Backlight module and display device

Abstract

The embodiment of the invention provides a backlight module and a display device. The backlight module comprises a light-emitting substrate which comprises a light-emitting area and a binding area located on one side of the light-emitting area; the electrostatic protection layer is located on the non-light-emitting side of the light-emitting substrate; the at least one flexible circuit board is bound in the binding area, the flexible circuit board comprises a fan-out area, and the fan-out area is located between the light-emitting substrate and the electrostatic protection layer; the at least one telescopic protruding structure is located on the side, facing the electrostatic protection layer, of the fan-out area, one end of the protruding structure is electrically connected with the grounding end of the flexible circuit board, and the other end of the protruding structure protrudes towards the electrostatic protection layer and is electrically connected with the electrostatic protection layer.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a backlight module and a display device. Background Art

[0002] As people's requirements for the display effects of display products increase, mini light-emitting diode (MLED) backlight technology has come into being. MLED backlight technology is composed of tens of thousands of ultra-small LEDs, which can make the dimming partitions more detailed and have higher contrast.

[0003] In the display device formed by using the MLED backlight technology, a backlight module and a driving circuit are included, wherein the backlight module includes a glass light board formed based on the Mini LED backlight technology, and a metal structure layer located on the non-light-emitting side of the glass light board, that is, the metal structure layer is located between the backlight module and the driving circuit. However, during the testing stage of product preparation, the display product formed did not match the corresponding driving circuit and only included the backlight module. At this time, the glass light board includes circuit structures such as a flexible circuit board, but the metal structure layer is bonded to the glass substrate in the glass light board, and there is no electrical connection between the two. Therefore, the metal structure layer cannot avoid damage to the backlight module caused by static electricity or surge current. Summary of the invention

[0004] Embodiments of the present disclosure provide a backlight module and a display device.

[0005] In a first aspect, an embodiment of the present disclosure provides a backlight module, comprising:

[0006] A light-emitting substrate, comprising a light-emitting area and a binding area located on one side of the light-emitting area;

[0007] An electrostatic protection layer, located on the non-light-emitting side of the light-emitting substrate;

[0008] At least one flexible circuit board, the flexible circuit board is bound to the binding area, and the flexible circuit board includes a fan-out area, and the fan-out area is located between the light-emitting substrate and the electrostatic protection layer;

[0009] At least one retractable protrusion structure is located on a side of the fan-out area facing the electrostatic protection layer,

[0010] One end of the protruding structure is electrically connected to the ground end of the flexible circuit board, and the other end of the protruding structure protrudes toward the electrostatic protection layer and is electrically connected to the electrostatic protection layer.

[0011] In some embodiments, the protrusion structure includes a fixing portion, a telescopic portion and a cap portion.

[0012] The fixing portion is fixed on the fan-out area, and the fixing portion is formed with a receiving space, and the receiving space has an opening facing one side of the electrostatic protection layer;

[0013] At least parts of the telescopic portion and the cap portion are located in the accommodating space, and the telescopic portion is configured to adjust the height of the cap portion protruding from the opening so that the cap portion contacts the electrostatic protection layer.

[0014] In some embodiments, the fixing portion includes a bottom wall fixed on the fan-out region and a side wall surrounding the bottom wall, and the bottom wall and the side wall define the accommodation space;

[0015] The telescopic portion includes an elastic component, one end of the elastic component is connected to the bottom wall, and the other end of the elastic component is connected to the bottom of the cap portion.

[0016] In some embodiments, the cap portion includes a first sub-portion and a second sub-portion which are connected as one and arranged in sequence along the axial direction of the cap portion, wherein the first sub-portion is in contact with the electrostatic protection layer,

[0017] The surface of the first sub-portion in contact with the electrostatic protection layer is a first surface, and the orthographic projection of the first surface on the fan-out area is located within the area of ​​the orthographic projection of the second sub-portion on the fan-out area.

[0018] In some embodiments, the first surface is a plane or a curved surface.

[0019] In some embodiments, the side wall has a first end away from the bottom wall.

