Electronic device

Abstract

The invention provides electronic equipment, and belongs to the technical field of electronic equipment, and the electronic equipment comprises a circuit board assembly which comprises a first plate body and a cavity located at one side of the first plate body; the chip is arranged on the other side of the first plate body; at least part of the cavity is filled with the first heat conduction material, and the first heat conduction material and the chip are arranged on the two sides of the first plate body respectively; and the first heat conduction assembly is arranged on the circuit board assembly, and the first heat conduction material transfers heat to the first heat conduction assembly.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] In the related art, the chip performance of electronic devices is getting stronger and stronger, and the heat generated is getting higher and higher. Excessive heat generation of the chip or circuit board may cause the solder joints of the chip to open, thereby causing failure of the electronic device. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide an electronic device that can effectively solve the technical problem of open solder joint failure caused by excessive heat generation of chips or circuit boards of electronic devices.

[0004] An embodiment of the present application provides an electronic device, including:

[0005] A circuit board assembly, the circuit board assembly comprising a first board body and a cavity located on one side of the first board body;

[0006] A chip is arranged on the other side of the first plate;

[0007] A first heat-conducting material is filled in at least a portion of the cavity, and the first heat-conducting material and the chip are respectively arranged on two sides of the first plate body;

[0008] The first heat-conducting component is arranged on the circuit board component, and the first heat-conducting material transfers heat to the first heat-conducting component.

[0009] In an embodiment of the present application, an electronic device includes a circuit board assembly, a chip, a first heat-conducting material and a first heat-conducting component. The circuit board assembly includes a first board body, and the first board body is provided with electronic components. In order to reduce interference, it is necessary to provide a shield for the first board body through a shielding cover or other board bodies, thereby forming a cavity. The chip is arranged on the first board body, and the first heat-conducting material is filled in the cavity. The first heat-conducting material and the chip are respectively located on two opposite sides of the first board body, and the positions of the first heat-conducting material and the first chip correspond. The first heat-conducting component is in contact with the circuit board assembly, and then the heat emitted by the chip or the circuit board will be conducted to the first heat-conducting material through the first circuit board, and the first heat-conducting material will then conduct the heat to the first heat-conducting component. The way in which the first heat-conducting material transfers heat to the first heat-conducting component can be direct transfer or indirect transfer, thereby improving the heat dissipation effect of the chip, and reducing the heat accumulation at the connection between the chip and the circuit board assembly, reducing the possibility of open welding between the chip and the circuit board assembly, and improving the reliability of the connection between the chip and the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0012] Figure 2 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0013] Figure 3 A schematic diagram of a third heat conducting member in an electronic device provided by an embodiment of the present application is shown;

[0014] Figure 4 A schematic diagram of a third heat conducting member in an electronic device provided by an embodiment of the present application is shown;

[0015] Figure 5 A cross-sectional view of an electronic device provided by one embodiment of the present application is shown;

[0016] Figure 6 A schematic diagram of a sixth heat conducting member in an electronic device provided by an embodiment of the present application is shown;

[0017] Figure 7 A schematic diagram of a sixth heat conducting member in an electronic device provided by an embodiment of the present application is shown;

[0018] Figure 8 A cross-sectional view of an electronic device provided by an embodiment of the present application is shown.

[0019] Figures 1 to 8 Reference numerals:

[0020] 100 electronic device, 110 circuit board assembly, 112 first board body, 1122 power distribution network, 114 chamber, 116 first shielding cover, 118 second board body, 120 second shielding cover, 122 third board body, 124 fourth board body, 130 chip, 140 first thermally conductive material, 150 first thermally conductive assembly, 1502 circuit board bracket, 1504 heat sink, 152 first thermally conductive member, 154 second thermally conductive member, 156 third thermally conductive member, 158 fourth thermally conductive member, 160 fifth thermally conductive member, 162 sixth thermally conductive member, 164 seventh thermally conductive member, 166 eighth thermally conductive member, 168 third thermally conductive material, 170 bracket, 172 bracket body, 174 tenth thermally conductive member, 180 third shielding cover, 182 shielding cover body, 184 ninth thermally conductive member, 186 second thermally conductive material, 190 screen. DETAILED DESCRIPTION

[0021] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0022] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0023] In the description of the present application, it should be understood that the terms "upper", "inner", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] Combine the following Figures 1 to 8 An electronic device 100 according to an embodiment of the present application is described. Figure 1 , Figure 2 , Figure 5 and Figure 8 The arrows in the diagram indicate how heat is transferred.

