Transceiving bidirectional photoelectric hybrid delay module and packaging structure thereof

Abstract

The invention provides a transceiving bidirectional photoelectric hybrid time delay module, which comprises an electric switch, an electro-optical modulator, a photoelectric detector, a numerical control electric attenuator, a numerical control electric time delay unit, a serial-to-parallel driver, a numerical control optical time delay unit and a laser. According to the invention, the numerical control electric delayer and the numerical control optical delayer are cascaded, the characteristics of large delay, high precision and low loss are realized, the receiving and transmitting bidirectional switching is carried out through the electric switch, the receiving and transmitting bidirectional delay function can be realized only through a set of photoelectric hybrid delay link, the electric switch is controlled through the switch switching control level, the switching speed is high, and the switching speed is high. The numerical control electric delayer and the numerical control optical delayer are controlled through the serial-to-parallel driver, the number of control interfaces is small, link attenuation control is carried out through the numerical control electric attenuator, a link gain adjusting function is achieved, and composition units in the module can be achieved through common packaging of bare chips. The time delay circuit has the characteristics of large time delay amount, low loss, high precision, adjustable gain, integrated packaging and transmit-receive bidirectional time delay.

Description

Technical Field

[0001] The present invention relates to the technical field of phased arrays, and in particular to a transceiver bidirectional optoelectronic hybrid delay module and a packaging structure thereof. Background Art

[0002] The phased array system realizes beam synthesis through an adjustable true delay network, which has the characteristics of large scanning angle, wide instantaneous bandwidth, and no beam tilt, and has broad application prospects. With the continuous improvement of the operating frequency band of the phased array antenna, the spacing between the phased array antenna units is getting smaller and smaller. In order to enhance the power of the phased array radar, the antenna caliber is constantly increasing, resulting in the continuous increase in the size of the array. Correspondingly, the number of adjustable delay line bits in the optical control beam synthesis network is constantly increasing, and the delay step is constantly shrinking.

[0003] At present, the adjustable true delay module often uses a digitally controlled electric delay device or a digitally controlled optical delay device for true delay adjustment. However, due to the small number of delay bits of the digitally controlled electric delay device, the long delay loss of the electric delay device is large, resulting in a small maximum delay of the electric delay device; the digitally controlled optical delay device has a small loss, but the optical waveguide is easily affected by the environment, resulting in limited delay accuracy. Therefore, it is a solution to utilize the advantages of digitally controlled electric delay devices and digitally controlled optical delay devices, cascade digitally controlled electric delay devices and digitally controlled optical delay devices, and give full play to the advantages of digitally controlled electric delay devices with small delay and high precision and digitally controlled optical delay devices with large delay and low loss. Digitally controlled electric delay devices naturally have bidirectional functions of sending and receiving, while digitally controlled optical delay devices require matching electro-optical modulators and photoelectric detectors, and electrical signals can only be input from electro-optical modulators and output from photoelectric detectors, resulting in only one-way delay. At present, two schemes are commonly used for digitally controlled optical delay devices to transmit and receive bidirectional optical delays. One scheme uses two sets of optical delay links to perform receiving and transmitting delays respectively. This scheme requires more delay devices and has a large size, weight and cost. The other scheme uses an optical circulator to switch the optical path and reuse the same set of optical delay links. However, the isolation of the optical circulator is limited, and the optical circulator is not easy to integrate into the chip, and there are problems with insufficient isolation and integration.

[0004] For phased array systems, not only do we need a multi-channel adjustable true delay module to adjust the delay between channels, but we also need to adjust the amplitude consistency between multiple channels. Therefore, it is particularly important to propose a bidirectional optoelectronic hybrid delay module with large delay, low loss, high precision, adjustable amplitude, and integrated packaging, which is suitable for phased array systems. Summary of the invention

[0005] In order to solve the technical problems existing in the background technology, the present invention proposes a bidirectional photoelectric hybrid delay module for transmitting and receiving and its packaging structure.

