PCB (printed circuit board) thick copper circuit resistance welding processing device

Abstract

The invention discloses a PCB (printed circuit board) thick copper circuit resistance welding processing device, and particularly relates to the technical field of PCB processing, the PCB thick copper circuit resistance welding processing device comprises a base, a resistance welding ink spraying chamber arranged at the top of the base, a curing bin, a drying bin and an ultraviolet generator arranged at the top of the curing bin, and one side of the curing bin is provided with a central processing unit and a heating mechanism; one side of the curing bin is provided with a central processing unit, the central processing unit is used for uniformly dividing the pcb entering the curing bin into a plurality of areas, the heating mechanism is used for increasing the temperature of each area of the pcb, the other side of the curing bin is provided with a cooling mechanism, and the cooling mechanism is used for reducing the temperature of each area of the pcb; the system further comprises a thermal gradient acquisition module and a temperature acquisition module. According to the invention, the temperature of each area of the pcb is monitored in real time and accurately adjusted, so that the problem of inconsistent ultraviolet curing effect caused by non-uniform temperature in the production process is solved, uniform curing of a coating is realized, and the product quality and reliability are improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board processing, and more specifically to a device for processing thick copper circuit soldering resistance of PCB board. Background Art

[0002] PCB (printed circuit board) is the basic carrier of electronic components, used to support and connect various electronic components and realize electrical connection. It is usually composed of insulating material and conductive circuit layer, and the conductive circuit layer forms a circuit pattern on the PCB board through etching and other processes. Thick copper circuit of PCB refers to a relatively thick copper wire circuit formed by a specific process on the copper layer of PCB board, which is usually used to carry large current or meet the requirements of high power transmission. Since these thick copper circuits have low resistance, they can effectively reduce signal loss and heat accumulation, and are widely used in high-frequency and high-power electronic devices. However, the surface finish and uniformity of thick copper circuits are poor, and they are easily affected by the external environment, resulting in problems such as oxidation or corrosion on the circuit surface. Therefore, in order to improve the long-term reliability and stability of the circuit board, solder mask processing is required on the thick copper circuit. The solder mask is a non-conductive protective layer, which is usually coated on the copper circuit surface of the PCB board with solder mask ink, which can effectively isolate moisture and pollutants in the air, prevent oxidation or corrosion of the copper circuit, and prevent solder short circuit during welding to ensure the reliability of the circuit. Through solder mask processing, the stable performance of thick copper circuits can be guaranteed throughout the life cycle of electronic equipment, extending the service life of the product while improving electrical performance and anti-interference capabilities. Therefore, this processing technology is crucial.

[0003] Existing PCB thick copper circuit solder mask processing devices usually adopt a multi-step process to ensure that the solder mask layer can be evenly and firmly covered on the surface of the thick copper circuit. First, the device will send the PCB board into the processing area through an automated feeding system for pretreatment to remove oil, oxides and other impurities on the surface of the copper circuit to ensure good adhesion. Next, a high-precision spraying device or dipping device is used to evenly apply the solder mask ink to the surface of the copper circuit to form a thin and uniform protective layer. In this process, the equipment usually uses a temperature control system to accurately control the temperature during the spraying or dipping process to avoid the coating being too thick or too thin, and to ensure that the coating can be well cured and adhered. Then, the coated PCB board enters the UV curing area, and the solder mask ink is cured by ultraviolet irradiation to form a stable non-conductive protective layer. This process can effectively prevent the solder mask from being damaged during subsequent processing. Finally, the cured PCB board will be subsequently inspected and cleaned to ensure that the coating is uniform and defect-free, and will not affect subsequent welding and other processes. The entire process relies on a high-precision control system to ensure that every area of ​​the thick copper circuit is fully protected to avoid electrical performance problems caused by uneven solder mask.

[0004] The existing technology has the following deficiencies: During the solder mask processing of thick copper circuits on PCB boards, the PCB boards after spraying need to be cured by an ultraviolet (UV) curing system, but due to factors such as temperature fluctuations in the production environment or uneven heat dissipation of the equipment, the surface temperature of the PCB board may be uneven. Uneven temperature will lead to inconsistent UV curing effects, incomplete curing of ink in some areas, and over-curing in other areas due to excessively high temperatures. This is because in areas with lower temperatures, the ink curing reaction is incomplete, the coating is loose, easy to fall off or unable to provide effective solder mask protection; while in areas with higher temperatures, over-cured ink may become fragile and easy to peel off, affecting the electrical performance of the circuit. The existing device cannot effectively adjust the temperature uniformity during the curing process, resulting in significant differences in the quality of the coating, which further affects the subsequent welding and electrical connection performance, and may cause loose welding of electronic components, thereby reducing the overall reliability of the product, and may even cause problems such as oxidation and corrosion, which have a serious impact on the quality and performance of the final product.

[0005] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not constitute the prior art that is already known to one of ordinary skill in the art. Summary of the invention

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a PCB thick copper circuit solder resist processing device to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions: A solder resist processing device for thick copper circuits of a PCB board, comprising a base, a solder resist ink spraying chamber arranged on the top of the base, a curing chamber and a drying chamber, and an ultraviolet generator arranged on the top of the curing chamber, a central processing unit and a heating mechanism are arranged on one side of the curing chamber, the central processing unit is used to evenly divide the PCB board entering the curing chamber into a plurality of areas, the heating mechanism is used to increase the temperature of each area of ​​the PCB board, and a cooling mechanism is arranged on the other side of the curing chamber, the cooling mechanism is used to reduce the temperature of each area of ​​the PCB board; Also includes: The thermal gradient acquisition module is arranged on the inner wall of the curing chamber, and is used to obtain the average temperature gradient of each area of ​​the PCB board and the adjacent areas in real time, and generate the temperature gradient variation coefficient of each area of ​​the PCB board through the central processor; The temperature acquisition module is arranged on the inner wall of the curing chamber, and is used to obtain the actual temperature of each area of ​​the PCB board in real time, and generate the temperature change index of each area of ​​the PCB board through the central processor; The temperature gradient variation coefficient and temperature variation index of each area of ​​the generated PCB board are comprehensively analyzed by the central processing unit to generate the uniform evaluation coefficient of each area of ​​the PCB board, and the uniform evaluation coefficient standard deviation is generated after the generation, and the generated uniform evaluation coefficient standard deviation is compared with the preset uniform evaluation coefficient standard deviation threshold, and the surface temperature of the PCB board is judged whether it is uniform according to the comparison result; When it is determined that the surface temperature of the PCB is uneven, a preset uniformity evaluation coefficient threshold interval is determined, and after determination, it is compared with the uniformity evaluation coefficient of each area of ​​the PCB. According to the comparison result, the various areas of the PCB are divided into a high-temperature area, a normal area and a low-temperature area, and according to the division result, the heating mechanism and the cooling mechanism are controlled to heat up and cool down the low-temperature area and the high-temperature area respectively.

