Photoelectric coupler and manufacturing method thereof

Abstract

The invention discloses a photoelectric coupler and a manufacturing method thereof, and the photoelectric coupler comprises a first conductive support which is provided with a die bonding region; the receiving chip is fixedly arranged in the die bonding area; the isolation protection layer is stacked on the receiving chip; the emission chip is stacked on the isolation protection layer; the second conductive bracket is arranged opposite to the first conductive bracket; the emission chip is electrically connected with the second conductive support through a crystal wire. The insulating part is fixedly arranged at the opposite end parts of the first conductive bracket and the second conductive bracket; and a packaging adhesive. The transmitting chip, the isolation protection layer and the receiving chip are sequentially attached in the vertical direction, so that the size of the photoelectric coupler in the vertical direction is reduced; the first conductive support and the second conductive support are abutted against each other, so that the size of the photoelectric coupler in the horizontal direction is reduced, and the overall size of the photoelectric coupler is minimized.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging, and in particular to a photoelectric coupler and a manufacturing method thereof. Background Art

[0002] Photocoupler, also known as optical coupler or photoelectric isolator, or optocoupler for short, is a device that uses light as a medium to transmit electrical signals. Its structure is mainly composed of two parts: the transmitter and the receiver. First, the electronic signal will drive the light-emitting element at the transmitter to emit light of a certain wavelength, which will generate a certain photocurrent after being received by the light detector at the light receiving end. This photocurrent can be processed by a certain amplification or shaping to output an electrical signal. There are two main packaging structures of existing photocouplers. One is the reflection type, that is, the light signal is reflected from the transmitter to the receiver inside the photocoupler. The photocoupler obtained in this way is smaller in size, but the photoelectric conversion efficiency is lower; the other is the opposite type, that is, the light signal is directly from the transmitter to the receiver in the form of opposite reflection inside the photocoupler. The transmitter chip and the receiver chip are opposite to each other in different planes. The photoelectric conversion efficiency of the photocoupler obtained in this way is higher, but the supporting bracket needs to be located in multiple layers on different planes, resulting in a larger product size. Therefore, how to reduce the product volume while ensuring the photoelectric conversion efficiency is an urgent problem to be solved. Summary of the invention

[0003] The main technical problem solved by the present invention is how to reduce the volume of the photoelectric coupler and ensure its photoelectric conversion efficiency.

[0004] An embodiment of the present application provides a photoelectric coupler, comprising: A first conductive support, wherein the first conductive support has a support surface disposed on the top thereof, and a crystal bonding area is disposed on the support surface; A receiving chip, wherein the receiving chip is fixedly disposed in the die-bonding area, and a photosensitive surface of the receiving chip is disposed away from the supporting surface of the first conductive bracket, and the receiving chip is electrically connected to the first conductive bracket; An isolation protection layer, the isolation protection layer is stacked on the photosensitive surface of the receiving chip; An emitting chip, wherein the emitting chip is stacked and arranged at an end of the isolation protection layer away from the receiving chip, and the light-emitting surface of the emitting chip is arranged toward the isolation protection layer, and the light emitted by the emitting chip is transmitted to the receiving chip via the isolation protection layer; a second conductive support, wherein the second conductive support and the first conductive support are arranged opposite to each other along a supporting surface of the first conductive support; the transmitting chip and the second conductive support are electrically connected via a crystal wire; An insulating member, the insulating member is fixedly disposed at ends of the first conductive support and the second conductive support that are opposite to each other; The packaging glue integrally encapsulates the receiving chip, the isolation protection layer, the transmitting chip, a part of the first conductive support, and a part of the second conductive support.

[0005] In one embodiment, a cross-sectional area of ​​the receiving chip along a direction perpendicular to the height is greater than a cross-sectional area of ​​the transmitting chip along a direction perpendicular to the height.

[0006] In one embodiment, the thickness and transmittance of the isolation protection layer correspond to the required photoelectric conversion efficiency.

