Multi-layer abrasive grinding wheel and preparation method thereof

Abstract

The preparation method comprises the following steps: adopting a hole template as a template for arranging abrasives at intervals, and arranging the abrasives on a soldering lug to prepare a single-layer blank working layer; a single-layer blank working layer is prepared, a soldering lug is arranged on the single-layer blank working layer, then a pore forming agent is arranged on the soldering lug to prepare the single-layer blank working layer again, the steps are repeated to prepare the multi-layer super-hard abrasive grinding wheel blank, and abrasive distribution in the grinding wheel working layer is in a regular and ordered form through regular arrangement of abrasives. The grinding materials are regularly arranged to ensure that each grinding material has enough chip accommodating space, so that the adhesion of grinding chips on the surface of the grinding wheel is effectively avoided; and meanwhile, each grinding material is stressed uniformly, and the abrasion is consistent, so that the service life of the grinding wheel is prolonged.

Description

Technical Field

[0001] The invention belongs to the technical field of mechanical processing, and in particular relates to a multi-layer abrasive grinding wheel and a preparation method thereof. Background Art

[0002] In the sintered abrasive grinding wheels manufactured using existing technologies, the distribution of abrasive particles in the brazing matrix presents a random and disordered characteristic. This distribution pattern means that in the actual process of grinding operations, only a very small proportion of the dynamically effective abrasive can actually participate in the material removal process, while the vast majority of the abrasives fail to fully exert their cutting effect, resulting in a low overall utilization rate of the abrasives.

[0003] Due to the disordered distribution of abrasives inside the grinding wheel, the size of the gaps between the abrasive particles shows significant non-uniformity. This inconsistency in the distribution of gaps directly leads to the relatively narrow chip space in some local areas of the working layer of the grinding wheel. During high-speed grinding, the generation of grinding chips is continuous and large in quantity. The narrow chip space will undoubtedly hinder the effective discharge of grinding chips, causing the grinding chips to accumulate on the surface of the grinding wheel or inside the working layer, thereby increasing the probability of adhesion between the grinding chips and the grinding wheel surface.

[0004] As time goes by, the continuous accumulation of grinding chips will not only reduce the grinding efficiency, but also increase the wear of the grinding wheel. More seriously, when the adhesion of grinding chips reaches a certain level, it may cause clogging of the grinding wheel surface, resulting in a sharp decline in the effective cutting ability of the grinding wheel. In some cases, it may even cause the grinding wheel to fail quickly in a short period of time, seriously affecting production efficiency and processing quality. Therefore, optimizing the distribution of abrasives in the grinding wheel, improving the utilization rate of abrasives, and improving the chip holding and chip removal performance of the grinding wheel are key issues that need to be urgently solved in the current sintered abrasive grinding wheel technology. Summary of the invention

[0005] The purpose of the present invention is to provide a multi-layer abrasive grinding wheel and a preparation method thereof, so as to overcome the problems in the prior art such as low abrasive utilization, chip adhesion, unstable grinding performance, etc. The present invention can improve the workpiece material removal rate and service life of the superhard abrasive grinding wheel.

[0006] To achieve the above purpose, the technical solution adopted by the present invention is as follows: A method for preparing a multi-layer abrasive grinding wheel comprises the following steps: S1, using a hole template as an abrasive spacing arrangement template, arranging abrasives on a welding sheet to prepare a single-layer blank working layer; setting a welding sheet on the single-layer blank working layer, and then arranging a pore-forming agent on the welding sheet to prepare a single-layer blank working layer again, repeating the above steps to prepare a multi-layer superhard abrasive grinding wheel blank; S2, sintering the multi-layer super-hard abrasive grinding wheel blank in a vacuum environment to obtain a multi-layer super-hard abrasive grinding wheel with abrasives regularly arranged.

[0007] Preferably, the abrasive distribution and arrangement form is made into a hole template using a set abrasive regular arrangement spacing, a first welding sheet is coated with a layer of pressure-sensitive adhesive, the hole template is attached to the first welding sheet, the abrasive is spread on the hole template, the excess abrasive on the hole template is scraped off, and then the pore-forming agent is filled in the gaps between the abrasives to form a first unit blank working layer; the pore-forming agent distribution and arrangement form is made into a hole template using a set pore-forming agent regular arrangement spacing, the hole template is attached to the first unit blank working layer, the pore-forming agent particles are spread on the hole template, the excess pore-forming agent on the hole template is scraped off, and then the abrasive is filled in the gaps between the pore-forming agents to form a second unit blank working layer.

[0008] Preferably, the number of the stacked single-layer blank working layers is 5 to 50.

