Fan heat dissipation adjusting method and control equipment

Abstract

The invention provides a fan heat dissipation adjusting method and control equipment, and relates to the technical field of power electronics. The fan heat dissipation adjusting method specifically comprises the steps that the initial layout of each power device and the size of a fan driving circuit are obtained; and constructing and determining an optimized layout based on initial local optimum through a position optimization model. Whether the heat dissipation characteristic and the convergence characteristic of the optimized layout meet preset conditions or not is sequentially judged, if neither the heat dissipation characteristic nor the convergence characteristic meets the preset conditions, and the heat dissipation temperature corresponding to the current initial local optimum meets a second preset threshold value, the current initial local optimum serves as a new initial global optimum layout, and the current initial local optimum serves as a second initial global optimum layout; returning to execute the step of determining the optimized layout based on the initial local optimum through the position optimization model until a second preset rule is met, and determining a final global optimum layout; and adjusting the layout position of the power device according to the final global optimal layout. According to the invention, the heat flux density among the components in the control device can be improved, so that the working performance and reliability of the control device are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of power electronics, and in particular to a fan heat dissipation adjustment method and control equipment. Background Art

[0002] With the development of power electronics technology, air conditioners have higher and higher requirements for dynamic performance, cost, volume, and reliability. Correspondingly, the requirements for the integration and reliability of various control components are also getting higher and higher. For control components, the heat flux density between the components on the control components is usually adjusted to improve the working performance and reliability of the control components.

[0003] Common ways to adjust the heat flux density between components on the control device include but are not limited to: increasing the copper area and thickness, increasing the number of thermal vias on the printed circuit board (PCB), and adding a heat sink to the high-power device. The above methods are all to improve the temperature rise of the control device by adjusting the structural parameters of the control device on the integrated printed circuit board. Adding a heat sink to the high-power device will increase the device cost and affect the overall structure of the air conditioner.

[0004] Taking the air-conditioning controller as an example, the high-power circuit on the air-conditioning controller is the fan drive circuit. The main power component of the fan drive circuit is the fan module, whose power can reach more than 80% of the overall power of the air-conditioning controller. Its high power consumption characteristics cause the heat generated by itself to be very high, and it is difficult to meet the integration and reliability requirements of the control device.

[0005] Based on this, there is an urgent need for an adjustment method for the control device, which can improve the heat flux density between the components in the control device without affecting the overall structure of the air conditioner, so as to improve the working performance and reliability of the control device. Summary of the invention

[0006] In view of this, the object of the present invention is to provide a fan heat dissipation adjustment method and control device, which can improve the heat flux density between components in the control device without affecting the overall structure of the air conditioner, so as to improve the working performance and reliability of the control device.

[0007] In order to achieve the above purpose, the technical solution adopted by the embodiment of the present invention is as follows:

[0008] In a first aspect, the present invention provides a fan heat dissipation adjustment method, which is applied to a fan drive circuit, wherein the fan drive circuit includes a plurality of power devices, and the fan heat dissipation adjustment method includes:

[0009] Obtaining the initial layout of each power device and the size of the fan drive circuit, the initial layout includes an initial local optimal layout and an initial global optimal layout;

[0010] A location optimization model is constructed according to the size of the fan drive circuit, and the optimized layout is determined based on the initial local optimum through the location optimization model;

[0011] Determine the heat dissipation characteristics of the optimized layout, and judge whether the heat dissipation characteristics of the optimized layout are better than the heat dissipation characteristics of the initial layout;

[0012] If yes, determining and judging whether the convergence characteristic of the optimized layout is less than or equal to a first preset threshold according to a first preset rule;

[0013] If the convergence characteristic is less than or equal to the first preset threshold, determining whether the heat dissipation temperature corresponding to the current initial local optimum is less than or equal to the second preset threshold;

[0014] If yes, the current initial local optimum is used as the new initial global optimum layout, and the process returns to the step of determining the optimized layout based on the initial local optimum through the position optimization model until the second preset rule is met, and the final global optimum layout is determined;

[0015] The layout positions of power devices are adjusted according to the final global optimal layout to improve the heat dissipation performance of the fan.

[0016] Optionally, the step of obtaining an initial layout of each power device includes:

[0017] Obtain the initial address of each power device;

[0018] The address layout is determined based on the initial addresses of each power device, and the address layout is used as an initial local optimal layout and an initial global optimal layout to obtain an initial layout.

