Display panel and manufacturing method thereof

Abstract

The invention relates to a display panel and a manufacturing method thereof. The display panel comprises a substrate, a first photoresist layer and a first light-emitting function part, a plurality of first electrodes arranged at intervals and a plurality of first pixel openings used for at least partially exposing the corresponding first electrodes respectively are arranged on the substrate, the first photoresist layer is arranged on the substrate, and the first light-emitting function part is arranged on the first photoresist layer. The first photoresist layer is provided with first evaporation openings communicated with the first pixel openings, and the first light-emitting function parts are arranged in the first evaporation openings and the first pixel openings and cover the corresponding first electrodes. The first evaporation openings are communicated with the first pixel openings to expose at least part of the first electrodes, so that the first light-emitting function parts are formed on the first electrodes through the first evaporation openings, sub-pixels of corresponding colors can be correspondingly formed, a metal mask plate does not need to be used, and the manufacturing cost is reduced. The problems that the aperture opening ratio of the manufactured display panel is limited and a large-size display panel is difficult to manufacture when the display panel is manufactured by using a metal mask plate are solved.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] OLED (Organic Light Emitting Diode) display panel is a display technology that uses the light-emitting principle of organic materials. It is widely used in smart phones, televisions, watches, car displays and other fields, and continues to promote the development of display technology.

[0003] The manufacturing method of the display panel in the related art has the problem that the PPI (Pixels Per Inch) of the manufactured display panel is limited, and it is difficult to manufacture a large-sized display panel. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel and a method for manufacturing the display panel in the related art, as the PPI (Pixels Per Inch) of the display panel is limited and large-size display panels are difficult to manufacture.

[0005] A display panel, comprising:

[0006] A substrate, on which a plurality of first electrodes arranged at intervals are provided, and a plurality of first pixel openings respectively used to at least partially expose the corresponding first electrodes;

[0007] A first photoresist layer is disposed on the substrate, wherein the first photoresist layer is provided with a first evaporation opening connected with the first pixel opening to expose the first electrode;

[0008] The first light emitting functional portion is disposed in the first evaporation opening and the first pixel opening, and covers the corresponding first electrode.

[0009] In one embodiment, the first light-emitting functional portion includes a first light-emitting portion and a second electrode stacked on the first electrode in a direction away from the substrate;

[0010] A plurality of first wiring structures corresponding to the second electrode are disposed on the substrate, wherein the first wiring structures are disposed outside the corresponding first pixel opening and inside the corresponding first evaporation opening, so as to be electrically connected to a portion of the second electrode located inside the corresponding first evaporation opening;

[0011] Optionally, a first power signal line is provided on the substrate, the display panel has a display area, and a first via connection structure located in the display area is further provided on the substrate;

[0012] The first wiring structure is electrically connected to the first power signal line through the first via connection structure; or

[0013] The substrate is provided with a first power signal line, the display panel has a display area and a frame area adjacent to the display area, and the substrate is further provided with a second via connection structure located in the frame area;

[0014] The first wiring structure is electrically connected to the first power signal line through the second via connection structure.

[0015] In one embodiment, the substrate is further provided with a plurality of third electrodes spaced apart from the plurality of first electrodes, and a plurality of second pixel openings for at least partially exposing the corresponding third electrodes;

[0016] The display panel comprises a second photoresist layer and a second light-emitting functional portion, wherein the second photoresist layer is arranged on a side of the first photoresist layer away from the substrate, and the second photoresist layer is provided with a second evaporation opening penetrating the first photoresist layer and communicating with the second pixel opening to expose the third electrode;

[0017] The second light-emitting functional portion is disposed in the second evaporation opening and the second pixel opening, and covers the corresponding third electrode;

[0018] Optionally, the display panel includes a first encapsulation layer, and the first encapsulation layer is arranged between the first light-emitting functional part and the second photoresist layer.

[0019] In one embodiment, the second light-emitting functional portion includes a second light-emitting portion and a fourth electrode stacked on the third electrode in a direction away from the substrate;

[0020] A plurality of second wiring structures corresponding to the fourth electrode are disposed on the substrate, and the second wiring structures are disposed outside the corresponding second pixel opening and inside the corresponding second evaporation opening, so as to be electrically connected to a portion of the fourth electrode located inside the corresponding second evaporation opening;

[0021] Optionally, a first power signal line is provided on the substrate, the display panel has a display area, and a third via connection structure located in the display area is further provided on the substrate;

[0022] The second wiring structure is electrically connected to the first power signal line through the third via connection structure; or

[0023] The substrate is provided with a first power signal line, the display panel has a display area and a frame area adjacent to the display area, and the substrate is further provided with a fourth via connection structure located in the frame area;

[0024] The second wiring structure is electrically connected to the first power signal line through the fourth via connection structure.

[0025] In one embodiment, the substrate is provided with a fifth electrode spaced apart from the first electrodes and the third electrodes, and a plurality of third pixel openings for at least partially exposing the corresponding fifth electrodes;

[0026] The display panel comprises a third photoresist layer and a third light-emitting functional portion, wherein the third photoresist layer is arranged on a side of the second photoresist layer away from the substrate, and the third photoresist layer is provided with a third evaporation opening penetrating the first photoresist layer and connected to the third pixel opening to expose the fifth electrode;

[0027] The third light-emitting functional portion is disposed in the third evaporation opening and the third pixel opening, and covers the corresponding fifth electrode;

[0028] Optionally, the display panel includes a second encapsulation layer, and the second encapsulation layer is arranged between the second light-emitting functional part and the third photoresist layer.

[0029] In one embodiment, the third light-emitting functional portion includes a third light-emitting portion and a sixth electrode stacked on the fifth electrode in a direction away from the substrate;

[0030] A plurality of third wiring structures corresponding to the sixth electrode are disposed on the substrate, and the third wiring structures are disposed outside the corresponding third pixel opening and inside the corresponding third evaporation opening, so as to be electrically connected to a portion of the sixth electrode located inside the corresponding third evaporation opening;

[0031] Optionally, a first power signal line is provided on the substrate, the display panel has a display area, and a fifth via connection structure located in the display area is further provided on the substrate;

[0032] The third wiring structure is electrically connected to the first power signal line through the fifth via connection structure; or

[0033] The substrate is provided with a first power signal line, the display panel has a display area and a frame area adjacent to the display area, and the substrate is further provided with a sixth via connection structure located in the frame area;

[0034] The third wiring structure is electrically connected to the first power signal line through the sixth via connection structure;

[0035] Optionally, two adjacent ones of the second electrode, the fourth electrode and the sixth electrode are electrically connected to each other;

[0036] Optionally, two adjacent ones of the first wiring structure, the second wiring structure and the third wiring structure are electrically connected to each other.

[0037] According to another aspect of the present application, a method for manufacturing a display panel is provided, and the method for manufacturing a display panel includes:

[0038] A substrate is provided, on which a plurality of first electrodes arranged at intervals are provided, and a plurality of first pixel openings respectively corresponding to the plurality of first electrodes; the first pixel openings are used to at least partially expose the corresponding first electrodes;

[0039] forming a first photoresist layer on the substrate, wherein the first photoresist layer fills the first pixel opening;

[0040] At least removing a portion of the first photoresist layer located in the first pixel opening to form a plurality of first evaporation openings on the first photoresist layer, wherein the first evaporation openings are connected to the corresponding first pixel openings to expose the first electrode;

[0041] A first light-emitting layer is formed on the substrate, wherein the first light-emitting layer includes a first light-emitting functional portion, and the first light-emitting functional portion is disposed in the first evaporation opening and the first pixel opening and covers the first electrode.

