Substrate processing apparatus

Abstract

The invention provides a substrate processing apparatus in which a plurality of clamp pins can synchronously and stably position a substrate at a rotation center. A substrate processing apparatus (1) according to an embodiment of the present invention is provided with: a clamp rod (12) that moves at least three clamp pins (11) between an open position at which the clamp pins (11) are separated from an outer peripheral end (We) of a substrate (W) and a closed position at which the clamp pins (11) are in contact with the outer peripheral end (We) and hold the substrate (W) in accordance with rotation about a horizontal axis; a lifting ring (15) that rotates the clamping rod (12) as the lifting ring moves up and down; a rotating body 30 that rotates the substrate W held by the clamp pin 11; a rotating mechanism 40 that rotates the rotating body 30 about an axis Ax; a lifting mechanism (50) for lifting the lifting ring (15); a biasing member (56) that biases the clamp lever (12) in the direction in which the clamp lever (12) is in the closed position; a synchronizing ring 61 provided so as to be able to rotate around an axis Ax and not to rise and fall; a conversion mechanism (62) that converts the lifting of the lifting ring (15) into the rotation of the synchronizing ring (61) and maintains the posture of the lifting ring (15) in a horizontal state; and a supply unit 70 that supplies the processing liquid to the substrate W.

Description

Technical Field

[0001] The invention relates to a substrate processing device. Background Art

[0002] In the manufacturing process of semiconductor devices or flat panel displays, an etching liquid is supplied to a film provided on the surface of a substrate such as a wafer or a glass substrate to form a desired pattern. As a device for performing such an etching process, a substrate processing device that supplies an etching liquid to the central area of ​​a rotating substrate has been proposed. In this case, the etching liquid supplied to the central area of ​​the substrate spreads toward the periphery of the substrate due to centrifugal force, so that the surface of the substrate is etched by the supplied etching liquid.

[0003] In such substrate processing, if contact marks for supporting the substrate remain on the surface of the substrate, the quality of the substrate will be reduced. In addition, if contact marks remain not only on the surface of the substrate but also on the back of the substrate, the quality of the substrate will be affected, so it is not preferred. Therefore, the substrate is processed while being rotated by a plurality of holding members while holding the outer peripheral end instead of the surface or back of the substrate. As such holding members, for example, a plurality of clamping pins that move in the direction of contact / separation with the outer peripheral end of the substrate can be used (see Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Laid-Open No. 10-209254 Summary of the invention

[0007] Problems to be solved by the invention

[0008] A plurality of clamping pins need to move between an open position away from the substrate and a closed position in contact with the outer peripheral end of the substrate and holding the substrate. However, if each clamping pin is driven independently, the position of the center of the substrate and the rotation center may deviate. Furthermore, even if the center of the substrate and the rotation center can be kept consistent by the independently driven clamping pins, centrifugal force will apply force from the substrate to the clamping pins during rotation, and the clamping pins may open, thereby causing the center of the substrate to deviate from the rotation axis.

[0009] The problem to be solved by the present invention is to provide a substrate processing device in which a plurality of clamping pins can synchronously and stably position a substrate at a rotation center.

[0010] Technical means of solving problems

[0011] The substrate processing device of the present invention comprises: at least three clamping pins for holding the outer peripheral end of the substrate; a clamping rod provided with the clamping pin, which moves between an open position away from the outer peripheral end of the substrate and a closed position in contact with the outer peripheral end of the substrate and holding the substrate as it rotates around a rotating axis in a horizontal direction; a lifting ring that rotates the clamping rod as it is lifted; a rotating body provided with a rotating axis of the clamping rod, which rotates the substrate held by the clamping pin together with the clamping rod and the lifting ring; and a rotating mechanism that rotates the The rotating body rotates around a rotation axis in a vertical direction; a lifting mechanism causes the lifting ring to rise and fall in a direction along the rotation axis; a force-applying member applies force to the clamping rod in a direction that causes the clamping pin to be in the closed position; a synchronization ring is configured to be rotatable around the rotation axis and unable to be lifted or lowered; a conversion mechanism converts the lifting of the lifting ring by the lifting mechanism into rotation of the synchronization ring and maintains the posture of the lifting ring in a horizontal state; and a supply unit supplies a processing liquid to the substrate held by the clamping pin and rotated by the rotating body.

[0012] Effects of the Invention

[0013] The present invention can provide a substrate processing device in which a plurality of clamping pins can synchronously and stably position a substrate at a rotation center. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] [ Figure 1 ] is a diagram showing the structure of a substrate processing apparatus according to an embodiment.

[0015] [ Figure 2 ] is to indicate Figure 1 A three-dimensional view of the internal structure of a substrate processing device.

[0016] [ Figure 3 ] is to indicate Figure 2 A three-dimensional diagram of the structure of the substrate holding portion.

[0017] [ Figure 4 ] (A) means Figure 2 A longitudinal sectional view through the central axis of the substrate holding state, (B) is a diagram showing Figure 2 A longitudinal section through the central axis in the open state.

[0018] [ Figure 5 ] is a simplified longitudinal cross-sectional view in two directions showing the clamping pin in the closed position.

[0019] [ Figure 6 ] (A) is a simplified longitudinal sectional view showing a situation where the clamp pin is normally retained, and (B) is a simplified longitudinal sectional view showing a situation where the clamp pin is abnormally retained.

[0020] [ Figure 7 ] is a simplified longitudinal cross-sectional view showing a situation where one clamping pin is in a closed position and the other clamping pin is in an open position.

[0021] [ Figure 8 ] is an explanatory diagram showing the principle of the tilting of the lifting ring when the clamping pin is held abnormally.

[0022] [ Fig. 9 ] is a flow chart showing the order of substrate processing.

[0023] [ Fig.10 ] is a simplified longitudinal sectional view showing an abnormal state of holding of a clamping pin in a substrate processing apparatus without a synchronization ring.

[0024] [ Fig.11 ] is an explanatory diagram showing an example of a conversion mechanism.

[0025] [ Fig.12 ] is a stereoscopic diagram showing a modified example of a conversion mechanism using a sliding shaft.

[0026] [ Fig.13 ] is a three-dimensional diagram showing a modified example of a conversion mechanism using a cam.

[0027] [ Fig.14 ] is a perspective view showing a modified example in which a single synchronizer ring is used. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0029] [summary]

[0030] like Figure 1 As shown, the substrate processing device 1 of the present embodiment is a device that performs processing while holding a substrate W and rotating it. The substrate W that is the processing object is, for example, a wafer or a glass substrate used in the manufacturing process of a microstructure such as a semiconductor device or a flat panel display. The processing performed by the substrate processing device 1 is, for example, a wet processing in which a processing liquid is supplied and the processing is performed while rotating the substrate W. In this way, the surface of the substrate W that is the processing object is set as the front surface, and the surface on the opposite side is set as the back surface. The wet processing of the present embodiment includes: an etching process in which a film provided on the surface of the substrate W is etched by a chemical solution, and a cleaning process in which a cleaning liquid is used to clean the film.

[0031] like Figure 1 and Figure 2 As shown, the substrate processing apparatus 1 includes a holding portion 10, a rotating body 30, a rotating mechanism 40, a lifting mechanism 50, a synchronization mechanism 60, a supply portion 70, and a detection portion 80 (see Figure 5 ), control device 90.

[0032] (Maintaining part)

[0033] like Figure 1 As shown in FIG. 1 , the holding portion 10 holds the substrate W in a horizontal direction. Figure 2 to Figure 4 As shown, the holding portion 10 includes a clamping pin 11 , a clamping rod 12 , a rotating shaft 13 , a cover 14 , a lifting ring 15 , and a clamping base 16 .

[0034] The clamping pins 11 are a plurality of components for holding the outer peripheral end We of the substrate W. The clamping pins 11 are in the shape of a truncated cone with a reduced diameter at the bottom. The clamping pins 11 only need to have a portion that can be in contact with the outer peripheral end We of the substrate W and hold the surface of the substrate W. Therefore, it includes a cylinder, a prism, and a cone with rotational symmetry, but is not limited to these shapes. It is preferably of such a height that when in contact with the outer peripheral end We, it does not contact the surface and the back of the substrate W and does not affect them, thereby suppressing the influence on the flow of the processing liquid.

[0035] A support portion 11a is provided at the lower portion of the clamp pin 11. The support portion 11a is wedge-shaped and is formed with a sharpened tip facing the rotation axis Ax of the rotating body 30 described later. The upper surface of the support portion 11a is an inclined surface that is inclined downward toward the axis Ax.

[0036] The clamp rod 12 is provided with a clamp pin 11 at one end thereof. The clamp pin 11 is moved to a closed position (see FIG. 1 ) in which the clamp pin 11 contacts the outer peripheral end We of the substrate W and holds the substrate W as the clamp rod 12 rotates about the horizontal axis. Figure 4 (A)), and the opening position away from the outer peripheral end We of the substrate W (refer to Figure 4 (B)) The clamp rod 12 is an L-shaped member.

