Heating disc, preparation method thereof and thin film deposition equipment
By screening the grounding elements and heating elements on the multi-layer substrate of the ceramic heating disk, the problem of poor flatness of the traditional ceramic heating disk is solved, and better temperature uniformity and equipment life are achieved.
Patent Information
- Application Number
- CN202411908519.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-03-28
AI Technical Summary
The metal mesh and heating wire of existing ceramic heating disks have poor flatness, resulting in uneven temperature distribution and reduced process level.
Multi-layer ceramic substrates are used to screen-print the plane grounding elements and the plane heating elements on different layers, and a heating plate is formed by hot pressing and sintering, avoiding the stress problems caused by high-temperature hot pressing and sintering.
The plane accuracy of the plane grounding elements and plane heating elements in the heating disk is improved, the temperature uniformity is enhanced, and the service life of the equipment is extended.
Smart Images
Figure CN119710647A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and in particular to a heating plate and a preparation method thereof, and a thin film deposition device. Background Art
[0002] In chemical vapor deposition (CVD) equipment, ceramic heating plates are key components used to provide uniform and controllable heat to promote chemical reactions. Traditional ceramic heating plate manufacturing methods usually involve a high-temperature hot-pressing sintering process that combines ceramic powder, metal mesh and heating wires. During this process, when the ceramic powder undergoes grain growth under high temperature and pressure, the internal metal structure is subjected to significant stress extrusion, which causes the metal mesh layer and flatness accuracy to decrease, making it impossible for the layer to maintain an ideal flat state. For the mesh layer, as an ESC (electrostatic clamping) and plasma grounding functional layer, the depth non-uniformity will further affect the capacitance of the local position, thereby adversely affecting the overall process level. At the same time, since the heating wire may deform during the sintering process, in order to minimize this deformation, the arrangement spacing of the heating wire is often strictly limited, but doing so will make the distance between the heating wires unable to reach the optimal configuration, resulting in uneven temperature distribution. Summary of the invention
[0003] The embodiments of the present invention provide a heating plate and a preparation method thereof and a thin film deposition device, aiming to solve the problem of poor flatness of mesh nets and heating wires of existing ceramic heating plates.
[0004] In a first aspect, the present invention provides a heating plate, comprising: a multilayer ceramic substrate, a planar grounding element and a planar heating element, wherein the planar grounding element is printed on one layer of the ceramic substrate, and the planar heating element is printed on another layer of the ceramic substrate, and the multilayer ceramic substrates are stacked to form the heating plate.
[0005] Further, the planar grounding element is a metal wire or a metal mesh; and / or the planar heating element is a heating wire.
[0006] Furthermore, the ceramic substrate is a ceramic sheet or a ceramic plate.
[0007] Furthermore, the planar grounding element is screen-printed on the ceramic substrate; and / or the planar heating element is screen-printed on the ceramic substrate.
[0008] Further, the level of the ceramic substrate corresponding to the planar grounding element is higher than the level of the ceramic substrate corresponding to the planar heating element.
[0009] Furthermore, the volume resistivity of the upper ceramic substrate and the lower ceramic substrate of the ceramic substrate corresponding to the planar grounding element are different.
[0010] Furthermore, the volume resistivity of the upper ceramic substrate is greater than the volume resistivity of the lower ceramic substrate.
[0011] In a second aspect, the present invention further provides a method for preparing a heating plate, the method comprising:
[0012] Fabricating multiple layers of ceramic substrates of preset dimensions;
[0013] Silk-screening a planar grounding element on one of the ceramic substrates, silk-screening a planar heating element on another of the ceramic substrates, and stacking the multiple ceramic substrates, wherein the ceramic substrate corresponding to the planar heating element is stacked on the upper layer of the ceramic substrate corresponding to the planar heating element;
[0014] The multiple layers of the ceramic substrate are sintered and densified by hot pressing.