[0019] Optionally, the steps of constructing a location optimization model include:

[0020] Determine the moving range of each power device according to the size of the fan drive circuit;

[0021] The displacement function is constructed based on the moving range to obtain the position optimization model; wherein, the expression of the position optimization model satisfies:

[0022] R=ΔR*T i , R≤R max ;

[0023] Where R is the moving radius of each power device; ΔR is the attenuation coefficient; T i is the annealing temperature in the i-th iteration; R max is the maximum moving distance.

[0024] Optionally, the heat dissipation characteristic includes the sum of the maximum temperature values ​​of each power device; and the step of judging whether the heat dissipation characteristic of the optimized layout is better than the heat dissipation characteristic of the initial layout includes:

[0025] Determine whether the sum of the highest temperature values ​​of the optimized layout is less than or equal to the sum of the temperatures of the initial global optimal layout;

[0026] If so, the optimized layout is used as a new initial global optimal layout and a new initial local optimal layout, and a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold is performed.

[0027] Optionally, after the step of determining whether the sum of the highest temperature values ​​is less than or equal to the sum of the temperatures of the initial global optimal layout, the method further includes:

[0028] If the sum of the highest temperature values ​​of the optimized layout is greater than the sum of the temperatures of the initial global optimal layout, then determine whether the sum of the highest temperature values ​​corresponding to the optimized layout is less than or equal to the sum of the temperatures of the initial local optimal layout;

[0029] If so, the optimized layout is used as a new initial local optimum, the initial global optimum layout is kept unchanged, and a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold is performed.

[0030] Optionally, the first preset rule is the Meltrov criterion. If the sum of the maximum temperature values ​​corresponding to the optimized layout is greater than the sum of the initial local optimal temperatures, the step of determining and judging whether the convergence characteristic of the optimized layout is less than or equal to a first preset threshold according to the first preset rule includes:

[0031] Calculate the target probability of the optimized layout according to the Meltrov criterion;

[0032] Determine whether the target probability is less than or equal to a first preset threshold;

[0033] If not, the optimized layout is used as a new initial local optimum, the initial global optimum layout is kept unchanged, and a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold is performed.

[0034] Optionally, the heat dissipation temperature includes an annealing temperature, and if the convergence characteristic is less than or equal to a first preset threshold, the step of determining whether the heat dissipation temperature corresponding to the current initial local optimum is less than a second preset threshold includes:

[0035] Determine the annealing temperature corresponding to the current initial local optimal number of iterations;

[0036] Determine whether the annealing temperature is less than or equal to the minimum cooling temperature;

[0037] If not, the current initial local optimum is kept unchanged, and the process returns to the step of determining the optimized layout based on the initial local optimum through the position optimization model, until the second preset rule is met, and the final global optimal layout is determined.

[0038] Optionally, the calculation formula of the Meltrov criterion satisfies:

[0039]

[0040] Where p is the target probability value; e is a constant; K is the Boltzmann constant; T i is the annealing temperature in the i-th iteration; E i is the internal energy of the solution of the equation in the i-th iteration process, E j is the internal energy in the solution of the j-th iteration process equation.

[0041] Optionally, the second preset rule includes:

[0042] It is determined whether the number of iterations in which the same layout result appears is equal to a third preset threshold. If so, the layout corresponding to the same layout result is used as the final global optimal layout.

[0043] In a second aspect, the present invention provides a control device, including a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor can execute the machine executable instructions to implement any fan heat dissipation adjustment method described in the first aspect.

[0044] The fan heat dissipation adjustment method and control device provided by the embodiment of the present invention have the following beneficial effects:

[0045] The fan heat dissipation adjustment method of the present invention is applied to a fan drive circuit, and the fan drive circuit includes multiple power devices. The fan heat dissipation adjustment method includes: obtaining the initial layout of each power device and the size of the fan drive circuit, and the initial layout includes an initial local optimal layout and an initial global optimal layout. A position optimization model is constructed according to the size of the fan drive circuit, and the optimized layout is determined based on the initial local optimal through the position optimization model. The heat dissipation characteristics of the optimized layout are determined, and it is judged whether the heat dissipation characteristics of the optimized layout are better than the heat dissipation characteristics of the initial layout. If so, it is determined and judged whether the convergence characteristics of the optimized layout are less than or equal to the first preset threshold according to the first preset rule; otherwise, it is judged whether the heat dissipation temperature corresponding to the current initial local optimal is less than or equal to the second preset threshold. If the above heat dissipation temperature is less than or equal to the second preset threshold, the current initial local optimal is used as the new initial global optimal layout, and the step of determining the optimized layout based on the initial local optimal through the position optimization model is returned to execute until the second preset rule is met, and the final global optimal layout is determined. The layout position of the power device is adjusted according to the final global optimal layout to improve the heat dissipation performance of the fan. The present invention can improve the heat flux density between components in a control device without affecting the overall structure of the air conditioner, so as to improve the working performance and reliability of the control device.

[0046] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0048] Figure 1 A flow chart showing the steps of a fan heat dissipation adjustment method according to an embodiment of the present invention is shown;

[0049] Figure 2 A schematic diagram of the steps of step 100 in an embodiment of the present invention is shown;

[0050] Figure 3 A schematic diagram of the steps of step 200 in an embodiment of the present invention is shown;

[0051] Figure 4 A schematic diagram of the steps of step 300 in an embodiment of the present invention is shown;

[0052] Figure 5 A schematic diagram of the steps of step 400 in an embodiment of the present invention is shown;

[0053] Figure 6 A schematic diagram of the steps of step 500 in an embodiment of the present invention is shown;

[0054] Figure 7 shows a schematic diagram of the layout of the fan drive circuit under initial conditions;

[0055] Figure 8 The schematic diagram of the layout of the fan drive circuit after adjustment by the fan heat dissipation adjustment method in the embodiment of the present invention is shown. DETAILED DESCRIPTION

[0056] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0057] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention.

[0058] It should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0059] The main high-power circuit on the air-conditioning controller is the fan drive circuit, among which the main power component is the fan module, and the corresponding power can reach more than 80% of the overall power of the controller. Its high power consumption characteristics cause the heat generated by itself to be very high. At the same time, due to the requirements of integrated and miniaturized lean design, the temperature rise of the fan module has always been a major pain point in the controller design layout.

[0060] Existing technologies often use thermal optimization settings such as increasing the copper area and thickness, increasing the number of thermal vias on the PCB, and adding heat sinks to high-power devices. These heat dissipation methods are based on the controller PCB circuit structure, changing device parameters to optimize temperature rise, which will partially increase the device cost burden and affect the overall structure of the air conditioner. At the same time, the above methods lack specific quantitative data support, and cannot form standard specifications in actual design, increasing labor costs.

[0061] Based on this, the present invention provides an adjustment method for a control device, which can improve the heat flux density between components in the control device without affecting the overall structure of the air conditioner, so as to improve the working performance and reliability of the control device.

[0062] The present invention provides a fan heat dissipation adjustment method, which is applied to a fan drive circuit. The fan drive circuit includes multiple power devices. The positions of the power devices can be adjusted by the fan heat dissipation adjustment method, thereby improving the heat flux density between the components in the control device without affecting the overall structure of the air conditioner, thereby improving the working performance and reliability of the control device. Figure 1 , Figure 1A flow chart of steps of a fan heat dissipation adjustment method in an embodiment of the present invention is shown. The fan heat dissipation adjustment method includes steps 100 to 700.

[0063] Step 100: Obtain an initial layout of each power device and a size of a wind turbine drive circuit. The initial layout includes an initial local optimal layout and an initial global optimal layout.

[0064] Step 200: construct a position optimization model according to the size of the fan drive circuit, and determine the optimized layout based on the initial local optimum through the position optimization model.

[0065] Step 300 , determine the heat dissipation characteristics of the optimized layout, and judge whether the heat dissipation characteristics of the optimized layout are better than the heat dissipation characteristics of the initial layout. If so, execute step 400 .

[0066] Step 400 : Determine and judge whether the convergence characteristic of the optimized layout is less than or equal to a first preset threshold according to a first preset rule. If yes, execute step 500 .

[0067] Step 500 , determining whether the heat dissipation temperature corresponding to the current initial local optimum is less than or equal to a second preset threshold. If so, executing step 600 .

[0068] Step 600: take the current initial local optimum as the new initial global optimum layout, return to the step of determining the optimized layout based on the initial local optimum through the position optimization model, until the second preset rule is met, and determine the final global optimum layout.