[0037] The rotation axis 13 is the rotation axis of the clamp rod 12. The rotation axis 13 is provided in the tangent direction (horizontal direction) of the rotation circle of the rotating body 30 with respect to the rotating body 30 described later. The clamp rod 12 rotates with the rotation axis 13 as a fulcrum. As a result, the clamp pin 11 moves between the open position and the closed position.

[0038] A connection hole 12a for connection with a clamp base 16 described later is formed at the other end of the clamp rod 12. The connection hole 12a is a long hole along the radial direction of the rotating body 30. The cover 14 is a cylindrical member provided in a manner that the clamp pin 11 is exposed and one end of the clamp rod 12 protrudes upward. The cover 14 has an inclined surface 14a on its upper surface, and the inclined surface 14a is provided on the rotating mechanism 40 side relative to the rotating shaft 13 of the clamp rod 12.

[0039] A plurality of clamp pins 11 and clamp rods 12 are arranged at equal intervals around the substrate W. Six clamp pins 11 are provided in a group of three arranged every other one around the axis Ax. Thus, six clamp pins 11 are arranged at intervals of 60 degrees. The three clamp pins 11 in one group are set as clamp pins 11A, and the three clamp pins 11 in the other group are set as clamp pins 11B. In addition, the number of clamp pins 11 is not limited to this, and three or more clamp pins 11 may be set as one group, and six or more clamp pins may be provided.

[0040] In addition, the clamp rod 12 provided with the clamp pin 11A is referred to as the clamp rod 12A, and the clamp rod 12 provided with the clamp pin 11B is referred to as the clamp rod 12B. In the following description, when the clamp pin 11A and the clamp pin 11B are not distinguished, they are referred to as the clamp pin 11, and when the clamp rod 12A and the clamp rod 12B are not distinguished, they are referred to as the clamp rod 12.

[0041] The lifting ring 15 rotates the clamping rod 12 as it is lifted. The lifting ring 15 is a ring-shaped part centered on the axis Ax, and is arranged around the rotating shaft 41 described later. The lifting ring 15 of this embodiment is provided with each clamping rod 12. In addition, a magnet 15a (see Figure 5 to Figure 7 ). The lifting ring 15 has a pair of lifting rings 15A and 15B. The lifting rings 15A and 15B are concentric annular shapes, and the lifting ring 15A having a smaller diameter than the lifting ring 15B is arranged on the inner side of the lifting ring 15B. The inner lifting ring 15A corresponds to the clamping rod 12A and the clamping pin 11A, and the outer lifting ring 15B corresponds to the clamping rod 12B and the clamping pin 11B. Hereinafter, when the lifting ring 15A and the lifting ring 15B are not distinguished, they are referred to as the lifting ring 15.

[0042] like Figure 3 , Figure 5 to Figure 7 As shown in the figure, a height detection plate 151 for detecting the height position is provided on the lifting ring 15. The height detection plate 151 is an annular plate arranged coaxially with the lifting ring 15 and surrounding the outer circumference of the lifting ring 15. The height detection plate 151 is fixed to the lifting ring 15 via a plurality of connecting parts extending from the inner circumference thereof. Since the relative position of the height detection plate 151 and the height position of the lifting ring 15 is constant, the height position of the height detection plate 151 reflects the height position of the lifting ring 15.

[0043] This embodiment has two height detection plates 151A and 151B. The height detection plate 151A is provided on the lifting ring 15A. The height detection plate 151B is provided on the lifting ring 15B. The height detection plate 151A indicates the height position of the lifting ring 15A, and the height detection plate 151B indicates the height position of the lifting ring 15B. Hereinafter, when the height detection plate 151A and the height detection plate 151B are not distinguished, they are simply referred to as the height detection plate 151.

[0044] The clamping base 16 supports each clamping rod 12 rotatably on the lifting ring 15. More specifically, the clamping base 16 is supported on the lifting ring 15 via the lifting guide 622 described later. That is, the clamping base 16 is provided above the lifting guide 622. The clamping base 16 is provided with a lifting shaft 16a inserted into the connecting hole 12a of the clamping rod 12 in the horizontal direction. The lifting shaft 16a moves along the connecting hole 12a as the lifting ring 15 is lifted and lowered, and at the same time, a force is applied to the connecting hole 12a up and down, so that the clamping rod 12 rotates, and the clamping pin 11 moves in the opening direction and the closing direction.

[0045] like Figure 5 to Figure 7 As shown, three clamping bases 16A are provided on the inner lifting ring 15A, and are respectively connected to the clamping rods 12A. Therefore, by the lifting and lowering of the lifting ring 15A, the three clamping rods 12A rotate synchronously, and the three clamping pins 11A contact / separate with the substrate W. Three clamping bases 16B are provided on the outer lifting ring 15B, and are respectively connected to the clamping rods 12B. Therefore, by the lifting and lowering of the lifting ring 15B, the three clamping rods 12B rotate synchronously, and the clamping pins 11B contact / separate with the substrate W. Hereinafter, when the clamping base 16A and the clamping base 16B are not distinguished, they are referred to as the clamping base 16.

[0046] (rotating body)

[0047] The rotating body 30 is provided with the rotating shaft 13 of the clamping rod 12, so that the substrate W held by the clamping pin 11 rotates together with the clamping rod 12 and the lifting ring 15. Figure 1 and Figure 2 As shown, the rotating body 30 has a rotating cover 31 and a rotating base 32. The rotating cover 31 is cylindrical in shape with one end blocked by a workbench 31a. The workbench 31a is a circular surface with a diameter larger than that of the substrate W. A through hole, that is, an outlet 31c, for discharging the processing liquid is formed on the side 31b of the rotating cover 31. In addition, Figure 4 This is a cross-sectional view obtained by cutting the inside of the rotary cover 31 along a vertical plane including the axis Ax.

[0048] The rotating base 32 is a disc-shaped member provided on the lower surface of the workbench 31a and coaxial with the workbench 31a. The axis is the axis Ax serving as the center of rotation. The rotation axis 13 of the clamping rod 12 is provided on the rotating base 32. The rotating body 30 is rotatably provided on the base portion B by a rotating mechanism 40 described later, and the base portion B is fixed to a stand provided on a setting surface not shown in the figure.

[0049] The lifting ring 15, the clamping base 16, and the other end of the clamping rod 12 (the connection portion with the clamping base 16) are arranged below the workbench 31a. In addition, a plurality of through holes 31d are provided at positions along the periphery of the substrate W on the workbench 31a. In the present embodiment, six through holes 31d are provided at intervals of 60 degrees. One end of the clamping rod 12 protrudes upward from the through hole 31d, and the clamping pin 11 is exposed.

[0050] Here, the clamp pin 11 protrudes from the upper surface of the table 31a through the through hole 31d, and the cover 14 of the clamp pin 11 is held to be located on the lower surface of the table 31a. In addition, in order to prevent the processing liquid from entering the interior of the rotating mechanism 40 from the through hole 31d, the gap between the lower surface of the table 31a and the upper surface of the cover 14 of the clamp pin is extremely small. When the entire upper surface of the cover 14 is horizontal, the upper surface of the cover 14 contacts the lower surface of the table 31a through the rotation of the rod 14, which may interfere with the opening and closing action.

[0051] As described above, the cover 14 has the inclined surface 14a on its upper surface, and the inclined surface 14a is provided on the rotating mechanism 40 side relative to the rotating shaft 13 of the clamping rod 12. Thus, while reducing the gap between the lower surface of the table 31a and the cover 14, even if the clamping rod 12 rotates and the clamping pin 11 moves between the open position and the closed position, the cover 14 is prevented from contacting the lower surface of the table (imaginary line α) and interfering with the opening and closing operation.

[0052] The through hole 31d is sized to allow the opening and closing of the clamp rod 12. The six clamp pins 11 exposed from the stage 31a move in the closing direction and contact the outer peripheral end We of the substrate W, whereby the substrate W is held on the stage 31a at intervals.

[0053] (Rotation mechanism)

[0054] like Figure 1 and Figure 4As shown, the rotating mechanism 40 rotates the rotating body 30 around the axis Ax. The rotating body 30 of this embodiment is connected to the rotating shaft 41. The rotating shaft 41 is a cylindrical body whose upper end is coaxially fixed to the rotating base 32. In addition, the rotating shaft 41 also includes a case where a plurality of cylindrical bodies are connected in the axial direction. In this embodiment, the entirety is referred to as the rotating shaft 41. The axis Ax is an imaginary axis that becomes the rotation center of the rotating body 30. The axis Ax of this embodiment is also the rotation center of the rotating shaft 41 in the vertical direction. When the substrate W is normally held, the center C of the substrate W whose outer peripheral end We is held by the clamping pin 11 is positioned on the axis Ax. In addition, the rotating mechanism 40 may also be a mechanism in which the rotating shaft 41 is located at a position offset from the axis Ax and the rotation from the rotating shaft 41 is transmitted by gears or the like. That is, the rotating shaft 41 connected to the rotating body 30 only needs to be directly or indirectly connected to the rotating body 30 in a manner that allows the rotating body 30 to rotate.

