Electronic device temperature monitoring method

By obtaining the actual temperature data and attribute data of the electronic device, the calculated temperature terms and humidity terms are calculated, and the actual temperature compensation value of the electronic device is calculated through the environmental compensation formula, the problem of the temperature monitoring of electronic devices affected by the ambient temperature and humidity in the prior art is solved, and the accurate temperature monitoring of electronic devices is achieved.

CN119666158AActive Publication Date: 2025-03-21QINGDAO ZITN MICROELECTRONICS CO LTD

Patent Information

Application Number
CN202510193496.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-21
Publication Date
2025-03-21
Estimated Expiration
2045-02-21

AI Technical Summary

Technical Problem

The prior art is susceptible to the influence of ambient temperature and humidity when monitoring the temperature of electronic devices, resulting in inaccurate temperature data, and monitoring errors or reporting errors may occur.

Method used

By obtaining the actual temperature data and attribute data of the electronic device, setting the test sample, detecting its temperature change difference under different ambient temperature and humidity, calculate the calculated temperature terms and calculated humidity terms, and calculate the actual temperature compensation value of the electronic device through the environmental compensation formula, thereby obtaining the real temperature data of the electronic device.

Benefits of technology

Real temperature monitoring of electronic devices is realized, reducing the impact of ambient temperature and humidity on the monitoring results, making the monitoring results more accurate.

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Abstract

The invention discloses an electronic device temperature monitoring method, and relates to the technical field of temperature monitoring. Comprising the steps that detection temperature data of a target electronic device are acquired, a target detection temperature item is obtained, and the target detection temperature item is used for expressing the surface temperature, detected in real time, of the target electronic device; attribute data of the target electronic device is obtained, and a target attribute item is obtained and used for expressing shell information of the target electronic device. According to the invention, the actual temperature compensation values of the target electronic device in different environment temperatures and environment humidity states are calculated through the obtained related data and the creation of the environment influence compensation formula, so that the actual temperature data of the target electronic device are obtained, and the real temperature monitoring effect of the target electronic device is realized. And the method is not interfered by environment temperature and environment humidity, so that the monitoring result is more accurate.
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Description

Technical Field

[0001] The invention relates to the technical field of temperature monitoring, and in particular to a temperature monitoring method for an electronic device. Background Art

[0002] Electronic devices are equipment or components manufactured using electronic principles and technologies, and are mainly used to control, process and transmit electrical signals. They play a vital role in modern electronic products and are widely used in computers, communications, automation, household appliances and other fields. They can be divided into active devices, such as transistors, diodes and integrated circuits, which can amplify electrical signals or perform switching operations, or passive devices such as resistors, capacitors and inductors, which do not actively amplify signals but are used to store and release energy. During the use of electronic devices, temperature monitoring is very important. Electronic devices generate heat when working. If the temperature is too high, it may cause the device performance to deteriorate or even be damaged. For example, the breakdown voltage of semiconductor devices will decrease as the temperature rises.

[0003] The computing board chip temperature monitoring system with patent publication number CN114088224A, after the computing board is powered on, responds to the temperature query command sent by the main controller, determines the respective initial chip temperatures through their respective temperature sensors, accumulates them, and sends the temperature accumulation value to the main controller; receives the average temperature sent by the main controller, calculates the deviation between the respective initial chip temperatures and the average temperature, determines the respective temperature compensation values ​​according to the deviation, and is based on a chip with an internally integrated temperature sensor. Compared with the prior art that relies on a small number of external temperature sensor chips for temperature monitoring, it is more accurate, and when monitoring the temperature, the temperature of each chip is calibrated first to compensate for the deviation caused by the difference between different temperature sensors, further improving the monitoring accuracy, and saving costs.