[0069] Step 700: Adjust the layout positions of power devices according to the final global optimal layout to improve the heat dissipation performance of the fan.

[0070] Based on this, this embodiment obtains the initial layout of each power device and the size of the fan drive circuit. Construct and determine the optimized layout based on the initial local optimum through the position optimization model, and then judge in turn whether the heat dissipation characteristics and convergence characteristics of the optimized layout meet the preset conditions, so as to update the initial layout through the optimized layout; if the heat dissipation characteristics and convergence characteristics of the optimized layout do not meet the preset conditions, then judge whether the heat dissipation temperature corresponding to the current initial local optimum meets the second preset threshold, if so, take the current initial local optimum as the new initial global optimal layout, return to execute the step of determining the optimized layout based on the initial local optimum through the position optimization model, until the second preset rule is met, and determine the final global optimal layout; adjust the layout position of the power device according to the final global optimal layout, so as to improve the heat flux density between the components in the control device without affecting the overall structure of the air conditioner, and improve the working performance and reliability of the control device.

[0071] In this embodiment, Figure 1 Based on Figure 2 , Figure 2 A schematic diagram of the steps of step 100 in this embodiment is shown. The step of obtaining the initial layout of each power device in step 100 includes steps 101 and 102.

[0072] Step 101: Obtain the initial address of each power device.

[0073] Step 102: determine an address layout based on the initial addresses of each power device, and use the address layout as an initial local optimal layout and an initial global optimal layout to obtain an initial layout.

[0074] In this embodiment, taking the existing half-bridge discrete fan drive circuit as an example, the initial address of the components with high power and low temperature rise margin in the above drive circuit, for example, the fan half-bridge chip, can be obtained. This embodiment does not limit the method of obtaining the initial address, as long as the address coordinates corresponding to the screened high-power devices can be obtained.

[0075] In one possible implementation method, high-power devices, that is, components with large power and low temperature rise margin, can be screened out through indicators such as the rated power indicated on the component nameplate on the existing half-bridge discrete fan drive circuit, and then a coordinate equation is established according to the chip size corresponding to the existing half-bridge discrete fan drive circuit, that is, the size of the fan drive circuit described in this embodiment, to obtain the initial address of each power device, and then a device distribution map of the current high-power device is constructed based on the initial address as the original data of the fan heat dissipation adjustment method, and the original data is used as the initial input parameter of the local optimal and global optimal layout of the following position optimization model to determine the optimized layout.

[0076] It should be noted that, in this embodiment, the initial layout includes not only the initial local optimum and the initial global optimum layout, but also the initial ambient temperature and the initial annealing temperature.

[0077] In order to ensure the integration of devices and the utilization of chip area, this embodiment provides a method for constructing a position optimization model. For example, the movable range of each power device can be determined by the size of the fan drive circuit, thereby obtaining an optimized layout. In one possible implementation method, Figure 1 Based on the reference Figure 3 , Figure 3 A step-by-step flow chart of step 200 is shown, wherein the step of constructing a location optimization model in step 200 includes steps 201 and 202 .

[0078] Step 201: Determine the moving range of each power device according to the size of the fan drive circuit.

[0079] Step 202: construct a displacement function based on the moving range to obtain a position optimization model.

[0080] Among them, the expression of the location optimization model satisfies:

[0081] R=ΔR*T i , R≤R max ;

[0082] Where R is the moving radius of each power device; ΔR is the attenuation coefficient; T i is the annealing temperature in the i-th iteration; R max is the maximum moving distance.

[0083] In this embodiment, each power device can be randomly moved according to the determined moving range, wherein the corresponding moving range also needs to satisfy the function expression of the current annealing temperature. In this embodiment, the annealing temperature will decrease with the increase of the number of iterations. Based on this, as the number of iterations increases, the annealing temperature corresponding to the number of iterations gradually decreases, and the moving range corresponding to any power device will also increase with the number of iterations, and the moving distance will become smaller, thereby increasing the accuracy of the position adjustment of each power device.

[0084] When the heat dissipation characteristics include the sum of the maximum temperature values ​​of each power device, Figure 1 Based on the reference Figure 4 , Figure 4 The step-by-step flow chart of step 300 is shown. The step of judging whether the heat dissipation characteristic of the optimized layout is better than the heat dissipation characteristic of the initial layout in step 300 includes steps 301 to 304 .