[0055] In addition, if Figure 1 As shown, the rotating mechanism 40 has a driving source 42. The driving source 42 is a hollow motor having a hollow rotor and a stator for rotating the rotor, and is fixed to the base portion B (see Figure 2 The lower end of the rotating shaft 41 is connected to the rotor of the driving source 42. The driving source 42 energizes the coil of the stator to rotate the rotating shaft 41 together with the rotor.

[0056] (Lifting mechanism)

[0057] The lifting mechanism 50 raises and lowers the lifting ring 15 in a non-contact manner through the repulsive force of the magnet. Figure 2 As shown, the lifting mechanism 50 includes an opening and closing cylinder 51, an opening and closing rod 52, an opening and closing lifter 53, an opening and closing rod 54, an opening and closing ring 55, a biasing member 56, and a stopper cylinder 57. The opening and closing cylinder 51 is fixed to the lower part of the base portion B in such a manner that the driving rod is directed downward in the vertical direction. In order to independently lift the lifting ring 15A and the lifting ring 15B, the opening and closing cylinder 51 includes two opening and closing cylinders 51A and 51B.

[0058] The opening and closing rod 52 is a member rotatably provided on the base portion B with a fulcrum 52a as the center. The fulcrum 52a is provided on a support member 52b extending in a vertical direction toward the bottom of the base portion B. The end of the opening and closing rod 52 is rotatably connected to the driving rod of the opening and closing cylinder 51. The opening and closing rod 52 is formed in a U-shape to surround the driving source 42. The opening and closing rod 52 corresponds to the two opening and closing cylinders 51A and 51B, and has two opening and closing rods 52A and 52B. However, since one of the opening and closing rods 52A is nested inside the other opening and closing rod 52B, Figure 2 is hidden in.

[0059] The opening and closing lifts 53 are arranged on the base portion B so as to be able to be raised and lowered. More specifically, the opening and closing lifts 53 are supported by a support member 53a extending in a vertical direction below the base portion B via a linear guide 53b, so that they can be raised and lowered. The opening and closing lifts 53 are formed into a pair with the driving source 42 between them, and are rotatably connected to the two ends of the U-shaped opening and closing rod 52. The pair of opening and closing lifts 53 connected to the opening and closing rod 52B are the opening and closing lifts 53B. The pair of opening and closing lifts connected to the opening and closing rod 52A are the opening and closing lifts 53A described later, which are located on the inner side of the opening and closing lifts 53B. Figure 2 is hidden in.

[0060] The opening and closing rod 54 is a cylindrical member, which is provided so as to be able to be raised and lowered by the opening and closing elevator 53, and protrudes toward the upper part of the base portion B. Two opening and closing rods 54 are provided for each opening and closing elevator 53. The opening and closing rod 54 provided for the pair of opening and closing elevators 53A is the opening and closing rod 54A, and the opening and closing rod 54 provided for the pair of opening and closing elevators 53B is the opening and closing rod 54B.

[0061] The open-closed ring 55 is an annular member provided with a magnet 55a (see Figure 5 to Figure 7 ). The magnet is arranged in such a way as to generate a repulsive force on the magnet 15a of the lifting ring 15. The open-closed ring 55 is arranged at a position facing the lower side of the lifting ring 15, and the lifting ring 15 is forced upward in a non-contact manner by the repulsive force of the magnets 15a and 55a. The open-closed ring 55 has a pair of open-closed rings 55A and 55B, which face the lifting ring 15A and the lifting ring 15B respectively.

[0062] The opening and closing ring 55 is supported on the upper end of the opening and closing rod 54, and is raised and lowered together with the opening and closing lift 53 by the opening and closing rod 52 rotated by the opening and closing cylinder 51. The pair of opening and closing rings 55A and 55B are driven independently. When the opening and closing cylinder 51A is raised and lowered, the opening and closing rod 52A is rotated, and the opening and closing lift 53A is raised and lowered, so the opening and closing rod 54A raises and lowers the opening and closing ring 55A. When the opening and closing cylinder 51B is raised and lowered, the opening and closing rod 52B is rotated, and the opening and closing lift 53B is raised and lowered, so the opening and closing rod 54B raises and lowers the opening and closing ring 55B.

[0063] The urging member 56 is a member that urges the clamp rod 12 in a direction to bring the clamp pin 11 to the closed position. The urging member 56 is provided between the rotating shaft 41 and each clamp base 16 (see Figure 4 ), and applies force downward to the lower end of the clamping rod 12. The force applying member 56 is, for example, a tension coil spring, the two ends of which are hooked between a pin protruding in the horizontal direction from the rotation shaft 41 and a pin penetrating the lifting guide 622 described later. The force applying member 56 applies force downward to the lower end of each clamping rod 12, thereby applying force to each clamping pin 11 in the closed position.

[0064] The force-applying members 56 of this embodiment are the same number as the clamping rods 12, that is, six. Three force-applying members 56 correspond to the three clamping rods 12A, and three force-applying members 56 correspond to the clamping rods 12B. Since the six force-applying members 56 are arranged at equal intervals on the circumference, the force applied by the force-applying members 56 applied from the clamping pins 11 to the outer peripheral end We of the substrate W acts evenly and is balanced, and the center C of the substrate W held by the clamping pins 11 is positioned to be consistent with the axis Ax. When the two opening and closing rings 55A and 55B are raised by the opening and closing cylinders 51A and 51B, the six clamping rods 12A and 12B overcome the force applied by the force-applying members 56 and rotate, and the six clamping pins 11A and 11B are in the open position.

[0065] When only the open-closed ring 55A rises, the three clamping rods 12A rotate against the force applied by the force applying member 56, the three clamping pins 11A are in the open position, and the three clamping pins 11B remain in the closed position. When only the open-closed ring 55B rises, the three clamping rods 12B rotate against the force applied by the force applying member 56, the three clamping pins 11B are in the open position, and the three clamping pins 11A remain in the closed position.

[0066] As long as at least three clamp pins 11 are in the closed position and in contact with the outer peripheral end We of the substrate W, the substrate W can be held. In the present embodiment, by switching the raising and lowering of the open-closed ring 55A and the open-closed ring 55B, the three holding states of the substrate W can be switched: a state in which the substrate W is held by six clamp pins 11A and 11B, a state in which the substrate W is held by three clamp pins 11A, and a state in which the substrate W is held by three clamp pins 11B.

[0067] The stop cylinder 57 is arranged at a position where the driving rod faces upward in the vertical direction and faces the driving rod of the opening and closing cylinder 51. By adjusting the protrusion amount of the driving rod of the stop cylinder 57, the position where the driving rod of the opening and closing cylinder 51 stops can be adjusted, so the opening position of the clamping pin 11 caused by the lifting and lowering of the opening and closing ring 55 can be adjusted.

[0068] (Synchronous mechanism)

[0069] The synchronization mechanism 60 is a mechanism for synchronizing the rotation of the plurality of clamping rods 12. Figure 2 and Figure 3 As shown in FIG. 1 , the synchronization mechanism 60 includes a synchronization ring 61 and a conversion mechanism 62. The synchronization ring 61 is a member that is rotatable around the axis Ax and cannot be raised or lowered. The synchronization ring 61 is an annular shape that is installed along the outer periphery of the rotation shaft 41 and is coaxial with the rotation shaft 41. The synchronization ring 61 rotates together with the rotation shaft 41, but by applying a force in the horizontal tangential direction, the synchronization ring 61 also rotates around the rotation shaft 41 independently of the rotation shaft 41.

[0070] A fixing ring 41a is fixed to the outer periphery of the rotating shaft 41. A portion of the outer edge of the fixing ring 41a protrudes outward further than the outer edge of the synchronizer ring 61, and a cylindrical roller 41b is provided, which rotates around an axis parallel to the axis Ax. There are multiple portions of the fixing ring 41a protruding outward, and each portion is provided with a roller 41b, so that multiple rollers 41b are arranged along the outer edge of the fixing ring 41a. A groove is formed on the outer periphery of the roller 41b, which is in contact with the outer edge of the synchronizer ring 61, and guides the rotation of the synchronizer ring 61 around the rotating shaft 41. Two rollers 41b are arranged overlapping in the upper and lower directions in a manner to guide the two synchronizer rings 61 described below. In addition, the protruding portion of the outer edge of the fixing ring 41a and the roller 41b are configured so as not to interfere with the protruding portion of the outer edge of the synchronizer ring 61 described below.

[0071] Two synchronizer rings 61 are arranged in the upper and lower parts. The upper synchronizer ring 61A rotates by the lifting and lowering of the lifting ring 15A, and the lower synchronizer ring 61B rotates by the lifting and lowering of the lifting ring 15B. Hereinafter, the synchronizer ring 61A and the synchronizer ring 61B are referred to as synchronizer ring 61 without distinguishing between them.