[0020] The fixing portion further comprises at least one limiting protrusion, and the limiting protrusion is located on the inner surface of the side wall close to the first end;

[0021] At least one limiting groove is arranged on the side surface of the second sub-portion, the limiting groove corresponds to the limiting protrusion, and the limiting groove extends along the axial direction of the cap portion so that the limiting protrusion slides in the limiting groove.

[0022] In some embodiments, the second sub-section is further provided with a baffle, the baffle is located on a side of the limiting groove close to the bottom wall, and the limiting protrusion is located between the baffle and the bottom wall.

[0023] In some embodiments, the inner surface of the bottom wall facing the accommodating space is the second surface, and the bottom surface of the second sub-portion is the third surface.

[0024] The second surface and the third surface are both circular, and the diameter of the second surface is greater than the diameter of the third surface.

[0025] In some embodiments, there is a first distance between the light emitting substrate and the electrostatic protection layer, and the first distance is not less than the sum of the thickness of the fan-out region and the height of the protruding structure.

[0026] In some embodiments, the retractable height range of the retractable protruding structure is 0.03 mm to 0.05 mm.

[0027] In some embodiments, the thickness of the fan-out region is 0.25 mm to 0.26 mm, and the first spacing is 0.28 mm to 0.31 mm.

[0028] In some embodiments, the electrostatic protection layer further includes a hollow portion corresponding to the flexible circuit board.

[0029] The flexible circuit board further includes a first binding connection area and a second binding connection area, and the first binding connection area, the fan-out area and the second binding connection area are connected in sequence, wherein:

[0030] The first binding connection area is bound to the binding area, and the second binding connection area extends through the hollow portion to a side of the electrostatic protection layer away from the light-emitting substrate.

[0031] In some embodiments, each of the flexible circuit boards includes a plurality of the protruding structures, and the plurality of the protruding structures are arranged along a first direction, and the first direction intersects with a direction from the fan-out region to the second binding connection region.

[0032] In some embodiments, the backlight module further includes a connector, and the connector is connected to an end of the second binding connection area away from the fan-out area.

[0033] In some embodiments, the material of the electrostatic protection layer includes metal.

[0034] In a second aspect, an embodiment of the present disclosure provides a display device, comprising the backlight module provided in the first aspect.

[0035] In the backlight module provided in the embodiment of the present disclosure, at least one protruding structure is added, one end of the protruding structure is electrically connected to the ground terminal of the flexible circuit board, and the other end is always in contact with the electrostatic protection layer based on its own scalability, so that the electrostatic protection layer can be used to protect the light-emitting substrate from electrostatic electricity, and the surge current can be transmitted to the ground terminal, thereby avoiding damage to the light-emitting substrate due to static electricity or surge current, and improving the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0037] Figure 1 A schematic diagram of the structure of a backlight module provided in the related art;

[0038] Figure 2 A schematic diagram of an expanded backlight module provided in an embodiment of the present disclosure;

[0039] Figure 3 , Figure 4 A schematic diagram of stacking a backlight module provided in an embodiment of the present disclosure;

[0040] Figure 5a A schematic diagram of a planar structure of a flexible circuit board provided in an embodiment of the present disclosure;

[0041] Figure 5b A schematic diagram of a planar structure of another flexible circuit board provided in an embodiment of the present disclosure;

[0042] Figure 6a A schematic diagram of the structure of the protrusion structure provided in an embodiment of the present disclosure;

[0043] Figure 6b A schematic diagram of the structure of a fixing part provided in an embodiment of the present disclosure;

[0044] Figure 6c A schematic structural diagram of a cap portion provided in an embodiment of the present disclosure.