[0006] The present invention proposes a bidirectional photoelectric hybrid delay module for transmitting and receiving, comprising an electric switch, an electro-optical modulator, a photodetector, a digitally controlled electric attenuator, a digitally controlled electric delay device, a serial-to-parallel driver, a digitally controlled optical delay device and a laser;

[0007] The laser, electro-optic modulator, photodetector, digitally controlled electric attenuator, digitally controlled electric delay device, serial-to-parallel driver and digitally controlled optical delay device together form an optoelectronic delay link, and the digitally controlled electric attenuator controls the link attenuation value according to the driving signal output by the serial-to-parallel driver, and the digitally controlled electric delay device and digitally controlled optical delay device control the link delay value according to the driving signal output by the serial-to-parallel driver;

[0008] The electric switch has four RF interfaces: the first port, the second port, the third port, and the fourth port. The first port and the third port are connected to external input and output signals. The second port inputs the received RF signal into the photoelectric delay link in the module. The fourth port outputs the RF signal output by the photoelectric delay link through the electric switch. The electric switch switches between two working states according to the switch switching control signal:

[0009] Working state 1: the first port is connected to the second port, and the third port is connected to the fourth port;

[0010] Working state 2: the first port is connected to the fourth port, and the second port is connected to the third port.

[0011] Thereby realizing the sending and receiving switching function.

[0012] Preferably, the second port inputs the received RF signal into the electro-optical modulator, the laser output laser passes through the electro-optical modulator to complete the electro-optical conversion, the electro-optical modulator outputs the optical signal and passes through the digitally controlled optical delay device to complete the optical delay, the delayed optical signal is input into the photodetector to complete the photoelectric conversion, the output electrical signal passes through the digitally controlled electrical attenuator for gain adjustment, the electrical signal after gain adjustment is input into the digitally controlled electrical delay device for electrical delay, the electrical signal after delay is input into the fourth port of the electric switch, and finally the RF signal is output through the electric switch.

[0013] Preferably, the minimum electrical delay step of the digital controlled electrical delay device is Δt, the number of electrical delay bits is m, and the minimum optical delay step of the digital controlled optical delay device is 2 m Δt, the number of optical delay bits is n, the delay step of the entire optoelectronic delay link is Δt, and the number of delay bits is (m+n).

[0014] Preferably, the electric switch, the electro-optic modulator, the photodetector, the digitally controlled electric attenuator, the digitally controlled electric delay device and the serial-to-parallel driver are independently packaged devices and are connected to the digitally controlled optical delay device and the laser.

[0015] Preferably, the electric switch, electro-optic modulator, photodetector, digitally controlled electric attenuator, digitally controlled electric delay device and serial-to-parallel driver are co-packaged as bare chips and then connected to the digitally controlled optical delay device and the laser.

[0016] The packaging structure of a bidirectional photoelectric hybrid delay module for transmitting and receiving proposed by the present invention comprises: the above-mentioned electric switch, electro-optical modulator, photoelectric detector, digitally controlled electric attenuator, digitally controlled electric delay, serial-to-parallel driver, digitally controlled optical delay and laser;

[0017] It also includes an optical chip, an optical fiber, a bias control chip, a transimpedance amplifier chip, a first base body, a second base body, an inner cover plate, solder balls, a bottom plate and a tube shell;

[0018] The optical chip integrates the functional units of the electro-optic modulator and the photodetector. The optical chip is connected to the optical fiber by end-face optical coupling for optical signal connection and is welded to the first base body by flip-chip welding for electrical signal interconnection.

[0019] The bias control chip is bonded to the first base body and connected to the surface wiring of the first base body by wire bonding, and connected to the optical chip through the metal vias inside the first base body, so as to perform closed-loop control on the bias of the electro-optic modulator inside the optical chip;

[0020] The transimpedance amplifier chip is bonded to the first base body and connected to the surface wiring of the first base body by wire bonding, and connected to the optical chip through the metal vias inside the first base body to perform transimpedance amplification on the output signal of the photodetector inside the optical chip;

[0021] The electric switch, the digitally controlled electric attenuator, the digitally controlled electric delay device and the serial-to-parallel driver are bonded to the second base body, and are respectively connected to the surface wiring of the second base body by wire bonding, and are electrically connected to each other through metal vias inside the second base body;

[0022] The first seat body, the second seat body and the bottom plate are connected and signal transmitted through solder balls, and the internal cavities of the first seat body and the second seat body are partially sealed by the inner cover plate; the optical fiber is welded to the tube shell, and the tube shell is welded to the bottom plate to form a co-packaged module;

[0023] The co-packaged module is electrically connected to the external electrical signal through solder balls; the co-packaged module, the CNC optical delay device and the laser are welded on the same printed circuit board, the optical signal is connected through the optical fiber, and the electrical signal is connected through the bottom solder balls and the wiring inside the printed circuit board.