[0085] Step 301 , determine whether the sum of the highest temperature values ​​of the optimized layout is less than or equal to the sum of the temperatures of the initial global optimal layout; if so, execute step 302 .

[0086] Step 302: using the optimized layout as a new initial global optimal layout and a new initial local optimal layout, and executing a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold.

[0087] Please continue to refer to Figure 4 In this embodiment, after the step of determining whether the sum of the highest temperature values ​​is less than or equal to the sum of the temperatures of the initial global optimal layout, steps 303 to 304 are also included.

[0088] Step 303: If the sum of the highest temperature values ​​of the optimized layout is greater than the sum of the temperatures of the initial global optimal layout, it is determined whether the sum of the highest temperature values ​​corresponding to the optimized layout is less than or equal to the sum of the temperatures of the initial local optimal layout. If so, step 304 is executed.

[0089] Step 304: take the optimized layout as a new initial local optimum, keep the initial global optimum layout unchanged, and execute the step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold.

[0090] In this embodiment, the heat dissipation characteristics include the sum of the highest temperature values ​​of each power device. The initial layout is represented by S0, and the optimized layout is represented by S1. The temperatures of all components under the initial layout S0 and the optimized layout S1 are calculated respectively, and the maximum record of the temperature of the components under the initial layout S0 is obtained. When the number of screened power devices is 3, the maximum record of the temperature of the components under the initial layout S0 is recorded as: TL = (t1, t2, t3); the maximum record of the temperature of the components under the optimized layout S1 is recorded as: TLN = (t1N, t2N, t3N).

[0091] In the first round of iteration, the maximum temperature values ​​corresponding to the initial local optimal and initial global optimal layouts are equal to TL=(t1, t2, t3) corresponding to the initial layout S0.

[0092] During the first round of iteration, it is determined whether the sum of the highest temperature values ​​of the optimized layout is less than or equal to the sum of the temperatures of the initial global optimal layout, wherein the value corresponding to the sum of the highest temperature values ​​of the optimized layout satisfies t1N+t2n+t3N; the value corresponding to the sum of the temperatures of the initial global optimal layout satisfies: t1+t2+t3; at this time, if t1N+t2N+t3N≤t1+t2+t3, that is, the sum of the highest temperature values ​​of the optimized layout is less than or equal to the sum of the temperatures of the initial global optimal layout, then it can be understood that the heat dissipation characteristics corresponding to the optimized layout S1 are better than the initial global optimal layout, and the optimized layout S1 is used to replace the initial global optimal layout and the initial local layout to obtain a new layout.

[0093] If the sum of the highest temperature values ​​of the optimized layout is greater than the sum of the temperatures of the initial global optimal layout, the degree of superiority between the optimized layout and the initial local optimal layout can be further judged. For example, it can be judged whether the sum of the highest temperature values ​​of the optimized layout is less than or equal to the sum of the temperatures of the initial local optimal layout. If it is less than or equal to, it means that the heat dissipation characteristics of the optimized layout are better than the heat dissipation characteristics of the initial local optimal layout. The coordinates corresponding to the optimized layout are used to update the initial local optimal layout. At this time, the initial global optimal layout is kept unchanged.

[0094] It should be noted that in this embodiment, the corresponding heat dissipation characteristics of the global optimal layout and the local optimal layout may be the same or different at different iteration times. For example, in the first round of iteration, the original data of the fan heat dissipation adjustment method is used as an input parameter. At this time, the heat dissipation characteristics corresponding to the global optimal layout and the local optimal layout are the same. After that, the global optimal layout and / or the local optimal layout are iteratively updated using the addresses corresponding to the optimized layout to obtain coordinates that meet the preset requirements and output the final global optimal layout.

[0095] In this embodiment, the initial local optimal layout and the initial global optimal layout are both layout parameters that characterize the iterative process.

[0096] exist Figure 4 Based on Figure 5 , Figure 5 A schematic diagram of the steps of step 400 is shown. In this embodiment, the first preset rule is the Meltrov criterion, and the convergence characteristics include the target probability. If the sum of the maximum temperature values ​​corresponding to the optimized layout is greater than the sum of the initial local optimal temperatures, step 400 of determining and judging whether the convergence characteristics of the optimized layout are less than or equal to the first preset threshold according to the first preset rule includes steps 401 to 403.