[0072] The conversion mechanism 62 is a mechanism that converts the lifting and lowering of the lifting ring 15 by the lifting mechanism 50 into the rotation of the synchronization ring 61, and maintains the posture of the lifting ring 15 in a horizontal state. The conversion mechanism 62 includes a swing lever 621, a lifting guide 622, and a rotation guide 623. The swing lever 621 is an L-shaped member, and is provided so as to be able to swing with a fixed shaft 621a fixed to the outer periphery of the rotating shaft 41 as a fulcrum. A vertical movement shaft 621b is provided at the lower end of the swing lever 621, and a lateral movement shaft 621c is provided at the upper end of the swing lever 621.

[0073] The lifting guide 622 is fixed to each of the lifting rings 15A and 15B. In addition, the lifting guide 622 is arranged at a position corresponding to each clamping base 16, that is, a position corresponding to each clamping rod 12 and each clamping pin 11. A horizontally long guide hole 622a is formed in the lifting guide 622. The vertically movable shaft 621b is inserted into the guide hole 622a in a manner that can rotate and slide. The rotating guide 623 is fixed to the synchronizer ring 61 in a state that it can rotate around the axis in the vertical direction and cannot move up and down. More specifically, the synchronizer ring 61 has protrusions 61a at multiple locations, and the shaft 62a extending from the rotating guide 623 in the vertical direction is embedded in the through hole provided in the protrusion 61a. The protrusions 61a are respectively provided in the upper and lower synchronizer rings 61, and are arranged so as not to interfere with each other as the synchronizer ring 61 rotates. A vertically long guide groove 623a is formed in the rotating guide 623. The lateral movement shaft 621c is inserted into the guide groove 623a in a rotatable and slidable manner.

[0074] As the lifting ring 15 is lifted and lowered, the lifting guide 622 applies force to the vertical movement shaft 621b through the guide hole 622a to lift it, so that the swing lever 621 swings. As a result, the lateral movement shaft 621c of the swing lever 621 applies force to the rotation guide 623 through the guide groove 623a to move it laterally, so that the synchronizer ring 61 rotates.

[0075] The conversion mechanism 62 is a pair of conversion mechanisms 62 that are arranged at positions facing each other across the axis Ax, and at least one group is provided. In the present embodiment, the conversion mechanism 62 has: a pair of conversion mechanisms 62A that connect the lifting ring 15A and the synchronization ring 61A; and a pair of conversion mechanisms 62B that connect the lifting ring 15B and the synchronization ring 61B. That is, the present embodiment has two groups of a pair of conversion mechanisms 62. The pair of conversion mechanisms 62A and the pair of conversion mechanisms 62B are preferably respectively arranged on straight lines passing through the axis Ax. Hereinafter, when the conversion mechanism 62A and the conversion mechanism 62B are not distinguished, they are referred to as the conversion mechanism 62. In addition, since only one group limits one direction of the horizontal plane, it is preferred to set more than two groups, and by limiting more than two directions of the horizontal plane, the center of the lifting ring 15 is consistent with the axis Ax. In this way, the consistency of the center of the lifting ring 15 with the axis Ax is related to the consistency of the center of the substrate W with the axis Ax.

[0076] In addition, as described later, as long as the abnormality of the clamp pin 11 can be detected by the inclination of the lifting ring 15, the pair of conversion mechanisms 62 may be arranged at a position slightly offset from the straight line passing through the axis Ax. For example, in order to avoid interference with other components such as the clamp base 16, it may be arranged at a position slightly offset from the straight line passing through the axis Ax. This case also includes positions facing each other across the rotating shaft 41. In addition, it is preferred that the straight line through which the pair of conversion mechanisms 62A pass is orthogonal to the straight line through which the pair of conversion mechanisms 62B pass, but as described above, in order to avoid interference with other components, they may not be orthogonal.

[0077] (Supply Department)

[0078] like Figure 1 As shown in FIG. 1 , the supply unit 70 supplies the processing liquid to the substrate W held by the clamp pins 11 and rotated by the rotating body 30. The supply unit 70 supplies the processing liquid to the surface of the substrate W, that is, the surface of the substrate W held by the holding unit 10 on the side opposite to the worktable 31a side. The supply unit 70 includes a processing liquid supply mechanism 71, a processing liquid holding unit 72, a lifting unit 73, and a heating unit 74.

[0079] The treatment liquid supply mechanism 71 is a mechanism for supplying a plurality of treatment liquids. In the present embodiment, for example, pure water (H2O), an aqueous solution containing phosphoric acid (H3PO4) (hereinafter referred to as a phosphoric acid solution), and an aqueous solution containing hydrogen fluoride (HF) (hereinafter referred to as a hydrofluoric acid solution) are supplied as treatment liquids. The treatment liquid supply mechanism 71 has a treatment liquid tank 71a for storing each treatment liquid.

[0080] The dedicated delivery pipe 71b is connected to the processing liquid supply pipe 71c in parallel from each processing liquid tank 71a. The front end of the processing liquid supply pipe 71c faces the substrate W held by the holding unit 10. Thus, the processing liquid from each processing liquid tank 71a is supplied to the surface of the substrate W via the dedicated delivery pipe 71b and the processing liquid supply pipe 71c. A flow rate adjustment valve 71d and a flow meter 71e are provided in each dedicated delivery pipe 71b.

[0081] The processing liquid holding portion 72 is circular in shape with a diameter larger than that of the substrate W, and has a basin shape by forming a wall rising toward the side opposite to the rotating body 30 at the peripheral portion. The outer bottom surface of the processing liquid holding portion 72 faces the substrate W. The processing liquid holding portion 72 has a discharge port 72a through which the front end of the processing liquid supply pipe 71c is inserted and exposed toward the substrate W side.

[0082] The lifting unit 73 is a mechanism for moving the processing liquid holding unit 72 in a direction of contact with / separation from the substrate W. As the lifting unit 73, various mechanisms such as a cylinder and a ball screw mechanism for moving the processing liquid holding unit 72 in a direction parallel to the axis of the rotating body 30 can be applied, but the details are omitted.

[0083] The heating unit 74 heats the processing liquid supplied by the supply unit 70 to the surface of the substrate W. The heating unit 74 includes a heater 741 provided on the surface of the processing liquid holding unit 72 opposite to the surface facing the substrate W. The heater 741 is a circular sheet. The heater 741 is formed with a through hole 741a through which the processing liquid supply pipe 71c is inserted.

[0084] (Detection Department)

[0085] like Figure 5 to Figure 7As shown, the detection unit 80 detects the height position of the lifting ring 15. The detection unit 80 is a reflective optical sensor that detects the distance to the detection object in a non-contact manner. The detection unit 80 is fixed to the base portion B below the height detection plate 151, and detects the distance to the height detection plate 151. The detection unit 80 has a detection unit 80A and a detection unit 80B. The detection unit 80A is arranged below the height detection plate 151A, and detects the height position of the lifting ring 15A according to the distance from the height detection plate 151A. The detection unit 80B is arranged below the height detection plate 151B, and detects the height position of the lifting ring 15B according to the distance from the height detection plate 151B. Hereinafter, when the detection unit 80A, the detection unit 80B, the height detection plate 151A, and the height detection plate 151B are not distinguished, they are simply referred to as the detection unit 80 and the height detection plate 151.

[0086] The detection unit 80 may be single or multiple. In the case of a single detection unit, the lifting ring 15 is rotated together with the rotating body 30 to detect the height positions of multiple locations in the circumferential direction. In the case of multiple detection units, each detection unit 80 detects the height positions of multiple locations in the circumferential direction.

[0087] (Control device)

[0088] The control device 90 controls each part of the substrate processing apparatus 1. In order to realize various functions of the substrate processing apparatus 1, the control device 90 has a processor for executing a program, a memory for storing various information such as a program or an operation condition, and a drive circuit for driving each component. That is, the control device 90 controls the rotating mechanism 40, the lifting mechanism 50, the supply unit 70, etc. In addition, the control device 90 has an input device for inputting information and a display device for displaying information.

[0089] In this embodiment, the control device 90 includes an opening and closing control unit 91, a rotation control unit 92, and a determination unit 93. The opening and closing control unit 91 controls the opening and closing cylinder 51 of the lifting mechanism 50 to raise and lower the opening and closing ring 55, and raise and lower the lifting ring 15 by the repulsive force of the magnets 15a and 55a, thereby opening and closing the clamp pin 11. When the opening and closing ring 55 rises and the lifting ring 15 rises, the clamp rod 12 overcomes the force applied by the force member 56 and rotates, and the clamp pin 11 is in an open state away from the outer peripheral end We of the substrate W. When the opening and closing ring 55 descends and the lifting ring 15 descends, the clamp rod 12 rotates by the force applied by the force member 56, and the clamp pin 11 is in a closed state in contact with the outer peripheral end We of the substrate W.

