Glass slightly soluble pressure sensor and manufacturing method thereof

Abstract

The invention discloses a glass slightly soluble pressure sensor and a manufacturing method thereof, and the sensor comprises a pedestal which is used for matching with a client pressure hole; the strain gauge is arranged on the base; the support frame is fixed on the base; the printed board is fixed to the supporting frame, connected with the strain gauge and used for processing resistance difference generated by the strain gauge, and the end, away from the base, of the printed board is provided with a metal sheet extending outwards; the upper cover is connected with the support frame; one end of the spring is fixed to the supporting frame, the other end of the spring penetrates through the upper cover, and the special-shaped spring is communicated with the metal sheet to achieve signal transmission. According to the invention, the structure is optimized, so that the accuracy of measurement and the miniaturization of the appearance are ensured.

Description

Technical Field

[0001] The present invention belongs to the field of pressure sensors, and more specifically, relates to a glass micro-soluble pressure sensor and a manufacturing method thereof. Background Art

[0002] The demand for pressure capacity in some large machinery and vehicles is increasing, but the requirement for volume is decreasing. Conventional pressure sensors above 20MPa are faced with the problem of being too large. When the volume of the pressure sensor is reduced to 30mm in height and 10mm in width, the existing high-pressure products cannot meet the requirements of small-volume product appearance.

[0003] Conventional solutions use a glass micro-soluble pressure sensor, which uses a combination of a soft board and a hard board to place the conditioning chip and export the corresponding signal to the required external location. However, since the soft board inside the product package cannot be fixed, the soft board will shake, causing product signal fluctuations. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a glass micro-soluble pressure sensor and a manufacturing method thereof to solve the problem of product signal fluctuation caused by the combination of a soft board and a hard board.

[0005] The present invention adopts the following technical solution: A glass micro-soluble pressure sensor, comprising: Base, used to match the pressure hole of the client; A strain gauge, arranged on the base; A support frame, fixed to the base; A printed circuit board, fixed to the support frame and electrically connected to the strain gauge, for processing the electrical signal generated by the strain gauge, wherein an end of the printed circuit board away from the base is provided with a metal sheet extending outward; An upper cover connected to the support frame; A spring has one end fixed to the support frame and the other end passing through the upper cover. The spring is connected to the metal sheet to achieve signal transmission.

[0006] Furthermore, the support frame includes a relative top surface and bottom surface and a side surface connecting the top surface and the bottom surface, the bottom surface is fixed to the base, the printed circuit board is fixed to the side surface, the metal sheet includes a connected extension portion and a bending portion, one end of the extension portion is fixed to the printed circuit board, and the other end extends to the outside of the top surface, and the bending portion is bent relative to the extension portion to the opening position of the upper cover.

[0007] Furthermore, the upper cover is provided with a buckle and a bending portion to achieve a buckle connection, and the number of the metal sheets and the springs are three and correspond one to one.

[0008] Furthermore, the glass micro-soluble pressure sensor further comprises: The sleeve is sleeved on the upper cover and the support frame and is fixedly connected to the base.

[0009] Furthermore, the printed circuit board is connected to the strain gauge via a metal wire, and the printed circuit board is also connected to the sleeve via another metal wire to achieve grounding.

[0010] The present invention also provides a method for manufacturing a glass micro-soluble pressure sensor, comprising the steps of: The metal base is fixed by laser spot welding with a metal ring which is integrally injection-molded and embedded on the support frame; Use metal wire to connect the strain gauge sintered on the metal base plane, conduct it to the printed circuit board, open a hole at the end of the printed circuit board and SMT a conductive metal copper sheet; The printed circuit board assembly with openings is clamped in the corresponding column on the support frame, and the printed circuit board assembly is fixed by a hot riveting process; Pass the spring through the upper cover and fix it to the support frame through the buckle on the side; The spring presses against the metal sheet to achieve connection; Insert a metal sleeve with a flanged edge on one side, and perform a circle of laser welding on the root of the sleeve and the base to achieve overall packaging fixation. Beneficial Effects

[0011] Compared with the prior art, the present invention has the following beneficial effects: The present invention arranges a support frame, places a printed circuit board on the side of the support frame, and then arranges a metal sheet on the printed circuit board. The metal sheet is connected to a spring, so that the signal is changed from vertical to horizontal and transmitted to the spring at a designated output position, thereby reducing the use of a flexible board and optimizing the product manufacturing process.