[0015] In a third aspect, the present invention further provides a thin film deposition device, comprising the heating plate of the first aspect, wherein the heating plate is manufactured by the method for manufacturing the heating plate of the second aspect.
[0016] The present invention provides a heating plate, a preparation method thereof and a thin film deposition device. The heating plate comprises a multilayer ceramic substrate, a planar grounding element and a planar heating element. The planar grounding element and the planar heating element are respectively printed on different layers of the ceramic substrate. The planar grounding element and the planar heating element are printed on a flat ceramic substrate instead of the traditional ceramic powder integral sintering process, thereby avoiding deformation of the planar grounding element and the planar heating element due to thermal stress extrusion, improving the plane accuracy of the planar grounding element and the planar heating element in the heating plate, and improving the temperature uniformity of the heating plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.
[0018] Figure 1 A schematic diagram showing a multilayer ceramic substrate of a heating plate according to an embodiment of the present invention;
[0019] Figure 2 A schematic diagram showing a planar grounding element and a planar heating element of a heating plate according to an embodiment of the present invention, in which the planar grounding element and the planar heating element are respectively printed on different layers of a ceramic substrate;
[0020] Figure 3 A schematic diagram showing hot pressing and sintering densification of a heating plate according to an embodiment of the present invention;
[0021] Figure 4 A schematic side view of a heating plate according to an embodiment of the present invention is shown;
[0022] Figure 5 A schematic flow chart showing the steps of a method for preparing a heating plate according to an embodiment of the present invention is shown;
[0023] Reference numerals:
[0024] 1. Ceramic substrate; 2. Planar grounding element; 3. Planar heating element. DETAILED DESCRIPTION
[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0026] The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but are not used to limit the present invention. In addition, in the drawings, structures with similar or identical structures are represented by the same reference numerals.
[0027] At present, the ceramic heating plate used in CVD equipment is usually made by firing ceramic powder, mesh and heating wire together using the traditional high-temperature hot pressing sintering method. When the ceramic powder is sintered under high temperature and high pressure, its grains continue to grow. This process will cause the internal metal mesh layer and heating wire layer to be strongly squeezed by stress. As a result, the flatness accuracy of the metal mesh layer in the ceramic plate will be greatly reduced, and the mesh layer, as the grounding functional layer of the electrostatic chuck (ESC) and plasma, will change the capacitance of the local position due to its uneven depth, which will have an adverse effect on the process level. For the heating wire layer, in order to avoid its deformation, the arrangement spacing of the heating wire is limited, which leads to the poor performance of the temperature uniformity of the heating plate. Therefore, the ceramic heating plate currently used in CVD equipment has the problem of poor flatness of the mesh layer and the heating wire layer due to the high-temperature hot pressing sintering method, which affects the process level and temperature uniformity.
[0028] To this end, an embodiment of the present invention proposes a heating plate, a preparation method thereof, and a thin film deposition device, which solves the problem of poor flatness of the mesh network and heating wire of the existing ceramic heating plate. By printing the planar grounding element and the planar heating element on different layers of the ceramic substrate respectively, deformation of the planar grounding element and the planar heating element caused by thermal stress extrusion is avoided, thereby improving the flatness.
[0029] The embodiment of the present invention solves the above-mentioned problem of poor flatness, and the specific ideas are as follows:
[0030] First, a multilayer ceramic sheet is made, and then the metal mesh and heating wire are screen-printed onto the corresponding layers of the ceramic sheet. Finally, the multilayer ceramic sheets are stacked and hot-pressed to make them dense, thereby preparing a ceramic heating plate. In the traditional one-piece sintering method, ceramic powder, metal mesh and heating wire are co-sintered under high temperature and high pressure. Due to the different thermal expansion coefficients of ceramics and metals, significant thermal stress will be generated during the cooling process, causing cracks or delamination inside the material, affecting the life of the heating plate. The screen printing technology allows the metal mesh and heating wire to be deposited separately on the already sintered ceramic sheets, avoiding the stress problems caused by high-temperature co-sintering. Screen printing can accurately deposit metal layers on the solidified ceramic substrate, avoiding possible deformation during the sintering process, which not only improves the flatness of the heating plate, but also ensures the uniformity and stability of the electrode structure, thereby extending the service life of the equipment.