[0090] The rotation control unit 92 controls the rotation of the rotating body 30 and the substrate W held by the clamp pins 11 by controlling the driving source 42 of the rotating mechanism 40. In addition, the rotation control unit 92 can rotate the lifting ring 15 together with the rotating body 30 to change the position of the lifting ring 15 detected by the detection unit 80.

[0091] The determination unit 93 determines whether the clamp pins 11 are holding the substrate W normally based on the height position of the lifting ring 15 detected by the detection unit 80. Figure 5 As shown, when the difference in the height position Da of each portion of the lifting ring 15 detected by the detection unit 80 is within a predetermined threshold value range, it can be determined that the clamp pins 11 are holding the substrate W normally. Figure 5 (A) indicates that the clamping pin 11A is used to maintain the device normally. Figure 5 (B) shows that the clamping pin 11B is normally held.

[0092] Figure 6 (A) shows the lifting ring which is normally maintained and at a normal height position by the clamp pin 11. Figure 6 (B) shows an abnormal holding and height position of the lifting ring using the clamp pin 11. Figure 6 As shown in (B), when the difference in height position Db of each part of the lifting ring 15 detected by the detection unit 80 is outside the predetermined threshold range, it can be determined that the lifting ring 15 is tilted due to abnormal holding of the substrate W by the clamp pins 11. Figure 6 (B) is a case where the clamp pin 11B is abnormally held. In this case, the inclination of the lifting ring 15A holding the normal clamp pin 11A increases, and the height detection plate 151A descends. On the other hand, the lifting ring 15B holding the abnormal clamp pin 11B also moves from the normal height (refer to Figure 6 Therefore, the detection unit 80A and the detection unit 80B can both detect the occurrence of an abnormality when the difference in height position Db is greater than a predetermined threshold value, and the occurrence of an abnormality in the clamping pin 11A or the clamping pin 11B corresponding to the one with the greater height position Db difference can be detected based on which of the detection units 80A and 80B detects a greater height position Db difference.

[0093] In addition, if Figure 7 As shown, when the difference in height position Dc of each portion of the lifting ring 15 detected by the detection unit 80 is within a predetermined threshold range, the determination unit 93 can determine that the clamp pin 11 is in the open position away from the substrate W. Figure 7 (A) shows the case where the clamp pin 11A is in the open position while being held only by the clamp pin 11B. Figure 7(B) shows a case where the clamp pin 11B is in the open position in a state where the clamp pin 11A is held alone.

[0094] Reference Figure 8 The principle and method of such determination will be described. In the following description, the mechanism for opening and closing the clamp pin 11A is sometimes referred to as the A-side mechanism, and the mechanism for opening and closing the clamp pin 11B is sometimes referred to as the B-side mechanism. In addition, M represents a straight line connecting the parts where the pair of conversion mechanisms 62A are arranged, and N represents a straight line connecting the parts where the pair of conversion mechanisms 62B are arranged.

[0095] Figure 8 (A) shows a state where all the clamp pins 11A and 11B normally hold the substrate W. In this normal state, the center C of the substrate W coincides with the axis of rotation Ax, and the substrate W and the lifting rings 15A and 15B are kept horizontal.

[0096] Figure 8 (B) shows a state where an abnormality has occurred in the holding of any clamp pin 11B on the B side. In this state, the clamp pin 11B (hereinafter indicated by black) that has an abnormality presses the substrate W in the direction indicated by the white arrow in the figure by the force applied from the opposing clamp pin 11A. Therefore, as shown by the arc-shaped arrow, the corresponding lifting ring 15B descends to a position lower than the normal position with M as the axis and tilts, and the center C of the substrate W deviates from the rotation axis Ax in the direction of the black arrow in the figure. The clamp pin 11A without an abnormality also deviates from the normal position following this positional deviation of the substrate W, so the lifting ring 15A also descends to a position lower than the normal position.

[0097] Therefore, since the distances between the lifting ring 15A and the lifting ring 15B detected by the detection unit 80A and the detection unit 80B are smaller than the predetermined threshold, it can be determined that an abnormality has occurred. In addition, since the tilt of the lifting ring 15B corresponding to the clamp pin 11B in which the abnormality has occurred increases, and the difference in the distances between the plurality of locations detected by the detection unit 80B is larger than the predetermined threshold, it can be determined that an abnormality has occurred in the holding of any of the clamp pins 11B.

[0098] Figure 8 (C) indicates a state where an abnormality has occurred in the retention of any clamp pin 11A on the A side. Figure 8 (D) indicates Figure 8(C) A state where the clamp pin 11A on the A side is abnormally held. In these cases, since the distances to the lifting rings 15A and 15B detected by the detection units 80A and 80B are smaller than the predetermined threshold, it can be determined that an abnormality has occurred. Furthermore, since the inclination of the lifting ring 15A corresponding to the abnormal clamp pin 11A with N as the axis increases, it can be determined that an abnormality has occurred in the holding of any of the clamp pins 11A.

[0099] [action]

[0100] In the Figures 1 to 8 Based on the reference Fig. 9 The operation of the substrate processing apparatus 1 according to the present embodiment described above will be described in the flowchart. In addition, a substrate processing method for processing a substrate according to the following procedure is also one aspect of the present embodiment.

[0101] First, if Figure 2 As shown, by using the opening and closing cylinder 51 to raise the lifting ring 15, the clamping rod 12 is rotated to overcome the force applied by the force applying member 56, so that the plurality of clamping pins 11 are in the open position. Figure 1 The processing liquid holding portion 72 of the supply portion 70 shown is located at an upper standby position.

[0102] In this state, the substrate W mounted on the manipulator of the transfer robot is moved between the processing liquid holding portion 72 and the rotating body 30 (step S01). The opening and closing cylinder 51 is operated to lower the lifting ring 15, thereby rotating the clamp rod 12 by the force applied by the force applying member 56, so that the plurality of clamp pins 11 are moved to the closed position (step S02).

[0103] Then, the inclined surface of the support portion 11 a that moves together with the clamp pin 11 moves and supports the lower edge of the outer peripheral end We of the substrate W so as to slide, and the clamp pin 11 abuts against the outer peripheral end We of the substrate W and holds it.

[0104] At this time, the opening and closing cylinders 51A and 51B lower the lifting rings 15A and 15B so that all six clamp pins 11A and 11B hold the outer peripheral end We of the substrate W. Thus, the center C of the substrate W is positioned on the rotation axis Ax by the six clamp pins 11A and 11B.

[0105] As described above, when the determination unit 93 determines that the height positions of the plurality of locations of the lifting ring 15 detected by the detection unit 80 are normal (YES in step S03) ( Figure 5The driving source 42 is operated, and the rotating body 30 starts rotating (step S06). The rotating body 30 is set to a relatively low predetermined speed (for example, about 50 rpm), and the substrate W is rotated together with the holding part 10 at the predetermined speed.

[0106] When the determination unit 93 determines that any of the clamp pins 11A and 11B is not in the normal position (NO in step S03), the substrate W is re-held (step S04). That is, the lifting ring 15 is raised to maintain the support of the substrate W by the support portion 11a, while the clamp pins 11 are slightly separated from the outer peripheral end We of the substrate W. Then, the lifting ring 15 is lowered again, and the clamp pins 11 hold the outer peripheral end We of the substrate W.

[0107] After the re-holding operation, if the determination unit 93 determines that the clamp pins 11 are in the normal position (Yes in step S05), the drive source 42 is operated, so that the rotating body 30 starts to rotate (step S06). After the re-holding operation, if the determination unit 93 determines that the holding of the clamp pins 11 is not normal (No in step S05), the plurality of clamp pins 11 are also moved to the open position (step S18). Then, the substrate W is carried out by the robot (step S19).

[0108] When the holding of the clamp pin 11 becomes normal and the rotating body 30 starts to rotate, the etching liquid as the processing liquid is supplied from the discharge port 72a of the processing liquid holding part 72 to the gap between the processing liquid holding part 72 and the surface of the substrate W by the processing liquid supply mechanism 71 (step S07). That is, when the hydrofluoric acid solution is supplied to the surface of the rotating substrate W, the etching liquid sequentially moves toward the outer peripheral end We of the substrate W, so that the surface of the substrate W is etched, thereby removing the oxide film and organic matter.

[0109] Next, the processing liquid supply mechanism 71 stops supplying the etching liquid (step S08), and supplies pure water from the nozzle 72a to the gap between the processing liquid holding portion 72 and the surface of the substrate W (step S09). When the pure water is supplied to the surface of the rotating substrate W, the pure water moves toward the outer peripheral end We of the substrate W in sequence, thereby washing away the hydrofluoric acid solution on the surface of the substrate W. Then, the processing liquid supply mechanism 71 stops supplying the pure water (step S10).

[0110] The processing liquid holding part 72 descends to bring the heater 741 close to the substrate W (step S11). The processing liquid supply mechanism 71 supplies the phosphoric acid solution to the gap between the processing liquid holding part 72 and the surface of the substrate W (step S12). In this way, the phosphoric acid solution supplied between the processing liquid holding part 72 and the surface of the substrate W is heated by the processing liquid holding part 72 heated by the heater 741 to a high temperature.

