vibrate, affecting the user experience. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an electronic device that can achieve a noise reduction effect to alleviate problems such as battery cover vibration.

[0005] In order to solve the above technical problems, this application is implemented as follows: An embodiment of the present application provides an electronic device, comprising: a frame, a mainboard, a speaker, a bracket assembly and a seal; The bracket assembly is arranged on the frame, the mainboard is arranged between the bracket assembly and the frame, the sealing member is arranged between the mainboard and the bracket assembly, the speaker is arranged on the frame, and the frame, the mainboard, the bracket assembly, the sealing member and the speaker together form a first sound cavity; The bracket assembly is provided with a first sound channel, a second sound channel and a second sound cavity. The first sound channel is connected to the first sound cavity. The second sound channel is used to output sound. The second sound cavity is connected between the first sound channel and the second sound channel. In the direction perpendicular to the sound propagation direction, the cross-sectional area of ​​the first sound channel is different from the cross-sectional area of ​​the second sound cavity, and the cross-sectional area of ​​the second sound channel is different from the cross-sectional area of ​​the second sound cavity.

[0006] The embodiment of the present application can be used to mute the sound emitted by the speaker through the design of the bracket assembly, so as to alleviate the problem of high-energy sound directly acting on the battery cover of the electronic device and causing the battery cover to vibrate. Among them, the bracket assembly can be provided with a first sound channel, a second sound channel and a second sound cavity, the second sound cavity is connected between the first sound channel and the second sound channel, and the first sound channel is connected to the first sound cavity, so that the sound emitted by the speaker can be transmitted to the first sound channel through the first sound cavity, and transmitted to the second sound cavity through the first sound channel, and then the sound is transmitted from the second sound cavity to the second sound channel, and transmitted from the second sound channel; in this process, since the cross-sectional area of ​​the first sound channel is different from the cross-sectional area of ​​the second sound cavity, and the cross-sectional area of ​​the second sound channel is different from the cross-sectional area of ​​the second sound cavity, the first sound channel, the second sound cavity and the second sound channel together form a resistive silencer structure, and the sound undergoes impedance changes in the process of entering the second sound cavity from the first sound channel and entering the second sound channel from the second sound cavity in the resistive silencer structure, so that the energy of the sound passing through the resistive silencer structure can be attenuated, which has a certain silencer effect on the sound. Therefore, even if the silenced sound is transmitted toward the battery cover of the electronic device again, since the energy of the sound is greatly attenuated, the vibration of the battery cover can be reduced, which effectively solves the problem that the vibration of the battery cover affects the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 A disassembly diagram of an electronic device disclosed in an embodiment of the present application; Figure 2 A schematic diagram of a partial assembly of an electronic device disclosed in an embodiment of the present application; Figure 3 for Figure 2 Schematic diagram of the cross section along AA; Figure 4 A schematic diagram of the structure of the bracket assembly and the speaker disclosed in the embodiment of the present application; Figure 5 This is a schematic diagram of the structure of the bracket body disclosed in the embodiment of the present application; Figure 6 This is a schematic structural diagram of a stent body with a Helmholtz hole disclosed in an embodiment of the present application; Figure 7 A schematic cross-sectional view of a Helmholtz hole disclosed in an embodiment of the present application; Figure 8 A schematic diagram of the structure of another form of a bracket body disclosed in an embodiment of the present application; Fig. 9 This is a schematic diagram of the vibration reduction effect of the bracket assembly on the battery cover disclosed in an embodiment of the present application.

[0008] Description of reference numerals: 01-frame; 02-main board; 021-avoidance hole; 03- Speaker; 04- Bracket assembly; 05-Seal; 10-bracket body; 11-Helmholtz hole; 111-first hole section; 112-second hole section; 12-first through groove; 13-second through groove; 14-third through groove; 15-accommodating groove; 20-cover plate; 30-sound absorbing parts; M-first channel; N-second channel; Q-first cavity; P-second cavity. DETAILED DESCRIPTION

[0009] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0010] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0011] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0012] refer to Figures 1 to 9 The embodiment of the present application discloses an electronic device, such as a mobile phone, a tablet computer, an e-book, etc. The disclosed electronic device includes a frame 01, a mainboard 02, a speaker 03, a bracket assembly 04 and a sealing member 05.

