Static electricity measuring and removing system for wafer cleaning liquid conveying pipe, wafer cleaning device and static electricity removing system of wafer cleaning device

Abstract

The invention provides a static electricity measuring and removing system for a wafer cleaning liquid conveying pipe, a wafer cleaning device and a static electricity removing system thereof.The static electricity measuring and removing system for the wafer cleaning liquid conveying pipe comprises a grounding assembly and a static electricity removing assembly, the grounding assembly comprises a grounding probe and a grounding unit which are conductively connected, and the grounding probe is arranged in the wafer cleaning liquid conveying pipe and located on the upstream of the cleaning liquid flowing direction; the grounding unit is located outside the wafer cleaning liquid conveying pipe; the electrostatic measurement assembly comprises two measurement probes for detecting the amount of positive and negative charges and a measurement unit forming a measurement loop with the two measurement probes, and the two measurement probes are arranged in the wafer cleaning fluid conveying pipe and located at the downstream of the cleaning fluid flowing direction; the measuring unit comprises a charge converter; and the charge converter is used for acquiring the charge quantity and the charge polarity detected by the measuring probe. The static electricity in the conveying pipe can be guided out, and whether the static electricity is completely removed or not can be detected.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and in particular to a static electricity measurement and removal system for a wafer cleaning liquid delivery pipe, a wafer cleaning device and a static electricity removal system thereof. Background Art

[0002] Wet cleaning is a technology that uses chemical reagents or deionized water to clean the surface of the wafer. It is mainly used to remove impurities such as particles, metals, and organic matter on the surface of the wafer to ensure the cleanliness and electrical properties of the wafer. Wet cleaning occupies an important position in the semiconductor manufacturing process and is performed almost before and after each process to ensure the yield and performance of the chip.

[0003] During the wet cleaning process, strong acid and alkaline chemical liquids are required to treat the surface of the wafer. However, static charges are easily generated in the chemical liquid through fluid flow and pipeline friction, and these static charges will be sprayed onto the surface of the wafer, causing arcs on the surface of the wafer and breaking down the circuit on the surface of the wafer, affecting the quality of the wafer and process reliability. The existing solution for removing static charges is to install a destaticizing ion handle in the wafer transfer area and wrap the destaticizing wire connected to the grounding system on the chemical liquid delivery pipe. On the one hand, the destaticizing ion handle cannot adjust its spraying of positive or negative ions to neutralize the static charge on the surface of the wafer according to the charge polarity in the chemical liquid delivery pipe. On the other hand, since most of the chemical liquid delivery pipes are made of insulating materials to meet the process production requirements, even if the destaticizing wire is wrapped, the static charge in the pipe cannot be discharged. Therefore, the solution has limited static charge removal, and it is easy for chemical liquid with static charge to be sprayed onto the surface of the wafer, causing damage to the wafer.

[0004] Therefore, it is necessary to develop a system that can measure and remove static charge in chemical liquid delivery pipes. Summary of the invention

[0005] The object of the present invention is to provide an electrostatic measurement and removal system for a wafer cleaning liquid delivery pipe, a wafer cleaning device and its electrostatic removal system. The electrostatic measurement system is used to detect whether static electricity still exists in the chemical liquid in the delivery pipe after being grounded through electrostatic discharge, and if so, the amount of charge is detected so that linkage control can be achieved with the wafer transfer control system to avoid damage to the wafer.

[0006] The present invention provides a static electricity measurement and removal system for a wafer cleaning liquid delivery pipe, which comprises: A grounding component, comprising a grounding probe and a grounding unit which are conductively connected, wherein the grounding probe is placed in the wafer cleaning liquid delivery pipe and is located upstream of the flow direction of the cleaning liquid, and the grounding unit is located outside the wafer cleaning liquid delivery pipe; An electrostatic measurement component includes two measuring probes for detecting positive and negative charges, and a measuring unit that forms a measurement circuit with the two measuring probes, wherein the two measuring probes are placed in the wafer cleaning liquid delivery pipe and are located downstream of the cleaning liquid flow direction; the measuring unit includes a charge converter, which is used to obtain the charge amount and charge polarity detected by the measuring probes.