[0008] Preferably, the temperature raising mechanism comprises a first load-bearing plate, a first slide rail, a first main air cylinder, a first main telescopic rod, a first slide plate, a first auxiliary air cylinder, a first auxiliary telescopic rod, a first fixed block, an electric heater, a first gas transmission pump, a first gas transmission pipe and a hot air nozzle; one side of the first load-bearing plate is fixedly connected to one side of the curing chamber, the top of the first load-bearing plate is fixedly connected to the bottom of the first slide rail, the output end of the first main air cylinder is transmission-connected to one end of the first main telescopic rod, the other end of the first main telescopic rod is fixedly connected to one side of the first slide plate, the outer wall of the first slide plate is slidably connected to the inner wall of the first slide rail, and the top of the first slide plate is fixedly connected to the inner wall of the first slide rail. The first auxiliary cylinder is fixedly connected to the bottom of the first auxiliary cylinder, the output end of the first auxiliary cylinder is transmission-connected to one end of the first auxiliary telescopic rod, the other end of the first auxiliary telescopic rod is fixedly connected to one side of the first fixed block, the bottom of the electric heater and the bottom of the first gas transmission pump are both fixedly connected to the top of the curing chamber, the output port of the electric heater is fixedly connected to the input port of the first gas transmission pump through a gas pipe, the output port of the first gas transmission pump is fixedly connected to the input port of the first gas transmission pipe, the output port of the first gas transmission pipe is fixedly connected to the input port of the hot gas nozzle, and the outer wall of the hot gas nozzle is fixedly connected to the inner wall of the first fixed block.

[0009] Preferably, the cooling mechanism includes a second load-bearing plate, a second slide rail, a second main air cylinder, a second main telescopic rod, a second slide plate, a second auxiliary air cylinder, a second auxiliary telescopic rod, a second fixed block, an air-cooled cooler, a second gas transmission pump, a second gas transmission pipe and a cold air nozzle; one side of the second load-bearing plate is fixedly connected to the other side of the curing bin, the top of the second load-bearing plate is fixedly connected to the bottom of the second slide rail, the output end of the second main air cylinder is transmission-connected to one end of the second main telescopic rod, the other end of the second main telescopic rod is fixedly connected to one side of the second slide plate, the outer wall of the second slide plate is slidably connected to the inner wall of the second slide rail, and the top of the second slide plate is fixedly connected to the outer wall of the second slide plate. The air-cooled cooler is fixedly connected to the bottom of the second sub-cylinder, the output end of the second sub-cylinder is transmission-connected to one end of the second telescopic rod, the other end of the second telescopic rod is fixedly connected to one side of the second fixed block, the bottom of the air-cooled cooler and the bottom of the second gas transfer pump are both fixedly connected to the top of the curing chamber, the output port of the air-cooled cooler is fixedly connected to the input port of the second gas transfer pump through a gas pipe, the output port of the second gas transfer pump is fixedly connected to the input port of the second gas transfer pipe, the output port of the second gas transfer pipe is fixedly connected to the input port of the cold air nozzle, and the outer wall of the cold air nozzle is fixedly connected to the inner wall of the second fixed block.

[0010] Preferably, the output end of the central processing unit is electrically connected to the input end of the first master cylinder, the input end of the first auxiliary cylinder, the input end of the electric heater, the input end of the first gas transfer pump, the input end of the second master cylinder, the input end of the second auxiliary cylinder, the input end of the air-cooled cooler and the input end of the second gas transfer pump, respectively, and the output end and input end of the thermal gradient acquisition module and the output end and input end of the temperature acquisition module are electrically connected to the input end and output end of the central processing unit, respectively.

[0011] Preferably, the acquisition logic of the temperature gradient variation coefficient of each area of ​​the PCB board is: S1. The average temperature gradient of each area and adjacent areas of the PCB board at different times in time T is obtained through the thermal gradient acquisition module, and calibrated as , Indicates that within T time Time PCB board The average temperature gradient between a region and its adjacent regions is , , and are all positive integers; S2. Calculate the temperature gradient variation coefficient of each area of ​​the PCB board. The calculation expression is: In the formula, For PCB board The temperature gradient variation coefficient of the region.

[0012] Preferably, the logic for obtaining the temperature variation index of each area of ​​the PCB is: S1. The actual temperature of each area of ​​the PCB board at different times within T time is obtained through the temperature acquisition module, and calibrated as , Indicates that within T time Time PCB board The actual temperature of the area, , , and are all positive integers; S2. Calculate the temperature change index of each area of ​​the PCB board. The calculation expression is: In the formula, For PCB board The temperature variation index of a region.

[0013] Preferably, the expression formula of the uniform evaluation coefficient of each area of ​​the PCB board is: Formula analysis is performed through the central processing unit according to the formula: In the formula, For PCB board The uniform evaluation coefficient of the region, and are the preset proportional coefficients of the temperature gradient variation coefficient and the temperature variation index of each area of ​​the PCB board, and and All are greater than 0; Calculate the standard deviation of the uniform evaluation coefficient according to the formula: In the formula, is the standard deviation of uniform evaluation coefficient; The standard deviation of the uniform evaluation coefficient generated The pre-set uniform evaluation coefficient standard deviation threshold Compare and judge whether the surface temperature of the PCB board is uniform according to the comparison results. The specific comparison analysis is as follows: when When the temperature of the PCB surface is uniform; when When the temperature of the PCB surface is not uniform.

[0014] Preferably, when it is determined that the surface temperature of the PCB is uneven, a preset uniformity evaluation coefficient threshold interval is determined. , and after determining the uniform evaluation coefficient of each area of ​​the PCB board Compare and divide the various areas of the PCB into high temperature area, normal area and low temperature area according to the comparison results, and control the heating mechanism and cooling mechanism to heat up and cool down the low temperature area and high temperature area respectively according to the division results. The specific comparison analysis and division are as follows: like , the area is divided into a low-temperature area, the central processing unit generates a low-temperature signal, and transmits the low-temperature signal to the first master cylinder, the first auxiliary cylinder, the electric heater and the first gas transmission pump respectively. After receiving the low-temperature signal, the first master cylinder, the first auxiliary cylinder, the electric heater and the first gas transmission pump control the temperature raising mechanism to raise the temperature of all areas divided into the low-temperature area; like , the area is divided into a normal area, the central processing unit generates a normal signal, and transmits the generated normal signal to the first master cylinder, the first auxiliary cylinder, the electric heater, the first gas transmission pump, the second master cylinder, the second auxiliary cylinder, the air-cooled cooler and the second gas transmission pump respectively. After receiving the normal signal, the first master cylinder, the first auxiliary cylinder, the electric heater and the first gas transmission pump do not control the heating mechanism to perform heating work. After receiving the normal signal, the second master cylinder, the second auxiliary cylinder, the air-cooled cooler and the second gas transmission pump do not control the cooling mechanism to perform cooling work. like , the area is divided into a high-temperature area, the central processing unit generates a high-temperature signal, and transmits the high-temperature signal to the second master cylinder, the second auxiliary cylinder, the air-cooled cooler and the second gas transmission pump respectively. After the second master cylinder, the second auxiliary cylinder, the air-cooled cooler and the second gas transmission pump receive the high-temperature signal, they control the cooling mechanism to cool down all areas divided into high-temperature areas.

