Aging test system and batch aging test method thereof

Abstract

The invention discloses an aging test system and a batch aging test method thereof, and relates to the field of chip aging test. The system comprises at least two test boxes, a plurality of grooves are formed in the outer surface of the top of each test box and coated with heat insulation layers, and two through holes are formed in each groove; a heating module is arranged in the test box; each aging test board comprises a first board surface provided with a measurement and control module; the second plate surface is provided with two parallel interface modules which are electrically connected with the measurement and control module through pins, and each interface module is connected with a test seat for inserting a chip to be tested; the interface module is embedded in the test groove and abuts against the heat insulation layer, and the test seat penetrates through the through hole and is placed in the cavity of the test box. Each output end of the temperature adjusting module is connected with the two test boxes through a conveying pipeline; the controller is electrically connected with the heating module, the measurement and control module and the temperature adjusting module. The service life of the aging test board can be effectively prolonged, and the reliability of the temperature cycle aging test is improved.

Description

Technical Field

[0001] The present application relates to the field of chip aging testing, and in particular to an aging testing system and a batch aging testing method thereof. Background Art

[0002] The high temperature aging test of the chip is to heat the chip to its operating temperature or higher than the operating temperature to test the chip's tolerance and reliability, so as to find chip failures at an early stage, which is of great significance for product quality supervision and the screening of high-quality chips. The chip temperature cycle aging test is a type of high temperature aging test for the chip. It heats the chip, cools it down, and heats it again after cooling down, and performs the test in this cycle.

[0003] Some chips have high-speed interfaces with the CPU, which have strict restrictions on the length and impedance of the signal line. For such chips, in order to meet the signal integrity requirements, the chip to be tested, the test control CPU and other devices must be implemented on a PCB board, and the two must be placed as close as possible. Based on this, in order to achieve a more reliable aging test, the current aging test system is integrated into an aging test board. At present, the chip to be tested is usually inserted into the aging test board for aging testing. The integrated aging test board has a large board area and high cost; and it is not easy to dissipate heat under long-term operation. When the chip temperature cycle aging test is required, the chip to be tested and the integrated aging test board are usually placed in the test temperature chamber together for the chip temperature cycle aging test. When the test environment temperature in the test temperature chamber cycles, while the high-temperature aging test is performed on the chip to be tested, other devices other than the chip to be tested (such as the test control CPU and surrounding circuits) will also accelerate aging, resulting in performance deterioration of other devices such as the test control CPU, short service life, and reduced reliability of the temperature cycle aging test. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes an aging test system and a batch aging test method thereof, which can effectively extend the service life of the aging test board and improve the reliability of the temperature cycle aging test.

[0005] In a first aspect, an embodiment of the present application provides an aging test system, comprising: At least two test boxes, each of which has a plurality of grooves on its top outer surface and is coated with a heat insulation layer, and two through holes are formed in the grooves; a heating module is provided in the test box; A plurality of aging test boards, each of which comprises: a first board surface and a second board surface, the first board surface being provided with a measurement and control module, the second board surface being provided with two parallel interface modules electrically connected to the measurement and control module through pins, each of the interface modules being connected to a test socket for inserting a chip to be tested; the interface module being embedded in the test slot and abutting against the heat insulation layer, the test socket being placed in the chamber of the test box through the through hole; A temperature adjustment module, comprising at least one output end, each of which is connected to the two test boxes via a delivery pipeline; A controller, electrically connected to the heating module, the measurement and control module, and the temperature adjustment module; The controller is used for: when at least one of the temperature compensation values ​​determined according to the target test temperature required for each test box is not 0, controlling the temperature adjustment module and the heating module to perform combined heating to raise the chamber temperature of all the test boxes to the target test temperature, and completing a high-temperature aging test on a batch of chips to be tested; controlling the temperature adjustment module to perform cooling processing and turning off the heating module to cool the chamber temperature to the initial temperature; repeating the combined heating, high-temperature aging test, and cooling until the number of high-temperature aging tests is equal to the number threshold, and then terminating the test.

[0006] In a second aspect, an embodiment of the present application provides a batch aging test method for an aging test system, which is applied to a controller of an aging test system as described in any one of the embodiments of the first aspect; the system further includes: at least two test boxes, each of which is provided with a heating module; multiple aging test boards, each of which includes a measurement and control module and two chips to be tested; a temperature control module; The method comprises: Determining the temperature compensation value required for each test box according to the target test temperature required for each test box; When there is at least one temperature compensation value that is not 0, a combined working mode instruction is determined according to the temperature compensation value; according to the combined working mode instruction, the temperature adjustment module and each of the heating modules are controlled to perform a combined heating process to increase the chamber temperature of the test box from an initial temperature to the target test temperature; At the target test temperature, starting the measurement and control module to perform a high temperature aging test on the batch of chips to be tested; After completing a high-temperature aging test, the temperature adjustment module is controlled to perform cooling processing and the heating module is turned off, so that the chamber temperature of all the test boxes is reduced from the target test temperature to the initial temperature; The combined heating treatment, high temperature aging test, and refrigeration treatment are repeated until the number of high temperature aging tests is equal to a number threshold, and the batch aging test is terminated.