[0004] When detecting the temperature of electronic devices, the above-mentioned and similar technical solutions need to consider the influence of ambient temperature, ambient humidity and other factors in order to calculate the most accurate real-time temperature of the electronic devices based on the acquired temperature data. The lower the ambient temperature and the greater the ambient humidity, the more severe the temperature suppression of the electronic devices. Conversely, the higher the ambient temperature and the lower the ambient humidity, the higher the temperature data of the detected electronic devices will be, resulting in inaccurate temperature data obtained, which in turn leads to monitoring errors or reporting errors when monitoring the temperature of electronic devices. Summary of the invention

[0005] The object of the present invention is to provide a method for monitoring the temperature of an electronic device to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: a method for monitoring the temperature of an electronic device, comprising:

[0007] Acquire detection temperature data of a target electronic device to obtain a target detection temperature item, where the target detection temperature item is used to express the surface temperature of the target electronic device detected in real time;

[0008] Acquire attribute data of a target electronic device to obtain a target attribute item, where the target attribute item is used to express housing information of the target electronic device;

[0009] Based on the target attribute item, a target test sample is set, and the minimum data of the temperature change difference of the target test sample when it is affected by the ambient temperature and the ambient humidity is detected to obtain a calculated temperature item and a calculated humidity item;

[0010] Acquire real-time temperature data and real-time humidity data of the target electronic device, and obtain an ambient temperature item and an ambient humidity item;

[0011] Based on the ambient temperature item and the ambient humidity item, the compensation data of the target electronic device is obtained through a compensation method, thereby obtaining the monitoring temperature data of the target electronic device and obtaining the real-time monitoring item.

[0012] Furthermore, the method for obtaining the calculated temperature item and the calculated humidity item includes:

[0013] Based on the target attribute item, at least two target test samples are set to obtain a first test sample set;

[0014] Based on the first test sample set, a detection temperature is set to obtain a test temperature item, and an initial ambient temperature and an initial ambient humidity are set at the same time. Based on the initial ambient temperature and the initial ambient humidity, the first test sample set is detected with the test temperature item, and a feedback temperature of the first test sample set is obtained to obtain an initial temperature feedback item and an initial humidity feedback item.

[0015] Setting adjustment values, adjusting the initial ambient temperature and the initial ambient humidity based on the adjustment values, respectively, to obtain a temperature adjustment value and a humidity adjustment value, testing the first test sample set again with the test temperature item based on the temperature adjustment value and the humidity adjustment value, and obtaining a feedback temperature of the first test sample set to obtain an adjustment temperature feedback item and an adjustment humidity feedback item;

[0016] Based on the comparison results of the initial temperature feedback item and the adjusted temperature feedback item, the target temperature with the smallest difference from the test temperature item is obtained as the target temperature item. Based on the comparison results of the initial humidity feedback item and the adjusted humidity feedback item, the target humidity with the smallest difference from the test temperature item is obtained as the target humidity item, and then the calculated temperature item and the calculated humidity item are obtained respectively.

[0017] Furthermore, the method for obtaining the calculated temperature item and the calculated humidity item further includes:

[0018] Based on the target attribute item, at least two target test samples are set to obtain a second test sample set;

[0019] Based on the second test sample set, a detection temperature is set to obtain a test temperature item, and an acquisition period is set at the same time. Based on the acquisition period, a target electronic device, an extremely high temperature value, an extremely low temperature value, an extremely high humidity value, and an extremely low humidity value are acquired. An initial temperature and an initial humidity are set with the extremely high temperature value, the extremely low temperature value, the extremely high humidity value, and the extremely low humidity value. Based on the initial temperature and the initial humidity, a first jitter value and a second jitter value are set. The second test sample set is detected with the test temperature item, and a feedback temperature of the second test sample set is acquired to obtain an initial first feedback item and an initial second feedback item.

[0020] The initial temperature and the initial humidity are adjusted with the first beating value and the second beating value respectively to obtain the first beating feedback and the second beating feedback, and the difference between the first beating feedback and the second beating feedback and the initial first feedback item and the initial second feedback item is determined, and the smaller difference is used as the target beating direction, and the beating feedback is continuously obtained for the target beating direction to obtain a beating feedback set, and the minimum value in the beating feedback set is obtained as the target value to obtain the calculated temperature item and the calculated humidity item.

