Device operation data management method based on sapphire slicing production

Abstract

The present application discloses a method for managing equipment operation data based on sapphire slicing production, belonging to the field of data management. Based on the operation data of the slicing equipment and the sapphire production data, the present application comprehensively analyzes the implicit features related to the slicing quality, accurately estimates the slicing quality, avoids the breakage during the sapphire cutting process caused by the mismatch between the slicing equipment and the sapphire, improves the safety during the cutting process, and solves the problem that in the prior art, due to the inconsistent operation aging of the sapphire slicing equipment and the inconsistent defect conditions of the sapphire, the operation data of the sapphire slicing equipment often does not match the sapphire data, resulting in the breakage of the sapphire during the cutting process and seriously affecting the slicing quality of the sapphire.

Description

Technical Field

[0001] This application belongs to the field of data management, specifically a method for managing equipment operation data based on sapphire slice production. Background Art

[0002] A sapphire slicing device is a mechanical device dedicated to cutting sapphire materials. The main function of the sapphire slicing device is to cut sapphire raw materials into sheet products of a certain thickness and size. It usually includes a cutting mechanism, a feeding mechanism, a control system, etc., and can achieve fast, accurate, and efficient cutting operations. The main characteristics of the sapphire slicing device include high precision, high efficiency, high stability, etc. It adopts advanced cutting technology and control system, can achieve high-precision cutting, while maintaining high production efficiency and stable equipment performance. However, in the prior art during cutting, due to the uneven aging of the operation of the sapphire slicing device and the uneven defect conditions of sapphires, the situation where the operation data of the sapphire slicing device does not match the sapphire data often occurs, resulting in breakage of sapphires during the cutting process, seriously affecting the slicing quality of sapphires;

[0003] For example, in a Chinese patent with the application publication number CN112396206A, a comprehensive management method and system for cutting and using plates are disclosed. The product attributes of the products to be produced and the attributes of the stock plates are obtained, and the products to be produced using the same plate attributes are combined to form sets of materials. According to the different sizes of the stock plates, the matching relationship between the plates to be cut and the products to be produced is formed, the plate utilization rate is calculated for each matching relationship, a utilization rate ranking table is formed, and the optimal set of materials plan for the products to be produced is combined according to the utilization rate ranking table. According to the obtained set of materials plan, the number of rolls of the plates required for cutting is calculated, and then the optimal cutting plan is obtained; this invention constructs a comprehensive plate management system based on plates, and makes overall plans from procurement, cutting, production, surplus materials, and obsolete materials; optimizes the cutting of plates according to the production plan to improve the plate utilization rate; this patent has the problems raised in this background art;

[0004] To solve the problems raised in this background art, this application designs a method for managing equipment operation data based on sapphire slice production. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, this application proposes a method for managing equipment operation data based on sapphire slice production. This application comprehensively analyzes the implicit features related to slicing quality based on the operation data of the slicing equipment and the production data of sapphires, accurately predicts the slicing quality, avoids the breakage of sapphires during the cutting process caused by the mismatch between the slicing equipment and sapphires, and improves the safety during the cutting process.

[0006] To achieve the above object, the present application provides the following technical solutions: In the first aspect, the present application provides a method for managing equipment operation data based on sapphire slicing production, which includes the following specific steps:

[0007] S1. Obtain sapphire production data and image data, and at the same time obtain the operation data of the slicing equipment;

[0008] S2. Import the obtained operation data of the slicing equipment into the slicing equipment operation evaluation model for slicing equipment operation evaluation;

[0009] S3. Import the obtained sapphire production data and image data into the sapphire production anomaly evaluation model for sapphire production anomaly evaluation;

[0010] S4. Perform anomaly prediction of the slicing process based on the slicing equipment operation evaluation result and the sapphire production anomaly evaluation result;

[0011] S5. Select a suitable slicing equipment for slicing process operation based on the slicing process anomaly prediction result.