[0009] Preferably, the abrasive distribution and arrangement form is made into a hole template using a set abrasive (or pore-forming agent) regularly arranged spacing, and the abrasive (or pore-forming agent) regularly arranged spacing is obtained by a mathematical modeling method.

[0010] Preferably, the objective function for optimizing the regular arrangement spacing of abrasives is to maximize the chip space V and maximize the workpiece material removal rate M during the machining of the workpiece material:

[0011]

[0012] And , , As a constraint condition, the chip space corresponding to the critical adhesion of grinding chips on the grinding wheel surface is determined through grinding tests. , solve the above mathematical model to obtain the regular arrangement spacing and arrangement form of the abrasive and the abrasive particle size parameters; b, λ, 、h g 、a g They are the single abrasive diameter of the grinding wheel, the abrasive spacing (or pore-forming agent spacing), the abrasive distribution angle, the abrasive exposure height and the maximum cutting thickness of a single abrasive; a p 、v s、 v w , A, h g d c They are grinding depth of grinding wheel, linear speed, worktable speed, contact area between grinding wheel and processed material, and equivalent diameter of grinding wheel.

[0013] Preferably, the pore-forming agent is hollow silicate sphere particles or Ni-Cr alloy hollow sphere particles with a particle size of 30-300 meshes.

[0014] Preferably, the welding sheet is made of Ni-Cr alloy or Cu-Sn-Ti alloy, and the thickness of the welding sheet is 0.02-0.2 mm.

[0015] Preferably, the abrasive is diamond or CBN, and the abrasive particle size is 30-300 mesh.

[0016] Preferably, the abrasives on the welding sheet are regularly arranged at a distance of 0.1 to 1 mm.

[0017] A multi-layer abrasive grinding wheel is prepared by the multi-layer abrasive grinding wheel preparation method described above.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects: The invention discloses a method for preparing a multi-layer abrasive grinding wheel. The method comprises the following steps: adopting a hole template as an abrasive spacing arrangement template, arranging abrasives on a welding sheet to prepare a single-layer blank working layer; arranging a welding sheet on the single-layer blank working layer, and then arranging a pore-forming agent on the welding sheet to prepare a single-layer blank working layer again, and repeating the above steps to prepare a multi-layer superhard abrasive grinding wheel blank. The abrasives are regularly arranged so that the abrasives in the grinding wheel working layer are distributed in a regular and orderly form. During the grinding process of the grinding wheel, the regularly arranged abrasives can ensure that each abrasive has enough chip accommodating space, thereby effectively avoiding the adhesion of chips on the grinding wheel surface; at the same time, each abrasive is subjected to a relatively uniform force and wears uniformly, thereby improving the service life of the grinding wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The present invention is a schematic diagram of the process structure of the method for preparing a multi-layer abrasive grinding wheel.

[0020] Figure 2 It is a schematic structural diagram of a multi-layer super-hard abrasive grinding wheel with regularly arranged abrasives of the present invention.

[0021] Figure 3 Schematic diagram of adjacent unit blank working layers.

[0022] Figure 4 Schematic diagram of a multi-layer super-hard abrasive grinding wheel blank with regularly arranged abrasives.

[0023] In the figure, matrix-1, binder-2, abrasive-3, pore-forming agent-4. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] like Figure 1 As shown, the present invention provides a method for preparing a multi-layer abrasive grinding wheel, comprising the following steps: S1, using a hole template as an abrasive spacing arrangement template, arranging abrasives on a welding sheet to prepare a single-layer blank working layer; setting a welding sheet on the single-layer blank working layer, and then arranging a pore-forming agent on the welding sheet to prepare a single-layer blank working layer again, repeating the above steps to prepare a multi-layer superhard abrasive grinding wheel blank; S2, sintering the multi-layer super-hard abrasive grinding wheel blank in a vacuum environment to obtain a multi-layer super-hard abrasive grinding wheel with abrasives regularly arranged.

[0027] In a specific implementation of the present application, the abrasive distribution and arrangement form is made into a hole template using a set abrasive regular arrangement spacing, a first welding sheet is coated with a layer of pressure-sensitive adhesive, the hole template is attached to the first welding sheet, the abrasive is spread on the hole template, and the excess abrasive on the hole template is scraped off to ensure that each hole can accommodate an abrasive, and then the pore-forming agent is filled in the gaps between the abrasives to form the first unit blank working layer.

[0028] Lay the second welding sheet neatly on the unit blank working layer of step 1, stick the hole template on the second welding sheet, spread the pore former on the hole template, scrape off the excess pore former on the hole template to ensure that there is pore former in each hole, and then fill the gaps between the pore formers with abrasive to form the second unit blank working layer.

[0029] Repeat the above steps, and the number of the stacked single-layer blank working layers is 5 to 50 layers, so as to form a multi-layer super-hard abrasive grinding wheel blank with regularly arranged abrasives, wherein the abrasives of two adjacent layers in the height direction are staggered.