[0013] refer to Figure 1, the frame 01 is a basic component, which can provide a bearing and installation foundation for components such as the mainboard 02, the speaker 03, the bracket assembly 04, and the seal 05. Among them, the bracket assembly 04 is arranged on the frame 01 to carry the bracket assembly 04 through the frame 01. Optionally, the bracket assembly 04 can be installed to the frame 01 by screwing, clamping, plugging, etc. to ensure the installation stability of the bracket assembly 04. The mainboard 02 is arranged between the bracket assembly 04 and the frame 01, so that the mainboard 02 can be limited on the frame 01 by the bracket assembly 04 to ensure the stability of the installation of the mainboard 02.

[0014] The speaker 03 can be arranged in the frame 01 to achieve stable installation of the speaker 03 through the frame 01. Optionally, the speaker 03 can be installed to the frame 01 by screwing, snapping, plugging, etc. In addition, the speaker 03 is also electrically connected to the mainboard 02 to facilitate signal transmission.

[0015] The seal 05 is disposed between the main board 02 and the bracket assembly 04. Based on this, the seal 05 can be used to seal the connection between the main board 02 and the bracket assembly 04 to prevent sound leakage; of course, the seal 05 can also form a flexible connection between the bracket assembly 04 and the main board 02, which can alleviate the problem of the bracket assembly 04 squeezing the main board 02 and causing damage to the main board 02 to a certain extent. It should be noted here that the seal 05 can be in a pre-pressed state between the main board 02 and the bracket assembly 04, which can help to improve the sealing effect to a certain extent.

[0016] Optionally, the sealing member 05 may be a sealing ring; in addition, the sealing member 05 may be a foam member, a rubber member, a plastic member, etc.

[0017] Based on the above configuration, in the embodiment of the present application, the frame 01, the main board 02, the bracket assembly 04, the seal 05 and the speaker 03 together form a first sound cavity Q. Figure 3 and Figure 2 As shown, the sound emitted by the speaker 03 can propagate in the first acoustic cavity Q.

[0018] In the embodiment of the present application, the bracket assembly 04 can be used to install the mainboard 02 to the frame 01 to ensure the installation stability of the mainboard 02. The bracket assembly 04 can be provided with a first sound channel M, a second sound channel N and a second sound cavity P.

[0019] The first sound channel M is connected to the first sound cavity Q, and is used to receive the sound from the speaker 03 transmitted by the first sound cavity Q. The second sound channel N is used to output the sound so that the user can listen to it later. The second sound cavity P is used to transmit the sound, and the second sound cavity P is connected between the first sound channel M and the second sound channel N. Based on this setting, the sound emitted by the speaker 03 can be transmitted to the first sound channel M through the first sound cavity Q, and transmitted to the second sound cavity P through the first sound channel M, and then transmitted to the second sound channel N by the second sound cavity P, and finally transmitted by the second sound channel N. Among them, the second sound channel N can be connected to the rear cavity formed by the battery cover, so as to finally transmit the sound to the outside through the rear cavity.

[0020] In some embodiments, the first acoustic cavity Q may be connected only to the first acoustic channel M, and the rest of the positions may be sealed by the sealing member 05 and not connected to the outside.

[0021] However, considering that sound propagates in the form of waves, when sound propagates to some easily deformed structural parts, it will cause the structural parts to vibrate. In some embodiments, for electronic devices, the sound emitted by its speaker 03 can propagate toward the battery cover through the rear sound cavity, and is transmitted to the outside world through the rear cavity formed by the battery cover. Therefore, when the sound propagates in the rear cavity, it is easy to cause direct impact on the battery cover, especially when the rigidity of the battery cover is insufficient, the sound will cause obvious vibration of the battery cover after propagating to the battery cover, which will bring a poor experience to the user.

[0022] In order to alleviate the problem of sound directly propagating to the battery cover and causing vibration of the battery cover, the embodiment of the present application makes structural improvements to the bracket assembly 04 so that in the direction perpendicular to the sound propagation direction, the cross-sectional area of ​​the first sound channel M is different from the cross-sectional area of ​​the second sound cavity P, and the cross-sectional area of ​​the second sound channel N is different from the cross-sectional area of ​​the second sound cavity P.