[0024] The present invention cascades a small delay high-precision digitally controlled electric delay device with a large delay low-loss digitally controlled optical delay device, which has the characteristics of large delay, high precision and low loss. The bidirectional switching of transmission and reception is performed through an electric switch, and only one set of optoelectronic hybrid delay link is needed to realize the bidirectional delay function of transmission and reception. In addition, the extinction ratio of the electric switch is high, and the electric switch chip is easy to be optically hybrid co-packaged. The electric switch is controlled by switching the control level, and the switching speed is fast. The digitally controlled electric delay device and the digitally controlled optical delay device are controlled by a serial-to-parallel driver, and the number of control interfaces is small. Link attenuation control is performed through a digitally controlled electric attenuator, and a gain adjustment function is provided. The component units in the module can be realized by co-packaging of bare chips. The entire module has the characteristics of large delay, low loss, high precision, adjustable gain, integrated packaging and bidirectional delay of transmission and reception.

[0025] In summary, compared with the prior art, the present invention has the following advantages:

[0026] 1. The present invention cascades a small delay, high-precision digitally controlled electric delay device with a large delay, low-loss digitally controlled optical delay device, which has the characteristics of large delay, high precision and low loss.

[0027] 2. The present invention uses an electric switch to perform bidirectional switching between transmission and reception. Only one set of optoelectronic hybrid delay links is needed to realize the bidirectional delay function of transmission and reception. In addition, the extinction ratio of the electric switch is high, and the electric switch chip is easy to perform optoelectronic hybrid co-packaging, further reducing the module size.

[0028] 3. The electric switch of the present invention is controlled by switching the control level, and the switching speed is fast. The digital controlled electric delay device and the digital controlled optical delay device are controlled by serial parallel drivers. The digital controlled electric delay device and the digital controlled optical delay device have many control interfaces, which can be significantly reduced by delay attenuation control code and driving.

[0029] 4. The digitally controlled electric attenuator of the present invention can perform link attenuation control according to the driving signal output by the serial-to-parallel driver, and has a multi-channel photoelectric delay amplitude consistency adjustment function.

[0030] 5. In the present invention, the electric switch, electro-optic modulator, photodetector, digitally controlled electric attenuator, digitally controlled electric delay and serial-to-parallel driver can be independently packaged devices connected to the digitally controlled optical delay and laser. They can also be co-packaged as bare chips, and after packaging, they are electrically interconnected with the digitally controlled optical delay and laser through the solder balls at the bottom of the module, and optically interconnected with the digitally controlled optical delay and laser through the optical fiber interface at the top of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a structural schematic diagram of a bidirectional photoelectric hybrid delay module for transmitting and receiving proposed by the present invention;

[0032] Figure 2A schematic diagram of the signal flow of a bidirectional photoelectric hybrid delay module for receiving and transmitting signals proposed by the present invention;

[0033] Figure 3 A schematic diagram of the signal flow of a bidirectional photoelectric hybrid delay module for transmitting and receiving signals proposed by the present invention;

[0034] Figure 4 This is a schematic diagram of the packaging structure of the bidirectional photoelectric hybrid delay module for transmitting and receiving proposed by the present invention. DETAILED DESCRIPTION

[0035] Reference Figure 1 The bidirectional photoelectric hybrid delay module for transmitting and receiving proposed by the present invention includes an electric switch 1, an electro-optical modulator 2, a photodetector 3, a digitally controlled electric attenuator 4, a digitally controlled electric delay 5, a serial-to-parallel driver 6, a digitally controlled optical delay 7 and a laser 8.

