Manufacturing method of gold finger PCB without gold guide wire

Abstract

The invention discloses a manufacturing method of a gold finger PCB (Printed Circuit Board) without a gold guide lead. Adding a gold guide lead wire at the position of the golden finger; printing easy-to-wash selective solder mask ink: exposing the golden finger position needing gold plating to form a first selective area, and covering other positions which do not need gold plating with the easy-to-wash selective solder mask ink; gold plating is carried out on the first selective area, and after gold plating is completed, the selective solder mask ink covering the board is removed; the PCB is covered with a layer of selective dry film, the gold guide lead is exposed to form a second selective area, and other positions are all covered with a layer of selective dry film for protection; etching off the gold guide lead by using etching liquid medicine; after etching is completed, the selective dry film is washed away, the gold finger PCB without the gold guide lead is obtained, and the defect that in the prior art, wire residues exist in the gold finger manufacturing process is overcome.

Description

Technical Field

[0001] The invention relates to the field of gold finger preparation technology, in particular to a PCB gold finger preparation technology without residual gold wire. Background Art

[0002] With the rapid development of electronic technology, circuit boards, as the basic components of electronic devices, have a vital impact on the overall performance of electronic devices through their performance and quality. As a common type of circuit board, gold finger PCB boards have a row of gold finger contacts made near the edge of the circuit board for signal connection between circuit boards. However, in the traditional method of making gold finger PCB boards, after the gold fingers are plated with gold, the gold guide wires cannot be completely removed and a part of them will remain on the PCB board. This will lead to a decrease in the performance of the gold finger PCB board. Therefore, it is of great practical significance to develop a method for making a gold finger PCB board without gold guide wires. The existing PCB gold finger production process usually requires the use of electroplating. After the gold finger PCB board is plated with gold, the gold guide wire cannot be completely removed, and a part of the gold guide wire will remain at the end of the gold finger. This part of the remaining gold guide wire will have the risk of falling off during use, and will also cause certain losses in the signal transmission between the boards, affecting the performance of the circuit board; therefore, a PCB gold finger preparation process is urgently needed to make up for the above technical defects. Summary of the invention

[0003] Aiming at the problem that the residual gold wire cannot be effectively removed during the preparation of the gold finger of the PCB in the above-mentioned technology, the present invention provides a solution.

[0004] To achieve the above object, the present invention provides a method for manufacturing a gold finger PCB board without gold conductive wires, comprising the following steps: S1. Adding gold guide wires: on the surface of the multi-layer gold finger PCB board, a circuit pattern is made as needed, and then a gold guide wire is added at the position of the made gold finger; the width of the gold guide wire is the same as the width of the gold finger, and the gold guide wire extends out of the PCB board; S2. Printing easy-to-remove and washable solder mask ink: expose the gold finger positions that need to be gold-plated to form the first selection area, and cover other positions that do not need to be gold-plated with easy-to-remove and washable solder mask ink; S3, gold plating and post-gold plating treatment: gold plating is performed on the first selected area, and after the gold plating is completed, the selected solder mask ink covering the board is removed; S4, covering with a selective dry film: Covering a layer of selective dry film on the PCB board, exposing the gold conductive wire to form a second selective area, and covering all other positions with a layer of selective dry film for protection; S5, etching and removing the dry film: etching the gold conductive wires with an etching solution; after etching, removing the selected dry film to obtain a gold finger PCB board without gold conductive wires.

[0005] Preferably, the PCB board includes a plurality of mutually independent gold fingers, the gold conductive wires match the number of the gold fingers, and are located on the same side of the plurality of gold fingers.

[0006] Preferably, in S2, when other positions not requiring gold plating are covered with easily strippable solder mask ink, the distance between the edge of the easily strippable solder mask ink covering the gold conductive wire and the gold finger is between 2-4 mils.

[0007] Preferably, in S4, before covering the selected dry film, a normal solder mask ink needs to be printed on the PCB board. Wherein, the gold finger area and the position of the gold conductive wire are not printed with normal solder mask ink.

[0008] Preferably, the first selected area and the second selected area are both obtained by printing on a film. Draw the corresponding graphics on the surface and then transfer them to the surface of the PCB board.

[0009] Preferably, after S5, the method further includes pasting tape at the position of the gold finger, and then Surface treatment of the board.