[0023] Based on this arrangement, in the process of sound propagating along the first sound channel M, the second sound cavity P and the second sound channel N in sequence, since the cross-sectional area of ​​the first sound channel M is different from the cross-sectional area of ​​the second sound cavity P, and the cross-sectional area of ​​the second sound channel N is different from the cross-sectional area of ​​the second sound cavity P, the first sound channel M, the second sound cavity P and the second sound channel N together form a resistive silencer structure, and the sound undergoes an impedance change in the process of entering the second sound cavity P from the first sound channel M and entering the second sound cavity P from the second sound cavity P in the resistive silencer structure, so that the energy of the sound passing through the resistive silencer structure can be attenuated, which has a certain silencer effect on the sound. Therefore, even if the silenced sound propagates toward the battery cover of the electronic device again, since the energy of the sound is greatly attenuated, the vibration of the battery cover can be reduced, effectively solving the problem of the battery cover vibration affecting the user experience.

[0024] It should be noted here that when the cross-sectional area of ​​the first sound channel M differs greatly from the cross-sectional area of ​​the second sound cavity P, that is, it can be understood as a sudden change in the cross-sectional area; when the cross-sectional area of ​​the second sound channel N differs greatly from the cross-sectional area of ​​the second sound cavity P, that is, it can be understood as a sudden change in the cross-sectional area. When the cross-sectional area suddenly changes, the impedance of sound propagation will increase, thereby playing a certain sound-absorbing effect.

[0025] In some embodiments, the cross-sectional area of ​​the first acoustic channel M may be smaller than the cross-sectional area of ​​at least part of the second acoustic cavity P. Figure 5 and Figure 8 In this case, during the transmission of sound from the first sound channel M to the second sound cavity P, the sound changes due to the increase in the cross-sectional area, which can increase the sound propagation impedance to a certain extent, thereby playing a role in muffler.

[0026] In addition, the cross-sectional area of ​​the second sound channel N may be smaller than the cross-sectional area of ​​at least part of the second sound cavity P, such as Figure 5 and Figure 8 In this case, during the transmission of sound from the second acoustic cavity P to the second acoustic channel N, the sound changes due to the reduction of the cross-sectional area, which can also increase the sound propagation impedance to a certain extent, thereby playing a role in muffler.

[0027] Of course, when the cross-sectional area of ​​the first sound channel M can be smaller than at least part of the cross-sectional area of ​​the second sound cavity P, and the cross-sectional area of ​​the second sound channel N can be smaller than at least part of the cross-sectional area of ​​the second sound cavity P, the impedance effect during sound propagation will be more obvious, which is beneficial to improving the sound absorption effect.

[0028] Of course, the cross-sectional area of ​​the first sound channel M may also be larger than the cross-sectional area of ​​at least part of the second sound cavity P; the cross-sectional area of ​​the second sound channel N may also be larger than the cross-sectional area of ​​at least part of the second sound cavity P. In this case, the impedance of sound propagation can also be increased by increasing the impedance of sound propagation.

[0029] It should be noted here that the embodiments of the present application are not limited to the cross-sectional area of ​​the first sound channel M and the cross-sectional area of ​​the second sound channel N, and the specific relationship between each of them and the cross-sectional area of ​​the second sound cavity P. As long as the impedance can be changed during the process of sound being transmitted from the first sound channel M to the second sound cavity P and from the second sound cavity P to the second sound channel N, a sound-absorbing effect can be achieved, and the specific implementation method is not limited.

[0030] refer to Figure 8 In some embodiments, the cross-sectional areas of the second acoustic cavity P at different positions along the sound propagation direction may not be exactly the same. Thus, the sound will also experience changes in the cross-sectional area during the propagation of the sound in the second acoustic cavity P, thereby causing impedance changes and achieving a sound-absorbing effect to a certain extent.