[0007] Preferably, the grounding probes are multiple and evenly distributed on the circumference of the wafer cleaning liquid delivery pipe, and all the grounding probes are connected to the grounding unit.

[0008] Preferably, the inner cores of the grounding probe and the measuring probe are both metallic carbon nanotubes, and the outer layers of the grounding probe and the measuring probe are both precious metal layers surrounding the metallic carbon nanotubes; and / or, the grounding probe and the measuring probe are both connected to the tube body of the wafer cleaning liquid delivery pipe by precious metal welding and sealing.

[0009] Preferably, the two measuring probes are staggered in the axial direction of the wafer cleaning liquid delivery pipe and are arranged opposite to each other in the radial direction of the wafer cleaning liquid delivery pipe.

[0010] Preferably, the length of the measuring probe satisfies that: in the wafer cleaning liquid delivery pipe, the end of the measuring probe is located at the center of the wafer cleaning liquid delivery pipe.

[0011] Preferably, the measuring unit further comprises a charge alarm unit, and the charge alarm unit is used to send out an alarm signal when the charge amount output by the charge converter is greater than a preset charge threshold.

[0012] Preferably, the measuring unit is used to transmit the charge amount and charge polarity to a wafer transfer control system, the wafer transfer control system includes a charge control unit for controlling the charge polarity and charge amount of a charge injection device, and the charge injection device is arranged in the wafer transfer area; the charge control unit is used to control the charge injection device to inject charges of opposite polarity to the charge polarity according to the charge polarity fed back by the measuring unit, and is used to control the charge amount injected by the charge injection device according to the charge amount fed back by the measuring unit.

[0013] Preferably, the measuring unit is used to transmit the charge amount and charge polarity to a wafer conveying control system, and the wafer conveying control system includes a conveying control unit that controls the start and stop of a wafer conveying mechanism. When the charge amount detected by the measuring unit is greater than a preset charge threshold, the conveying control unit controls the wafer conveying mechanism to stop wafer conveying.

[0014] The present invention also provides a static electricity removal system for a wafer cleaning device, comprising the static electricity measurement and removal system for a wafer cleaning liquid delivery pipe as described in any one of the above items, and a wafer conveying control system, wherein the measurement unit is connected to the wafer conveying control system and transmits the charge amount and the charge polarity to the wafer conveying control system, and the wafer conveying control system comprises one or two of the following control units: A charge control unit, used for controlling the charge ejection device to eject charges of opposite polarity to the charge polarity according to the charge polarity fed back by the measuring unit, and for controlling the charge amount ejected by the charge ejection device according to the charge amount fed back by the measuring unit, wherein the charge ejection device is arranged in the wafer transfer area; The conveying control unit is used to control the start and stop of the wafer conveying mechanism for conveying the wafer. When the charge amount fed back by the measuring unit is greater than a preset charge threshold, the conveying control unit controls the wafer conveying mechanism to stop conveying the wafer.

[0015] The present invention also provides a wafer cleaning device, comprising a wafer cleaning liquid delivery pipe, a wafer conveying mechanism and an electrostatic removal system for the wafer cleaning device as described above, wherein the grounding probe and the measuring probe in the electrostatic measurement and removal system are both placed in the wafer cleaning liquid delivery pipe, and the wafer conveying mechanism is controlled by a conveying control unit in the wafer conveying control system.