[0111] In this state, when the phosphoric acid solution is continuously supplied from the nozzle 72a of the processing liquid holding portion 72, the phosphoric acid solution moves sequentially on the surface of the substrate W toward the outer peripheral end We of the substrate W, thereby replacing the pure water on the surface of the substrate W with phosphoric acid and removing the nitride film by etching.

[0112] Next, the processing liquid supply mechanism 71 stops supplying the phosphoric acid solution, and the processing liquid holding unit 7 rises (step S13). The processing liquid supply mechanism 71 supplies pure water from the nozzle 72a to the gap between the processing liquid holding unit 72 and the surface of the substrate W (step S14). When the pure water is supplied to the surface of the rotating substrate W, the pure water moves toward the outer peripheral end We of the substrate W in sequence, thereby washing away the phosphoric acid on the surface of the substrate W.

[0113] Then, when the predetermined cleaning time has passed, the processing liquid supply mechanism 71 stops supplying pure water (step S15). Then, the processing liquid holding unit 72 rises (step S16), the driving source 42 stops, and the rotating body 30 stops rotating, thereby stopping the rotation of the substrate W (step S17).

[0114] Then, the robot is inserted under the substrate W, and the opening and closing cylinder 51 is operated to raise the lifting ring 15, thereby rotating the clamping rod 12, so that the plurality of clamping pins 11 are moved to the open position (step S18). Then, the substrate W is carried out by the robot (step S19).

[0115] Furthermore, during the processing of the substrate W, the clamp pins 11A and 11B are replaced to suppress the occurrence of uneven processing. That is, the state in which the substrate W is held by six clamp pins 11A and 11B, the state in which the substrate W is held by only three clamp pins 11A with three clamp pins 11B in an open position, and the state in which the substrate W is held by only three clamp pins 11B with three clamp pins 11A in an open position are switched. In this way, it is possible to prevent the time for which specific clamp pins 11A and 11B are in contact with the substrate W from becoming longer, thereby suppressing the occurrence of uneven processing caused by the accumulation of processing liquid at the contact position.

[0116] However, when switching between the holding state held by only three clamping pins 11A and the holding state held by only three clamping pins 11B, in order to prevent the center position of the substrate W from being shifted or held incorrectly, the holding state held by six clamping pins 11A and 11B is interposed during the switching. That is, for example, the switching operation is performed in the manner of holding by six clamping pins (11A, 11B) → ​​holding by three clamping pins (11A) → holding by six clamping pins (11A, 11B) → ​​holding by three clamping pins (11B) → ​​holding by six clamping pins (11A, 11B) → ​​holding by three clamping pins (11A) → holding by six clamping pins (11A, 11B) → ​​holding by three clamping pins (11B) → ​​holding by six clamping pins (11A, 11B) ... Moreover, before the rotation starts and before the rotation stops, the holding state held by six clamping pins 11A and 11B must be set.

[0117] Furthermore, during the processing of the substrate W (steps S06 to S17), when the determination unit 93 determines that the holding of the clamp pins 11 is abnormal based on the height position of the lifting ring 15 detected by the detection unit 80, the control device 90 stops the substrate processing. That is, when the fluctuation range of the height position of the rotating lifting ring 15 is outside the range of a predetermined threshold value, the holding of the clamp pins 11 is abnormal, and the control device 90 immediately takes countermeasures such as stopping the device.

[0118] [Effect]

[0119] (1) As described above, the substrate processing device 1 of the present embodiment comprises: at least three clamping pins 11 for holding the outer peripheral end We of the substrate W; a clamping rod 12 provided with the clamping pin 11, which moves between an open position away from the outer peripheral end We of the substrate W and a closed position in contact with the outer peripheral end We of the substrate W and holding the substrate W as it rotates around an axis (rotation axis 13) in the horizontal direction; a lifting ring 15 that rotates the clamping rod 12 as it is lifted; and a rotating body 30 provided with the rotation axis 13 of the clamping rod 12, which rotates the substrate W held by the clamping pin 11 together with the clamping rod 12 and the lifting ring 15. The rotating body 30 is provided with a rotating mechanism 40 for rotating the rotating body 30 around the axis Ax (the rotating axis 41 in the vertical direction); the lifting mechanism 50 for lifting and lowering the lifting ring 15 in the direction along the axis Ax; the force-applying member 56 for applying force to the clamping rod 12 in the direction in which the clamping pin 11 is in the closed position; the synchronous ring 61 is arranged to be able to rotate around the axis Ax and cannot be lifted or lowered; the conversion mechanism 62 for converting the lifting and lowering of the lifting ring 15 by the lifting mechanism 50 into the rotation of the synchronous ring 61, and maintaining the posture of the lifting ring 15 in a horizontal state; and the supply part 70 for supplying the processing liquid to the substrate W held by the clamping pin 11 and rotated by the rotating body 30.

[0120] Therefore, by raising the lifting ring 15 by the lifting mechanism 50, the clamping rod 12 rotates to overcome the force applied by the force member 56, and the clamping pin 11 is in the open position. By lowering the lifting ring 15 by the lifting mechanism 50, the clamping rod 12 rotates according to the force applied by the force member 56, and the clamping pin 11 is in the closed position. At this time, the lifting ring 15 is connected to the synchronous ring 61 that can rotate but cannot be raised and lowered through the conversion mechanism 62, so it is lowered while maintaining the horizontal direction. Therefore, there is no deviation in the movement of each clamping pin 11 caused by the inclination of the lifting ring 15, and the clamping pin 11 is synchronously connected to the outer peripheral end We of the substrate W. The force applied by the force member 56 acts on at least three clamping pins 11 to hold the outer peripheral end We of the substrate W, so that the substrate W is positioned in a state where the combined force of all the clamping pins 11 is zero, that is, the center C of the substrate W is aligned with the axis Ax.

[0121] For example, Fig.10 As shown, even in a structure in which the clamping pin 11 is opened and closed by the up and down movement of the lifting ring 15, and there is no synchronization mechanism 60 (synchronization ring 61), the combined force of the clamping pin 11 can be made zero to hold the substrate W. However, in the absence of the synchronization mechanism 60, when the substrate W is held in a state in which the forces of all the clamping pins 11 are balanced by the combined force of the force applying member 56, the centrifugal force acting due to the rotation of the substrate W causes the substrate W to move in the direction in which the centrifugal force is applied, and the center C of the substrate W is offset from the axis Ax (rotation axis 41). In addition, in the event of an abnormality in the clamping pin 11 or the clamping rod 12, the center C of the substrate W is located at a position deviating from the axis Ax. In this state, the combined force of the force applying member 56 balances the forces of all the clamping pins 11 holding the substrate W, which means that a balanced state is achieved and the forces applied by the force applying member 56 are offset. When the forces applied by the force applying member 56 are offset, as shown in FIG. Fig.10 As shown in FIG. 1 , the lifting ring 15 may be tilted. This is because the lifting ring 15 is restricted in the rotation direction but not in the vertical direction. In this embodiment, the lifting ring 15 is restricted in the vertical direction but not in the rotation by the conversion mechanism 62 and the synchronization mechanism 60, so that the lifting ring can be maintained in a horizontal state, so that the center of the substrate W can be aligned with the axis Ax.

[0122] That is, in the present embodiment, the lifting ring 15 is connected to the synchronization ring 61 via the conversion mechanism 62, and the synchronization ring 61 does not rise or fall but rotates as the lifting ring 15 rises or falls. Therefore, when the substrate W rotates, even if a force that is intended to rotate the clamp rod 12 due to the centrifugal force applied to any clamp pin 11 acts, the lifting ring 15 supporting the clamp rod 12 is inhibited from rising by the synchronization ring 61. Even if a force that is intended to rotate a certain clamp pin 11 and clamp rod 12 due to the centrifugal force acts to raise the lifting ring 15, the other clamp pins 11 also synchronize, so that in order to actually raise the lifting ring 15, a force that is intended to open the other clamp pins 11 and clamp rods 12 is required. Therefore, the force that is intended to lift the lifting ring 15 and rotate the synchronization ring 61 becomes a resistance, and even if the substrate W presses the clamp pins 11 and clamp rod 12 due to the centrifugal force, the clamp pins 11 and clamp rod 12 cannot be opened. As a result, the clamp rod 12 becomes less likely to rotate, and the movement of the clamp pin 11 to the open position is suppressed, so that the positioning of the substrate W is stabilized.