[0026] like Figure 1 , Figure 2 , Figure 5 and Figure 8As shown, an embodiment of the present application provides an electronic device 100, including: a circuit board assembly 110, the circuit board assembly 110 includes a first board body 112 and a cavity 114 located on one side of the first board body 112; a chip 130, arranged on the other side of the first board body 112; a first thermally conductive material 140, filling at least a portion of the cavity 114, the first thermally conductive material 140 and the chip 130 are respectively arranged on both sides of the first board body 112; a first thermally conductive component 150, arranged on the circuit board assembly 110, and the first thermally conductive material 140 transfers heat to the first thermally conductive component 150.

[0027] In the embodiment of the present application, the electronic device 100 includes a circuit board assembly 110, a chip 130, a first heat-conducting material 140 and a first heat-conducting assembly 150. The circuit board assembly 110 includes a first board 112. The first board 112 is provided with electronic components. In order to reduce interference, it is necessary to provide a shield for the first board 112 through a shielding cover or other board, thereby forming a chamber 114. The chip 130 is provided on the first board 112, and the first heat-conducting material 140 is filled in the chamber 114. The first heat-conducting material 140 and the chip 130 are respectively located on opposite sides of the first board 112. The positions of the first heat-conducting material 140 and the first chip 130 are relatively The first heat-conducting component 150 is in contact with the circuit board assembly 110, and then the heat emitted by the chip 130 or the first board 112 is conducted to the first heat-conducting material 140, and the first heat-conducting material 140 then conducts the heat to the first heat-conducting component 150. The first heat-conducting material 140 transfers heat to the first heat-conducting component 150 directly or indirectly, thereby improving the heat dissipation effect of the chip 130, and reducing the heat accumulation at the connection between the chip 130 and the circuit board assembly 110, reducing the possibility of open welding between the chip 130 and the circuit board assembly 110, and improving the reliability of the connection between the chip 130 and the circuit board assembly 110.

[0028] The chamber 114 is a shielding cavity surrounded by a shielding cover or other plates to reduce interference of electrical components on the first plate 112. The first thermal conductive material 140 may fill the projection area of ​​the first chip 130 on the side of the first plate 112 away from the first chip 130.

[0029] The chip 130 may be a system on chip (SoC) or other chips, and other chips may be charging chips, antenna chips or image processing chips, etc. The present application can improve the heat dissipation effect of the chip 130 by adding the first thermal conductive material 140, so that the temperature of the chip 130 or the first board 112 drops rapidly, improve the thermal stress fatigue of the solder joints between the chip 130 and the first board 112, and reduce the possibility of solder joints cracking due to thermal stress. Specifically, solder joints crack due to thermal stress because of temperature differences when heated, inconsistent expansion and contraction deformation of various materials, and stress generated by mutual constraints. The solder ball is repeatedly heated and cooled for a long time, resulting in plastic deformation and eventual fracture and failure. The present application quickly extracts the heat generated by the chip 130 through the first thermal conductive material 140, thereby reducing the amplitude and frequency of heating and cooling of the solder ball.

[0030] like Figure 1 As shown, as a possible implementation, the circuit board assembly 110 also includes: a first shielding cover 116, which is arranged on one side of the first board body 112, the first board body 112 and the first shielding cover 116 enclose a chamber 114, the first thermally conductive material 140 is in contact with the first board body 112 and the first shielding cover 116, and the first thermally conductive component 150 is arranged on the side of the first shielding cover 116 away from the first board body 112.

[0031] Specifically, the circuit board assembly 110 further includes a first shielding cover 116, which is disposed on one side of the first board body 112, and the first shielding cover 116 and the first board body 112 enclose a chamber 114, and a first thermally conductive material 140 is filled between the first shielding cover 116 and the first board body 112, and the first thermally conductive material 140 is in contact with the first board body 112, and the first thermally conductive material 140 is also in contact with the first shielding cover 116, and a first thermally conductive component 150 is disposed on the first shielding cover 116, The first heat-conducting component 150 is located on a side of the first shielding cover 116 away from the first plate body 112, so that the heat generated by the chip 130 or the first plate body 112 can be transferred to the first heat-conducting material 140, and the first heat-conducting material 140 transfers the heat to the first shielding cover 116, and the first shielding cover 116 transfers the heat to the first heat-conducting component 150. That is, the first heat-conducting material 140 indirectly transfers the heat to the first heat-conducting component 150, thereby achieving heat dissipation and improving the heat dissipation effect on the chip 130.

