Horizontal wafer centralized cleaning equipment

Abstract

The invention discloses horizontal wafer centralized cleaning equipment, and relates to the technical field of wafer cleaning, the horizontal wafer centralized cleaning equipment comprises a base, the upper end of the base is fixedly connected with a vertical frame, the side wall of the vertical frame is provided with a moving groove, the moving groove is internally provided with a moving plate, the top of the vertical frame is provided with an electric telescopic rod, and the electric telescopic rod is fixedly connected with the vertical frame. And the telescopic end of the electric telescopic rod downwards penetrates through the vertical frame and is fixedly connected to the upper end of the moving plate, two sliding rods are vertically arranged in the moving groove, and the sliding rods penetrate through the moving plate and are slidably connected with the moving plate. According to the wafer cleaning device, the wafer body can be sequentially cleaned in the multiple cleaning solutions, the cleaning efficiency is higher, the spray pipe drives the nozzle to swing in a reciprocating mode, then impurity bonding is avoided in the cleaning process, the wafer body is driven to rotate while being cleaned, sufficient cleaning of the wafer body can be achieved, and the cleaning efficiency is improved. Meanwhile, the wafer body is effectively cleaned, and the cleaning effect is improved.

Description

Technical Field

[0001] The invention relates to the technical field of wafer cleaning, and in particular to a horizontal type centralized wafer cleaning device. Background Art

[0002] Wafers are round chips made of high-purity silicon materials used to manufacture silicon semiconductor circuits. The production process begins with polysilicon raw materials, which are purified and dissolved, and then doped with silicon seeds, which are slowly stretched to form cylindrical single-crystal silicon rods. Next, this silicon rod undergoes fine grinding, polishing and slicing processes to finally obtain what we call a wafer. The current mainstream wafer sizes in China include 8 inches and 12 inches. In the middle and late stages of wafer processing, removing colloids and impurities from the surface of the wafer is a key step to prepare for the next cutting and subsequent processing.

[0003] Existing wafer cleaning usually requires the use of a robot to repeatedly clamp the wafer and place it in different cleaning tanks for cleaning, which reduces work efficiency, is time-consuming and labor-intensive, and multiple clamping can easily cause irreversible damage to the wafer, and will also greatly delay the cleaning time and cleaning efficiency. In addition, existing wafer cleaning will leave residues of the cleaning fluid, and the cleaning effect is not good enough. Summary of the invention

[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a horizontal wafer centralized cleaning device.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: The top of described sliding panel also is provided with an interlocking structure, and the interlocking structure is hinged on the base, and the interlocking structure is hinged on the base for holding the interlocking structure to be used for cleaning the interlocking structure.

[0006] As a further improvement of the present invention, the cleaning assembly includes a mounting plate fixedly connected to the lower end of the movable plate, the lower end of the mounting plate is provided with a swing chamber and a device groove, two side plates are fixed to the lower end of the mounting plate, the two side plates are respectively located on both sides of the swing chamber, a loading mechanism is provided between the two side plates, a flushing mechanism is provided inside the swing chamber, a driving mechanism connected to the flushing mechanism is provided inside the device groove, a second device chamber is provided inside the side plate located below the device groove, and a linkage mechanism connected to the driving mechanism and the loading mechanism is provided inside the second device chamber.

[0007] As a further improvement of the present invention, the reversing assembly includes a first rack arranged inside the first device cavity, a first gear is mounted on the side wall of the rotating column through a one-way bearing, the first gear is meshed with the first rack, one end of the first rack is fixedly connected to a traction rope, the end of the traction rope away from the first rack passes through the base and is fixedly connected to the lower end of the movable plate, a first spring is provided inside the first device cavity, one end of the first spring is fixedly connected to the inner wall of the first device cavity, and the other end of the first spring is fixedly connected to the end of the first rack.