[0007] In one embodiment, the insulating member is fixedly disposed on the first conductive bracket; the second conductive bracket includes a main body, a bending portion and a first extension portion, the main body is arranged opposite to the first conductive bracket, the first extension portion is located above the supporting surface of the first conductive bracket, and the bending portion is connected between the main body and the first extension portion.

[0008] In one embodiment, the bent portion abuts against the insulating member.

[0009] In one embodiment, the first extension portion overlaps above the insulating member, and an orthographic projection range of the first extension portion on the supporting surface of the first conductive support is located within a supporting range of the insulating member.

[0010] In one embodiment, the second conductive support further includes a second extension portion, and the second extension portion is located at an end of the first extension portion close to the first conductive support and extends along the height direction, and the extension height does not exceed the height of the transmitting chip.

[0011] In one embodiment, the main body, the bending portion, the first extending portion, and the second extending portion are an integrally bent structure.

[0012] In one embodiment, the insulating part includes a connecting sleeve, which has openings at both ends and is respectively sleeved on the ends of the first conductive bracket and the second conductive bracket; the connecting sleeve has a connecting through hole that passes through the top wall of the connecting sleeve, and an electrode is embedded in the connecting through hole, and the electrode is electrically connected to the second conductive bracket; the connecting sleeve is also provided with an insulating layer that separates the openings at both ends.

[0013] Based on the same inventive concept, the embodiment of the present application further provides a method for manufacturing the above-mentioned photoelectric coupler, comprising: Providing a light-emitting crystal element, wherein a light-emitting surface and an electrode surface of the light-emitting crystal element are arranged opposite to each other; An isolation protection layer is provided on the light emitting surface of the light emitting wafer; Cutting the light-emitting wafer provided with the isolation protection layer to form an emission component, wherein the emission component includes an emission chip and an isolation protection layer; The end of the transmitting component provided with the isolation protection layer is fixed to the photosensitive surface of the receiving chip; wherein the receiving chip is fixed to the solid crystal area of ​​the first conductive support; the solid crystal area is provided on the supporting surface at the top of the first conductive support; The transmitting chip and the receiving chip are electrically connected to the second conductive bracket and the first conductive bracket respectively; the first conductive bracket and the second conductive bracket are arranged opposite to each other along the supporting surface, and an insulating member is also arranged between the opposite ends of the first conductive bracket and the second conductive bracket; Set the packaging glue.

[0014] According to the photoelectric coupler and the manufacturing method thereof of the above-mentioned embodiment, since the transmitting chip, the isolation protection layer and the receiving chip are sequentially attached in the vertical direction, the size of the photoelectric coupler in the vertical direction can be reduced; and since the first conductive bracket and the second conductive bracket are relatively abutted, the size of the photoelectric coupler in the horizontal direction can also be reduced, thereby achieving a more miniaturized overall size of the photoelectric coupler.

[0015] In addition, since the first conductive bracket and the second conductive bracket are relatively abutted, the length of the crystal line connecting the transmitting chip on the first conductive bracket to the second conductive bracket is shorter; since the crystal line is mainly composed of metal gold, the cost is relatively high, reducing the length of the crystal line can greatly save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Schematic diagram of the structure of a photoelectric coupler in an embodiment of the present application.

[0017] Figure 2 Schematic diagram of a top view of a photoelectric coupler in an embodiment of the present application.

[0018] Figure 3 This is a schematic diagram of a second conductive bracket structure in an embodiment of the present application.

[0019] Figure 4 FIG. 2 is a schematic diagram of another structure of a photoelectric coupler in an embodiment of the present application.

[0020] Figure 5 This is a schematic diagram of another second conductive bracket structure in an embodiment of the present application.

[0021] Figure 6 This is a schematic diagram of another second conductive bracket structure in an embodiment of the present application.

[0022] Figure 7This is a schematic diagram of another photoelectric coupler structure in an embodiment of the present application.

