Arrangement for converter

Abstract

An apparatus for a converter is disclosed. The power converter assembly may include a plurality of conductive paths, such as a first conductive path, a second conductive path, and a third conductive path. The first conductive path extends through the first magnetically conductive material. The second conductive path extends through the second magnetically conductive material. A third conductive path extends through the first magnetically conductive material and the second magnetically conductive material. For example, a first conductive path may be disposed side-by-side and parallel to a first portion of a third conductive path in the first magnetically conductive material; the second conductive path may be disposed in the second magnetically conductive material side-by-side and parallel with a second portion of the third conductive path.

Description

Technical Field

[0001] The present disclosure relates to the field of electronics, and more particularly to trans-inductor voltage regulators and transformer assemblies. Background Art

[0002] A printed circuit board (PCB) or printed wiring board is a laminated structure of conductive layers separated by insulating layers. Typically, a PCB has two functions. The first function is to fix electronic components at specified locations on the outer layers of the PCB by means of attachment methods such as soldering. The electronic circuits instantiated by the populated circuit board are designed to provide one or more specific functions. After manufacturing, the electronic circuits are powered to perform the desired functions.

[0003] Typically, a printed circuit board is a planar device on which multiple components are interconnected via traces to provide functionality as previously discussed. Such implementations of circuitry fabricated on planar circuit board assemblies are limited in size, preventing high density implementations of circuitry.

[0004] Modern VR (voltage regulator) modules used in high-power demanding applications such as AI training processors and TPU-based data centers can be divided into two categories based on how the heat generated by the semiconductor devices is removed from the module to the heat sink.

[0005] Conventional power stage cooling modules include a physical stacking of components to enable direct contact between the power stage itself (such as a package including a set of semiconductor devices and embedding the set of semiconductor devices) and a heat sink, which is the most efficient way to dissipate the generated heat and therefore produces a very low Rth (thermal resistance, the lower the better).

[0006] It should also be noted that a conventional TLVR (trans-inductor voltage regulator) system is typically a voltage regulator (e.g., a buck converter) in which the magnetic device is no longer a single-winding inductor, but a transformer with two windings; the primary winding constitutes the phase inductor. The secondary winding is a so-called TLVR winding, which is used to improve transient performance. The secondary windings of each phase are connected in series, and their routing relative to the PCB (printed circuit board) ensures that the transformer dots rule is always met. Summary of the invention

[0007] The implementation of clean energy (or green technology) is very important to reduce the impact of human beings on the environment. Generally, clean energy includes any evolving methods and materials used to reduce the overall toxicity of energy consumption to the environment.

[0008] The present disclosure includes the following observations: Raw energy, such as energy received from green or non-green energy sources, typically needs to be converted into an appropriate form (such as a desired AC voltage, DC voltage, etc.) before it can be used to power terminal devices such as servers, computers, mobile communication devices, etc. Whether the energy is received from a green energy source or a non-green energy source, it is desirable to use the raw energy provided by such a system most efficiently to reduce our impact on the environment. The present disclosure helps reduce our carbon emissions (and green energy) via more efficient energy conversion and circuit implementations that support more efficient energy conversion.

[0009] As discussed herein, manufacturers produce one or more components that provide higher density circuitry and better heat dissipation capabilities than conventional instantiation of circuitry on a planar circuit board.

[0010] More specifically, the present disclosure includes devices, systems, methods, etc. For example, a device as discussed herein includes: a first conductive path (also referred to as an ECP) ​​extending through a first magnetic conductive material (also referred to as an MPM); and a second conductive path extending through the first magnetic conductive material, the first conductive path and the second conductive path being arranged side by side and passing through the first magnetic conductive material in parallel.

[0011] The device also includes a component. The component is configured to include: a first conductive path; a second conductive path; a first substrate. The first axial end of the first conductive path is directly coupled to the first node of the first substrate, and the first conductive path provides a first heat dissipation path between the second axial end of the first conductive path and the first node. The first axial end of the second conductive path is directly coupled to the second node of the first substrate, and the second conductive path provides a second heat dissipation path between the second axial end of the second conductive path and the second node. The axial length of the first conductive path extends substantially orthogonal to the planar surface of the first substrate. The axial length of the second conductive path extends substantially orthogonal to the planar surface of the first substrate. The device can be configured to include an electronic circuit system embedded in the first substrate. The electronic circuit system can be configured to control the transmission of current through the first conductive path. In addition, or alternatively, the electronic circuit system can be fixed to the first substrate. Such an electronic circuit system can be configured to control the transmission of current through the first conductive path.

[0012] In addition, the component can be configured to include: a third conductive path extending through the second magnetic conductive material; a fourth conductive path extending through the second magnetic conductive material, the third conductive path being arranged side by side with the fourth conductive path and extending parallel to the second magnetic conductive material. A first axial end of the third conductive path is directly coupled to a third node of the first substrate, and the third conductive path provides a third heat dissipation path between a second axial end of the third conductive path and the third node; a first axial end of the fourth conductive path can be directly coupled to a fourth node of the first substrate, and the fourth conductive path provides a fourth heat dissipation path between a second axial end of the fourth conductive path and the fourth node; an axial length of the third conductive path is configured to extend substantially orthogonal to a planar surface of the first substrate; and an axial length of the fourth conductive path can be configured to extend substantially orthogonal to the planar surface of the first substrate.

[0013] Furthermore, an apparatus as discussed herein may be configured to include: a conductive element providing a connection between the second node and the fourth node, the conductive element connecting the second conductive path and the fourth conductive path in series. The conductive element may be fixed to the first substrate.

[0014] Other examples as discussed herein include a first component and a second component. The first component is configured to include: a first substrate; a first conductive path; a second conductive path. The first axial end of the first conductive path can be directly coupled to the first node of the first substrate, and the first conductive path provides a first heat dissipation path between the second axial end of the first conductive path and the first node; the first axial end of the second conductive path can be directly coupled to the second node of the first substrate, and the second conductive path provides a second heat dissipation path between the second axial end of the second conductive path and the second node. The axial length of the first conductive path can be configured to extend substantially orthogonal to the planar surface of the first substrate; and the axial length of the second conductive path can be configured to extend substantially orthogonal to the planar surface of the first substrate. The second component can be configured to include: a second substrate; a third conductive path extending through the second magnetic conductive material; a fourth conductive path extending through the second magnetic conductive material, the third conductive path and the fourth conductive path are arranged side by side and parallel to the second magnetic conductive material. The first axial end of the third conductive path can be directly coupled to the first node of the second substrate, and the third conductive path provides a third heat dissipation path between the second axial end of the third conductive path and the first node of the second substrate; the first axial end of the fourth conductive path can be directly coupled to the second node of the second substrate, and the fourth conductive path provides a fourth heat dissipation path between the second axial end of the fourth conductive path and the second node of the second substrate. The axial length of the third conductive path can be configured to extend substantially orthogonal to the planar surface of the second substrate; and the axial length of the fourth conductive path can be configured to extend substantially orthogonal to the planar surface of the second substrate. In addition, the device can be configured to include a third substrate. The first substrate and the second substrate can be fixed to the third substrate. The device can also be configured to include a conductive element that provides a series connection of the second conductive path and the fourth conductive path, and the conductive element can be fixed to the third substrate.