[0015] Technical effects and advantages of the present invention: 1. The present invention combines the temperature gradient variation coefficient and the temperature variation index of each area of ​​the PCB board, so that the central processing unit can calculate the temperature fluctuation of each area in real time and accurately monitor the temperature uniformity of the entire PCB board. The temperature gradient variation coefficient reflects the degree of fluctuation of the temperature difference between different areas, while the temperature variation index measures the stability of the temperature change in a certain area within a certain period of time. Combining these two indicators, the central processing unit can generate a heating or cooling signal in time under the condition of uneven temperature, and make precise adjustments through the heating mechanism and the cooling mechanism. In this way, the problem of incomplete curing in the low-temperature area or excessive curing in the high-temperature area can be effectively avoided, the uniformity of the PCB board coating can be ensured, and then the effect of ultraviolet curing can be ensured, thereby improving the coating quality and stability of the entire product.

[0016] 2. In the process of heating up and cooling down, the heating mechanism and the cooling mechanism of the present invention work together through multiple components to accurately adjust the temperature. The heating mechanism uses the first main cylinder, the first auxiliary cylinder, the electric heater, the hot air nozzle and other components to enable the low-temperature area to heat up quickly; while the cooling mechanism uses the air-cooled cooler, the second gas transmission pump, the cold air nozzle and other components to enable the high-temperature area to be effectively cooled. The two work together to adjust the temperature of each area in real time according to the instructions of the central processing unit to ensure the stability of temperature control. Through this refined temperature control adjustment mechanism, not only the curing effect of each area is optimized, but also product defects caused by excessive temperature differences are avoided, thereby improving the overall efficiency and product quality of the production line.

[0017] 3. The present invention can automatically determine the area with uneven temperature and adjust the heating and cooling operations in real time through intelligent analysis and control of the central processing unit. The whole process does not require human intervention, and each step from temperature monitoring, data analysis to signal transmission control can be completed automatically. This not only improves production efficiency, but also ensures the continuous stability of temperature uniformity throughout the production process. In addition, based on the temperature gradient variation coefficient and the temperature variation index, the system can flexibly adjust the temperature control strategy according to different production conditions to ensure that each PCB board is always in the optimal temperature state during the entire processing process. This highly automated and intelligent control mechanism greatly reduces the error of human operation, makes the production process more accurate and efficient, and further improves the consistency and quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings; Figure 1 A schematic diagram of the three-dimensional structure of a PCB thick copper circuit solder resist processing device proposed by the present invention; Figure 2 A schematic diagram of the top structure of a PCB thick copper circuit solder resist processing device proposed by the present invention; Figure 3 A schematic diagram of the internal structure of a curing chamber of a PCB thick copper circuit solder resist processing device proposed by the present invention; Figure 4 A schematic diagram of the structure of a heating mechanism of a PCB thick copper circuit solder resist processing device proposed by the present invention; Figure 5 This is a schematic diagram of the installation structure of the first fixed block and the hot air nozzle of a PCB thick copper circuit solder mask processing device proposed by the present invention; Figure 6 This is a schematic diagram of the installation structure of the second fixed block and the cold air nozzle of a PCB thick copper circuit solder mask processing device proposed by the present invention; Figure 7A schematic diagram of the cooling mechanism structure of a PCB thick copper circuit solder resist processing device proposed by the present invention; Figure 8 The present invention provides a schematic diagram of a module of a PCB thick copper circuit solder resist processing device.

[0019] In the figure: 1, base; 2, solder mask ink spraying room; 3, curing chamber; 4, ultraviolet generator; 5, drying chamber; 6, central processing unit; 7, heating mechanism; 701, first load-bearing plate; 702, first slide rail; 703, first main cylinder; 704, first main telescopic rod; 705, first slide plate; 706, first auxiliary cylinder; 707, first auxiliary telescopic rod; 708, first fixed block; 709, electric heater; 710, first gas transmission pump; 711, first gas Transmission pipe; 712, hot air nozzle; 8, cooling mechanism; 801, second load-bearing plate; 802, second slide rail; 803, second main cylinder; 804, second main telescopic rod; 805, second slide plate; 806, second secondary cylinder; 807, second secondary telescopic rod; 808, second fixed block; 809, air-cooled cooler; 810, second gas transmission pump; 811, second gas transmission pipe; 812, cold air nozzle; 9, thermal gradient acquisition module; 10, temperature acquisition module. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] like Figure 1-8 As shown, a PCB thick copper circuit solder mask processing device comprises a base 1, a solder mask ink spray chamber 2 arranged on the top of the base 1, a curing chamber 3 and a drying chamber 5, and an ultraviolet generator 4 arranged on the top of the curing chamber 3. A central processing unit 6 and a heating mechanism 7 are arranged on one side of the curing chamber 3. The central processing unit 6 is used to evenly divide the PCB board entering the curing chamber 3 into a plurality of areas. The heating mechanism 7 is used to increase the temperature of each area of ​​the PCB board. A cooling mechanism 8 is arranged on the other side of the curing chamber 3. The cooling mechanism 8 is used to reduce the temperature of each area of ​​the PCB board. In order to realize that the PCB board entering the curing chamber 3 is evenly divided into several areas, the central processing unit 6 can perform regional division by combining image processing technology with temperature data. Specifically, the central processing unit 6 can use a high-resolution camera or infrared thermal imager installed in the curing chamber 3 to obtain a real-time image or temperature distribution diagram of the PCB board, and divide the PCB board into multiple areas through image recognition algorithms such as edge detection and regional segmentation. In addition, combined with the real-time data of the temperature sensor array, the central processing unit 6 can further divide the area according to the temperature difference through a data clustering algorithm such as K-means clustering. This method is not only based on physical location, but also can optimize the regional division according to the actual temperature distribution, thereby ensuring the accuracy of temperature control, avoiding the temperature of the local area being too high or too low, and improving the stability and uniformity of processing. The specific implementation method is not specifically limited here, and can be selected according to actual needs.

[0022] Also includes: The thermal gradient acquisition module 9 is arranged on the inner wall of the curing chamber 3, and is used to obtain the average temperature gradient of each area of ​​the PCB board and the adjacent areas in real time, and generate the temperature gradient variation coefficient of each area of ​​the PCB board through the central processor 6; It should be noted that the thermal gradient acquisition module 9 can be an infrared thermal imager or other equipment that can obtain the average temperature gradient of each area and adjacent areas of the PCB in real time. The thermal gradient acquisition module 9 is not specifically limited here and can be selected according to actual needs.

[0023] The temperature acquisition module 10 is arranged on the inner wall of the curing chamber 3, and is used to obtain the actual temperature of each area of ​​the PCB in real time, and generate the temperature change index of each area of ​​the PCB through the central processor 6; It should be noted that the temperature acquisition module 10 can be a laser temperature sensor or other equipment that can obtain the actual temperature of each area of ​​the PCB in real time. The temperature acquisition module 10 is not specifically limited here and can be selected according to actual needs.