[0023] Figure 8 This is a schematic diagram of a connecting sleeve structure in an embodiment of the present application.

[0024] Fig. 9 It is a schematic side view of a connecting sleeve structure in an embodiment of the present application.

[0025] Fig.10 This is a flow chart of a method for manufacturing a photoelectric coupler in an embodiment of the present application.

[0026] Fig.11 This is a schematic diagram of a light-emitting crystal structure in an embodiment of the present application.

[0027] Fig.12 It is a schematic side view of a light-emitting wafer in an embodiment of the present application.

[0028] Fig.13 Schematic diagram of a light-emitting wafer provided with an isolation protection layer in an embodiment of the present application.

[0029] Fig.14 This is a schematic diagram of the structure of the transmitting component in the embodiment of the present application.

[0030] Description of reference numerals: 1-first conductive support; 11-solidification area; 2-second conductive bracket; 21-main body; 22-bending portion; 23-first extension portion; 24-second extension portion; 3-Receiver chip; 4- Transmitter chip; 5-Isolation protection layer; 6-insulating member; 61-connecting sleeve; 62-insulating layer; 63-electrode; 64-insulating partition; 7-packaging glue; 71-inner packaging glue; 72-outer packaging glue; 8-crystal line; 9- Luminescent crystal. DETAILED DESCRIPTION

[0031] The present invention is further described in detail below by specific embodiments in conjunction with the accompanying drawings. Wherein similar elements in different embodiments adopt associated similar element numbers. In the following embodiments, many detailed descriptions are for making the present application better understood. However, those skilled in the art can easily recognize that some features can be omitted in different situations, or can be replaced by other elements, materials, methods. In some cases, some operations related to the present application are not shown or described in the specification, this is to avoid the core part of the present application being overwhelmed by too much description, and for those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations according to the description in the specification and the general technical knowledge in the art.

[0032] In addition, the features, operations or characteristics described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment and are not meant to be a required sequence, unless otherwise specified that a certain sequence must be followed.

[0033] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).

[0034] Photocoupler, also known as optocoupler or opto-isolator, or optocoupler for short, is a device that uses light as a medium to transmit electrical signals. Its structure mainly consists of two parts: the transmitter and the receiver. First, the electronic signal will drive the light-emitting element at the transmitter to emit light of a certain wavelength, which will generate a certain photocurrent after being received by the light detector at the light receiving end. This photocurrent can be processed by a certain amplification or shaping to output an electrical signal. Since the signal in the photocoupler is in the form of light from the transmitter to the receiver, the photocoupler has a good isolation effect on signal noise, which can avoid mutual interference between the electrical signal at the transmitter and the electrical signal at the receiver. Because of the excellent signal isolation effect of the photocoupler, the photocoupler is currently widely used in various circuits and has become one of the most diverse and widely used optoelectronic components. There are two main packaging structures of optocouplers. One is reflective, that is, the optical signal is reflected from the transmitter to the receiver inside the optocoupler. The transmitting chip and the receiving chip are arranged on the same plane, and the conductive bracket that can carry the chip is also arranged on the same plane. In this way, only one set of brackets is needed and there is no need for stacking and other actions, so the volume of the product is small; but because the optical signal is transmitted by internal reflection, its photoelectric conversion efficiency is low; and the other is opposite-beam, that is, the optical signal is directly transmitted from the transmitter to the receiver inside the optocoupler in the form of direct radiation, and the transmitting chip and the receiving chip are in different planes and arranged opposite to each other, so the photoelectric conversion efficiency is high, but because the brackets carrying the chips are not in the same plane, it is often necessary to open two sets of brackets and combine bending and other operations to realize the two-way facing of the transmitting chip and the receiving chip, which increases the bracket cost and production cost, and because the transmitting end and the receiving end are not in the same plane, the volume of the entire product is relatively large.