[0015] Additionally, the present disclosure includes an apparatus comprising: a first conductive path extending through a first magnetically conductive material; a second conductive path extending through a second magnetically conductive material; and a third conductive path extending through the first magnetically conductive material and the second magnetically conductive material, the first conductive path being disposed in the first magnetically conductive material side by side and parallel to a first portion of the third conductive path, and the second conductive path being disposed in the second magnetically conductive material side by side and parallel to a second portion of the third conductive path. In one example, the first magnetically conductive material and the second magnetically conductive material are disposed together in a single homogenous block of magnetically conductive material.

[0016] The combination of the first conductive path and the first portion of the third conductive path may be a first transformer, wherein the first conductive path is inductively coupled to the first portion of the third conductive path; the combination of the second conductive path and the second portion of the third conductive path may be a second transformer, wherein the second conductive path is inductively coupled to the second portion of the third conductive path. The first magnetically conductive material may not be present in a first volume between the first conductive path and the first portion of the third conductive path; the second magnetically conductive material may not be present in a second volume between the second conductive path and the second portion of the third conductive path.

[0017] The device can be configured to include: i) a first switch circuit system coupled to a first axial end of a first conductive path, the first switch circuit system being operable to control the amplitude of a first current passing through the first conductive path; and ii) a second switch circuit system coupled to a first axial end of a second conductive path, the second switch circuit system being operable to control the amplitude of a second current passing through the second conductive path. Control of the first switch circuit system can be operated to generate a first output current output from a second axial end of the first conductive path; control of the second circuit system can be operated to generate a second output current output from a second axial end of the second conductive path. The second axial end of the first conductive path can be directly connected to a second axial end of the second conductive path to jointly generate an output voltage.

[0018] Furthermore, the third conductive path may be configured to carry only alternating current (AC) current via control of the switch.

[0019] Furthermore, the first axial end of the third conductive path and the second axial end of the third conductive path may both be directly coupled to a voltage reference.

[0020] An apparatus as discussed herein may include: a substrate; a first axial end of a first conductive path directly coupled to a first node of the substrate, the first conductive path providing a first heat dissipation path between a second axial end of the first conductive path and the first node; and a first axial end of a second conductive path directly coupled to a second node of the substrate, the second conductive path providing a second heat dissipation path between a second axial end of the second conductive path and the second node. An axial length of the first conductive path may extend substantially orthogonal to a planar surface of the substrate; and an axial length of the second conductive path may extend substantially orthogonal to the planar surface of the substrate.

[0021] As yet another example, an apparatus as discussed herein may be configured to include a first substrate and a second substrate. A first axial end of a first conductive path may be directly coupled to a first node of the first substrate, and the first conductive path may be operable to provide a first heat dissipation path between a second axial end of the first conductive path and the first node. A first axial end of a second conductive path may be directly coupled to a second node of the second substrate, and the second conductive path may be operable to provide a second heat dissipation path between a second axial end of the second conductive path and the second node. An axial length of the first conductive path may be configured to extend substantially orthogonal to a planar surface of the first substrate; and an axial length of the second conductive path may be configured to extend substantially orthogonal to a planar surface of the second substrate.

[0022] An apparatus as discussed herein may include: i) a first conductor element extending between a second axial end of a first conductive path and a third node of a substrate, the first conductor element being operable to transmit a first output current from the second axial end of the first conductive path to the substrate; and ii) a second conductor element extending between a second axial end of the second conductive path and a fourth node of the substrate, the second conductor element being operable to transmit a second output current from the second axial end of the second conductive path to the substrate.

[0023] Note that the third conductive path may be implemented as a series circuit path disposed across the inductor voltage regulator.

[0024] In addition, the apparatus as discussed herein may include: a metal layer coupled to a first axial end of the first conductive path and a second conductive path. A portion of the first magnetically conductive material and a portion of the second magnetically conductive material may be disposed between the metal layer and a substrate coupled to second axial ends of the first conductive path and the second conductive path. The metal layer may be operated to electromagnetically shield noise emitted by a first return conductive path extending from an axial end of a first portion of the third conductive path to the substrate; and the metal layer may be operated to electromagnetically shield noise emitted by a second return conductive path extending from an axial end of a second portion of the third conductive path to the substrate.

[0025] According to a further example, the apparatus as discussed herein may include: a metal shielding layer encapsulating a third portion of the third conductive path, the third portion of the third conductive path being disposed neither in the first magnetically conductive material nor in the second magnetically conductive material.

[0026] An apparatus as discussed herein may include an interposer operable to provide connection of a first portion of the third conductive path to a second portion of the third conductive path; the interposer may be disposed between the main substrate and the combination of the first and second magnetically conductive materials.

[0027] It should also be noted that the first magnetically conductive material, the second magnetically conductive material, the first conductive path, the second conductive path, the first portion of the third conductive path, and the second portion of the third conductive path may be disposed in an overmolded component.

[0028] In addition, an apparatus as discussed herein may include: an overmolded assembly including a first circuit board, a first magnetically conductive material, a second magnetically conductive material, a first conductive path, and a second conductive path. The overmolded assembly may be configured to reside between the second circuit board and the third circuit board, and the first circuit board may be operated to provide a connection between the second circuit board and the third circuit board.

[0029] According to another example, an apparatus as discussed herein may include: an assembly including a first magnetically conductive material and a second magnetically conductive material, which may be operable to reside between a first circuit board and a second circuit board, and a third portion of a third conductive path may be disposed between the assembly and the second circuit board.

[0030] The third portion of the third conductive path may be configured to reside between the first magnetically conductive material and the second magnetically conductive material.The third portion of the third conductive path may be a return path from an axial end of the first portion of the third conductive path to the substrate.

[0031] As another example, a device as discussed herein includes: a first conductive path extending through a first magnetically conductive material; and a second conductive path extending through the first magnetically conductive material, the first conductive path and the second conductive path being disposed side by side and in parallel in the first magnetically conductive material.