[0031] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0032] See also Figure 1-Figure 4 An embodiment of the present invention shows a heating plate, comprising: a multi-layer ceramic substrate 1, a planar grounding element 2 and a planar heating element 3, wherein the planar grounding element 2 is printed on one layer of the ceramic substrate 1, and the planar heating element 3 is printed on another layer of the ceramic substrate 1, and the multi-layer ceramic substrate 1 is stacked to form the heating plate.
[0033] Specifically, when the traditional integrated sintering method is used to manufacture a ceramic heating disk for CVD equipment, due to the difference in thermal expansion coefficients of metal and ceramic materials during high temperature and high pressure sintering, stress concentration and deformation are easily caused, which affects the flatness accuracy and service life of the heating disk, and the traditional embedded metal wire and heating wire are difficult to achieve high-precision layout, which limits the functional integration and performance optimization of the heating disk. This embodiment avoids the stress problem in the traditional integrated sintering method by arranging components with different functions (planar grounding element 2 and planar heating element 3) in different layers of the ceramic substrate 1, thereby improving the flatness accuracy and service life of the heating disk. Among them, the multilayer ceramic substrate 1 is composed of a plurality of ceramic sheets or ceramic plates stacked together, and each layer can independently select materials and design functions. The ceramic substrate 1 can select different types of ceramic materials, such as aluminum oxide, silicon nitride, etc., to meet different requirements for temperature resistance, insulation and mechanical strength. The planar grounding element 2 is a metal structure, such as a metal mesh or a metal wire, for providing plasma grounding and electrostatic adsorption functions. The planar heating element 3 is a heating wire for providing uniform heating to ensure accurate control of the wafer temperature. The specific shapes of the planar grounding element 2 and the planar heating element 3 can be adjusted according to the actual application requirements, for example, a grid shape, a spiral shape or other complex patterns are adopted. The planar grounding element 2 and the planar heating element 3 are printed on the ceramic substrate 1. It should be noted that there are many printing methods adopted in this embodiment, such as screen printing, lithography, gravure printing, flexographic printing, inkjet printing, thermal transfer printing, photolithography printing, etc., which are not limited here. The planar grounding element 2 and the planar heating element 3 are directly printed on the ceramic substrate 1 by printing, and there is almost no thickness, while the traditional integrated sintering method is to sandwich a piece of metal mesh in the ceramic, and the metal mesh itself has thickness and unevenness, not to mention that it is more uneven after being squeezed and deformed by thermal stress. Therefore, the planar grounding element 2 and the planar heating element 3 are accurately printed on the solidified ceramic substrate 1, avoiding thermal stress deformation that may occur during the sintering process.
[0034] Through this embodiment, since each functional layer is printed on a separate ceramic substrate 1 and then stacked, stress extrusion during traditional co-firing is avoided, so that the planar grounding element 2 and the planar heating element 3 can maintain good flatness and shape accuracy. The precisely printed planar grounding element 2 can ensure the stability of the grounding, reduce the capacitance change caused by uneven depth, and thus improve the process level; the uniformly printed planar heating element 3 can achieve a more reasonable spacing setting, improve the temperature uniformity of the heating plate, and make the heating effect more stable and reliable.
