Flexible circuit board for vehicle-mounted display panel and packaging method thereof

Abstract

The invention provides a flexible circuit board for a vehicle-mounted display panel and a packaging method thereof, and the flexible circuit board comprises an insulating substrate layer which comprises a first region and second regions, and the second regions are at least located at one end of the first region and located at the two opposite sides of the first region; a conductive electrode disposed on the first region; the insulating covering layer is arranged above the conducting electrodes, the conducting electrodes at the two ends of the first area are exposed, and the insulating covering layer and the second area are partially overlapped; the sealant is arranged at the end, overlapped with the second area, of the insulation covering layer, and the sealant is at least arranged between the insulation covering layer and the conduction electrode and between the second area and the conduction electrode; and the release film covers the second areas and the first area between the second areas and is adhered to the sealant. According to the flexible circuit board for the vehicle-mounted display panel and the packaging method of the flexible circuit board, the sealing effect and the external force resistance between the display panel and the flexible circuit board can be improved.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuits, and in particular to a flexible circuit board for a vehicle-mounted display panel and a packaging method thereof. Background Art

[0002] With the development of intelligent automobiles, the uses of in-vehicle display panels are becoming more diverse. For example, they will gradually penetrate into central control screens, instrument panels, electronic rearview mirrors, and rear entertainment screens. However, in the packaging process of in-vehicle display panels, there are problems such as poor water and oxygen barrier capabilities, limited protection capabilities, serious color cross-talk, and high packaging costs, which limit the quality of in-vehicle display panels, affect the application effect in automobiles, and shorten the service life. This leads to poor customer experience and is not conducive to the practical application and marketization of products. Summary of the invention

[0003] In view of the shortcomings of the prior art mentioned above, an object of the present invention is to provide a flexible circuit board for a vehicle-mounted display panel and a packaging method thereof, which can improve the sealing of the binding between the flexible circuit board and the display panel, reduce the risk of water vapor erosion, and reduce production costs.

[0004] To solve the above technical problems, the present invention is implemented through the following technical solutions.

[0005] The present invention provides a flexible circuit board for a vehicle-mounted display panel, comprising:

[0006] An insulating substrate layer, comprising a first region and a second region, wherein the second region is located at least at one end of the first region and at two opposite sides of the first region;

[0007] A conducting electrode, disposed on the first region;

[0008] an insulating cover layer, disposed above the conduction electrode, exposing the conduction electrode at two ends of the first region, and the insulating cover layer partially overlaps with the second region;

[0009] A sealant, at an end where the insulating cover layer and the second region overlap, the sealant being disposed at least between the insulating cover layer and the conductive electrode, and between the second region and the conductive electrode; and

[0010] The release film covers the second area and the first area between the second areas and is adhered to the sealant.

[0011] In an embodiment of the present invention, the second area is located at two ends of the first area and at two opposite sides of the first area.

[0012] In one embodiment of the present invention, the material of the insulating substrate layer includes one or a combination of polyimide film, polyvinyl alcohol film, polytetrafluoroethylene film or polyester film.

[0013] In one embodiment of the present invention, the thickness of the insulating substrate layer is 10-150 μm.

[0014] In one embodiment of the present invention, the material of the insulating cover layer includes one or a combination of polyimide film, polyvinyl alcohol film, polytetrafluoroethylene film or polyester film.

[0015] In one embodiment of the present invention, the sealant is located at one end where the insulating cover layer overlaps with the second region, between the insulating cover layer and the conductive electrode, between the second region and the conductive electrode, and on a side of the conductive electrode away from the insulating cover layer.

[0016] In one embodiment of the present invention, the sealant is of a pressure-curing type, an ultraviolet-curing type or a temperature-curing type.

[0017] In one embodiment of the present invention, the release film is a matte release film, a fluoroplastic release film or a fluorocarbon release film.

[0018] The present invention also discloses a packaging method for a flexible circuit board for a vehicle-mounted display panel, which comprises at least the following steps:

[0019] Providing a display panel, the display panel comprising a panel electrode and an electrode exposed area;

[0020] Providing an insulating substrate layer, comprising a first region and a second region, wherein the second region is at least located at one end of the first region and at two opposite sides of the first region;

[0021] forming a conducting electrode on the first region;

[0022] forming an insulating covering layer on a portion of the conducting electrode, wherein the insulating covering layer exposes the conducting electrode at two ends of the first region, and the insulating covering layer partially overlaps with the second region;

[0023] Disposing a sealant between the insulating cover layer and the conducting electrode, and between the second region and the conducting electrode;

[0024] Covering the second area and the first area between the second areas with a release film, and the release film is adhered to the sealant;

[0025] removing the release film;

[0026] Aligning and pressing the conducting electrode and the panel electrode; and

[0027] The sealant is cured.