[0024] The central processor 6 performs a comprehensive analysis on the temperature gradient variation coefficient and the temperature variation index of each area of ​​the PCB board, generates a uniform evaluation coefficient for each area of ​​the PCB board, and analyzes it after generation to generate a uniform evaluation coefficient standard deviation, and compares the generated uniform evaluation coefficient standard deviation with a preset uniform evaluation coefficient standard deviation threshold, and determines whether the surface temperature of the PCB board is uniform according to the comparison result; When it is determined that the surface temperature of the PCB is uneven, a preset uniform evaluation coefficient threshold interval is determined, and after determination, it is compared with the uniform evaluation coefficient of each area of ​​the PCB. According to the comparison result, each area of ​​the PCB is divided into a high-temperature area, a normal area and a low-temperature area, and according to the division result, the heating mechanism 7 and the cooling mechanism 8 are controlled to heat up and cool down the low-temperature area and the high-temperature area respectively.

[0025] In this embodiment, the heating mechanism 7 includes a first load-bearing plate 701, a first slide rail 702, a first main cylinder 703, a first main telescopic rod 704, a first slide plate 705, a first auxiliary cylinder 706, a first auxiliary telescopic rod 707, a first fixed block 708, an electric heater 709, a first gas transmission pump 710, a first gas transmission pipe 711 and a hot air nozzle 712. One side of the first load-bearing plate 701 is fixedly connected to one side of the curing chamber 3, the top of the first load-bearing plate 701 is fixedly connected to the bottom of the first slide rail 702, the output end of the first main cylinder 703 is transmission-connected to one end of the first main telescopic rod 704, the other end of the first main telescopic rod 704 is fixedly connected to one side of the first slide plate 705, and the outer wall of the first slide plate 705 slides with the inner wall of the first slide rail 702. The top of the first slide plate 705 is fixedly connected to the bottom of the first sub-cylinder 706, the output end of the first sub-cylinder 706 is transmission-connected to one end of the first sub-telescopic rod 707, the other end of the first sub-telescopic rod 707 is fixedly connected to one side of the first fixed block 708, the bottom of the electric heater 709 and the bottom of the first gas transmission pump 710 are both fixedly connected to the top of the curing chamber 3, the output port of the electric heater 709 is fixedly connected to the input port of the first gas transmission pump 710 through a gas pipe, the output port of the first gas transmission pump 710 is fixedly connected to the input port of the first gas transmission pipe 711, the output port of the first gas transmission pipe 711 is fixedly connected to the input port of the hot air nozzle 712, and the outer wall of the hot air nozzle 712 is fixedly connected to the inner wall of the first fixed block 708.

[0026] The heating mechanism 7 is used to increase the temperature of each area of ​​the PCB board, and the specific implementation method is as follows: First, the first load-bearing plate 701 is fixed on one side of the curing chamber 3 to provide stable support for the entire heating mechanism 7. Through the sliding cooperation of the first slide rail 702 and the first slide plate 705, the heating mechanism 7 can accurately adjust the position of the first fixed block 708, and then adjust the position of the hot air nozzle 712. The first main cylinder 703 and the first auxiliary cylinder 706 can control the movement of the first slide plate 705 by controlling the first main telescopic rod 704 and the first auxiliary telescopic rod 707 to extend and retract, so that the hot air nozzle 712 can perform uniform hot air spraying above different areas of the PCB board. At the same time, the electric heater 709 heats the air, and the first gas transmission pump 710 and the first gas transmission pipe 711 transport the hot air to the hot air nozzle 712, and the hot air is sprayed to various areas of the PCB board through the hot air nozzle 712, thereby achieving local heating. Through this system, the heating mechanism 7 can accurately adjust the temperature of different areas to ensure that the surface temperature of the entire PCB board is uniform.

[0027] The significance of this arrangement is that such a heating mechanism 7 is arranged to ensure accurate temperature control, avoiding the situation where the local temperature is too high or too low that may occur in the traditional heating method. Through sliding control and airflow adjustment, the hot air nozzle 712 can flexibly cover the entire PCB board surface and provide uniform heat. In addition, the use of the electric heater 709 and the first gas transmission pump 710 can more effectively control the air flow and temperature, making the temperature regulation more accurate and stable. This design not only improves the accuracy of temperature control, but also can adapt to PCB boards of different sizes, shapes and layouts, optimizes the uneven temperature distribution during the solder mask processing, and ensures the quality and stability of coating curing.

[0028] In this embodiment, the cooling mechanism 8 includes a second load-bearing plate 801, a second slide rail 802, a second main cylinder 803, a second main telescopic rod 804, a second slide plate 805, a second auxiliary cylinder 806, a second auxiliary telescopic rod 807, a second fixed block 808, an air-cooled cooler 809, a second gas transmission pump 810, a second gas transmission pipe 811 and a cold air nozzle 812. One side of the second load-bearing plate 801 is fixedly connected to the other side of the curing chamber 3, the top of the second load-bearing plate 801 is fixedly connected to the bottom of the second slide rail 802, the output end of the second main cylinder 803 is transmission-connected to one end of the second main telescopic rod 804, the other end of the second main telescopic rod 804 is fixedly connected to one side of the second slide plate 805, and the outer wall of the second slide plate 805 slides with the inner wall of the second slide rail 802. The top of the second slide plate 805 is fixedly connected to the bottom of the second sub-cylinder 806, the output end of the second sub-cylinder 806 is transmission-connected to one end of the second sub-telescopic rod 807, the other end of the second sub-telescopic rod 807 is fixedly connected to one side of the second fixed block 808, the bottom of the air-cooled cooler 809 and the bottom of the second gas transfer pump 810 are both fixedly connected to the top of the curing chamber 3, the output port of the air-cooled cooler 809 is fixedly connected to the input port of the second gas transfer pump 810 through a gas pipe, the output port of the second gas transfer pump 810 is fixedly connected to the input port of the second gas transfer pipe 811, the output port of the second gas transfer pipe 811 is fixedly connected to the input port of the cold air nozzle 812, and the outer wall of the cold air nozzle 812 is fixedly connected to the inner wall of the second fixed block 808.

[0029] The cooling mechanism 8 is used to reduce the temperature of each area of ​​the PCB board, and the specific implementation method is as follows: the second load-bearing plate 801 provides stable support for the cooling mechanism 8 and is fixedly connected to one side of the curing chamber 3. The sliding cooperation of the second slide rail 802 and the second slide plate 805 allows the second fixed block 808 to move above the PCB board, thereby controlling the position of the cold air nozzle 812. The second main cylinder 803 and the second secondary cylinder 806 drive the movement of the second slide plate 805 through the second main telescopic rod 804 and the second secondary telescopic rod 807, adjust the position of the cold air nozzle 812, and ensure that it can cover different areas of the PCB board. The cooling process cools the external air through the air-cooled cooler 809, and then the cold air is transported to the cold air nozzle 812 through the second gas transmission pump 810 and the second gas transmission pipe 811, and the cold air is sprayed to different areas of the PCB board through the cold air nozzle 812 to reduce the temperature. Through this system, the cooling mechanism 8 can accurately adjust the temperature of different areas to ensure the uniformity and accuracy of temperature control.