[0031] Exemplarily, the cross-sectional area of ​​the second acoustic cavity P in the region close to the first acoustic channel M may be larger than or smaller than the cross-sectional area of ​​the region far from the first acoustic channel M; of course, the cross-sectional area of ​​the second acoustic cavity P in the region close to the second acoustic channel N may be larger than or smaller than the cross-sectional area of ​​the region far from the first acoustic channel M, etc. As long as the cross-sectional area of ​​the second acoustic cavity P at different positions along the propagation direction of the sound changes, it can cause impedance changes and play a sound-absorbing role, and the specific form is not limited.

[0032] In the embodiment of the present application, the first sound channel M, the second sound cavity P and the second sound channel N together constitute a reactive sound-absorbing structure, the reactive sound-absorbing structure mainly absorbing mid- and low-frequency sounds, but has limited absorbing effect on mid- and high-frequency sounds.

[0033] Based on the above situation, in the embodiment of the present application, the inner wall of the second sound cavity P may be provided with a sound absorbing member 30, such as Figure 1 As shown, the sound absorbing member 30 can absorb the mid-high frequency sound and achieve a certain silencing effect. Therefore, in the embodiment of the present application, by setting the sound absorbing member 30 on the inner wall of the second sound cavity P, it can cooperate with the resistive silencing structure to form an impedance composite silencing structure, so that it can almost silence the full-frequency sound, so as to alleviate the problem that the sound directly acts on the structural parts with insufficient strength and easy deformation, such as the battery cover of the electronic device, other sheet parts, etc., and causes the structural parts to vibrate.

[0034] Exemplarily, the sound absorbing member 30 may be made of a material with a plurality of sound absorbing holes, such as sound absorbing cotton, sound absorbing foam, sound absorbing powder brick, etc., which may be selected according to actual working conditions.

[0035] In some embodiments, the sound absorbing member 30 may be disposed on the inner cavity wall surface of the second acoustic cavity P extending along the sound propagation direction. For example, when the second acoustic cavity P is a circular cavity, the sound absorbing member 30 may be laid on the inner cavity wall of the circular cavity along the circumference of the circular cavity; when the second acoustic cavity P is a polygonal cavity, the sound absorbing member 30 may be laid on multiple inner cavity walls of the polygonal cavity along the circumference of the polygonal cavity. Of course, the sound absorbing member 30 may also be laid on at least part of the inner cavity wall of the second acoustic cavity P along the circumference.

[0036] refer to Figure 6 In some embodiments, the inner wall of the second acoustic cavity P may be provided with a Helmholtz hole 11. Based on the setting of the Helmholtz hole 11 and the Helmholtz resonance silencing principle, when sound propagates in the second acoustic cavity P, resonance may be generated locally to consume the energy of the sound, thereby playing a certain silencing role.

[0037] Among them, the inner wall of the second sound cavity P can be provided with a plurality of Helmholtz holes 11, and the plurality of Helmholtz holes 11 are arranged along the sound propagation direction. This can help to enhance the resonance of the sound in the second sound cavity P, thereby increasing the energy consumed by the sound and further improving the sound reduction effect.

[0038] In addition, the inner wall of the second acoustic cavity P may be provided with a plurality of Helmholtz holes 11, and the apertures of the plurality of Helmholtz holes 11 are not completely the same. Thus, the plurality of Helmholtz holes 11 with different apertures can also help to enhance the resonance of the sound in the second acoustic cavity P, thereby increasing the energy consumed by the sound and further improving the silencing effect. It should be noted here that by adjusting the aperture size of the Helmholtz hole 11, the broadband silencing effect can be improved.

[0039] refer to Figure 7 In some more specific embodiments, the Helmholtz hole 11 may include a first hole segment 111 and a second hole segment 112 that are connected, the end of the first hole segment 111 that is away from the second hole segment 112 is located at the inner wall of the second acoustic cavity P, the end of the second hole segment 112 that is away from the first hole segment 111 is closed, and the aperture of the first hole segment 111 is smaller than the aperture of the second hole segment 112. Based on this arrangement, the sound transmitted into the second acoustic cavity P can enter the closed second hole segment 112 through the first hole segment 111, that is, the sound enters the closed space of the Helmholtz hole 11, which will cause the air in the closed space to vibrate and generate resonance, or the vibrating air in the closed space will interfere with the sound in the second acoustic cavity P. Therefore, it can play a muffler role.