[0045] Description of reference numerals:

[0046] Light-emitting substrate E, electrostatic protection layer M, flexible circuit board FPC, raised structure Pin, connector C;

[0047] Light-emitting substrate E: light-emitting area AA, binding area BA;

[0048] Electrostatic protection layer M: hollow portion k;

[0049] Flexible circuit board FPC: fan-out area f1, first binding connection area f2, second binding connection area f3;

[0050] Raised structure Pin: fixed part p1, telescopic part p2, cap part p3;

[0051] Fixed portion p1: bottom wall 11, second surface a2, side wall 12, first end 120, accommodating space Sp, limiting protrusion t1;

[0052] Telescopic part p2: elastic member 20;

[0053] Cap portion p3: first sub-portion 31, first surface a1; second sub-portion 32, limiting groove t0, baffle t2, third surface a3;

[0054] The first direction is X, and the axial direction is Z. DETAILED DESCRIPTION

[0055] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0056] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0057] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, "including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0058] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0059] In the embodiments of the present disclosure, structure A is located on the "side far from the substrate" or "above" structure B, which only means that in the stacking relationship, the layer of structure A is formed after the layer of structure B, and does not mean that the projections of structure A and structure B overlap or that the distances between structure A and structure B and the substrate meet a specific relationship. In the embodiments of the present disclosure, structure A is located on the "side close to the substrate" or "below" structure B, which only means that in the stacking relationship, the layer of structure A is formed before the layer of structure B, and does not mean that the projections of structure A and structure B overlap or that the distances between structure A and structure B and the substrate meet a specific relationship.

[0060] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0061] As people's requirements for the display effects of display products increase, mini light-emitting diode (MLED) backlight technology has come into being. MLED backlight technology is composed of tens of thousands of ultra-small LEDs, which can make the dimming partitions more detailed and have higher contrast.

[0062] In a display device formed using MLED backlight technology, a backlight module and a driving circuit are included, wherein the backlight module includes a glass light board formed based on Mini LED backlight technology, and a metal structure layer located on the non-light-emitting side of the glass light board, that is, the metal structure layer is located between the backlight module and the driving circuit. Figure 1 A schematic diagram of the structure of a backlight module provided in the related art is shown in FIG. Figure 1 As shown, a plurality of openings are provided on the metal structure layer; a flexible printed circuit (FPC) is provided on the glass light board, one end of the FPC is bound to the binding area BA of the glass light board, and the other end passes through the opening on the metal structure layer and is connected to the printed circuit board (not shown in the figure).

[0063] At this time, the metal structure layer can be connected to the ground terminal in the driving circuit, and the conductivity of the metal structure layer can be used to apply an electrostatic discharge (ESD) protection channel for the circuit structure in the display device (including the driving structure and the flexible circuit board FPC in the glass light board), and the metal structure layer can also serve as a transmission channel for transmitting surge current to the ground terminal. The static electricity and / or surge current appearing around it can be effectively dredged through the metal structure layer.

[0064] It should be understood that during the testing phase of product preparation, the display product formed does not match the corresponding driving circuit and only includes the backlight module. Figure 1 In the test phase, the backlight module only includes the glass light board G and the metal structure layer m. At this time, the flexible circuit board FPC and other circuit structures are bound to the binding area BA of the glass light board G, but the metal structure layer m is bonded to the glass substrate in the glass light board G, and there is no electrical connection between the two. Therefore, the metal structure layer cannot avoid damage to the backlight module caused by static electricity or surge current.

[0065] In order to solve at least one of the above-mentioned technical problems, an embodiment of the present disclosure provides a backlight module, by adding a retractable protruding structure on the FPC to connect the metal structure layer to the ground terminal on the FPC. On the one hand, it can avoid damage to the backlight module caused by static electricity or surge current during the testing phase; on the other hand, after the display device is prepared, it can increase the contact area of ​​the electrostatic protection, effectively drain the static electricity or surge current around the metal structure layer to the ground terminal, and extend the service life of the display device.

[0066] Figure 2 A schematic diagram of an expanded backlight module provided in an embodiment of the present disclosure is shown in FIG. Figure 3 , Figure 4 FIG. 1 is a schematic diagram of stacking a backlight module provided in an embodiment of the present disclosure. Figure 2-Figure 4 As shown, the backlight module includes: a light-emitting substrate E, an electrostatic protection layer M, at least one flexible circuit board FPC, and at least one retractable protruding structure Pin located on the flexible circuit board FPC.

