A forming and processing device and method for a copper clad laminate

Abstract

The present invention relates to the field of lamination processing of copper clad laminates, and specifically to a forming processing device and method for copper clad laminates, including a support table with a hollow structure. A lower pressing plate is fixedly connected to the top of the support table. A gantry is fixedly installed across the front and rear sides of the lower pressing plate on the top of the support table. A hydraulic mechanism is installed at the bottom of the gantry above the support table. A calibration mechanism is installed at the bottom of the hydraulic mechanism on the side of the lower pressing plate and a multi-stage lamination mechanism is installed on the top of the lower pressing plate. The present invention uses a combination of a primary lamination mechanism and a secondary lamination mechanism to perform multi-stage lamination on the stacked copper clad laminates. First, the secondary lamination mechanism is used to perform multi-point pre-pressing on the copper clad laminates, so that the air between the layers can be discharged from the gaps at the pressing points. Then, the primary lamination mechanism performs high-temperature heating lamination on the copper clad laminates, avoiding the appearance of bubbles inside the copper clad laminates and improving the firmness and quality of the lamination forming of the copper clad laminates.

Description

Technical Field

[0001] The present invention relates to the technical field of lamination processing of copper clad laminates, and specifically to a forming processing device and method for copper clad laminates. Background Art

[0002] Copper clad laminate is one of the main materials for manufacturing printed circuit boards, which is composed of a substrate, copper foil, and an adhesive, and is made through a lamination composite processing technology under high temperature and high pressure; copper clad laminates not only need to have good electrical properties, but also need to have certain mechanical strength, heat resistance, moisture resistance, chemical stability and other characteristics. Copper clad laminates include single-sided copper clad laminates, double-sided copper clad laminates, and multi-layer copper clad laminates. Among them, the most common double-sided copper clad laminate is prepared by laminating a copper foil layer, an adhesive layer, a substrate layer, an adhesive layer, and a copper foil layer stacked correctly from bottom to top.

[0003] Currently, when copper clad laminates are prepared, they are generally prepared in large sizes, and then cut to the required size after the preparation and processing are completed. Currently, large-size copper clad laminates are generally processed by special lamination equipment during production, but there are still the following deficiencies: 1. When laminating large-size copper clad laminates, there are adhesive layers and substrate layers between the stacked copper foil layers. The large-size copper clad laminate is laminated and formed by upper and lower pressing. Due to the large size of the large-size copper clad laminate, it is easy for air to exist between the stacked copper foil layers, adhesive layers, and substrate layers. If the air between the copper foil layer, adhesive layer, and substrate layer cannot be removed in time during pressing, bubbles will exist inside the laminated copper clad laminate, affecting the firmness and quality of the copper clad laminate.

[0004] 2. Since the adhesive layer is between the copper foil layer and the substrate layer of the large-size copper clad laminate, the adhesive layer will be in a fluid state during high-temperature lamination. Before the fluid state of the adhesive layer solidifies, the copper foil layer and the substrate layer are prone to sliding during lamination, resulting in misalignment. Therefore, after the copper clad laminate is laminated, the edges that do not meet the quality requirements are cut and corrected, resulting in material waste and increasing production costs and time costs. Summary of the Invention

[0005] In order to solve the above problems, the present invention provides a forming processing device for copper clad laminates, which includes a support table with a hollow structure. A lower pressing plate is fixedly connected to the top of the support table. A gantry is fixedly installed at the top of the support table across the front and rear sides of the lower pressing plate. A hydraulic mechanism is installed at the bottom of the gantry above the support table. A correction mechanism is installed at the bottom of the hydraulic mechanism on the side of the lower pressing plate and a multi-stage lamination mechanism is installed at the top of the lower pressing plate. A reset ejector rod is also installed at the bottom of the gantry and is matched with the multi-stage lamination mechanism. A conveying mechanism for horizontally conveying the copper clad laminate is installed inside the lower pressing plate.