[0007] The embodiment of the present application includes: an aging test system including: at least two test boxes, multiple aging test boards, a temperature control module, and a controller; wherein, each test box has multiple grooves on its top outer surface and is coated with a heat insulation layer, and two through holes are provided in the grooves; a heating module is arranged in the test box; each aging test board includes: a first board surface and a second board surface, a measurement and control module is arranged on the first board surface, and two parallel interface modules electrically connected to the measurement and control module through pins are arranged on the second board surface, and each interface module is connected to a test socket for inserting a chip to be tested; the interface module is embedded in the test slot and abuts against the heat insulation layer, and the test socket is placed in the chamber of the test box through the through hole; the temperature control module includes at least one output terminal, and each output terminal It is connected to two test boxes through a conveying pipeline; the controller is electrically connected to the heating module, the measurement and control module, and the temperature control module; when the aging test system is used to perform batch aging tests on batches of chips to be tested, through the controller, first, when at least one of the temperature compensation values ​​determined according to the target test temperature required for each test box is not 0, the temperature control module and the heating module are controlled to perform combined heating to increase the chamber temperature of all test boxes to the target test temperature, and a high-temperature aging test is completed for the batch of chips to be tested; then, the temperature control module is controlled to perform cooling treatment and the heating module is turned off to cool the chamber temperature to the initial temperature; the combined heating, high-temperature aging test, and cooling are repeated until the number of high-temperature aging tests is equal to the number threshold, and the test is terminated. By setting the chip to be tested and the measurement and control module on a test board separately, the chip to be tested is placed in the test environment provided by the chamber of the test box, and the chamber temperature adjustment function of the temperature adjustment module is used to place the chip to be tested in a high-temperature, initial temperature cycle switching test environment, so as to facilitate the temperature cycle aging test; at the same time, the measurement and control module is placed in a room temperature environment to ensure that the performance of the measurement and control module and its surrounding circuits are normal during the temperature cycle aging test, which is conducive to extending the service life of the aging test board and improving the reliability of the temperature cycle aging test. That is to say, the embodiment of the present application can effectively extend the service life of the aging test board and improve the reliability of the temperature cycle aging test. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of the overall structure of an aging test system provided by an embodiment of the present application; Figure 2 is a schematic top view of a test box provided by an embodiment of the present application; Figure 3 is a schematic top view of a first panel provided by an embodiment of the present application; Figure 4 is a schematic top view of a second panel provided by an embodiment of the present application; Figure 5 This is an arrangement of two interface modules in a burn-in test board provided by an embodiment of the present application; Figure 6 This is an arrangement of two interface modules in a burn-in test board provided in another embodiment of the present application; Figure 7 is a side view of a burn-in test board in a connected state provided by an embodiment of the present application; Figure 8 is a schematic diagram of the specific structure of a temperature control module provided in one embodiment of the present application; Fig. 9 It is a specific flow chart of a batch aging test method of an aging test system provided in one embodiment of the present application. DETAILED DESCRIPTION

[0009] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0010] It should be understood that in the description of the present application, the orientation descriptions, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0011] It should be noted that although a logical order is shown in the flowchart in the description of the present application, in some cases, the steps shown or described may be performed in an order different from that in the flowchart. In the description of the present application, a number of means one or more, and a plurality of means two or more. The description of "first" and "second" is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0012] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0013] The present application provides an aging test system and a batch aging test method of the aging test system, which relate to the field of chip aging test. The system includes at least two test boxes, each of which has a plurality of grooves on the top outer surface and is coated with a heat insulation layer, and two through holes are provided in the grooves; a heating module is provided in the test box; a plurality of aging test boards, each of which includes: a first board surface provided with a measurement and control module; two parallel interface modules electrically connected to the measurement and control module through pins are provided on the second board surface, and each interface module is connected to a test seat for inserting a chip to be tested; the interface module is embedded in the test slot and abuts against the heat insulation layer, and the test seat is placed in the chamber of the test box through the through hole; each output end of the temperature control module is connected to the two test boxes through a delivery pipeline; the controller is electrically connected to the heating module, the measurement and control module, and the temperature control module. It can effectively extend the service life of the aging test board and improve the reliability of the temperature cycle aging test.

[0014] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0015] First, as Figure 1 As shown, the aging test system 1000 includes: at least two test boxes 300 , a plurality of aging test boards 200 , a temperature adjustment module 100 , and a controller 500 .

[0016] Specifically, Figure 1 , Figure 2 , Figure 7 As shown, a plurality of grooves 301 are formed on the top outer surface of each test box 300 and coated with a heat insulating layer 303 , and two through holes 302 are formed in the grooves 301 ; a heating module 400 is disposed in the test box 300 .

[0017] Specifically, the groove 301 is used to place the interface module 205, and the shape and size of the groove 301 match the interface module 205. Therefore, the embodiment of the present application does not specifically limit the shape and size of the groove 301. Each groove 301 corresponds to a aging test board 200, and multiple grooves 301 are set on the test box 300, so that a batch of chips to be tested can be subjected to temperature cycle aging test. When performing high-temperature aging test, the target test temperature required for different types of chips to be tested may be different. Therefore, when different types of chips to be tested need to be tested, the aging test board 200 with different types of chips to be tested can be loaded and placed on the grooves 301 of different test boxes 300. For example, only the chips to be tested of type U1 are placed on the first test box 300, and only the chips to be tested of type U2 are placed on the second test box 300, thereby realizing group aging test based on different chip types. Those skilled in the art can design the number of grooves 301 on the test box 300 according to actual needs, so the embodiment of the present application does not specifically limit the number of grooves 301 set.

[0018] In one embodiment, the test box 300 further includes a sealing cover that can be detachably connected to the groove 301. When the groove 301 is not used, the sealing cover is used to seal the groove 301 to form a relatively closed space, so that the chamber temperature in the test box 300 can be adjusted more conveniently.

[0019] In one embodiment, the test box 300 further includes: an input port and an output port provided with a throttle valve. The input port is connected to the output end of the temperature control module 100 through a delivery pipeline, so as to guide the cold air or hot air generated by the temperature control module 100 into the test box 300. The volume of the test box 300 is limited, and there may be a situation where the temperature cycle changes in the test box 300 cause the internal and external pressure difference to be too large, thereby damaging the shell of the test box 300. Therefore, by providing an output port and a throttle valve, it is convenient to timely adjust the pressure difference between the test box 300 and the external environment, thereby ensuring safety in use.

[0020] Specifically, the through hole 302 is used to allow the test socket 206 to pass through, and the shape and size of the through hole 302 match the test socket 206. Therefore, the embodiment of the present application does not impose any specific restrictions on the shape and size of the through hole 302.

[0021] Specifically, each heating module 400 is used to perform temperature compensation on the chamber environment of the test box 300 under the control of the controller 500, and the chamber temperature in the test box 300 is increased to the required target test temperature to provide a suitable test environment for the temperature cycle aging test.

[0022] The embodiment of the present application provides a test basis for performing temperature cycle aging tests on batches of chips to be tested by setting up a test box 300.