[0016] The static electricity measurement and removal system for a wafer cleaning liquid delivery pipe, a wafer cleaning device and a static electricity removal system thereof of the present invention have the following beneficial effects: a grounding probe in a grounding assembly and a measuring probe in a static electricity measurement assembly are sequentially placed in the wafer cleaning liquid delivery pipe according to the flow direction of the cleaning liquid, static electricity in the cleaning liquid in the pipe is extracted by the grounding probe, and the measuring probe detects the amount of positive and negative charges in the downstream cleaning liquid in the pipe in real time, thereby realizing the extraction of static electricity in the cleaning liquid in the pipe and the detection of whether static electricity has been completely eliminated; the static electricity removal system of the present invention can output the amount of positive and negative charges in the cleaning liquid to a wafer delivery control system when static electricity has not been completely eliminated, so as to facilitate the connection with the wafer delivery control system System linkage control; the wafer cleaning device adopts an electrostatic measurement and removal system to realize real-time detection of the amount of positive and negative charges and charge polarity in the liquid in the tube, and transmits the data to the wafer transfer control system. When positive and negative charges are detected in the cleaning liquid in the tube, the wafer transfer control system can control the charge injection device in the wafer transfer area to perform corresponding injection, so that the wafer surface carries a neutralizing charge that can be neutralized with the charge in the liquid, thereby neutralizing the charge in the cleaning liquid with the charge on the wafer surface, and achieving further electrostatic removal. Alternatively, when the amount of positive and negative charges obtained by the measuring unit is greater than the preset charge threshold, the wafer transfer is directly stopped, or an alarm signal is issued to avoid wafer damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1Shown is a schematic diagram of a wafer cleaning liquid delivery pipe with a static electricity measurement and removal system in one embodiment.

[0018] Figure 2 Shown is a schematic diagram of the distribution of grounding probes in a wafer cleaning liquid delivery pipe in one embodiment.

[0019] Figure 3 A diagram showing an embodiment of a measurement probe is shown.

[0020] Figure 4 Shown is a functional block diagram of the measurement unit and wafer transport control system. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0022] For ease of explanation, the wafer cleaning liquid delivery pipe in this specification is mainly used to deliver the cleaning liquid used in the wet cleaning process, and deliver the cleaning liquid to the wet cleaning area. In the wet cleaning area, the wafer cleaning liquid delivery pipe can be connected to the spray mechanism to spray the cleaning liquid onto the surface of the wafer, thereby removing particles, metals, organic matter and other impurities on the surface of the wafer; the cleaning liquid can be a strong acid or alkaline chemical solution, deionized water or other liquids required for wet cleaning. In this specification, the wafer is transported to the wet cleaning area by the wafer conveying mechanism, and the area where the wafer is transported, that is, the area through which the wafer conveying mechanism passes, is referred to as the wafer conveying area.

[0023] like Figures 1 to 4 As shown, an embodiment of the present invention provides a static electricity measurement and removal system for a wafer cleaning liquid delivery pipe, which includes: The grounding component includes a grounding probe 3 and a grounding unit 4 which are conductively connected. The grounding probe 3 is placed in the wafer cleaning liquid delivery pipe 1 and is located in the flow direction of the cleaning liquid (such as Figure 1 The grounding unit 4 is located outside the wafer cleaning liquid delivery pipe. In this embodiment, the grounding unit 4 may be a grounding plate or a wire connected to an external ground level. The electrostatic measurement component includes two measurement probes 2 for detecting positive and negative charges, and a measurement unit 5 that forms a measurement loop with the two measurement probes 2. The two measurement probes 2 are placed in the wafer cleaning liquid delivery pipe 1 and are located downstream of the flow direction of the cleaning liquid. The measurement unit 5 includes a charge converter 51, and the charge converter 51 is used to obtain the amount of charge and the charge polarity detected by the measurement probe 2. In this embodiment, the charge converter 51 is a voltage conversion device based on the principle of capacitor charging and discharging. For example, the amount of charge stored in the capacitor array can be divided into two elements, and the charge attenuation reference voltage can be used to achieve accurate conversion from charge to voltage. In addition, the charge polarity can be judged by the charging and discharging behavior of the capacitor at the same time. The positive and negative polarities of the charge can be directly judged by measuring the flow direction of the current through the capacitor, and non-polar ceramic capacitors can be selected to adapt to the environment with the above-mentioned cleaning liquid.