[0006] The calibration mechanism includes a downward pressing drive assembly and a number of clamping and leveling assemblies. The clamping and leveling assemblies are installed inside the support table, and the downward pressing drive assembly is installed at the bottom of the hydraulic mechanism and drives the clamping and leveling assemblies to clamp and level the stacked copper clad laminates inward as the hydraulic mechanism moves downward.

[0007] The multi-stage lamination mechanism includes a first-stage lamination mechanism installed at the bottom of the hydraulic mechanism for laminating the copper clad laminate. A second-stage lamination mechanism is slidably installed at the bottom of the first-stage lamination mechanism. A friction limiting mechanism for clamping and limiting the second-stage lamination mechanism is installed inside the first-stage lamination mechanism. Electric heating tubes are provided inside both the lower pressing plate and the first-stage lamination mechanism.

[0008] In a possible implementation manner, the hydraulic mechanism includes a number of hydraulic cylinders fixedly installed at the bottom of the gantry. The bottom ends of the output shafts of the number of hydraulic cylinders are commonly fixedly connected to a lower pressing plate. The hydraulic cylinders are arranged in a row on the top of the lower pressing plate. A through hole matching the reset ejector rod is provided on the top of the lower pressing plate.

[0009] In a possible implementation manner, the downward pressing drive assembly includes an elastic telescopic cylinder fixedly connected to the bottom surface of the lower pressing plate. The bottom end of the elastic telescopic cylinder penetrates into the inside of the support table and is fixedly connected to a downward pressing frame. A number of downward pressing blocks corresponding to the clamping and leveling assemblies one by one are fixedly connected to the bottom surface of the downward pressing frame. One end of the downward pressing block close to the clamping and leveling assembly is provided with a first inclined surface, and the height of the first inclined surface gradually increases towards the end close to the clamping and leveling assembly.

[0010] In a possible implementation manner, the clamping and leveling assembly includes a guide plate fixedly connected to the top surface of the inner cavity of the support table. A leveling plate is slidably installed inside the guide plate. A pushing block is slidably installed on one side of the leveling plate away from the middle of the support table. One side of the pushing block close to the downward pressing block is provided with a second inclined surface and is matched with the first inclined surface of the downward pressing block. The bottom of the pushing block is slidably installed on the bottom of the support table. A reset spring for pushing the pushing block to move towards the direction close to the downward pressing block is fixedly connected between the pushing block and the inner wall of the support table.

[0011] In a possible implementation manner, a guide groove is provided inside the guide plate. A guide block is fixedly connected to the side surface of the leveling plate. The guide block is slidably installed inside the guide groove. The height of one end of the guide groove close to the lower pressing plate gradually increases.

[0012] In a possible implementation manner, the first-stage lamination mechanism includes an upper pressing plate with a hollow structure fixedly connected to the bottom of the lower pressing plate and located directly above the lower pressing plate. Alignment grooves arranged in a row are provided on the bottom of the upper pressing plate. The electric heating tube is installed in the bottom wall of the upper pressing plate.

[0013] In a possible implementation manner, the secondary lamination mechanism includes a movable plate slidably installed inside the upper laminating plate. A column of pre-pressing columns is fixedly connected to the bottom of the movable plate. The bottom end of the pre-pressing column penetrates through the bottom wall of the upper laminating plate and is fixedly connected to a pre-pressing plate, and the pre-pressing plate is matched with the alignment groove.

[0014] In a possible implementation manner, the friction limiting mechanism includes a limiting frame fixedly installed inside the upper laminating plate. Friction blocks symmetrically distributed with respect to the pre-pressing columns are slidably installed inside the limiting frame. A pressing spring for pushing the friction blocks to move towards the pre-pressing columns is fixedly connected between the friction blocks and the limiting frame.

[0015] In a possible implementation manner, the conveying mechanism includes a carrying component slidably installed inside the lower laminating plate for horizontally conveying the copper clad laminate. The carrying components are symmetrically distributed front and back on the lower laminating plate. A conveying component for pushing the carrying component to move horizontally is fixedly installed inside the support table.