[0035] In one embodiment, the planar grounding element 2 is a metal wire or a metal mesh; and / or, the planar heating element 3 is a heating wire. Specifically, the planar grounding element 2 can be a metal wire or a metal mesh, which is used to provide plasma grounding and electrostatic adsorption functions. The metal wire has certain flexibility and operability, which is convenient for silk screen molding; the metal mesh has better conductivity and grounding area, which can be selected according to actual needs. For example, when the grounding performance is required to be high and the space is allowed, the metal mesh can provide a more stable grounding effect. The planar heating element 3 can be a heating wire, which is used to provide uniform heating. As a heating element, the parameters such as the thickness, material and resistance of the heating wire can be adjusted according to the requirements of heating power and temperature uniformity. For example, selecting a thinner heating wire can increase the number of heating wires per unit area, which helps to improve temperature uniformity, but its resistance and power carrying capacity may need to be considered. In other embodiments, the planar grounding element 2 can use a metal mesh with different weaving tightness, or use a metal wire in combination with a metal mesh; the planar heating element 3 can explore the use of heating wires with different alloy compositions, or use a flat heating wire to change the heat conduction and distribution characteristics.
[0036] In one embodiment, the ceramic substrate 1 is a ceramic sheet or a ceramic plate. Specifically, the ceramic substrate 1 can be a ceramic sheet or a ceramic plate, and the specific form depends on the actual application requirements and the manufacturing process. Ceramic sheets are usually thinner and suitable for multi-layer designs, while ceramic plates are relatively thicker and suitable for applications that require higher mechanical strength. By selecting ceramic substrates 1 in different forms, the performance and structure of the heating plate can be optimized according to specific needs. Through this embodiment, the design of the ceramic sheet makes the multi-layer structure easier to achieve, and ceramic sheets of different materials can be selected according to different functional requirements to improve flexibility; for applications that require higher mechanical strength, thicker ceramic plates can be selected to ensure that the heating plate maintains structural integrity under high temperature and high pressure environments and enhance mechanical strength; by selecting ceramic substrates 1 of different thicknesses and materials, the heat conduction path can be optimized, the thermal efficiency of the heating plate can be improved, and heat conduction can be optimized.
[0037] In one embodiment, the planar grounding element 2 is screen-printed on the ceramic substrate 1; and / or, the planar heating element 3 is screen-printed on the ceramic substrate 1. Specifically, the planar grounding element 2 and the planar heating element 3 are screen-printed by screen printing in this embodiment. Screen printing is a printing technology that uses a taut screen as a template to press the material through the opening of the screen and transfer it to the substrate to form a desired pattern. Screen printing has the advantages of high precision, applicability to a variety of substrates, strong thick film printing ability, high production efficiency, and low cost. Compared with the traditional co-firing or pasting method, screen printing can achieve a close combination of the functional layer and the ceramic substrate 1, and can accurately control the thickness, shape and position of the functional layer. For example, the lines or grids of the planar grounding element 2 can be printed more evenly and finely by screen printing to ensure the stability of the grounding; for the planar heating element 3, screen printing can achieve accurate arrangement of the heating wire and improve heating efficiency and uniformity. Specifically, on the one hand, silk screen printing technology avoids direct contact between metal and ceramic materials during high-temperature sintering, reduces stress caused by differences in thermal expansion coefficients, avoids stress problems caused by high-temperature sintering, and improves flatness accuracy and component stability; on the other hand, silk screen printing technology can achieve higher-precision pattern printing, ensuring a more uniform arrangement of metal wires and heating wires, thereby improving the performance of the heating plate, and the silk screen printing process is relatively simple, reducing manufacturing difficulty and cost.