[0008] As a further improvement of the present invention, the flushing mechanism includes a plurality of nozzles horizontally arranged inside the swing chamber, a plurality of nozzles are arranged on the lower side wall of the nozzle, one end of the nozzle is rotatably connected to the inner wall of the swing chamber, the other end of the nozzle penetrates the inner wall of the swing chamber and extends to the outside of the mounting plate, a gas tank is provided at the upper end of the base, a gas valve is connected to the gas tank, an output end of the gas valve is connected to a gas pipe, an end of the gas pipe away from the gas valve is connected to the nozzle, a second gear is fixedly sleeved on the side wall of the nozzle, a second rack meshing with the second gear is horizontally provided inside the swing chamber, a movable groove is provided on the inner wall of the swing chamber, one end of the second rack is slidably inserted into the inside of the movable groove, the other end of the second rack penetrates the inner wall of the swing chamber and extends to the inside of the device groove, the second rack is slidably connected to the inner wall of the swing chamber, a second spring is provided inside the movable groove, one end of the second spring is fixedly connected to the end of the second rack, and the other end of the second spring is fixedly connected to the inner wall of the movable groove.

[0009] As a further improvement of the present invention, the driving mechanism includes a motor installed on the inner wall of the device groove, the output shaft of the motor is fixedly connected to a first rotating shaft, the end of the first rotating shaft away from the motor is rotatably connected to the inner wall of the device groove, a turntable is fixedly sleeved on the first rotating shaft, and a plurality of extrusion protrusions are fixed on the side wall of the turntable close to the second rack, and the plurality of extrusion protrusions are evenly spaced along the circumference of the side wall of the turntable.

[0010] As a further improvement of the present invention, the linkage mechanism includes a second rotating shaft rotatably connected to the inner wall of the second device cavity, the second rotating shaft passes through the inner wall of the second device cavity and extends to the outside of the side plate, the second rotating shaft is fixedly connected to a third gear at one end outside the side plate, the second rotating shaft is fixedly sleeved on the side wall of the second device cavity, the first rotating shaft is fixedly sleeved on the first sprocket, and the first sprocket is connected to the second sprocket via a transmission chain.

[0011] As a further improvement of the present invention, the loading mechanism includes a placement rack, a plurality of placement slots are arranged at the upper end of the placement rack, a wafer body is arranged inside each of the placement slots, the left and right side walls of the placement rack are fixedly connected with connecting blocks, the side walls of the two side panels are fixedly connected with connecting seats, the two connecting blocks are respectively located inside the two connecting seats, a third rotating shaft is penetrated inside the placement rack, one end of the third rotating shaft is rotatably connected to the inside of the placement rack, the other end of the third rotating shaft extends out of the placement rack and is fixedly connected with a third gear, the fourth gear, the fourth gear is meshed with the third gear, and a plurality of friction rollers are fixedly sleeved on the side walls of the third rotating shaft, the plurality of friction rollers respectively extend to the inside of the plurality of placement slots, and the friction rollers are in contact with the bottom of the wafer body.

[0012] As a further improvement of the present invention, a limiting groove is provided on the inner wall of the first device cavity, and the end of the first rack away from the traction rope is slidably inserted into the interior of the limiting groove. A redirecting wheel is installed inside the base, and the traction rope is wrapped around the redirecting wheel.

[0013] As a further improvement of the present invention, a mounting hole close to the rotating column is provided inside the base, a positioning block is provided inside the mounting hole, four positioning grooves cooperating with the positioning block are provided on the side wall of the rotating column, the four positioning grooves are arranged at equal intervals along the circumference of the rotating column, a third spring is provided inside the mounting hole, one end of the third spring is fixedly connected to the positioning block, and the other end of the third spring is fixedly connected to the inner wall of the mounting hole.

[0014] Beneficial effects of the present invention: 1. By setting up multiple cleaning boxes and adding different cleaning liquids into the multiple cleaning boxes, the cleaning boxes are driven to rotate by the rotation of the turntable, so that the wafer body can be cleaned in multiple cleaning liquids in turn, and the cleaning efficiency is more efficient.

[0015] 2. By moving the moving plate upward to drive the wafer body out of the cleaning box, the reversing mechanism can drive the rotating column to rotate, and then the rotating column can drive the turntable to rotate, so that the position of the cleaning box can be automatically changed after each wafer body cleaning.

[0016] 3. By setting up a driving mechanism and a flushing mechanism, the driving mechanism can drive the second rack to move back and forth, and the reciprocating movement of the second rack can drive the nozzle to swing back and forth, and then the nozzle is driven to swing back and forth through the nozzle, thereby avoiding impurities from sticking during the cleaning process, and effectively cleaning the wafer body, thereby improving the cleaning effect.