[0032] In addition, it should be noted that although each of the different features, techniques, configurations, etc. herein may be discussed in different places of the present disclosure, it is intended that each of these concepts may be optionally performed independently of each other or in combination with each other where appropriate. Therefore, one or more of the present inventions described herein may be implemented and viewed in many different ways.

[0033] In addition, please note that the preliminary discussion of the technology (the Summary of the Invention) herein is not intended to specify every novel aspect of the present disclosure or the claimed invention. Rather, the Summary of the Invention merely presents general aspects and corresponding points of novelty relative to conventional technology. For additional details and / or possible viewpoints (arrangements) of the present invention, the reader is referred to the Detailed Description section (which is a summary) of the present disclosure discussed further below and the corresponding drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1A is an example 3-dimensional (3D) diagram illustrating a transformer or power converter assembly as discussed herein.

[0035] Figure 1Bis an example side view showing a transformer or power converter assembly as discussed herein.

[0036] Figure 2 is an example diagram illustrating a trans-inductor voltage regulator circuit as discussed herein.

[0037] Figure 3A is an example diagram illustrating a side cross-sectional view of a first transformer assembly as discussed herein.

[0038] Figure 3B is an example diagram illustrating a side cross-sectional view of a second transformer assembly as discussed herein.

[0039] Figure 4 is an example 3D diagram illustrating a power converter assembly including multiple power converter phases as discussed herein.

[0040] Figure 5 is an example diagram showing a side cross-sectional view of a transformer assembly as discussed herein.

[0041] Fig. 6A and Figure 6B is an example diagram showing a side cross-sectional view of a transformer assembly as discussed herein.

[0042] Figure 7 is an example diagram showing TLVR (trans-inductor voltage regulator) and power stage connections as discussed herein.

[0043] Figure 8 is an example 3D diagram showing current flow of a power converter assembly through a series connection of multiple transformer windings as discussed herein.

[0044] Fig. 9 is an example side view illustrating an implementation of a transformer assembly as discussed herein.

[0045] Fig. 10A and Fig. 10B is an example cross-sectional view showing an inductive winding associated with a transformer assembly as discussed herein.

[0046] Fig.11 is an example diagram showing a power supply circuit for implementing any of the transformer components in a trans-inductor voltage regulator as discussed herein.

[0047] Fig.12 are example diagrams showing different views of a transformer assembly as discussed herein.

[0048] Fig.13 are example diagrams showing different views of a transformer assembly as discussed herein.

[0049] Fig.14 are example diagrams showing different views of a transformer assembly as discussed herein.

[0050] Fig.15 is a diagram illustrating an example of an over-mold transformer assembly as discussed herein.

[0051] Fig.16 are example diagrams showing different views of a transformer assembly as discussed herein.

[0052] Fig.17A , Fig. 17B and Fig. 17C are example diagrams showing different views of providing a series connection through multiple windings of multiple transformers as discussed herein.

[0053] Fig.18A is an example diagram of multiple individual components mounted on respective host substrates as discussed herein.

[0054] Fig.18B is an illustrative diagram of multiple instances of multiple subassemblies forming a single multi-phase assembly mounted on respective main substrates as discussed herein.

[0055] As shown in the accompanying drawings, the foregoing and other objects, features and advantages of the subject matter disclosed herein will become apparent from the following more detailed description herein, in which like reference numerals refer to the same parts throughout the different views. The accompanying drawings are not necessarily drawn to scale, with emphasis placed on illustrating principles, concepts, aspects, techniques, etc. DETAILED DESCRIPTION

[0056] Now, more specifically, Figure 1A is an example 3-dimensional (3D) diagram illustrating a power converter assembly as discussed herein.

[0057] like Figure 1A As shown, the corresponding manufacturer 150 or other suitable entity manufactures the component 100 to include: one or more magnetic conductive material blocks, such as a first magnetic conductive material block 111, a second magnetic conductive material block 112, ...; a conductive path 121; a conductive path 122; a conductive path 123-1; a conductive path 123-2, etc.

[0058] The magnetic permeability of the first magnetic conductive material 111 may be the same as or different from the magnetic permeability of the second magnetic conductive material 112, etc. In one example, the first magnetic conductive material 111 and the second magnetic conductive material 112 are arranged together, fused, connected, etc. as a single homogenous magnetic conductive material block.

[0059] Furthermore, in this example, the first magnetic conductive material 111 includes a cavity 111-C (opening or volume), and both the conductive path 121 and the conductive path 123-1 pass through one end of the cavity 111-C and the other end. The conductive path 121 and the conductive path 123-1 can each be coated with an insulating material or separated by an insulating spacer, so that the pair of conductive paths 121 and the conductive path 123-1 are separated by an insulating layer, so that the conductive path 121 is electrically isolated from the conductive path 123-1 (for example, not in contact). In other words, the first magnetic conductive material 111 may not exist between the conductive path 121 and the conductive path 123-1.

[0060] In addition, the conductive path 121 and the conductive path 123-1 each extend in an axial direction parallel to the Y axis. For example, the conductive path 121 includes a first axial end 121-1 protruding from the first magnetic conductive material 111 and the cavity 111-C; the conductive path 121 includes a second axial end 121-2 protruding from the first magnetic conductive material 111 and the cavity 111-C. The conductive path 123-1 includes a first axial end E1 protruding from the first magnetic conductive material 111 and the cavity 111-C; the conductive path 123-1 includes a second axial end E2 protruding from the first magnetic conductive material 111 and the cavity 111-C.

[0061] The second magnetic conductive material 112 (such as adjacent to the first magnetic conductive material 111) includes a cavity 112-C (open volume or space), and the conductive path 122 and the conductive path 123-2 pass through the cavity 112-C. The conductive path 122 and the conductive path 123-2 can each be coated with an insulating material, or the pair of conductive paths 122 and conductive paths 123-2 are separated by an insulating layer, so that the conductive path 122 is electrically isolated from the conductive path 123-2 (for example, not in contact). In other words, there may be no second magnetic conductive material 112 between the conductive path 122 and the conductive path 123-2.

[0062] In addition, the conductive path 122 and the conductive path 123-2 each extend in an axial direction parallel to the Y-axis. For example, the conductive path 122 includes a first axial end 122-1 protruding from the second magnetic conductive material 112 and the cavity 112-C; the conductive path 122 includes a second axial end 122-2 protruding from the second magnetic conductive material 112 and the cavity 112-C. The conductive path 123-2 includes a first axial end E3 protruding from the second magnetic conductive material 112 and the cavity 112-C; the conductive path 123-2 includes a second axial end E4 protruding from the second magnetic conductive material 112 and the cavity 112-C.