[0023] Specifically, Figure 3 , Figure 4 and Figure 7 As shown, each aging test board 200 includes: a first board surface 201 and a second board surface 202, a measurement and control module 203 is arranged on the first board surface 201, and two parallel interface modules 205 are arranged on the second board surface 202 and are electrically connected to the measurement and control module 203 through pins 204. Each interface module 205 is connected to a test socket 206 for inserting a chip to be tested; the interface module 205 is embedded in the test slot and abuts against the heat insulation layer 303, and the test socket 206 is placed in the chamber of the test box 300 through the through hole 302. The interface module 205 is detachably connected to the pin 204. When the interface module 205 is damaged, only the interface module 205 can be replaced without discarding the entire aging test board 200, which is conducive to reducing hardware costs.

[0024] On the aging test board 200, the connection and assembly status of the second board surface 202, the interface module 205, and the test socket 206 are as follows: Figure 7 As shown, it can be seen that in the vertical direction, the projection area of ​​the test socket 206 is smaller than the projection area of ​​the interface module 205, and the projection area of ​​the interface module 205 is smaller than the surface area of ​​the second board surface 202. Therefore, it is necessary to set a groove 301 whose shape and size match the interface module 205 to facilitate the placement of the interface module 205.

[0025] Specifically, the temperature adjustment module 100 includes at least one output terminal, and each output terminal is connected to two test boxes 300 through a delivery pipeline. It can be understood that the temperature adjustment module 100 is used to simultaneously deliver hot air or cold air to each test box 300, so as to quickly increase the chamber temperature of each test box 300 to a reference temperature or reduce it to an initial temperature; and provide a suitable test environment for performing temperature cycle aging tests on batches of chips to be tested.

[0026] It is understandable that the distance between the temperature control module 100 and the test box 300 will also affect the chamber temperature regulation effect. If the distance between the temperature control module 100 and the test box 300 is large, the delivery pipeline will also be adaptively set to be longer, and the output efficiency of the hot air / cold air output by the temperature control module 100 will also be reduced, and the chamber temperature regulation efficiency will then be lowered. In order to make a temperature control module 100 have the same regulation efficiency for the chamber temperatures of multiple test boxes 300 at the same time, so that the chamber temperatures of the test boxes 300 reach the reference temperature or the initial temperature at the same time, one output end of the temperature control module 100 is only connected to two test boxes 300, and the two test boxes 300 are symmetrically arranged about the connected output end, and the two delivery pipelines between the two test boxes 300 and the output end are the same length. In this way, the effect of synchronous temperature regulation can be achieved.

[0027] like Figure 1 As shown, the controller 500 is electrically connected to the heating module 400, the measurement and control module 203, and the temperature control module 100; the controller 500 is used for: when at least one of the temperature compensation values ​​determined according to the target test temperature required for each test box 300 is not 0, controlling the temperature control module 100 and the heating module 400 to perform combined heating to increase the chamber temperature of all test boxes 300 to the target test temperature, and completing a high-temperature aging test on a batch of chips to be tested; controlling the temperature control module 100 to perform cooling treatment and turning off the heating module 400 to cool the chamber temperature to the initial temperature; repeating the combined heating, high-temperature aging test, and cooling until the number of high-temperature aging tests is equal to the number threshold, and then terminating the test.

[0028] like Figure 5As shown, according to some embodiments of the present application, two interface modules 205 are arranged on the left and right sides of the measurement and control module 203 along the long side direction of the second board surface 202, and the two interface modules 205 and the measurement and control module 203 are located on the same symmetry axis. By arranging the two interface modules 205 on the second board surface 202 opposite to the first board surface 201, it is beneficial to reduce the surface area of ​​the board surface and improve the heat dissipation efficiency of the overall aging test board 200.

[0029] like Figure 6 As shown, according to some embodiments of the present application, two interface modules 205 are sequentially arranged side by side on the same side of the measurement and control module 203 along the long side direction of the second board surface 202, and the two interface modules 205 and the measurement and control module 203 are not located on the same symmetry axis. By arranging the two interface modules 205 on the side of the second board surface 202 opposite to the first board surface 201, it is beneficial to reduce the surface area of ​​the board surface and further improve the heat dissipation efficiency of the aging test board 200.

[0030] like Figure 8 As shown, according to some embodiments of the present application, the temperature adjustment module 100 further includes: a first temperature adjustment unit A and at least one second temperature adjustment unit B; the output end of each second temperature adjustment unit B is connected to two test boxes 300 through a delivery pipeline.

[0031] like Figure 8 As shown, specifically, the first temperature control unit includes: a compressor 101, a four-way valve 104, a first heat exchanger 103, and a gas-liquid separator 102; the compressor 101 includes an exhaust port 1011 and an air intake port 1012, the exhaust port 1011 is connected to the first end 1041 of the four-way valve 104, the exhaust port 1011 is connected to the first high- and low-pressure pipes 106 by setting a first branch of a first solenoid valve 107, and the first end 1041 of the first heat exchanger 103 is connected to the second end 1042 of the four-way valve 104; the first end 1041 of the gas-liquid separator 102 is connected to the air intake port 1012, and the second end 1042 of the gas-liquid separator 102 is connected to the first air pipe 105 connected to the third end 1043 of the four-way valve 104; the second end 1042 of the gas-liquid separator 102 is connected to the first high- and low-pressure pipes 106 by setting a second branch of a second solenoid valve 108.

[0032] like Figure 8As shown, specifically, each second temperature control unit includes: a second heat exchanger 110, the second end 1042 of the second heat exchanger 110 is connected to the second end 1042 of the first heat exchanger 103 through a liquid pipe 109; the first end 1041 of the second heat exchanger 110 is connected to a second air pipe 111 provided with a high-pressure valve 113, a second high- and low-pressure pipe 112 provided with a low-pressure valve 114 is connected in parallel with the second air pipe 111, the second high- and low-pressure pipe 112 is connected to the first air pipe 105, and the first high- and low-pressure pipe 106 is connected to the second air pipe 111 to form a refrigerant circuit; the first solenoid valve 107, the second solenoid valve 108, the high-pressure valve 113, and the low-pressure valve 114 are electrically connected to the controller 500, respectively.