[0017] 4. By setting up a loading mechanism and a linkage mechanism, the linkage mechanism can drive the wafer body inside the placement rack to rotate, and then drive the wafer body to rotate while cleaning the wafer body, which can achieve full cleaning of the wafer body and further improve the cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of a horizontal wafer centralized cleaning device proposed by the present invention; Figure 2 A schematic diagram of the structure of a cleaning component of a horizontal wafer centralized cleaning device proposed by the present invention; Figure 3 A schematic diagram of the three-dimensional structure of a base, a turntable, a cleaning box, a vertical frame, a moving slot, a moving plate, a sliding rod, and an electric telescopic rod of a horizontal wafer centralized cleaning device proposed by the present invention; Figure 4 A schematic diagram of the three-dimensional structure of a mounting plate, a side plate, and a connecting seat of a horizontal wafer centralized cleaning device proposed by the present invention; Figure 5 A schematic diagram of the structure of a turntable and an extrusion bump of a horizontal wafer centralized cleaning device proposed by the present invention; Figure 6 for Figure 1 Enlarged view of point A in the middle.

[0019] In the figure: 1 base, 2 vertical frame, 3 moving groove, 4 sliding rod, 5 traction rope, 6 moving plate, 7 electric telescopic rod, 8 mounting plate, 9 gas pipe, 10 gas tank, 11 gas valve, 12 cleaning box, 13 turntable, 14 rotating column, 15 limit groove, 16 first gear, 17 first rack, 18 first device cavity, 19 first spring, 20 redirecting wheel, 21 swing cavity, 22 movable groove, 23 second spring, 24 second rack, 25 second gear, 26 nozzle, 27 nozzle , 28 device slot, 29 turntable, 30 first rotating shaft, 31 motor, 32 first sprocket, 33 transmission chain, 34 side plate, 35 second device cavity, 36 second sprocket, 37 second rotating shaft, 38 third gear, 39 fourth gear, 40 third rotating shaft, 41 friction roller, 42 placement frame, 43 placement slot, 44 connecting block, 45 connecting seat, 46 wafer body, 47 extrusion protrusion, 48 mounting hole, 49 third spring, 50 positioning block, 51 positioning slot. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] Reference Figure 1-Figure 6 A horizontal wafer centralized cleaning device comprises a base 1, a vertical frame 2 is fixedly connected to the upper end of the base 1, a movable groove 3 is arranged on the side wall of the vertical frame 2, a movable plate 6 is arranged inside the movable groove 3, an electric telescopic rod 7 is installed on the top of the vertical frame 2, the telescopic end of the electric telescopic rod 7 penetrates the vertical frame 2 downward and is fixedly connected to the upper end of the movable plate 6, two sliding rods 4 are vertically arranged inside the movable groove 3, the sliding rod 4 penetrates the movable plate 6 and is slidably connected to the movable plate 6, the two ends of the sliding rod 4 are respectively fixedly connected to the inner top wall and the inner bottom wall of the movable groove 3, a cleaning assembly is arranged at the lower end of the movable plate 6, a first device cavity 18 is arranged inside the base 1, a rotating column 14 is rotatably connected to the inner bottom wall of the first device cavity 18, the upper end of the rotating column 14 penetrates the inner top wall of the first device cavity 18 and is fixedly connected to a turntable 13, and a mounting hole close to the rotating column 14 is arranged inside the base 1 48. A positioning block 50 is provided inside the mounting hole 48. Four positioning grooves 51 cooperating with the positioning block 50 are provided on the side wall of the rotating column 14. The four positioning grooves 51 are arranged at equal intervals along the circumference of the rotating column 14. A third spring 49 is provided inside the mounting hole 48. One end of the third spring 49 is fixedly connected to the positioning block 50, and the other end of the third spring 49 is fixedly connected to the inner wall of the mounting hole 48. The positioning block 50 is engaged in the positioning groove 51, so that the rotating column 14 can be positioned and fixed, thereby ensuring the stability of the turntable 13 and the stability of the cleaning box 12 above the turntable 13. Four cleaning boxes 12 are fixed to the upper end of the turntable 13. The four cleaning boxes 12 are distributed at equal intervals along the circumference of the upper end of the turntable 13. Different cleaning liquids are stored in the cleaning boxes 12. A reversing component connected to the rotating column 14 and the movable plate 6 is provided inside the first device cavity 18.