[0016] In a possible implementation manner, the carrying component includes a sliding block slidably installed inside the lower laminating plate. The top of the sliding block is flush with the top of the lower laminating plate, and a number of equally spaced suction cups are installed on the top of the sliding block.

[0017] Advantages of the present invention: 1. The present invention uses a combination of a primary lamination mechanism and a secondary lamination mechanism to perform multi-stage lamination on the stacked copper clad laminates of each layer. First, the secondary lamination mechanism is used to perform multi-point pre-pressing on the copper clad laminate, so that the air between each layer can be discharged from the gaps at the pressing points. Then, the primary lamination mechanism performs high-temperature heating lamination on the copper clad laminate, avoiding the occurrence of bubbles inside the copper clad laminate, and improving the firmness and quality of the copper clad laminate during lamination molding.

[0018] 2. By the combined use of the hydraulic mechanism, the calibration mechanism and the multi-stage lamination mechanism, while the hydraulic mechanism pushes the multi-stage lamination mechanism to perform multi-stage lamination on the copper clad laminate, the hydraulic mechanism can also drive the calibration mechanism to calibrate and level the copper clad laminate from the four sides, avoiding misalignment of the copper clad laminate during lamination, eliminating the need for cutting and correction of the copper clad laminate, reducing material waste, lowering production costs, improving the processing efficiency of the copper clad laminate, and moreover, the calibration mechanism clamps the copper clad laminate in an inclined lifting and moving manner. After the processing of the copper clad laminate is completed, the calibration mechanism can move obliquely downward away from the copper clad laminate, avoiding affecting the loading and unloading of the copper clad laminate.

[0019] 3. The present invention uses a friction limiting mechanism to limit the secondary lamination mechanism. When the hydraulic mechanism pushes the primary lamination mechanism and the secondary lamination mechanism downward, the secondary lamination mechanism can first pre-press the copper clad laminate. When the pressure exerted by the primary lamination mechanism on the secondary lamination mechanism is greater than the frictional force between the friction limiting mechanism and the secondary lamination mechanism, relative sliding will occur between the primary lamination mechanism and the secondary lamination mechanism, causing the primary lamination mechanism to move downward to laminate the copper clad laminate, achieving the effect of multi-stage lamination. Moreover, during the downward movement of the primary lamination mechanism, the friction limiting mechanism applies dynamic friction pressure to the secondary lamination mechanism, enabling the secondary lamination mechanism to pre-press the copper clad laminate with a constant pressure, improving the stability of the pre-pressing. Brief Description of the Drawings

[0020] Figure 1 is a three-dimensional structural schematic diagram of the present invention.

[0021] Figure 2 is a three-dimensional structural schematic diagram of another angle of the present invention.

[0022] Figure 3 is a front cross-sectional view of the present invention.

[0023] Figure 4 is a planar structural schematic diagram of the present invention when fully laminated.

[0024] Figure 5 is a three-dimensional structural schematic diagram of the calibration mechanism of the present invention.

[0025] Figure 6 is a three-dimensional structural schematic diagram of the clamping and leveling assembly of the present invention.

[0026] Figure 7 is a three-dimensional structural schematic diagram of the friction limiting assembly of the present invention.

[0027] Figure 8 is a three-dimensional structural schematic diagram of the conveying mechanism of the present invention.