[0030] The abrasive (or pore-forming agent) distribution and arrangement form is made into a hole template by using a set abrasive (or pore-forming agent) regular arrangement spacing, and the abrasive (or pore-forming agent) regular arrangement spacing is obtained by a mathematical modeling method.

[0031] Specifically, the physical mathematical modeling method is adopted, that is, the maximum chip space V and the highest workpiece material removal rate M of the grinding wheel during the processing of the workpiece material are used as the objective function for optimizing the spacing of the abrasive regular arrangement:

[0032]

[0033] And , , As a constraint condition, the chip space corresponding to the critical adhesion of grinding chips on the grinding wheel surface is determined through grinding tests. , solve the above mathematical model and obtain the regular arrangement spacing and arrangement form of abrasives and abrasive particle size parameters.

[0034] The pore-forming agent is hollow silicate sphere particles or Ni-Cr alloy hollow sphere particles with a particle size of 30-300 meshes, the welding sheet is Ni-Cr alloy or Cu-Sn-Ti alloy welding sheet with a thickness of 0.02-0.2 mm, and the abrasive is diamond or CBN with a particle size of 30-300 meshes.

[0035] The abrasives on the welding sheet are regularly arranged at a distance of 0.1 to 1 mm, and the size of the holes on the hole template matches the particle size of the abrasives and the pore-forming agent.

[0036] There are gaps between abrasives in the working layer of the grinding wheel, which are called chip spaces. The size and shape of the chip space depends on the manufacturing process of the grinding wheel, the types of binders and pore-forming agents, and the height of the abrasive exposure. When the manufacturing process of the grinding wheel and the pore-forming agent material are determined, the regular arrangement of abrasives is the most important factor in determining the size of the chip space of a single abrasive. The design parameters of the regular arrangement of abrasives include the axial distance, radial distance, and arrangement angle of the abrasives.

[0037] Combining the theory and process practice of grinding, the present invention provides a practical method for realizing the regular arrangement of abrasives in multi-layer super-hard abrasive grinding wheels, namely, a physical mathematical modeling method. The present invention is a method for achieving the regular arrangement of abrasives by establishing a mathematical model according to basic physical principles under the premise of several simplifications. The objective function for optimizing the regular arrangement spacing of abrasives is to maximize the chip space V of the grinding wheel during the processing of the workpiece material and to maximize the workpiece material removal rate M:

[0038]

[0039] Formula (I) set up: , , As constraints, b, λ, 、h g 、a g They are the single abrasive diameter, abrasive spacing, abrasive distribution angle, abrasive exposure height and single abrasive maximum cutting thickness of the grinding wheel; a p 、v s、 v w , A, h g d c They are grinding depth of grinding wheel, linear speed, worktable speed, contact area between grinding wheel and processed material, and equivalent diameter of grinding wheel.

[0040] In addition, V represents the constraint conditions determined by the grinding wheel chip space ( It shows that the chip space on the grinding wheel surface cannot be less than the minimum chip space, otherwise adhesion will occur on the grinding wheel surface. The chip space corresponding to the critical adhesion of the grinding wheel surface is determined through grinding tests. ), q and Ra represent the constraints determined by the average heat flux density in the contact arc area and the surface roughness of the workpiece ( , The conditions are similar to the previous ones).

[0041] By solving the above mathematical model, the regular abrasive arrangement spacing, angle and abrasive grain size can be obtained according to the properties of the processed material under given processing requirements and processing conditions; the multi-layer super-hard abrasive grinding wheel made according to the optimal regular abrasive arrangement method will have the highest workpiece material removal rate when grinding workpieces.

[0042] Reference Figures 2 to 4 The production process of multi-layer super-hard abrasive grinding wheels with regular abrasive arrangement is as follows: Step 1, according to the regular arrangement spacing of the abrasive, the abrasive distribution and arrangement form is made into a hole template (the spacing between the holes is 0.7mm, and the hole arrangement form is a grid, that is, the arrangement angle is 45°), take the first Ni-Cr alloy welding sheet (the welding sheet thickness is 0.1mm) and coat it with a layer of pressure-sensitive adhesive, stick the hole template on the first welding sheet, spread diamond abrasive (particle size is 50 / 60 mesh) on the hole template, scrape off the excess diamonds on the hole template, ensure that each hole can accommodate a diamond, and then fill the gaps between the diamonds with pore-forming agent to form the first unit blank working layer; Step 2, lay the second welding sheet neatly on the unit blank working layer of step 1, stick the hole template on the second welding sheet, spread the pore former on the hole template, the pore former is Ni-Cr alloy hollow sphere particles (particle size is 50 / 60 mesh), scrape off the excess pore former on the hole template to ensure that there is pore former in each hole, and then fill the gaps between the pore formers with diamonds to form the second unit blank working layer; Step 3, repeating steps 1 and 2, the number of unit blank working layers stacked together is 30 layers, forming a multi-layer super-hard abrasive grinding wheel blank with regularly arranged abrasives, and the abrasives of two adjacent layers in the height direction are staggered; Step 4, sending the multi-layer super-hard abrasive grinding wheel blank obtained in step 3 into a vacuum sintering furnace for sintering, and finally obtaining a multi-layer super-hard abrasive grinding wheel with regularly arranged abrasives.