[0038] In one embodiment, the level of the ceramic substrate 1 corresponding to the planar grounding element 2 is higher than the level of the ceramic substrate 1 corresponding to the planar heating element 3. Specifically, if the planar grounding element 2 and the planar heating element 3 are located in the same layer or adjacent layers, it is easy to cause uneven electric field distribution, affecting the electrostatic adsorption effect and heating uniformity, and the mutual interference between the metal wire and the heating wire may also reduce the overall performance of the heating plate. Therefore, the level of the ceramic substrate 1 corresponding to the planar grounding element 2 is designed to be higher than the level of the ceramic substrate 1 corresponding to the planar heating element 3. This design ensures electrical isolation between the planar grounding element 2 and the planar heating element 3, avoids mutual interference between the two, and optimizes the electric field distribution and heating uniformity. For example, the planar grounding element 2 is on the 3rd layer and the planar heating element 3 is on the 6th layer. The hierarchical distribution can utilize the insulation performance of the ceramic substrate 1 to reduce the electromagnetic interference and thermal interference between the planar grounding element 2 and the planar heating element 3. For example, when the planar grounding element 2 is located in the upper layer, it can better shield external electromagnetic interference and reduce the impact on the planar heating element 3 in the lower layer; while the planar heating element 3 is located in the lower layer, when the heat generated by it is transferred upward, it is buffered and homogenized by the middle ceramic substrate layer 1, which can make the temperature distribution of the heating plate more uniform and avoid local overheating.
[0039] In one embodiment, the volume resistivity of the upper ceramic substrate 1 and the lower ceramic substrate 1 of the ceramic substrate 1 corresponding to the planar grounding element 2 is different. Specifically, volume resistivity, also known as volume resistivity or volume resistance, is a physical quantity that measures the resistance to the flow of current inside a material. It represents the resistance characteristics of a material per unit volume, and is usually used to evaluate the electrical insulation performance of an insulating material or the electrical conductivity of a conductive material. Volume resistivity is a physical quantity, and its unit is usually ohm·meter (Ω·m), and sometimes ohm·centimeter (Ω·cm). The upper ceramic substrate 1 and the lower ceramic substrate 1 are the upper and lower layers of the metal mesh, respectively. For example, the upper layer of the mesh requires an electrostatic adsorption function, and a material with a volume resistivity of E9-E11 needs to be selected, and the lower layer can use a material with a lower volume resistivity to obtain high thermal conductivity. In a conventional heating plate, the volume resistivity of the ceramic substrate 1 is usually the same, which limits the optimization of the electrical and thermal performance of the heating plate between different functional layers. The upper ceramic substrate 1 and the lower ceramic substrate 1 have different volume resistivities to meet the requirements of different functional layers. The upper ceramic substrate 1 has a higher volume resistivity and is suitable for electrostatic adsorption; the lower ceramic substrate 1 has a lower volume resistivity and is suitable for heating. This design can select the most suitable material according to the requirements of different functional layers and optimize electrical and thermal properties. By selecting ceramic materials with different volume resistivities, multiple functional requirements such as electrostatic adsorption and thermal conduction can be met at the same time. The design of the multi-layer ceramic disc increases the feasibility window for the development of multifunctional integrated ceramic discs.
[0040] In a specific embodiment, the volume resistivity of the upper ceramic substrate 1 is greater than the volume resistivity of the lower ceramic substrate 1. Specifically, it has been explained above that by selecting ceramic materials with different volume resistivities, the performance of the electrostatic adsorption layer and the heating layer can be optimized. The volume resistivity of the upper ceramic substrate 1 of this embodiment is greater than the volume resistivity of the lower ceramic substrate 1. The high volume resistivity of the upper ceramic substrate 1 helps to maintain static charge and ensure the stability and uniformity of the electrostatic adsorption effect. The low volume resistivity of the lower ceramic substrate 1 helps to improve thermal conductivity and ensure the uniformity and efficiency of heating. For example, the upper ceramic substrate 1 uses alumina ceramics with a volume resistivity of 10^8Ω·cm, and the lower ceramic substrate 1 uses graphite ceramics with a volume resistivity of 10^4Ω·cm. The planar grounding element 2 (such as a metal mesh) is screen-printed on the middle layer, and then stacked with other ceramic substrates 1 and formed into a heating plate through a high-temperature sintering process.