[0067] Among them, the light-emitting substrate E includes a light-emitting area AA and a binding area BA located on one side of the light-emitting area AA; the electrostatic protection layer M is located on the non-light-emitting side of the light-emitting substrate E; the flexible circuit board FPC is bound to the binding area BA, and the flexible circuit board FPC includes a fan-out area f1, and the fan-out area f1 is located between the light-emitting substrate E and the electrostatic protection layer M; at least one retractable protruding structure Pin is located on the side of the fan-out area f1 facing the electrostatic protection layer M, one end of the protruding structure Pin is electrically connected to the ground end of the flexible circuit board FPC, and the other end of the protruding structure Pin protrudes toward the electrostatic protection layer M and is electrically connected to the electrostatic protection layer M.

[0068] In the disclosed embodiment, at least one raised structure Pin is added, one end of which is electrically connected to the ground terminal of the flexible circuit board FPC. Based on the scalability of the raised structure Pin, it can be ensured that the other end of the raised structure Pin is always in contact with the electrostatic protection layer M, so that the electrostatic protection layer M can be used to protect the light-emitting substrate E from electrostatic discharge, and the surge current can be transmitted to the ground terminal, thereby avoiding damage to the light-emitting substrate E due to static electricity or surge current, thereby improving the service life of the product.

[0069] It should be understood that if Figure 4 As shown, when the light-emitting substrate E is a large-sized light-emitting substrate E, a plurality of flexible circuit boards FPC are connected to the binding area BA thereof, thereby providing a driving signal for the light-emitting device on the light-emitting substrate E. Specifically, the number of flexible circuit boards FPC can be flexibly set according to actual conditions, and this is not limited in the embodiments of the present disclosure. In addition, the material of the electrostatic protection layer M is a metal material with good conductivity, so that it can play a role in electrostatic protection and transmission of surge current.

[0070] Figure 5a A schematic diagram of a planar structure of a flexible circuit board provided in an embodiment of the present disclosure is shown in FIG. Figure 5b This is a schematic diagram of a planar structure of another flexible circuit board provided in an embodiment of the present disclosure. Figure 5a The schematic diagram shows the structure of the surface of the flexible circuit board FPC away from the light-emitting substrate E. Figure 5b A schematic structural diagram of a flexible circuit board FPC and a surface of a light-emitting substrate E close to a side of the light-emitting substrate E is shown.

[0071] like Figure 2 , Figure 5a and Figure 5b As shown, the flexible circuit board FPC also includes a first binding connection area f2 and a second binding connection area f3 respectively arranged on both sides of the fan-out area f1, that is, the first binding connection area f2, the fan-out area f1 and the second binding connection area f3 of the flexible circuit board FPC are connected in sequence. Among them, the fan-out area f1 is bound to the binding area BA of the light-emitting substrate E; the electrostatic protection layer M is provided with a hollow portion k corresponding to the flexible circuit board FPC, and the second binding connection area f3 extends through the hollow portion k to the side of the electrostatic protection layer M away from the light-emitting substrate E.

[0072] like Figure 5b As shown, at least one test point Test Point is reserved on the fan-out area f1 of the flexible circuit board FPC. The test point is a ground signal. The protruding structure Pin is arranged above the test point to electrically connect the protruding structure Pin to the ground.

[0073] Figure 6a A schematic diagram of the structure of the protrusion structure provided in the embodiment of the present disclosure, Figure 6bA schematic diagram of the structure of the fixing part provided in the embodiment of the present disclosure, Figure 6c Schematic diagram of the structure of the cap part provided by the embodiment of the present disclosure. Figure 6a-6c As shown, the protruding structure Pin includes a fixed portion p1, a telescopic portion p2 and a cap portion p3. The fixed portion p1 is fixed on the fan-out region f1, and the fixed portion p1 forms a receiving space Sp, and the receiving space Sp has an opening toward the side of the electrostatic protection layer M; at least part of the telescopic portion p2 and the cap portion p3 is located in the receiving space Sp, and the telescopic portion p2 is configured to adjust the height of the cap portion p3 protruding from the opening so that the cap portion p3 is in contact with the electrostatic protection layer M.