[0024] The static electricity measurement and removal system of this embodiment places the grounding probe 3 and the measuring probe 2 in the wafer cleaning liquid delivery pipe 1 in sequence according to the flow direction of the cleaning liquid, and the static electricity in the wafer cleaning liquid delivery pipe 1 is led out and grounded by the grounding probe 3. The positive and negative charges in the cleaning liquid after passing through the grounding probe 3 are detected in real time by the measuring probe 2 and acquired by the measuring unit 5. The positive and negative charges can be specifically: whether the static electricity in the cleaning liquid is completely removed, and if there is a charge, the charge amount, charge polarity and other information are acquired. The static electricity measurement and removal system of this embodiment can detect the positive and negative charges in the cleaning liquid through the static electricity measurement component, thereby determining whether the grounding component has completely removed the static electricity in the cleaning liquid, thereby avoiding the inability of the wafer cleaning liquid delivery pipe 1 in the prior art to detect whether the static electricity has been completely removed, and the inability to realize linkage control of the equipment in the wafer transfer area, resulting in damage to the wafer. The cleaning liquid in this embodiment is a strong acid and strong alkali chemical liquid commonly used in the wafer wet cleaning process.

[0025] In this embodiment, the measuring unit 5 can feed back the positive and negative charge conditions to the wafer conveying control system 6, and the wafer conveying control system 6 is used to control the start and stop of the wafer conveying mechanism that transports the wafer, so that the electrostatic measurement and removal system of this embodiment and the wafer conveying control system 6 can be linked and controlled to avoid damage to the wafer due to static electricity in the cleaning fluid.

[0026] As a specific embodiment of the grounding component, see Figure 2 As shown, in this embodiment, there are multiple grounding probes 3 evenly distributed on the circumference of the wafer cleaning liquid delivery pipe 1, and all grounding probes 3 are connected to the grounding unit. In this embodiment, multiple grounding probes 3 are arranged on the circumference of the wafer cleaning liquid delivery pipe 1 to better guide the static electricity in the liquid and reduce omissions. In another embodiment, multiple circles of grounding probes 3 are arranged on the wafer cleaning liquid delivery pipe 1, and multiple grounding probes 3 are arranged in each circle, and the grounding probes 3 in adjacent circles are staggered in the circumference, so that the static electricity in the liquid can be better guided out.

[0027] In one embodiment, the grounding probe 3 and the measuring probe 2 have the same structure. Figure 3 As shown, the inner cores of the grounding probe 3 and the measuring probe 2 are both metallic carbon nanotubes 21, and the outer layers of the grounding probe 3 and the measuring probe 2 are both precious metal layers 22 surrounding the metallic carbon nanotubes 21. The grounding probe 3 and the measuring probe 2 in this embodiment are both made of composite materials, the probe surface is precious metal, the precious metal can be platinum-rhodium alloy or gold, which has the characteristics of corrosion resistance, strong ductility, high conductivity, etc. The inner core of the probe is metallic carbon nanotube 21, which has the characteristics of strong ductility, high conductivity and convenient processing, so that the grounding probe 3 and the measuring probe 2 of this embodiment can be used in the wafer cleaning liquid delivery pipe 1, and are not corroded by strong acid and strong alkali chemical liquids. Because of the characteristics of the inner core, it can be disturbed by the flow of liquid and adapt to the flow rate of the liquid. In addition, the inner core uses metallic carbon nanotube 21 to reduce costs.

[0028] As an embodiment of the above-mentioned electrostatic measurement component, see Figure 1 As shown, the two measuring probes 2 are staggered in the axial direction of the wafer cleaning liquid delivery tube 1 and are arranged oppositely in the radial direction of the wafer cleaning liquid delivery tube 2, so as to avoid the two measuring probes 2 being unable to measure due to contact and conduction during the swing of the fluid; in addition, they are arranged oppositely in the radial direction of the wafer cleaning liquid delivery tube 2, so as to better contact the liquid in the radial direction to detect the charge in the liquid. In a more preferred embodiment, the length of the measuring probe 2 satisfies: in the wafer cleaning liquid delivery tube 1, the end of the measuring probe 2 is located at the center of the wafer cleaning liquid delivery tube 1, and further the charge detection of the liquid in the tube is better realized in the radial direction.

