LED chip and LED display panel
By designing the electrodes of the LED chips to distinguish positive and negative electrodes, and using the spacing settings and connection methods of the conductive layers, the problem of low production and packaging efficiency caused by electrode distinction in the prior art is solved, and a more efficient production process and lower material losses are achieved.
Patent Information
- Application Number
- CN202411828502.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-03-18
AI Technical Summary
The electrodes of existing Micro LED chips need to distinguish between positive and negative electrodes, resulting in additional processes during production and packaging, reducing efficiency, and easily causing material losses due to polar assembly.
An LED chip is designed in which the electrodes do not distinguish between positive and negative electrodes. By sequentially spaced the first conductive layer and the second conductive layer on the LED structural layer, and connecting the electrodes to different ends of the semiconductor layer, flexible conduction of current is achieved.
It realizes flexible patching of LED chips, saves the production process of LED display panels, improves production efficiency, and reduces material losses caused by polar installation, and saves material costs.