[0035] The present application provides a photoelectric coupler, please refer to Figure 1-Figure 2 As shown, the optocoupler includes: A first conductive support 1, the first conductive support 1 having a support surface arranged on the top thereof, and a crystal bonding area 11 is arranged on the support surface; The receiving chip 3 is fixedly disposed in the crystal-fixing area 11, and the photosensitive surface of the receiving chip 3 is disposed away from the supporting surface of the first conductive support 1, and the receiving chip 3 is electrically connected to the first conductive support 1; An isolation protection layer 5, the isolation protection layer 5 is stacked on the photosensitive surface of the receiving chip 3; The transmitting chip 4 is stacked and arranged at the end of the isolation protection layer 5 away from the receiving chip 3, and the light-emitting surface of the transmitting chip 4 is arranged toward the isolation protection layer 5, and the light emitted by the transmitting chip 4 is transmitted to the receiving chip 3 via the isolation protection layer 5; A second conductive support 2, the second conductive support 2 and the first conductive support 1 are arranged opposite to each other along a supporting surface of the first conductive support 1; the transmitting chip 4 is electrically connected to the second conductive support 2 through a crystal wire 8; An insulating member 6, the insulating member 6 is fixedly disposed at the ends of the first conductive support 1 and the second conductive support 2 that are opposite to each other; The packaging glue 7 integrally covers the receiving chip 3, the isolation protection layer 5, the transmitting chip 4, a part of the first conductive support 1 and a part of the second conductive support 2 therein.

[0036] In the design structure of the photoelectric coupler in the embodiment of the present application, in order to reduce the volume of the photoelectric coupler, the bracket used includes a first conductive bracket 1 and a second conductive bracket 2, and the structure of the arrangement is basically located in the same plane, that is, the first conductive bracket 1 and the second conductive bracket 2 are arranged relatively along the support surface. Under this arrangement structure, in the related art, a gap is usually set between the first conductive bracket 1 and the second conductive bracket 2 to achieve insulation, but the reliability of this structure is poor, and usually a large spacing is required to ensure the insulation effect; in the embodiment of the present application, a physical insulating member 6 is set between the first conductive bracket 1 and the second conductive bracket 2, and the insulating member 6 is set at the opposite ends of the first conductive bracket 1 and the second conductive bracket 2, and the insulating member 6 is fixed to the first conductive bracket 1 and / or the second conductive bracket 2. By setting the insulating member 6, the gap between the first conductive bracket 1 and the second conductive bracket 2 can be reduced while ensuring that the first conductive bracket 1 and the second conductive bracket 2 are insulated from each other, thereby reducing the size of the entire photoelectric coupler.

[0037] In order to ensure the photoelectric conversion efficiency, the photoelectric coupler in the embodiment of the present application adopts a counter-radiation structure, wherein an isolation protection layer 5 is arranged between the receiving chip 3 and the transmitting chip 4, the light-emitting surface of the transmitting chip 4 is arranged toward the isolation protection layer 5, and the photosensitive surface of the receiving chip 3 is also arranged toward the isolation protection layer 5, and the light emitted by the transmitting chip 4 is transmitted to the receiving chip 3 after passing through the isolation protection layer 5. Since the isolation protection layer 5 is arranged between the transmitting chip 4 and the receiving chip 3, the photoelectric conversion efficiency of the entire photoelectric coupler can be adjusted by adjusting the parameters of the isolation protection layer 5, including but not limited to transmittance, thickness, etc.; for example, the higher the thickness of the isolation protection layer 5, the lower the corresponding photoelectric conversion efficiency; the higher the transmittance of the isolation protection layer 5, the higher the corresponding photoelectric conversion efficiency. In other words, the thickness and transmittance of the isolation protection layer 5 correspond to the required photoelectric conversion efficiency. In addition, the hardness and other parameters of the isolation protection layer 5 can also be adjusted to meet the safety level required by the product.