[0029] As an example, see Figure 4 As shown, the above-mentioned measuring unit 5 may also include a charge alarm unit 52, which is used to send an alarm signal when the charge amount output by the charge converter 51 is greater than a preset charge threshold. In this embodiment, the preset charge threshold can be pre-stored in the measuring unit, or obtained by the measuring unit through the input unit. The charge alarm unit 52 can realize the alarm through sound, light signal or on the display interface of the wafer transfer control system, so that it can be observed.

[0030] As an example, see Figure 4As shown, this embodiment also includes a wafer conveying control system 6 connected to the above-mentioned measuring unit 5. The wafer conveying control system 6 is mainly used to control the operation of various devices in the wafer conveying area, that is, the wafer conveying control system 6 receives the positive and negative charge conditions transmitted by the measuring unit 5 and can realize linkage control of the wafer conveying. In one embodiment, the above-mentioned wafer conveying control system 6 may include a charge control unit 61 for controlling the charge polarity and injection amount of the charge injection device. The charge injection device is arranged in the wafer conveying area. In this embodiment, the charge control unit 61 controls the charge injection device to spray out neutralized charges with the opposite polarity and the same charge amount as the charge detected by the measuring unit, so that the surface of the wafer carries the neutralized charges until the wafer is transported to the cleaning area sprayed by the wafer cleaning liquid delivery pipe. These neutralized charges can be neutralized with the charges in the cleaning liquid to avoid wafer damage.

[0031] In another embodiment, the wafer conveying control system 6 may include a conveying control unit 62 for controlling the start and stop of the wafer conveying mechanism. For example, when the amount of charge detected by the measuring unit is greater than a preset charge threshold, the conveying control unit 62 controls the wafer conveying mechanism to stop conveying the wafer to prevent the wafer from entering the wet cleaning area sprayed by the wafer cleaning liquid delivery pipe and being damaged.

[0032] Optimally, the wafer transfer control system 6 includes both the charge control unit 61 and the transfer control unit 62, thereby improving the static charge removal rate and effectively protecting the wafer from being damaged by static electricity.

[0033] The present invention also provides a wafer cleaning liquid delivery pipe that can measure and remove static electricity from the delivered cleaning liquid. Figure 1 As shown, the wafer cleaning liquid delivery pipe 1 includes a pipe body, a grounding probe 3 and a measuring probe 2, and the grounding probe 3 and the measuring probe 2 are both placed in the pipe body and sealed and connected to the pipe body. In one embodiment, the grounding probe 3 and the measuring probe 2 are both sealed and connected to the pipe body by precious metal welding. The precious metal in this embodiment can be gold or platinum group metal. The grounding probe 3 and the measuring probe 2 of this embodiment are used in the above-mentioned static measurement and removal system, specifically: the wafer cleaning liquid delivery pipe 1 is provided with a grounding probe 3 and a measuring probe 2, and the grounding probe 3 is connected to the grounding unit 4 outside the pipe as the grounding component in the above-mentioned static measurement and removal system, so as to realize the static electricity in the liquid in the pipe to be eliminated by grounding; the measuring probe 2 is connected to the measuring unit 5 outside the pipe as the static measurement component of the above-mentioned static measurement and removal system, so as to realize the real-time detection of the static charge amount and charge polarity in the liquid after passing through the grounding probe 3, so as to realize linkage control with the wafer conveying control system.