[0063] The connections of the different windings (such as conductive paths 121 , 122 , 123 - 1 , 123 - 2 , etc.) may vary depending on the circuit implementation.

[0064] Figure 1Bis an example side view illustrating a power converter assembly as discussed herein.

[0065] The side view of assembly 100 shows the spacing or open volume or just separation between conductive path 121 and conductive path 123-1 and the spacing between conductive path 122 and conductive path 123-2. As previously discussed, conductive path 121 can be spaced apart from conductive path 123-1 via a corresponding insulating material layer 191; conductive path 122 can be spaced apart from conductive path 123-2 via a corresponding insulating material layer 192.

[0066] As shown in this side cross-sectional view, component 100 (such as a device, a power converter component, a transformer component, etc.) includes: i) a first conductive path 121 (such as a first inductive path) extending through a first magnetic conductive material 111; ii) a second conductive path 122 (such as a second inductive path) extending through a second magnetic conductive material 112; and iii) a third conductive path (such as a combination of conductive path 123-1 and conductive path 123-2) extending through both the first magnetic conductive material 111 and the second magnetic conductive material 112.

[0067] The first conductive path 121 is arranged side by side and in parallel with the first portion of the third conductive path (such as conductive path 123-1) in the first magnetic conductive material 111; the second conductive path 122 is arranged side by side and in parallel with the second portion of the third conductive path (such as conductive path 123-2) in the second magnetic conductive material 112. The circuit path 223-P1 provides a connection from the conductive path 123-1 to the conductive path 123-2 to create the entire conductive path 123 (i.e., a series circuit path).

[0068] In one example, a combination of the first conductive path 121 and the first portion of the third conductive path (also referred to as conductive path 123-1) is a first transformer TR1, wherein the first conductive path 121 is inductively coupled to the first portion 123-1 of the third conductive path; a combination of the second conductive path 122 and the second portion of the third conductive path (also referred to as conductive path 123-2) is a second transformer TR2, wherein the second conductive path 122 is inductively coupled to the second portion 123-2 of the third conductive path.

[0069] As previously discussed, the first magnetically conductive material 111 includes a cavity 111-C in which the first magnetically conductive material 111 is not present in a first volume or space between the first conductive path 121 and the first portion 123-1 of the third conductive path. Additionally, the second magnetically conductive material 112 includes a cavity 112-C in which the first magnetically conductive material 112 is not present in a second volume or space between the second conductive path 122 and the second portion 123-2 of the third conductive path.

[0070] As discussed further herein, one or more instances of assembly 100 may be implemented in a trans-inductor voltage regulator (also referred to as a TLVR) to generate a corresponding output voltage 223 (see FIG. 2 ) via contributions from respective output currents of conductive paths 121 and 122. Figure 2 ). In such an example, the corresponding TLVR windings of adjacent phases are as follows Figure 1B 1-IN to ensure proper coupling to each phase. When a positive load step occurs on VOUT, the current in the TLVR winding is positive from node TLVR1-IN to node TLVR2-OUT, and vice versa. For example, during a load current release on VOUT (a decrease in the output current associated with VOUT), the current is negative from node TLVR2-OUT to node TLVR1-IN. Therefore, referring to Figure 2 , the node TLVR1-OUT is connected to the node TLVR2-IN. Finally, the node TLVR2-OUT is routed back to the corresponding PCB (substrate, such as a printed circuit board) to ensure the TLVR connection between adjacent modules.

[0071] Figure 2 is an example diagram showing logical and physical connections across multiple windings in an inductive voltage regulator as discussed herein.

[0072] For example, as shown in power converter assembly 200 (such as part of a trans-inductor voltage regulator circuit), conductive path 121 (such as a first phase inductor) extends between node VSW1 and node VOUT (producing output voltage 223); conductive path 122 (such as a second phase inductor) extends between node VSW2 and node VOUT (producing output voltage 223).

[0073] Power converter assembly 200 includes series circuit path 160 between nodes TLVR1-IN and TLVR2-OUT. Series circuit path 160 (also referred to as conductive path 123) includes a conditional series connection of conductive path 123-1 and conductive path 123-2, wherein conductive path 223-P1 provides a connection between node E2 (such as node TLVR1-OUT) and node E3 (such as node TLVR2-IN).

[0074] Figure 3A is an example diagram showing a side cross-sectional view of a first transformer as discussed herein. Figure 3B is an example diagram showing a side cross-sectional view of a second transformer as discussed herein.

[0075] In this example, the phase windings (such as the conductive paths discussed herein) not only fulfill the corresponding electrical tasks, but also act as a very effective thermal bridge to the heat sink above and / or below the assembly 100 as discussed further herein.

[0076] In this example, the TLVR routing is accomplished through substrate 301 (substrate layer, such as one or more different substrates or circuit boards). Specifically, the input of each TLVR winding (such as conductive path 123-1, conductive path 123-2, etc.) can be connected to the PCB (TLVR1-IN, TLVR2-IN) through a copper clip. Such a copper clip (such as a clip combination of conductive path 223-P11 and conductive path 223-P12) can contact the power stage package (such as substrate 302) or can be lifted relative to it. In the latter case, the corresponding supplementary conductive path provides the connection of the TLVR1-IN node or the TLVR2-IN node to the substrate 302. Similar to providing the Vout potential of the output voltage 223, the top end of each TLVR winding (such as conductive path 121 and conductive path 122) is routed back to the PCB (substrate 301 and / or substrate 302) through a copper clip (such as a clip combination of conductive element 321 and conductive element 399).

[0077] More specifically, the axial length of first conductive path 121 extends substantially orthogonal to a planar surface (such as in the XZ plane) of substrate 301-1 and / or substrate 302 and a planar surface (such as in the XZ plane) associated with conductive element 321 (such as in the XZ plane). Figure 3A A portion of the assembly 100 in can be configured to include: a first metal clip (or conductive element or circuit path) that provides a connection (such as a combination of conductive element 321 and conductive element 399) between node 121-2 and node N31 of substrate 302. In addition, Figure 3A The component 100 in can be configured to include: a second metal clip (or conductive element or circuit path) that provides a connection between the node E2 and the node N32 (such as a combination of the conductive element 223-P11 on the top and the conductive element 223-P12 on the side).