[0038] The receiving chip 3 is directly fixed to the solid crystal area 11 of the first conductive support 1, and the isolation protection layer 5 and the transmitting chip 4 are sequentially stacked on the receiving chip 3. In order to support the isolation protection layer 5 and the transmitting chip 4 and improve the light receiving efficiency, the cross-sectional area of ​​the receiving chip 3 along the direction perpendicular to the height can be configured to be larger than the cross-sectional area of ​​the transmitting chip 4 along the direction perpendicular to the height, so that the proportion of light emitted by the transmitting chip 4 that overflows can be reduced to ensure the photoelectric conversion efficiency.

[0039] In some optional embodiments, the composition structure of the encapsulation glue 7 may specifically include an inner encapsulation glue 71 and an outer encapsulation glue 72. The inner encapsulation glue 71 integrally encapsulates the receiving chip 3, the isolation protection layer 5, the transmitting chip 4, a part of the first conductive support 1 and a part of the second conductive support 2, and the outer encapsulation glue 72 encapsulates the inner encapsulation glue 7 as a whole. Therefore, during the manufacturing process, the receiving chip 3, the isolation protection layer 5, the transmitting chip 4, a part of the first conductive support 1 and a part of the second conductive support 2 may be encapsulated by the inner encapsulation glue 71 first, so as to fix these components; then, the outer encapsulation glue 72 is arranged outside the inner encapsulation glue 71 to encapsulate the entire inner encapsulation glue 71.

[0040] In some alternative embodiments, please refer to Figure 3 In order to facilitate the electrical connection between the transmitting chip 4 and the second conductive support 2, reduce the length of the crystal wire 8, and improve the integrity of the product, the insulating member 6 is fixedly arranged on the first conductive support 1; the second conductive support 2 includes a main body 21, a bending portion 22 and a first extension portion 23, the main body 21 is arranged opposite to the first conductive support 1, the first extension portion 23 is located above the support surface of the first conductive support 1, and the bending portion 22 is connected between the main body 21 and the first extension portion 23. The component structure of the second conductive support 2 includes a connected main body, a bending portion 22 and a first extension portion 23 in sequence, and the first extension portion 23 is directly arranged above the support surface of the first conductive support 1, which is equivalent to raising the position of the first extension portion 23; since the transmitting chip 4 is connected to the first conductive support 1 through the crystal wire 8, the crystal wire 8 can be connected to the transmitting chip 4 and the first extension portion 23 under this structure, thereby reducing the required length of the crystal wire 8. Most of the crystal wire 8 is gold, so reducing the length of the crystal wire 8 can reduce the amount of crystal wire 8, thereby reducing the cost.

[0041] In some optional embodiments, please continue to refer to Figure 1 In order to improve product consistency and enhance product strength, the bent portion 22 can abut against the insulating member 6. Since the insulating member 6 is disposed between the first conductive bracket 1 and the second conductive bracket 2, even if the bent portion 22 abuts against the insulating member 6 directly, it will not affect the insulation performance between the first conductive bracket 1 and the second conductive bracket 2. The shape of the bent portion 22 can be a curve or a broken line.

[0042] In some optional embodiments, please continue to refer to Figure 1 In order to further improve product consistency and enhance product strength, the first extension portion 23 is overlapped on the top of the insulating member 6, and the orthographic projection range of the first extension portion 23 on the supporting surface of the first conductive bracket 1 is located within the supporting range of the insulating member 6. In other words, the first extension portion 23 can be directly placed on the top of the insulating member 6, which is equivalent to supporting the first extension portion 23 through the insulating member 6; and because the orthographic projection range formed by the first extension portion 23 on the supporting surface of the first conductive bracket 1 is located within the supporting range of the insulating member 6, overlapping the first extension portion 23 on the top of the insulating member 6 will not affect the insulation effect.