[0033] It can be understood that in the temperature control module, the liquid pipe 109, the first high and low pressure pipe 106, the second high and low pressure pipe 112, the first air pipe 105 and the second air pipe 111 constitute a refrigerant circuit, and the refrigerant circuit includes multiple parallel second heat exchangers 110, so that after the refrigerant is discharged by the compressor 101, it enters the second temperature control unit side through the refrigerant circuit, and after passing through the second heat exchanger 110, it returns to the compressor 101 through the refrigerant circuit, realizing the refrigerant circulation, ensuring that the multiple second temperature control units can perform corresponding cooling or heating operations.

[0034] Specifically, in the embodiment, the four-way valve 104 also includes a fourth end 1044, and a capillary is connected between the third end 1043 and the fourth end 1044 of the four-way valve 104. When the fourth end 1044 is not involved in the work, there will be a liquid seal, and the capillary plays a role of buffering and drainage, and guides the residual liquid to the low-pressure side to ensure the safe operation of the first temperature control unit. It can be understood that the four-way valve 104 has a D port, a C port, an S port and an E port. In the present invention, the first end 1041, the second end 1042, the third end 1043 and the fourth end 1044 are used to represent the D port, the C port, the S port and the E port respectively.

[0035] Specifically, the compressor 101 is used to provide power for the circulation of the refrigerant in the temperature control module 100. Driven by the compressor 101, the refrigerant can circulate between the first heat exchanger 103 and the second heat exchanger 110 and other components.

[0036] Specifically, the first heat exchanger 103 and the first heat exchanger 103 can perform phase change heat exchange treatment or condensation heat exchange treatment to change the physical state (liquid or gaseous) of the inflowing refrigerant, thereby realizing switching for heating treatment or cooling treatment.

[0037] It is understandable that the controller 500 can control the opening and closing states of the first solenoid valve 107, the second solenoid valve 108, the high pressure valve 113 and the low pressure valve 114 electrically connected to the controller 500 to make the state of the refrigerant flowing into the second temperature control unit meet the heat exchange requirements when the chamber temperature needs to be adjusted. The controller 500 controls the different opening and closing states of the first solenoid valve 107, the second solenoid valve 108, the high pressure valve 113 and the low pressure valve 114, which will change the flow state of some pipelines in the refrigerant circuit, and then make the refrigerant enter the second temperature control unit side through different pipelines in different states after being discharged by the compressor 101, so as to meet the heat exchange requirements of the second temperature control unit. The second temperature control unit can achieve heating or cooling under the control of the controller 500.

[0038] When the aging test system 1000 provided in the embodiment of the present application is used to perform batch aging tests on batches of chips to be tested, through the controller 500, first, when at least one of the temperature compensation values ​​determined according to the target test temperature required for each test box 300 is not 0, the temperature control module 100 and the heating module 400 are controlled to perform combined heating to increase the chamber temperature of all test boxes 300 to the target test temperature, and complete a high-temperature aging test on the batch of chips to be tested; then, the temperature control module 100 is controlled to perform cooling treatment and the heating module 400 is turned off to cool the chamber temperature to the initial temperature; the combined heating, high-temperature aging test, and cooling are repeated until the number of high-temperature aging tests is equal to the number threshold, and the test is terminated. By setting the chip to be tested and the measurement and control module 203 on a test board in different planes, the chip to be tested is placed in the test environment provided by the chamber of the test box 300, and the chamber temperature adjustment function of the temperature adjustment module 100 is used to place the chip to be tested in a test environment of high temperature and initial temperature cycle switching, so as to facilitate the temperature cycle aging test; at the same time, the measurement and control module 203 is placed in a room temperature environment to ensure that the performance of the measurement and control module 203 and its surrounding circuits are normal during the temperature cycle aging test, which is conducive to extending the service life of the aging test board 200 and improving the reliability of the temperature cycle aging test. That is to say, the embodiment of the present application can effectively extend the service life of the aging test board 200 and improve the reliability of the temperature cycle aging test.

[0039] Those skilled in the art will appreciate that the system structure shown in the figure does not constitute a limitation on the embodiments of the present application, and may include more or fewer components than shown in the figure, or a combination of certain components, or a different arrangement of components.

[0040] Those skilled in the art will appreciate that the system architecture and application scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of the system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0041] Based on the above system structure, various embodiments of the batch aging test method of the present application are proposed below.

[0042] Second, as Fig. 9 As shown, the embodiment of the present application provides a batch aging test method for an aging test system, which is applied to a controller of an aging test system as in any one of the embodiments of the first aspect; the aging test system also includes: at least two test boxes, each of which is provided with a heating module; multiple aging test boards, each of which includes a measurement and control module and two chips to be tested; and a temperature adjustment module. The batch aging test method may include but is not limited to steps S110 to S150.

[0043] Step S110: determining the temperature compensation value required for each test box according to the target test temperature required for each test box.

[0044] Step S120: When there is at least one temperature compensation value that is not 0, determine the combined working mode instruction according to the temperature compensation value; according to the combined working mode instruction, control the temperature adjustment module and each heating module to perform combined heating treatment to increase the chamber temperature of the test box from the initial temperature to the target test temperature.

[0045] Step S130: At the target test temperature, start the measurement and control module to perform a high temperature aging test on the batch of chips to be tested.

[0046] Step S140: After completing one high temperature aging test, the temperature adjustment module is controlled to perform cooling processing and the heating module is turned off, so as to reduce the chamber temperature of all the test boxes from the target test temperature to the initial temperature.

[0047] Step S150: Repeat the combined heating treatment, high temperature aging test, and cooling treatment until the number of high temperature aging tests is equal to the number threshold, and then the batch aging test is terminated.

[0048] Specifically, the initial temperature is the current indoor temperature, or a low temperature set to meet the requirements of extreme environment testing; therefore, this application does not impose any specific restrictions on the value of the initial temperature.

[0049] Specifically, the number threshold can be configured according to the aging test requirements, so this application does not impose any specific restrictions on the value of the number threshold.

[0050] Specifically, the chip to be tested is a DDR chip.