[0036] The laser 8, the electro-optic modulator 2, the photodetector 3, the digitally controlled electric attenuator 4, the digitally controlled electric delay 5, the serial-to-parallel driver 6 and the digitally controlled optical delay 7 together form an optoelectronic delay link, and the digitally controlled electric attenuator 4 can control the link attenuation value according to the drive signal output by the serial-to-parallel driver 6, which is conducive to adjusting the amplitude consistency between channels in a multi-channel optoelectronic delay scenario. The digitally controlled electric delay 5 and the digitally controlled optical delay 7 jointly complete the link delay setting, and the digitally controlled electric delay 5 and the digitally controlled optical delay 7 can control the link delay value according to the drive signal output by the serial-to-parallel driver 6. The minimum electric delay step of the digitally controlled electric delay 5 is Δt, the number of electric delay bits is m, and the minimum optical delay step of the digitally controlled optical delay 7 is 2 m Δt, the number of optical delay bits is n, the delay step of the entire optoelectronic delay link is Δt, and the number of delay bits is (m+n), which combines the advantages of 5 small delays and high precision of CNC electric delay devices and 7 large delays and low losses of CNC optical delay devices.

[0037] The electric switch 1 has four radio frequency interfaces: a first port 11, a second port 12, a third port 13, and a fourth port 14. The first port 11 and the third port 13 are connected to external input and output signals. The second port 12 inputs the received radio frequency signal into the photoelectric delay link in the module, and the fourth port 14 outputs the radio frequency signal output by the photoelectric delay link through the electric switch 1. Specifically, the second port 12 inputs the received radio frequency signal into the electro-optical modulator 2, the laser 8 outputs the laser through the electro-optical modulator 2 to complete the electro-optical conversion, the electro-optical modulator 2 outputs the optical signal through the digitally controlled optical delay device 7 to complete the optical delay, and after the delay, the optical signal is input into the photodetector 3 to complete the photoelectric conversion, the output electrical signal is gain adjusted through the digitally controlled electrical attenuator 4, the electrical signal after the gain adjustment is input into the digitally controlled electrical delay device 5 for electrical delay, and the electrical signal after the delay is input into the fourth port 14 of the electric switch 1, and finally the radio frequency signal is output through the electric switch 1.

[0038] Reference Figure 2-3 , taking the first port 11 receiving an external signal and the third port 13 transmitting an external signal as a receiving state, and taking the first port 11 transmitting an external signal and the third port 13 receiving an external signal as a transmitting state as an example, the electric switch 1 switches between two working states according to the switch switching control signal:

[0039] Working state 1: the first port 11 is connected to the second port 12, and the third port 13 is connected to the fourth port 14. Figure 2 As shown, the delay of receiving signal is realized;

[0040] Working state 2: the first port 11 is connected to the fourth port 14, and the second port 12 is connected to the third port 13. Figure 3 As shown, the transmission signal delay is realized;

[0041] Thereby realizing the bidirectional switching function of sending and receiving.

[0042] As can be seen from the above, the present invention cascades a small delay high-precision digitally controlled electric delay device 5 with a large delay low-loss digitally controlled optical delay device 7, which has the characteristics of large delay, high precision and low loss. The bidirectional switching of transmission and reception is performed through the electric switch 1, and only one set of optoelectronic hybrid delay link is needed to realize the bidirectional delay function of transmission and reception. In addition, the extinction ratio of the electric switch 1 is high, and the chip of the electric switch 1 is easy to be optoelectronically hybrid co-packaged. The electric switch 1 is controlled by switching the control level, and the switching speed is fast. The digitally controlled electric delay device 5 and the digitally controlled optical delay device 7 are controlled by a serial-to-parallel driver 6, and the number of control interfaces is small. The link attenuation control is performed by the digitally controlled electric attenuator 4, and the gain adjustment function is provided. The components in the module can be realized by co-packaging of bare chips. The entire module has the characteristics of large delay, low loss, high precision, adjustable gain, integrated packaging and bidirectional delay of transmission and reception.

[0043] In addition, in this embodiment, the electric switch 1, the electro-optical modulator 2, the photodetector 3, the digitally controlled electric attenuator 4, the digitally controlled electric delay 5 and the serial-to-parallel driver 6 can be devices with independent packaging connected to the digitally controlled optical delay 7 and the laser 8, or they can all be bare chips that are co-packaged and then connected to the digitally controlled optical delay 7 and the laser 8 after co-packaging.