[0028] In one embodiment of the present invention, the packaging method further includes:

[0029] removing the release film;

[0030] Applying positive resist on the exposed area of ​​the electrode;

[0031] The conducting electrode is aligned with the panel electrode and pressed; and

[0032] The sealant is cured.

[0033] In summary, the present invention provides a flexible circuit board for a vehicle-mounted display panel and a packaging method thereof, which improves the sealing between the flexible circuit board and the display panel, reduces the risk of water vapor erosion, and reduces production costs. Moreover, the provision of the insulating substrate layer improves the ability of the flexible circuit board to resist external forces, avoiding problems such as tearing of the flexible circuit board and damage to the circuit.

[0034] Of course, any manner of implementing the present invention does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0036] Figure 1 FIG. 4 is a schematic diagram of an insulating substrate layer in one embodiment of the present invention.

[0037] Figure 2 FIG. 1 is a schematic diagram of forming a conducting electrode in a first region according to an embodiment of the present invention.

[0038] Figure 3 It is a schematic diagram of providing an insulating covering layer and a sealant in one embodiment of the present invention.

[0039] Figure 4 Schematic diagram of a complete flexible circuit board after a release film is provided in one embodiment of the present invention.

[0040] Figure 5 FIG. 4 is a schematic diagram of a flexible circuit board in another embodiment of the present invention.

[0041] Figure 6 FIG. 4 is a schematic diagram of a flexible circuit board in another embodiment of the present invention.

[0042] Figure 7 FIG. 4 is a schematic diagram of a flexible circuit board in another embodiment of the present invention.

[0043] Figure 8 FIG. 4 is a schematic diagram of a display panel according to an embodiment of the present invention.

[0044] Description of labels:

[0045] 100, flexible circuit board; 10, insulating substrate layer; 11, conductive electrode; 12, insulating covering layer; 13, sealant; 14, release film; 101, first area; 102, second area; 200, display panel; 20, electrode exposed area; 21, panel electrode. DETAILED DESCRIPTION

[0046] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0047] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0048] In the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, if the terms "first" and "second" appear, they are only used for description and distinction purposes, and cannot be understood as indicating or implying relative importance.

[0049] The present invention provides a flexible circuit board for a vehicle-mounted display panel and a packaging method thereof, which can improve the sealing effect between the flexible circuit board and the display panel, reduce the risk of water vapor erosion, and reduce production costs. In addition, the provision of an insulating substrate layer improves the ability of the flexible circuit board to resist external forces, avoiding problems such as tearing and circuit damage.

[0050] See also Figures 4 to 7As shown, in one embodiment of the present invention, the present invention provides a flexible circuit board 100 for a vehicle display panel 200, including an insulating substrate layer 10, a conductive electrode 11, an insulating covering layer 12, a sealant 13 and a release film 14, wherein the insulating substrate layer 10 includes a first area 101 and a second area 102, and the second area 102 is at least located at one end of the first area 101 and is located on two opposite sides of the first area 101.

[0051] See also Figure 8 As shown, in one embodiment of the present invention, the display panel 200 includes an electrode exposed area 20 and a panel electrode 21, which are used to connect to the flexible circuit board 100 to achieve circuit / signal transmission.

[0052] See also Figure 1 As shown, in one embodiment of the present invention, an insulating substrate layer 10 is used as the bottom layer of the flexible circuit board 100 to provide support for subsequent components. The material of the insulating substrate layer 10 includes, for example, polyimide film, polyvinyl alcohol film, polytetrafluoroethylene film or polyester film, so as to improve the insulation, heat resistance, conformal performance, thickness, mechanical properties and electrical properties of the bottom layer of the flexible circuit board 100 to meet the use requirements of the flexible circuit board 100. The material thickness of the insulating substrate layer 10 is, for example, 10-150 μm, and for example, 12.5, 25, 50, 75 or 125 μm. The insulating substrate layer 10 includes a first region 101 and a second region 102. In one embodiment of the present invention, the second region 102 is, for example, located at one end of the first region 101 and located on opposite sides of the first region 101.

[0053] See also Figure 6 to Figure 7 As shown, in another embodiment of the present invention, the insulating substrate layer 10 includes a first region 101 and a second region 102 , wherein the second region 102 is located at two ends of the first region 101 and at two opposite sides of the first region 101 .