[0123] Furthermore, when the lifting ring 15 is lowered, the clamping rod 12 is closed and the clamping pins 11 in contact with the outer peripheral end We of the substrate W move the substrate W, thereby moving the center of the substrate W to the rotation center (axis Ax). At this time, not all clamping pins 11 are in contact with the outer peripheral end We of the substrate W at the same time. When the substrate W is transported by the robot, the substrate W is placed in a skewed state by the inclined surface of the clamping pins 11. That is, when the lifting ring 15 is lowered and the clamping pins 11 are moved in the closing direction, a part of the clamping pins 11 first contact the outer peripheral end We of the substrate W. For example, in the absence of a synchronization mechanism 60, if the movement stops in the middle, only the clamping pins 11 that are not in contact with the outer peripheral end We move, thereby maintaining the substrate W in a tilted state of the lifting ring 15. In this embodiment, the lifting ring 15 is raised and lowered while maintaining a horizontal state through the conversion mechanism 62 and the synchronization mechanism 60. Therefore, even if there is a deviation in the timing when the clamping pin 11 contacts the outer peripheral end We of the transported substrate W, the inclination of the lifting ring 15 can be suppressed, so that the center of the substrate W is aligned with the axis Ax when the clamping pin 11 is finally closed.

[0124] In addition, for example, it is also conceivable to provide an axial slide (linear guide) parallel to the axis Ax of the rotating body 30 on the lifting ring 15 to lift the lifting ring 15. However, in this case, by providing the axial slide, the weight of the rotating body 30 and the rotating shaft 41 is increased, and the load on the motor is increased. Furthermore, in order to lift and lower without eccentric rotation and maintain horizontality, it is necessary to arrange a plurality of axial slides opposite to each other with the rotating shaft 41 interposed therebetween, thereby further reducing the weight. In this embodiment, since a synchronizer ring 61 that rotates coaxially with the rotating shaft 41 via a conversion mechanism 62 is used, the rotating part can be made lighter, thereby suppressing eccentric rotation.

[0125] In addition, for example, it is conceivable to suppress the tilting of the lifting ring 15 by moving a cylindrical slider that is long in the axial direction along the shaft and lifting the lifting ring 15 by the slider. However, in the case of a cylindrical slider, in order to smoothly lift and lower the shaft relative to the cylindrical part, it is necessary to make the diameter of the hole of the cylindrical part larger than the diameter of the shaft to leave room. That is, since a gap (play) is formed between the hole of the cylindrical part and the shaft, the shaft is easy to tilt. As a result, the lifting ring 15 is also tilted, and the clamping rod 12 is tilted, and the substrate W cannot be positioned on the axis Ax of the rotation center. In addition, if the diameter of the hole of the cylindrical part is set to eliminate the play with the shaft, the contact between the shaft and the cylindrical part increases and becomes a resistance, and the lifting ring 15 may not be able to be lifted and lowered smoothly. In this embodiment, the lifting and lowering of the lifting ring 15 is converted into the rotation of the synchronization ring 61 by the conversion mechanism 62, and the posture of the lifting ring 15 is maintained in a horizontal state, so this kind of shaking does not occur.

[0126] (2) The device comprises: a detection unit 80 for detecting the height position of the lifting ring 15; and a determination unit 93 for determining whether the clamp pins 11 are holding the substrate W normally based on the height position of the lifting ring 15 detected by the detection unit 80.

[0127] When an abnormality occurs in the clamp pin 11 or the clamp rod 12 and the clamp pin 11 cannot hold the substrate W, the lifting ring 15 tilts with the line connecting the pair of conversion mechanisms 62 as an axis. Therefore, the determination unit 93 determines the abnormality of the clamp pin 11 holding the substrate W based on the height position of the lifting ring 15, thereby preventing the substrate W from being released from holding or the failure of the device.

[0128] (3) The lifting mechanism 50 raises and lowers the lifting ring 15 in a non-contact manner by utilizing the repulsive force of the magnets 15a and 55a. Therefore, the lifting ring 15 can be raised and lowered while rotating together with the rotating body 30. In addition, since a gap is generated between the lifting mechanism 50 and the lifting ring 15, it is possible to determine abnormality in holding the substrate W based on changes in the height position of the lifting ring 15.

[0129] (4) The clamp pins 11 are arranged in groups of three or more arranged every other one around the rotation axis 41, and six or more clamp pins are provided. The lifting mechanism 50, the lifting ring 15, the synchronization ring 61, and the conversion mechanism 62 are provided in at least one group of clamp pins 11. Therefore, during the process, the substrate W can be replaced by the three clamp pins 11, thereby preventing uneven processing caused by the accumulation of the processing liquid.

[0130] In addition, three clamp pins 11 are the minimum number that can hold the substrate W. If the load on any one clamp pin 11 increases due to the centrifugal force, the substrate W cannot be supported by the other two clamp pins 11, and the displacement increases. However, as described above, the clamp pins 11 of the present embodiment hold the substrate W, and by using the synchronization ring 61 and the conversion mechanism 62, the three clamp pins 11 are not easily displaced even when the centrifugal force is applied, so the substrate W can be stably replaced.

[0131] Furthermore, when an abnormality occurs in the holding of the clamp pins 11 of one of the groups, as described above, the inclination of the lifting ring 15 of the abnormal other group becomes larger, thereby causing differences between groups, so it is determined that an abnormality has occurred in any clamp pin 11 of any group.

[0132] (5) The conversion mechanism 62 has a swing lever 621 that swings around a fixed axis in the horizontal direction orthogonal to the axis Ax as a fulcrum, and converts the lifting and lowering of the lifting ring 15 into the rotation of the synchronizer ring 61. Therefore, the lifting and lowering action of the lifting ring 15 can be efficiently converted into a lateral action by the swing lever 621 that swings around the fixed axis as a fulcrum, thereby rotating the synchronizer ring 61. In addition, by providing a plurality of conversion mechanisms 62 around the rotating shaft 41, the lifting ring 15 can be lifted and lowered while maintaining a horizontal state more stably, thereby stabilizing the position of the clamp pin 11.

[0133] [Modifications]

[0134] (1) The conversion mechanism 62 only needs to be able to convert the lifting action of the lifting ring 15 into the rotation of the synchronization ring 61. Fig.11 As shown in (A), in principle, the lifting action is converted into rotation through the L-shaped connecting rod L, for example, Fig.12 As shown, the conversion mechanism 62 can also be composed of a sliding shaft 624 and a sliding member 625. The sliding shaft 624 is set on the lifting ring 15 and is inclined relative to the axis Ax. The sliding member 625 is connected to the synchronous ring 61 and moves along the sliding shaft 624 that rises and falls together with the lifting ring 15, thereby rotating the synchronous ring 61.

[0135] More specifically, the sliding shaft 624 is a cylindrical member, and is provided on a sliding shaft base 624a fixed to the lifting ring 15. The slider 625 has a sleeve through which the sliding shaft 624 is inserted. In the synchronizer ring 61, a conversion member 625a is provided on a rotary shaft 625b parallel to the rotating shaft 41 so as to be rotatable in the horizontal direction. The slider 625 is connected to the conversion member 625a via a radial shaft 625c in the radial direction of the rotation circle of the rotating shaft 41 so as to be slidable in the radial direction.

[0136] When the lifting ring 15 rises, the sliding shaft 624 rises, and the sliding member 625 moves along the inclination of the sliding shaft 624, thereby applying force to the radial shaft 625c in the tangential direction of the rotation circle of the synchronizer ring 61. Then, the conversion member 625a is urged together with the radial shaft 625c, so that the conversion member 625a rotates around the rotating shaft 625b, and the synchronizer ring 61 is urged to rotate in the circumferential direction.

[0137] In this way, the radial deviation generated between the linear movement of the slider 625 and the rotational movement of the synchronizer ring 61 can be absorbed by the sliding movement of the slider 625 relative to the radial axis 625c and the rotation of the conversion member 625a. That is, by having two degrees of freedom, the movement of the conversion mechanism 62 can be stabilized.

[0138] In addition, if Fig.11 As shown in (B), the lifting action can also be changed by using the connecting rod L of the cam. Fig.13 As shown, the conversion mechanism 62 can also be composed of a cam 626 and a cam shaft 627. The cam 626 is set on the lifting ring 15 and is inclined relative to the axis Ax. The cam shaft 627 is connected to the synchronizer ring 61 and moves along the cam 626 that rises and falls together with the lifting ring 15, thereby rotating the synchronizer ring 61.

[0139] More specifically, the cam 626 is a long hole formed in a cam base 626a fixed to the lifting ring 15. The cam 626 is inclined relative to the axis Ax. The cam shaft 627 is a cylindrical member inserted into the cam 626. In the synchronizer ring 61, the cam shaft 627 is provided so as to be able to rotate in the horizontal direction around an axis parallel to the axis Ax. In the cam shaft 627, a horizontal axis 627b fixed to the tangent direction of the rotating circle of the synchronizer ring 61 is inserted into the rotating shaft 41 so as to be able to slide and move.

[0140] When the lifting ring 15 rises, the cam 626 rises, and when the cam shaft 627 moves along the slope in the cam 626, the cam shaft 627 moves horizontally along the horizontal axis 627b and applies force to the synchronizer ring 61 in the tangential direction of the rotating circle. As a result, the synchronizer ring 61 is urged in the circumferential direction to rotate.