[0032] As mentioned above, for a conventional double-sided 2D stacked circuit board, the first thermally conductive material 140 is filled in the projection area of ​​the chip 130, and the first thermally conductive material 140 is filled between the first board body 112 and the first shielding cover 116. The top of the first shielding cover 116 is connected to the metal of the circuit board bracket 1502 to conduct heat through the heat sink 1504, thereby reducing the problem of fracture of the solder joints of the chip 130 and the first board body 112 due to thermal stress fatigue.

[0033] The first heat-conducting component 150 includes at least one of a circuit board bracket 1502 and a heat sink 1504. The metal portion of the circuit board bracket 1502 is in contact with the circuit board assembly 110, that is, the circuit board bracket 1502 is connected to the first shielding cover 116, the second shielding cover 120, the third board body 122 or the fourth board body 124, and the heat sink 1504 is in contact with the metal portion of the circuit board bracket 1502, thereby conducting heat out. The heat sink 1504 can be a graphite heat dissipation film (Pyrolytic Graphite Sheet, PGS), a copper heat dissipation film or a steel heat dissipation film, etc.

[0034] like Figure 1 As shown, as a possible implementation, the first heat conducting component 150 is in contact with a side of the first shielding cover 116 facing away from the first board body 112 .

[0035] Specifically, the first heat conducting component 150 is in contact with a side of the first shielding cover 116 facing away from the first board 112 , thereby shortening the heat transfer path, improving the heat transfer efficiency, and improving the heat dissipation effect on the chip 130 .

[0036] like Figure 2 As shown, as a possible implementation, the circuit board assembly 110 also includes: a second board 118, which is arranged on one side of the first board 112, the first board 112 and the second board 118 enclose a chamber 114, and the first thermally conductive material 140 is in contact with the first board 112 and the second board 118; a second shielding cover 120, which is arranged on the side of the second board 118 away from the first board 112, and the first thermally conductive component 150 is in contact with the second shielding cover 120; the first thermally conductive component 150 includes: a first thermally conductive member 152, which is arranged between the second board 118 and the second shielding cover 120; and a second thermally conductive member 154, which is arranged on the side of the second shielding cover 120 away from the second board 118.

[0037] Specifically, the circuit board assembly 110 also includes a second board 118 and a second shielding cover 120, the first heat-conducting assembly 150 includes a first heat-conducting member 152 and a second heat-conducting member 154, the second board 118 is arranged on the first board 112, the first board 112 and the second board 118 form a frame structure, the first board 112 and the second board 118 surround the chamber 114, the first heat-conducting material 140 is in contact with the first board 112, the first heat-conducting material 140 is also in contact with the second board 118, the second board 118 is provided with a second shielding cover 120, the first heat-conducting member 152 is arranged on the second board 118 and the second shielding cover 120 The first heat conductor 152 can transfer the heat of the second plate 118 to the second shielding cover 120, and the second heat conductor 154 is arranged on the side of the second shielding cover 120 away from the second plate 118, so that the heat generated by the chip 130 or the first plate 112 can be transferred to the first heat conductive material 140, the first heat conductive material 140 transfers the heat to the second plate 118, the second plate 118 transfers the heat to the first heat conductive member 152, the second heat conductive member 154 transfers the heat to the second shielding cover 120, and the second shielding cover 120 transfers the heat to the second heat conductive member 154, thereby improving the heat dissipation effect of the chip 130.

[0038] The first heat-conducting member 152 may be made of metal, thermally conductive gel or thermally conductive silicone grease. The first heat-conducting member 152 made of metal may be disposed on the second board 118 by surface mounting technology (SMT). In addition, a third heat-conducting material 168 may be disposed at the end of the first heat-conducting member 152, and the third heat-conducting material 168 is in contact with the second shielding cover 120, thereby improving the heat conduction effect, wherein the third heat-conducting material 168 may be thermally conductive gel or thermally conductive silicone grease. That is, the first heat-conducting member 152 is in contact with the second board 118, and the first heat-conducting member 152 is also in contact with the second shielding cover 120 through the third heat-conducting material 168. Of course, in other embodiments of the present application, the first heat-conducting member 152 may be in contact with the second board 118 and the second shielding cover 120.