[0012] As a preferred technical solution of the method for managing equipment operation data based on sapphire slicing production, the specific content of obtaining sapphire production data and image data, and at the same time obtaining the operation data of the slicing equipment is as follows:

[0013] S11. Obtain the three-dimensional image of sapphire production through an image acquisition terminal, and obtain sapphire defect position data and defect specification data;

[0014] S12. Collect the cutting data of the cutting equipment at the start of cutting through a cutting data acquisition terminal, where the cutting data includes cutting speed data, the swing data of the cutting edge during cutting, and cutting pressure data;

[0015] S13. Store the collected data in a storage component.

[0016] As a preferred technical solution of the method for managing equipment operation data based on sapphire slicing production, the importing the obtained operation data of the slicing equipment into the slicing equipment operation evaluation model for slicing equipment operation evaluation includes the following specific steps:

[0017] S21. Obtain cutting speed data, the swing data of the cutting edge during cutting, and cutting pressure data;

[0018] S22. Import the obtained swing data of the cutting edge during cutting into the cutting edge swing anomaly coefficient calculation formula to calculate the cutting edge swing anomaly coefficient, where the cutting edge swing anomaly coefficient calculation formula is: , where T is the test time, Lt is the amplitude of the blade swing at time t, Lm is the maximum value of the safe range of the blade swing amplitude, vm is the average cutting speed, vt is the cutting speed at time t, dt is the time integral, and Td is the blade swing anomaly coefficient. In this formula, the anomaly of the blade swing at different cutting speeds is comprehensively analyzed;

[0019] S23. Obtain the cutting speed data and cutting pressure data, and import them into the cutting operation anomaly coefficient calculation formula to calculate the cutting operation anomaly coefficient. Among them, the cutting operation anomaly coefficient calculation formula is: , where a is the cutting speed ratio coefficient, vm is the average cutting speed, st is the cutting pressure at time t, and sz is the average cutting pressure;

[0020] S24. Substitute the obtained blade swing anomaly coefficient and cutting operation anomaly coefficient into the slicing equipment operation evaluation value calculation formula to calculate the slicing equipment operation evaluation value. Among them, the slicing equipment operation evaluation value calculation formula is: ;

[0021] It should be noted here that the abnormal operation of the cutting equipment is comprehensively analyzed through this step.

[0022] As an optimal technical solution of the equipment operation data management method based on sapphire slicing production, the importing the obtained sapphire production data and image data into the sapphire production anomaly evaluation model for sapphire production anomaly evaluation includes the following specific steps:

[0023] S31. Obtain the sapphire defect position data and defect specification data. Among them, the defect specification data includes the defect length and the maximum width data of the defect;

[0024] S32. Import the obtained sapphire defect position data and defect specification data into the production anomaly evaluation value calculation formula to calculate the production anomaly evaluation value of the sapphire. Among them, the production anomaly evaluation value calculation formula is: , where N is the number of defects, Di is the length of the i-th defect, Ki is the maximum width of the i-th defect, Mc is the surface area of the sapphire, xc is the centroid value, b is the centroid ratio coefficient, and mc is the defect aggregation degree;

[0025] It should be noted here that the possible breakage during the sapphire cutting process is comprehensively considered through the size and position data of the defects.

[0026] As a preferred technical solution of the method for managing the operation data of equipment based on sapphire slicing, the abnormal prediction of the slicing process based on the operation evaluation result of the slicing equipment and the abnormal evaluation result of sapphire production includes the following specific contents: S41. Obtain the calculated abnormal evaluation value of production and the operation evaluation value of the slicing equipment, and import the abnormal evaluation value of production and the operation evaluation value of the slicing equipment into the abnormal value calculation formula of the slicing process to calculate the abnormal value of the slicing process. Among them, the abnormal value calculation formula of the slicing process is: ;

[0027] S42. Compare the calculated abnormal value of the slicing process with the set abnormal threshold of the slicing process. If the calculated abnormal value of the slicing process is greater than or equal to the set abnormal threshold of the slicing process, it means that the sapphire slice has a risk of breakage and the slicing equipment needs to be replaced. If the calculated abnormal value of the slicing process is less than the set abnormal threshold of the slicing process, it means that the sapphire slice has no risk of breakage and the slicing equipment does not need to be replaced.