[0054] See also Figure 2 As shown, in one embodiment of the present invention, a conducting electrode 11 is formed on the first area 101 to connect the circuit / signal of the display panel 200 with the circuit / signal on the flexible circuit board 100. The conducting electrode 11 includes a conductive copper foil layer covering the insulating substrate layer 10 to realize circuit / signal transmission. In this embodiment, the conductive copper foil is, for example, a rolled copper foil or an electrolytic copper foil. The thickness of the copper foil is, for example, 18-110 μm, and for example, 18, 35, 70 or 105 μm. The conductive copper foil is, for example, a single layer, a double layer or a multilayer, wherein the double-layer conductive layer forms a conductive path through a metallized hole to meet the design and use functions of flexibility. The multilayer conductive layer with high reliability and thermal conductivity is obtained by pressing three or more conductive layers, and the metallized holes are formed by drilling and electroplating to form a conductive path between different conductive layers.

[0055] See also Figure 3 As shown, in one embodiment of the present invention, the insulating cover layer 12 is disposed above a portion of the conductive electrode 11 to protect the conductive electrode 11 from dust and water vapor and to increase the strength of the insulating substrate layer 10. In this embodiment, the insulating cover layer 12 exposes the conductive electrodes 11 at both ends of the first region 101, and the insulating cover layer 12 partially overlaps the second region 102. The insulating cover layer 12 is made of, for example, a polyimide film, a polyvinyl alcohol film, a polytetrafluoroethylene film, or a polyester film, and has a thickness of, for example, 12.5-30 μm, and for example, 12.5 or 25 μm.

[0056] See also Figure 3 As shown, in one embodiment of the present invention, the sealant 13 is arranged between the insulating covering layer 12 and the conductive electrode 11, between the second area 102 and the conductive electrode 11, and on the side of the conductive electrode 11 away from the insulating covering layer 12, and a ring-shaped sealant 13 is formed around the first area 101 between the second areas 102 to achieve sealed binding of the flexible circuit board 100 and the display panel 200.

[0057] Please refer to 5 to Figure 6 As shown, in another embodiment of the present invention, the sealant 13 is arranged between the insulating cover layer 12 and the conducting electrode 11, and between the second area 102 and the conducting electrode 11, and forms a C-shaped sealant 13 around the first area 101 between the second area 102. In this embodiment, the type of the sealant 13 is, for example, pressure-curing type, ultraviolet-curing type or temperature-curing type. Among them, the pressure-curing sealant is, for example, made of synthetic rubber such as styrene-butadiene rubber, polyisoprene rubber, polyisobutylene, butyl rubber, chloroprene rubber or nitrile rubber as the main body, and is prepared with additives such as tackifying resin, softener, antioxidant, etc. The ultraviolet-curing sealant is, for example, made of prepolymers such as epoxy acrylate, polyurethane acrylate, polyether acrylate, polyester acrylate or acrylic resin, and monofunctional, difunctional, trifunctional or multifunctional monomers, and initiators such as 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxycyclohexyl phenyl ketone or benzophenone. Temperature curing sealants include, for example, epoxy resins, polyurethanes, or polysulfide adhesives.

[0058] See also Figure 4 As shown, in one embodiment of the present invention, the release film 14 covers the second area 102 and the first area 101 between the second area 102, and the release film 14 is adhered to the sealant 13. The release film 14 has a good release effect and is easy to peel off, and can play a role in isolating the viscosity of the sealant 13 and protecting the sealant 13. The release film 14 is, for example, a matte release film, a fluoroplastic separation film, or a fluoroelastomer release film, and the thickness is, for example, 12-100 μm.

[0059] See also Figure 4 and Figure 8 As shown, in one embodiment of the present invention, after removing the release film 14, the conducting electrode 11 is attached to the panel electrode 21, and the sealant 13 at one end of the flexible circuit board 100 is properly aligned with the display panel 200 and pressed, and then pressure, temperature or ultraviolet light is applied according to the type of the sealant 13 to cure the sealant 13. In this embodiment, the sealant 13 is, for example, a temperature-curing epoxy resin. First, after the sealant 13 is properly aligned and pressed with the display panel 200, it is left at room temperature for, for example, 1-2 hours, waiting for the surface to dry and complete preliminary curing. Then, it is cured at a certain temperature, for example, 60-150°C, for example, for 1-4 hours to complete complete curing.

[0060] See also Figures 5 to 8 As shown, the present invention also provides a packaging method for a flexible circuit board 100 to achieve sealing and binding of the flexible circuit board 100 and the display panel 200 .

[0061] See also Figure 5 and Figure 8 As shown, in another embodiment of the present invention, the release film 14 is removed, the electrode exposed area 20 is coated with positive glue, and after the conductive electrode 11 is bonded to the panel electrode 21, the sealant 13 at one end of the flexible circuit board 100 is correctly aligned and pressed with the display panel 200, and then pressure, temperature or ultraviolet rays are applied according to the type of the sealant 13 to cure the sealant 13.

[0062] See also Figure 6 and Figure 8 As shown, in another embodiment of the present invention, the release film 14 is removed, the electrode exposed area 20 is coated with positive glue, and after the conductive electrode 11 is bonded to the panel electrode 21, the sealant 13 at both ends of the flexible circuit board 100 is correctly aligned and pressed with the display panel 200, and then pressure, temperature or ultraviolet rays are applied according to the type of the sealant 13 to cure the sealant 13.