[0028] In the figure: 1. Support platform; 11. Lower pressing plate; 2. Gantry; 3. Hydraulic mechanism; 31. Hydraulic cylinder; 32. Lower pressing plate; 4. Calibration mechanism; 41. Lower pressing drive assembly; 411. Elastic telescopic cylinder; 412. Lower pressing frame; 413. Lower pressing block; 42. Clamping and leveling assembly; 421. Guide plate; 4211. Guide groove; 422. Leveling plate; 4221. Guide block; 423. Pushing block; 424. Return spring; 5. Multi-stage lamination mechanism; 51. First-stage lamination mechanism; 511. Upper pressing plate; 512. Alignment groove; 52. Second-stage lamination mechanism; 521. Movable plate; 522. Pre-pressing column; 523. Pre-pressing plate; 53. Friction limiting mechanism; 531. Limiting frame; 532. Friction block; 533. Compression spring; 6. Return ejector rod; 7. Conveyor mechanism; 71. Carrying assembly; 711. Sliding block; 712. Suction cup; 72. Conveyor assembly; 8. Electric heating tube. Detailed implementation manners

[0029] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific implementation manners disclosed below.

[0030] Please refer to Figure 1 and Figure 2 A forming and processing device for a copper clad laminate, comprising a support platform 1 with a hollow structure. A lower pressing plate 11 is fixedly connected to the top of the support platform 1. A gantry 2 spanning the front and rear sides of the lower pressing plate 11 is fixedly installed on the top of the support platform 1. A hydraulic mechanism 3 is installed at the bottom of the gantry 2 above the support platform 1. A calibration mechanism 4 is installed at the bottom of the hydraulic mechanism 3 on the side of the lower pressing plate 11, and a multi-stage lamination mechanism 5 is installed at the top of the lower pressing plate 11. A return ejector rod 6 cooperating with the multi-stage lamination mechanism 5 is also installed at the bottom of the gantry 2. A conveyor mechanism 7 for horizontally conveying the copper clad laminate is installed inside the lower pressing plate 11.

[0031] Please refer to Figure 1 and Figure 3 The calibration mechanism 4 includes a lower pressing drive assembly 41 and a plurality of clamping and leveling assemblies 42. The clamping and leveling assemblies 42 are installed inside the support platform 1 and are symmetrically distributed with respect to the lower pressing plate 11. The lower pressing drive assembly 41 is installed at the bottom of the hydraulic mechanism 3 and drives the clamping and leveling assemblies 42 to move inward to clamp and level the copper clad laminate as the hydraulic mechanism 3 moves downward.

[0032] Please refer to Figure 1 and Figure 3, the multi-stage lamination mechanism 5 includes a first-stage lamination mechanism 51 installed at the bottom of the hydraulic mechanism 3 for laminating the copper clad laminate. A second-stage lamination mechanism 52 for multi-point pre-pressing the copper clad laminate is slidably installed at the bottom of the first-stage lamination mechanism 51. A friction limiting mechanism 53 for clamping and limiting the second-stage lamination mechanism 52 is installed inside the first-stage lamination mechanism 51. Electric heating tubes 8 are provided inside both the lower platen 11 and the first-stage lamination mechanism 51, and the electric heating tubes 8 can meet the high-temperature requirements during lamination.

[0033] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , the hydraulic mechanism 3 includes a plurality of hydraulic cylinders 31 fixedly installed at the bottom of the gantry 2. The bottom ends of the output shafts of the plurality of hydraulic cylinders 31 are commonly fixedly connected to a lower platen 32. The hydraulic cylinders 31 are arranged in a row at the top of the lower platen 32. A through hole matching the reset ejector rod 6 is opened at the top of the lower platen 32. By pushing the lower platen 32 downward through the hydraulic cylinders 31, the downward pressing drive assembly 41 can be driven downward to drive the clamping and leveling assembly 42 to move inward to extrude and correct the copper clad laminate, and at the same time, the first-stage lamination mechanism 51 and the second-stage lamination mechanism 52 can be pushed downward to laminate the copper clad laminate. When the hydraulic cylinders 31 drive the lower platen 32 to move upward, the downward pressing drive assembly 41 and the first-stage lamination mechanism 51 can be driven to move upward for reset. At this time, the bottom end of the reset ejector rod 6 can enter the inside of the first-stage lamination mechanism 51 through the through hole to extrude and push the second-stage lamination mechanism 52, so that the second-stage lamination mechanism 52 slides downward and resets relative to the first-stage lamination mechanism 51, facilitating the next lamination operation.