[0021] Furthermore, the compensation method includes:

[0022] Create an environmental compensation formula, the environmental compensation formula is:

[0023] ;

[0024] in Monitor temperature data of target electronic devices, is the detected temperature data of the target electronic device, is the composite compensation function;

[0025] ;

[0026] in is the ambient temperature, Indicates the ambient humidity. represents the calculated temperature term, To calculate the humidity term, is the standard deviation of humidity, which is used to control the influence of humidity on temperature. is the thermal property of the material, is the linear influence coefficient of ambient temperature difference on device temperature, Coefficient used to account for the nonlinear effects of humidity.

[0027] Furthermore, the method for obtaining the linear influence coefficient of the ambient temperature difference on the device temperature and the coefficient of the nonlinear influence of humidity includes:

[0028] Set up at least three test combinations to obtain the monitoring temperature data of electronic devices under different ambient temperatures and ambient humidity conditions. And the detection temperature data of electronic devices ;

[0029] Get the data of the test combination and calculate the temperature difference. The formula for obtaining the temperature difference is:

[0030] ;

[0031] The influence of ambient temperature and humidity is modeled by the target method, and the linear model is:

[0032] ;

[0033] The fitting model obtains the linear influence coefficient of the ambient temperature difference on the device temperature and the coefficient of nonlinear effect of humidity .

[0034] Furthermore, the method for obtaining the target detection temperature item includes: setting at least two first target detection devices, setting a detection interval, arranging the first target detection devices respectively based on the detection interval, obtaining surface temperature data of the target electronic device, obtaining a detection data item, obtaining an average value of the detection data item, and obtaining a target detection temperature item.

[0035] Furthermore, the attribute data of the target electronic device includes material attributes and data attributes, and the method for obtaining the target attribute items includes: splitting the target electronic device into a device body and a device shell, obtaining the material properties of the device shell to obtain material attribute items, and simultaneously obtaining the thickness data of the device shell to obtain data attribute items, and combining the material attribute items with the data attribute items to obtain the target attribute items.

[0036] Furthermore, the method for obtaining the ambient temperature item and the ambient humidity item includes: setting at least two second target detection device groups, the second target detection device groups including at least one temperature detection device and one humidity detection device, and obtaining the temperature data and humidity data of the target electronic device based on the second target detection device groups to obtain the ambient temperature item and the ambient humidity item.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The electronic device temperature monitoring method obtains actual temperature data of the electronic device, then obtains attribute data of the electronic device, sets a test sample based on the attribute data, detects the minimum value of the temperature change difference of the test sample when it is affected by ambient temperature and ambient humidity through a detection method, obtains a calculated temperature item and a calculated humidity item, and obtains real-time temperature data and real-time humidity data of the target electronic device. An environmental impact compensation formula is created through the obtained related data, and the actual temperature compensation value of the target electronic device under different ambient temperature and ambient humidity conditions is calculated, thereby obtaining the actual temperature data of the target electronic device, achieving a real temperature monitoring effect on the target electronic device, and being free from interference from ambient temperature and ambient humidity, so that the monitoring result is more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the overall process of the present invention;

[0040] Figure 2 It is a schematic diagram of the detection interval of the present invention;

[0041] Figure 3 It is a schematic diagram of the device body and the device housing of the present invention;

[0042] Figure 4 is a schematic diagram of the target temperature item of the present invention;