[0010] The beneficial effects of the present invention are as follows: compared with the prior art, the present invention provides a method for manufacturing a gold finger PCB board without gold lead wires, comprising the following steps: S1, adding gold lead wires: making a circuit pattern on the surface of a multi-layer gold finger PCB board as required, and then adding gold lead wires at the position of the manufactured gold finger; the width of the gold lead wires is the same as the width of the gold finger, and the gold lead wires extend out of the PCB board; S2, printing an easy-to-remove and washable solder mask ink: exposing the gold finger position that needs to be gold-plated to form a first selectivity area, and covering other positions that do not need to be gold-plated with an easy-to-remove and washable solder mask ink; S3, gold plating and after gold plating Processing: Gold-plating is performed on the exposed gold finger area. After the gold plating is completed, the selective solder mask ink covering the board is removed; S4, covering with selective dry film: Covering a layer of selective dry film on the PCB board, exposing the gold guide wire to form a second selective area, and all other positions are covered with a layer of selective dry film for protection; S5, etching and removing the dry film: Etching the gold guide wire is etched away with etching solution; after etching, the selective dry film is removed to obtain a gold finger PCB board without gold guide wires; in this way, a gold finger PCB board without gold guide wires is obtained, and there is no gold guide wire at the end of the gold finger, which can effectively reduce the loss during signal transmission; In addition, the gold wires are removed by etching, so the edges of the gold fingers are relatively neat and there are no unevenness. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a process flow chart of the present invention; Figure 2 This is a schematic diagram of the PCB surface during step S1 of the present invention; Figure 3 It is a schematic diagram of each area of ​​the PCB layout during steps S2-S5 of the present invention; Figure 4 The figure is a schematic diagram of the PCB surface after the gold conductive wires are removed according to the present invention.

[0012] The main component symbols are described as follows: 1. PCB board; 2. Gold finger; 3. Gold wire; A. First selected area; B. Second selected area. DETAILED DESCRIPTION

[0013] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0014] In the following description, general election example details are given to provide a deeper understanding of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all embodiments. It should be understood that the specific embodiments are only used to explain the present invention and are not used to limit the present invention.

[0015] It should be understood that when the terms "include" and / or "comprises" are used in this specification, they indicate the existence of the stated features, integers, steps, operations, elements or components, but do not exclude the existence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0016] The present invention provides a method for manufacturing a gold finger PCB board without gold wires. Figures 1 to 4 , including the following steps: S1. Adding gold guide wires: on the surface of the multi-layer gold finger PCB board 1, a circuit pattern is made as required, and then a gold guide wire 3 is added at the position of the made gold finger 2; the width of the gold guide wire 3 is the same as that of the gold finger 2, and the gold guide wire 3 extends out of the PCB board 1; S2, printing easy-to-remove and washable solder mask ink: expose the position of the gold finger 3 that needs to be gold-plated to form the first selective area A, and cover the other positions that do not need to be gold-plated with easy-to-remove and washable solder mask ink; the characteristic of the selective solder mask ink is that it can effectively protect the position that does not need to be gold-plated from being affected by the gold plating solution, and this part of the ink can be easily removed after gold plating; S3, gold plating and post-gold plating treatment: gold plating is performed on the exposed first selected area A. After the gold plating is completed, the selected solder mask ink covering the board is removed; the gold thickness requirement is generally 3-30 mm; S4, covering with selective dry film: Cover the PCB board 1 with a layer of selective dry film, expose the gold conductive wire 3, form the second selective area B, and cover all other positions with a layer of selective dry film for protection; the function of the selective dry film is to protect the circuits in other areas from reacting with the chemical solution when removing the gold conductive wire; S5, etching and removing the dry film: use etching solution to etch away the gold conductive wire 3; after etching is completed, remove the selected dry film to obtain a gold finger PCB board without gold conductive wires.

[0017] The above-mentioned method for manufacturing a gold finger PCB board without gold wires uses etching to remove the gold wires during the process of manufacturing the PCB board, which changes the prior art of using processes such as cutting to remove the gold wires, and will not cause the residue of the gold wires. In addition, during the gold plating process, the area except the gold fingers is covered with an easily strippable and selective solder mask ink, which avoids the gold wires being plated with nickel gold, thereby reducing manufacturing costs and improving production efficiency.

