COB light-emitting device and light-emitting device

Abstract

The utility model relates to a COB light-emitting device and a light-emitting device. The COB light-emitting device comprises a light-emitting assembly, a plurality of first lenses and a plurality of second lenses. The light-emitting assembly comprises a plurality of light-emitting chips and is provided with a plurality of light-emitting areas, and each light-emitting area is formed by the light-emitting face of the corresponding light-emitting chip. The plurality of first lenses are in one-to-one correspondence with the plurality of light-emitting areas, each first lens is arranged on the light-emitting chip of the corresponding light-emitting area, the minimum included angle between the section line of the side surface of each first lens on the optical axis section and the extension line of the section line of the bottom surface of each first lens is theta, and theta is greater than 45 degrees and greater than 90 degrees. The second lens is arranged on the light-emitting assembly and comprises a plurality of lens parts which are connected with one another, the plurality of lens parts are in one-to-one correspondence with the plurality of first lenses, and each lens part is arranged above the corresponding first lens at intervals. According to the COB light-emitting device, light emitted by the light-emitting chip is collected through the arrangement of the first lens, the size of the second lens is obviously reduced, the size of the device is obviously reduced, and miniaturization of the COB light-emitting device is facilitated.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a COB light-emitting device and light-emitting apparatus. Background Technology

[0002] Traditional COB (Chip On Board) light-emitting devices typically use translucent adhesive to seal the light-emitting chip, and then place a lens on top of the adhesive to control the light emission from the chip. Since the chip is a surface light source, its emission angle can reach 120°. To capture light within this emission angle range, the lens needs to have a large coverage area, resulting in a large lens size and consequently, a large overall COB light-emitting device size, which hinders miniaturization. Summary of the Invention

[0003] Therefore, it is necessary to provide a COB light-emitting device and light-emitting apparatus to address the problem that the large size of the COB light-emitting device is caused by the large size of the lens.

[0004] A COB light-emitting device, comprising:

[0005] A light-emitting component, comprising a plurality of light-emitting chips and having a plurality of light-emitting areas, each light-emitting area being formed by the light-emitting surface of the light-emitting chip;

[0006] A plurality of first lenses are provided, each corresponding to one of the plurality of light-emitting areas. Each first lens is disposed on the light-emitting chip of the corresponding light-emitting area. The minimum angle between the extension of the section line on the side surface of the first lens and the section line on the bottom surface of the first lens in the optical axis section is θ, where 90° > θ > 45°.

[0007] The second lens is disposed on the light-emitting component and includes a plurality of interconnected lens portions, each of which is disposed in a one-to-one correspondence with the plurality of first lenses, and each lens portion is spaced above the corresponding first lens.

[0008] In one embodiment, the top surface of each of the first lenses is a convex curved surface.

[0009] In one embodiment, the light-emitting device further includes a reflective structure disposed on the light-emitting component and having a plurality of reflective holes, wherein the plurality of reflective holes are configured in a one-to-one correspondence with the plurality of first lenses; wherein each first lens is directly formed on the light-emitting chip through the corresponding reflective hole.

[0010] In one embodiment, the light-emitting device further includes: a plurality of light-transmitting adhesive layers, the plurality of light-transmitting adhesive layers being disposed one-to-one with the plurality of light-emitting areas, each of the light-transmitting adhesive layers being disposed on the top surface of the corresponding light-emitting chip and bonded to the bottom surface of the corresponding first lens; the reflective structure is directly formed on the light-emitting component by a mold, and covers the light-emitting chip, the light-transmitting adhesive layer and the side surface of the first lens.

[0011] In one embodiment, the COB light-emitting device further includes: a plurality of light-transmitting adhesive layers, wherein the plurality of light-transmitting adhesive layers are disposed in a one-to-one correspondence with the plurality of light-emitting areas, and each of the light-transmitting adhesive layers at least covers the top surface of the corresponding light-emitting chip and is bonded to the bottom surface of the corresponding first lens.