[0043] Figure 5 It is a schematic diagram of the target humidity item of the present invention. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] Temperature changes not only affect the performance and stability of electronic devices, but may even cause damage to them. Therefore, it is crucial to accurately obtain the actual temperature of electronic devices. However, the actual data of temperature detection often differs from the actual temperature of electronic devices. This difference is not simply caused by the performance and failure of the device itself, but is also affected by many factors such as ambient temperature and ambient humidity. First of all, the impact of environmental factors on the temperature detection results of electronic devices cannot be ignored. The change of ambient temperature is an important factor affecting the accuracy of electronic device temperature data. When the ambient temperature is low, the low temperature of the outside world will have a significant inhibitory effect on the heating effect of electronic devices, resulting in the temperature value recorded by the detection equipment being lower than the actual temperature of the electronic devices. In this case, the electronic devices may not operate adequately within the temperature range of certain key operations, thereby potentially affecting their performance, such as extending the response time and reducing the processing speed. On the contrary, in the case of high ambient temperature, electronic devices are prone to overheating due to the increase in ambient temperature. The cause of this overheating is often mistaken for the heat generated by the electronic devices themselves, leading to a wrong understanding of device performance. Due to the high ambient temperature, the temperature data recorded by the detection equipment may appear false. High, which may cause overload and failure of electronic equipment during operation. Therefore, in a high-temperature environment, ignoring the impact of the external environment on temperature data may lead to incorrect judgment of the safe operation status of electronic devices, which may bring hidden dangers to equipment maintenance and management. Therefore, when monitoring the temperature of electronic devices, attention must be paid to the impact of ambient temperature and humidity factors on the monitoring results. The technical solution provided by the present application first obtains the detection temperature data of the target electronic device to obtain the target detection temperature item, and then obtains the attribute data of the target electronic device to obtain the target attribute item. Based on the target attribute item, the target test sample is set, and the minimum data of the temperature change difference of the target test sample when it is affected by ambient temperature and ambient humidity is detected to obtain the calculated temperature item and the calculated humidity item. The real-time temperature data and real-time humidity data of the target electronic device are obtained to obtain the ambient temperature item and the ambient humidity item. Then, based on the ambient temperature item and the ambient humidity item, the compensation data of the target electronic device is obtained by a compensation method, thereby obtaining the monitoring temperature data of the target electronic device, thereby achieving the real temperature monitoring effect of the target electronic device, and is not affected by the ambient temperature and ambient humidity, so that the monitoring result is more accurate. Specifically in the present application, Figure 1 As shown, steps S100-S500 are included.

[0046] Step S100: Acquire detection temperature data of a target electronic device to obtain a target detection temperature item.

[0047] It should be noted that the target detection temperature item is used to express the surface temperature of the target electronic device detected in real time. Since the electronic device is affected by the ambient temperature and humidity during actual operation, its surface temperature may be slightly different from the actual temperature. Therefore, when compensating for the environment later, it is necessary to first obtain the surface temperature of the electronic device.

[0048] like Figure 2 As shown, specifically, the method for obtaining the target detection temperature item includes: setting two first target detection devices, the first target detection device is an infrared temperature sensor, setting a detection interval, the detection interval is 50 cm, arranging infrared temperature sensors based on the detection interval, obtaining surface temperature data of the target electronic device, obtaining a detection data item, obtaining an average value of the detection data item, obtaining a target detection temperature item, and detecting the average temperature of the surface of the electronic device according to the two infrared temperature sensors, which can make the detection result more accurate and, under the premise of the detection interval, make the detection result more comprehensive.

[0049] Step S200: Acquire the attribute data of the target electronic device to obtain the target attribute items.

[0050] It should be noted that the target attribute item is used to express the shell information of the target electronic device. The attribute data of the target electronic device includes material attributes and data attributes. The method for obtaining the target attribute item includes: splitting the target electronic device into a device body and a device shell, obtaining the material properties of the device shell, obtaining the material attribute item, and simultaneously obtaining the thickness data of the device shell to obtain the data attribute item. The material attribute item and the data attribute item are combined to obtain the target attribute item.

[0051] like Figure 3 As shown, in a specific implementation process, the temperature of an electronic device is monitored. The electronic device consists of an electronic body and a polyethylene outer shell. At this time, the electronic device is split into a device body and a device shell. The device body is the electronic body, and the device shell is the polyethylene outer shell. The material property of the shell is obtained to be polyethylene. At this time, the material property item is polyethylene. The thickness of the device shell is 2 mm. At this time, the data attribute item is 2 mm, and then the target attribute item is a polyethylene shell with a thickness of 2 mm.