[0078] Thus, examples as discussed herein include a first conductor element (such as conductive element 321 and conductive element 399) extending between the second axial end 121-2 of the first conductive path 121 and the node N31 of the substrate 302. The first conductor element or clip may be operated to transmit a first output current from the second axial end 121-2 of the first conductive path to the substrate 301-1 or substrate 302, thereby providing power to a load associated with the substrate 302 (such as via the output voltage 223).

[0079] Notice, Figure 3BThe axial length of the second conductive path 122 in the assembly 100 can be configured to extend substantially orthogonal to the planar surface of the substrate 301-2 and / or the substrate 302 and the planar surface associated with the conductive element 321. A portion of the assembly 100, such as a first metal clip (or conductive element or circuit path), provides a connection (such as a combination of the conductive element 321 and the conductive element 399) between the node 122-2 and the node N31. In addition, Figure 3B The assembly 100 in may be configured to include: a third metal clip (or conductive element or circuit path) that provides a connection between the node E4 and the node N34 (such as a combination of the conductive element 223 - P21 and the conductive element 223 - P22 ).

[0080] Thus, the examples discussed herein include a second conductor element (such as conductive element 321 and conductive element 399) extending between the second axial end 122-2 of the second conductive path 122 and the node N31 of the substrate 302. The second conductor element can be operated to transmit a second output current associated with the output voltage 223 from the second axial end 122-2 of the second conductive path to the substrate 301-2 or the substrate 302.

[0081] Note that the inter-winding connection between two adjacent TLVR windings, such as from node N32 to node E3 (such as Figure 2 The circuit path 223 -P1) in the example embodiment may be implemented from TLVR1 -OUT to TLVR2 -IN through an internal layer of a PCB substrate (such as substrate 301 and / or substrate 302 ).

[0082] Given an electrical task, each of the TLVR windings discussed herein can withstand relatively high voltages (up to (Vin-Vo)*Nph) (e.g., when using discrete transient inductors), but also rapid and high current changes over time (high di / dt).

[0083] The high di / dt through the conductive path can make the TLVR winding very noisy, which needs to be shielded so as not to interfere with nearby circuitry. In addition, the high voltage of the TLVR winding can create a need for the thermal interface material, which is typically placed between the top surface of the module and the customer's heat sink, to be thicker than usual in order to provide adequate electrical isolation. However, the thicker the thermal interface material (also called TIM), the higher the thermal resistance Rth, and therefore the lower its ability to dissipate heat. For these reasons, in certain applications it may be necessary or desirable to shield the TLVR winding (also called the conductive path) and at the same time have a stable low potential on the top exposed surface. This can be achieved using Figure 5 This is achieved with the implementation shown, where the Vout clamp covers the TLVR winding and only exposes the stable and low Vout potential.

[0084] Figure 4 is an example 3D diagram illustrating a power converter assembly including a plurality of power converter phases as discussed herein.

[0085] In this example, the first clip providing the connection includes a planar metal layer 321 (such as shown in the XZ plane) and a planar metal layer 399 (such as shown in the XY plane) that provide conductivity between the axial ends 121-2 and 122-2 (nodes) and a node N31 associated with the substrate 302. Thus, the output voltage 223 (Vout) is provided to the substrate 302 via the first metal clip.

[0086] Alternatively, it is noted that the first clip may be connected to substrates 301 - 1 and 301 - 2 ; substrates 301 - 1 and 301 - 2 may be configured to provide a conductive path layer to transfer the output voltage Vout received from the first clip to substrate 301 and / or substrate 302 .

[0087] In addition, substrate 302 inputs an input voltage TLVR1-IN (such as any suitable reference voltage or any suitable reference potential) to node E1 of conductive path 123-1 through a corresponding clip or conductive path through substrate 301-1 in a manner as previously discussed. Substrate 302 provides a connection from node N32 (such as TLVR1-OUT) to the clip or provides a connection to node E3 of conductive path 123-2 through substrate 301-2. An example of current associated with conductive path 123 (series circuit path 160) is shown in FIG. Figure 8 Shown in.

[0088] Figure 5 is an example diagram showing a side cross-sectional view of a transformer assembly as discussed herein.

[0089] In yet another example, it is noted that the high voltage and di / dt related challenges of the TLVR winding can be overcome by using coaxial cables / blocks for the portion of the winding that is disposed outside the core. Figure 5 An example is shown in . Specifically, an internal conductor (such as shielded conductive path 223-P11) provides a connection for the output of conductive path 123-1 back to substrate 301 and / or substrate 302 via conductive element 223-P12. In such a case, the left portion of planar metal layer 521 (e.g., a stable voltage potential such as Vout or a DC voltage) is suspended from conductive path 223-P11, thereby providing EMI shielding for wireless transmissions from conductive path 223-P11. Therefore, in addition to being a heat sink for thermal energy received from conductive path 121, the planar metal layer 521 on top of component 100 also provides the shielding needed to shield against noise.

[0090] It is also noted that, in a similar manner to the phase windings, each TLVR winding (such as conductive paths 123 - 1 , 123 - 2 , etc.) can be used to push heat out of the power stage (such as substrate 301 and corresponding components or substrate 302 and corresponding components), thereby enhancing the heat dissipation capabilities of assembly 100 .

[0091] like Figure 5 As shown, this example of assembly 100 can be configured to include complete shielding of TLVR windings, such as conductive path 123 - 1 and conductive path 123 - 2 . For example, planar metal layer 521 blocks wireless noise emanating from conductive element 223 - P11 .

[0092] As further noted in this example, the assembly 100 can be configured to include the substrate 301 and / or the substrate 302. The first axial end 121-1 of the first conductive path 121 is directly coupled to the first node N51 of the substrate 301. In such a case, the first conductive path 121 provides a first heat dissipation path from the second axial end 121-2 through the first conductive path 121 to the first node N51. In other words, the heat associated with the conductive path 121 can be dissipated to the substrate 301 and / or the substrate 302. The planar metal layer 521 also dissipates the heat received from the conductive path 121 to the air above the assembly. A heat sink can be provided on top of the planar metal layer 521.

[0093] As further shown, the first axial end 121-1 of the conductive path 121 can be directly coupled to the substrate 302 or the node N51 (such as a surface pad) of the substrate 301, thereby providing heat dissipation capabilities. For example, in such a case, the conductive path 121 provides a heat dissipation path from the first axial end 121-1 and the node N51 through the conductive path 121 to the planar metal layer 521, or vice versa. The planar metal layer 521 dissipates the heat received from the conductive path 121 to the upper part of the component.