[0141] In this conversion mechanism 62 based on the cam 626, due to the friction between the cam 626 and the camshaft 627, a larger force is required to open the clamp pin 11. Therefore, even if centrifugal force is applied, the position of the clamp pin 11 is not easily offset.

[0142] In addition, if Fig.11 As shown in (C), a conversion mechanism 62 may be provided that converts the lifting motion into the rotation motion using a linear link L having two rotation fulcrums.

[0143] (2) In the case where no switching action is performed, a structure using a single synchronizer ring 61 may also be adopted. Fig.14 As shown, by fixing three conversion mechanisms 62 on the inner lifting ring 15A and connecting it to the synchronization ring 61, the lifting ring 15A can be raised and lowered while maintaining a horizontal state. Three clamping pins 11A are arranged on the lifting ring 15A. The lifting ring 15B is not provided with a conversion mechanism 62, but is provided with three clamping pins 11B. The open and closed ring 55 is shared by the lifting ring 15A and the lifting ring 15B. By raising and lowering the open and closed ring 55, the lifting ring 15A and the lifting ring 15B are raised and lowered at the same time. Thus, the center C of the substrate W can be positioned on the axis Ax by the six clamping pins 11A and 11B. More specifically, the center C of the substrate W is positioned (centered) on the axis Ax by the three clamping pins 11A provided on the lifting ring 15A, and the outer periphery of the centered substrate W is gripped by the three clamping pins 11B. At this time, through the lifting and lowering action of the two lifting rings and the rotation action of the synchronization ring 61, the center C of the substrate W moves from the direction where the conversion mechanism 62 is configured to the direction toward the axis Ax, so that the substrate W is centered. In the case of normal holding, the lifting ring 15A and the lifting ring 15B are at the same height in a horizontal state, thereby confirming that the substrate W is normally centered and held. Similar to the above, in the event that any of the clamping pins 11A and 11B has an abnormality, the abnormality can be determined by the descent and tilting of the lifting ring 15A and the lifting ring 15B. The number of clamping pins 11 is not limited, but at least three is sufficient. Therefore, in Fig.14 In a modified example, a configuration without the lifting ring 15B and the three clamp pins 11B is also possible.

[0144] (3) The lifting mechanism 50 is not limited to the above-described form. For example, a contact type structure may be adopted instead of a non-contact type structure based on the repulsive force of a magnet, for example, a structure in which a cam follower capable of lifting and lowering is used to make the rotating roller of the cam follower contact with the lifting ring 15 so that the lifting and lowering ring 15 can be rotated while the lifting and lowering ring 15 is lifted and lowered.

[0145] (4) The processing contents and processing liquid of the substrate processing apparatus 1 are not limited to the above-mentioned examples. The substrate W and film to be processed are also not limited to the above-mentioned examples.

[0146] [Other embodiments]

[0147] Although the embodiments of the present invention and the modified examples of each part are described above, the embodiments or the modified examples of each part are provided as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments or their modifications are included in the scope or the main idea of ​​the invention, and are included in the invention described in the claims.

[0148] Explanation of symbols

[0149] 1: Substrate processing equipment

[0150] 10: Maintaining part

[0151] 11, 11A, 11B: Clamping pin

[0152] 11a: Supporting part

[0153] 12, 12A, 12B: Clamping rod

[0154] 12a: Connection hole

[0155] 13: Rotation axis

[0156] 14: Cover

[0157] 14a: Inclined surface

[0158] 15, 15A, 15B: Lifting ring

[0159] 15a, 55a: Magnet

[0160] 16, 16A, 16B: Clamping base

[0161] 16a: Lifting axis

[0162] 30: Rotating body

[0163] 31: Rotating cover

[0164] 31a: Workbench

[0165] 31b: Side

[0166] 31c: Exhaust port

[0167] 31d: Through hole

[0168] 32: Rotating base

[0169] 40: Rotating mechanism

[0170] 41: Rotation axis

[0171] 41a: Fixed ring

[0172] 41b: Roller

[0173] 42: Driving source

[0174] 50: Lifting mechanism

[0175] 51, 51A, 51B: Open and close cylinder

[0176] 52, 52A, 52B: Opening and closing lever

[0177] 52a: Fulcrum

[0178] 52b: Supporting member

[0179] 53, 53A, 53B: Open and close lifts

[0180] 53a: Supporting member

[0181] 53b: Linear guide

[0182] 54, 54A, 54B: Opening and closing rods

[0183] 55, 55A, 55B: Open and closed loop

[0184] 56: Force-applying member

[0185] 57: Stopper cylinder

[0186] 60: Synchronous mechanism

[0187] 61, 61A, 61B: Synchronous ring

[0188] 61a: protrusion

[0189] 62, 62A, 62B: Conversion mechanism

[0190] 62a: Axis

[0191] 70: Supply Department

[0192] 71: Processing liquid supply mechanism

[0193] 71a: Treatment tank

[0194] 71b: Dedicated delivery pipe

[0195] 71c: Processing liquid supply pipe

[0196] 71d: Flow control valve

[0197] 71e: Flow meter

[0198] 72: Processing liquid holding unit

[0199] 72a: Spout

[0200] 73: Lifting Department

[0201] 74: Heating unit

[0202] 80, 80A, 80B: Detection unit

[0203] 90: Control device

[0204] 91: Opening and closing control unit

[0205] 92: Rotation control unit

[0206] 93: Judgment Department

[0207] 123: Clamping rod

[0208] 151, 151A, 151B: Height detection board

[0209] 621: Swinging Rod

[0210] 621a: Fixed shaft

[0211] 621b: Move the axis up and down

[0212] 621c: Horizontal movement axis

[0213] 622: Lifting guide

[0214] 622a: Guide hole

[0215] 623: Rotating guide

[0216] 623a: Boot slot

[0217] 624: Sliding shaft

[0218] 624a: Sliding shaft base

[0219] 624b: Conversion component

[0220] 625: Sliding parts

[0221] 625a: Conversion component

[0222] 625b: Rotary axis

[0223] 625c: Radial shaft

[0224] 626: Cam

[0225] 626a: Cam base

[0226] 627: Camshaft

[0227] 627b: Horizontal axis

[0228] 741: Heater

[0229] 741a: Through hole

Claims

1. A substrate processing device, characterized in that: have: at least three clamping pins for holding the outer peripheral end of the substrate; A clamping rod is provided with the clamping pin, and as the clamping pin rotates around the horizontal rotation axis, the clamping pin moves between an open position away from the outer peripheral end of the substrate and a closed position in contact with the outer peripheral end of the substrate and holds the substrate; A lifting ring, which causes the clamping rod to rotate as it is lifted; A rotating body, provided with a rotating shaft of the clamping rod, so that the substrate held by the clamping pin rotates together with the clamping rod and the lifting ring; A rotating mechanism, which causes the rotating body to rotate around a rotating axis in a vertical direction; A lifting mechanism, which enables the lifting ring to be lifted and lowered in a direction along the rotation axis; A force applying member, applying force to the clamping rod in a direction to make the clamping pin be in the closed position; A synchronizer ring, configured to be rotatable about the rotation axis and unable to be raised or lowered; a conversion mechanism for converting the lifting and lowering of the lifting ring by the lifting mechanism into the rotation of the synchronization ring and maintaining the posture of the lifting ring in a horizontal state; as well as The supply unit supplies the processing liquid to the substrate held by the clamp pins and rotated by the rotating body.

2. The substrate processing device according to claim 1, characterized in that: have: a detection unit, for detecting the height position of the lifting ring; and The determination unit determines whether the clamp pins are holding the substrate normally based on the height position of the lifting ring detected by the detection unit.

3. The substrate processing device according to claim 2, characterized in that: The lifting mechanism uses the repulsive force of the magnet to lift the lifting ring in a non-contact manner.

4. The substrate processing device according to claim 1 or 2, characterized in that: The clamping pins are arranged in groups of at least three arranged every other one around the axis, and at least six are provided. The lifting mechanism, the lifting ring, the synchronizing ring and the conversion mechanism are arranged in at least one group of the clamping pins.

5. The substrate processing apparatus according to claim 1, wherein: The conversion mechanism includes a swing lever that swings around a fixed axis in a horizontal direction orthogonal to the rotation axis as a fulcrum, and converts the lifting and lowering of the lifting ring into the rotation of the synchronizer ring.

6. The substrate processing apparatus according to claim 1, wherein: The conversion mechanism has: a sliding shaft, disposed on the lifting ring and inclined relative to the shaft; and The slider is connected to the synchronizer ring and moves along the slide shaft that is lifted and lowered together with the lift ring, thereby rotating the synchronizer ring.

7. The substrate processing apparatus according to claim 1, wherein: The conversion mechanism has: a cam, disposed on the lifting ring and inclined relative to the shaft; and The cam shaft is connected to the synchronizer ring and moves along a cam that is raised and lowered together with the lifting ring, thereby rotating the synchronizer ring.

Images