[0043] The present invention provides a multi-layer abrasive grinding wheel, which is prepared by the above-mentioned preparation method of the multi-layer abrasive grinding wheel. The specific structure is as follows Figures 2 to 4 shown.

[0044] The multi-layer super-hard abrasive grinding wheel with regularly arranged abrasives manufactured according to the manufacturing process and requirements of the present invention has a large exposed abrasive height of up to 40% to 60%, a high rate of workpiece material removal by the grinding wheel and high processing efficiency; and the adhesion of grinding chips on the grinding wheel surface and burning of the workpiece surface can be effectively avoided during the processing.

[0045] The above is only a specific implementation of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantial changes to the present invention using this concept shall be deemed as an infringement of the protection scope of the present invention.

Claims

1. A method for preparing a multi-layer abrasive grinding wheel, characterized in that: The following steps are involved: S1, using a hole template as an abrasive spacing arrangement template, arranging abrasives on a welding sheet to prepare a single-layer blank working layer; setting a welding sheet on the single-layer blank working layer, and then arranging a pore-forming agent on the welding sheet to prepare a single-layer blank working layer again, repeating the above steps to prepare a multi-layer superhard abrasive grinding wheel blank; S2, sintering the multi-layer super-hard abrasive grinding wheel blank in a vacuum environment to obtain a multi-layer super-hard abrasive grinding wheel with abrasives regularly arranged.

2. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The abrasive distribution and arrangement form is made into a hole template using a set abrasive regular arrangement spacing, a first welding sheet is coated with a layer of pressure-sensitive adhesive, the hole template is attached to the first welding sheet, abrasive is spread on the hole template, excess abrasive on the hole template is scraped off, and then pore-forming agent is filled in the gaps between the abrasives to form a first unit blank working layer; the pore-forming agent distribution and arrangement form is made into a hole template using a set pore-forming agent regular arrangement spacing, the hole template is attached to the first unit blank working layer, pore-forming agent particles are spread on the hole template, excess pore-forming agent on the hole template is scraped off, and then abrasive is filled in the gaps between the pore-forming agents to form a second unit blank working layer.

3. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The number of single-layer blank working layers stacked together is 5 to 50.

4. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The abrasive (or pore-forming agent) distribution and arrangement form is made into a hole template by using a set abrasive (or pore-forming agent) regular arrangement spacing, and the abrasive (or pore-forming agent) regular arrangement spacing is obtained by a mathematical modeling method.

5. The method for preparing a multi-layer abrasive grinding wheel according to claim 4, characterized in that: The objective function for optimizing the spacing of abrasive regular arrangement is to maximize the chip space V and maximize the workpiece material removal rate M during the machining process of the grinding wheel: And , , As a constraint condition, the chip space corresponding to the critical adhesion of grinding chips on the grinding wheel surface is determined through grinding tests. , solve the above mathematical model to obtain the regular arrangement spacing and arrangement form of the abrasive and the abrasive particle size parameters; b, λ, 、h g 、a g They are the single abrasive diameter of the grinding wheel, the abrasive spacing (or pore-forming agent spacing), the abrasive distribution angle, the abrasive exposure height and the maximum cutting thickness of a single abrasive; a p 、v s、 v w , A, h g d c They are grinding depth of grinding wheel, linear speed, worktable speed, contact area between grinding wheel and processed material, and equivalent diameter of grinding wheel.

6. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The pore-forming agent is hollow silicate sphere particles or Ni-Cr alloy hollow sphere particles with a particle size of 30-300 meshes.

7. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The welding piece is a Ni-Cr alloy or a Cu-Sn-Ti alloy welding piece, and the thickness of the welding piece is 0.02-0.2 mm.

8. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The abrasive is diamond or CBN, and the abrasive particle size is 30-300 meshes.

9. The method for preparing a multi-layer abrasive grinding wheel according to claim 1, characterized in that: The abrasives on the welding sheet are regularly arranged at a distance of 0.1 to 1 mm.

10. A multi-layer abrasive grinding wheel prepared by the method according to any one of claims 1 to 9.

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