[0034] Please refer to Figure 1 , Figure 3 , Figure 5 and Figure 6 , the downward pressing drive assembly 41 includes an elastic telescopic cylinder 411 fixedly connected to the bottom surface of the lower platen 32. The bottom end of the elastic telescopic cylinder 411 penetrates into the inside of the support table 1 and is fixedly connected to a downward pressing frame 412. A plurality of downward pressing blocks 413 corresponding to the clamping and leveling assembly 42 one by one are fixedly connected to the bottom surface of the downward pressing frame 412. One end of the downward pressing block 413 close to the clamping and leveling assembly 42 is provided with a first inclined surface, and the height of the first inclined surface gradually increases towards the end close to the clamping and leveling assembly 42.

[0035] Please refer to Figure 3 , Figure 5 and Figure 6, the clamping and leveling assembly 42 includes a guide plate 421 fixedly connected to the top surface of the inner cavity of the support table 1. A leveling plate 422 is slidably installed inside the guide plate 421. A pushing block 423 is slidably installed on one side of the leveling plate 422 away from the middle of the support table 1. One side of the pushing block 423 close to the pressing block 413 is provided with a second inclined surface that matches the first inclined surface of the pressing block 413. The bottom of the pushing block 423 is slidably installed on the bottom of the support table 1. A return spring 424 that pushes the pushing block 423 to move towards the pressing block 413 is fixedly connected between the inner walls of the pushing block 423 and the support table 1. When the hydraulic mechanism 3 pushes the elastic telescopic cylinder 411 downward, the elastic telescopic cylinder 411 pushes the lower pressing frame 412 and the pressing block 413 downward. The pressing block 413 is used to squeeze the pushing block 423 downward, causing the pushing block 423 to slide towards the lower pressing plate 11. Then, the pushing block 423 pushes the leveling plate 422 to move towards the lower pressing plate 11, enabling the leveling plate 422 to correct and level the four sides of the copper clad laminate placed on the lower pressing plate 11, preventing the copper clad laminate from shifting and misaligning during the lamination process.

[0036] Please refer to Figure 6 , a guide groove 4211 is formed inside the guide plate 421. A guide block 4221 is fixedly connected to the side surface of the leveling plate 422. The guide block 4221 is slidably installed inside the guide groove 4211. The height of one end of the guide groove 4211 close to the lower pressing plate 11 gradually increases. The guide groove 4211 plays a guiding and limiting role for the guide block 4221. When the leveling plate 422 moves towards the lower pressing plate 11, the leveling plate 422 can move upward synchronously. Conversely, the leveling plate 422 can slide downward into the support table 1 to avoid hindering the loading and unloading of the copper clad laminate on the lower pressing plate 11.

[0037] Please refer to Figure 1 and Figure 3 , the primary lamination mechanism 51 includes an upper pressing plate 511 that is hollow and fixedly connected to the bottom of the lower pressing plate 32 and is directly above the lower pressing plate 11. A row of alignment grooves 512 are formed at the bottom of the upper pressing plate 511. The electric heating tube 8 is installed in the bottom wall of the upper pressing plate 511.

[0038] Please refer to Figure 1 and Figure 3 , the secondary lamination mechanism 52 includes a movable plate 521 slidably installed inside the upper pressing plate 511. A row of pre-pressing columns 522 are fixedly connected to the bottom of the movable plate 521. The bottom ends of the pre-pressing columns 522 penetrate through the bottom wall of the upper pressing plate 511 and are fixedly connected to a pre-pressing plate 523. The pre-pressing plate 523 matches the alignment grooves 512.