[0028] In a second aspect, the present application provides an electronic device, including: a processor and a memory. Among them, a computer program that can be called by the processor is stored in the memory;

[0029] The processor executes the above-mentioned method for managing the operation data of equipment based on sapphire slicing by calling the computer program stored in the memory.

[0030] In a third aspect, the present application provides a computer-readable storage medium storing instructions, which when run on a computer, cause the computer to execute the method for managing the operation data of equipment based on sapphire slicing as described above.

[0031] Compared with the prior art, the beneficial effects of the present application are: The present application imports the obtained operation data of the slicing equipment into the slicing equipment operation evaluation model for slicing equipment operation evaluation, imports the obtained sapphire production data and image data into the sapphire production abnormal evaluation model for sapphire production abnormal evaluation, and performs abnormal prediction of the slicing process based on the slicing equipment operation evaluation result and the sapphire production abnormal evaluation result. The present application comprehensively analyzes the implicit features related to the slicing quality based on the slicing equipment operation data and the sapphire production data, accurately estimates the slicing quality, avoids the breakage situation during the sapphire cutting process caused by the mismatch between the slicing equipment and the sapphire, and improves the safety during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, purposes, and advantages of the present application will become more obvious;

[0033] Figure 1Schematic diagram of the overall process of the device operation data management method based on sapphire slicing production of the present application;

[0034] Figure 2 Schematic diagram of step S2 of the device operation data management method based on sapphire slicing production of the present application;

[0035] Figure 3 Schematic diagram of step S4 of the device operation data management method based on sapphire slicing production of the present application;

[0036] Figure 4 Schematic diagram of an electronic device of the present application. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The description of at least one exemplary embodiment below is actually only illustrative and in no way constitutes a limitation to the present application and its application or use.

[0038] Here, the technical problems in the background art are extended: Sapphire breakage during the cutting process is a common problem. There are many reasons that may cause sapphire breakage during the cutting process. First, the quality, sharpness, and improper selection of the cutting tool may lead to excessive cutting force or inaccurate cutting, thus causing cracking. Second, unreasonable settings of parameters such as cutting speed, feed speed, and cutting depth may also cause the sapphire to be damaged due to excessive stress during the cutting process. In addition, the vibration and instability of the equipment may also affect the cutting quality and cause sapphire breakage. Therefore, it is necessary to perform a matching analysis on the slicing equipment and sapphire, but the prior art does not provide a suitable solution;

[0039] To solve the technical problems raised in the background art, the present application provides a preferred embodiment: As Figures 1 - 3 shown, this embodiment provides a device operation data management method based on sapphire slicing production, which includes the following specific steps:

[0040] S1. Obtain sapphire production data and image data, and at the same time obtain the operation data of the slicing equipment;

[0041] In one specific embodiment, the specific content of obtaining sapphire production data and image data and at the same time obtaining the operation data of the slicing equipment is:

[0042] S11. Obtain the three-dimensional image of sapphire production through an image acquisition terminal, and obtain the sapphire defect position data and defect specification data. Among them, to obtain the three-dimensional image of sapphire production through an image acquisition terminal, a three-dimensional image acquisition system based on a single camera can be used. This system sends and receives instructions by developing corresponding programs in the upper computer, and uses GemView software to provide a human-computer interaction interface, enabling system operators to interact through mouse and keyboard devices. During the process of obtaining the three-dimensional image, the operator needs to input and set rotation parameters and click the start three-dimensional acquisition button. The program will generate a related instruction set in the background and send it to the three-dimensional image acquisition experimental platform. The camera transmits the real-time information of the object on the central tray of the device back to GemView software. The software collects the information and synthesizes a three-dimensional photo sequence according to the set parallax angle. In addition, a three-dimensional data acquisition method based on multi-station scanning can also be used, such as the target method, the back sight orientation method, and the data acquisition method based on automatic point cloud stitching, to obtain the sapphire internal defect position data and defect specification data through a transmission microscope;