[0012] The present invention realizes the change of signal transmission of vertical printed circuit board from vertical to horizontal designated position through novel structural design, which can reduce the use of soft board to connect horizontal position and eliminate the use of printed circuit board in horizontal direction, and the manufacturing process is simpler.

[0013] The optimized small package glass micro-soluble pressure sensor can realize the application of high pressure range products in an environment with limited space, while reducing the weight of the sensor itself and achieving lightweight. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a cross-sectional view of a glass micro-soluble pressure sensor according to an embodiment of the present invention.

[0015] Figure 2 The figure is a three-dimensional schematic diagram of a printed board of a glass micro-soluble pressure sensor according to an embodiment of the present invention.

[0016] Figure 3 for Figure 1 Schematic diagram of the exploded view of the glass micro-soluble pressure sensor.

[0017] In the figure: 1-metal sleeve; 2-upper cover; 3-printed circuit board; 4-conductive special-shaped spring; 5-support frame; 6-metal wire; 7-metal ring; 8-metal base; 9-metal wire; 10-strain gauge. DETAILED DESCRIPTION

[0018] The present invention is further described below in conjunction with specific embodiments and drawings.

[0019] See also Figure 1-Figure 3 The embodiment of the present invention provides a glass micro-soluble pressure sensor, comprising: Base 8, used for matching the pressure hole of the client; A strain gauge 10, provided on the base 8; A support frame 5 is fixed to the base 8; A printed circuit board 3, fixed to the support frame 5 and electrically connected to the strain gauge 10, for processing the electrical signal generated by the strain gauge 10, wherein an end of the printed circuit board away from the base 8 is provided with a metal sheet extending outward; An upper cover 2 connected to the metal sheet; The spring 4 has one end fixed to the support frame 5 and the other end passing through the upper cover 2. The spring 4 is connected to the metal sheet to achieve signal transmission.

[0020] In this embodiment, the spring 4 is a conductive special-shaped spring 4 , and its specific shape is designed so that it can contact the metal sheet and pass through the upper cover 2 .

[0021] Furthermore, the support frame 5 includes a relative top surface and a bottom surface and a side surface connecting the top surface and the bottom surface, the bottom surface is fixed to the base 8, the printed circuit board 3 is fixed to the side surface, and the metal sheet includes a connected extension portion and a bending portion, one end of the extension portion is fixed to the printed circuit board 3, and the other end extends to the outside of the top surface, and the bending portion is bent relative to the extension portion to a position suitable for connection with the upper cover 2.

[0022] Furthermore, the upper cover 2 is provided with a buckle to achieve a buckle connection with the fixing frame, and the number of the metal sheets and the special-shaped springs 4 are both three and correspond one to one.

[0023] Furthermore, the glass micro-soluble pressure sensor further comprises: The sleeve 1 is sleeved on the upper cover 2 and the support frame 5 and is fixedly connected to the base 8 .

[0024] Furthermore, the printed circuit board 3 is connected to the strain gauge 10 via a metal wire 6, and the printed circuit board 3 is also connected to the sleeve 1 via another metal wire 9 to achieve grounding.

[0025] The present invention also provides a method for manufacturing a glass micro-soluble pressure sensor, comprising the steps of: The metal base 8 is fixed by laser spot welding with the metal ring 7 which is integrally injection-molded and embedded on the support frame 5; A metal wire 6 is used to connect the strain gauge 10 sintered on the plane of the metal base 8, and then connected to the printed circuit board 3. A hole is opened at the tail end of the printed circuit board 3 and a conductive metal copper sheet is SMTed; Place the printed circuit board 3 assembly on the support frame 5, and fix the printed circuit board 3 assembly by a hot riveting process; Pass the special-shaped spring 4 through the upper cover 2 and fix it to the support frame 5 through the buckle on the side; The upper cover 2 connects the special-shaped spring to the metal sheet by clamping the thicker part of the special-shaped spring; A metal sleeve 1 with a flanged edge on one side is inserted, and a circle of laser welding is performed on the root of the sleeve 1 and the base 8 to achieve overall packaging fixation.