[0039] Please refer to Figure 3 and Figure 7, the friction limiting mechanism 53 includes a limiting frame 531 fixedly installed inside the upper pressing plate 511. Inside the limiting frame 531, friction blocks 532 symmetrically distributed with respect to the preloading column 522 are slidably installed. A pressing spring 533 that pushes the friction block 532 to move towards the preloading column 522 is fixedly connected between the friction block 532 and the limiting frame 531. The friction block 532 is pushed by the pressing spring 533 to clamp outside the preloading column 522, enabling the preloading column 522 to move together with the upper pressing plate 511. The first-stage laminating mechanism 51 and the second-stage laminating mechanism 52 are pushed downward by the hydraulic cylinder 31. First, the pre-pressing plate 523 pre-presses the copper clad laminate, allowing the air between layers to be discharged from the gap at the extrusion point. When the downward pressure applied by the hydraulic cylinder 31 is greater than the maximum static friction force between the friction block 532 and the preloading column 522, the friction block 532 and the preloading column 522 will slide. At this time, the hydraulic cylinder 31 will push the upper pressing plate 511 downward to laminate the copper clad laminate. During lamination, the pre-pressing plate 523 will coincide with the alignment groove 512 to form a whole, ensuring uniform pressure on each part of the copper clad laminate. At the same time, the electric heating tube 8 can heat the copper clad laminate at a high temperature, enabling the adhesive layer inside the copper clad laminate to quickly melt into a fluid state and rapidly fill between the copper foil layer and the substrate layer of the copper clad laminate.

[0040] Please refer to Figure 2 and Figure 8 , the conveying mechanism 7 includes a carrying component 71 slidably installed inside the lower pressing plate 11 for horizontally conveying the copper clad laminate. The carrying components 71 are symmetrically distributed front and back on the lower pressing plate 11. Inside the support platform 1, a conveying component 72 for pushing the carrying component 71 to move horizontally is fixedly installed. The conveying component 72 is a lead screw linear slide.

[0041] Please refer to Figure 2 and Figure 8 , the carrying component 71 includes a sliding block 711 slidably installed inside the lower pressing plate 11. The top of the sliding block 711 is flush with the top of the lower pressing plate 11. A number of equally spaced suction cups 712 are installed on the top of the sliding block 711. During lamination of the copper clad laminate, the suction cups 712 can adsorb on the bottom of the copper clad laminate. After lamination is completed, the conveying component 72 drives the sliding block 711 to move horizontally, causing the sliding block 711 to drive the copper clad laminate out of the lower pressing plate 11, facilitating the blanking of the copper clad laminate.

[0042] In addition, the present invention also provides a processing method for a copper clad laminate forming and processing device, which specifically includes the following steps:

[0043] S1. Place the stacked copper clad laminate on the lower pressing plate 11. Push the lower pressing plate 32 downward by the hydraulic cylinder 31, and then the lower pressing plate 32 pushes the elastic telescopic cylinder 411 and the upper pressing plate 511 downward.

[0044] When the elastic telescopic cylinder 411 moves downward, it will push the lower pressing frame 412 and the lower pressing block 413 to move downward together, so that the lower pressing block 413 squeezes the pushing block 423 downward. When the pushing block 423 is squeezed by the lower pressing block 413, it will move in the direction close to the lower pressing plate 11, and then push the flattening plate 422 to move along the guiding groove 4211 in the direction close to the lower pressing plate 11, so that the flattening plate 422 squeezes and corrects the copper clad laminate to prevent the copper clad laminate from being misaligned.

[0045] Since the friction limiting mechanism 53 clamps the secondary lamination mechanism 52, when the upper pressing plate 511 moves downward, it will drive the pre-pressing column 522 to move downward together, so that the pre-pressing plate 523 at the bottom of the pre-pressing column 522 first pre-presses the copper clad laminate tightly. Through the pre-pressing, the air between the layers inside the copper clad laminate is discharged from the gap at the pressing point, preventing bubbles from appearing in the copper clad laminate.