[0094] In addition, the first axial end E1 of the conductive path 123-1 can be directly coupled to the second node N52 (such as a surface plate) of the substrate 302 or the substrate 301, thereby providing heat dissipation capabilities. In this case, the second conductive path 123-1 provides a heat dissipation path from the first axial end E1 through the conductive path 123-1 to the conductive path 223-P11. The conductive path 123-1 allows heat to flow from the substrate 301 or the substrate 302 through the node N52 and the conductive path 123-1 to the conductive path 223-P11.

[0095] Fig. 6A is an example diagram showing a side cross-sectional view of a transformer assembly as discussed herein.

[0096] In this example, a first metal clip or return path associated with conductive path 123 - 1 , such as including conductive paths 223 - P11 and 223 - P12 , may be configured to provide a connection of axial end E2 to node N32 coupled to substrate 301 and / or substrate 302 .

[0097] As further shown, a second metal clip or return path associated with conductive path 121 (such as including planar metal layer 521 and planar metal layer 699) extends between axial end 121-2 and node N61 of substrate 302. Also note that a portion of planar metal layer 521 extends to the right to provide additional heat dissipation capability at the top of assembly 100.

[0098] Thus, the planar metal layer 521 may be a heat sink. The combination of the planar metal layer 521 and the planar metal layer 699 provides shielding for wireless electromagnetic signals emitted through the third conductive paths, such as the conductive paths 223 - P11 and 223 - P12 .

[0099] Figure 6B is an example diagram showing a side cross-sectional view of a transformer assembly as discussed herein.

[0100] In this example, the metal clip (such as including the conductive path 223-P11 and the conductive path 223-P12) can be configured to include a metal shielding layer 690 that encapsulates the metal clip (such as the third portion of the third conductive path 123). As shown, the metal clip (such as including the conductive path 223-P11 and the conductive path 223-P12) is neither disposed in the first magnetic conductive material 111 nor in the second magnetic conductive material 112.

[0101] Note that the shielding provided by the metal shielding layer 690 may be implemented in any of the configurations as discussed herein.

[0102] Figure 7 is an example diagram showing power stage and TLVR (trans-inductor voltage regulator) connections as discussed herein.

[0103] exist Figure 7 In the depicted example, this implementation requires a new dedicated power stage that has a TLVR exposed pad on top of its package (assembly 100) and a TLVR pad in its pin footprint.

[0104] Figure 7 The advantage of the implementation in is that the PCB area previously used for the TLVR IN connection is saved, thereby making the design more flexible and the PCB area can be used for other components. In addition, since the bottom plate of the winding no longer needs to be bent, the manufacturability of the TLVR conductor is greatly simplified.

[0105] Figure 8 is an example 3D diagram of a power converter assembly showing current flow through a series connection of multiple transformer windings as discussed herein.

[0106] In this example, assembly 100 includes insert 810. Insert 810 is optional.

[0107] The insert 810 can be disposed between the main substrate 301 layer (such as substrate 301-1 and substrate 301-2) and the combination of the first magnetic conductive material 111 and the second magnetic conductive material 112. In addition, the insert 810 can be configured to provide a connection (such as circuit path #6) from the conductive path 123-1 (such as circuit path #3) to the conductive path 123-2 (such as circuit path #7). Alternatively, if the insert 810 is not present in the assembly 100, the substrate 301 (also referred to as the substrate layer) and / or the substrate 302 provide a connection associated with the series circuit path including the conductive path 123-1, the conductive path 123-2, etc.

[0108] Note that the interposer 810 (such as a PCB) can be soldered to each power stage package via an exposed pad, which can be an electrically floating network or a stable potential, which is useful for shielding sensitive gate drive circuitry inside the power stage package if needed. Such an example implementation can be beneficial primarily when it is necessary to shield such circuitry from the noise of the TLVR. Figure 8 An example of component 100 in includes multiple heat dissipation paths, such as individual phase windings (conductive paths 121 and 122) and other paths starting from the exposed pad of the package, through an insert 810 (such as a PCB) and ultimately through the TLVR winding to a heat sink (such as a planar metal layer 321 or a corresponding heat sink coupled to the planar metal layer 321).

[0109] In one example, only two TLVR pads are required on the substrate PCB, giving the designer more flexibility.

[0110] Insert 810 may include additional electrical networks (such as metal circuit paths) as discussed herein. Alternatively, it should be noted that any of the connections provided by insert 810 may be implemented via one or more of substrates 301 (such as substrate 301-1, substrate 301-2, etc.), substrate 302, etc.

[0111] Furthermore, in this example of series circuit paths 160 (such as circuit paths 1, 2, 3, 4, 5, 6, 7, 8, 9), current from TLVR1-IN extends along circuit path #1 between substrate 302 and insert 810 or other suitable entity of assembly 100. The current is then transmitted along circuit path #2 in insert 810 to axial end E1 of conductive path 123-1. Circuit path #3 (such as conductive path 123-1) transmits current from axial end E1 to axial end E2 of conductive path 123-1. As previously discussed, conductive path 123-1 supports the transmission of heat from one or more of insert 810, substrate 301, substrate 302, components associated with assembly 100, etc. Additionally, circuit path #4, such as conductive element 223-P11, transmits current to circuit path #5, such as conductive element 223-P12. The current is then transferred along circuit path #6 in the insert 810 or other suitable entity (such as substrate 302, substrate 301, etc.) to the axial end E3 of the conductive path 123-2. Circuit path #7 (such as conductive path 123-2) transfers the current from the axial end E3 of the conductive path 123-2 to the axial end E4. As previously discussed, the conductive path 123-2 supports the transfer of heat from one or more of the insert 810, substrate 301, substrate 302, components associated with the assembly 100, etc. Circuit path #8, such as conductive element 223-P21, transfers the current to circuit path #9, such as conductive element 223-P22. Circuit path #9 transfers the current to a reference voltage node associated with the insert 810 or to the substrate 301 and / or substrate 302 through the insert 810.

[0112] Also note that Fig.11 Any of the circuit components in the trans-inductor voltage regulator circuit, such as the trans-inductor voltage regulator circuit, may be mounted to substrate 301-1, substrate 301-2, substrate 301 (in the case where substrate 301-1 and substrate 301-2 are implemented as a single substrate 301), substrate 302, etc. Switching of corresponding switches in the trans-inductor voltage regulator circuit may be operated to convert a corresponding input voltage into an output voltage result and a corresponding heat at a bottom layer of the component 100, such as substrate 301, substrate 302, etc. As previously discussed, conductive paths such as conductive path 121, conductive path 122, conductive path 123-1, conductive path 123-2, circuit path #5, circuit path #9, etc. provide a path for corresponding heat to flow along the Y-axis to the top side of the component 100, such as the planar metal layer 321.