[0041] Reference Figure 1-Figure 5 The present invention also provides a method for preparing a heating plate. The method of this embodiment can be applied to the heating plate of the above embodiment, and of course can also be applied to other heating plates. The heating plate has been described in detail in the above embodiment, and for the sake of brevity of the description, it will not be repeated here. The method includes steps: S1-S3.
[0042] S1, preparing multiple layers of ceramic substrates of preset size;
[0043] S2, screen printing a planar grounding element on one layer of the ceramic substrate, screen printing a planar heating element on another layer of the ceramic substrate, and stacking the multiple layers of the ceramic substrates, wherein the ceramic substrate corresponding to the planar heating element is stacked on the upper layer of the ceramic substrate corresponding to the planar heating element;
[0044] S3, hot-pressing and sintering the multiple layers of the ceramic substrate to make them dense.
[0045] In this embodiment, if Figure 1 As shown, according to the design requirements, a multi-layer ceramic substrate of preset size is made using a tape casting process or other suitable methods. The size and thickness of each layer of the ceramic substrate should be precisely controlled according to the specific application requirements to ensure the matching and alignment between the layers. The ceramic substrate can choose different types of ceramic materials, such as alumina, silicon nitride, etc., to meet different requirements for temperature resistance, insulation and mechanical strength. Figure 2 As shown, one of the ceramic substrates is selected as the carrier of the planar grounding element, and the conductive paste (such as silver paste, copper paste, etc.) is accurately printed on the ceramic substrate using screen printing technology to form the required metal mesh or metal wire pattern; during the screen printing process, the thickness and uniformity of the ink need to be strictly controlled to ensure the electrical performance and reliability of the planar grounding element. After printing, the substrate can be pre-cured to improve stability in subsequent processes. Another ceramic substrate is selected as the carrier of the planar heating element, and the conductive paste (such as resistor paste, nickel-chromium alloy paste, etc.) is also printed on the ceramic substrate using screen printing technology to form the required heating wire pattern; during the screen printing process, special attention needs to be paid to the arrangement spacing and shape of the heating wires to ensure the uniformity and efficiency of heating. After printing, the substrate can also be pre-cured. The ceramic substrates with printed planar grounding elements and heating elements are stacked with other unprinted ceramic substrates in a predetermined order to ensure alignment and close contact between the layers to avoid gaps or misalignment; the ceramic substrate corresponding to the planar heating element should be stacked on the lower layer of the ceramic substrate corresponding to the planar grounding element to ensure electrical isolation and optimize the electric field distribution, reducing thermal interference and electromagnetic interference. Figure 3 As shown, the stacked multilayer ceramic substrate is placed in a high-temperature furnace for hot pressing and sintering. The sintering temperature and pressure should be optimized according to the characteristics of the selected ceramic material to ensure that the layers are tightly combined to form a dense overall structure. During the hot pressing and sintering process, pay attention to controlling the heating rate and holding time to avoid cracks or stratification inside the material due to too fast heating or too long holding time. Figure 4 As shown, a ceramic heating plate is obtained after hot pressing and sintering to make it dense.
[0046] Through this embodiment, the structural accuracy and stability of the heating plate are ensured by accurately manufacturing and stacking multiple layers of ceramic substrates; the silk screen printing process optimizes the performance of the planar grounding element and the planar heating element, reduces the stress deformation caused by the difference in thermal expansion coefficient, improves the plane accuracy, and improves the grounding stability and heating uniformity; further, the silk screen printing technology can achieve higher-precision pattern printing, ensure that the arrangement of the metal mesh and the heating wire is more uniform, thereby improving the flatness accuracy of the heating plate; the reasonable stacking sequence reduces thermal interference and electromagnetic interference, and improves the overall performance of the heating plate; hot pressing sintering densifies the ceramic substrate, enhances the mechanical strength of the heating plate and the connection reliability between the layers, thereby ensuring that the heating plate can work stably and efficiently during long-term use, and meet various complex heating requirements. In addition, each layer can select the most suitable material according to the specific functional requirements to achieve the integration of multiple functions, such as electrostatic adsorption, heat conduction, etc.