[0012] In one embodiment, the light-emitting component further includes a substrate on which the plurality of light-emitting chips are disposed; the second lens further includes a support portion, the bottom end of which is supported on the substrate, and the top end of which surrounds and connects all the lens portions.

[0013] In one embodiment, the second lens is an integrally formed structure, and the side of the support portion is coplanar with the side of the substrate.

[0014] In one embodiment, a connecting portion is provided between adjacent first lenses, and the connecting portion is connected to the side of the first lens.

[0015] In one embodiment, the light-emitting component further includes a substrate and a support structure, the plurality of light-emitting chips are disposed on the substrate, the support structure is supported between the substrate and the second lens, and the side of the support structure is coplanar with the side of the substrate.

[0016] A light-emitting device, comprising:

[0017] matrix; and

[0018] COB light-emitting device, wherein the COB light-emitting device is disposed on the substrate, and is the COB light-emitting device as described in any of the above embodiments.

[0019] The aforementioned COB light-emitting device and apparatus, by setting a first lens on the light-emitting chip, and with the minimum angle θ between the extension line of the side profile of the first lens and the extension line of the bottom profile of the first lens on the optical axis being greater than 60°, allows the side profile of the first lens to totally reflect the large-angle lateral light emission of the light-emitting chip, such as 120° light emission, while converging the light upwards, thus significantly reducing the angle of the light emitted from the light-emitting surface of the first lens. Consequently, the light-receiving angle range of the lens portion located above the first lens is also reduced accordingly, meaning the coverage area of ​​the lens portion can be reduced. Therefore, the volume of the second lens is significantly reduced, and the volume of the COB light-emitting device is also significantly reduced, which is beneficial for its miniaturization. Attached Figure Description

[0020] Figure 1 This is a top view of the COB light-emitting device in the first embodiment of this application.

[0021] Figure 2 for Figure 1 A cross-sectional view of the COB light-emitting device along line II.

[0022] Figure 3 This is a cross-sectional view of the COB light-emitting device in the second embodiment of this application.

[0023] Figure 4 This is a cross-sectional view of the COB light-emitting device in the third embodiment of this application.

[0024] Figure 5 This is a cross-sectional view of the COB light-emitting device in the fourth embodiment of this application.

[0025] Figure 6 This is a partial cross-sectional view of a light-emitting device in one embodiment of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100-COB light-emitting device; 110-Light-emitting component; 111-Light-emitting chip; 112-Light-emitting area; 113-Light-emitting surface; 114-Substrate; 115-Supporting structure; 116-Accommodation space; 120-First lens; 122-Connecting part; 130-Second lens; 132-Lens part; 134-Supporting part; 140-Reflective structure; 142-Reflective aperture; 150-Light-transmitting adhesive layer;

[0028] 200 - Light-emitting device; 210 - Substrate. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] Please see Figure 1 and Figure 2 , Figure 1 A top view of the COB light-emitting device in the first embodiment of this application is shown. Figure 2 It shows Figure 1 A cross-sectional view along line II of the COB light-emitting device provided in the first embodiment of this application shows a COB light-emitting device 100, including a light-emitting component 110, a plurality of first lenses 120, and a second lens 130. The light-emitting component 110 has a plurality of light-emitting areas 112 and includes a plurality of light-emitting chips 111, wherein each light-emitting area 112 is formed by the light-emitting surface 113 of the light-emitting chip 111. The plurality of first lenses 120 are arranged one-to-one with the plurality of light-emitting areas 112, and each first lens 120 is disposed on the light-emitting chip 111 of the corresponding light-emitting area 112. The minimum angle between the extension line of the cross-section of the side surface of the first lens 120 and the cross-section of the bottom surface of the first lens 120 on the optical axis is θ, where 90° > θ > 45°. The second lens 130 is disposed on the light-emitting component 110 and includes a plurality of interconnected lens portions 132, each lens portion 132 being arranged one-to-one with the plurality of first lenses 120, and each lens portion 132 being spaced apart above the corresponding first lens 120.