[0042] In one embodiment, the first light-emitting functional portion includes a first light-emitting portion and a second electrode stacked on the first electrode in a direction away from the substrate;

[0043] After providing a substrate and before forming a first photoresist layer on the substrate, the method further includes:

[0044] forming a plurality of first wiring structures corresponding to the second electrode on the substrate, wherein the first wiring structures are arranged outside the corresponding first pixel opening and inside the corresponding first evaporation opening, so as to be electrically connected to the portion of the second electrode located inside the corresponding first evaporation opening;

[0045] Optionally, the first light-emitting layer includes a first light-emitting sacrificial portion, the first light-emitting sacrificial portion covers the first photoresist layer, and after forming the first light-emitting layer on the substrate, the method further includes removing the first light-emitting sacrificial portion.

[0046] In one embodiment, the substrate is provided with third electrodes spaced apart from the first electrodes, and second pixel openings respectively corresponding to the third electrodes; the second pixel openings are used to at least partially expose the corresponding third electrodes;

[0047] forming a second photoresist layer on the substrate, wherein the second photoresist layer fills the second pixel opening;

[0048] At least removing a portion of the second photoresist layer corresponding to the second pixel opening to form a plurality of second evaporation openings on the second photoresist layer, wherein the second evaporation openings are connected to the corresponding second pixel openings to expose the third electrode;

[0049] forming a second light-emitting layer on the substrate, wherein the second light-emitting layer includes a second light-emitting functional portion, the second light-emitting functional portion is disposed in the second evaporation opening and the second pixel opening, and covers the third electrode;

[0050] Optionally, before forming the second photoresist layer on the substrate, the method further includes: forming a first encapsulation layer on the substrate, wherein the first encapsulation layer is arranged on a side of the first light-emitting layer away from the substrate;

[0051] Optionally, the second light-emitting functional portion includes a second light-emitting portion and a fourth electrode stacked on the third electrode in a direction away from the substrate;

[0052] After providing a substrate and before forming a first photoresist layer on the substrate, the method further includes:

[0053] forming a plurality of second wiring structures corresponding to the fourth electrode on the substrate, wherein the second wiring structures are arranged outside the corresponding second pixel opening and inside the corresponding second evaporation opening, so as to be electrically connected to the portion of the fourth electrode located inside the corresponding second evaporation opening;

[0054] Optionally, the second light-emitting layer includes a second light-emitting sacrificial portion, and the second light-emitting sacrificial portion covers the second photoresist layer. After the second light-emitting layer is formed on the substrate, the method further includes removing the second light-emitting sacrificial portion.

[0055] In one embodiment, the substrate is provided with fifth electrodes spaced apart from the first electrodes, and third pixel openings respectively corresponding to the fifth electrodes; the third pixel openings are used to at least partially expose the corresponding fifth electrodes;

[0056] forming a third photoresist layer on the substrate, wherein the third photoresist layer fills the third pixel opening;

[0057] At least removing a portion of the third photoresist layer corresponding to the third pixel opening to form a plurality of third evaporation openings on the third photoresist layer, wherein the third evaporation openings are connected to the corresponding third pixel openings to expose the fifth electrode;

[0058] forming a third light-emitting layer on the substrate, wherein the third light-emitting layer includes a third light-emitting functional portion, the third light-emitting functional portion is disposed in the third evaporation opening and the third pixel opening, and covers the fifth electrode;

[0059] Optionally, before forming the third photoresist layer on the substrate, the method further includes: forming a second encapsulation layer on the substrate, wherein the second encapsulation layer is arranged on a side of the second light-emitting layer away from the substrate;

[0060] Optionally, the third light-emitting functional portion includes a third light-emitting portion and a sixth electrode stacked on the fifth electrode in a direction away from the substrate;

[0061] After providing a substrate and before forming a first photoresist layer on the substrate, the method further includes:

[0062] forming a plurality of third wiring structures corresponding to the sixth electrode on the substrate, wherein the third wiring structures are arranged outside the corresponding third pixel opening and inside the corresponding third evaporation opening, so as to be electrically connected to a portion of the sixth electrode located inside the corresponding third evaporation opening;

[0063] Optionally, the third light-emitting layer includes a third light-emitting sacrificial portion, and the third light-emitting sacrificial portion covers the third photoresist layer. After the third light-emitting layer is formed on the substrate, the method further includes removing the third light-emitting sacrificial portion.

[0064] The above-mentioned display panel and its manufacturing method, by forming multiple first evaporation openings on the first photoresist layer to connect the first pixel opening and expose at least a portion of the first electrode, can form a first light-emitting functional portion on the first electrode through the first evaporation opening, and corresponding sub-pixels of corresponding colors can be formed. In this way, there is no need to use a metal mask plate (FMM), and the problem of PPI (Pixels Per Inch) of the display panel manufactured by using a metal mask plate is avoided, and the problem of difficulty in manufacturing large-size display panels is avoided. The aperture ratio of the display panel can be improved, and the manufacturing cost of the display panel can also be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] Figure 1 A schematic structural diagram of the display panel of the present application is shown.

[0066] Figure 2A side cross-sectional view of a substrate provided in the present application is shown.

[0067] Figure 3 A top view of a first wiring structure, a second wiring structure, and a third wiring structure according to an embodiment of the present application is shown.

[0068] Figure 4 A side cross-sectional view of a substrate provided with a first via connection structure according to the present application is shown.

[0069] Figure 5 A top view of a first wiring structure, a second wiring structure, and a third wiring structure according to another embodiment of the present application is shown.

[0070] Figure 6-Figure 8 A schematic diagram of the process of manufacturing a display panel provided in the present application is shown.

[0071] Figure 9(a)-Figure 9(j) A schematic diagram of the process of manufacturing a display panel using the display panel manufacturing method provided by the present application is shown.

[0072] Description of reference numerals:

[0073] 10. Display panel;

[0074] 11. substrate; 12. anode flat layer; 13. pixel definition layer; 14. first pixel opening; 15. second pixel opening; 16. third pixel opening;

[0075] 110, first electrode; 120, second electrode; 121, first wiring structure; 122, first via connection structure; 130, third electrode; 140, fourth electrode; 141, second wiring structure; 150, fifth electrode; 160, sixth electrode; 161, third wiring structure; 171, bottom layer; 172, conductive layer; 173, top layer;

[0076] 210, first photoresist layer; 211, first evaporation opening; 220, second photoresist layer; 221, second evaporation opening; 230, third photoresist layer; 231, third evaporation opening; 240, fourth photoresist layer;

[0077] 310, first light-emitting layer; 311, first light-emitting portion; 320, second light-emitting layer; 321, second light-emitting portion; 330, third light-emitting layer; 331, third light-emitting portion;

[0078] 410, first encapsulation layer; 420, second encapsulation layer; 430, third encapsulation layer. DETAILED DESCRIPTION

[0079] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0080] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0081] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0082] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0083] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0084] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0085] OLED (Organic Light Emitting Diode) display technology has broad application prospects in the display field due to its advantages such as self-luminous characteristics, high contrast, low power consumption and flexibility. In the prior art, for the production of OLED display panels, a mask is usually used to evaporate organic light-emitting materials and metal electrode materials to specific positions, thereby realizing the manufacture of display panels. In the process of using the mask, there are some challenges, such as the need to maintain high-precision pattern alignment, ensure the flatness and cleanliness of the mask, and achieve uniform evaporation on large-size substrates. Ultimately, the PPI (Pixels Per Inch) of the display panel produced will be limited, and large-size display panels will be difficult to produce.

[0086] Based on this, the present application provides a display panel and a method for manufacturing the same, so as to solve the problem of limited PPI of the display panel and reduce the difficulty of manufacturing a large-size display panel.