[0030] The significance of this arrangement is that the arrangement of the cooling mechanism 8 can effectively solve the problem of uneven surface temperature of the PCB board, especially when it is necessary to quickly reduce the temperature of certain areas, accurate regional adjustment can be achieved through sliding control. The flexible position adjustment of the cold air nozzle 812 ensures uniform temperature distribution, and through the cooperation of the air-cooled cooler 809 and the second gas transmission pump 810, stable and efficient cold air delivery can be provided between different areas, avoiding the shortcomings of traditional cooling methods, such as overcooling or uneven cold air flow. In this way, the cooling mechanism can achieve efficient and uniform temperature control, making the surface temperature control of the entire PCB board more accurate, thereby improving the quality and stability of the solder mask processing and avoiding the influence of local overheating or overcooling on the curing of the coating.

[0031] In this embodiment, the output end of the central processing unit 6 is electrically connected to the input end of the first main cylinder 703, the input end of the first auxiliary cylinder 706, the input end of the electric heater 709, the input end of the first gas transfer pump 710, the input end of the second main cylinder 803, the input end of the second auxiliary cylinder 806, the input end of the air-cooled cooler 809 and the input end of the second gas transfer pump 810, and the output end and input end of the thermal gradient acquisition module 9 and the output end and input end of the temperature acquisition module 10 are electrically connected to the input end and output end of the central processing unit 6, respectively.

[0032] It should be noted that electrical connection refers to the process of transmitting electric current from one part of an electronic device or circuit to another part through an electrically conductive material or a conductive element. This connection is a key component of the operation of electronic devices and circuits. It ensures the effective transmission and connection of electron flow in electronic devices. Electrical connection can be made using wires. The method of electrical connection between the central processing unit 6 and the first main cylinder 703, the first auxiliary cylinder 706, the electric heater 709, the first gas transfer pump 710, the second main cylinder 803, the second auxiliary cylinder 806, the air-cooled cooler 809, the second gas transfer pump 810, the thermal gradient acquisition module 9 and the temperature acquisition module 10 is not specifically limited and can be selected according to actual needs.

[0033] During the solder mask processing of thick copper lines on PCB boards, the PCB boards after spraying need to be cured by an ultraviolet UV curing system, but due to factors such as temperature fluctuations in the production environment or uneven heat dissipation of the equipment, the surface temperature of the PCB board may be uneven. Uneven temperature will lead to inconsistent UV curing effects, incomplete curing of the ink in some areas, and over-curing in other areas due to excessively high temperatures. This is because in areas with lower temperatures, the ink curing reaction is incomplete, the coating is loose, easy to fall off or unable to provide effective solder mask protection; while in areas with higher temperatures, over-cured ink may become fragile and easy to peel off, affecting the electrical performance of the circuit. Existing devices cannot effectively adjust the temperature uniformity during the curing process, resulting in significant differences in the quality of the coating, which further affects the subsequent welding and electrical connection performance, and may cause loose welding of electronic components, thereby reducing the overall reliability of the product, and may even cause problems such as oxidation and corrosion, which have a serious impact on the quality and performance of the final product. Therefore, in order to solve this problem, it is necessary to detect in real time whether the surface temperature of the PCB board is uniform, and when it is determined that the surface temperature of the PCB board is uneven, determine the high temperature area, normal area and low temperature area, and control the heating mechanism 7 and the cooling mechanism 8 to heat up and cool down the low temperature area and the high temperature area respectively, which can ensure that the temperature of the entire board surface is uniform and optimize the ultraviolet curing effect. This process not only improves the curing quality of the ink coating, ensures the integrity and stability of the coating, but also prevents the coating from falling off, cracking and other problems caused by uneven temperature, thereby improving the electrical performance and welding reliability of the PCB board, reducing quality problems such as oxidation and corrosion caused by uneven temperature, and ultimately ensuring the overall reliability and performance stability of the product.

[0034] In this embodiment, the temperature gradient variation coefficient of each area of ​​the PCB board refers to the degree of change in the temperature difference between each area of ​​the PCB board and the adjacent area within the T time. Specifically, the temperature gradient variation coefficient is a quantification of the temperature difference change between adjacent areas, reflecting the volatility of the temperature gradient within a time period. The value of the temperature gradient variation coefficient of each area of ​​the PCB board means the stability of the regional temperature distribution: the larger the value, the greater the temperature difference between the area and the adjacent area, the stronger the temperature non-uniformity, which may cause the temperature to rise too high or too low during the curing process; the smaller the value, the more stable the temperature change in the area, and the uniform temperature distribution, which helps to ensure the uniformity of the UV curing process and the coating quality.

[0035] The logic for obtaining the temperature gradient variation coefficient of each area of ​​the PCB board is: S1, obtain the average temperature gradient of each area and adjacent areas of the PCB board at different times in time T through the thermal gradient acquisition module 9, and calibrate it as , Indicates that within T time Time PCB board The average temperature gradient between a region and its adjacent regions is , , and are all positive integers; S2. Calculate the temperature gradient variation coefficient of each area of ​​the PCB board. The calculation expression is: In the formula, For PCB board The temperature gradient variation coefficient of the region.

[0036] In this embodiment, the temperature variation index of each area of ​​the PCB board is an indicator used to measure the degree of temperature fluctuation of each area of ​​the PCB board within the time T. It reflects the instability of temperature by calculating the temperature variation of each area relative to the initial time within the time period. The value of the temperature variation index of each area of ​​the PCB board reflects the amplitude of temperature variation in the area: the larger the value, the more drastic the temperature fluctuation in the area, the larger the temperature variation, which may lead to uneven temperature, thus affecting the effect of the curing process; the smaller the value, the smaller the temperature variation in the area, the more stable the temperature fluctuation, which is conducive to maintaining the uniformity of temperature control and ensuring the stability and consistency of the ink curing process.

[0037] The logic for obtaining the temperature change index of each area of ​​the PCB board is: S1. The actual temperature of each area of ​​the PCB board at different times within the time T is obtained through the temperature acquisition module 10, and calibrated as , Indicates that within T time Time PCB board The actual temperature of the area, , , and are all positive integers; S2. Calculate the temperature change index of each area of ​​the PCB board. The calculation expression is: In the formula, For PCB board The temperature variation index of a region.

[0038] In this embodiment, the expression formula of the uniform evaluation coefficient of each area of ​​the PCB board is: Will and After dimensionless processing, the central processing unit 6 performs a formula analysis according to the formula: In the formula, For PCB board The uniform evaluation coefficient of the region, and are the preset proportional coefficients of the temperature gradient variation coefficient and the temperature variation index of each area of ​​the PCB board, and and All are greater than 0; From the calculated expression, it can be seen that the greater the temperature gradient variation coefficient and temperature variation index of each area of ​​the PCB board, the greater the uniformity evaluation coefficient of each area of ​​the PCB board. the bigger it is; It should be noted that dimensionless is a process of expressing physical quantities in dimensionless form. This method can eliminate the influence of units on physical problems, making the problem more concise and universal; the preset proportional coefficients of the temperature gradient change coefficient and temperature change index of each area of ​​the PCB board and In order to more flexibly adapt to different working conditions and environmental changes in actual monitoring, these deviation coefficients can be adjusted according to specific circumstances to improve the performance and applicability of the monitoring system.