[0113] Fig. 9 is an example diagram illustrating an implementation of a transformer assembly as discussed herein.

[0114] In this implementation, all circuit components 955 (such as Fig.11 The switches and / or other components associated with controlling the current through the conductive path shown in the trans-inductor voltage regulator circuit can all be embedded in one or more surfaces of the substrate 302 that completes the TLVR network wiring. The benefits of embedding components in the substrate 302 include: no increase in the cost of the power stage packaging, the PDN is reduced to obtain higher efficiency, and a larger available height is provided for other components (such as magnets). In addition, the TLVR windings (such as conductive path 123-1, conductive path 123-2, etc.) can be further simplified without any base plate (such as a PCB) for connecting to the substrate 302.

[0115] As previously discussed, each of the different conductive paths discussed herein can be configured to carry heat to substrate 301, substrate 302, etc. In this example, with a trans-inductive voltage regulator circuit (such as Fig.11 ) and switches and corresponding controllers (such as component 955) associated with the corresponding power converter assembly 100 are disposed on or embedded in the substrate 302.

[0116] Note that the substrate 302 can include a corresponding planar metal layer 966-2 to allow heat associated with the substrate 302 and the component 955 (any component associated with the trans-inductor voltage regulator) to flow to the axial end 121-1, through the conductive path 121, and to the corresponding top surface 999 of the assembly 100 for heat dissipation. Heat can also flow in the opposite direction. As previously discussed, the assembly 100 can be configured to include a corresponding heat sink on the top surface of the assembly 100. In addition, the substrate 302 can include a corresponding planar metal layer 966-2 to allow heat associated with the substrate 302 and the component 955 to flow to the axial end E1, through the conductive path 123-1, and to the corresponding top surface 999 of the assembly 100 for heat dissipation.

[0117] Fig. 10A and Fig. 10B is an example cross-sectional view showing an inductive winding associated with a transformer assembly as discussed herein.

[0118] Each of the transformers TR1 , TR2 , etc. and the corresponding conductive paths in assembly 100 may be configured in any suitable manner.

[0119] exist Fig. 10AIn this example cross-sectional view of transformer TR1 including an instance of conductive path 121 and an instance of conductive path 123-1 (such as a view of conductive path 121 and conductive path 123-1 viewed along axis Y in assembly 100), conductive path 121 is curved, with corresponding recesses filled with magnetically conductive material 111-1; conductive path 123-1 is curved, with corresponding recesses filled with magnetically conductive material 111-1. Magnetic conductive material 111-1 may be configured to have a different magnetic permeability than magnetically conductive material 111. The curved conductive paths are separated by gaps 1098.

[0120] Transformer TR2 can be configured in a similar manner. Fig. 10B In this example cross-sectional view of transformer TR2 including an instance of conductive path 122 and an instance of conductive path 123-2 (such as a view of conductive path 122 and conductive path 123-2 viewed along axis Y in assembly 100), conductive path 122 is curved, with corresponding recesses filled with magnetically conductive material 112-1; conductive path 123-2 is curved, with corresponding recesses filled with magnetically conductive material 112-1. Magnetic conductive material 112-1 may be configured to have a different magnetic permeability than magnetically conductive material 112. The curved conductive paths are separated by gaps 1099.

[0121] Note that the examples as discussed herein can be easily extended to Nph>2 or scaled down to Nph=1.

[0122] Fig.11 is an example diagram showing a power supply circuit for implementing any of the transformer components in a trans-inductor voltage regulator as discussed herein.

[0123] Note that the LTR inductor in the example trans-inductor voltage regulator may be used to limit the di / dt of the output current from each of the power converter phases when a transient occurs with respect to the load 118. The inductor LTR may be a discrete inductor or implemented through a combination of parasitics of the PCB and / or leakage inductance of each phase transformer.

[0124] Furthermore, in this example, each of the power converter phases in power supply 1101 (such as power converter phase 1121, power converter phase 1122, ..., power converter phase 112N) includes a pair of switches (such as a high-side switch circuit system and a low-side switch circuit system) and one or more windings to facilitate generating output voltage 223. Controller 140 generates control signals 105 (such as control signals S11, S12, S21, S22, ..., SN1, and SN2) for regulating the generation of the corresponding output voltage 223 relative to a set point reference voltage Vref.

[0125] For example, the power converter phase 1121 of the power supply 1101 (such as a trans-inductor voltage regulator) includes a transformer 221 (such as TR1 including a combination of the conductive path 121 and the conductive path 123-1), a switch QH1 (such as a high-side switch circuit system) controlled by a signal S11 generated by the controller 140, and a switch QL1 (such as a low-side switch circuit system) controlled by a signal S12 generated by the controller 140. The switch QH1 is connected in series with the switch QL1 at the input voltage V IN 1111 and a ground reference potential. In this example, the drain of switch QH1 receives input voltage 1111; the source of QH1 is connected to the drain of switch QL1 and contributes to generating output voltage 223; the source of QL1 is grounded. Switches QH1 and QL1 and / or controller 140 (such as circuit components) as discussed herein may be disposed on or secured to any suitable substrate, such as substrate 301, substrate 302, insert 810, etc. The switching of the switches and the corresponding current (such as current I_PHASE_1) output from power converter phase 1121 causes heat to be generated, which is transferred along conductive path 121 and conductive path 123-1 to a suitable heat sink or top surface of assembly 100 as previously discussed.

[0126] The power converter phase 1122 of the power supply 1101 includes a transformer 222 (such as a transformer TR2 including a combination of the conductive path 122 and the conductive path 123-2), a switch QH2 (such as a high-side switch circuit system) controlled by a signal S21 generated by the controller 140, and a switch QL2 (such as a low-side switch circuit system) controlled by a signal S22 generated by the controller 140. The switch QH2 is connected in series between the input voltage 1111 and the ground reference potential. The drain of the switch QH2 receives the input voltage 1111; the source of QH2 is connected to the drain of the switch QL2 and helps to generate the output voltage 223; the source of QL2 is grounded. The switches QH2 and QL2 and / or the controller 140 (such as circuit components) as discussed herein can be disposed on or fixed to any suitable substrate, such as the substrate 301, the substrate 302, the insert 810, etc. The switching of the switches and the corresponding current output from power converter phase 1122 , such as current I_PHASE_2 , causes heat to be generated, which is transferred along conductive path 122 and conductive path 123 - 2 to a suitable heat sink as previously discussed.