[0046] S2. Then, the hydraulic cylinder 31 continuously applies a downward pressure to the upper pressing plate 511. When the downward pressure generated by the upper pressing plate 511 is greater than the maximum static friction force between the friction block 532 and the pre-pressing column 522, the friction block 532 and the pre-pressing column 522 slide, so that the upper pressing plate 511 moves downward. During the downward movement of the upper pressing plate 511, the pre-pressing plate 523 presses the copper clad laminate with a constant pressure. After that, the upper pressing plate 511 presses tightly on the surface of the copper clad laminate for lamination. During the lamination process, the electric heating tube 8 heats the copper clad laminate at a high temperature, so that the adhesive layer inside the copper clad laminate can be quickly melted into a fluid state and quickly filled between the copper foil layer and the substrate layer of the copper clad laminate, thus performing rapid lamination preparation.

[0047] S3. After the lamination is completed, the hydraulic cylinder 31 drives the lower pressing plate 32 to move upward, so that the primary lamination mechanism 51 and the lower pressing drive assembly 41 move upward and reset. During the upward movement of the elastic telescopic cylinder 411 driving the lower pressing frame 412 and the lower pressing block 413, the return spring 424 pushes the pushing block 423 to move in the direction away from the lower pressing plate 11. At this time, the flattening plate 422 moves along the guiding groove 4211 in the direction away from the lower pressing plate 11, so that the flattening plate 422 can be retracted into the support table 1.

[0048] When the primary lamination mechanism 51 moves upward, it will drive the secondary lamination mechanism 52 to move away from the copper clad laminate together. When the primary lamination mechanism 51 moves upward to the reset ejector rod 6, the bottom end of the reset ejector rod 6 passes through the through hole inside the lower pressing plate 32 and squeezes the movable plate 521 downward, so that the secondary lamination mechanism 52 no longer moves upward with the primary lamination mechanism 51 until the movable plate 521 fits against the bottom wall of the inner cavity of the upper pressing plate 511. At this time, the hydraulic cylinder 31 no longer drives the secondary lamination mechanism 52 to move upward.

[0049] S4. Finally, the conveying component 72 drives the sliding block 711 to move rightward, causing the sliding block 711 to drive the copper clad laminate to move outside the lower pressing plate 11. Then, the existing robotic arm horizontally moves and removes the copper clad laminate at the upper end of the sliding block 711. After that, the conveying component 72 drives the sliding block 711 to move leftward, causing the sliding block 711 to return to the inside of the lower pressing plate 11. After cooling, fixing, and shaping, the processing is completed, and the next processing can be carried out.

[0050] In the description of the present invention, it should also be noted that, unless otherwise clearly specified and limited, the terms "arranged", "connected", "installed", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, an integral connection, or a sliding connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] The embodiments of this specific implementation manner are all preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A forming and processing device for a copper clad laminate, including a support table with a hollow structure, characterized in that: A lower pressing plate is fixedly connected to the top of the support table. A gantry is fixedly installed on the top of the support table, spanning across the front and rear sides of the lower pressing plate. A hydraulic mechanism is installed at the bottom of the gantry above the support table. The bottom of the hydraulic mechanism is equipped with a correction mechanism on the side of the lower pressing plate and a multi-stage lamination mechanism on the top of the lower pressing plate. A reset ejector rod cooperating with the multi-stage lamination mechanism is also installed at the bottom of the gantry. A conveying mechanism for horizontally conveying the copper clad laminate is installed inside the lower pressing plate; The correction mechanism includes a downward pressing drive assembly and a number of clamping and leveling assemblies. The clamping and leveling assemblies are installed inside the support table, and the downward pressing drive assembly is installed at the bottom of the hydraulic mechanism and drives the clamping and leveling assemblies to clamp and level the copper clad laminate inward as the hydraulic mechanism moves downward; The multi-stage lamination mechanism includes a first-stage lamination mechanism installed at the bottom of the hydraulic mechanism for laminating the copper clad laminate. A second-stage lamination mechanism for multi-point pre-pressing the copper clad laminate is slidably installed at the bottom of the first-stage lamination mechanism. A friction limiting mechanism for clamping and limiting the second-stage lamination mechanism is installed inside the first-stage lamination mechanism. Electric heating tubes are provided inside both the lower pressing plate and the first-stage lamination mechanism; The second-stage lamination mechanism includes a movable plate slidably installed inside the upper pressing plate. A row of pre-pressing columns is fixedly connected to the bottom of the movable plate. The bottom end of the pre-pressing column penetrates through the bottom wall of the upper pressing plate and is fixedly connected to a pre-pressing plate, and the pre-pressing plate matches the alignment groove; The friction limiting mechanism includes a limiting frame fixedly installed inside the upper pressing plate. Friction blocks symmetrically distributed with respect to the pre-pressing columns are slidably installed inside the limiting frame. A compression spring for pushing the friction block to move towards the pre-pressing column is fixedly connected between the friction block and the limiting frame.