[0097] Step 401, calculating the target probability of the optimized layout according to the Meltrov criterion;

[0098] Step 402: determine whether the target probability is less than or equal to a first preset threshold; if not, execute step 403.

[0099] Step 403: take the optimized layout as the new initial local optimum, keep the initial global optimum layout unchanged, and perform the step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than the second preset threshold. If so, perform step 404.

[0100] Step 404: keep the initial local optimal and initial global optimal layouts unchanged, and execute the step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold.

[0101] In this embodiment, the calculation formula of the Meltrov criterion satisfies:

[0102]

[0103] Among them, p is the target probability value; e is a constant; K is the Boltzmann constant, whose value is 1.386505×10 -23 J / K; T i is the annealing temperature in the i-th iteration, in K / ℃; E i is the internal energy of the solution of the equation in the i-th iteration process, in J; E jis the internal energy in the solution of the j-th iteration process equation, in J.

[0104] In this embodiment, a possible way to determine the convergence characteristics of the optimized layout based on the Meltrov criterion is to first calculate the target probability of the optimized layout through the calculation formula corresponding to the Meltrov criterion. While calculating the target probability, according to the principle of the Meltrov criterion, a probability value is randomly generated in [0,1], that is, the first preset threshold, to compare with the target probability. If the target probability is less than or equal to the first preset threshold, it means that the received probability corresponding to the current optimized layout does not meet the requirements, and it is necessary to continue iterating to obtain a layout that meets the requirements as the final output.

[0105] For example, when the target probability is greater than the first preset threshold, the optimized layout is used as the new initial local optimum, and the initial global optimum layout is kept unchanged. When the target probability is less than or equal to the first preset threshold, the optimized layout is used as the new initial local optimum, and the initial global optimum layout is kept unchanged. Otherwise, the optimized layout is used as the new initial local optimum, and the initial global optimum layout is kept unchanged.

[0106] After determining the heat dissipation characteristics and convergence characteristics corresponding to the optimized layout, a new initial layout will be obtained, that is, the initial local optimal or initial global optimal layout in the initial layout is updated with the address corresponding to the optimized layout. Figure 1 Based on Figure 6 , Figure 6 A schematic diagram of the steps of step 500 is shown. When the heat dissipation temperature includes the annealing temperature, if the convergence characteristic is less than or equal to the first preset threshold, the step of determining whether the heat dissipation temperature corresponding to the current initial local optimum is less than the second preset threshold includes steps 501 to 503.

[0107] Step 501: Determine the annealing temperature corresponding to the current initial local optimum iteration number.

[0108] Step 502: Determine whether the annealing temperature is less than or equal to the minimum cooling temperature. If not, execute step 503. If yes, execute step 504.

[0109] Step 503: keep the current initial local optimum unchanged, and return to the step of determining the optimized layout based on the initial local optimum through the position optimization model until the second preset rule is met to determine the final global optimal layout.

[0110] Step 504: Take the current initial local optimum as the global optimum layout, and determine whether the second preset rule is satisfied to determine the final global optimum layout.

[0111] In this embodiment, as the number of iterations increases, the corresponding annealing temperature will gradually decrease. Generally, the annealing temperature satisfies: T i =T i-1 *ΔT; where T i is the annealing temperature in the i-th iteration; T i-1 is the annealing temperature during the i-1th iteration; ΔT is the temperature drop coefficient, which is usually between 0.95-0.99 and less than 1.

[0112] In a possible implementation, the second preset rule may be to satisfy a preset number of iterations. For example, the step of determining whether the second preset rule is satisfied is:

[0113] It is determined whether the number of iterations in which the same layout result appears is equal to a third preset threshold. If so, the layout corresponding to the same layout result is used as the final global optimal layout.

[0114] Based on this, please continue to refer to Figure 6 In this embodiment, the annealing temperature corresponding to the number of iterations of the current initial local optimum is first determined, and then whether the annealing temperature is less than or equal to the minimum cooling temperature Tth. If it is less than or equal to the minimum cooling temperature Tth, the current initial local optimum is regarded as the global optimal layout, and then it is determined whether the second preset rule is met, that is, whether the global optimal layout corresponding to the results of several consecutive iterations does not change, or whether the number of iterations meets the preset value. If it does not meet the second rule, it returns to the step of determining the optimized layout based on the initial local optimum through the position optimization model until the second preset rule is met to obtain the final global optimal layout. If the second preset rule is met, the final global optimal layout is output.