[0047] In one embodiment, the ceramic substrate is a ceramic sheet, and the ceramic sheet is made by a tape casting process. Specifically, the tape casting process is a molding method for ceramic products. First, the crushed powder is mixed with an organic plasticizer solution in an appropriate ratio to form a slurry with a certain viscosity. The slurry flows down from the container and is scraped and applied to a special base belt with a certain thickness by a scraper. After drying and curing, it is peeled off from the top to become a thin film of a green tape. Then, according to the size and shape of the finished product, the green tape is punched, laminated, and other processing is performed to make a blank product to be sintered. This embodiment adopts a tape casting process, which can accurately control the thickness and size of the ceramic sheet, ensure the matching and alignment between the layers of the ceramic substrate, and improve the overall accuracy and performance of the heating plate. In addition, the tape casting process has a high degree of automation and fast production efficiency, which is suitable for mass production and improves production efficiency.
[0048] The embodiment of the present invention further provides a thin film deposition device, comprising the heating plate of the above embodiment, wherein the heating plate is made by the method for making the heating plate of the above embodiment. Specifically, the heating plate and the method for making the heating plate have been described in detail in the above embodiment, and for the sake of brevity of the specification, they will not be repeated here.
[0049] Through this embodiment, the above-mentioned heating plate is adopted, and the screen printing technology is used to not only solve the thermal stress and deformation problems existing in the traditional manufacturing method, but also greatly improve the flatness accuracy, service life and versatility of the heating plate; by selecting ceramic materials with different volume resistivity, the electrical and thermal properties of each functional layer can be optimized to meet various process requirements; it provides a larger feasibility window for the development of ceramic plates integrating multiple functions.
[0050] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.
Claims
1. A heating plate, characterized in that: include: A multilayer ceramic substrate, a planar grounding element and a planar heating element, wherein the planar grounding element is printed on one layer of the ceramic substrate, and the planar heating element is printed on another layer of the ceramic substrate. The multilayer ceramic substrates are stacked to form the heating plate.
2. The heating plate according to claim 1, characterized in that: The planar grounding element is a metal wire or a metal mesh; and / or the planar heating element is a heating wire.
3. The heating plate according to claim 1, characterized in that: The ceramic substrate is a ceramic sheet or a ceramic plate.
4. The heating plate according to claim 1, characterized in that: The planar grounding element is screen-printed on the ceramic substrate; and / or the planar heating element is screen-printed on the ceramic substrate.
5. The heating plate according to claim 1, characterized in that: The level of the ceramic substrate corresponding to the planar grounding element is higher than the level of the ceramic substrate corresponding to the planar heating element.
6. The heating plate according to claim 1, characterized in that: The upper ceramic substrate and the lower ceramic substrate of the ceramic substrate corresponding to the planar grounding element have different volume resistivities.
7. The heating plate according to claim 6, characterized in that: The volume resistivity of the upper ceramic substrate is greater than the volume resistivity of the lower ceramic substrate.
8. A method for preparing a heating plate, characterized in that: The method comprises: Fabricating multiple layers of ceramic substrates of preset dimensions; Silk-screening a planar grounding element on one of the ceramic substrates, silk-screening a planar heating element on another of the ceramic substrates, and stacking the multiple ceramic substrates, wherein the ceramic substrate corresponding to the planar heating element is stacked on the upper layer of the ceramic substrate corresponding to the planar heating element; The multiple layers of the ceramic substrate are sintered and densified by hot pressing.
9. The method according to claim 8, characterized in that The ceramic substrate is a ceramic sheet, and the ceramic sheet is made by a tape casting process.
10. A thin film deposition device, characterized in that: It comprises a heating plate as described in any one of claims 1 to 7, wherein the heating plate is manufactured by the method for manufacturing a heating plate as described in any one of claims 8 to 9.