[0063] See also Figure 7 and Figure 8 As shown, in another embodiment of the present invention, after the release film 14 is removed and the conductive electrode 11 is bonded to the panel electrode 21, the sealant 13 at both ends of the flexible circuit board 100 is correctly aligned and pressed with the display panel 200, and then pressure, temperature or ultraviolet rays are applied according to the type of the sealant 13 to cure the sealant 13.

[0064] In summary, the present invention provides a flexible circuit board for a vehicle-mounted display panel and a packaging method thereof, firstly forming an insulating substrate layer as the bottom layer of the flexible circuit board, forming a conducting electrode on the first area of ​​the insulating substrate layer, and setting an insulating covering layer above part of the conducting electrode, and then setting a sealant at least between the insulating covering layer and the conducting electrode, and between the second area and the conducting electrode, and then covering the second area and the first area between the second area with a release film to isolate and protect the sealant. After removing the release film, the conducting electrode is bonded to the panel electrode, and after the sealant is correctly aligned and pressed with the display panel, pressure, temperature or ultraviolet light is applied according to the type of sealant to cure the sealant. Through the above-mentioned packaging method, the sealing of the binding between the flexible circuit board and the display panel is improved, the risk of water vapor erosion is reduced, and at the same time, the use of positive glue and reverse glue and related supporting equipment in the production process is reduced, the complexity of the process is reduced, and the production cost is reduced. Moreover, the setting of the insulating substrate layer improves the ability of the flexible circuit board to resist external forces, and avoids problems such as tearing of the flexible circuit board and damage to the circuit.

[0065] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A flexible circuit board for a vehicle display panel, characterized in that: include: An insulating substrate layer, comprising a first region and a second region, wherein the second region is located at least at one end of the first region and at two opposite sides of the first region; A conducting electrode, disposed on the first region; an insulating cover layer, disposed above the conduction electrode, exposing the conduction electrode at two ends of the first region, and the insulating cover layer partially overlaps with the second region; A sealant, at an end where the insulating cover layer and the second region overlap, the sealant being disposed at least between the insulating cover layer and the conductive electrode, and between the second region and the conductive electrode; as well as The release film covers the second area and the first area between the second areas and is adhered to the sealant.

2. The flexible circuit board according to claim 1, characterized in that: The second area is located at two ends of the first area and at two opposite sides of the first area.

3. The flexible circuit board according to claim 1, characterized in that: The material of the insulating substrate layer includes one or a combination of polyimide film, polyvinyl alcohol film, polytetrafluoroethylene film or polyester film.

4. The flexible circuit board according to claim 1, characterized in that: The thickness of the insulating substrate layer is 10-150 μm.

5. The flexible circuit board according to claim 1, characterized in that: The material of the insulating covering layer includes one or a combination of polyimide film, polyvinyl alcohol film, polytetrafluoroethylene film or polyester film.

6. The flexible circuit board according to claim 1, characterized in that: The sealant is located at one end where the insulating cover layer overlaps with the second region, and is disposed between the insulating cover layer and the conducting electrode, between the second region and the conducting electrode, and on a side of the conducting electrode away from the insulating cover layer.

7. The flexible circuit board according to claim 1, characterized in that: The sealant is of a pressure-curing type, an ultraviolet-curing type or a temperature-curing type.

8. The flexible circuit board according to claim 1, characterized in that: The release film is one of a matte release film, a fluoroplastic release film or a fluorocarbon release film.

9. A packaging method for a flexible circuit board for a vehicle-mounted display panel, characterized in that: At least the following steps are included: Providing a display panel, the display panel comprising a panel electrode and an electrode exposed area; Providing an insulating substrate layer, comprising a first region and a second region, wherein the second region is at least located at one end of the first region and at two opposite sides of the first region; forming a conducting electrode on the first region; forming an insulating covering layer on a portion of the conducting electrode, wherein the insulating covering layer exposes the conducting electrode at two ends of the first region, and the insulating covering layer partially overlaps with the second region; Disposing a sealant between the insulating cover layer and the conducting electrode, and between the second region and the conducting electrode; Covering the second area and the first area between the second areas with a release film, wherein the release film is adhered to the sealant; removing the release film; Aligning and pressing the conducting electrode and the panel electrode; as well as The sealant is cured.

10. The packaging method of a flexible circuit board for a vehicle-mounted display panel according to claim 9, characterized in that: The packaging method further comprises: removing the release film; Applying positive resist on the exposed area of ​​the electrode; The conducting electrode is aligned with the panel electrode and pressed; and The sealant is cured.

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