[0039] As mentioned above, for the 3D stacked circuit board, the projection area of ​​the chip 130 is filled with the first thermally conductive material 140, and the first thermally conductive material 140 is filled in the cavity 114 formed between the first board body 112 and the second board body 118, and the heat is discharged through the first thermally conductive material 140, the second board body 118, the first thermally conductive member 152, the second shielding cover 120 and the second thermally conductive member 154 in sequence.

[0040] The second heat conductor 154 includes at least one of a circuit board bracket 1502 and a heat sink 1504. The metal portion of the circuit board bracket 1502 is in contact with the circuit board assembly 110, that is, the circuit board bracket 1502 is connected to the first shielding cover 116, the second shielding cover 120, the third board body 122 or the fourth board body 124, and the heat sink 1504 is in contact with the metal portion of the circuit board bracket 1502, thereby conducting heat out. The heat sink 1504 can be a graphite heat sink film (Pyrolytic Graphite Sheet, PGS), a copper heat sink film or a steel heat sink film, etc.

[0041] like Figure 2 , Figure 3 and Figure 4 As shown, as a possible implementation, the first heat-conducting component 150 further includes: a third heat-conducting member 156 embedded in the second plate 118 , and the third heat-conducting member 156 is in contact with the first heat-conducting material 140 and the first heat-conducting member 152 .

[0042] Specifically, the first heat-conducting component 150 also includes a third heat-conducting member 156 embedded in the second plate body 118. The second plate body 118 has a channel. The third heat-conducting member 156 is embedded in the channel of the second plate body 118. The first heat-conducting material 140 and the third heat-conducting member 156 are in contact with each other, and the first heat-conducting member 152 and the third heat-conducting member 156 are in contact with each other. Therefore, when heat is transferred, it can be transferred through the third heat-conducting member 156, thereby improving the thermal conductivity between the first heat-conducting material 140 and the first heat-conducting member 152, and improving the heat dissipation effect on the chip 130.

[0043] The third heat conducting member 156 may be made of metal, thermally conductive gel or thermally conductive silicone grease, etc. That is, the first heat conducting material 140 , the second heat conducting member 154 and the third heat conducting member 156 may all be made of thermally conductive gel or thermally conductive silicone grease, etc.

[0044] Furthermore, the third heat conducting member 156 may be a thermal bar, and a hole may be etched on the first plate 112 by an etching process, and then the hole may be filled by electroplating or the like.

[0045] As mentioned above, for the 3D stacked circuit board, the projection area of ​​the chip 130 is filled with the first thermally conductive material 140, and the first thermally conductive material 140 is filled in the cavity 114 formed between the first board body 112 and the second board body 118, and the heat is discharged through the first thermally conductive material 140, the third thermally conductive member 156, the first thermally conductive member 152, the second shielding cover 120 and the second thermally conductive member 154 in sequence.

[0046] like Figure 5As shown, as a possible implementation, the circuit board assembly 110 also includes: a third plate body 122, which is arranged on one side of the first plate body 112, and the first plate body 112 and the third plate body 122 surround a chamber 114; the first heat-conducting assembly 150 includes: a fourth heat-conducting member 158, which is arranged on the third plate body 122 and is located in the chamber 114, and the first heat-conducting material 140 is in contact with the first plate body 112 and the fourth heat-conducting member 158; and a fifth heat-conducting member 160, which is arranged on the side of the third plate body 122 away from the fourth heat-conducting member 158.