[0087] See also Figure 1 and Figure 2 As shown, the display panel 10 provided in the present application includes a substrate 11, a first photoresist layer 210 and a first light-emitting functional part, a plurality of first electrodes 110 arranged at intervals are provided on the substrate 11, and a plurality of first pixel openings 14 are respectively used to at least partially expose the corresponding first electrodes 110, the first photoresist layer 210 is provided on the substrate 11, and a first evaporation opening 211 connected to the first pixel opening 14 is provided on the first photoresist layer 210, so as to expose the first electrode 110 through the first evaporation opening 211. Here, please refer to FIG. 9 (a) for easy understanding, the first light-emitting functional part is provided in the first evaporation opening 211 and the first pixel opening 14, and covers the corresponding first electrode 110. Optionally, the thickness of the first photoresist layer 210 is 0.5um-1um.

[0088] The present application can form a first evaporation opening 211 by setting a first photoresist layer 210, and form a first light-emitting functional portion on the first electrode 110 through the first evaporation opening 211, and corresponding sub-pixels of corresponding colors can be formed without using a metal mask plate (FMM), thereby avoiding the problem of using a metal mask plate to manufacture the display panel 10, such as the PPI (Pixels Per Inch) of the manufactured display panel 10 is limited, and the difficulty in manufacturing a large-size display panel 10.

[0089] The first light-emitting functional part includes a first light-emitting part 311 and a second electrode 120 stacked on the first electrode 110 in a direction away from the substrate 11. A plurality of first wiring structures 121 corresponding to the second electrode 120 are provided on the substrate 11. The first wiring structure 121 is provided outside the corresponding first pixel opening 14 and in the corresponding first evaporation opening 211, so as to be electrically connected to the portion of the second electrode 120 located in the corresponding first evaporation opening 211. In some embodiments, the first electrode 110 is an anode, the second electrode 120 is a cathode, the first light-emitting part 311 is provided between the first electrode 110 and the second electrode 120, the first light-emitting part 311 emits light under the effect of applying a voltage between the anode and the cathode to inject carriers into the first light-emitting part 311, and the first wiring structure 121 is a connection structure for connecting the second electrode 120 and the corresponding power signal line (such as a VSS signal line) to provide the second electrode 120 with a corresponding low-level voltage signal (i.e., a VSS signal) through the first wiring structure 121. At the same time, the first wiring structure 121 can also play an isolating role, isolating the corresponding first light-emitting portion 311 to avoid cross-talk between adjacent light-emitting portions, so as to improve the display quality of the display panel 10 .

[0090] See also Figure 1 As shown, the substrate 11 is also provided with a plurality of third electrodes 130 spaced apart from the plurality of first electrodes 110 and a plurality of fifth electrodes 150 spaced apart from the plurality of first electrodes 110. Correspondingly, the substrate 11 is also provided with a plurality of second pixel openings 15 for at least partially exposing the corresponding third electrodes 130, refer to FIG. 9(a) for easy understanding, and a plurality of third pixel openings 16 for at least partially exposing the corresponding fifth electrodes 150.

[0091] As shown in reference 2, an anode planarization layer 12 is disposed on the substrate 11, and a first electrode 110, a third electrode 130, and a fifth electrode 150 are disposed on the anode planarization layer 12 at intervals from each other. A pixel definition layer 13 is also disposed on the anode planarization layer 12, and the pixel definition layer 13 at least covers the first electrode 110, the third electrode 130, and the fifth electrode 150. A first pixel opening 14, a second pixel opening 15, and a third pixel opening 16 are opened on the pixel definition layer 13, so that the corresponding first electrode 110 is at least partially exposed through the first pixel opening 14, the corresponding third electrode 130 is at least partially exposed through the second pixel opening 15, and the corresponding fifth electrode 150 is at least partially exposed through the third pixel opening 16. Optionally, the material of the anode planarization layer 12 and the pixel definition layer 13 includes photoresist.

[0092] Continue reading Figure 1 The display panel 10 includes a second photoresist layer 220 and a second light-emitting functional portion. The second photoresist layer 220 is disposed on a side of the first photoresist layer 210 away from the substrate 11. The second photoresist layer 220 is provided with a second evaporation opening 221 penetrating the first photoresist layer 210 and communicating with the second pixel opening 15, so as to expose the third electrode 130 through the second evaporation opening 221. For ease of understanding, please refer to FIG. 9(f). The second light-emitting functional portion is disposed in the second evaporation opening 221 and the second pixel opening 15, and covers the corresponding third electrode 130. Optionally, the thickness of the second photoresist layer 220 is 0.5um-1um.

[0093] By setting the second photoresist layer 220, a second evaporation opening 221 can be formed, penetrating the portion of the first photoresist layer 210 corresponding to the second evaporation opening 221 and the second pixel opening 15, so that the second pixel opening 15 is connected with the second evaporation opening 221, and then a second light-emitting functional portion can be formed in the second evaporation opening 221 and the second pixel opening 15. Without using a mask, the problem of limited PPI (Pixels Per Inch) of the manufactured display panel and difficulty in manufacturing a large-sized display panel when using a metal mask to manufacture a display panel is avoided, and the aperture ratio of the display panel can be improved, and the manufacturing cost of the display panel can also be reduced.

[0094] Optionally, the display panel 10 includes a first encapsulation layer 410, which is disposed between the first light-emitting functional unit and the second photoresist layer 220 to encapsulate the first light-emitting functional unit, thereby improving the quality of the display panel 10 and further improving the display quality. Optionally, the thickness of the first encapsulation layer 410 is 10nm-50nm.

[0095] The second light-emitting functional part includes a second light-emitting part 321 and a fourth electrode 140 stacked on the third electrode 130 in a direction away from the substrate 11. A plurality of second wiring structures 141 corresponding to the fourth electrode 140 are provided on the substrate 11. The second wiring structure 141 is provided outside the corresponding second pixel opening 15 and in the corresponding second evaporation opening 221, so as to be electrically connected to the portion of the fourth electrode 140 located in the corresponding second evaporation opening 221. Correspondingly, the third electrode 130 is an anode, the fourth electrode 140 is a cathode, the second light-emitting part 321 is provided between the third electrode 130 and the fourth electrode 140, the second light-emitting part 321 emits light under the effect of applying a voltage between the anode and the cathode to inject carriers into the second light-emitting part 321, and the second wiring structure 141 is a connection structure for connecting the fourth electrode 140 and the corresponding power signal line (such as a VSS signal line) to provide the fourth electrode 140 with a corresponding low-level voltage signal (i.e., a VSS signal) through the second wiring structure 141. At the same time, the second wiring structure 141 can also play an isolating role, isolating the corresponding second light-emitting portion 321 to avoid light crosstalk between adjacent light-emitting portions, so as to improve the display quality of the display panel 10 .

[0096] The second light emitting portion 321 is configured to emit light of a color different from the color of the light emitted by the first light emitting portion 311 , so as to realize light emission of pixels of different colors.

[0097] Continue reading Figure 1 The display panel 10 includes a third photoresist layer 230 and a third light-emitting functional unit. The third photoresist layer 230 is disposed on a side of the second photoresist layer 220 away from the substrate 11. The third photoresist layer 230 is provided with a third evaporation opening 231 that penetrates the first photoresist layer 210 and is connected to the third pixel opening 16, so as to expose the fifth electrode 150 through the third evaporation opening 231. For ease of understanding, please refer to FIG. 9(i). The third light-emitting functional unit is disposed in the third evaporation opening 231 and the third pixel opening 16, and covers the corresponding fifth electrode 150. Optionally, the thickness of the third photoresist layer 230 satisfies 0.5um-1um.

[0098] By setting the third photoresist layer 230, a third evaporation opening 231 can be formed, penetrating the first photoresist layer 210 and the second photoresist layer 220 corresponding to the second evaporation opening 221 and the second pixel opening 15, so that the third pixel opening 16 is connected to the third evaporation opening 231, and then the third light-emitting functional part can be formed in the third evaporation opening 231 and the third pixel opening 16. Without using a mask, the problem of limited PPI (Pixels Per Inch) of the manufactured display panel and difficulty in manufacturing large-size display panels when using a metal mask to manufacture a display panel is avoided.