[0043] In some alternative embodiments, please refer to Figure 4-Figure 6 In order to further reduce the length of the crystal line 8, the second conductive support 2 further includes a second extension portion 24, which extends along the height direction at the end of the first extension portion 23 close to the first conductive support 1, and the extension height does not exceed the height of the transmitting chip 4. The second extension portion 24 extends along the height direction, so that the extended end thereof can be closer to the transmitting chip 4, and the closest part can be flush with the transmitting chip 4, in this state, the length of the crystal line 8 can be minimized.

[0044] In some optional embodiments, in order to ensure connection strength and achieve electrical connection, the main body 21, the bent portion 22, the first extending portion 23 and the second extending portion 24 can be directly formed into an integral bent structure.

[0045] The present application also provides a photoelectric coupler, please refer to Figure 7-Figure 9 , the corresponding insulating member 6 may specifically include a connecting sleeve 61, wherein the connecting sleeve 61 has openings at both ends, and is respectively sleeved on the ends of the first conductive bracket 1 and the ends of the second conductive bracket 2; an insulating layer 62 is also provided inside the connecting sleeve 61 to separate the openings at both ends. The connecting sleeve 61 can be respectively provided at the ends of the first conductive bracket 1 and the second conductive bracket 2 in the form of sleeve connection, which is equivalent to achieving a fixed connection between the first conductive bracket 1 and the second conductive bracket 2; and the inside of the connecting sleeve 61 is provided with an insulating layer 62 to separate the openings, so that the insulation between the first conductive bracket 1 and the second conductive bracket 2 can be achieved.

[0046] In some optional embodiments, in order to facilitate the electrical connection between the transmitting chip 4 and the second conductive support 2, the connecting sleeve 61 is further provided with a connecting through hole penetrating the top tube wall of the connecting sleeve 61, and an electrode 63 is embedded in the connecting through hole, and the electrode 63 is electrically connected to the second conductive support 2. The electrode 63 embedded in the connecting through hole can form an electrical connection with the transmitting chip 4, and the height of the electrode 63 can even be adjusted to make it closer to the transmitting chip 4. In addition, when the second conductive support 2 includes multiple, the connecting sleeve 61 can be integrally sleeved on each second conductive support 2, and an insulating partition 64 can be set in the sleeve based on each conductive support.

[0047] According to the optocoupler provided in the embodiment of the present application, since the transmitting chip 4, the isolation protection layer 5 and the receiving chip 3 are sequentially attached in the vertical direction, the size of the optocoupler in the vertical direction can be reduced; and because the first conductive bracket 1 and the second conductive bracket 2 are relatively abutted, the size of the optocoupler in the horizontal direction can also be reduced, thereby achieving a smaller overall size of the optocoupler.

[0048] In addition, since the first conductive support 1 and the second conductive support 2 are relatively abutted, the length of the crystal wire 8 connecting the transmitting chip 4 on the first conductive support 1 to the second conductive support 2 is shorter; since the main component of the crystal wire is metal gold, the cost is relatively high, reducing the length of the crystal wire can greatly save costs.

[0049] In addition, the present invention also provides a method for manufacturing a photoelectric coupler, please refer to Figure 10-Figure 14 ,include: S101, providing a light-emitting wafer 9, wherein the light-emitting surface of the light-emitting wafer 9 and the electrode 63 are arranged opposite to each other; the light-emitting wafer 9 is in the form of a sheet as a whole, and can be cut into a plurality of separate emission chips 4, such as Fig.11 and Fig.12 shown.

[0050] S102, on the light-emitting surface of the light-emitting wafer 9, an isolation protection layer 5 is provided, such as Fig.13 As shown; the isolation protective layer 5 serves as a medium for transmitting the light emitted by the transmitting chip 4 to the receiving chip 3. It is fixed to the light emitting wafer 9 before cutting the light emitting wafer 9. In the subsequent cutting process, the light emitting wafer 9 and the isolation protective layer 5 are directly cut as a whole to obtain the required combination structure of the transmitting chip 4 and the isolation protective layer 5.