[0051] Through steps S110 to S150, when a batch of chips to be tested are subjected to a batch aging test using the aging test system provided by the embodiment of the present application, the controller first determines the temperature compensation value required for each test box according to the target test temperature required for each test box; then, when there is at least one temperature compensation value that is not 0, determines a combined working mode instruction according to the temperature compensation value; according to the combined working mode instruction, controls the temperature control module and each heating module to perform a combined heating treatment to increase the chamber temperature of the test box from the initial temperature to the target test temperature; then, at the target test temperature, starts the measurement and control module to perform a high-temperature aging test on the batch of chips to be tested; then, after completing a high-temperature aging test, controls the temperature control module to perform a cooling treatment and turns off the heating module to reduce the chamber temperature of all test boxes from the target test temperature to the initial temperature; finally, repeats the combined heating treatment, the high-temperature aging test, and the cooling treatment until the number of high-temperature aging tests is equal to the number threshold, and the batch aging test is terminated. By setting the chip to be tested and the measurement and control module on a test board in different planes, the chip to be tested is placed in the test environment provided by the chamber of the test box, and the chamber temperature adjustment function of the temperature adjustment module is used to place the chip to be tested in a high-temperature, initial temperature cycle switching test environment, so as to facilitate the temperature cycle aging test; at the same time, the measurement and control module is placed in a room temperature environment to ensure that the performance of the measurement and control module and its surrounding circuits are normal during the temperature cycle aging test, which is conducive to extending the service life of the aging test board and improving the reliability of the temperature cycle aging test. Therefore, the embodiment of the present application can effectively extend the service life of the aging test board and improve the reliability of the temperature cycle aging test.

[0052] According to some embodiments of the present application, step S110 is further described. Step S110: determining the temperature compensation value required for each test box according to the target test temperature required for each test box, including but not limited to steps S111 to S113.

[0053] Step S111: sequentially acquiring the target test temperature required for each test box to obtain at least two target test temperatures; wherein the target test temperature is determined by the type of the chip to be tested on the test box, and the type of the chips to be tested mounted on the same test box is the same.

[0054] Step S112: Determine the target test temperature with the minimum value as the reference temperature from among at least two target test temperatures.

[0055] Step S113: Subtract the reference temperature from each target test temperature to obtain a temperature compensation value.

[0056] To further explain step S111, specifically, multiple aging test boards can be placed on each test box, and each aging test board is loaded with two chips to be tested, and the types of chips to be tested on each test box are consistent. That is, the target test temperature required for the chips to be tested on a test box is the same. However, the types of chips to be tested loaded on different test boxes are different. Therefore, the target test temperature required for each test box may be the same or different. The target test temperature required for different chips to be tested can be pre-configured by the tester through a host computer electrically connected to the controller to determine the target test temperature required for different chips to be tested; then the configured target test temperature is sent to the controller through the host computer, so that the controller can automatically obtain the target test temperature required for each test box in turn when the test is started. In the case where at least two test boxes are set, at least two target test temperatures can be obtained.

[0057] Step S112 is further described. Specifically, the obtained target test temperatures are compared and screened, and the minimum target test temperature is determined as the reference temperature, so that the temperature adjustment module can be preliminarily controlled based on the reference temperature to perform preliminary work, and the chamber temperature of the test box can be quickly adjusted to the reference temperature, thereby improving the temperature adjustment efficiency.

[0058] Further explanation of step S113, specifically, the difference between each target test temperature and the reference temperature is the temperature compensation value required for each test box, wherein, when the target test temperature is the same as the reference temperature, the temperature compensation value is 0, indicating that no temperature compensation processing is required for the test box; when the target test temperature is the same as the reference temperature, the temperature compensation value is not 0, indicating that temperature compensation processing is required for the test box.

[0059] Through steps S111 to S113 , the temperature compensation value required by the test box can be determined, providing a reliable reference for the subsequent selection of a heating treatment method.

[0060] In one embodiment, when all temperature compensation values ​​are 0 and it is determined that all test boxes do not need temperature compensation, a single-mode heating instruction is generated according to the target test temperature, and the temperature control module is controlled to perform heating work based on the single-mode heating instruction to increase the chamber temperature to a reference temperature value (i.e., the target test temperature). When one temperature compensation value is not 0, a combined working mode instruction needs to be determined according to the temperature compensation value to perform combined heating processing. The specific description is as follows.

[0061] According to some embodiments of the present application, step S120 is further described, wherein, when there is at least one temperature compensation value that is not 0, a combined operating mode instruction is determined according to the temperature compensation value, including but not limited to steps S210 to S240.

[0062] Step S210: generating a coarse adjustment control instruction according to the reference temperature; Step S220: traverse the obtained temperature compensation values ​​in sequence, when the temperature compensation value is 0, determine that the code value of the corresponding bit is 0; when the temperature compensation value is not 0, determine that the code value of the corresponding bit is 1; after traversing all the temperature compensation values, splice the code values ​​in sequence to obtain the temperature compensation control instruction.

[0063] Step S230: generating an auxiliary heating instruction according to the temperature compensation value that is not zero.

[0064] Step S240: Generate a combined working mode instruction according to the coarse adjustment control instruction, the temperature compensation control instruction and the auxiliary heating instruction.

[0065] Specifically, in step S210, the coarse control instruction is used to: start the temperature control module, and control the first temperature control unit and the second temperature control unit of the temperature control module to work together, so that the second temperature control unit performs heating processing to increase the chamber temperature to the reference temperature.

[0066] Specifically, in step S220, a binary temperature compensation control instruction is generated by the temperature compensation value, and the temperature compensation control instruction is used to control the heating module to start or shut down. The code value 0 in the temperature compensation control instruction is used to determine that the corresponding test box is not a temperature compensation object, thereby instructing the corresponding heating module to shut down, and the code value 1 in the temperature compensation control instruction is used to determine that the corresponding test box is a temperature compensation object, thereby instructing the corresponding heating module to start, in preparation for the subsequent auxiliary heating process.

[0067] Specifically, in step S230, the auxiliary heating instruction includes a temperature compensation value, and the auxiliary heating instruction is used to control the heating module to work based on constant power, generate a certain amount of heat, increase the chamber temperature from the current reference temperature to the target test temperature, and maintain it at the target test temperature.