[0022] In the present invention, the cleaning assembly includes a mounting plate 8 fixedly connected to the lower end of the movable plate 6, a swing chamber 21 and a device groove 28 are provided at the lower end of the mounting plate 8, two side plates 34 are fixed to the lower end of the mounting plate 8, the two side plates 34 are respectively located on both sides of the swing chamber 21, a loading mechanism is provided between the two side plates 34, a flushing mechanism is provided inside the swing chamber 21, a driving mechanism connected to the flushing mechanism is provided inside the device groove 28, a second device chamber 35 is provided inside the side plate 34 located below the device groove 28, and a linkage mechanism connected to the driving mechanism and the loading mechanism is provided inside the second device chamber 35.

[0023] Reference Figure 1The reversing assembly includes a first rack 17 arranged inside a first device cavity 18, and a first gear 16 is mounted on the side wall of the rotating column 14 through a one-way bearing. The first gear 16 is meshed with the first rack 17. When the first rack 17 moves to the left, the first gear 16 rotates. At this time, the one-way bearing will not drive the rotating column 14 to rotate. When the first rack 17 moves to the right, the first gear 16 rotates. At this time, the one-way bearing will drive the rotating column 14 to rotate, and then drive the turntable 13 to rotate through the rotating column 14. One end of the first rack 17 is fixedly connected to a traction rope 5, and the end of the traction rope 5 away from the first rack 17 passes through the base 1 and is fixedly connected to the lower end of the moving plate 6. A first spring 19 is provided inside the first device cavity 18, and one end of the first spring 19 is fixedly connected to the inner wall of the first device cavity 18, and the other end of the first spring 19 is fixedly connected to the end of the first rack 17.

[0024] The flushing mechanism includes a plurality of nozzles 26 horizontally arranged inside the swing chamber 21, a plurality of nozzles 27 are arranged on the lower side wall of the nozzle 26, one end of the nozzle 26 is rotatably connected to the inner wall of the swing chamber 21, the other end of the nozzle 26 penetrates the inner wall of the swing chamber 21 and extends to the outside of the mounting plate 8, a gas tank 10 is provided at the upper end of the base 1, a gas valve 11 is connected to the gas tank 10, an output end of the gas valve 11 is connected to a gas delivery pipe 9, an end of the gas delivery pipe 9 away from the gas valve 11 is connected to the nozzle 26, a second gear 25 is fixedly sleeved on the side wall of the nozzle 26, and the swing chamber 21 is provided with a plurality of nozzles 26 arranged on the lower side wall of the nozzle 26, and the second gear 25 is fixedly sleeved on the side wall of the nozzle 26. 1 is horizontally provided with a second rack 24 meshing with the second gear 25, and a movable groove 22 is provided on the inner wall of the swing cavity 21, one end of the second rack 24 is slidably inserted in the movable groove 22, and the other end of the second rack 24 penetrates the inner wall of the swing cavity 21 and extends to the inside of the device groove 28, and the second rack 24 is slidably connected to the inner wall of the swing cavity 21, and a second spring 23 is provided in the movable groove 22, one end of the second spring 23 is fixedly connected to the end of the second rack 24, and the other end of the second spring 23 is fixedly connected to the inner wall of the movable groove 22.

[0025] The driving mechanism includes a motor 31 installed on the inner wall of the device groove 28, the output shaft of the motor 31 is fixedly connected to the first rotating shaft 30, and the end of the first rotating shaft 30 away from the motor 31 is rotatably connected to the inner wall of the device groove 28, and a turntable 29 is fixedly sleeved on the first rotating shaft 30. A plurality of extrusion protrusions 47 are fixed on the side wall of the turntable 29 close to the second rack 24. The plurality of extrusion protrusions 47 are distributed at equal intervals along the circumferential direction of the side wall of the turntable 29. When the extrusion protrusions 47 are squeezed by the second rack 24, the second rack 24 can be moved. When the extrusion protrusions 47 are separated from the second rack 24, the elastic force of the second spring 23 can act on the second rack 24, so that the second rack 24 is reset and moved.

