Method for reducing particles in atomic deposition chamber
By using 6061 aluminum alloy material and sandblasting, ultrasonic cleaning and oxidation treatment, an alumina film layer is formed, which solves the problem of particles falling off in the atomic deposition chamber, improves the quality and service life of the film layer, and meets the high requirements of the semiconductor industry for thin film particle defects.
CN119663228APending Publication Date: 2025-03-21KUNMING INST OF PHYSICS
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Patent Information
- Application Number
- CN202411732498.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-03-21
AI Technical Summary
Technical Problem
The atomic deposition chamber is prone to cause particles to fall off during the growth of the film layer, resulting in poor quality of the film layer and short service life, which cannot meet the high requirements of the semiconductor industry for thin film particle defects.
Method used
The chamber is made of 6061 aluminum alloy material, and a layer of aluminum oxide film is formed by sandblasting, ultrasonic cleaning and surface oxidation treatment to improve the adhesion of the chamber surface and the quality of the film layer.
Benefits of technology
It significantly reduces the generation of chamber particles, extends the service life of the chamber, improves the quality and adhesion of the film layer, and reduces material and labor costs.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to an atomic deposition technology, in particular to a method for reducing particles in an atomic deposition chamber, which is based on an existing atomic deposition chamber structure and is characterized in that a chamber is made of 6061 aluminum alloy, an aluminum oxide film layer is generated on the inner surface of the chamber by performing sand blasting treatment, ultrasonic cleaning and surface oxidation treatment on the chamber, and the particles in the chamber are reduced. The obtained cavity is not easy to fall off, the service life of the cavity is greatly prolonged, and the material cost and the labor cost are reduced; the quality of the film layer prepared by the chamber obtained by the method is greatly improved, and particles in the deposited film layer are greatly reduced.
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