[0068] Through step S210 to step S240, a combined working mode instruction is generated, which provides a reliable reference for the subsequent control of the temperature adjustment module and the heating module to perform combined heating processing.

[0069] An example is given to illustrate the specific process of generating the combined working mode instruction from step S111 to step S113 and step S210 to step S240.

[0070] Example 1: Assume there are 5 test boxes.

[0071] First, the target test temperature required for the first test box is 40 degrees Celsius, the target test temperature required for the first test box is 45 degrees Celsius, the target test temperature required for the first test box is 46 degrees Celsius, the target test temperature required for the first test box is 50 degrees Celsius, and the target test temperature required for the first test box is 40 degrees Celsius.

[0072] Secondly, determine the minimum target test temperature: 40 degrees Celsius, which is the reference temperature.

[0073] Next, the temperature compensation value required for each test box is obtained by subtracting the reference temperature from each target test temperature. Specifically, the temperature compensation value required for the first test box is 0 degrees Celsius, the temperature compensation value required for the second test box is 5 degrees Celsius, the temperature compensation value required for the third test box is 6 degrees Celsius, the temperature compensation value required for the fourth test box is 10 degrees Celsius, and the temperature compensation value required for the fifth test box is 0.

[0074] Then, if it is confirmed that four temperature compensation values ​​are not 0, a coarse control instruction (including 40 degrees Celsius) is generated according to the reference temperature (40 degrees Celsius).

[0075] Then, the obtained temperature compensation values ​​are traversed in sequence, the code values ​​corresponding to the respective temperature compensation values ​​are determined, and the code values ​​are concatenated in sequence to obtain the temperature compensation control instruction: 01110.

[0076] Then, an auxiliary heating instruction (including: 5 degrees Celsius, 6 degrees Celsius, 10 degrees Celsius) is generated according to the temperature compensation value that is not 0.

[0077] Finally, a combined working mode instruction is generated based on the coarse adjustment control instruction (including 40 degrees Celsius), the temperature compensation control instruction: 01110, and the auxiliary heating instruction (including: 5 degrees Celsius, 6 degrees Celsius, 10 degrees Celsius).

[0078] According to some embodiments of the present application, step S120 is further described, wherein, according to the combined working mode instruction, the temperature control module and each heating module are controlled to perform a combined heating process to increase the chamber temperature of the test box from the initial temperature to the target test temperature, including but not limited to steps S310 to S340.

[0079] Step S310: Determine a coarse adjustment control instruction, a temperature compensation control instruction, and an auxiliary heating instruction from the combined working mode instruction.

[0080] Step S320: In response to the coarse control instruction, the temperature adjustment module is controlled to perform a heating process to increase the chamber temperature of all the test boxes from the initial temperature to the reference temperature.

[0081] Step S330: When the temperature sensor detects that the chamber environment temperature is stable at the reference temperature, in response to the temperature compensation control instruction, a temperature compensation object is determined from a plurality of test boxes.

[0082] Step S340: in response to the auxiliary heating instruction, controlling the heating modules of the temperature compensation objects to perform auxiliary heating processing, raising the chamber temperature in each auxiliary heating object by the temperature compensation value to reach the respective required target test temperature.

[0083] Through step S320 , the chamber temperatures of all the test boxes are synchronously and rapidly raised from the initial temperature to the reference temperature, thereby improving the temperature regulation efficiency of the chamber temperature and facilitating subsequent fine temperature compensation.

[0084] Through step S330 and step S340, a more detailed temperature compensation process is performed on the auxiliary heating object to ensure the accuracy of temperature regulation; and different target test temperatures are adaptively provided for different types of chips to be tested.

[0085] Through step S310 to step S340, through combined heating treatment, the temperature adjustment module is controlled to perform coarse adjustment, and the heating module is controlled to perform fine adjustment, so that the chamber temperature in each test box reaches the target test temperature required by each test box.

[0086] Take an example and combine it with Example 1 to illustrate the specific process of the combined heating treatment provided in the embodiment of the present application.

[0087] Example 2: Based on Example 1, first, determine from the combined working mode instructions: coarse adjustment control instructions (including 40 degrees Celsius), temperature compensation control instructions: 01110, auxiliary heating instructions (including: 5 degrees Celsius, 6 degrees Celsius, 10 degrees Celsius).

[0088] Next, the temperature control module is controlled to perform heating processing according to the coarse control instruction, and the chamber temperature of all the test boxes is increased from the initial temperature to the reference temperature of 40 degrees Celsius.

[0089] Then, when the temperature sensor detects that the chamber ambient temperature is stable at the reference temperature, further, according to the temperature compensation control instruction: 01110, the second test box, the third test box, and the fourth test box are determined as temperature compensation objects, the heating modules in each temperature compensation object are started, and the heating modules in the remaining test boxes are turned off.

[0090] Finally, according to the auxiliary heating instructions (including: 5 degrees Celsius, 6 degrees Celsius, 10 degrees Celsius), the heating module is controlled accordingly to perform auxiliary heating, and the chamber temperature in each auxiliary heating object is increased by the temperature compensation value (5 degrees Celsius, 6 degrees Celsius, 10 degrees Celsius respectively) to achieve the required target test temperature.

[0091] According to some embodiments of the present application, the first temperature regulating unit and the second temperature regulating unit form a refrigerant circuit, the first temperature regulating unit includes: a first solenoid valve and a second solenoid valve electrically connected to the controller; the second temperature regulating unit includes: a high-pressure valve and a low-pressure valve electrically connected to the controller; further illustrating step S320, wherein the temperature regulating module is controlled to perform heating processing, including: controlling the first solenoid valve of the first temperature regulating unit to open, controlling the second solenoid valve to close; controlling the high-pressure valves of all the second temperature regulating units to open, controlling the low-pressure valves to close, so that the second heat exchanger of the second temperature regulating unit performs heating. Thus, the second heat exchanger is controlled to perform heating at the same time to increase the chamber temperature to the reference temperature value.