[0026] The linkage mechanism includes a second rotating shaft 37 rotatably connected to the inner wall of the second device cavity 35, the second rotating shaft 37 passes through the inner wall of the second device cavity 35 and extends to the outside of the side plate 34, and the end of the second rotating shaft 37 located outside the side plate 34 is fixedly connected to the third gear 38, and the second rotating shaft 37 is located on the side wall of the second device cavity 35 and is fixedly sleeved with a second sprocket 36, and the first rotating shaft 30 is fixedly sleeved with a first sprocket 32, and the first sprocket 32 ​​and the second sprocket 36 are connected by a transmission chain 33.

[0027] The loading mechanism includes a placement rack 42, and a plurality of placement grooves 43 are arranged at the upper end of the placement rack 42. Balls are embedded on the inner walls of the placement grooves 43 for positioning the wafer body 46. A wafer body 46 is arranged inside each placement groove 43. The left and right side walls of the placement rack 42 are fixedly connected with connecting blocks 44. The side walls of the two side panels 34 are fixedly connected with connecting seats 45. The connecting blocks 44 are rectangular blocks. The connecting seats 45 are provided with rectangular grooves that match the connecting blocks 44. The two connecting blocks 44 are respectively located at the two connecting A third rotating shaft 40 is provided inside the receiving seat 45 and the placing frame 42, one end of the third rotating shaft 40 is rotatably connected to the inside of the placing frame 42, and the other end of the third rotating shaft 40 extends out of the placing frame 42 and is fixedly connected to the third gear 38 and the fourth gear 39, the fourth gear 39 is meshed with the third gear 38, and a plurality of friction rollers 41 are fixedly sleeved on the side wall of the third rotating shaft 40, and the plurality of friction rollers 41 extend to the inside of the plurality of placing grooves 43 respectively, and the friction rollers 41 are in contact with the bottom of the wafer body 46.

[0028] A limiting groove 15 is provided on the inner wall of the first device cavity 18 , and one end of the first rack 17 away from the traction rope 5 is slidably inserted into the limiting groove 15 . A redirecting wheel 20 is installed inside the base 1 , and the traction rope 5 is wound around the redirecting wheel 20 .

[0029] When the present invention is used, the wafer body 46 is placed inside the placement groove 43, and then the placement frame 42 is placed between the two side plates 34, and then the connecting block 44 is inserted into the connecting seat 45 to complete the loading of the wafer body 46. At this time, the third gear 38 is meshed with the fourth gear 39; Then, the electric telescopic rod 7 is started to extend, driving the moving plate 6 to move downward, and then driving the mounting plate 8 to move downward, so as to drive the placement rack 42 and the wafer body 46 to move into the cleaning box 12, and at the same time, the nozzle 27 is inserted into the cleaning liquid in the cleaning box 12, and the air valve 11 is started, so that the high-pressure gas in the gas tank 10 can be discharged and sprayed into the cleaning liquid through the nozzle 27, so that the wafer body 46 can be rinsed by the cleaning liquid carried by the airflow, and the motor 31 is started to drive the first rotating shaft 30 to rotate, and the turntable 29 is driven to rotate through the first rotating shaft 30, so that the second rack 24 can be intermittently squeezed by the squeezing protrusion 47, so that the second rack 24 reciprocates, and because the second rack 24 is meshed with the second gear 25, the second gear 25 can be driven to reciprocate, so that the nozzle 26 can be driven to swing back and forth, and then the nozzle 27 is driven to swing back and forth through the nozzle 26, so as to avoid impurities from sticking during the cleaning process, and at the same time, the wafer body 46 is effectively cleaned, thereby improving the cleaning effect; When the first rotating shaft 30 rotates, it can drive the first sprocket 32 ​​to rotate. The transmission effect of the transmission chain 33 can drive the second sprocket 36 to rotate, and the second rotating shaft 37 can be driven to rotate. The third gear 38 is driven to rotate through the second rotating shaft 37. Since the third gear 38 is meshed with the fourth gear 39, the third rotating shaft 40 can be driven to rotate. The friction roller 41 is driven to rotate through the third rotating shaft 40. The friction force between the friction roller 41 and the wafer body 46 can be used to drive the wafer body 46 inside the placement rack 42 to rotate, and then the wafer body 46 is driven to rotate while the wafer body 46 is being cleaned, so that the wafer body 46 can be fully cleaned, and the cleaning effect can be further improved. After the cleaning is completed, the electric telescopic rod 7 is started to retract, driving the movable plate 6 to move upward, driving the wafer body 46 to move out of the cleaning box 12, and then in the process of the movable plate 6 moving upward, the first rack 17 is pulled to move by the traction rope 5. When the first rack 17 moves, it can drive the first gear 16 to rotate. At this time, the one-way bearing can drive the rotating column 14 to rotate, and the turntable 13 is driven to rotate through the rotating column 14. The cleaning box 12 is driven to rotate by the rotation of the turntable 13. After each cleaning of the wafer body 46, the position of the cleaning box 12 can be automatically changed.