[0074] It should be understood that the electrostatic protection layer M and the glass substrate of the light-emitting substrate E are bonded by an adhesive layer. Specifically, the adhesive layer is coated on the light-emitting substrate E, and the electrostatic protection layer M is bonded to the uncured adhesive layer, so that the electrostatic protection layer M and the light-emitting substrate E are firmly connected after the adhesive layer is cured. The above-mentioned adhesive layer can be a reactive hot melt adhesive, and the colloid has a certain fluidity when it is not cured, so the first gap Gap between the electrostatic protection layer M and the light-emitting substrate E is not fixed.

[0075] In view of this, the raised structure Pin provided in the embodiment of the present disclosure can adjust the height of the cap part p3 protruding from the opening of the fixed part p1 through the telescopic part p2, so that the raised structure Pin has telescopicity to match the distance between the electrostatic protection layer M and the light-emitting substrate E, thereby ensuring that the cap part p3 can maintain contact with the electrostatic protection layer M at all times.

[0076] In some embodiments, the materials of the fixing portion p1 and the cap portion p3 can be the same, or they can be selected from one of the following materials. For example, steel, stainless steel, tungsten steel, etc., all of which have good wear resistance and hardness. Among them, steel is generally made of high-quality carbon steel or alloy steel, and carbon steel has good toughness and strength; and alloy steel can improve the hardness and corrosion resistance of steel due to the presence of other metal elements. The raised structure Pin made of steel is hard and has a long service life; stainless steel generally refers to non-woven stainless steel, which has good corrosion resistance and high temperature resistance. In addition, the raised structure Pin made of stainless steel has a smooth surface and will not scratch the surface of the contacting parts, which is beneficial to protecting the workpiece; tungsten steel is a high-hardness alloy steel with excellent cutting performance and wear resistance, so the raised structure Pin made has good durability.

[0077] In some embodiments, Figure 6a , Figure 6bAs shown, the fixed part p1 includes a bottom wall 11 fixed on the fan-out area f1 and a side wall 12 surrounding the bottom wall 11, and the bottom wall 11 and the side wall 12 define a accommodating space Sp; the telescopic part p2 includes an elastic component 20, one end of the elastic component 20 is connected to the bottom wall 11, and the other end of the elastic component 20 is connected to the bottom of the cap part p3.

[0078] The elastic component 20 may be a wave spring, which has a wide range of stiffness, strong buffering and vibration absorption capabilities, and large deformation energy per unit volume. Compared with ordinary springs, wave springs have the advantages of high strength, good flexibility, and strong impact resistance. In addition, the wave spring has a compact structure and requires a smaller installation space under the same physical parameter conditions.

[0079] In addition, one end of the elastic component 20 is connected to the bottom wall 11, and the two can be welded or adhesively connected, or no connecting component is required, and one end of the elastic component 20 is directly pressed against the bottom wall 11 based on the elastic force of the elastic component 20; similarly, the other end of the elastic component 20 is connected to the bottom of the cap portion p3, and the two can be welded or adhesively connected, or no connecting component is required; in the disclosed embodiment, there is no limitation on the method of connecting either end of the elastic component 20 with other structures.

[0080] In some embodiments, Figure 6a-6c As shown, the cap portion p3 includes a first sub-portion 31 and a second sub-portion 32 which are connected as a whole and arranged in sequence along the axial direction Z of the cap portion p3, wherein the first sub-portion 31 is in contact with the electrostatic protection layer M, and the surface of the first sub-portion 31 in contact with the electrostatic protection layer M is the first surface a1, and the orthographic projection of the first surface a1 on the fan-out area f1 is located within the area of ​​the orthographic projection of the second sub-portion 32 on the fan-out area f1.

[0081] Specifically, one end of the raised structure Pin is located on the test point Test Point reserved in the fan-out area f1, and the other end protrudes toward the side of the electrostatic protection layer M. The above-mentioned "axial direction Z of the cap portion p3" refers to the direction in which the fan-out area f1 of the flexible circuit board FPC located on the back side of the light-emitting substrate points to the electrostatic protection layer M after the backlight module is prepared, that is, the thickness direction of the electrostatic protection layer M or the light-emitting substrate E.