[0036] By setting a first lens 120 on the light-emitting chip 111, and ensuring that the minimum angle θ between the extension line of the side profile of the first lens 120 and the extension line of the bottom profile of the first lens 120 on the optical axis is greater than 45°, the side profile of the first lens 120 can totally reflect the large-angle lateral light emission of the light-emitting chip 111, such as 120° light emission, while converging the light upwards. This significantly reduces the angle of the light emitted from the light-emitting surface of the first lens 120, and consequently reduces the light-receiving angle range of the lens portion 132 located above the first lens 120. That is, the coverage area of ​​the lens portion 132 can be reduced. Therefore, the volume of the second lens 130 is significantly reduced, and the volume of the COB light-emitting device 100 is also significantly reduced, which is beneficial for its miniaturization.

[0037] It should be noted that the multiple light-emitting areas 112 of the light-emitting component 110 can be arranged irregularly or regularly, such as in a single row, a single column, or an array. In this embodiment, the multiple light-emitting areas 112 are arranged in an array, specifically a matrix arrangement of three rows and three columns; however, the arrangement is not limited to this. The angle between the extension of the section line on the side of the first lens 120 and the section line on the bottom of the first lens 120 in the optical axis section is usually one, such as when the first lens 120 is a frustum or a regular square truncated cone. However, when the first lens 120 is a square truncated cone, and its top surface has a rectangular shape when viewed from above, there can be two angles. Since the minimum angle θ is set to be greater than 45°, the other angle must be larger, resulting in a better focused light emission effect.

[0038] The light-emitting component 110 also includes a substrate 114 and a support structure 115. Multiple light-emitting chips 111 are disposed on the substrate 114, and the support structure 115 is supported between the substrate 114 and the second lens 130, providing a accommodating space 116 for the light-emitting chips 111 and the first lens 120. Clearly, the height of the support structure 115 is greater than the overall height of the first lens 120, thus causing the light-emitting surfaces of the second lens 130 on the support structure 115 to be spaced apart from those of the first lens 120.

[0039] The substrate 114 can be a plate with circuitry (not shown), which not only serves to support the light-emitting chip 111, but also allows the light-emitting chip 111 to be electrically connected to external devices through the circuitry. The material of the substrate can be, but is not limited to, glass, resin, or ceramic.

[0040] Each light-emitting area 112 may be formed by the light-emitting surface 113 of at least one light-emitting chip 111. The light-emitting chip 111 may be a conventional chip or a flip chip, specifically, but not limited to, an LED chip or a semiconductor laser chip. The light-emitting surface 113 of the light-emitting chip 111 may be the top surface of the light-emitting chip 111 or the top surface and side surface of the light-emitting chip 111.

[0041] In this embodiment, each light-emitting area 112 is formed by the light-emitting surface 113 of a light-emitting chip 111, and the light-emitting surface 113 of the light-emitting chip 111 is its top surface. However, the number of light-emitting chips 111 in each light-emitting area 112 is not limited to this. Since the first lens 120 is only provided for one light-emitting chip 111 and is only provided on the top surface of the light-emitting chip 111, the volume of the first lens 120 can be designed to be smaller, which also reduces the volume of the second lens 130, that is, the volume of the COB light-emitting device 100 can be further reduced. It should be noted that, in an alternative embodiment, each light-emitting area 112 can be formed by the light-emitting surfaces 113 of multiple light-emitting chips 111. The multiple light-emitting chips 111 can include two LED chips arranged side by side, or three LED chips arranged in a reasonable manner, specifically a red LED chip, a green LED chip, and a blue LED chip, and the light-emitting surface 113 of each LED chip can be the top surface and the side surface.

[0042] The support structure 115 is disposed on the edge region of the substrate 114, and surrounds all the light-emitting chips 111 and the first lens 120, providing a receiving space 116 for the light-emitting chips 111 and the first lens 120, and also serving to support the second lens 130. When setting the support structure 115 on the substrate 114, the support structure 115 can be molded first, and then the support structure 115 can be fixed on the substrate 114.