[0099] Optionally, the display panel 10 includes a second encapsulation layer 420, which is disposed between the second light-emitting functional unit and the third photoresist layer 230 to encapsulate the second light-emitting functional unit, thereby improving the quality of the display panel 10 and further improving the display quality. Optionally, the thickness of the second encapsulation layer 420 is 10nm-50nm.

[0100] The third light-emitting functional part includes a third light-emitting part 331 and a sixth electrode 160 stacked on the fifth electrode 150 in a direction away from the substrate 11. A plurality of third wiring structures 161 corresponding to the sixth electrode 160 are provided on the substrate 11. The third wiring structure 161 is provided outside the corresponding third pixel opening 16 and in the corresponding third evaporation opening 231, so as to be electrically connected to the portion of the sixth electrode 160 located in the corresponding third evaporation opening 231. Correspondingly, the fifth electrode 150 is an anode, the sixth electrode 160 is a cathode, the third light-emitting part 331 is provided between the fifth electrode 150 and the sixth electrode 160, the third light-emitting part 331 emits light under the effect of applying a voltage between the anode and the cathode to inject carriers into the third light-emitting part 331, and the third wiring structure 161 is a connection structure for connecting the sixth electrode 160 and the corresponding power signal line (such as a VSS signal line) to provide the corresponding low-level voltage signal (i.e., VSS signal) to the sixth electrode 160 through the third wiring structure 161. Furthermore, the first wiring structure 121 , the second wiring structure 141 and the third wiring structure 161 of the present application can also isolate the corresponding light-emitting parts, or isolate the pixels, to avoid light crosstalk in the display panel 10 , so as to improve the display effect of the display panel 10 .

[0101] The third light-emitting portion 331 can be configured to emit light of a different color from the light emitted by the first light-emitting portion 311 and the second light-emitting portion 321. In some embodiments, the first light-emitting portion 311 is configured to emit red light, the second light-emitting portion 321 is configured to emit green light, and the third light-emitting portion 331 is configured to emit blue light. Under the isolation effect of the corresponding wiring structure, the first light-emitting portion 311, the second light-emitting portion 321 and the third light-emitting portion 331 can have a better light-emitting effect, avoid cross-talk between adjacent light-emitting portions, and improve the display effect of the display panel 10.

[0102] In some embodiments, the display panel 10 also includes a fourth photoresist layer 240, which is disposed on a side of the third photoresist layer 230 away from the substrate 11 and covers the third light-emitting functional portion to protect the third light-emitting functional portion. At the same time, the fourth photoresist layer 240 is filled in the third evaporation opening 231 to make the display panel 10 flat.

[0103] Optionally, the display panel 10 further includes a third encapsulation layer 430, which is disposed between the third light-emitting functional unit and the fourth photoresist layer 240 to encapsulate and protect the third light-emitting functional unit, thereby improving the quality of the display panel 10 and further improving the display quality. Optionally, the thickness of the third encapsulation layer 430 is 50nm-150nm.

[0104] The first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 of the present application can be set to be relatively independent of each other and electrically connected to each other through the first power signal line, so that two adjacent ones of the second electrode 120, the fourth electrode 140 and the sixth electrode 160 are electrically connected to each other to form a cathode network. Figure 3 , Figure 3 The first wiring structure 121 , the second wiring structure 141 , and the third wiring structure 161 of the illustrated embodiment are relatively independent of each other and are arranged in pairs at intervals.

[0105] like Figure 3 In the illustrated embodiment, the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 can all be configured to include an inner ring structure and an outer ring structure that are arranged around the corresponding first electrode 110, the third electrode 130 or the fifth electrode 150 and are electrically connected to each other. The double-layer ring structure can improve the isolation effect of the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161, avoid light crosstalk between the pixels that are ultimately formed, and thereby improve the display effect of the display panel 10.

[0106] And in Figure 3 In the embodiment shown, in conjunction with reference to Figure 4 As shown, optionally, a first power signal line is provided on the substrate 11, the display panel 10 has a display area, and a first via connection structure 122 is also provided on the substrate 11 located in the display area. The first wiring structure 121 is electrically connected to the first power signal line through the first via connection structure 122. The first power signal line is electrically connected to the first wiring structure 121 through the first via connection structure 122 and then electrically connected to the second electrode 120 to energize the second electrode 120. The corresponding first electrode 110 is also connected to the corresponding power signal line to inject electrons and holes into the first light-emitting portion 311 through the first electrode 110 and the second electrode 120, so that the first light-emitting portion 311 is excited to generate light.

[0107] Correspondingly, the substrate 11 is further provided with a third via hole connection structure located in the display area and a fifth via hole connection structure located in the display area, the second wiring structure 141 is electrically connected to the first power signal line through the third via hole connection structure, and the third wiring structure 161 is electrically connected to the first power signal line through the fifth via hole connection structure. That is, the first power signal line is electrically connected to the second wiring structure 141 through the third via hole connection structure and then electrically connected to the fourth electrode 140, so as to energize the fourth electrode 140. At this time, the third electrode 130 is also connected to the corresponding power signal line, so as to inject electrons and holes into the second light-emitting portion 321 through the third electrode 130 and the fourth electrode 140, so that the second light-emitting portion 321 is excited to generate light. Correspondingly, the first power signal line is electrically connected to the third wiring structure 161 through the fifth via connection structure and then electrically connected to the sixth electrode 160 to energize the sixth electrode 160. Correspondingly, the fifth electrode 150 is also electrically connected to the corresponding power signal line, and electrons and holes are injected into the third light-emitting portion 331 through the fifth electrode 150 and the sixth electrode 160, so that the third light-emitting portion 331 is excited to generate light.

[0108] like Figure 4 , the first via connection structure 122 can be arranged on the side of the corresponding first wiring structure 121 facing the substrate 11, the first power signal line is arranged on the direction of the first wiring structure 121 facing the substrate 11, a first through hole is penetrated on at least one of the anode flat layer 12 and the pixel definition layer 13, and the first via connection structure 122 passes through the first through hole to connect between the first power signal line and the first wiring structure 121, so as to realize the conduction between the second electrode 120 and the corresponding power signal line or the conduction of the cathode network. In some embodiments, the first via connection structure 122 can also be arranged on the side of the first wiring structure 121 away from the substrate 11. In this case, the first power signal line is arranged on the direction of the first wiring structure 121 away from the substrate 11, and the first via connection structure 122 passes through the various layers of structures arranged on the side of the first wiring structure 121 away from the substrate 11, and is connected between the first power signal line and the first wiring structure 121, so as to realize the conduction between the second electrode 120 and the corresponding power signal line or the conduction of the cathode network.

[0109] Correspondingly, the third via hole connection structure has the same structure as the first via hole connection structure 122, which can be referred to Figure 4The schematic diagram of the first via connection structure 122 is shown for easy understanding. The third via connection structure can be arranged on the side of the corresponding second wiring structure 141 facing the substrate 11, and a second through hole is penetrated on at least one of the anode flat layer 12 and the pixel definition layer 13. The third via connection structure passes through the second through hole and is connected between the first power signal line and the second wiring structure 141 to achieve conduction between the fourth electrode 140 and the corresponding power signal line or the cathode network. The third via connection structure can also be arranged on the side of the second wiring structure 141 away from the substrate 11. The third via connection structure passes through the various layers of the structure arranged on the side of the second wiring structure 141 away from the substrate 11, and is connected between the first power signal line and the second wiring structure 141 to achieve conduction between the fourth electrode 140 and the corresponding power signal line or the cathode network.