[0034] The present invention also provides a static electricity removal system for a wafer cleaning device. Figures 1 to 4As shown, it may specifically include the static measurement and removal system for the wafer cleaning liquid delivery pipe 1 described in the above embodiments, and the above wafer transfer control system 6, wherein the charge converter 51 in the measurement unit 5 is connected to the wafer transfer control system 6 and transmits the detected charge amount and charge polarity to the wafer transfer control system 6, and the charge control unit 61 and the transfer control unit 62 in the wafer transfer control system 6 perform corresponding control processes. The working process of the static removal system in this embodiment may be: In the wafer cleaning liquid delivery pipe 1, the grounding probe 3 located at the upstream of the cleaning liquid flow direction guides the static charge in the cleaning liquid to the grounding unit 4 located outside the wafer cleaning liquid delivery pipe 1, so as to guide the static charge in the cleaning liquid in the pipe; the measuring probe 2 located at the downstream of the cleaning liquid flow direction detects the static charge in the cleaning liquid in real time, and is connected to the measuring unit 5 located outside the wafer cleaning liquid delivery pipe 1, and the measuring unit 5 outputs the detected charge amount and charge polarity to the wafer conveying control system 6; And, optionally, performing the following steps: a. The wafer conveying control system 6 controls the charge ejection device to eject the charge of the opposite polarity to the charge polarity according to the charge polarity fed back by the above-mentioned measuring unit 5, and controls the charge amount ejected by the charge ejection device according to the charge amount fed back by the above-mentioned measuring unit 5. The charge ejection device is located in the wafer conveying area, so as to realize that the wafer surface is charged with the opposite polarity in the wafer conveying area, until the wafer is conveyed to the cleaning area sprayed by the wafer cleaning liquid delivery pipe, the charge of the opposite polarity can be neutralized with the static charge in the cleaning liquid to avoid damaging the wafer. In this embodiment, the charge control unit 61 can execute the control of the charge amount and charge polarity ejected by the charge ejection device; b. Obtaining a preset charge threshold value, judging whether the charge amount fed back by the above-mentioned measuring unit 5 is greater than the preset charge threshold value, if it is greater than the preset charge threshold value, the wafer conveying control system 6 controls the wafer conveying mechanism to stop working, and in this embodiment, controlling the wafer conveying mechanism to stop working can be executed by the conveying control unit 62. In this embodiment, judging whether the charge amount fed back by the above-mentioned measuring unit 5 exceeds the preset charge threshold value, if it exceeds, the wafer conveying is stopped to avoid subsequent wafers being transported to the cleaning area and being damaged. The preset charge threshold value in this embodiment can be pre-stored in a storage device such as a memory so that the wafer conveying control system can read and obtain it; or, the preset charge threshold value can be directly input into the input system of the wafer conveying control system, that is, the way in which the wafer conveying control system obtains the preset charge threshold value is not limited; c. Obtaining a preset charge threshold value, determining whether the charge amount fed back by the above-mentioned measuring unit 5 is greater than the preset charge threshold value, if it is greater than the preset charge threshold value, the charge alarm unit 52 in the measuring unit 5 sends an alarm signal, and the charge alarm unit 52 can realize the alarm through sound, light signal or on the display interface of the wafer conveying control system 6, so as to be observed. The preset charge threshold value in this embodiment can be pre-stored in a storage device such as a memory so that the measuring unit can read it; or the preset charge threshold value can be directly implanted into the measuring unit through an input device; or the preset charge threshold value is stored in the wafer conveying control system and output to the measuring unit by the wafer conveying system, that is, the method of obtaining the preset charge threshold value is not limited.

[0035] An embodiment of the present invention further provides a wafer cleaning device. Figure 1 and Figure 4 As shown, it includes the wafer cleaning liquid delivery pipe 1 and the static measurement and removal system used therefor, and a wafer conveying assembly provided with a wafer conveying control system 6. The wafer conveying control system 6 may include a charge control unit 61 for controlling the charge polarity and the amount of the charge spraying device, and a conveying control unit 62 for controlling the start and stop of the wafer conveying mechanism. The charge spraying device is arranged in the wafer conveying area. The wafer cleaning device of this embodiment adopts a wafer cleaning liquid delivery pipe with the static measurement and removal system, and realizes linkage control with the wafer conveying control system through the static measurement and removal system, thereby further improving the wafer yield.

[0036] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A static electricity measurement and removal system for a wafer cleaning liquid delivery pipe, characterized in that: The static electricity measurement and removal system comprises: A grounding component, comprising a grounding probe and a grounding unit which are conductively connected, wherein the grounding probe is placed in the wafer cleaning liquid delivery pipe and is located upstream of the flow direction of the cleaning liquid, and the grounding unit is located outside the wafer cleaning liquid delivery pipe; An electrostatic measurement component includes two measuring probes for detecting positive and negative charges, and a measuring unit that forms a measurement circuit with the two measuring probes, wherein the two measuring probes are placed in the wafer cleaning liquid delivery pipe and are located downstream of the cleaning liquid flow direction; the measuring unit includes a charge converter, which is used to obtain the charge amount and charge polarity detected by the measuring probes.