[0044] Reference Figure 4 The packaging structure of a bidirectional photoelectric hybrid delay module for transmitting and receiving proposed by the present invention includes: the above-mentioned electric switch 1, electro-optical modulator 2, photodetector 3, digitally controlled electric attenuator 4, digitally controlled electric delay 5, serial-to-parallel driver 6, digitally controlled optical delay 7 and laser 8; and optical chip 20, optical fiber 21, bias control chip 22, transimpedance amplifier chip 23, first seat 24, second seat 25, inner cover 26, solder ball 27, bottom plate 28 and tube shell 29, wherein:

[0045] The optical chip 20 integrates the functional units of the electro-optic modulator 2 and the photodetector 3, and is connected to the optical fiber 21 for optical signal connection by end-face optical coupling, and is welded to the first base body 24 by flip-chip welding for electrical signal interconnection. The bias control chip 22 is bonded to the first base body 24, and is connected to the surface wiring of the first base body 24 by wire bonding, and is connected to the optical chip 20 through the metal vias inside the first base body 24, so as to perform closed-loop control on the bias of the electro-optic modulator 2 inside the optical chip 20. The transimpedance amplifier chip 23 is bonded to the first base body 24, and is connected to the surface wiring of the first base body 24 by wire bonding, and is connected to the optical chip 20 through the metal vias inside the first base body 24, so as to perform transimpedance amplification on the output signal of the photodetector 3 inside the optical chip 20. The electric switch 1, the digitally controlled electric attenuator 4, the digitally controlled electric delay 5 and the serial-to-parallel driver 6 are bonded to the second base 25, and are connected to the surface wiring of the second base 25 by wire bonding, and are electrically connected to each other through the metal vias inside the second base 25. The first base 24, the second base 25 and the bottom plate 28 are connected and signal transmitted through the solder balls 27. The internal cavities of the first base 24 and the second base 25 are partially sealed by the inner cover plate 26, the optical fiber 21 is welded to the tube shell 29, and the tube shell 29 is welded to the bottom plate 28 to seal the module as a whole, thereby forming a co-packaged module 9.

[0046] The co-packaged module 9 is electrically connected to the external electrical signal through the solder ball 27. The co-packaged module 9, the digitally controlled optical delay device 7 and the laser 8 are soldered on the same printed circuit board, and the optical signal is connected through the optical fiber 21, and the electrical signal is connected through the bottom solder ball 27 and the wiring inside the printed circuit board.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A bidirectional photoelectric hybrid delay module for transmitting and receiving, characterized in that: include: An electric switch (1), an electro-optic modulator (2), a photodetector (3), a digitally controlled electric attenuator (4), a digitally controlled electric delay device (5), a serial-to-parallel driver (6), a digitally controlled optical delay device (7) and a laser (8); The laser (8), the electro-optic modulator (2), the photodetector (3), the digitally controlled electric attenuator (4), the digitally controlled electric delay device (5), the serial-to-parallel driver (6) and the digitally controlled optical delay device (7) together form an optical-to-electrical delay link, and the digitally controlled electric attenuator (4) controls the link attenuation value according to the driving signal output by the serial-to-parallel driver (6) to achieve link gain adjustment, and the digitally controlled electric delay device (5) and the digitally controlled optical delay device (7) control the link delay according to the driving signal output by the serial-to-parallel driver (6); The electric switch (1) has four radio frequency interfaces: a first port (11), a second port (12), a third port (13), and a fourth port (14). The first port (11) and the third port (13) are connected to external input and output signals. The second port (12) inputs the received radio frequency signal into the photoelectric delay link. The fourth port (14) outputs the radio frequency signal output by the photoelectric delay link through the electric switch (1). The electric switch (1) switches between two working states according to a switch switching control signal: Working state 1: the first port (11) is connected to the second port (12), and the third port (13) is connected to the fourth port (14); Working state 2: the first port (11) is connected to the fourth port (14), and the second port (12) is connected to the third port (13).