[0110] Correspondingly, the fifth via hole connection structure has the same structure as the first via hole connection structure 122, which can be referred to Figure 4 The schematic diagram of the first via connection structure 122 is shown for easy understanding. The fifth via connection structure can be arranged on the side of the corresponding third wiring structure 161 facing the substrate 11, and a third through hole is penetrated on at least one of the anode flat layer 12 and the pixel definition layer 13. The fifth via connection structure passes through the third through hole and is connected between the first power signal line and the third wiring structure 161 to achieve conduction between the sixth electrode 160 and the corresponding power signal line or to achieve conduction of the cathode network. The fifth via connection structure can also be arranged on the side of the third wiring structure 161 away from the substrate 11. The fifth via connection structure passes through the various layers of structures arranged on the side of the third wiring structure 161 away from the substrate 11, and is connected between the first power signal line and the third wiring structure 161 to achieve conduction between the sixth electrode 160 and the corresponding power signal line or to achieve conduction of the cathode network.

[0111] The first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 of the present application can also be arranged to be directly electrically connected to each other to form a cathode network, that is, two adjacent ones of the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 are directly electrically connected to each other. Figure 5 As shown, Figure 5 In the illustrated embodiment, first wiring structure 121 , second wiring structure 141 , and third wiring structure 161 are connected to one another and are electrically conductive to one another.

[0112] exist Figure 5In the illustrated embodiment, the display panel 10 has a display area and a frame area adjacent to the display area. The first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 in the display area are directly electrically connected to each other. Therefore, there is no need to additionally set connecting wires in the display area to realize the electrical connection between the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161. An electrical connection structure is set in the frame area to connect the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 and the corresponding power signal line. The substrate 11 may be provided with a second via connection structure, a fourth via connection structure and a sixth via connection structure located in the frame area. The first wiring structure 121 near the frame area is electrically connected to the first power signal line through the second via connection structure, the second wiring structure 141 near the frame area is electrically connected to the first power signal line through the fourth via connection structure, and the third wiring structure 161 near the frame area is electrically connected to the first power signal line through the sixth via connection structure, so as to realize the electrical connection between the entire cathode and the corresponding power signal line.

[0113] In some embodiments, the first wiring structure 121 , the second wiring structure 141 and the third wiring structure 161 each include a top layer 173 , a bottom layer 171 and a conductive layer 172 disposed between the top layer 173 and the bottom layer 171 , and the second electrode 120 , the fourth electrode 140 and the sixth electrode 160 are each connected to the corresponding conductive layer 172 .

[0114] The present application also provides a method for manufacturing a display panel 10, which is used to manufacture the above-mentioned display panel 10, so as to reduce the difficulty of manufacturing a large-size display panel 10 and solve the problem of PPI (Pixels Per Inch) limitation in the existing manufacturing of the display panel 10.

[0115] See also Figure 6 , with reference to FIG. 9( a) to FIG. 9( e), the method for manufacturing the display panel 10 includes:

[0116] S11, firstly, a substrate 11 is provided, on which a plurality of first electrodes 110 arranged at intervals, a third electrode 130 arranged at intervals with the plurality of first electrodes 110, and a fifth electrode 150 arranged at intervals with the plurality of first electrodes 110 are provided, or in other words, a plurality of first electrodes 110, a plurality of third electrodes 130, and a plurality of fifth electrodes 150 arranged at intervals with each other are provided on the substrate 11. The substrate 11 is also provided with a plurality of first pixel openings 14 respectively corresponding to the plurality of first electrodes 110, a plurality of second pixel openings 15 respectively corresponding to the plurality of third electrodes 130, and a plurality of third pixel openings 16 respectively corresponding to the plurality of fifth electrodes 150.

[0117] In some embodiments, an anode flat layer 12 is first formed on a substrate 11, a plurality of first electrodes 110, a plurality of third electrodes 130 and a plurality of fifth electrodes 150 are formed on the anode flat layer 12, and a pixel definition layer 13 is then formed on the anode flat layer 12, the pixel definition layer 13 at least covers the first electrodes 110, the third electrodes 130 and the fifth electrodes 150, and then a plurality of first pixel openings 14, a plurality of second pixel openings 15 and a plurality of third pixel openings 16 are opened on the pixel definition layer 13, wherein the first pixel opening 14 is used to at least partially expose the corresponding first electrode 110, the second pixel opening 15 is used to at least partially expose the corresponding third electrode 130, and the third pixel opening 16 is used to at least partially expose the corresponding fifth electrode 150. The preparation of the anode flat layer 12 is conducive to the relative flatness of the positions of the anodes such as the first electrode 110, the third electrode 130 and the fifth electrode 150, and thus facilitates the adjustment of the positions of the anodes.

[0118] In some embodiments, the sizes of the first electrode 110 , the third electrode 130 and the fifth electrode 150 may be adjusted by comprehensively considering factors such as the life span and aperture ratio of the display panel 10 , and are not limited here.

[0119] S12. After providing the above-mentioned substrate 11, a first photoresist layer 210 is formed on the substrate 11, the first photoresist layer 210 fills the first pixel opening 14, and then at least the portion of the first photoresist layer 210 located in the first pixel opening 14 is removed to form a plurality of first evaporation openings 211 on the first photoresist layer 210. The first evaporation openings 211 are connected to the corresponding first pixel openings 14 to expose the first pixel opening 14 and the first electrode 110 in the first pixel opening 14, so as to facilitate the subsequent formation of the first light-emitting portion 311 and the second electrode 120.

[0120] S13, forming a first light-emitting layer 310 on the substrate 11, the first light-emitting layer 310 includes a first light-emitting functional part and a first light-emitting sacrificial part, the first light-emitting functional part is arranged in the first evaporation opening 211 and the first pixel opening 14, and covers the first electrode 110, and the first light-emitting sacrificial part covers the first photoresist layer 210. The first light-emitting functional part includes a first light-emitting part 311 and a second electrode 120 stacked on the first electrode 110 in a direction away from the substrate 11, and holes and electrons are input into the first light-emitting part 311 through the first electrode 110 and the second electrode 120, so that the first light-emitting part 311 is stimulated to emit light.

[0121] In some embodiments, the first light-emitting layer 310 can be formed on the substrate 11 by evaporation. For example, after forming the first photoresist layer 210 and the first evaporation opening 211, a first light-emitting material layer is evaporated. The portion of the first light-emitting material layer corresponding to the first electrode 110 in the first evaporation opening 211 and the first pixel opening 14 is the first light-emitting portion 311, and the remaining portion is the first light-emitting sacrificial portion. Then, the second electrode 120 is formed on the first light-emitting portion 311 to form the first light-emitting layer 310.

[0122] S14. After forming the first light-emitting layer 310 on the substrate 11 and before forming the second photoresist layer 220 on the substrate 11, it also includes forming a first encapsulation layer 410 on the substrate 11. The first encapsulation layer 410 is arranged on a side of the first light-emitting layer 310 away from the substrate 11 to encapsulate the first light-emitting layer 310, or to encapsulate the pixel unit corresponding to the formed first light-emitting layer 310, so as to improve the display effect.

[0123] Correspondingly, see Figure 7 , referring to FIG. 9( e ) to FIG. 9( g ), the method for manufacturing the display panel 10 further includes:

[0124] S21. After forming the first light-emitting layer 310 on the substrate 11, a second photoresist layer 220 is formed on the substrate 11, and the second photoresist layer 220 fills the second pixel opening 15. At least the portion of the second photoresist layer 220 corresponding to the second pixel opening 15 is removed to form a plurality of second evaporation openings 221 on the second photoresist layer 220. The second evaporation openings 221 are connected to the corresponding second pixel openings 15 to expose the third electrode 130 in the second pixel opening 15, so as to facilitate the subsequent formation of the second light-emitting portion 321 and the fourth electrode 140.