[0030] The above process is repeated to clean the wafer body 46 for the next time.

[0031] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A horizontal wafer centralized cleaning device, comprising a base (1), characterized in that: The upper end of the base (1) is fixedly connected to a vertical frame (2), a movable groove (3) is provided on the side wall of the vertical frame (2), a movable plate (6) is provided inside the movable groove (3), an electric telescopic rod (7) is installed on the top of the vertical frame (2), the telescopic end of the electric telescopic rod (7) penetrates downwardly through the vertical frame (2) and is fixedly connected to the upper end of the movable plate (6), two sliding rods (4) are vertically provided inside the movable groove (3), the sliding rod (4) penetrates the movable plate (6) and is slidably connected to the movable plate (6), and the two ends of the sliding rod (4) are respectively fixedly connected to the inner top wall and the inner wall of the movable groove (3). A cleaning assembly is provided at the bottom wall of the movable plate (6), a first device cavity (18) is provided inside the base (1), a rotating column (14) is rotatably connected to the inner bottom wall of the first device cavity (18), the upper end of the rotating column (14) passes through the inner top wall of the first device cavity (18) and is fixedly connected to a turntable (13), four cleaning boxes (12) are fixed to the upper end of the turntable (13), the four cleaning boxes (12) are distributed at equal intervals along the circumference of the upper end of the turntable (13), and a reversing assembly connected to the rotating column (14) and the movable plate (6) is provided inside the first device cavity (18).

2. A horizontal wafer centralized cleaning equipment according to claim 1, characterized in that: The cleaning assembly comprises a mounting plate (8) fixedly connected to the lower end of the moving plate (6); a swing cavity (21) and a device groove (28) are provided at the lower end of the mounting plate (8); two side plates (34) are fixed to the lower end of the mounting plate (8); the two side plates (34) are respectively located on both sides of the swing cavity (21); a loading mechanism is provided between the two side plates (34); a flushing mechanism is provided inside the swing cavity (21); a driving mechanism connected to the flushing mechanism is provided inside the device groove (28); a second device cavity (35) is provided inside the side plate (34) located below the device groove (28); and a linkage mechanism connected to the driving mechanism and the loading mechanism is provided inside the second device cavity (35).

3. The horizontal wafer centralized cleaning equipment according to claim 1, characterized in that: The reversing assembly comprises a first rack (17) arranged inside a first device cavity (18); a first gear (16) is mounted on the side wall of the rotating column (14) via a one-way bearing; the first gear (16) is meshed with the first rack (17); one end of the first rack (17) is fixedly connected to a traction rope (5); one end of the traction rope (5) away from the first rack (17) passes through the base (1) and is fixedly connected to the lower end of the moving plate (6); a first spring (19) is arranged inside the first device cavity (18); one end of the first spring (19) is fixedly connected to the inner wall of the first device cavity (18); and the other end of the first spring (19) is fixedly connected to the end of the first rack (17).