2. According to the bidirectional photoelectric hybrid delay module for transmitting and receiving according to claim 1, it is characterized in that the second port (12) inputs the received radio frequency signal into the electro-optical modulator (2); the laser (8) outputs laser light and passes through the electro-optical modulator (2) to complete the electro-optical conversion; the electro-optical modulator (2) outputs the optical signal and passes through the digital controlled optical delay device (7) to complete the optical delay; after the delay, the optical signal is input into the photodetector (3) to complete the photoelectric conversion, and the output electrical signal is passed through the digital controlled electrical attenuator (4) for gain adjustment; after the gain adjustment, the electrical signal is input into the digital controlled electrical delay device (5) for electrical delay, and the electrical signal after the delay is input into the fourth port (14) of the electrical switch (1), and finally the radio frequency signal is output through the electrical switch (1).

3. The optoelectronic delay link according to claim 2 is characterized in that the minimum electrical delay step of the digitally controlled electrical delay device (5) is Δt, and the number of electrical delay bits is m; the minimum optical delay step of the digitally controlled optical delay device (7) is 2 m Δt, the number of optical delay bits is n, the delay step of the entire optoelectronic delay link is Δt, and the number of delay bits is (m+n).

4. The bidirectional optoelectronic hybrid delay module for transmitting and receiving according to claim 1 is characterized in that the electric switch (1), the electro-optical modulator (2), the photodetector (3), the digitally controlled electric attenuator (4), the digitally controlled electric delay device (5) and the serial-to-parallel driver (6) are independently packaged devices and are connected to the digitally controlled optical delay device (7) and the laser (8).

5. The bidirectional optoelectronic hybrid delay module for transmitting and receiving according to claim 1 is characterized in that the electric switch (1), the electro-optical modulator (2), the photodetector (3), the digitally controlled electric attenuator (4), the digitally controlled electric delay device (5) and the serial-to-parallel driver (6) are bare chips that are co-packaged and then connected to the digitally controlled optical delay device (7) and the laser (8).

6. A packaging structure of a bidirectional photoelectric hybrid delay module for transmitting and receiving, comprising: An electric switch (1), an electro-optical modulator (2), a photodetector (3), a digitally controlled electric attenuator (4), a digitally controlled electric delay (5), a serial-to-parallel driver (6), a digitally controlled optical delay (7) and a laser (8) as claimed in any one of claims 1 to 5; The device is characterized in that it also includes an optical chip (20), an optical fiber (21), a bias control chip (22), a transimpedance amplifier chip (23), a first base body (24), a second base body (25), an inner cover plate (26), solder balls (27), a base plate (28) and a tube shell (29); The optical chip (20) integrates the functional units of the electro-optic modulator (2) and the photodetector (3); the optical chip (20) is connected to the optical fiber (21) by end-face optical coupling for optical signal connection, and is welded to the first base body (24) by flip-chip welding for electrical signal interconnection; The bias control chip (22) is bonded to the first base (24) and connected to the surface wiring of the first base (24) by wire bonding, and connected to the optical chip (20) through the metal vias inside the first base (24) to perform closed-loop control on the bias of the electro-optic modulator (2) inside the optical chip (20); The transimpedance amplifier chip (23) is bonded to the first base (24) and connected to the surface wiring of the first base (24) by wire bonding, and connected to the optical chip (20) through the metal vias inside the first base (24) to perform transimpedance amplification on the output signal of the photoelectric detector (3) inside the optical chip (20); The electric switch (1), the digitally controlled electric attenuator (4), the digitally controlled electric delay device (5) and the serial-to-parallel driver (6) are bonded to the second base body (25), and are respectively connected to the surface wiring of the second base body (25) by wire bonding, and are electrically connected to each other through metal vias inside the second base body (25); The first base body (24), the second base body (25) and the bottom plate (28) are connected and signals are transmitted through solder balls (27), and the internal cavities of the first base body (24) and the second base body (25) are partially sealed through an inner cover plate (26); the optical fiber (21) is welded to the tube shell (29), and the tube shell (29) is welded to the bottom plate (28) to form a co-packaged module (9); The co-packaged module (9) is electrically connected to an external electrical signal via a solder ball (27); the co-packaged module (9), a digitally controlled optical delay device (7) and a laser (8) are welded on the same printed circuit board, optical signals are connected via an optical fiber (21), and electrical signals are connected via a bottom solder ball (27) and wiring inside the printed circuit board.

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