[0125] When forming the second evaporation opening 221 and connecting the second pixel opening 15, it is necessary to sequentially remove the portion of the second photoresist layer 220 corresponding to the second pixel opening 15, remove the portion of the first encapsulation layer 410 corresponding to the second evaporation opening 221 and the second pixel opening 15, remove the portion of the first light-emitting material layer corresponding to the second evaporation opening 221 and the second pixel opening 15, and remove the portion of the first photoresist layer 210 corresponding to the second evaporation opening 221 and the second pixel opening 15, so that the second evaporation opening 221 is connected to the second pixel opening 15.

[0126] S22, after forming the second evaporation opening 221, a second light-emitting layer 320 is formed on the substrate 11, the second light-emitting layer 320 includes a second light-emitting functional part and a second light-emitting sacrificial part, the second light-emitting functional part is arranged in the second evaporation opening 221 and the second pixel opening 15, and covers the third electrode 130, and the second light-emitting sacrificial part covers the second photoresist layer 220. Among them, the second light-emitting functional part includes a second light-emitting part 321 and a fourth electrode 140 stacked on the third electrode 130 in a direction away from the substrate 11, and holes and electrons are input into the second light-emitting part 321 through the third electrode 130 and the fourth electrode 140, so that the second light-emitting part 321 is stimulated to emit light.

[0127] In some embodiments, the second light-emitting layer 320 may be formed on the substrate 11 by evaporation, for example, after forming the second photoresist layer 220 and the second evaporation opening 221, a second light-emitting material layer is evaporated, and the portion of the second light-emitting material layer corresponding to the third electrode 130 in the second evaporation opening 221 and the second pixel opening 15 is the second light-emitting portion 321, and the remaining portion is the second light-emitting sacrificial portion, and then the fourth electrode 140 is formed on the second light-emitting portion 321 to form the second light-emitting layer 320. The color of the light emitted by the second light-emitting material layer when stimulated may be different from the color of the light emitted by the first light-emitting material layer when stimulated to form pixels of different colors.

[0128] S23. After forming the second light-emitting layer 320 on the substrate 11 and before forming the third photoresist layer 230 on the substrate 11, it also includes forming a second encapsulation layer 420 on the substrate 11. The second encapsulation layer 420 is arranged on the side of the second light-emitting layer 320 away from the substrate 11 to encapsulate the second light-emitting layer 320, or to encapsulate the pixel unit corresponding to the formed second light-emitting layer 320, so as to improve the display effect.

[0129] Correspondingly, see Figure 8 , referring to FIG. 9( h) to FIG. 9( j), the method for manufacturing the display panel 10 further includes:

[0130] S31. After forming the second light-emitting layer 320 on the substrate 11, a third photoresist layer 230 is formed on the substrate 11, and the third photoresist layer 230 fills the third pixel opening 16. At least the portion of the third photoresist layer 230 corresponding to the third pixel opening 16 is removed to form a plurality of third evaporation openings 231 on the third photoresist layer 230. The third evaporation openings 231 are connected to the corresponding third pixel openings 16 to expose the third pixel opening 16 and the fifth electrode 150 in the third pixel opening 16, so as to facilitate the subsequent formation of the third light-emitting portion 331 and the sixth electrode 160.

[0131] When forming the third evaporation opening 231 and connecting the third pixel opening 16, in some embodiments, it is necessary to sequentially remove the portion of the third photoresist layer 230 corresponding to the third pixel opening 16, remove the portion of the second packaging layer 420 corresponding to the third evaporation opening 231 and the third pixel opening 16, remove the portion of the second luminescent material layer corresponding to the third evaporation opening 231 and the third pixel opening 16, remove the portion of the second photoresist layer 220 corresponding to the third evaporation opening 231 and the third pixel opening 16, remove the portion of the first packaging layer 410 corresponding to the third evaporation opening 231 and the third pixel opening 16, remove the portion of the first luminescent material layer corresponding to the third evaporation opening 231 and the third pixel opening 16, and remove the portion of the first photoresist layer 210 corresponding to the third evaporation opening 231 and the third pixel opening 16, so that the third evaporation opening 231 and the third pixel opening 16 are connected.

[0132] S32, forming a third light-emitting layer 330 on the substrate 11, the third light-emitting layer 330 includes a third light-emitting functional part and a third light-emitting sacrificial part, the third light-emitting functional part is arranged in the third evaporation opening 231 and the third pixel opening 16, and covers the fifth electrode 150, and the third light-emitting sacrificial part covers the third photoresist layer 230. The third light-emitting functional part includes a third light-emitting part 331 and a sixth electrode 160 stacked on the third electrode 130 in a direction away from the substrate 11, and holes and electrons are input into the third light-emitting part 331 through the fifth electrode 150 and the sixth electrode 160, so that the third light-emitting part 331 is stimulated to emit light.

[0133] In some embodiments, a third light-emitting layer 330 can be formed on the substrate 11 by evaporation. For example, after forming a third photoresist layer 230 and a third evaporation opening 231, a third light-emitting material layer is evaporated. The portion of the third light-emitting material layer corresponding to the fifth electrode 150 in the third evaporation opening 231 and the third pixel opening 16 is the third light-emitting portion 331, and the remaining portion is the third light-emitting sacrificial portion. Thereafter, a sixth electrode 160 is formed on the third light-emitting portion 331 to form a third light-emitting layer 330.

[0134] S33. After forming the third light-emitting layer 330 on the substrate 11 and before forming the fourth photoresist layer 240 on the substrate 11, it also includes forming a third encapsulation layer 430 on the substrate 11. The third encapsulation layer 430 is arranged on the side of the third light-emitting layer 330 away from the substrate 11 to encapsulate the third light-emitting layer 330, or to encapsulate the pixel unit corresponding to the formed third light-emitting layer 330, so as to improve the display effect.

[0135] In some embodiments, the first encapsulation layer 410 and the second encapsulation layer 420 are formed by an atomic deposition process, and the third encapsulation layer 430 can be formed by an atomic deposition process or a chemical vapor deposition process. In some embodiments, the thickness of the first encapsulation layer 410 and the second encapsulation layer 420 are both 10nm-50nm, and the thickness of the third encapsulation layer 430 is both 50nm-100nm.

[0136] In some embodiments, the thickness of the first photoresist layer 210 , the second photoresist layer 220 , and the third photoresist layer 230 may be 0.5-1 um.

[0137] In some embodiments, when forming the first evaporation opening 211, the second evaporation opening 221 or the third evaporation opening 221, an etching or development process may be used to form corresponding openings on the first photoresist layer 210, the second photoresist layer 220 or the third photoresist layer 230. When removing the corresponding parts on the first encapsulation layer 410 or the second encapsulation layer 420, fluorine ions may be used to facilitate the removal of the corresponding parts on the first encapsulation layer 410 or the second encapsulation layer 420, that is, the corresponding encapsulation material is cleaned away using a fluorine ion chamber, such as using a fluorine ion chamber to clean away the corresponding encapsulation layer prepared by atomic layer deposition technology, which can replace the harsh chamber environment of dry etching and is conducive to improving the quality of the display panel 10. In combination with the above-mentioned etching or development process, the first pixel opening 14 and the first evaporation opening 211 are connected, the second pixel opening 15 and the second evaporation opening 221 are connected, and the third pixel opening 16 and the third evaporation opening 231 are connected.

[0138] In some embodiments, after the third light-emitting layer 330 is formed on the substrate 11, a fourth photoresist layer 240 is also formed on the substrate 11, the fourth photoresist layer 240 covers the third light-emitting layer 330, and the fourth photoresist layer 240 fills the third evaporation opening 231 to make the upper part of the third light-emitting layer 330 flat, which is beneficial to the subsequent packaging of the display panel 10.