[0115] If the annealing temperature is greater than the lowest cooling temperature Tth, the current initial local optimal layout and the current initial global optimal layout are not changed, and then a determination is made as to whether the second preset rule is satisfied.

[0116] Based on this, this embodiment uses a simulated annealing algorithm to continuously compare the convergence characteristics, heat dissipation characteristics and heat dissipation temperature under address information corresponding to different layouts through an iterative process, find an optimal solution that meets the preset requirements, and then determine the global optimal layout.

[0117] Please refer to Figure 7 , Figure 8 , Figure 7 It is the layout diagram of the fan drive circuit under the initial conditions; Figure 8Schematic diagram of the layout of the fan drive circuit after adjustment by the fan heat dissipation adjustment method in the embodiment of the present invention. Among them, module IPM1, module IPM2, and module IPM3 are high-power half-bridge modules under the fan drive circuit; resistors R4, R5, R6, R7, R8, and R9 are power resistors under the fan drive circuit, respectively. Figure 7 The corresponding structure diagram is adjusted to Figure 8 After reading the corresponding structure diagram, please refer to Table 1, which shows the component temperatures before and after layout optimization.

[0118] Table 1

[0119]

[0120] from Figure 7 , Figure 8 As can be seen from Table 1, the total heat dissipation area of ​​the layout after optimization according to the fan heat dissipation adjustment method in this embodiment is increased by 37% compared with the total heat dissipation area of ​​the layout before optimization.

[0121] Based on this, the fan heat dissipation adjustment method of the present invention obtains the initial layout of each power device and the size of the fan drive circuit. Construct and determine the optimized layout based on the initial local optimum through the position optimization model. Judge in turn whether the heat dissipation characteristics and convergence characteristics of the optimized layout meet the preset conditions. If they are not satisfied, and the heat dissipation temperature corresponding to the current initial local optimum meets the second preset threshold, then use the current initial local optimum as the new initial global optimal layout, return to execute the step of determining the optimized layout based on the initial local optimum through the position optimization model, until the second preset rule is met, and determine the final global optimal layout; adjust the layout position of the power device according to the final global optimal layout. The present invention can improve the heat flux density between the components in the control device to improve the working performance and reliability of the control device.

[0122] In a second aspect, the present invention provides a control device, including a processor and a memory, the memory storing machine executable instructions that can be executed by the processor, namely: obtaining the initial layout of each power device and the size of the fan drive circuit. Constructing and determining the optimized layout based on the initial local optimum through a position optimization model. Determining in turn whether the heat dissipation characteristics and convergence characteristics of the optimized layout meet the preset conditions, if they are not satisfied, and the heat dissipation temperature corresponding to the current initial local optimum meets the second preset threshold, then using the current initial local optimum as the new initial global optimal layout, returning to execute the step of determining the optimized layout based on the initial local optimum through the position optimization model, until the second preset rule is met, and determining the final global optimal layout; adjusting the layout position of the power device according to the final global optimal layout.

[0123] In this example, the memory is used to store programs or data. The memory may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc.

[0124] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0125] In addition, the functional modules in the various embodiments of the present invention may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0126] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0127] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A fan heat dissipation adjustment method, applied to a fan drive circuit, wherein the fan drive circuit includes a plurality of power devices, characterized in that: The fan heat dissipation adjustment method comprises: Obtaining an initial layout of each of the power devices and a size of the fan drive circuit, wherein the initial layout includes an initial local optimal layout and an initial global optimal layout; Constructing a position optimization model according to the size of the fan drive circuit, and determining an optimized layout based on the initial local optimum through the position optimization model; Determining the heat dissipation characteristics of the optimized layout, and judging whether the heat dissipation characteristics of the optimized layout are better than the heat dissipation characteristics of the initial layout; If yes, determining and judging whether the convergence characteristic of the optimized layout is less than or equal to a first preset threshold according to a first preset rule; If the convergence characteristic is less than or equal to the first preset threshold, determining whether the heat dissipation temperature corresponding to the current initial local optimum is less than or equal to a second preset threshold; If yes, the current initial local optimum is used as the new initial global optimum layout, and the step of determining the optimized layout based on the initial local optimum by the position optimization model is returned to be executed until the second preset rule is met, and the final global optimum layout is determined; The layout positions of the power devices are adjusted according to the final global optimal layout to improve the heat dissipation performance of the fan.