[0052] Step S300: Based on the target attribute item, a target test sample is set, and the minimum data of the temperature change difference of the target test sample when it is affected by the ambient temperature and the ambient humidity is detected to obtain a calculated temperature item and a calculated humidity item.

[0053] It should be noted that the method for obtaining the calculated temperature item and the calculated humidity item includes: based on the target attribute item, setting two target test samples, divided into sample No. 1 and sample No. 2, to obtain the first test sample set; based on the first test sample set, setting the detection temperature, the detection temperature is the normal working temperature of the target attribute item, which is 26°C, to obtain the test temperature item, and at the same time setting the initial ambient temperature and the initial ambient humidity, setting the initial ambient temperature to 0°C, and the initial ambient humidity to 0%, based on the initial ambient temperature and the initial ambient humidity, using the test temperature item to detect the first test sample set, and obtaining the feedback temperature of the first test sample set, to obtain the initial temperature feedback item and the initial humidity feedback item; setting the adjustment value, adjusting The setting values ​​are 1°C and 1% respectively. The initial ambient temperature and the initial ambient humidity are adjusted based on the adjustment values ​​to obtain the temperature adjustment value and the humidity adjustment value. The first test sample set is detected again with the test temperature item based on the temperature adjustment value and the humidity adjustment value, and the feedback temperature of the first test sample set is obtained to obtain the adjustment temperature feedback item and the adjustment humidity feedback item. Based on the comparison result of the initial temperature feedback item and the adjustment temperature feedback item, the target temperature with the smallest difference with the test temperature item is obtained as the target temperature item. Based on the comparison result of the initial humidity feedback item and the adjustment humidity feedback item, the target humidity with the smallest difference with the test temperature item is obtained as the target humidity item, and then the calculated temperature item and the calculated humidity item are respectively obtained.

[0054] like Figure 4-Figure 5As shown, in the specific implementation process, the ideal storage temperature of polyethylene is 18-26℃, so the polyethylene material is temperature tested with a test temperature item of 26℃, and it is divided into sample No. 1 and sample No. 2. The test temperature item is applied on one side of sample No. 1 and sample No. 2, and the temperature feedback on the other side of sample No. 1 and sample No. 2 is tested. First, it is carried out in an experimental environment with an initial ambient temperature of 18℃ and an initial ambient humidity of 0%. It is detected that the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22℃, and then the temperature and humidity are adjusted according to the adjustment values. When the ambient temperature is 19℃, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22.3℃; when the ambient temperature is 20℃, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22.8℃; when the ambient temperature is 21℃, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 23.2℃; when the ambient temperature is 22℃, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 23.5 ℃; repeat the experimental steps; when the ambient humidity is 1%, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22.1℃; when the ambient humidity is 2%, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22.4℃; when the ambient humidity is 3%, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22.8℃; when the ambient humidity is 4%, the temperature feedback on the other side of sample No. 1 and sample No. 2 is 22.9℃; repeat the experimental steps, at this time, the target temperature with the smallest difference from the test temperature item is obtained as the target temperature item, and the target humidity with the smallest difference from the test temperature item is obtained as the target humidity item based on the comparison result of the initial humidity feedback item and the adjusted humidity feedback item, and then the calculated temperature item and the calculated humidity item are obtained respectively. After experiments, it is obtained that at 25℃, the difference between the feedback temperature and the test temperature item is the smallest; at 50% humidity, the difference between the feedback temperature and the test temperature item is the smallest, and at this time the calculated temperature item and the calculated humidity item are 25℃ and 50% respectively.