[0047] Specifically, the circuit board assembly 110 further includes a third plate body 122, the first heat-conducting assembly 150 includes a fourth heat-conducting member 158 and a fifth heat-conducting member 160, the third plate body 122 is arranged on the first plate body 112, the first plate body 112 and the third plate body 122 form a frame structure, the first plate body 112 and the third plate body 122 surround the chamber 114, the fourth heat-conducting member 158 is arranged on the third plate body 122 and is located in the chamber 114, the first heat-conducting material 140 is in contact with the first plate body 112, and the first heat-conducting material The material 140 is also in contact with the fourth heat conductor 158. The fifth heat conductor 160 is arranged on the side of the third plate 122 away from the fourth heat conductor 158. Therefore, the heat generated by the chip 130 or the first plate 112 can be transferred to the first heat conductive material 140, and the first heat conductive material 140 transfers the heat to the fourth heat conductive member 158. The fourth heat conductive member 158 transfers the heat to the third plate 122, and the third plate 122 transfers the heat to the fifth heat conductive member 160, thereby improving the heat dissipation effect of the chip 130.

[0048] For the 3D stacked circuit board, the projection area of ​​the chip 130 is filled with the first heat-conducting material 140, and the first heat-conducting material 140 is filled in the cavity 114 formed between the first plate body 112 and the third plate body 122, and the heat is sequentially conducted through the first heat-conducting material 140, the fourth heat-conducting member 158, the third plate body 122 and the fifth heat-conducting member 160. The fourth heat-conducting member 158 can be a heat pipe or a heat spreader, etc., which can be single-layer, double-layer or multi-layer.

[0049] like Figure 5 , Figure 6 and Figure 7 As shown, as a possible implementation, the first heat-conducting component 150 includes: a sixth heat-conducting member 162 embedded in the third plate 122 , and the sixth heat-conducting member 162 is in contact with the fourth heat-conducting member 158 and the fifth heat-conducting member 160 .

[0050] Specifically, the first heat-conducting component 150 includes: a sixth heat-conducting member 162, the third plate body 122 has a through hole, the sixth heat-conducting member 162 is embedded in the channel of the third plate body 122, the fourth heat-conducting member 158 and the sixth heat-conducting member 162 are in contact with each other, and the fifth heat-conducting member 160 and the sixth heat-conducting member 162 are in contact with each other, so that when heat is transferred, it can be transferred through the sixth heat-conducting member 162, thereby improving the thermal conductivity between the fourth heat-conducting member 158 and the fifth heat-conducting member 160, and improving the heat dissipation effect on the chip 130.

[0051] The sixth heat-conducting member 162 may be made of metal, thermally conductive gel or thermally conductive silicone grease.

[0052] Furthermore, the sixth heat conducting member 162 may be a thermal bar, and a hole may be etched on the third plate 122 by an etching process, and then the hole may be filled by electroplating or the like.

[0053] As mentioned above, for the 3D stacked circuit board, the projection area of ​​the chip 130 is filled with the first thermally conductive material 140, and the first thermally conductive material 140 is filled in the cavity 114 formed between the first board body 112 and the third board body 122, and the heat is successively discharged through the first thermally conductive material 140, the fourth thermally conductive member 158, the sixth thermally conductive member 162 and the fifth thermally conductive member 160.

[0054] Optionally, the circuit board assembly 110 further includes a second shielding cover 120, which is disposed on the third board 122. A heat conducting member may be disposed between the third board 122 and the second shielding cover 120, so that heat can also be conducted through the second shielding cover 120. Figure 2 On the basis of the electronic device 100 shown, the above heat conduction structure is added.

[0055] like Figure 8 As shown, as a possible implementation, the circuit board assembly 110 also includes: a fourth board 124, which is arranged on one side of the first board 112, and the first board 112 and the fourth board 124 surround a chamber 114; the first heat-conducting assembly 150 includes: a seventh heat-conducting member 164, which is arranged on the fourth board 124 and located in the chamber 114, and the first heat-conducting material 140 is in contact with the first board 112 and the sixth heat-conducting member 162; an eighth heat-conducting member 166 is passed through the fourth board 124 and the first board 112; wherein, the electronic device 100 also includes a bracket 170, the bracket 170 is located on the side of the chip 130 away from the circuit board assembly 110, and the eighth heat-conducting member 166 is connected to the bracket 170.