[0082] In one example, the second sub-portion 32 may be cylindrical, and the first sub-portion 31 may be truncated cone or semi-spherical. Figure 6cAs shown, when the first sub-portion 31 is in a truncated cone shape, the diameter d1 of the surface of the first sub-portion 31 in contact with the electrostatic protection portion, i.e., the first surface a1, is 1.15 mm ± 0.01 mm, and the bottom diameter d3 of the second sub-portion 32 is 1.35 ± 0.01 mm. Such a configuration can ensure that the first sub-portion 31 can contact the surface of the electrostatic protection layer M as long as it is stretched by the elastic component 20, and can reduce the contact area between the first sub-portion 31 and the electrostatic protection layer M under the premise of sufficient electrostatic discharge, thereby preventing the first sub-portion 31 from causing stress damage to the electrostatic protection layer M.

[0083] In some embodiments, the first surface a1 may be a plane or a curved surface; the connection surface between the first surface a1 and the second sub-portion 32 may also be a plane or a curved surface. For example, when the first sub-portion 31 is in the shape of a truncated cone, the first surface a1 is a plane, and the connection surface between the first surface a1 and the second sub-portion 32 is also a plane; when the first sub-portion 31 is in the shape of a semi-sphere, the first surface a1 is a curved surface, and the connection surface between the first surface a1 and the second sub-portion 32 is a curved surface smoothly connected to the first surface a1, and the embodiments of the present disclosure are not limited to this.

[0084] In some embodiments, Figure 6a-6c As shown, the side wall 12 has a first end 120 away from the bottom wall 11, and the fixing portion p1 also includes at least one limiting protrusion t1, which is located on the inner surface of the side wall 12 close to the first end 120; at least one limiting groove t0 is provided on the side surface of the second sub-portion 32, the limiting groove t0 corresponds to the limiting protrusion t1, and the limiting groove t0 extends along the axial direction Z of the cap portion p3 so that the limiting protrusion t1 slides in the limiting groove t0.

[0085] The elastic component 20 is extended and retracted to drive the cap part p3 to move along the axial direction Z. At the same time, through the cooperation between the limiting groove t0 and the limiting protrusion t1, the axial direction Z of the cap part p3 is limited to be perpendicular to the reference plane where the electrostatic protection layer M is located, so as to avoid the axial direction Z of the cap part p3 being tilted, which leads to the phenomenon that the contact area between the cap part p3 and the electrostatic protection layer M is too small, thereby ensuring the electrostatic protection effect of the electrostatic protection layer M and effectively releasing the surge current. The above-mentioned axial Z tilt means that the axial direction Z of the cap part p3 forms an acute angle with the above-mentioned reference plane at any angle.

[0086] It should also be explained that the sliding of the limiting protrusion t1 in the limiting groove t0 means that the limiting protrusion t1 is located on the inner surface of the side wall 12 of the fixing part p1, and its position remains unchanged. When the cover part p3 moves under the action of the telescopic part p2, the limiting groove moves with the movement of the cover part p3. In other words, the limiting protrusion t1 is stationary, and the limiting groove moves in the axial direction Z relative to the limiting protrusion t1.

[0087] In some embodiments, the second sub-portion 32 is further provided with a baffle t2 , which is located on a side of the limiting groove t0 close to the bottom wall 11 , and the limiting protrusion t1 is located between the baffle t2 and the bottom wall 11 .

[0088] Specifically, the baffle t2 is located on the side of the limiting groove t0 close to the bottom wall 11. When the cap part p3 extends out of the opening in the direction away from the bottom wall 11, the limiting groove t0 slides in the axial direction Z relative to the limiting protrusion t1 until the limiting protrusion t1 contacts the baffle t2, so that the bottom of the cap part p3 is always located in the accommodating space Sp, thereby avoiding excessive elastic force of the elastic component 20 on the cap part p3, which may push the cap part p3 out of the fixing part p1 and cause the cap part p3 to separate from the fixing part p1.