[0043] In this embodiment, the side of the support structure 115 is coplanar with the side of the substrate 114, which facilitates the splicing of different COB light-emitting devices 100. When producing COB light-emitting devices 100, a module with multiple device units can be produced first, and then a cutting process can be used to cut out individual COB light-emitting devices 100, which facilitates the mass production of COB light-emitting devices 100.

[0044] The first lens 120 can reduce the Fresnel loss of the light-emitting chip 111 and also converge the emission angle of the light-emitting chip 111, thereby reducing the emission angle of its emission surface. Furthermore, the minimum angle θ between the extension line of the side profile of the first lens 120 and the extension line of the bottom profile of the first lens 120 on the optical axis is greater than 60° and less than 90°. The larger the minimum angle θ, the more lateral light rays are reflected from the side of the first lens 120, the better the light mixing effect, and the improved light output brightness and uniformity.

[0045] In this embodiment, the minimum angle θ between the extension line of the cross-section of the side surface of the first lens 120 and the extension line of the cross-section of the bottom surface of the first lens 120 on the optical axis can be, but is not limited to, 75°. Lateral rays with an emission angle greater than 105° from the light-emitting chip 111 are reflected by the side surface of the first lens 120. It is understood that in other embodiments, the minimum angle θ can also be 70°, 80°, 85°, or other angles, depending on the actual requirements.

[0046] The height of the side surface of the first lens 120 is H, and the square side length of the light-emitting chip 111 is L, where L*tanθ>H>L. When the minimum included angle θ is 75°, 3.837L>H>L, for example, H=3L, but not limited to this. Obviously, when the minimum included angle θ is constant, the smaller the height H of the side surface of the first lens 120, the smaller the light-emitting surface of the first lens 120, and the smaller the volume of the first lens 120 becomes. Consequently, the volume of the second lens 130 also decreases accordingly, which can make the thickness of the entire device thinner and the overall volume shrink.

[0047] In this embodiment, the top surface of each first lens 120 is a convex curved surface, which serves to focus light, further reducing the light emission angle of its light emission surface and further reducing the light incident surface of the lens portion 132, that is, further reducing the volume of the lens portion 132; at the same time, it can improve the brightness and uniformity of the light spot projected by the second lens 130.

[0048] In this embodiment, the first lens 120 can be fixed to the top surface of the light-emitting chip 111 by bonding. That is, the first lens 120 is first molded, and then multiple first lenses 120 are bonded to the top surface of multiple light-emitting chips 111 at one time using a fixture. It should be noted that in other embodiments, the first lens 120 may be provided with a mounting part, which can be used to fix it to the substrate 114, and the lens portion of the first lens 120 is disposed on the top surface of the light-emitting chip 111.

[0049] The second lens 130 can reshape the light emitted from the first lens 120 to meet the user's needs for different light patterns, thereby improving the device's light control capability. Please refer to... Figure 1 The projected area of ​​the light-emitting surface of the first lens 120 is S1, and the projected area of ​​the light-emitting surface of the lens portion 132 is S2, wherein 5S1≥S2>S1. By controlling the size of each lens portion 132, the volume of the second lens 130 is minimized while meeting optical requirements, which is beneficial for device miniaturization. In this embodiment, S2=2.5S1, but it is not limited thereto. In alternative embodiments, S2=2S1, 3S1, or 4S1.

[0050] In this embodiment, each lens portion 132 can be, but is not limited to, a convex lens, serving as a secondary light-focusing element, resulting in a brighter and more uniform light spot. Specifically, each lens portion 132 can be a biconvex lens. However, in other embodiments, the biconvex lens can be replaced by a plano-convex lens, or each lens portion 132 can also be a Fresnel lens.

[0051] Please combine Figure 1 In this embodiment, the shape of each lens portion 132 is adapted to the shape of the top of the first lens 120, that is, each lens portion 132 is circular; however, its shape is not limited to this. In other embodiments, each lens portion 132 may also be a cuboid, hexagon, or other polygon, thereby increasing the number of connecting portions between adjacent lens portions 132 and improving the connection stability.