2. The forming and processing device for a copper clad laminate according to claim 1, wherein: The hydraulic mechanism includes a number of hydraulic cylinders fixedly installed at the bottom of the gantry. The bottom ends of the output shafts of the number of hydraulic cylinders are commonly fixedly connected to a lower pressing plate. The hydraulic cylinders are arranged in a row on the top of the lower pressing plate, and a through hole matching the reset ejector rod is opened on the top of the lower pressing plate.

3. The forming and processing device for a copper clad laminate according to claim 2, wherein: The downward pressing drive assembly includes an elastic telescopic cylinder fixedly connected to the bottom surface of the lower pressing plate. The bottom end of the elastic telescopic cylinder penetrates into the inside of the support table and is fixedly connected to a downward pressing frame. A number of downward pressing blocks corresponding to the clamping and leveling assemblies one by one are fixedly connected to the bottom surface of the downward pressing frame. One end of the downward pressing block close to the clamping and leveling assembly is provided with a first inclined surface, and the height of the first inclined surface gradually increases towards the end close to the clamping and leveling assembly.

4. The forming and processing device for a copper clad laminate according to claim 3, wherein: The clamping and leveling assembly includes a guide plate fixedly connected to the top surface of the inner cavity of the support table. A leveling plate is slidably installed inside the guide plate. A pushing block is slidably installed on the side of the leveling plate away from the middle of the support table. One side of the pushing block close to the downward pressing block is provided with a second inclined surface and matches the first inclined surface of the downward pressing block. The bottom of the pushing block is slidably installed at the bottom of the support table. A reset spring for pushing the pushing block to move towards the downward pressing block is fixedly connected between the pushing block and the inner wall of the support table.

5. The forming and processing device for a copper clad laminate according to claim 4, characterized in that: A guiding groove is formed inside the guiding plate. A guiding block is fixedly connected to the side surface of the leveling plate. The guiding block is slidably installed inside the guiding groove. The height of one end of the guiding groove close to the lower pressing plate gradually increases.

6. The forming and processing device for a copper clad laminate according to claim 2, characterized in that: The primary lamination mechanism includes an upper pressing plate with a hollow structure that is fixedly connected to the bottom of the lower pressing plate and is directly above the lower pressing plate. A series of alignment grooves arranged in a row are formed at the bottom of the upper pressing plate. The electric heating tubes are installed in the bottom wall of the upper pressing plate.

7. The forming and processing device for a copper clad laminate according to claim 1, characterized in that: The conveying mechanism includes a carrying component that is slidably installed inside the lower pressing plate for horizontally conveying the copper clad laminate. The carrying components are symmetrically distributed front and back on the lower pressing plate. A conveying component for pushing the carrying component to move horizontally is fixedly installed inside the support table.

8. The forming and processing device for a copper clad laminate according to claim 7, characterized in that: The carrying component includes a sliding block that is slidably installed inside the lower pressing plate. The top of the sliding block is flush with the top of the lower pressing plate. A number of suction cups are installed at equal intervals on the top of the sliding block.

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