[0056] Specifically, the circuit board assembly 110 further includes a fourth board 124, the first heat-conducting assembly 150 includes a seventh heat-conducting member 164 and an eighth heat-conducting member 166, the fourth board 124 is arranged on the first board 112, the first board 112 and the fourth board 124 form a frame structure, the first board 112 and the fourth board 124 surround a chamber 114, the seventh heat-conducting member 164 is arranged on the fourth board 124 and is located in the chamber 114, the first heat-conducting material 140 is in contact with the first board 112, the first heat-conducting material 140 is also in contact with the seventh heat-conducting member 164, and the electronic device 100 It also includes a bracket 170, and the eighth heat conductor 166 passes through the fourth plate 124 and the first plate 112, and the eighth heat conductor 166 is fixed on the bracket 170, so that the heat generated by the chip 130 or the first plate 112 can be transferred to the first heat conductive material 140, and the first heat conductive material 140 transfers the heat to the seventh heat conductive member 164, and the seventh heat conductive member 164 transfers the heat to the fourth plate 124, and the fourth plate 124 transfers the heat to the eighth heat conductive member 166, and the eighth heat conductive member 166 transfers the heat to the bracket 170, thereby improving the heat dissipation effect of the chip 130.

[0057] Optionally, the circuit board assembly 110 further includes a second shielding cover 120, which is disposed on the fourth board 124. A heat conducting member may be disposed between the fourth board 124 and the second shielding cover 120, so that heat can also be conducted away through the second shielding cover 120. Optionally, a heat conducting member may be disposed on the fourth board 124, so that heat can be conducted away. That is, in the example Figure 2 or Figure 5 On the basis of the electronic device 100 shown, the above heat conduction structure is added.

[0058] The eighth heat conducting member 166 may be a copper column or a screw, etc. The seventh heat conducting member 164 may be a heat conducting pipe or a heat spreader, etc., which may be single-layer, double-layer or multi-layer.

[0059] like Figure 1 , Figure 2 , Figure 5 and Figure 8 As shown, as a possible implementation, a screen 190 is disposed on a side of the bracket 170 facing away from the circuit board assembly 110 .

[0060] like Figure 1 , Figure 2 , Figure 5 and Figure 8 As shown, as a possible implementation, it further includes: a third shielding cover 180 , which is disposed on the chip 130 ; and a second thermal conductive material 186 , which is disposed between the chip 130 and the bracket 170 .

[0061] Specifically, the electronic device 100 also includes a third shielding cover 180 and a second thermally conductive material 186. The third shielding cover 180 is arranged on the first plate body 112 and covers the chip 130. The second thermally conductive material 186 is filled between the chip 130 and the third shielding cover 180, and between the bracket 170 and the third shielding cover 180, thereby improving the heat dissipation effect of the chip 130 through the second thermally conductive material 186.

[0062] The second thermally conductive material 186 may be thermally conductive gel or thermally conductive silicone grease.

[0063] Optionally, the third shielding cover 180 includes a shielding cover body 182 and a ninth heat conducting member 184, the shielding cover body 182 has a through hole, the ninth heat conducting member 184 closes the through hole, the ninth heat conducting member 184 is made of metal, such as copper foil or aluminum foil, etc., and the second heat conducting material 186 is disposed on both sides of the ninth heat conducting member 184. The ninth heat conducting member 184 can be a heat pipe or a heat spreader, etc., which can be single-layer, double-layer or multi-layer.

[0064] like Figure 1 , Figure 2 , Figure 5 and Figure 8 As shown, as a possible implementation, the electronic device 100 also includes: a bracket 170, located on one side of the circuit board assembly 110, opposite to the chip 130; a third shielding cover 180, covering the chip 130; and a second thermal conductive material 186, used for heat conduction between the chip 130 and the bracket 170.

[0065] The bracket 170 includes a bracket body 172 and a tenth heat conducting member 174 . The tenth heat conducting member 174 is embedded in the bracket body 172 . The second heat conducting material 186 is in contact with the tenth heat conducting member 174 .

[0066] like Figure 1 , Figure 2 , Figure 5 and Figure 8 As shown, as a possible implementation, the first board 112 has a power distribution network (PDN) 1122 , and the first thermal conductive material 140 covers at least a portion of the power distribution network 1122 .

[0067] Specifically, the first board 112 has a power distribution network 1122, and the first thermal conductive material 140 covers at least a portion of the power distribution network 1122. The power distribution network 1122 distributes power to the chip 130. This position generates a large amount of heat. The heat dissipation effect of this position can be improved by setting the first thermal conductive material 140.