[0052] The second lens 130 can be fixed to the support structure 115 by adhesive bonding or snap-fit. In this embodiment, the receiving space 116 formed by the support structure 115 and the substrate 114 is circular, and the multiple lens portions 132 of the second lens 130 are arranged in a rectangular array, wherein the lens portions 132 at the four corners of the second lens 130 are adhesively fixed to the top surface of the support structure 115.

[0053] Please combine Figure 2 When producing a single COB light-emitting device 100, to avoid interference between the support structure 115 and the die bonding of the light-emitting chip 111, multiple light-emitting chips 111 can be first fixed on the substrate 114; then, multiple first lenses 120 are bonded to the top surface of the multiple light-emitting chips 111 in one step using a jig; next, the support structure 115 is fixed on the substrate 114; finally, a second lens 130 is fixed on the support structure 115, such that the multiple lens portions 132 of the second lens 130 are aligned with the multiple first lenses 120 one by one. Furthermore, since the sides of the light-emitting chip 111 are not sealed, sealant can be applied to the sides of the light-emitting chip 111 after fixing the first lenses 120, or the sides of the light-emitting chip 111 can be sealed with sealant after setting the support structure 115. It should be noted that the production process of the COB light-emitting device 100 is not limited to the above steps; the above steps are merely an exemplary production method. In addition, when mass-producing COB light-emitting devices 100, modules containing multiple device units can be processed in the manner described above, and then individual COB light-emitting devices 100 can be cut out using cutting processes such as laser cutting or metal cutting.

[0054] Please see Figure 3 , Figure 3A cross-sectional view of the COB light-emitting device in the second embodiment of this application is shown. Compared with the COB light-emitting device 100 in the first embodiment described above, the COB light-emitting device 100 in this embodiment further includes a reflective structure 140. The reflective structure 140 is disposed on the light-emitting component 110 and has a plurality of reflective holes 142. The plurality of reflective holes 142 are arranged one-to-one with a plurality of first lenses 120, and the hole wall of each reflective hole 142 covers the side of the corresponding light-emitting chip 111 and the first lens 120. The reflective surface of the reflective hole 142 can reflect light, thereby reducing the light loss of light passing through the first lens 120, which is beneficial to improving the light extraction rate and thus improving the luminous brightness of the device.

[0055] In this embodiment, the COB light-emitting device 100 further includes a plurality of light-transmitting adhesive layers 150. The plurality of light-transmitting adhesive layers 150 are disposed in a one-to-one correspondence with the plurality of light-emitting areas 112, and each light-transmitting adhesive layer 150 is disposed on the top surface of the corresponding light-emitting chip 111 and is bonded to the bottom surface of the corresponding first lens 120.

[0056] The reflective structure 140 is disposed on the substrate 114. It can be directly molded onto the substrate 114, or it can be molded first and then fixed onto the substrate 114. In this embodiment, the reflective structure 140 is directly molded onto the substrate 114 using white resin (a high-reflectivity material). After curing, its hole walls naturally form a reflective surface without the need for additional processing. Specifically, a light-transmitting adhesive layer 150 is formed on the light-emitting chip 111 using a mold. After the light-transmitting adhesive layer 150 has cured, molten white resin is injected from the side into the cavity formed between the substrate 114, the light-transmitting adhesive layer 150, and the mold. After the white resin has cured, the mold is removed, and the reflective structure 140 is directly formed on the substrate 114. At this time, the reflective structure 140 covers the side of the light-emitting chip 111, the side of the light-transmitting adhesive layer 150, and the side of the first lens 120. Obviously, the above process steps use a single mold, requiring only one demolding, eliminating the need for multiple demoldings using different molds, simplifying the process and improving production efficiency.

[0057] Each first lens 120 is directly formed on the top surface of the light-emitting chip 111 through a corresponding reflection hole 142, thus completing the forming and assembly of the first lens 120 at the same time. When setting the first lens 120, glue can be directly injected into the reflection hole 142, reducing production steps, significantly improving production efficiency, and reducing production costs.