[0092] Specifically, combined Figure 8 To further explain the heating principle of the temperature control module, when the second temperature control unit needs to be heated, the first solenoid valve 107 and the high-pressure valve 113 are controlled to be opened, and the second solenoid valve 108 and the low-pressure valve 114 are controlled to be closed. At this time, the second branch is blocked, the first branch is connected in series with the first high- and low-pressure pipe 106, the second high- and low-pressure pipe 112 on the second temperature control unit side is blocked, and the second air pipe 111 is connected. At this time, after the high-temperature and high-pressure gaseous refrigerant is discharged from the exhaust port 1011 of the compressor 101, it does not pass through the four-way valve 104 but passes through the first branch, the first solenoid valve 107 and the first high- and low-pressure pipe 106 and the second air pipe 111 in sequence, and then flows to the second temperature control unit side and enters the second heat exchanger 110 on the second temperature control unit side; the high-temperature and high-pressure gaseous refrigerant undergoes phase change heat treatment (releasing heat, heating the air, and obtaining hot gas) of the second heat exchanger 110, and is converted into liquid refrigerant, and then the liquid refrigerant passes in sequence. The liquid refrigerant enters the first heat exchanger 103 through the liquid pipe, and is converted into a low-temperature and low-pressure gaseous refrigerant through the phase change heat treatment of the first heat exchanger 103. The low-temperature and low-pressure gaseous refrigerant enters the four-way valve 104 through the second end 1042 of the four-way valve 104, and then flows out from the third end 1043 and returns to the gas-liquid separator 102. Finally, the gaseous refrigerant passes through the output port of the gas-liquid separator 102, the connecting pipe between the gas-liquid separator 102 and the compressor 101, and the air intake port 1012 in sequence and returns to the compressor 101 to complete the cycle.

[0093] According to some embodiments of the present application, step S140 is further described, wherein controlling the temperature adjustment module to perform cooling processing includes: controlling the first solenoid valve of the first temperature adjustment unit to close and the second solenoid valve to open; controlling the high-pressure valve and the low-pressure valve of all the second temperature adjustment units to open, so that the second heat exchanger of the second temperature adjustment unit performs cooling. In this way, the second heat exchanger is controlled to perform cooling at the same time to reduce the chamber temperature of each test box from the current target test temperature to the initial temperature.

[0094] Specifically, when all the second temperature control units need to be refrigerated, the second solenoid valve 108, the high-pressure valve 113 and the low-pressure valve 114 are controlled to open, and the first solenoid valve 107 is controlled to close. At this time, the first branch is blocked, and the second branch is connected in series with the first high- and low-pressure pipe 106, and the second high- and low-pressure pipes 112 on the second temperature control unit side are connected, and the second air pipe 111 is connected. At this time, after the high-temperature and high-pressure gaseous refrigerant is discharged from the exhaust port 1011 of the compressor 101, it is input from the first end 1041 of the four-way valve 104 and then discharged from the second end 1042 of the four-way valve 104, and then the high-temperature and high-pressure gaseous refrigerant enters the first heat exchanger 103, and forms a liquid refrigerant after the condensation heat exchange treatment of the first heat exchanger 103. The liquid refrigerant enters the second heat exchanger 110 through the liquid pipe in turn, and after the phase change heat treatment (absorbing heat, lowering the air temperature, and obtaining cold air) of the second heat exchanger 110, the liquid refrigerant is converted into a low-temperature and low-pressure gaseous refrigerant; after the low-temperature and low-pressure gaseous refrigerant is output from the second heat exchanger 110, a part of it passes through the second air pipe 11 connected to the second heat exchanger 110 in turn. 1. The first high- and low-pressure pipe 106, the second solenoid valve 108 and the second branch enter the gas-liquid separator 102 of the first temperature control unit, and the other part of the low-temperature and low-pressure gaseous refrigerant flows to the first gas pipe 105 through the second gas pipe 111 and the second high- and low-pressure pipe 112. At this time, the third end 1043 of the four-way valve 104 is connected to the first gas pipe 105. The four-way valve 104 itself has a certain pressure difference. Under the action of the pressure difference, the low-temperature and low-pressure gaseous refrigerant in the first gas pipe 105 can enter the gas-liquid separator 102. Finally, the gaseous refrigerant passes through the output port of the gas-liquid separator 102, the connecting pipe between the gas-liquid separator 102 and the compressor 101, and the air intake port 1012 in turn and returns to the compressor 101 to complete the cycle.

[0095] The above is a specific description of the preferred implementation of the present application, but the present application is not limited to the above-mentioned implementation mode. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the present application. These equivalent deformations or substitutions are all included in the scope defined by the present application.

Claims

1. An aging test system, characterized in that: include: At least two test boxes, each of which has a plurality of grooves on its top outer surface and is coated with a heat insulation layer, and has two through holes in the grooves; The test box is provided with a heating module; A plurality of aging test boards, each of which comprises: a first board surface and a second board surface, the first board surface being provided with a measurement and control module, the second board surface being provided with two parallel interface modules electrically connected to the measurement and control module through pins, each of the interface modules being connected to a test socket for inserting a chip to be tested; the interface module being embedded in the test slot and abutting against the heat insulation layer, the test socket being placed in the chamber of the test box through the through hole; A temperature adjustment module, comprising at least one output end, each of which is connected to the two test boxes via a delivery pipeline; A controller, electrically connected to the heating module, the measurement and control module, and the temperature adjustment module; The controller is used for: when at least one of the temperature compensation values ​​determined according to the target test temperature required for each test box is not 0, controlling the temperature adjustment module and the heating module to perform combined heating to raise the chamber temperature of all the test boxes to the target test temperature, and completing a high-temperature aging test on a batch of chips to be tested; controlling the temperature adjustment module to perform cooling processing and turning off the heating module to cool the chamber temperature to the initial temperature; repeating the combined heating, high-temperature aging test, and cooling until the number of high-temperature aging tests is equal to the number threshold, and then terminating the test.