[0051] S103, cutting the light emitting wafer 9 provided with the isolation protection layer 5 to form an emission component, the emission component including the emission chip 4 and the isolation protection layer 5, such as Fig.14 shown.

[0052] S104, fix one end of the transmitting component provided with the isolation protection layer 5 to the photosensitive surface of the receiving chip 3; wherein the receiving chip 3 is fixed to the solid crystal area 11 of the first conductive bracket 1; the solid crystal area 11 is provided on the supporting surface at the top of the first conductive bracket 1; wherein the step of fixing the receiving chip 3 to the first conductive bracket 1 can be before any step before obtaining the transmitting chip 4, or after fixing the receiving chip 3 and the transmitting chip 4 to each other, and then fixing the receiving chip 3, the isolation protection layer 5 and the transmitting chip 4 to the solid crystal area 11 of the first conductive bracket 1 as a whole.

[0053] S105, electrically connect the transmitting chip 4 and the receiving chip 3 to the second conductive bracket 2 and the first conductive bracket 1 respectively; the first conductive bracket 1 and the second conductive bracket 2 are arranged opposite to each other along the supporting surface, and an insulating member 6 is also arranged between the opposite ends of the first conductive bracket 1 and the second conductive bracket 2; when making electrical connections, the receiving chip 3 can be electrically connected to the first conductive bracket 1 by means of a patch or a crystal wire 8, while the transmitting chip 4 generally only forms a cable line with the second conductive bracket 2 through the crystal wire 8.

[0054] S106, setting the packaging glue 7. The packaging glue 7 may specifically include an inner packaging glue 71 and an outer packaging glue 72. The inner packaging glue 71 is firstly packaged, and then the inner packaging glue 71 is wrapped by the outer packaging glue 72, so as to obtain the desired photoelectric coupler.

[0055] After the optocoupler product is formed, corresponding tests can be carried out. The test content includes photoelectric conversion efficiency, safety level, etc., to determine whether it meets the requirements of the product.

[0056] According to the photoelectric coupler and the manufacturing method thereof of the above-mentioned embodiment, since the transmitting chip 4, the isolation protection layer 5 and the receiving chip 3 are sequentially attached in the vertical direction, the size of the photoelectric coupler in the vertical direction can be reduced; and since the first conductive bracket 1 and the second conductive bracket 2 are relatively abutted, the size of the photoelectric coupler in the horizontal direction can also be reduced, thereby achieving a more miniaturized overall size of the photoelectric coupler.

[0057] In addition, since the first conductive support 1 and the second conductive support 2 are relatively abutted, the length of the crystal wire 8 connecting the transmitting chip 4 on the first conductive support 1 to the second conductive support 2 is shorter; since the main component of the crystal wire is metal gold, the cost is relatively high, reducing the length of the crystal wire can greatly save costs.

[0058] Those skilled in the art will appreciate that all or part of the functions of the various methods in the above-mentioned embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above-mentioned embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, and the storage medium can include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to implement the above-mentioned functions. For example, the program is stored in the memory of the device, and when the program in the memory is executed by the processor, all or part of the above-mentioned functions can be implemented. In addition, when all or part of the functions in the above-mentioned embodiments are implemented by computer programs, the program can also be stored in a storage medium such as a server, another computer, disk, optical disk, flash disk or mobile hard disk, and can be downloaded or copied and saved in the memory of the local device, or the system of the local device is updated, and when the program in the memory is executed by the processor, all or part of the functions in the above-mentioned embodiments can be implemented.

[0059] The above specific examples are used to illustrate the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the art, according to the concept of the present invention, some simple deductions, modifications or substitutions can be made.