[0040] Continue to refer Figure 1 In some embodiments, the bracket assembly 04 may include a bracket body 10 and a cover plate 20. Among them, the bracket body 10 may be provided with a first groove, a second groove and a third groove on one side along its thickness direction, and the first groove, the second groove and the third groove are connected in sequence. The cover plate 20 is provided on one side along the thickness direction of the bracket body 10, and is respectively blocked in the notches of the first groove, the second groove and the third groove, thereby forming a first sound channel M, a second sound cavity P and a second sound channel N respectively. In this arrangement, a bracket assembly 04 with a resistant sound-absorbing structure can be formed by the cooperation of a cover plate 20 and the bracket body 10, and the manufacture of the bracket body 10 can be facilitated, and the cover plate 20 can be connected to the bracket body 10.

[0041] Optionally, a cover plate 20 and the bracket body 10 are detachably connected, such as by snap connection, screw connection, plug connection, hook connection, etc. Of course, the cover plate 20 and the bracket body 10 can also be fixedly connected, such as by welding, bonding, riveting, etc. In addition, the bracket body 10 can be an integrated structural member, which can be formed by stamping to form the bracket body 10 with the first groove, the second groove and the third groove, so as to improve manufacturing efficiency and shorten the manufacturing cycle.

[0042] refer to Figure 1 In other embodiments, the bracket body 10 may also be provided with a first through slot 12, a second through slot 13 and a third through slot 14 which are respectively penetrated along the thickness direction of the bracket body 10, and the first through slot 12, the second through slot 13 and the third through slot 14 are sequentially connected, and the cover plate 20 is provided on both sides along the thickness direction of the bracket body 10, and respectively blocks the notches at both ends of the first through slot 12, the second through slot 13 and the third through slot 14, so as to respectively form the first sound channel M, the second sound cavity P and the second sound channel N. In this arrangement, the bracket assembly 04 with a resistive sound-absorbing structure can also be formed by the cooperation of the two cover plates 20 and the bracket body 10, and the manufacture of the bracket body 10 can be facilitated, and the cover plate 20 and the bracket body 10 can be connected.

[0043] Optionally, the two cover plates 20 and the bracket body 10 can be detachably connected, such as by snap connection, screw connection, plug connection, hook connection, etc. Of course, the two cover plates 20 and the bracket body 10 can also be fixedly connected, such as by welding, bonding, riveting, etc. In addition, the bracket body 10 can be an integrated structural member, which can be formed by stamping to form the bracket body 10 with the first through slot 12, the second through slot 13 and the third through slot 14, so as to improve manufacturing efficiency and shorten the manufacturing cycle.

[0044] In other embodiments, the bracket assembly 04 may also be an integrated structure, that is, the bracket body 10 and the cover plate 20 are an integrated structure. In this case, the first sound channel M, the second sound channel N, and the second sound cavity P may be formed on the bracket assembly 04 by machining. Exemplarily, the first sound channel M, the second sound channel N, and the second sound cavity P may be machined on the bracket assembly 04 by milling, drilling, boring, etc.

[0045] refer to Figure 8In some embodiments, the bracket assembly 04 may include a plurality of first sound channels M, a plurality of second sound channels N, and a plurality of second sound cavities P. The plurality of first sound channels M are connected to the plurality of second sound cavities P in a one-to-one correspondence, and the plurality of second sound channels N are connected to the plurality of second sound cavities P in a one-to-one correspondence. Based on this configuration, a plurality of groups of resistive silencing paths may be formed on the bracket assembly 04. The coordination of the plurality of groups of resistive silencing paths may improve the silencing effect of the sound to a certain extent, further alleviating the problem that the sound emitted by the speaker 03 is directly transmitted to the battery cover of the electronic device, causing the battery cover to vibrate.

[0046] Optionally, the shapes, settings, etc. of the multiple groups of resistive silencer paths may be the same or different, and may be specifically set according to actual working conditions.