2. The aging test system according to claim 1, characterized in that: The temperature adjustment module also includes: A first temperature regulating unit and at least one second temperature regulating unit; an output end of each of the second temperature regulating units is connected to the two test boxes via a delivery pipeline; Wherein, the first temperature control unit comprises: a compressor, a four-way valve, a first heat exchanger, and a gas-liquid separator; the compressor comprises an exhaust port and an air intake port, the exhaust port is connected to the first end of the four-way valve, the exhaust port is connected to the first high-low pressure pipe by setting a first branch of a first solenoid valve, and the first end of the first heat exchanger is connected to the second end of the four-way valve; the first end of the gas-liquid separator is connected to the air intake port, and the second end of the gas-liquid separator is connected to the first air pipe connected to the third end of the four-way valve; the second end of the gas-liquid separator is connected to the first high-low pressure pipe by setting a second branch of a second solenoid valve; Each of the second temperature adjustment units includes: a second heat exchanger, wherein the second end of the second heat exchanger is connected to the second end of the first heat exchanger through a liquid pipe; the first end of the second heat exchanger is connected to a second gas pipe provided with a high-pressure valve, a second high-low-pressure pipe provided with a low-pressure valve is connected in parallel with the second gas pipe, the second high-low-pressure pipe is connected to the first gas pipe, and the first high-low-pressure pipe is connected to the second gas pipe to form a refrigerant circuit; The first solenoid valve, the second solenoid valve, the high-pressure valve, and the low-pressure valve are electrically connected to the controller, respectively.

3. The aging test system according to any one of claims 1 to 2, characterized in that: The two interface modules are arranged on the left and right sides of the measurement and control module along the long side direction of the second board surface, and the two interface modules and the measurement and control module are located on the same symmetry axis.

4. The aging test system according to any one of claims 1 to 2, characterized in that: The two interface modules are arranged in parallel in sequence on the same side of the measurement and control module along the long side direction of the second plate surface, and the two interface modules and the measurement and control module are not located on the same symmetry axis.

5. A batch aging test method for an aging test system, characterized in that: A controller applied to the aging test system according to any one of claims 1 to 4; the system further comprises: at least two test boxes, each of which is provided with a heating module; a plurality of aging test boards, each of which comprises a measurement and control module and two chips to be tested; a temperature control module; The method comprises: Determining the temperature compensation value required for each test box according to the target test temperature required for each test box; When there is at least one temperature compensation value that is not 0, a combined working mode instruction is determined according to the temperature compensation value; according to the combined working mode instruction, the temperature adjustment module and each of the heating modules are controlled to perform a combined heating process to increase the chamber temperature of the test box from an initial temperature to the target test temperature; At the target test temperature, starting the measurement and control module to perform a high temperature aging test on the batch of chips to be tested; After completing a high-temperature aging test, the temperature adjustment module is controlled to perform cooling processing and the heating module is turned off, so that the chamber temperature of all the test boxes is reduced from the target test temperature to the initial temperature; The combined heating treatment, high temperature aging test, and refrigeration treatment are repeated until the number of high temperature aging tests is equal to a number threshold, and the batch aging test is terminated.

6. The batch aging test method of the aging test system according to claim 5, characterized in that: Determining the temperature compensation value required for each test box according to the target test temperature required for each test box includes: Sequentially acquiring the target test temperature required by each of the test boxes to obtain at least two target test temperatures; wherein the target test temperature is determined by the type of the chip to be tested on the test box, and the type of the chips to be tested mounted on the same test box is the same; Determine the target test temperature with the minimum value as the reference temperature from among the at least two target test temperatures; The temperature compensation value is obtained by subtracting the reference temperature from each target test temperature.

7. The batch aging test method of the aging test system according to claim 6, characterized in that: The step of determining a combined working mode instruction according to the temperature compensation value comprises: generating a coarse control instruction according to the reference temperature; The temperature compensation values ​​obtained are traversed in sequence, and when the temperature compensation value is 0, the code value of the corresponding bit is determined to be 0; when the temperature compensation value is not 0, the code value of the corresponding bit is determined to be 1; after traversing all the temperature compensation values, the code values ​​are sequentially spliced ​​to obtain a temperature compensation control instruction; generating an auxiliary heating instruction according to the temperature compensation value that is not zero; The combined working mode instruction is generated according to the coarse adjustment control instruction, the temperature compensation control instruction and the auxiliary heating instruction.

8. The batch aging test method of the aging test system according to claim 7, characterized in that: According to the combined working mode instruction, controlling the temperature adjustment module and each of the heating modules to perform combined heating processing to increase the chamber temperature of the test box from the initial temperature to the target test temperature includes: Determine the coarse adjustment control instruction, the temperature compensation control instruction, and the auxiliary heating instruction from the combined working mode instruction; In response to the coarse control instruction, controlling the temperature adjustment module to perform a heating process to increase the chamber temperature of all the test boxes from an initial temperature to the reference temperature; When the temperature sensor detects that the chamber environment temperature is stable at the reference temperature, in response to the temperature compensation control instruction, a temperature compensation object is determined from the plurality of test boxes; In response to the auxiliary heating instruction, the heating module of the temperature compensation object is controlled to perform auxiliary heating processing, and the chamber temperature in each auxiliary heating object is increased by the temperature compensation value to reach the target test temperature required by each.

9. The batch aging test method of the aging test system according to claim 8, characterized in that: The temperature adjustment module includes: a first temperature adjustment unit and at least one second temperature adjustment unit, the first temperature adjustment unit and the second temperature adjustment unit form a refrigerant circuit, the first temperature adjustment unit includes: a first solenoid valve and a second solenoid valve electrically connected to the controller; the second temperature adjustment unit includes: a high-pressure valve and a low-pressure valve electrically connected to the controller; The controlling the temperature adjustment module to perform heating processing includes: Controlling the first solenoid valve of the first temperature adjustment unit to open and controlling the second solenoid valve to close; The high-pressure valves of all the second temperature regulating units are controlled to open, and the low-pressure valves are controlled to close, so that the second heat exchangers of the second temperature regulating units perform heating.

10. The batch aging test method of the aging test system according to claim 9, characterized in that: The controlling the temperature adjustment module to perform refrigeration processing includes: Controlling the first solenoid valve of the first temperature adjustment unit to close and the second solenoid valve to open; The high-pressure valve and the low-pressure valve of all the second temperature adjustment units are controlled to open, so that the second heat exchanger of the second temperature adjustment unit performs cooling.

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