2. The static electricity measurement and removal system according to claim 1, characterized in that: There are multiple grounding probes evenly distributed on the circumference of the wafer cleaning liquid delivery pipe, and all the grounding probes are connected to the grounding unit.

3. The static electricity measurement and removal system according to claim 1, characterized in that: The inner cores of the grounding probe and the measuring probe are both metallic carbon nanotubes, and the outer layers of the grounding probe and the measuring probe are both precious metal layers surrounding the metallic carbon nanotubes; and / or, the grounding probe and the measuring probe are both connected to the tube body of the wafer cleaning liquid delivery pipe by precious metal welding and sealing.

4. The static electricity measurement and removal system according to claim 1, characterized in that: The two measuring probes are staggered in the axial direction of the wafer cleaning liquid delivery pipe and are arranged opposite to each other in the radial direction of the wafer cleaning liquid delivery pipe.

5. The static electricity measurement and removal system according to claim 1, characterized in that: The length of the measuring probe satisfies that: in the wafer cleaning liquid delivery pipe, the end of the measuring probe is located at the center of the wafer cleaning liquid delivery pipe.

6. The static electricity measurement and removal system according to claim 1, characterized in that: The measuring unit further comprises a charge alarm unit, which is used to send out an alarm signal when the charge amount output by the charge converter is greater than a preset charge threshold.

7. The static electricity measurement and removal system according to claim 1, characterized in that: The measuring unit is used to transmit the charge amount and charge polarity to a wafer conveying control system, wherein the wafer conveying control system includes a charge control unit for controlling the charge polarity and the amount of charge ejected by a charge ejecting device, wherein the charge ejecting device is arranged in the wafer conveying area; The charge control unit is used to control the charge ejection device to eject charges of opposite polarity according to the charge polarity fed back by the measuring unit, and to control the charge amount ejected by the charge ejection device according to the charge amount fed back by the measuring unit.

8. The static electricity measurement and removal system according to claim 1, characterized in that: The measuring unit is used to transmit the charge amount and charge polarity to the wafer transfer control system, and the wafer transfer control system includes a transfer control unit that controls the start and stop of the wafer transfer mechanism. When the charge amount detected by the measuring unit is greater than a preset charge threshold, the transfer control unit controls the wafer transfer mechanism to stop wafer transportation.

9. An electrostatic removal system for a wafer cleaning device, characterized in that: The invention comprises an electrostatic measurement and removal system for a wafer cleaning liquid delivery pipe according to any one of claims 1 to 6, and a wafer conveying control system, wherein the measurement unit is connected to the wafer conveying control system and transmits the charge amount and the charge polarity to the wafer conveying control system, and the wafer conveying control system comprises one or two of the following control units: A charge control unit, used for controlling the charge ejection device to eject charges of opposite polarity to the charge polarity according to the charge polarity fed back by the measuring unit, and for controlling the charge amount ejected by the charge ejection device according to the charge amount fed back by the measuring unit, wherein the charge ejection device is arranged in the wafer transfer area; The conveying control unit is used to control the start and stop of the wafer conveying mechanism for conveying the wafer. When the charge amount fed back by the measuring unit is greater than a preset charge threshold, the conveying control unit controls the wafer conveying mechanism to stop conveying the wafer.

10. A wafer cleaning device, characterized in that: It includes a wafer cleaning liquid delivery pipe, a wafer conveying mechanism and an electrostatic removal system for a wafer cleaning device as described in claim 9, wherein the grounding probe and the measuring probe in the electrostatic measurement and removal system are both placed in the wafer cleaning liquid delivery pipe, and the wafer conveying mechanism is controlled by a conveying control unit in the wafer conveying control system.

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