[0043] S12. Collect the cutting data of the cutting device at the start of cutting through a cutting data acquisition terminal. Among them, the cutting data includes cutting speed data, the swing data of the cutting edge during the cutting process, and cutting pressure data. In this embodiment, it should be noted that the cutting data is obtained through sensors installed on the cutting device. For example, the cutting speed can be obtained through a speed sensor, and the swing data of the cutting edge and the cutting pressure data can be obtained through a displacement sensor and a pressure sensor respectively;

[0044] S13. Store the collected data in a storage component;

[0045] S2. Import the obtained slicing device operation data into the slicing device operation evaluation model for slicing device operation evaluation;

[0046] In one specific embodiment, importing the obtained slicing device operation data into the slicing device operation evaluation model for slicing device operation evaluation includes the following specific steps:

[0047] S21. Obtain the cutting speed data, the swing data of the cutting edge during the cutting process, and the cutting pressure data;

[0048] S22. Import the obtained swing data of the cutting edge during the cutting process into the cutting edge swing abnormality coefficient calculation formula to calculate the cutting edge swing abnormality coefficient. Among them, the cutting edge swing abnormality coefficient calculation formula can be any formula that comprehensively analyzes the swing abnormality of the blade at different cutting speeds. Among them, the cutting edge swing abnormality coefficient calculation formula is preferably: , where T is the test time, Lt is the amplitude of the blade swing at time t, Lm is the maximum value of the safe range of the blade swing amplitude, vm is the average cutting speed, vt is the cutting speed at time t, dt is the time integral, and Td is the blade swing anomaly coefficient. In this formula, the blade swing anomalies at different cutting speeds are comprehensively analyzed. It should be noted here that the test time can be set according to experimental needs and can be 1 minute or 20 seconds;

[0049] S23. Obtain the cutting speed data and cutting pressure data, and import them into the cutting operation anomaly coefficient calculation formula to calculate the cutting operation anomaly coefficient. Among them, the cutting operation anomaly coefficient calculation formula can be any formula that analyzes the anomaly of the fluctuation magnitude of the cutting speed data and cutting pressure data within a set period, such as the variance or standard deviation formula, etc. Among them, the cutting operation anomaly coefficient calculation formula is preferably: , where a is the cutting speed ratio coefficient, vm is the average cutting speed, st is the cutting pressure at time t, and sz is the average cutting pressure. Through this formula, the anomaly of the fluctuation magnitude of the cutting speed data and cutting pressure data within a set period is analyzed. The smaller the fluctuations of the cutting speed and cutting pressure, the more beneficial it is to the cutting quality;

[0050] S24. Substitute the obtained blade swing anomaly coefficient and cutting operation anomaly coefficient into the slicing equipment operation evaluation value calculation formula to calculate the slicing equipment operation evaluation value. Among them, the slicing equipment operation evaluation value calculation formula is: ;

[0051] S3. Import the obtained sapphire production data and image data into the sapphire production anomaly evaluation model for sapphire production anomaly evaluation;

[0052] In one specific embodiment, importing the obtained sapphire production data and image data into the sapphire production anomaly evaluation model for sapphire production anomaly evaluation includes the following specific steps:

[0053] S31. Obtain the sapphire defect position data and defect specification data. Among them, the defect specification data includes defect length and defect maximum width data;

[0054] S32. Import the obtained sapphire defect position data and defect specification data into the production anomaly evaluation value calculation formula to calculate the production anomaly evaluation value of the sapphire. Among them, the production anomaly evaluation value calculation formula is: , where N is the number of defects, Di is the length of the i-th defect, Ki is the maximum width of the i-th defect, Mc is the surface area of the sapphire, xc is the centripetal value, and the formula for calculating the centripetal value is: the average distance from the defect to the center position of the sapphire divided by the average diameter of the sapphire, that is, the closer the defect is to the center position of the sapphire, the greater the influence of the defect, and thus the greater the weight. b is the centripetal proportion coefficient, and mc is the defect aggregation degree. The formula for calculating the defect aggregation degree is: the average distance between defects divided by the average diameter of the sapphire, that is, the more concentrated the defects are, the greater the influence of the defects, and thus the greater the weight. The average diameter mentioned here is the diameter of the circumscribed sphere of the sapphire image, which is only set for convenience of calculation;