[0026] The specific manufacturing and principle of the glass micro-soluble pressure sensor of the embodiment of the present invention are as follows: The metal base 8 is fixed by laser spot welding with the metal ring 7 which is integrally injection-molded and embedded on the support frame 5, and then the metal wire 6 is used to connect with the strain gauge 10 sintered on the plane of the metal base 8, and then the metal wire 6 is used to connect to the printed circuit board 3 assembly; components such as chips are placed on the printed circuit board 3 assembly, holes are opened at the tail end and a conductive metal copper sheet is SMTed, a metal wire 9 is welded at the bottom, and then the printed circuit board 3 assembly is placed on the support frame 5, and the printed circuit board 3 assembly is fixed by a hot riveting process; then the drum-shaped special-shaped spring 4 is passed through the upper cover 2 from the bottom, and fixed to the support frame 5 by the side buckle to form an integrated structure, and finally the metal sleeve 1 with a flanged edge on one side is placed from the top, and a circle of laser welding is performed with the base 8 at the root to achieve overall packaging fixation.

[0027] Functional principle: The metal base 8 is used to match the pressure hole of the client, and radial sealing is achieved by installing an external O-ring later. There is a flat surface on the head of the metal base 8, and a resistance strain gauge 10 is sintered on the flat surface. Under the action of pressure, the flat surface will be deformed, causing the strain gauge 10 to deform and the resistance to change.

[0028] The strain gauge 10 is connected to the printed circuit board 3 assembly through the metal wire 6. The printed circuit board 3 assembly has components such as chips for processing the resistance change of the strain gauge 10 and outputting corresponding signals. The metal wire 9 is welded to the printed circuit board assembly and is subsequently grounded to the housing after the metal sleeve 1 is installed.

[0029] The tail of the printed circuit board 3 component is soldered with a metal sheet of the required shape to change the signal from horizontal to vertical, and is snap-connected with the upper cover 2 plugged with the special-shaped spring 4 to achieve signal transmission.

[0030] Finally, the metal sleeve 1 is fully fixed from top to bottom, and then laser welded to the metal base 8 at the root to achieve product packaging.

[0031] The examples described in the present invention are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the concept and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made to the technical solutions of the present invention by engineers and technicians in this field should all fall within the protection scope of the present invention.

Claims

1. A glass micro-soluble pressure sensor, comprising: Base, used to match the pressure hole of the client; A strain gauge, arranged on the base; It is characterized by further comprising: A support frame, fixed to the base; A printed circuit board, fixed to the support frame and electrically connected to the strain gauge, for processing the electrical signal generated by the strain gauge, wherein an end of the printed circuit board away from the base is provided with a metal sheet extending outward; An upper cover connected to the support frame; A spring has one end fixed to the support frame and the other end passing through the upper cover. The spring is connected to the metal sheet to achieve signal transmission.

2. The glass micro-soluble pressure sensor according to claim 1, characterized in that: The support frame includes a top surface and a bottom surface relative to each other and a side surface connecting the top surface and the bottom surface, the bottom surface is fixed to the base, the printed circuit board is fixed to the side surface, the metal sheet includes an extended portion and a bent portion connected to each other, one end of the extended portion is fixed to the printed circuit board, and the other end extends to the outside of the top surface, and the bent portion is bent relative to the extended portion to the opening position of the upper cover.

3. The glass micro-soluble pressure sensor according to claim 2, characterized in that: The upper cover is provided with a buckle to realize a buckle connection with the side of the support frame, the fixing position of the metal sheet corresponds one to one with the opening position of the upper cover, and the number of the metal sheet and the special-shaped spring are both three and correspond one to one.

4. The glass micro-soluble pressure sensor according to claim 1, characterized in that: The glass micro-soluble pressure sensor also includes: The sleeve is sleeved on the upper cover and the support frame and is fixedly connected to the base.

5. The glass micro-soluble pressure sensor according to claim 4, characterized in that: The printed circuit board is connected to the strain gauge through a metal wire, and the printed circuit board is also connected to the sleeve through another metal wire to achieve grounding.

6. A method for manufacturing a glass micro-soluble pressure sensor as claimed in claim 1, characterized in that: Includes steps: The metal base is fixed by laser spot welding with a metal ring which is integrally injection-molded and embedded on the support frame; Use metal wire to connect the strain gauge sintered on the metal base plane, conduct it to the printed circuit board, open a hole at the end of the printed circuit board and SMT a conductive metal copper sheet; The printed circuit board assembly with openings is clamped in the corresponding column on the support frame, and the printed circuit board assembly is fixed by a hot riveting process; Pass the spring through the upper cover and fix it to the support frame through the buckle on the side; The spring presses against the metal sheet to achieve connection; Insert a metal sleeve with a flanged edge on one side, and perform a circle of laser welding on the root of the sleeve and the base to achieve overall packaging fixation.

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