2. The fan heat dissipation adjustment method according to claim 1, characterized in that: The step of obtaining the initial layout of each of the power devices comprises: Obtaining an initial address of each of the power devices; An address layout is determined based on the initial addresses of the power devices, and the address layout is used as an initial local optimal layout and an initial global optimal layout to obtain the initial layout.

3. The fan heat dissipation adjustment method according to claim 1, characterized in that: The step of constructing the location optimization model comprises: Determining the moving range of each of the power devices according to the size of the fan drive circuit; A displacement function is constructed based on the moving range to obtain a position optimization model; wherein the expression of the position optimization model satisfies: R=ΔR*T i ,R≤R max ; Wherein, R is the moving radius of each power device; ΔR is the attenuation coefficient; T i is the annealing temperature in the i-th iteration; R max is the maximum moving distance.

4. The fan heat dissipation adjustment method according to claim 1, characterized in that: The heat dissipation characteristic includes the sum of the maximum temperature values ​​of each of the power devices; and the step of judging whether the heat dissipation characteristic of the optimized layout is better than the heat dissipation characteristic of the initial layout includes: Determine whether the sum of the highest temperature values ​​of the optimized layout is less than or equal to the sum of the temperatures of the initial global optimal layout; If so, the optimized layout is used as a new initial global optimal layout and a new initial local optimal layout, and a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold is performed.

5. The fan heat dissipation adjustment method according to claim 4, characterized in that: After the step of determining whether the sum of the highest temperature values ​​is less than or equal to the sum of the temperatures of the initial global optimal layout, the method further includes: If the sum of the highest temperature values ​​of the optimized layout is greater than the sum of the temperatures of the initial global optimal layout, then determining whether the sum of the highest temperature values ​​corresponding to the optimized layout is less than or equal to the sum of the temperatures of the initial local optimal layout; If so, the optimized layout is used as a new initial local optimum, the initial global optimum layout is kept unchanged, and a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold is performed.

6. The fan heat dissipation adjustment method according to claim 5, characterized in that: The first preset rule is the Meltrov criterion. If the sum of the highest temperature values ​​corresponding to the optimized layout is greater than the sum of the initial local optimal temperatures, the step of determining and judging whether the convergence characteristic of the optimized layout is less than or equal to a first preset threshold according to the first preset rule includes: Calculating the target probability of the optimized layout according to the Meltrov criterion; Determining whether the target probability is less than or equal to the first preset threshold; If not, the optimized layout is used as a new initial local optimum, the initial global optimum layout is kept unchanged, and a step of determining whether the heat dissipation temperature corresponding to the current initial layout is less than a second preset threshold is performed.

7. The fan heat dissipation adjustment method according to claim 6, characterized in that: The heat dissipation temperature includes an annealing temperature. If the convergence characteristic is less than or equal to the first preset threshold, the step of determining whether the heat dissipation temperature corresponding to the current initial local optimum is less than a second preset threshold comprises: Determine the annealing temperature corresponding to the current initial local optimal number of iterations; Determining whether the annealing temperature is less than or equal to the minimum cooling temperature; If not, the current initial local optimum is kept unchanged, and the process returns to the step of determining the optimized layout based on the initial local optimum through the position optimization model, until the second preset rule is met, and the final global optimal layout is determined.

8. The fan heat dissipation adjustment method according to claim 6, characterized in that: The calculation formula of the Meltrov criterion satisfies: Where p is the target probability value; e is a constant; K is the Boltzmann constant; T i is the annealing temperature during the i-th iteration; E i is the internal energy of the solution of the equation in the i-th iteration process, E j is the internal energy in the solution of the j-th iteration process equation.

9. The fan heat dissipation adjustment method according to claim 1, characterized in that: The second preset rule includes: It is determined whether the number of iterations in which the same layout result appears is equal to a third preset threshold. If so, the layout corresponding to the same layout result is used as the final global optimal layout.

10. A control device, characterized in that: It comprises a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor can execute the machine executable instructions to implement the fan heat dissipation adjustment method described in any one of claims 1 to 9.

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