[0039] Calculate the standard deviation of the uniform evaluation coefficient according to the formula: In the formula, is the standard deviation of uniform evaluation coefficient; The standard deviation of the uniform evaluation coefficient generated The pre-set uniform evaluation coefficient standard deviation threshold Compare and judge whether the surface temperature of the PCB board is uniform according to the comparison results. The specific comparison analysis is as follows: when When the temperature of the PCB surface is uniform; This situation means that the temperature distribution of the entire PCB is uniform, the temperature difference between different areas is small, and the temperature fluctuation is controlled within an ideal range. This shows that the amplitude of temperature change is very small, the temperature change trend of all areas is relatively consistent, and the curing effect of the ink during UV curing will be more uniform. The quality of coating curing is guaranteed, avoiding the problem of incomplete or over-curing of local curing, thereby ensuring the protective performance of the solder mask layer and improving the reliability of subsequent welding and electrical connections.

[0040] when When the temperature of the PCB surface is not uniform.

[0041] This situation means that there is a significant non-uniformity in the surface temperature of the PCB board. The temperature in some areas may be higher, resulting in over-curing of the coating during the UV curing process, which may make the ink brittle and peel off; while the temperature in other areas is lower, the ink may not be fully cured, resulting in a loose coating and failure to provide effective solder mask protection. This temperature non-uniformity will directly affect the subsequent welding quality, increase the risk of weak welding, and may cause the performance of electronic components to decline. In severe cases, it may also cause oxidation and corrosion, affecting the long-term stability and reliability of the product.

[0042] The pre-set standard deviation threshold of the uniformity evaluation coefficient can be determined by a variety of methods, mainly depending on the actual production process The demand for temperature uniformity and the accuracy of the equipment. First, it can be analyzed based on historical production data, and data on the temperature uniformity of PCB boards under different production conditions such as different equipment, ambient temperature, etc. can be collected. Through statistical analysis of these data, a reasonable standard deviation range can be obtained. Secondly, the threshold can be determined through experimental verification, such as simulating different temperature fluctuations in multiple experimental batches, observing the coating curing effect, and gradually adjusting the standard deviation threshold until a standard that can ensure the quality of the coating without being too strict is found. In addition, considering the stability of equipment and processes, a reasonable threshold can also be set in combination with quality control standards and industry standards to ensure that it can meet the quality requirements of the product and have a certain tolerance range to cope with the inevitable temperature fluctuations in the production process. Through these methods, a suitable standard deviation threshold can be finally obtained to determine whether the temperature uniformity meets the requirements.

[0043] The purpose of evaluating whether the surface temperature of the PCB board is uniform is to ensure the accuracy of temperature control and the consistency of coating quality during the entire processing process by judging whether the standard deviation of the uniformity evaluation coefficient is less than or greater than the preset threshold. Uneven temperature will directly affect the UV curing effect, resulting in incomplete or over-curing of the coating, which in turn affects the protective function of the solder mask and subsequent welding performance. By calculating the standard deviation, the amplitude of temperature fluctuations can be quantified to reflect the stability of temperature control in different areas. When the standard deviation is small, it indicates that the temperature fluctuation is small, the temperature control is uniform, and the ink curing effect is good; when the standard deviation is large, it indicates that there is uneven temperature, which may lead to unstable processing quality. This method can identify temperature problems in real time and accurately through scientific mathematical analysis, and provide the necessary basis for adjustment, thereby ensuring the quality and performance of the product.

[0044] In this embodiment, when it is determined that the surface temperature of the PCB is uneven, a preset uniformity evaluation coefficient threshold interval is determined. , and after determining the uniform evaluation coefficient of each area of ​​the PCB board Compare and divide each area of ​​the PCB into high temperature area, normal area and low temperature area according to the comparison results, and control the heating mechanism 7 and cooling mechanism 8 to heat up and cool down the low temperature area and the high temperature area respectively according to the division results. The specific comparison analysis and division are as follows: like , the area is divided into a low temperature area, the central processor 6 generates a low temperature signal, and transmits the low temperature signal to the first main cylinder 703, the first auxiliary cylinder 706, the electric heater 709 and the first gas transmission pump 710 respectively. After receiving the low temperature signal, the first main cylinder 703, the first auxiliary cylinder 706, the electric heater 709 and the first gas transmission pump 710 control the temperature raising mechanism 7 to raise the temperature of all areas divided into the low temperature area; This division is to ensure that the lower temperature area can be heated in time, so as to avoid the problem of incomplete ink curing. Insufficient temperature curing in the low temperature area may cause the coating to be loose and unable to provide effective solder mask protection. Such areas must be heated by the heating mechanism 7 to ensure that the ink reacts completely during the ultraviolet curing process, thereby ensuring the quality of the coating and subsequent electrical properties. Therefore, the heating treatment of the low temperature area is the key to ensuring the temperature control uniformity and curing effect during the entire processing process.

[0045] The heating operation means that after receiving the low temperature signal, the first main cylinder 703, the first auxiliary cylinder 706, the electric heater 709 and the first gas transmission pump 710 will start to work together to increase the temperature. Specifically, the first main cylinder 703 and the first auxiliary cylinder 706 drive the first telescopic rod 704 and the first auxiliary telescopic rod 707 to move the first slide plate 705 and adjust the position of the first fixed block 708 to ensure that the hot air nozzle 712 is accurately aligned with the low temperature area. At the same time, the electric heater 709 heats the air, and the first gas transmission pump 710 sends the heated gas into the hot air nozzle 712 through the first gas transmission pipe 711, and sprays the hot air into the low temperature area. The entire heating process gradually increases the temperature of the low temperature area by precisely controlling the synergistic effect of each component until the temperature evenly reaches the required range, ensuring that the ink curing reaction is complete and improving the coating quality.

[0046] like , the area is divided into a normal area, the central processor 6 generates a normal signal, and transmits the generated normal signal to the first main cylinder 703, the first sub-cylinder 706, the electric heater 709, the first gas transmission pump 710, the second main cylinder 803, the second sub-cylinder 806, the air-cooled cooler 809 and the second gas transmission pump 810 respectively. After receiving the normal signal, the first main cylinder 703, the first sub-cylinder 706, the electric heater 709 and the first gas transmission pump 710 do not control the heating mechanism 7 to perform heating work. After receiving the normal signal, the second main cylinder 803, the second sub-cylinder 806, the air-cooled cooler 809 and the second gas transmission pump 810 do not control the cooling mechanism 8 to perform cooling work. This division means that the temperature fluctuation in this area is within the expected range, neither too high nor too low, the temperature distribution is uniform, and the ink curing effect is stable. For these normal areas, no additional heating or cooling operations are required because they are already in the ideal curing temperature range, which can ensure the stability and consistency of the coating. By keeping the temperature of these areas stable, coating problems caused by excessive heating or cooling are avoided, and energy waste is also reduced.