[0055] It should be noted that the method for obtaining the calculated temperature item and the calculated humidity item also includes: based on the target attribute item, setting two target test samples, namely sample No. 3 and sample No. 4, to obtain a second test sample set; based on the second test sample set, setting the detection temperature, the detection temperature is 26°C, to obtain the test temperature item, and setting the acquisition period at the same time, the acquisition device is 365 days, based on the acquisition period, the target electronic device, the extreme high temperature value, the extreme low temperature value, the extreme high humidity value and the extreme low humidity value are obtained, and the initial temperature and initial humidity are set with the extreme high temperature value, the extreme low temperature value, the extreme high humidity value and the extreme low humidity value, the initial temperature and initial humidity are half of the difference between the extreme high temperature value and the extreme low temperature value and half of the difference between the extreme high humidity value and the extreme low humidity value, respectively, based on the initial temperature and initial humidity, set the first The first and second jitter values ​​are ±1, that is, for temperature, the jitter values ​​are ±1°C, and for humidity, the jitter values ​​are ±1%. The second test sample set is tested with the test temperature item, and the feedback temperature of the second test sample set is obtained to obtain an initial first feedback item and an initial second feedback item; the initial temperature and the initial humidity are adjusted with the first and second jitter values ​​respectively to obtain a first jitter feedback and a second jitter feedback, and the difference between the first and second jitter feedback and the initial first and second feedback items is determined, and the smaller difference is used as the target jitter direction, and the jitter feedback is continuously obtained for the target jitter direction to obtain a jitter feedback set, and the minimum value in the jitter feedback set is obtained as the target value to obtain a calculated temperature item and a calculated humidity item.

[0056] In the specific implementation process, it is obtained that within the 365-day acquisition period of the target electronic device, the extremely high temperature is 40°C, the extremely low temperature is 0°C, the extremely high humidity is 80%, and the extremely low humidity is 20%. At this time, the initial temperature and initial humidity are set to 20°C and 30% respectively. According to the set jump value, the first jump value is -1°C and -1%, and the second jump value is 1°C and 1%. At this time, the polyethylene material is temperature tested and divided into sample No. 3 and sample No. 4. A test temperature item of 26°C is applied to one side of sample No. 3 and sample No. 4. First, the temperature feedback on the other side is 26°C under the conditions that the initial temperature and initial humidity are 20°C and 30% respectively. Then, according to the set jump value, 19 ℃ and 21℃ were tested, and the temperature feedback on the other side was 22.2 and 22.5℃ respectively. The difference was -3.8 and -3.5 respectively. The smaller difference was taken as the target jumping direction, that is, 21℃ was the jumping direction. Then 29% and 31% were tested, and the temperature feedback on the other side was 22.3℃ and 22.6℃ respectively. The difference was -3.7 and -3.4 respectively. The smaller difference was taken as the target jumping direction, that is, 31% was the jumping direction. The experimental steps were repeated, and it was found that at 25℃, the difference between the feedback temperature and the test temperature item was the smallest; at 50% humidity, the difference between the feedback temperature and the test temperature item was the smallest. At this time, the calculated temperature item and the calculated humidity item were 25℃ and 50% respectively.

[0057] Step S400: Acquire real-time temperature data and real-time humidity data of the target electronic device to obtain an ambient temperature item and an ambient humidity item.

[0058] It should be noted that the method for obtaining the ambient temperature item and the ambient humidity item includes: setting two second target detection device groups, the second target detection device groups at least including a temperature sensor and a humidity sensor, obtaining temperature data and humidity data of the target electronic device based on the second target detection device groups, and obtaining the ambient temperature item and the ambient humidity item;

[0059] Step S500: Based on the ambient temperature item and the ambient humidity item, compensation data of the target electronic device is obtained by a compensation method.

[0060] It should be noted that by obtaining the compensation data of the target electronic device, the monitoring temperature data of the target electronic device is obtained to obtain the real-time monitoring item. The compensation method includes:

[0061] Create an environmental compensation formula, the environmental compensation formula is:

[0062] ;

[0063] in Monitor temperature data of target electronic devices, is the detected temperature data of the target electronic device, is the composite compensation function;

[0064] ;

[0065] in is the ambient temperature, Indicates the ambient humidity. represents the calculated temperature term, To calculate the humidity term, is the standard deviation of humidity, which is used to control the influence of humidity on temperature. is the thermal property of the material, is the linear influence coefficient of ambient temperature difference on device temperature, The coefficient used to express the nonlinear effect of humidity, the linear effect coefficient of the ambient temperature difference on the device temperature, and the coefficient of the nonlinear effect of humidity are obtained in the following ways:

[0066] Set up at least three test combinations to obtain the monitoring temperature data of electronic devices under different ambient temperatures and ambient humidity conditions. And the detection temperature data of electronic devices ;

[0067] Get the data of the test combination and calculate the temperature difference. The formula for obtaining the temperature difference is:

[0068] ;

[0069] The influence of ambient temperature and humidity is modeled by the target method, and the linear model is:

[0070] ;

[0071] The fitting model obtains the linear influence coefficient of the ambient temperature difference on the device temperature and the coefficient of nonlinear effect of humidity .

[0072] In the specific implementation process, three test combinations are set to obtain the monitoring temperature data of electronic devices under different ambient temperatures and ambient humidity conditions. And the detection temperature data of electronic devices ,The data obtained are the detection temperature data of the electronic device at 28℃, 25℃, 30℃, and 30℃, respectively.,The monitoring temperature data of the electronic device are 30℃, 28℃, 36℃, and the temperatures are 2℃, 3℃, 6℃, respectively;

[0073] The influence of ambient temperature and humidity is modeled by the target method, and the linear model is:

[0074] ;

[0075] The fitting results are:

[0076] ;

[0077] ;

[0078] The calculated temperature and humidity items are 25°C and 50% respectively. is 10. Through the least squares method, the linear influence coefficient of the ambient temperature difference on the device temperature is obtained through calculation. and the coefficient of nonlinear effect of humidity The values ​​are 0.5 and 2 respectively. At the same time, the ambient temperature and humidity are 15°C and 80% respectively. According to the environmental compensation formula:

[0079] ;

[0080] ;

[0081] After calculation:

[0082] ;

[0083] ;

[0084] The final calculation result is =25.56°C, that is, the monitoring temperature data of the target electronic device is 25.56°C, and the real-time monitoring item is obtained.

[0085] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is limited by the attached embodiments and their equivalents.

Claims

1. A method for monitoring the temperature of an electronic device, characterized in that: include: Acquire detection temperature data of a target electronic device to obtain a target detection temperature item, where the target detection temperature item is used to express the surface temperature of the target electronic device detected in real time; Acquire attribute data of a target electronic device to obtain a target attribute item, where the target attribute item is used to express housing information of the target electronic device; Based on the target attribute item, a target test sample is set, and the minimum data of the temperature change difference of the target test sample when it is affected by the ambient temperature and the ambient humidity is detected to obtain a calculated temperature item and a calculated humidity item; Acquire real-time temperature data and real-time humidity data of the target electronic device, and obtain an ambient temperature item and an ambient humidity item; Based on the ambient temperature item and the ambient humidity item, the compensation data of the target electronic device is obtained through a compensation method, thereby obtaining the monitoring temperature data of the target electronic device and obtaining the real-time monitoring item.

2. The method for monitoring the temperature of an electronic device according to claim 1, characterized in that: The method for obtaining the calculated temperature item and the calculated humidity item includes: Based on the target attribute item, at least two target test samples are set to obtain a first test sample set; Based on the first test sample set, a detection temperature is set to obtain a test temperature item, and an initial ambient temperature and an initial ambient humidity are set at the same time. Based on the initial ambient temperature and the initial ambient humidity, the first test sample set is detected with the test temperature item, and a feedback temperature of the first test sample set is obtained to obtain an initial temperature feedback item and an initial humidity feedback item. Setting adjustment values, adjusting the initial ambient temperature and the initial ambient humidity based on the adjustment values, respectively, to obtain a temperature adjustment value and a humidity adjustment value, testing the first test sample set again with the test temperature item based on the temperature adjustment value and the humidity adjustment value, and obtaining a feedback temperature of the first test sample set to obtain an adjustment temperature feedback item and an adjustment humidity feedback item; Based on the comparison results of the initial temperature feedback item and the adjusted temperature feedback item, the target temperature with the smallest difference from the test temperature item is obtained as the target temperature item. Based on the comparison results of the initial humidity feedback item and the adjusted humidity feedback item, the target humidity with the smallest difference from the test temperature item is obtained as the target humidity item, and then the calculated temperature item and the calculated humidity item are obtained respectively.