Claims

1. A photoelectric coupler, characterized in that: include: A first conductive support, wherein the first conductive support has a support surface disposed on the top thereof, and a crystal bonding area is disposed on the support surface; A receiving chip, wherein the receiving chip is fixedly disposed in the die-bonding area, and a photosensitive surface of the receiving chip is disposed away from the supporting surface of the first conductive bracket, and the receiving chip is electrically connected to the first conductive bracket; An isolation protection layer, the isolation protection layer is stacked on the photosensitive surface of the receiving chip; A transmitting chip, wherein the transmitting chip is stacked and arranged at an end of the isolation protection layer away from the receiving chip, and the light-emitting surface of the transmitting chip is arranged toward the isolation protection layer, and the light emitted by the transmitting chip is transmitted to the receiving chip via the isolation protection layer; a second conductive support, wherein the second conductive support and the first conductive support are arranged opposite to each other along a supporting surface of the first conductive support; the transmitting chip and the second conductive support are electrically connected via a crystal wire; An insulating member, the insulating member is fixedly disposed at ends of the first conductive support and the second conductive support that are opposite to each other; The packaging glue integrally encapsulates the receiving chip, the isolation protection layer, the transmitting chip, a part of the first conductive support, and a part of the second conductive support.

2. The photocoupler according to claim 1, wherein: A cross-sectional area of ​​the receiving chip along a direction perpendicular to the height is greater than a cross-sectional area of ​​the transmitting chip along a direction perpendicular to the height.

3. The photocoupler according to claim 1, wherein: The thickness and light transmittance of the isolation protection layer correspond to the required photoelectric conversion efficiency.

4. The photoelectric coupler according to any one of claims 1 to 3, characterized in that: The insulating member is fixedly arranged on the first conductive bracket; the second conductive bracket includes a main body, a bending portion and a first extension portion, the main body is arranged opposite to the first conductive bracket, the first extension portion is located above the supporting surface of the first conductive bracket, and the bending portion is connected between the main body and the first extension portion.

5. The photocoupler according to claim 4, wherein: The bent portion abuts against the insulating member.

6. The photocoupler according to claim 4, wherein: The first extension portion is overlapped on the top of the insulating member, and the orthographic projection range of the first extension portion on the supporting surface of the first conductive bracket is located within the supporting range of the insulating member.

7. The photocoupler according to claim 4, wherein: The second conductive support further includes a second extension portion, which is located at an end of the first extension portion close to the first conductive support and extends along the height direction, and the extension height does not exceed the height of the transmitting chip.

8. The photocoupler according to claim 7, wherein: The main body, the bent portion, the first extending portion, and the second extending portion are an integrally bent structure.

9. The photoelectric coupler according to any one of claims 1 to 4, characterized in that: The insulating part includes a connecting sleeve, which has openings at both ends and is respectively sleeved on the ends of the first conductive bracket and the second conductive bracket; the connecting sleeve has a connecting through hole that penetrates the top wall of the connecting sleeve, and an electrode is embedded in the connecting through hole, and the electrode is electrically connected to the second conductive bracket; the connecting sleeve is also provided with an insulating layer that separates the openings at both ends.

10. A method for manufacturing a photoelectric coupler according to any one of claims 1 to 9, characterized in that: include: Providing a light-emitting crystal element, wherein a light-emitting surface and an electrode surface of the light-emitting crystal element are arranged opposite to each other; An isolation protection layer is provided on the light emitting surface of the light emitting wafer; Cutting the light-emitting wafer provided with the isolation protection layer to form an emission component, wherein the emission component includes an emission chip and an isolation protection layer; The end of the transmitting component provided with the isolation protection layer is fixed to the photosensitive surface of the receiving chip; wherein the receiving chip is fixed to the solid crystal area of ​​the first conductive support; the solid crystal area is provided on the supporting surface at the top of the first conductive support; The transmitting chip and the receiving chip are electrically connected to the second conductive bracket and the first conductive bracket respectively; the first conductive bracket and the second conductive bracket are arranged opposite to each other along the supporting surface, and an insulating member is also arranged between the opposite ends of the first conductive bracket and the second conductive bracket; Set the packaging glue.

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