[0055] It should be noted here that the possible breakage during the sapphire cutting process is comprehensively considered through the size and position data of the defects;

[0056] S4. Perform abnormal prediction of the slicing process based on the operation evaluation result of the slicing equipment and the abnormal evaluation result of sapphire production;

[0057] In one specific embodiment, performing abnormal prediction of the slicing process based on the operation evaluation result of the slicing equipment and the abnormal evaluation result of sapphire production includes the following specific contents: S41. Obtain the calculated abnormal evaluation value of production and the operation evaluation value of the slicing equipment, and import the abnormal evaluation value of production and the operation evaluation value of the slicing equipment into the formula for calculating the abnormal value of the slicing process to calculate the abnormal value of the slicing process. Among them, the formula for calculating the abnormal value of the slicing process is: ;

[0058] S42. Compare the calculated abnormal value of the slicing process with the set abnormal threshold of the slicing process. If the calculated abnormal value of the slicing process is greater than or equal to the set abnormal threshold of the slicing process, it means that there is a risk of breakage in the sapphire slicing, and the slicing equipment needs to be replaced. If the calculated abnormal value of the slicing process is less than the set abnormal threshold of the slicing process, it means that there is no risk of breakage in the sapphire slicing, and the slicing equipment does not need to be replaced. It should be noted here that the risk of breakage does not mean that breakage will definitely occur during cutting, but the probability of breakage during cutting is relatively high;

[0059] S5. Select a suitable slicing equipment for the slicing process operation based on the abnormal prediction result of the slicing process. The specific content is that selecting a suitable slicing equipment means the slicing equipment for which the calculated abnormal value of the slicing process is greater than or equal to the set abnormal threshold of the slicing process. At this time, the slicing equipment can be repaired or a slicing equipment with excellent performance can be replaced.

[0060] It should be specifically noted in this embodiment that the setting parameters such as the cutting speed ratio coefficient, centripetal ratio coefficient, and slicing process abnormal threshold in this embodiment are set by those skilled in the art according to experiments. The preferred experimental method is as follows: Obtain at least 200 groups of sapphire production data, image data, and slicing equipment operation data. Substitute the obtained data into the slicing process abnormal value calculation formula to calculate the slicing process abnormal value. Obtain the slicing breakage situation and slicing process abnormal value in the actual slicing process. Import the slicing breakage situation and slicing process abnormal value in the actual slicing process into the fitting software, and output the values of the setting parameters such as the cutting speed ratio coefficient, centripetal ratio coefficient, and slicing process abnormal threshold that meet the highest breakage judgment accuracy rate.

[0061] According to the above implementation content, this embodiment has the following technical advantages or advantages over the prior art: Import the obtained slicing equipment operation data into the slicing equipment operation evaluation model for slicing equipment operation evaluation. Import the obtained sapphire production data and image data into the sapphire production abnormal evaluation model for sapphire production abnormal evaluation. Based on the slicing equipment operation evaluation result and sapphire production abnormal evaluation result, perform slicing process abnormal prediction. This application comprehensively analyzes the implicit features related to slicing quality based on the slicing equipment operation data and sapphire production data, accurately estimates the slicing quality, avoids the breakage situation during the sapphire cutting process caused by the mismatch between the slicing equipment and sapphire, and improves the safety during the cutting process.