[0068] The power distribution network 1122 may include lines and capacitors. The power distribution network 1122 is located at the positive projection position of the chip 130 onto the first board 112. The first thermal conductive material 140 covers the capacitor and contacts the first shielding cover 116, the second shielding cover 120, the third board 122 or the fourth board 124.

[0069] As a possible implementation, the first thermally conductive material 140 may be thermally conductive silicone grease or thermally conductive gel, etc., and the first thermally conductive material 140 is filled in the cavity 114 .

[0070] The electronic device 100 may be a terminal, or may be other devices except the electronic device 100. Exemplarily, the electronic device 100 may be a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted electronic device 100, a music player, a private network communication terminal device (such as a walkie-talkie), a mobile Internet device (Mobile Internet Device, MID), an augmented reality / virtual reality / mixed reality device, a robot, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook or a personal digital assistant (personal digital assistant, PDA), etc. It may also be a server, a network attached storage (Network Attached Storage, NAS), a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., and the embodiments of the present application are not specifically limited.

[0071] In the description of this specification, the description with reference to the terms "one embodiment" or "specific embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0072] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A circuit board assembly, the circuit board assembly comprising a first board body and a cavity located on one side of the first board body; A chip is arranged on the other side of the first plate; A first heat-conducting material is filled in at least a portion of the cavity, and the first heat-conducting material and the chip are respectively arranged on two sides of the first plate; The first heat-conducting component is arranged on the circuit board component, and the first heat-conducting material transfers heat to the first heat-conducting component.

2. The electronic device according to claim 1, characterized in that: The circuit board assembly further comprises: The first shielding cover is arranged on one side of the first plate body. The first plate body and the first shielding cover enclose the chamber. The first heat-conducting material is in contact with the first plate body and the first shielding cover. The first heat-conducting component is arranged on a side of the first shielding cover away from the first plate body.

3. The electronic device according to claim 2, characterized in that: The first heat conducting component is in contact with a side of the first shielding cover facing away from the first plate body.

4. The electronic device according to claim 1, characterized in that: The circuit board assembly further comprises: A second plate body is arranged on one side of the first plate body, the first plate body and the second plate body enclose the chamber, and the first heat conductive material is in contact with the first plate body and the second plate body; A second shielding cover is arranged on a side of the second plate body away from the first plate body, and the first heat conducting component is in contact with the second shielding cover; The first heat conducting component comprises: A first heat conducting member, disposed between the second plate body and the second shielding cover; The second heat conducting member is arranged on a side of the second shielding cover away from the second plate body.

5. The electronic device according to claim 4, characterized in that: The first heat conducting component also includes: The third heat-conducting member is embedded in the second plate body, and the third heat-conducting member is in contact with the first heat-conducting material and the first heat-conducting member.

6. The electronic device according to claim 1, characterized in that: The circuit board assembly further comprises: A third plate body is arranged on one side of the first plate body, and the first plate body and the third plate body surround the chamber; The first heat conducting component comprises: A fourth heat-conducting member is disposed on the third plate and located in the chamber, wherein the first heat-conducting material is in contact with the first plate and the fourth heat-conducting member; The fifth heat conducting member is arranged on a side of the third plate body away from the fourth heat conducting member.

7. The electronic device according to claim 6, characterized in that: The first heat conducting component comprises: The sixth heat-conducting member is embedded in the third plate body, and the sixth heat-conducting member is in contact with the fourth heat-conducting member and the fifth heat-conducting member.

8. The electronic device according to claim 1, characterized in that: The circuit board assembly further comprises: A fourth plate body is disposed on one side of the first plate body, and the first plate body and the fourth plate body surround the chamber; The first heat conducting component comprises: A seventh heat-conducting member is disposed on the fourth plate and located in the chamber, and the first heat-conducting material is in contact with the first plate and the seventh heat-conducting member; an eighth heat conducting member, penetrating the fourth plate body and the first plate body; Wherein, the electronic device further comprises a bracket, the bracket is located at a side of the chip away from the circuit board assembly, and the eighth heat conducting member is connected to the bracket.

9. The electronic device according to claim 8, characterized in that: Also includes: A third shielding cover is disposed on the chip; The second heat-conducting material is arranged between the chip and the bracket.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The first board has a power distribution network, and the first heat conductive material covers at least a portion of the power distribution network.

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