[0018] In this embodiment, the PCB board 1 includes a plurality of mutually independent gold fingers 2, and the gold guide wires 3 match the number of the gold fingers 2 and are located on the same side of the plurality of gold fingers 2. In the actual processing method, in two adjacent gold fingers, the corresponding gold guide wires are located on the same side of the two gold fingers, and the gold guide wires on the two gold fingers can be close to each other or far away from each other. If the two gold guide wires are close to each other, the two gold guide wires can be merged at the same place, and then separated after electroplating to avoid short circuit.

[0019] In this embodiment, in step S2, when other positions not requiring gold plating are covered with the easily-removable solder mask ink, the distance between the edge of the easily-removable solder mask ink covering the gold conductive lead 3 and the gold finger is between 2-4 mils. If the distance between the edge and the gold finger is less than 2 mils, the gold conductive lead is easily plated with gold during the gold plating process, which will lead to a waste of resources. If the distance between the edge of the easily-removable solder mask ink and the gold finger is greater than 4 mils, it will lead to a waste of ink.

[0020] In this embodiment, in S4, before covering the selected dry film, it is necessary to print normal solder mask ink on the PCB board 1, wherein the gold finger 2 area and the position of the gold guide wire 3 are not printed with normal solder mask ink. This ink is not easy to be washed off after printing; and it can protect the covered area from external attacks.

[0021] In this embodiment, the first selected area A and the second selected area B are both obtained by printing on film. The corresponding graphics are first drawn on the surface of the film and then transferred to the surface of the PCB board 1. It can be understood that the corrosion resistance of the film and the PCB board is different. Therefore, the circuit drawing and etching are effectively carried out through this characteristic.

[0022] Furthermore, after S5, it also includes pasting tape at the position of the gold finger 3, and then performing surface treatment on the PCB board 1. The tape can be an anti-static tape, which is mainly used to protect the gold finger, and the surface treatment specifically includes removing oil stains on the PCB board, and drying the PCB board.

[0023] The above disclosures are only several specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a gold finger PCB board without gold conductive wires, characterized in that: The following steps are involved: S1. Adding gold guide wires: on the surface of the multi-layer gold finger PCB board, a circuit pattern is made as needed, and then a gold guide wire is added at the position of the made gold finger; the width of the gold guide wire is the same as the width of the gold finger, and the gold guide wire extends out of the PCB board; S2. Printing easy-to-remove and washable solder mask ink: expose the gold finger positions that need to be gold-plated to form the first selection area, and cover other positions that do not need to be gold-plated with easy-to-remove and washable solder mask ink; S3, gold plating and post-gold plating treatment: gold plating is performed on the first selected area, and after the gold plating is completed, the selected solder mask ink covering the board is removed; S4, covering with a selective dry film: Covering a layer of selective dry film on the PCB board, exposing the gold conductive wire to form a second selective area, and covering all other positions with a layer of selective dry film for protection; S5, etching and removing the dry film: etching the gold conductive wires with an etching solution; after etching, removing the selected dry film to obtain a gold finger PCB board without gold conductive wires.

2. The method for manufacturing a gold finger PCB board without gold conductive wires according to claim 1, characterized in that: The PCB board includes a plurality of mutually independent gold fingers, the gold conductive wires match the number of the gold fingers and are located on the same side of the plurality of gold fingers.

3. The method for manufacturing a gold finger PCB board without gold conductive wires according to claim 1, characterized in that: In S2, when other positions not requiring gold plating are covered with the stripping-resistant solder mask ink, the distance between the edge of the stripping-resistant solder mask ink covering the gold conductive wire and the gold finger is between 2-4 mils.

4. The method for manufacturing a gold finger PCB board without gold conductive wires according to claim 1, characterized in that: In S4, before covering the selected dry film, it is necessary to print normal solder mask ink on the PCB board, wherein the gold finger area and the position of the gold conductive wire are not printed with normal solder mask ink.

5. The method for manufacturing a gold finger PCB board without gold conductive wires according to claim 1, characterized in that: The first selected area and the second selected area are both obtained by printing on a film. The corresponding graphics are first drawn on the surface of the film and then transferred to the surface of the PCB board.

6. The method for manufacturing a gold finger PCB board without gold conductive wires according to claim 1, characterized in that: After S5, the process also includes pasting tape at the location of the gold finger and then performing surface treatment on the PCB board.

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