[0047] Taking into account that the mainboard 02 is installed to the frame 01 through the bracket assembly 04, in order to avoid installation interference between the mainboard 02 and the speaker 03, the mainboard 02 can be provided with an avoidance hole 021, and the speaker 03 is arranged in the frame 01, and at least a part of the speaker 03 is inserted into the avoidance hole 021, thereby effectively preventing the speaker 03 from occupying the position and interfering with the installation of the mainboard 02 to the frame 01, thereby ensuring the normal installation of the mainboard 02 and the speaker 03.

[0048] In order to accommodate the speaker 03 and transmit the sound generated by the speaker 03, in the embodiment of the present application, the bracket assembly 04 may be provided with a receiving groove 15, such as Figure 4 , Figure 5 , Figure 6 and Figure 8 The notch of the receiving groove 15 is snap-fitted with the surface of the main board 02, and at least part of the speaker 03 protrudes into the receiving groove 15 through the avoidance hole 021. In this way, the frame 01, the bracket assembly 04, the main board 02 and the speaker 03 can together form a first sound cavity Q.

[0049] Based on the above arrangement, by setting the accommodating groove 15, space can be provided for accommodating the speaker 03, and installation interference between the bracket assembly 04 and the speaker 03 can be prevented. In addition, the sound emitted by the speaker 03 can also diffuse and propagate in the first sound cavity Q, and be transmitted to the first sound channel M through the second sound cavity, that is, transmitted to the resistive sound-absorbing structure, so that the sound can be silenced by the resistive sound-absorbing structure.

[0050] Optionally, the seal 05 can also form a flexible connection between the notch of the receiving groove 15 and the main board 02, which can alleviate the problem of the bracket assembly 04 squeezing the main board 02 and causing damage to the main board 02 to a certain extent.

[0051] In the embodiment of the present application, the propagation path of the sound is: The sound emitted by the speaker 03 first enters the first sound cavity Q, then enters the first sound channel M from the first sound cavity Q, then enters the second sound cavity P from the first sound channel M, then enters the second sound channel N from the second sound cavity P, and finally enters the back cavity formed by the battery cover through the second sound channel N. In the process of the sound passing through the first sound channel M, the second sound cavity P and the second sound channel N, it will be subjected to the reactive silencing effect, so that the energy of the sound is attenuated. Therefore, when the sound after silencing is transmitted to the battery cover again, the vibration of the battery cover can be reduced, thereby improving the user experience.

[0052] Considering that the silencing performance of the resistant silencing structure is related to the shape of the resistant silencing structure, the size, position, number, cross-sectional area, etc. of the inlet or outlet, in actual situations, the following steps can be followed for design, specifically: 1) Based on simulation or testing, clarify the main frequency range of battery cover vibration and the vibration characteristics of the battery cover; 2) Determine the main mute frequency based on the vibration characteristics of the battery cover; 3) According to the main sound elimination frequency, combined with the actual space and layout of the components in the electronic device, the number, position, shape, etc. of the second sound cavity P of the reactive sound elimination structure of the bracket assembly 04 are determined by calculation to maximize the sound elimination effect of the main sound elimination frequency part; 4) Determine whether to set a sound absorbing member 30 or a Helmholtz hole 11 in the second acoustic cavity P of the bracket assembly 04 based on factors such as cost, space, and application effect.

[0053] In order to further illustrate the effect of the resistant sound-absorbing structure on the vibration reduction effect of the battery cover, the Figure 5 and Figure 8 Two forms of silencing have a shock-absorbing effect on the battery cover. Fig. 9 It can be seen that the vibration of the battery cover is significantly improved in the two methods with the resistant silencing structure compared with the method without the resistant silencing structure, and Figure 8 The second silencing method has a better silencing effect than Figure 5 The first silencing method has the same silencing effect as the previous one.

[0054] In summary, the embodiment of the present application provides a resistant silencing structure on the bracket assembly 04 to silence the sound emitted by the speaker 03, so that the energy of the sound can be attenuated to prevent the sound from directly acting on the battery cover of the electronic device, thereby improving the problem of excessive vibration of the battery cover of the electronic device due to the sound of the speaker 03. In addition, by providing the first sound channel M, the second sound cavity P and the second sound channel N, and connecting the first sound channel M with the rear sound cavity (i.e., the first sound cavity Q) of the speaker 03 to expand the rear sound cavity of the speaker 03, it is beneficial to improve the low-frequency effect of the speaker 03. In addition, by providing the first sound channel M, the second sound cavity P and the second sound channel N on the bracket assembly 04, the overall thickness of the electronic device will not be increased, and the stacking of structural parts is facilitated.