[0139] In some embodiments, after forming the third light-emitting layer 330 on the substrate 11, the third light-emitting sacrificial portion, the second light-emitting sacrificial portion and the first light-emitting sacrificial portion may be removed in sequence. Figure 1As shown, specifically, part of the third encapsulation layer 430, part of the third light-emitting layer 330, part of the third photoresist layer 230, part of the second encapsulation layer 420, part of the second light-emitting layer 320, part of the second photoresist layer 220, part of the first encapsulation layer 410, and part of the first light-emitting layer 310 are removed in sequence to retain the first light-emitting functional part, the second light-emitting functional part, and the third light-emitting functional part, or to retain the corresponding three pixel parts. Preferably, the first light-emitting sacrificial part, the second light-emitting sacrificial part, and the third light-emitting sacrificial part are not removed to reduce the risk of damaging the first light-emitting part 311, the second light-emitting part 321, and the third light-emitting part 331 during the removal process.

[0140] In some embodiments, the first light-emitting material layer, the second light-emitting material layer, and the third light-emitting material layer may be formed on the substrate 11 by using an inkjet printing (IJP) process.

[0141] Finally, the display panel 10 is packaged to form an overall packaging layer, and a chemical vapor deposition (CVD) process may be used. Preferably, the thickness of the overall packaging layer is about 1 um.

[0142] After providing a substrate 11, before forming a first photoresist layer 210 on the substrate 11, the method further includes forming a plurality of first wiring structures 121 corresponding to the second electrode 120 on the substrate 11, forming a plurality of second wiring structures 141 corresponding to the fourth electrode 140 on the substrate 11, and forming a plurality of third wiring structures 161 corresponding to the sixth electrode 160 on the substrate 11. The first wiring structure 121 is disposed outside the corresponding first pixel opening 14 and inside the corresponding first evaporation opening 211, so as to be electrically connected to the portion of the second electrode 120 located inside the corresponding first evaporation opening 211, the second wiring structure 141 is disposed outside the corresponding second pixel opening 15 and inside the corresponding second evaporation opening 221, so as to be electrically connected to the portion of the fourth electrode 140 located inside the corresponding second evaporation opening 221, and the third wiring structure 161 is disposed outside the corresponding third pixel opening 16 and inside the corresponding third evaporation opening 231, so as to be electrically connected to the portion of the sixth electrode 160 located inside the corresponding third evaporation opening 231.

[0143] In some embodiments, in conjunction with Figure 2As shown, before forming the first photoresist layer 210 on the substrate 11, the method further includes sequentially arranging a bottom layer 171, a conductive layer 172 and a top layer 173 on the pixel definition layer 13 to form the corresponding first wiring structure 121, the second wiring structure 141 and the third wiring structure 161. After the bottom layer 171, the conductive layer 172 and the top layer 173 are sequentially arranged on the pixel definition layer 13, the conductive layer 172 is etched by etching or other processes, so that the radial dimension of the conductive layer 172 does not exceed the radial dimension of the bottom layer 171 and the top layer 173, or in other words, the projection range of the conductive layer 172 on the substrate 11 is within the projection range of the bottom layer 171 on the substrate 11, and the projection range of the conductive layer 172 on the substrate 11 is within the projection range of the top layer 173 on the substrate 11, so as to form the corresponding first wiring structure 121, the second wiring structure 141 and the third wiring structure 161. It can be understood that the setting of the projection size of the above-mentioned conductive layer 172 is beneficial to the subsequent formation of the first light-emitting material layer, the second light-emitting material layer and the third light-emitting material layer. By adjusting the evaporation angle, the corresponding first light-emitting material layer, the second light-emitting material layer or the third light-emitting material layer can be cut off at the corresponding wiring structure, so as to facilitate the connection of the corresponding second electrode 120, the fourth electrode 140 or the sixth electrode 160 to the corresponding conductive layer 172.

[0144] After the first evaporation opening 211 is formed on the substrate 11, when forming the first light-emitting material layer, it is necessary to adjust the evaporation angle to ensure that the first light-emitting material layer is broken at the first wiring structure 121. Correspondingly, when forming the second light-emitting material layer, the evaporation angle is adjusted to ensure that the second light-emitting material layer is broken at the second wiring structure 141. When forming the third light-emitting material layer, the evaporation angle is correspondingly adjusted to ensure that the third light-emitting material layer is broken at the third wiring structure 161. In this way, when the second electrode 120, the fourth electrode 140 and the sixth electrode 160 are subsequently formed, the second electrode 120 can be connected to the conductive layer 172 of the corresponding first wiring structure 121, the fourth electrode 140 can be connected to the conductive layer 172 of the corresponding second wiring structure 141, and the sixth electrode 160 can be connected to the conductive layer 172 of the corresponding third wiring structure 161. In some embodiments, the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 may be prepared by a photolithography process combined with an etching process, wherein the bottom layer 171 and the top layer 173 both include a titanium (Ti) layer, and the conductive layer 172 includes an aluminum (Al) layer.

[0145] The display panel 10 and the manufacturing method thereof provided in the present application form a plurality of first evaporation openings 211 on the first photoresist layer 210 to connect to the first pixel opening 14 and expose at least a portion of the first electrode 110, thereby being able to form a first light-emitting functional portion on the first electrode 110 through the first evaporation openings 211, and corresponding sub-pixels of corresponding colors can be formed. In this way, there is no need to use a metal mask plate, thereby avoiding the problem of limited PPI of the display panel 10 manufactured by using a metal mask plate and difficulty in manufacturing a large-size display panel 10.

[0146] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0147] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: A substrate, on which a plurality of first electrodes arranged at intervals are provided, and a plurality of first pixel openings respectively used to at least partially expose the corresponding first electrodes; A first photoresist layer is disposed on the substrate, wherein the first photoresist layer is provided with a first evaporation opening connected with the first pixel opening to expose the first electrode; The first light emitting functional portion is disposed in the first evaporation opening and the first pixel opening, and covers the corresponding first electrode.

2. The display panel according to claim 1, characterized in that: The first light-emitting functional portion includes a first light-emitting portion and a second electrode stacked on the first electrode in a direction away from the substrate; A plurality of first wiring structures corresponding to the second electrode are disposed on the substrate, wherein the first wiring structures are disposed outside the corresponding first pixel opening and inside the corresponding first evaporation opening, so as to be electrically connected to a portion of the second electrode located inside the corresponding first evaporation opening; Optionally, a first power signal line is provided on the substrate, the display panel has a display area, and a first via connection structure located in the display area is further provided on the substrate; The first wiring structure is electrically connected to the first power signal line through the first via connection structure; or The substrate is provided with a first power signal line, the display panel has a display area and a frame area adjacent to the display area, and the substrate is further provided with a second via connection structure located in the frame area; The first wiring structure is electrically connected to the first power signal line through the second via connection structure.

3. The display panel according to claim 2, characterized in that: The substrate is also provided with a plurality of third electrodes spaced apart from the plurality of first electrodes, and a plurality of second pixel openings for at least partially exposing the corresponding third electrodes; The display panel comprises a second photoresist layer and a second light-emitting functional part, wherein the second photoresist layer is arranged on a side of the first photoresist layer away from the substrate, and the second photoresist layer is provided with a second evaporation opening penetrating the first photoresist layer and communicating with the second pixel opening to expose the third electrode; The second light-emitting functional portion is disposed in the second evaporation opening and the second pixel opening, and covers the corresponding third electrode; Optionally, the display panel includes a first encapsulation layer, and the first encapsulation layer is arranged between the first light-emitting functional part and the second photoresist layer.