[0062] This embodiment can also provide a device operation data management system based on sapphire slicing production, which is implemented based on the above device operation data management method for sapphire slicing production. It at least specifically includes a data acquisition module, a slicing equipment operation evaluation module, a production abnormal evaluation module, and a slicing process abnormal prediction module. Among them, the data acquisition module is used to acquire sapphire production data and image data, and at the same time acquire slicing equipment operation data. The slicing equipment operation evaluation module is used to import the obtained slicing equipment operation data into the slicing equipment operation evaluation model for slicing equipment operation evaluation. The production abnormal evaluation module is used to import the obtained sapphire production data and image data into the sapphire production abnormal evaluation model for sapphire production abnormal evaluation. The slicing process abnormal prediction module performs slicing process abnormal prediction based on the slicing equipment operation evaluation result and sapphire production abnormal evaluation result, and selects a suitable slicing equipment for slicing process operation based on the slicing process abnormal prediction result.

[0063] In some embodiments, it may further include a control unit for controlling the operation of the data acquisition module, the slicing equipment operation evaluation module, the production abnormal evaluation module, and the slicing process abnormal prediction module. The control unit may also have a PLC control function to control the slicing equipment to perform slicing process operations.

[0064] For the specific steps of each unit module in the above device operation data management system based on sapphire slice production to implement corresponding functions, reference can be made to the steps in the embodiments of the device operation data management method based on sapphire slice production in the foregoing text, which will not be elaborated here.

[0065] This embodiment also provides an electronic device, such as Figure 4 shown, including: a processor and a memory, wherein, a computer program that can be called by the processor is stored in the memory;

[0066] The processor executes the above-mentioned device operation data management method based on sapphire slice production by calling the computer program stored in the memory.

[0067] The memory can be used to store instructions, programs, codes, code sets or instruction sets. The memory 310 may include a program storage area and a data storage area. Among them, the program storage area can store instructions for implementing an operating system, instructions for at least one function, and instructions for implementing the device operation data management method provided in the above embodiment, etc.; the data storage area can store data involved in the device operation data management method provided in the above embodiment, etc.

[0068] The processor may include one or more processing cores. The processor runs or executes instructions, programs, code sets or instruction sets stored in the memory, calls data stored in the memory, and executes various functions of this application and processes data. The processor can be at least one of an application specific integrated circuit (ASIC), a digital signal processor (DSP), a digital signal processing device (DSPD), a programmable logic device (PLD), a field programmable gate array (FPGA), a central processing unit (CPU), a controller, a microcontroller and a microprocessor. It can be understood that for different devices, the electronic devices for implementing the above processor functions may also be others, and the embodiments of this application do not make specific limitations.

[0069] It may further include a communication bus, and the communication bus may include a path for transmitting information between the above components. The communication bus can be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The communication bus can be divided into an address bus, a data bus, a control bus, etc.

[0070] This embodiment also proposes a computer-readable storage medium, on which a rewritable computer program is stored;

[0071] When the computer program runs on a computer device, the computer device is caused to execute the above-mentioned device operation data management method based on sapphire slicing.

[0072] For example, the computer-readable storage medium can be a read-only memory, a random access memory, a compact disc read-only memory, magnetic tapes, floppy disks, and optical data storage devices, etc.

[0073] The above embodiments can be implemented in whole or in part by software, hardware, firmware, or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions according to the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired network or / and a wireless network. The computer-readable storage medium can be any available medium that can be accessed by a computer, or a data storage device such as a server or a data center that contains one or more collections of available media. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a magnetic tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state drive.

[0074] The term "comprising", "including", or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or device that includes a series of elements includes not only those elements but also other elements not expressly listed, or elements that are inherent to such process, method, article, or device.

[0075] The above description is only a preferred embodiment of the present application and an explanation of the applied technical principle. Those skilled in the art should understand that the scope of the application involved in the present application is not limited to the technical solution formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the previous inventive concept. For example, a technical solution formed by mutually replacing the above features with (but not limited to) technical features having similar functions in the present application.