[0089] In some embodiments, Figure 6b , Figure 6c As shown, the inner surface of the bottom wall 11 facing the accommodating space Sp is the second surface a2, the bottom surface of the second sub-portion 32 is the third surface a3, the second surface a2 and the third surface a3 are both circular, and the diameter of the second surface a2 is greater than the diameter of the third surface a3.

[0090] It should be understood that the fixing portion p1 is sleeved below the cap portion p3, and the height of the cap portion p3 protruding from the fixing portion p1 is adjusted by the telescopic portion p2. Therefore, the inner surface diameter of the bottom wall 11 of the fixing portion p1 is slightly larger than the diameter of the bottom surface of the cap portion p3, thereby reserving sufficient matching space for the limiting groove t0 and the limiting protrusion t1, so that the cap portion p3 can adjust its height along its axial direction Z. In one example, the diameter d2 of the second surface a2 is 1.39±0.01mm, and the diameter d3 of the third surface a3 is 1.35±0.01mm.

[0091] In some embodiments, there is a first gap Gap between the light emitting substrate E and the electrostatic protection layer M, and the first gap Gap is not less than the sum of the thickness of the fan-out region f1 of the flexible circuit board FPC and the height H of the protruding structure Pin.

[0092] In some embodiments, the retractable range of the height H of the retractable protruding structure Pin is 0.03 mm to 0.05 mm; the thickness of the fan-out region f1 is 0.25 mm to 0.26 mm, and the first spacing is 0.28 mm to 0.31 mm.

[0093] Specifically, the height of the cap part p3 and the height of the fixing part p1 can be equal, and the cap part p3 can be moved within a range of 0.02 mm under the adjustment of the telescopic part p2. That is to say, under the adjustment of the telescopic part p2, the height H of the entire raised structure Pin can be adjusted within a range of 0.03 mm to 0.05 mm. In this way, the unevenness formed by the fluidity of the colloid between the light-emitting substrate E and the electrostatic protection layer M when it is not solidified can be absorbed, so that the first spacing Gap between the electrostatic protection layer M and the light-emitting substrate E is fixed.

[0094] Furthermore, by setting a retractable protruding structure Pin, on the one hand, the protruding structure Pin is always in contact with the electrostatic protection layer M, so that the light-emitting substrate E can be electrostatically protected by the electrostatic protection layer M, and the surge current can be transmitted to the ground; on the other hand, the first distance Gap between the light-emitting substrate E and the electrostatic protection layer M is fixed, thereby improving the service life of the product.

[0095] In some embodiments, Figure 2 As shown, each flexible circuit board FPC includes a plurality of protruding structure Pins, and the plurality of protruding structure Pins are arranged along a first direction X, and the first direction X intersects with the direction from the fan-out area f1 to the second binding connection area f3. The embodiment of the present disclosure does not limit the setting position and specific data of the protruding structure Pin on the first binding connection area f2 of the flexible circuit board FPC, and it can be flexibly set according to product requirements.

[0096] In some embodiments, the backlight module further includes a connector C, which is connected to an end of the second binding connection area f3 away from the fan-out area f1. The connector C can be integrated on a flexible circuit board FPC to form a flexible flat cable (FFC), which can be bound to the second binding connection area f3 of the flexible circuit board FPC through a binding terminal, and the embodiments of the present disclosure are not limited to this.

[0097] The disclosed embodiment also provides a display device, comprising the above-mentioned backlight module.

[0098] The above-mentioned display device can be: electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator and any other product or component with display function, which is not limited in the present disclosure.

[0099] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A backlight module, characterized in that: include: A light-emitting substrate, comprising a light-emitting area and a binding area located on one side of the light-emitting area; An electrostatic protection layer, located on the non-light-emitting side of the light-emitting substrate; At least one flexible circuit board, the flexible circuit board is bound to the binding area, and the flexible circuit board includes a fan-out area, and the fan-out area is located between the light-emitting substrate and the electrostatic protection layer; At least one retractable protrusion structure is located on a side of the fan-out area facing the electrostatic protection layer, One end of the protruding structure is electrically connected to the ground end of the flexible circuit board, and the other end of the protruding structure protrudes toward the electrostatic protection layer and is electrically connected to the electrostatic protection layer.