[0055] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: Frame, motherboard, speakers, bracket assembly and seals; The bracket assembly is arranged on the frame, the mainboard is arranged between the bracket assembly and the frame, the sealing member is arranged between the mainboard and the bracket assembly, the speaker is arranged on the frame, and the frame, the mainboard, the bracket assembly, the sealing member and the speaker together form a first sound cavity; The bracket assembly is provided with a first sound channel, a second sound channel and a second sound cavity, the first sound channel is connected to the first sound cavity, the second sound channel is used to output sound, the second sound cavity is connected between the first sound channel and the second sound channel, and in a direction perpendicular to the sound propagation direction, the cross-sectional area of ​​the first sound channel is different from the cross-sectional area of ​​the second sound cavity, and the cross-sectional area of ​​the second sound channel is different from the cross-sectional area of ​​the second sound cavity.

2. The electronic device according to claim 1, characterized in that: The cross-sectional area of ​​the first acoustic channel is smaller than the cross-sectional area of ​​at least a portion of the second acoustic cavity; And / or, a cross-sectional area of ​​the second acoustic channel is smaller than a cross-sectional area of ​​at least part of the second acoustic cavity.

3. The electronic device according to claim 1, characterized in that: Along the sound propagation direction, the cross-sectional areas of the second acoustic cavity at different positions are not completely the same.

4. The electronic device according to claim 1, characterized in that: The inner cavity wall of the second sound cavity is provided with a sound absorbing member.

5. The electronic device according to claim 1, characterized in that: The inner cavity wall of the second acoustic cavity is provided with a Helmholtz hole.

6. The electronic device according to claim 5, characterized in that: The inner cavity wall of the second sound cavity is provided with a plurality of the Helmholtz holes, and the plurality of the Helmholtz holes are arranged along the sound propagation direction; And / or, the inner cavity wall of the second acoustic cavity is provided with a plurality of the Helmholtz holes, and the apertures of the plurality of the Helmholtz holes are not completely the same.

7. The electronic device according to claim 5, characterized in that: The Helmholtz hole comprises a first hole segment and a second hole segment which are connected, and the hole diameter of the first hole segment is smaller than the hole diameter of the second hole segment; One end of the first hole segment facing away from the second hole segment is located at the inner wall of the second acoustic cavity, and one end of the second hole segment facing away from the first hole segment is closed.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The bracket assembly includes a bracket body and a cover plate; The bracket body is provided with a first groove, a second groove and a third groove on one side along the thickness direction of the bracket body, respectively, and the first groove, the second groove and the third groove are connected in sequence, and the cover plate is provided on one side along the thickness direction of the bracket body, and is respectively blocked at the notches of the first groove, the second groove and the third groove, so as to form the first sound channel, the second sound cavity and the second sound channel respectively; Alternatively, the bracket body is provided with a first through groove, a second through groove and a third through groove respectively penetrating along the thickness direction of the bracket body, and the first through groove, the second through groove and the third through groove are connected in sequence, and the cover plate is provided on both sides along the thickness direction of the bracket body, and respectively blocks the notches at both ends of the first through groove, the second through groove and the third through groove to respectively form the first sound channel, the second sound cavity and the second sound channel.

9. The electronic device according to any one of claims 1 to 7, characterized in that: The support assembly is provided with a plurality of the first sound channels, a plurality of the second sound channels and a plurality of the second sound cavities; The plurality of first sound channels are connected to the plurality of second sound cavities in a one-to-one correspondence, and the plurality of second sound channels are connected to the plurality of second sound cavities in a one-to-one correspondence.

10. The electronic device according to claim 1, characterized in that: The bracket assembly is further provided with a receiving groove, the notch of the receiving groove is buckled and connected with the surface of the mainboard, and the sealing member is arranged around the notch of the receiving groove; The mainboard is provided with an avoidance hole, and at least a portion of the speaker protrudes into the accommodating groove through the avoidance hole.

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