Claims

1. A method for managing device operation data produced based on sapphire slicing, characterized in that, It includes the following specific steps: Obtain sapphire production data and image data, and at the same time obtain the operating data of the slicing equipment; Import the obtained operating data of the slicing equipment into the slicing equipment operation evaluation model for slicing equipment operation evaluation; It includes the following specific steps: Obtain cutting speed data, the swing data of the cutting edge during the cutting process, and cutting pressure data; Import the obtained swing data of the cutting edge during the cutting process into the calculation formula of the cutting edge swing abnormality coefficient. The calculation formula of the cutting edge swing abnormality coefficient is as follows: , where T is the test time, Lt is the swing amplitude of the cutting edge at time t, Lm is the maximum value of the safe range of the swing amplitude of the cutting edge, vm is the average cutting speed, vt is the cutting speed at time t, dt is the time integral, and Td is the cutting edge swing abnormality coefficient; Obtain the cutting speed data and cutting pressure data, and import them into the cutting operation anomaly coefficient calculation formula to calculate the cutting operation anomaly coefficient; the cutting operation anomaly coefficient calculation formula is: , where a is the cutting speed ratio coefficient, vm is the average cutting speed, st is the cutting pressure at time t, and sz is the average cutting pressure; Obtain the calculated abnormal coefficient of the knife edge swing and the abnormal coefficient of the cutting operation, and substitute them into the calculation formula of the slicing equipment operation evaluation value. Among them, the calculation formula of the slicing equipment operation evaluation value is: , where Tl is the abnormal coefficient of the cutting operation; Import the obtained sapphire production data and image data into the sapphire production anomaly evaluation model for sapphire production anomaly evaluation; It includes the following specific steps: Obtain sapphire defect location data and defect specification data, where the defect specification data includes defect length and maximum defect width data; Import the obtained sapphire defect position data and defect specification data into the production anomaly evaluation value calculation formula to calculate the production anomaly evaluation value of the sapphire. The production anomaly evaluation value calculation formula is as follows: , where N is the number of defects, Di is the length of the i-th defect, Ki is the maximum width of the i-th defect, Mc is the surface area of the sapphire, xc is the centroid value, b is the centroid ratio coefficient, mc is the defect aggregation degree, and the calculation formula for the centroid value is: the average distance from the defect to the center position of the sapphire divided by the average diameter of the sapphire. The calculation formula for the defect aggregation degree is: the average distance between defects divided by the average diameter of the sapphire; Perform slicing process anomaly prediction based on the slicing equipment operation evaluation result and the sapphire production anomaly evaluation result; The abnormal prediction of the slicing process based on the operation evaluation results of the slicing equipment and the abnormal evaluation results of sapphire production includes the following specific contents: Obtain the calculated production abnormal evaluation value and the slicing equipment operation evaluation value, and import the production abnormal evaluation value and the slicing equipment operation evaluation value into the slicing process abnormal value calculation formula to calculate the slicing process abnormal value. Among them, the slicing process abnormal value calculation formula is: ; Compare the calculated slicing process abnormal value with the set slicing process abnormal threshold. If the calculated slicing process abnormal value is greater than or equal to the set slicing process abnormal threshold, it indicates that there is a risk of breakage in sapphire slicing and the slicing equipment needs to be replaced. If the calculated slicing process abnormal value is less than the set slicing process abnormal threshold, it indicates that there is no risk of breakage in sapphire slicing and the slicing equipment does not need to be replaced; Select a suitable slicing equipment for slicing process operation based on the slicing process anomaly prediction result.

2. The method for managing device operation data based on sapphire slicing production according to claim 1, wherein, The specific content of obtaining sapphire production data and image data and at the same time obtaining the operating data of the slicing equipment is: Obtain the three-dimensional image of sapphire production through an image acquisition terminal, and obtain sapphire defect location data and defect specification data; Collect the cutting data of the cutting equipment at the start of cutting through a cutting data acquisition terminal, where the cutting data includes cutting speed data, the swing data of the cutting edge during the cutting process, and cutting pressure data; store the collected data in a storage component.

3. An electronic device, comprising: A processor and a memory, where the memory stores a computer program that can be called by the processor; It is characterized in that the processor executes the equipment operation data management method based on sapphire slicing production as described in any one of claims 1-2 by calling the computer program stored in the memory.

4. A computer-readable storage medium, characterized in that, Stores instructions that, when run on a computer, cause the computer to execute the equipment operation data management method based on sapphire slicing production as described in any one of claims 1-2.

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