[0058] As for the other aspects of the COB light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the COB light-emitting device 100 in the first embodiment above. The specific details can be referred to the description of the first embodiment above, and will not be repeated here.

[0059] Please see Figure 4 , Figure 4A cross-sectional view of the COB light-emitting device in the third embodiment of this application is shown. Compared with the COB light-emitting device 100 in the first embodiment described above, the COB light-emitting device 100 in this embodiment further includes multiple light-transmitting adhesive layers 150. The multiple light-transmitting adhesive layers 150 are disposed one-to-one with multiple light-emitting areas 112. Each light-transmitting adhesive layer 150 at least covers the top surface of the corresponding light-emitting chip 111 and adheres to the bottom surface of the corresponding first lens 120. The light-transmitting adhesive layer 150 not only serves to adhere and fix the first lens 120, but can also change the emission color of the light-emitting chip 111 by filling it with phosphor, thereby meeting the requirements of different emission colors of the device.

[0060] In this embodiment, each light-transmitting adhesive layer 150 simultaneously covers the top and side surfaces of the corresponding light-emitting chip 111, thereby sealing and protecting the light-emitting chip 111, reducing the impact of the external environment on the light-emitting chip 111, and improving the service life of the light-emitting chip 111.

[0061] As for the other aspects of the COB light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the COB light-emitting device 100 in the first embodiment above. The specific content can be referred to the description of the above embodiment, and will not be repeated here.

[0062] Please see Figure 5 , Figure 5 A cross-sectional view of the COB light-emitting device in the fourth embodiment of this application is shown. Compared with the COB light-emitting device 100 in the third embodiment described above, the COB light-emitting device 100 in this embodiment has a connecting portion 122 between adjacent first lenses 120, and the connecting portion 122 is connected to the side of the first lens 120. All first lenses 120 can be connected into a whole through the connecting portion 122, which facilitates the alignment and bonding of all first lenses 120 with the top surface of all light-emitting chips 111, thereby reducing the assembly difficulty. Obviously, the connecting portion 122 only serves a connecting function, and its impact on the optical path is almost negligible. If necessary, the connecting portion 122 can be laser-cut after the first lens 120 is fixed.

[0063] In this embodiment, the first lens 120 and the connecting part 122 are integrally formed, specifically by integral injection molding using a mold.

[0064] In this embodiment, the second lens 130 further includes a support portion 134, which replaces the support structure 115. The bottom end of the support portion 134 is supported on the substrate 114, and the top end of the support portion 134 surrounds and connects all the lens portions 132. Since the second lens 130 has its own support portion 134, there is no need to set up a support structure 115, simplifying the device structure. During assembly, there is no need to separately install the support structure 115 and the second lens 130, reducing assembly steps, improving production efficiency, and further reducing the size of the COB light-emitting device 100, thus achieving miniaturization.

[0065] In this embodiment, the second lens 130 is an integrally formed structure and is bonded to the substrate 114, thereby improving the chip's sealing performance and preventing the chip from being affected by the external environment.

[0066] In this embodiment, since the support portion 134 of the second lens 130 can seal the internal light-emitting chip 111, each light-transmitting adhesive layer 150 can only cover the top surface of the corresponding light-emitting chip 111 without covering the side surface of the corresponding light-emitting chip 111, thereby reducing material usage and lowering costs.

[0067] In this embodiment, the side of the support portion 134 and the substrate 114 are coplanar, which facilitates the splicing of different COB light-emitting devices 100. When producing COB light-emitting devices 100, a module with multiple device units can be produced first, and then a cutting process can be used to cut out individual COB light-emitting devices 100, which facilitates the mass production of COB light-emitting devices 100.

[0068] As for the other aspects of the COB light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the COB light-emitting device 100 in the third embodiment above. The specific content can be referred to the description of the above embodiments, and will not be repeated here.