[0047] like , the area is divided into a high-temperature area, the central processing unit 6 generates a high-temperature signal, and transmits the high-temperature signal to the second main cylinder 803, the second auxiliary cylinder 806, the air-cooled cooler 809 and the second gas transmission pump 810 respectively. After the second main cylinder 803, the second auxiliary cylinder 806, the air-cooled cooler 809 and the second gas transmission pump 810 receive the high-temperature signal, they control the cooling mechanism 8 to cool down all areas divided into high-temperature areas.

[0048] This indicates that the temperature in this area is too high, which may cause the ink to overcure during the UV curing process, and the coating becomes fragile and may peel off, thus affecting subsequent welding and electrical performance. In order to solve this problem, the high temperature area needs to be cooled by the cooling mechanism 8 to ensure that the temperature of the curing process does not exceed the ideal range. By reducing the temperature of these areas, overcure of the ink can be avoided, the integrity and stability of the coating can be ensured, and the reliability of the final product can be improved.

[0049] The cooling operation means that after the second main cylinder 803, the second auxiliary cylinder 806, the air-cooled cooler 809 and the second gas transmission pump 810 receive the high temperature signal, the cooling operation will be started. Specifically, the second main cylinder 803 and the second auxiliary cylinder 806 drive the second telescopic rod 804 and the second auxiliary telescopic rod 807 to push the second slide plate 805 to move, and adjust the position of the second fixed block 808 so that the cold air nozzle 812 is aimed at the high temperature area. At the same time, the air-cooled cooler 809 will cool the external air, and the second gas transmission pump 810 will transport the cold air to the cold air nozzle 812 through the second gas transmission pipe 811, and spray the cold air to the high temperature area. In this way, the cooling mechanism 8 effectively reduces the temperature of the overheated area, avoids the problem of excessive curing of the ink due to excessive temperature, thereby ensuring the quality and stability of the coating, and optimizing subsequent welding and electrical performance.

[0050] The determination of the preset uniformity evaluation coefficient threshold interval can be carried out in a variety of ways. First, the relationship between temperature uniformity and coating quality can be analyzed through experimental data and historical production data. In multiple production batches, temperature data under different conditions are collected to observe its correlation with the coating curing effect, and a reasonable uniformity evaluation coefficient interval is obtained through statistical analysis. Secondly, simulation tests can be used to simulate the temperature changes of PCB boards under different environmental conditions, and the corresponding relationship between different temperature uniformity standards and coating quality can be evaluated experimentally to determine a threshold interval that meets production needs. In addition to experiments and simulations, industry standards and quality control specifications can also be referred to, and a preliminary threshold interval can be set in combination with the requirements of different processes, and through continuous debugging and optimization, it can be ensured that the threshold can meet the strict requirements for temperature uniformity and product quality in actual production. Ultimately, these data and analysis results will be combined with equipment performance, environmental fluctuations and production processes to determine the most suitable uniformity evaluation coefficient threshold interval to ensure stable product quality and avoid curing problems caused by uneven temperature.

[0051] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters in the formula are set by technicians in this field according to actual conditions.

[0052] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0053] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0054] In the several embodiments provided in the present application, it should be understood that the disclosed overall system, device and method can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another overall system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0055] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0056] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0057] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A PCB thick copper circuit solder mask processing device, comprising a base (1), a solder mask ink spray chamber (2) arranged on the top of the base (1), a curing chamber (3) and a drying chamber (5), and an ultraviolet generator (4) arranged on the top of the curing chamber (3), characterized in that: A central processing unit (6) and a heating mechanism (7) are provided on one side of the curing chamber (3); the central processing unit (6) is used to evenly divide the PCB board entering the curing chamber (3) into a plurality of areas; the heating mechanism (7) is used to increase the temperature of each area of ​​the PCB board; and a cooling mechanism (8) is provided on the other side of the curing chamber (3); the cooling mechanism (8) is used to reduce the temperature of each area of ​​the PCB board; Also includes: A thermal gradient acquisition module (9) is arranged on the inner wall of the curing chamber (3) and is used to acquire the average temperature gradient of each area of ​​the PCB board and adjacent areas in real time, and to generate the temperature gradient variation coefficient of each area of ​​the PCB board through the central processor (6); A temperature acquisition module (10) is arranged on the inner wall of the curing chamber (3) and is used to obtain the actual temperature of each area of ​​the PCB in real time and generate a temperature change index of each area of ​​the PCB through a central processor (6); A central processor (6) is used to comprehensively analyze the temperature gradient variation coefficient and the temperature variation index of each region of the PCB board, and a uniform evaluation coefficient of each region of the PCB board is generated. After the uniform evaluation coefficient standard deviation is generated, the uniform evaluation coefficient standard deviation is generated, and the generated uniform evaluation coefficient standard deviation is compared with a preset uniform evaluation coefficient standard deviation threshold value, and whether the surface temperature of the PCB board is uniform is determined according to the comparison result; When it is determined that the surface temperature of the PCB is uneven, a pre-set uniformity evaluation coefficient threshold interval is determined, and after determination, it is compared with the uniformity evaluation coefficients of various regions of the PCB. According to the comparison result, the various regions of the PCB are divided into a high temperature region, a normal region and a low temperature region. According to the division result, a heating mechanism (7) and a cooling mechanism (8) are controlled to perform heating and cooling operations on the low temperature region and the high temperature region, respectively.

2. A PCB thick copper circuit solder mask processing device according to claim 1, characterized in that: The temperature raising mechanism (7) comprises a first bearing plate (701), a first slide rail (702), a first main cylinder (703), a first main telescopic rod (704), a first slide plate (705), a first auxiliary cylinder (706), a first auxiliary telescopic rod (707), a first fixed block (708), an electric heater (709), a first gas transmission pump (710), a first gas transmission pipe (711) and a hot gas nozzle (712); one side of the first bearing plate (701) is fixedly connected to one side of the curing chamber (3); the top of the first bearing plate (701) is fixedly connected to the bottom of the first slide rail (702); the output end of the first main cylinder (703) is transmission-connected to one end of the first main telescopic rod (704); the other end of the first main telescopic rod (704) is fixedly connected to one side of the first slide plate (705); the outer wall of the first slide plate (705) is slidingly connected to the inner wall of the first slide rail (702); The first slide plate (705) is dynamically connected to the bottom of the first auxiliary cylinder (706), the output end of the first auxiliary cylinder (706) is transmission-connected to one end of the first auxiliary telescopic rod (707), the other end of the first auxiliary telescopic rod (707) is fixedly connected to one side of the first fixed block (708), the bottom of the electric heater (709) and the bottom of the first gas transmission pump (710) are both fixedly connected to the top of the curing chamber (3), the output port of the electric heater (709) is fixedly connected to the input port of the first gas transmission pump (710) through a gas pipe, the output port of the first gas transmission pump (710) is fixedly connected to the input port of the first gas transmission pipe (711), the output port of the first gas transmission pipe (711) is fixedly connected to the input port of the hot air nozzle (712), and the outer wall of the hot air nozzle (712) is fixedly connected to the inner wall of the first fixed block (708).