4. The display panel according to claim 3, characterized in that: The second light-emitting functional portion includes a second light-emitting portion and a fourth electrode stacked on the third electrode in a direction away from the substrate; A plurality of second wiring structures corresponding to the fourth electrode are disposed on the substrate, and the second wiring structures are disposed outside the corresponding second pixel opening and inside the corresponding second evaporation opening, so as to be electrically connected to a portion of the fourth electrode located inside the corresponding second evaporation opening; Optionally, a first power signal line is provided on the substrate, the display panel has a display area, and a third via connection structure located in the display area is further provided on the substrate; The second wiring structure is electrically connected to the first power signal line through the third via connection structure; or The substrate is provided with a first power signal line, the display panel has a display area and a frame area adjacent to the display area, and the substrate is further provided with a fourth via connection structure located in the frame area; The second wiring structure is electrically connected to the first power signal line through the fourth via connection structure.

5. The display panel according to claim 4, characterized in that: The substrate is provided with a fifth electrode spaced apart from the first electrodes and the third electrodes, and a plurality of third pixel openings for at least partially exposing the corresponding fifth electrodes; The display panel comprises a third photoresist layer and a third light-emitting functional portion, wherein the third photoresist layer is arranged on a side of the second photoresist layer away from the substrate, and the third photoresist layer is provided with a third evaporation opening penetrating the first photoresist layer and connected to the third pixel opening to expose the fifth electrode; The third light-emitting functional portion is disposed in the third evaporation opening and the third pixel opening, and covers the corresponding fifth electrode; Optionally, the display panel includes a second encapsulation layer, and the second encapsulation layer is arranged between the second light-emitting functional part and the third photoresist layer.

6. The display panel according to claim 5, characterized in that: The third light-emitting functional portion includes a third light-emitting portion and a sixth electrode stacked on the fifth electrode in a direction away from the substrate; A plurality of third wiring structures corresponding to the sixth electrode are disposed on the substrate, and the third wiring structures are disposed outside the corresponding third pixel opening and inside the corresponding third evaporation opening, so as to be electrically connected to a portion of the sixth electrode located inside the corresponding third evaporation opening; Optionally, a first power signal line is provided on the substrate, the display panel has a display area, and a fifth via connection structure located in the display area is further provided on the substrate; The third wiring structure is electrically connected to the first power signal line through the fifth via connection structure; or The substrate is provided with a first power signal line, the display panel has a display area and a frame area adjacent to the display area, and the substrate is further provided with a sixth via connection structure located in the frame area; The third wiring structure is electrically connected to the first power signal line through the sixth via connection structure; Optionally, two adjacent ones of the second electrode, the fourth electrode and the sixth electrode are electrically connected to each other; Optionally, two adjacent ones of the first wiring structure, the second wiring structure and the third wiring structure are electrically connected to each other.

7. A method for manufacturing a display panel, characterized in that: The manufacturing method of the display panel includes: A substrate is provided, on which a plurality of first electrodes arranged at intervals are provided, and a plurality of first pixel openings respectively corresponding to the plurality of first electrodes; the first pixel openings are used to at least partially expose the corresponding first electrodes; forming a first photoresist layer on the substrate, wherein the first photoresist layer fills the first pixel opening; At least removing a portion of the first photoresist layer located in the first pixel opening to form a plurality of first evaporation openings on the first photoresist layer, wherein the first evaporation openings are connected to the corresponding first pixel openings to expose the first electrode; A first light-emitting layer is formed on the substrate, wherein the first light-emitting layer includes a first light-emitting functional portion, and the first light-emitting functional portion is disposed in the first evaporation opening and the first pixel opening and covers the first electrode.

8. The method for manufacturing a display panel according to claim 7, characterized in that: The first light-emitting functional portion includes a first light-emitting portion and a second electrode stacked on the first electrode in a direction away from the substrate; After providing a substrate and before forming a first photoresist layer on the substrate, the method further includes: forming a plurality of first wiring structures corresponding to the second electrode on the substrate, wherein the first wiring structures are arranged outside the corresponding first pixel opening and inside the corresponding first evaporation opening, so as to be electrically connected to the portion of the second electrode located inside the corresponding first evaporation opening; Optionally, the first light-emitting layer includes a first light-emitting sacrificial portion, the first light-emitting sacrificial portion covers the first photoresist layer, and after forming the first light-emitting layer on the substrate, the method further includes removing the first light-emitting sacrificial portion.

9. The method for manufacturing a display panel according to claim 7, characterized in that: The substrate is provided with third electrodes spaced apart from the first electrodes, and second pixel openings respectively corresponding to the third electrodes; The second pixel opening is used to at least partially expose the corresponding third electrode; forming a second photoresist layer on the substrate, wherein the second photoresist layer fills the second pixel opening; At least removing a portion of the second photoresist layer corresponding to the second pixel opening to form a plurality of second evaporation openings on the second photoresist layer, wherein the second evaporation openings are connected to the corresponding second pixel openings to expose the third electrode; forming a second light-emitting layer on the substrate, wherein the second light-emitting layer includes a second light-emitting functional portion, the second light-emitting functional portion is disposed in the second evaporation opening and the second pixel opening, and covers the third electrode; Optionally, before forming the second photoresist layer on the substrate, the method further includes: forming a first encapsulation layer on the substrate, wherein the first encapsulation layer is arranged on a side of the first light-emitting layer away from the substrate; Optionally, the second light-emitting functional portion includes a second light-emitting portion and a fourth electrode stacked on the third electrode in a direction away from the substrate; After providing a substrate and before forming a first photoresist layer on the substrate, the method further includes: forming a plurality of second wiring structures corresponding to the fourth electrode on the substrate, wherein the second wiring structures are arranged outside the corresponding second pixel opening and inside the corresponding second evaporation opening, so as to be electrically connected to the portion of the fourth electrode located inside the corresponding second evaporation opening; Optionally, the second light-emitting layer includes a second light-emitting sacrificial portion, and the second light-emitting sacrificial portion covers the second photoresist layer. After the second light-emitting layer is formed on the substrate, the method further includes removing the second light-emitting sacrificial portion.

10. The method for manufacturing a display panel according to claim 9, characterized in that: The substrate is provided with fifth electrodes spaced apart from the first electrodes, and third pixel openings respectively corresponding to the fifth electrodes; The third pixel opening is used to at least partially expose the corresponding fifth electrode; forming a third photoresist layer on the substrate, wherein the third photoresist layer fills the third pixel opening; At least removing a portion of the third photoresist layer corresponding to the third pixel opening to form a plurality of third evaporation openings on the third photoresist layer, wherein the third evaporation openings are connected to the corresponding third pixel openings to expose the fifth electrode; forming a third light-emitting layer on the substrate, wherein the third light-emitting layer includes a third light-emitting functional portion, the third light-emitting functional portion is disposed in the third evaporation opening and the third pixel opening, and covers the fifth electrode; Optionally, before forming the third photoresist layer on the substrate, the method further includes: forming a second encapsulation layer on the substrate, wherein the second encapsulation layer is arranged on a side of the second light-emitting layer away from the substrate; Optionally, the third light-emitting functional portion includes a third light-emitting portion and a sixth electrode stacked on the fifth electrode in a direction away from the substrate; After providing a substrate and before forming a first photoresist layer on the substrate, the method further includes: forming a plurality of third wiring structures corresponding to the sixth electrode on the substrate, wherein the third wiring structures are arranged outside the corresponding third pixel opening and inside the corresponding third evaporation opening, so as to be electrically connected to a portion of the sixth electrode located inside the corresponding third evaporation opening; Optionally, the third light-emitting layer includes a third light-emitting sacrificial portion, and the third light-emitting sacrificial portion covers the third photoresist layer. After the third light-emitting layer is formed on the substrate, the method further includes removing the third light-emitting sacrificial portion.

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