[0069] Please see Figure 6 , Figure 6 A partial cross-sectional view of a light-emitting device according to an embodiment of this application is shown. The light-emitting device 200 provided in this embodiment includes a substrate 210 and a COB light-emitting device 100, which is disposed on the substrate 210. The specific structure of the COB light-emitting device 100 is as described in the above embodiments. Since the light-emitting device 200 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0070] In this embodiment, the substrate 210 may be, but is not limited to, part of a circuit board or a housing.

[0071] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0072] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A COB light emitting device, characterized by, include: The light-emitting component (110) includes a plurality of light-emitting chips (111) and is provided with a plurality of light-emitting areas (112), each of the light-emitting areas (112) being formed by the light-emitting surface (113) of the light-emitting chip (111); A plurality of first lenses (120) are provided, each corresponding to one of the plurality of light-emitting areas (112). Each first lens (120) is disposed on the light-emitting chip (111) of the corresponding light-emitting area (112). The minimum angle between the extension line of the side profile of the first lens (120) and the extension line of the bottom profile of the first lens (120) on the optical axis is θ, where 90° > θ > 45°. The second lens (130) is disposed on the light-emitting component (110) and includes a plurality of lens portions (132) connected to each other. The plurality of lens portions (132) are disposed in a one-to-one correspondence with the plurality of first lenses (120), and each lens portion (132) is disposed above the corresponding first lens (120) at intervals.

2. The COB light emitting device according to claim 1, wherein, The top surface of each of the first lenses (120) is a convex curved surface.

3. The COB light emitting device according to claim 1, wherein, Also includes: A reflective structure (140) is disposed on the light-emitting component (110) and is provided with a plurality of reflective holes (142), wherein the plurality of reflective holes (142) are provided in a one-to-one correspondence with the plurality of first lenses (120); Each of the first lenses (120) is directly formed on the light-emitting chip (111) through the corresponding reflection hole (142).

4. The COB light emitting device according to claim 3, characterized in that, Also includes: Multiple light-transmitting adhesive layers (150) are provided one-to-one with the multiple light-emitting areas (112). Each light-transmitting adhesive layer (150) is provided on the top surface of the corresponding light-emitting chip (111) and is bonded to the bottom surface of the corresponding first lens (120). The reflective structure (140) is directly molded onto the light-emitting component (110) by a mold, and covers the side of the light-emitting chip (111), the light-transmitting adhesive layer (150) and the first lens (120).

5. The COB light-emitting device according to any one of claims 1 to 3, characterized in that, Also includes: Multiple light-transmitting adhesive layers (150) are provided in a one-to-one correspondence with the multiple light-emitting areas (112). Each light-transmitting adhesive layer (150) covers at least the top surface of the corresponding light-emitting chip (111) and is bonded to the bottom surface of the corresponding first lens (120).

6. The COB light-emitting device according to claim 1 or 2, characterized in that, The light-emitting component (110) also includes a substrate (114), and the plurality of light-emitting chips (111) are disposed on the substrate (114); The second lens (130) also includes a support portion (134), the bottom end of which is supported on the substrate (114), and the top end of which is connected around all the lens portions (132).

7. The COB light emitting device according to claim 6, wherein, The second lens (130) is an integrally formed structure, and the side of the support (134) is coplanar with the side of the substrate (114).

8. The COB light-emitting device according to claim 1 or 2, characterized in that, A connecting portion (122) is provided between adjacent first lenses (120), and the connecting portion (122) is connected to the side of the first lens (120).

9. The COB light emitting device according to claim 1 or 2, characterized in that, The light-emitting component (110) further includes a substrate (114) and a support structure (115). The plurality of light-emitting chips (111) are disposed on the substrate (114). The support structure (115) is supported between the substrate (114) and the second lens (130). The side of the support structure (115) is coplanar with the side of the substrate (114).

10. A light-emitting device, characterized in that, include: Matrix (210); and COB light-emitting device (100), the COB light-emitting device (100) is disposed on the substrate (210), and is the COB light-emitting device (100) according to any one of claims 1 to 9.

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