3. A PCB thick copper circuit solder mask processing device according to claim 2, characterized in that: The cooling mechanism (8) comprises a second bearing plate (801), a second slide rail (802), a second main cylinder (803), a second main telescopic rod (804), a second slide plate (805), a second auxiliary cylinder (806), a second auxiliary telescopic rod (807), a second fixed block (808), an air-cooled cooler (809), a second gas transmission pump (810), a second gas transmission pipe (811) and a cold air nozzle (812); one side of the second bearing plate (801) is fixedly connected to the other side of the curing chamber (3); the top of the second bearing plate (801) is fixedly connected to the bottom of the second slide rail (802); the output end of the second main cylinder (803) is transmission-connected to one end of the second main telescopic rod (804); the other end of the second main telescopic rod (804) is fixedly connected to one side of the second slide plate (805); the outer wall of the second slide plate (805) is slidingly connected to the inner wall of the second slide rail (802); The top of the second slide plate (805) is fixedly connected to the bottom of the second auxiliary cylinder (806), the output end of the second auxiliary cylinder (806) is transmission-connected to one end of the second auxiliary telescopic rod (807), the other end of the second auxiliary telescopic rod (807) is fixedly connected to one side of the second fixed block (808), the bottom of the air-cooled cooler (809) and the bottom of the second gas transmission pump (810) are both fixedly connected to the top of the curing chamber (3), the output port of the air-cooled cooler (809) is fixedly connected to the input port of the second gas transmission pump (810) through a gas pipe, the output port of the second gas transmission pump (810) is fixedly connected to the input port of the second gas transmission pipe (811), the output port of the second gas transmission pipe (811) is fixedly connected to the input port of the cold air nozzle (812), and the outer wall of the cold air nozzle (812) is fixedly connected to the inner wall of the second fixed block (808).

4. A PCB thick copper circuit solder mask processing device according to claim 3, characterized in that: The output end of the central processing unit (6) is electrically connected to the input end of the first main cylinder (703), the input end of the first auxiliary cylinder (706), the input end of the electric heater (709), the input end of the first gas transmission pump (710), the input end of the second main cylinder (803), the input end of the second auxiliary cylinder (806), the input end of the air-cooled cooler (809) and the input end of the second gas transmission pump (810), respectively, and the output end and input end of the thermal gradient acquisition module (9) and the output end and input end of the temperature acquisition module (10) are electrically connected to the input end and output end of the central processing unit (6), respectively.

5. A PCB thick copper circuit solder resist processing device according to claim 4, characterized in that: The logic for obtaining the temperature gradient variation coefficient of each area of ​​the PCB board is: S1. The average temperature gradient of each area and the adjacent area of ​​the PCB board at different times in time T is obtained by the thermal gradient acquisition module (9), and is calibrated as , Indicates that within T time Time PCB board The average temperature gradient between a region and its adjacent regions is , , and are all positive integers; S2. Calculate the temperature gradient variation coefficient of each area of ​​the PCB board. The calculation expression is: In the formula, For PCB board The temperature gradient variation coefficient of the region.

6. A PCB thick copper circuit solder resist processing device according to claim 5, characterized in that: The logic for obtaining the temperature variation index of each area of ​​the PCB board is: S1. The actual temperature of each area of ​​the PCB board at different times within the time T is obtained through the temperature acquisition module (10) and calibrated as , Indicates that within T time Time PCB board The actual temperature of the area, , , and are all positive integers; S2. Calculate the temperature change index of each area of ​​the PCB board. The calculation expression is: In the formula, For PCB board The temperature variation index of a region.

7. A PCB thick copper circuit solder resist processing device according to claim 6, characterized in that: The expression formula of the uniform evaluation coefficient of each area of ​​the PCB board is: The central processing unit (6) performs a formula analysis according to the formula: In the formula, For PCB board The uniform evaluation coefficient of the region, and are the preset proportional coefficients of the temperature gradient variation coefficient and the temperature variation index of each area of ​​the PCB board, and and All are greater than 0; Calculate the standard deviation of the uniform evaluation coefficient according to the formula: In the formula, is the standard deviation of uniform evaluation coefficient; The standard deviation of the uniform evaluation coefficient generated The pre-set uniform evaluation coefficient standard deviation threshold Compare and judge whether the surface temperature of the PCB board is uniform according to the comparison results. The specific comparison analysis is as follows: when When the temperature of the PCB surface is uniform; when When the temperature of the PCB surface is not uniform.

8. A PCB thick copper circuit solder resist processing device according to claim 7, characterized in that: When the PCB surface temperature is found to be uneven, a pre-set uniformity evaluation coefficient threshold interval is determined. , and after determining the uniform evaluation coefficient of each area of ​​the PCB board A comparison is performed, and the various areas of the PCB are divided into a high temperature area, a normal area and a low temperature area according to the comparison results. The heating mechanism (7) and the cooling mechanism (8) are controlled according to the division results to perform heating work and cooling work on the low temperature area and the high temperature area respectively. The specific comparison analysis and division are as follows: like , the area is divided into a low-temperature area, the central processing unit (6) generates a low-temperature signal, and transmits the low-temperature signal to the first main cylinder (703), the first auxiliary cylinder (706), the electric heater (709) and the first gas transmission pump (710) respectively; after receiving the low-temperature signal, the first main cylinder (703), the first auxiliary cylinder (706), the electric heater (709) and the first gas transmission pump (710) control the heating mechanism (7) to heat up all the areas divided into the low-temperature area; like , the area is divided into a normal area, the central processing unit (6) generates a normal signal, and transmits the generated normal signal to the first main cylinder (703), the first auxiliary cylinder (706), the electric heater (709), the first gas transmission pump (710), the second main cylinder (803), the second auxiliary cylinder (806), the air-cooled cooler (809) and the second gas transmission pump (810), respectively; after receiving the normal signal, the first main cylinder (703), the first auxiliary cylinder (706), the electric heater (709) and the first gas transmission pump (710) do not control the heating mechanism (7) to perform heating work; after receiving the normal signal, the second main cylinder (803), the second auxiliary cylinder (806), the air-cooled cooler (809) and the second gas transmission pump (810) do not control the cooling mechanism (8) to perform cooling work; like , the area is divided into a high-temperature area, the central processing unit (6) generates a high-temperature signal, and transmits the high-temperature signal to the second main cylinder (803), the second auxiliary cylinder (806), the air-cooled cooler (809) and the second gas transmission pump (810) respectively. After receiving the high-temperature signal, the second main cylinder (803), the second auxiliary cylinder (806), the air-cooled cooler (809) and the second gas transmission pump (810) control the cooling mechanism (8) to cool all areas divided into high-temperature areas.

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