2. The backlight module according to claim 1, characterized in that: The protruding structure includes a fixing portion, a telescopic portion and a cap portion. The fixing portion is fixed on the fan-out area, and the fixing portion is formed with a receiving space, and the receiving space has an opening facing one side of the electrostatic protection layer; At least parts of the telescopic portion and the cap portion are located in the accommodating space, and the telescopic portion is configured to adjust the height of the cap portion protruding from the opening so that the cap portion contacts the electrostatic protection layer.

3. The backlight module according to claim 2, characterized in that: The fixing portion includes a bottom wall fixed on the fan-out area and a side wall surrounding the bottom wall, wherein the bottom wall and the side wall define the accommodation space; The telescopic portion includes an elastic component, one end of the elastic component is connected to the bottom wall, and the other end of the elastic component is connected to the bottom of the cap portion.

4. The backlight module according to claim 3, characterized in that: The cap portion includes a first sub-portion and a second sub-portion which are connected as one and arranged in sequence along the axial direction of the cap portion, wherein the first sub-portion is in contact with the electrostatic protection layer, The surface of the first sub-portion in contact with the electrostatic protection layer is a first surface, and the orthographic projection of the first surface on the fan-out area is located within the area of ​​the orthographic projection of the second sub-portion on the fan-out area.

5. The backlight module according to claim 4, characterized in that: The first surface is a plane or a curved surface.

6. The backlight module according to claim 4, characterized in that: The side wall has a first end away from the bottom wall. The fixing portion further comprises at least one limiting protrusion, and the limiting protrusion is located on the inner surface of the side wall close to the first end; At least one limiting groove is arranged on the side surface of the second sub-portion, the limiting groove corresponds to the limiting protrusion, and the limiting groove extends along the axial direction of the cap portion so that the limiting protrusion slides in the limiting groove.

7. The backlight module according to claim 6, characterized in that: The second sub-section is further provided with a baffle, which is located on a side of the limiting groove close to the bottom wall, and the limiting protrusion is located between the baffle and the bottom wall.

8. The backlight module according to claim 4, characterized in that: The inner surface of the bottom wall facing the accommodating space is the second surface, and the bottom surface of the second sub-part is the third surface. The second surface and the third surface are both circular, and the diameter of the second surface is greater than the diameter of the third surface.

9. The backlight module according to claim 1, characterized in that: There is a first distance between the light emitting substrate and the electrostatic protection layer, and the first distance is not less than the sum of the thickness of the fan-out area and the height of the protruding structure.

10. The backlight module according to claim 9, characterized in that: The retractable height range of the retractable protruding structure is 0.03 mm to 0.05 mm.

11. The backlight module according to claim 10, characterized in that: The thickness of the fan-out area is 0.25 mm to 0.26 mm, and the first spacing is 0.28 mm to 0.31 mm.

12. The backlight module according to claim 1, characterized in that: The electrostatic protection layer also includes a hollow portion corresponding to the flexible circuit board. The flexible circuit board further includes a first binding connection area and a second binding connection area, and the first binding connection area, the fan-out area and the second binding connection area are connected in sequence, wherein: The first binding connection area is bound to the binding area, and the second binding connection area extends through the hollow portion to a side of the electrostatic protection layer away from the light-emitting substrate.

13. The backlight module according to claim 12, characterized in that: Each of the flexible circuit boards includes a plurality of the protruding structures, and the plurality of the protruding structures are arranged along a first direction, and the first direction intersects with a direction from the fan-out area to the second binding connection area.

14. The backlight module according to claim 12, characterized in that: The backlight module further includes a connector, and the connector is connected to an end of the second binding connection area away from the fan-out area.

15. The backlight module according to claim 1, characterized in that: The material of the electrostatic protection layer includes metal.

16. A display device, characterized in that: A backlight module comprising any one of claims 1-15.

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