4. The horizontal wafer centralized cleaning equipment according to claim 2, characterized in that: The flushing mechanism comprises a plurality of nozzles (26) arranged horizontally inside the swing chamber (21), a plurality of nozzles (27) arranged on the lower side wall of the nozzle (26), one end of the nozzle (26) being rotatably connected to the inner wall of the swing chamber (21), the other end of the nozzle (26) penetrating the inner wall of the swing chamber (21) and extending to the outside of the mounting plate (8), a gas tank (10) being provided at the upper end of the base (1), a gas valve (11) being connected to the gas tank (10), an output end of the gas valve (11) being connected to a gas supply pipe (9), an end of the gas supply pipe (9) being away from the gas valve (11) being connected to the nozzle (26), a second gear (25) being fixedly sleeved on the side wall of the nozzle (26), and the nozzle (26) being provided with a plurality of nozzles (27) arranged on the lower side wall of the nozzle (26). A second rack (24) meshing with a second gear (25) is horizontally arranged inside the swing cavity (21); a movable groove (22) is arranged on the inner wall of the swing cavity (21); one end of the second rack (24) is slidably inserted into the inside of the movable groove (22); the other end of the second rack (24) penetrates the inner wall of the swing cavity (21) and extends to the inside of the device groove (28); the second rack (24) is slidably connected to the inner wall of the swing cavity (21); a second spring (23) is arranged inside the movable groove (22); one end of the second spring (23) is fixedly connected to the end of the second rack (24); the other end of the second spring (23) is fixedly connected to the inner wall of the movable groove (22).

5. The horizontal wafer centralized cleaning equipment according to claim 4, characterized in that: The driving mechanism comprises a motor (31) mounted on the inner wall of the device groove (28); an output shaft of the motor (31) is fixedly connected to a first rotating shaft (30); an end of the first rotating shaft (30) away from the motor (31) is rotatably connected to the inner wall of the device groove (28); a rotating disk (29) is fixedly sleeved on the first rotating shaft (30); a plurality of extrusion protrusions (47) are fixed on the side wall of the rotating disk (29) close to the second rack (24); and the plurality of extrusion protrusions (47) are distributed at equal intervals along the circumferential direction of the side wall of the rotating disk (29).

6. The horizontal wafer centralized cleaning equipment according to claim 5, characterized in that: The linkage mechanism comprises a second rotating shaft (37) rotatably connected to the inner wall of the second device cavity (35); the second rotating shaft (37) penetrates the inner wall of the second device cavity (35) and extends to the outside of the side plate (34); one end of the second rotating shaft (37) located outside the side plate (34) is fixedly connected to a third gear (38); a second sprocket (36) is fixedly sleeved on the side wall of the second rotating shaft (37) located in the second device cavity (35); a first sprocket (32) is fixedly sleeved on the first rotating shaft (30); and the first sprocket (32) and the second sprocket (36) are connected via a transmission chain (33).

7. The horizontal wafer centralized cleaning equipment according to claim 6, characterized in that: The loading mechanism comprises a placement rack (42), a plurality of placement slots (43) are arranged at the upper end of the placement rack (42), a wafer body (46) is arranged inside each of the placement slots (43), a connection block (44) is fixedly connected to the left and right side walls of the placement rack (42), a connection seat (45) is fixedly connected to the side walls of the two side plates (34), the two connection blocks (44) are respectively located inside the two connection seats (45), a third rotating shaft (40) is passed through the inside of the placement rack (42), and the third rotating shaft (40) is provided inside the placement rack (42). One end of the third rotating shaft (40) is rotatably connected to the inside of the placement frame (42), and the other end of the third rotating shaft (40) extends out of the placement frame (42) and is fixedly connected to the third gear (38), the fourth gear (39), and the fourth gear (39) is meshed with the third gear (38). A plurality of friction rollers (41) are fixedly sleeved on the side wall of the third rotating shaft (40), and the plurality of friction rollers (41) extend to the inside of a plurality of placement grooves (43) respectively, and the friction rollers (41) are in contact with the bottom of the wafer body (46).

8. The horizontal wafer centralized cleaning equipment according to claim 3, characterized in that: A limiting groove (15) is provided on the inner wall of the first device cavity (18); one end of the first rack (17) away from the traction rope (5) is slidably inserted into the limiting groove (15); a redirecting wheel (20) is installed inside the base (1); and the traction rope (5) is wound around the redirecting wheel (20).

9. The horizontal wafer centralized cleaning equipment according to claim 1, characterized in that: The base (1) is provided with a mounting hole (48) close to the rotating column (14), a positioning block (50) is provided inside the mounting hole (48), and four positioning grooves (51) cooperating with the positioning block (50) are provided on the side wall of the rotating column (14), and the four positioning grooves (51) are arranged at equal intervals along the circumference of the rotating column (14). A third spring (49) is provided inside the mounting hole (48), one end of the third spring (49) is fixedly connected to the positioning block (50), and the other end of the third spring (49) is fixedly connected to the inner wall of the mounting hole (48).

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