3. The method for monitoring temperature of an electronic device according to claim 1, characterized in that: The method for obtaining the calculated temperature item and the calculated humidity item also includes: Based on the target attribute item, at least two target test samples are set to obtain a second test sample set; Based on the second test sample set, a detection temperature is set to obtain a test temperature item, and an acquisition period is set at the same time. Based on the acquisition period, a target electronic device, an extremely high temperature value, an extremely low temperature value, an extremely high humidity value, and an extremely low humidity value are acquired. An initial temperature and an initial humidity are set with the extremely high temperature value, the extremely low temperature value, the extremely high humidity value, and the extremely low humidity value. Based on the initial temperature and the initial humidity, a first jitter value and a second jitter value are set. The second test sample set is detected with the test temperature item, and a feedback temperature of the second test sample set is acquired to obtain an initial first feedback item and an initial second feedback item. The initial temperature and the initial humidity are adjusted with the first beating value and the second beating value respectively to obtain the first beating feedback and the second beating feedback, and the difference between the first beating feedback and the second beating feedback and the initial first feedback item and the initial second feedback item is determined, and the smaller difference is used as the target beating direction, and the beating feedback is continuously obtained for the target beating direction to obtain a beating feedback set, and the minimum value in the beating feedback set is obtained as the target value to obtain the calculated temperature item and the calculated humidity item.

4. The method for monitoring temperature of an electronic device according to claim 1, characterized in that: The compensation method includes: Create an environmental compensation formula, the environmental compensation formula is: ;in Monitor temperature data of target electronic devices, is the detected temperature data of the target electronic device, is the composite compensation function; ;in is the ambient temperature, Indicates the ambient humidity. represents the calculated temperature term, To calculate the humidity term, is the standard deviation of humidity, which is used to control the influence of humidity on temperature. is the thermal property of the material, is the linear influence coefficient of ambient temperature difference on device temperature, Coefficient used to account for the nonlinear effects of humidity.

5. The method for monitoring the temperature of an electronic device according to claim 4, characterized in that: The method for obtaining the linear influence coefficient of the ambient temperature difference on the device temperature and the coefficient of the nonlinear influence of humidity includes: Set up at least three test combinations to obtain the monitoring temperature data of electronic devices under different ambient temperatures and ambient humidity conditions. And the detection temperature data of electronic devices ; Get the data of the test combination and calculate the temperature difference. The formula for obtaining the temperature difference is: ; The influence of ambient temperature and humidity is modeled by the target method, and the linear model is: ; The fitting model obtains the linear influence coefficient of the ambient temperature difference on the device temperature and the coefficient of nonlinear effect of humidity .

6. The method for monitoring temperature of an electronic device according to claim 1, characterized in that: The method for obtaining the target detection temperature item includes: setting at least two first target detection devices, setting a detection interval, arranging the first target detection devices respectively based on the detection interval, obtaining surface temperature data of the target electronic device, obtaining a detection data item, obtaining an average value of the detection data item, and obtaining the target detection temperature item.

7. The method for monitoring temperature of an electronic device according to claim 1, characterized in that: The attribute data of the target electronic device includes material attributes and data attributes. The method for obtaining the target attribute items includes: splitting the target electronic device into a device body and a device shell, obtaining the material properties of the device shell to obtain material attribute items, and simultaneously obtaining the thickness data of the device shell to obtain data attribute items, and combining the material attribute items with the data attribute items to obtain the target attribute items.

8. The method for monitoring temperature of an electronic device according to claim 1, characterized in that: The method for obtaining the ambient temperature item and the ambient humidity item includes: setting at least two second target detection device groups, the second target detection device groups include at least one temperature detection device and one humidity detection device, and obtaining the temperature data and humidity data of the target electronic device based on the second target detection device groups to obtain the ambient temperature item and the ambient humidity item.

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