[0127] Power converter phase 112N (the nth phase of power source 1101 such as a trans-inductive voltage regulator) includes transformer 22N (such as a combination of conductive path 22N-2 and conductive path 22N-1), switch QHN (such as a high-side switch circuit system) controlled by signal SN1 generated by controller 140, and switch QLN (such as a low-side switch circuit system) controlled by signal SN2 generated by controller 140. Switch QHN is connected in series between input voltage 1111 and a ground reference potential. The drain of switch QHN receives input voltage 1111; the source of QHN is connected to the drain of switch QN1 and helps to generate output voltage 223; the source of QN1 is grounded. Switches QHN and QLN and / or controller 140 (such as circuit components) as discussed herein can be disposed on or fixed to any suitable substrate, such as substrate 301, substrate 302, insert 810, etc. The switching of the switches and the corresponding current output from power converter phase 112N, such as current I_PHASE_N, causes heat to be generated, which is transferred along conductive path 22N- 1 and conductive path 22N- 2 to a suitable heat sink as previously discussed.

[0128] In one example, as in a buck converter or other suitable technology, the controller 140 generates the control signal 105 based on the magnitude of the output voltage 223 relative to the desired set point voltage. Typically, as in a buck converter topology, activation of the corresponding high-side switch circuitry in the corresponding power converter phase increases the magnitude of the output voltage 223; activation of the low-side switch circuitry causes a decrease in current from the energy stored in the inductor to the load.

[0129] In one example, windings 123-1, 123-2, ..., 22N-1 are first windings of a plurality of power converter phases connected in series in a series circuit path 160 as discussed herein. Each of the plurality of power converter phases 1121, 1122, 112N includes a first winding (such as a primary winding) and a second winding (such as a secondary winding). In such an example, each of the second windings 121, 122, ..., 22N-2 of the plurality of power converter phases generates a corresponding phase output current (or voltage) based on a control signal from the controller 140 that contributes to generating an output voltage 223 for powering the load 118.

[0130] For example, the conductive path 121 generates / outputs a current I_PHASE_1; the conductive path 122 generates / outputs a current I_PHASE_2; ...; the conductive path 22N-2 generates / outputs a current I_PHASE_N.

[0131] In one example, the low-side switch circuitry in the corresponding phase is activated when the corresponding high-side switch circuitry is deactivated. The high-side switch circuitry and the low-side switch circuitry are not activated at the same time. There is a dead time between activating the high-side switch circuitry and activating the low-side switch circuitry.

[0132] In this example, power converter phase 1121 represents PHASE_1 that supplies current to load 118 ; power converter phase 1122 represents PHASE_2 that supplies current to load 118 ; . . . ; power converter phase 112N represents PHASE_N that supplies current to load 118 .

[0133] Thus, a series circuit path 160 associated with a power source 1101 (such as a trans-inductor voltage regulator) can be configured to include a series circuit path 160 that includes a plurality of conductive paths (123-1, 123-2, etc.), each of which is implemented as a trans-inductor voltage regulator winding. A first switch circuit system in a power converter phase 1121, such as QH1 and QL1 coupled to a second axial end 121-2 of the first conductive path 121, controls the magnitude of a first current I_PHASE_1 that reaches a load 118 through the first conductive path 121. The node coupling the conductive path 121, the switch QH1, and the switch QL1 is a node VSW1.

[0134] The second switch circuitry in power converter phase 1122, such as QH2 and QL2 coupled to the second axial end 122-2 of the second conductive path 122, controls the magnitude of the second current I_PHASE_2 through the second conductive path 122 to the load 118. The node coupling the conductive path 122, switch QH2, and switch QL2 is node VSW2, and so on.

[0135] Accordingly, the first axial end 121 - 1 of the first conductive path 121 is directly connected to the first axial end 122 - 1 of the second conductive path 122 to generate the output voltage 223 .

[0136] As previously discussed, any of the circuit components such as switches QH1, QL1, QH2, QL2, ..., controller 140 can be configured to be directly coupled to one or more surfaces of any of the circuit boards or substrates discussed herein or embedded in any of the circuit boards or substrates.

[0137] Fig.12 are example diagrams showing different views of a transformer assembly as discussed herein.

[0138] In this example, the bottom PCB (such as substrate 1220) acts as an interface to the customer's motherboard and houses the VIN, VOUT, and GND nets as well as the power stage I / O signals and TLVR I / O nets.

[0139] A top PCB such as substrate 1210 carries the power stages and corresponding components associated with power supply 1101 , including its associated auxiliary capacitors / resistors and some input capacitors.

[0140] A vertical substrate 1230 , such as a PCB, is implemented to route signals and voltages such as power stage I / O signals, input power VIN, TLVR net, and optionally an analog ground net (AGND) from the bottom substrate 1220 to the top substrate 1210 .

[0141] Note that the PGND circuit path can be a solid piece of metal material capable of carrying high current. Assuming that the current flowing into or through the PGND path is mainly controlled by the DC component, the PGND circuit path helps to reduce conduction losses, improve efficiency and thus partially alleviate the typical shortcomings of power stage cooling modules. Optionally, the VIN input power path can be implemented in a similar manner (such as extending from substrate 1210 to substrate 1220) through an external copper block.

[0142] However, in some cases it may be desirable to include a PGND power path in the vertical substrate 1230. Employing inductive components (conductive paths) as discussed herein makes the module highly scalable: it would be sufficient to change the core height to meet the height and / or inductive requirements of a new module.

[0143] The proposed TLVR (trans-inductor voltage regulator) wiring depicted herein, such as through conductive path 123-1, substrate 1210, and substrate 1230, supports current 1201. The input pad can be configured to be located on the bottom substrate 1220 and can be connected to a straight single-turn TLVR winding such as conductive path 123-1, thereby transmitting current 1201 upward to the top substrate 1210.

[0144] In order to properly route such current 1201 to a conductive path (such as an adjacent TLVR winding), the TLVR net is first routed into the top substrate 1210, and then to the vertical substrate 1230, through which the TLVR current 1201 can flow down again to the bottom PCB (substrate 1220), and finally feed the TLVR winding of the adjacent phase in a manner as previously discussed. The phase winding (such as conductive path 121) can provide a minimal power distribution network (PDN), thereby reducing conduction losses and improving efficiency.

[0145] It can be noted that, considering its electrical task, the TLVR windings, such as the conductive paths 123-1, 123-2, etc., can be strong noise sources due to their fast changing AC currents through the corresponding series circuit paths 160. This aspect shows another fundamental benefit of the proposed structure: the TLVR connection or TLVR mesh is completely enclosed in the magnetic core (magnetic conductive materials 111 and 112) and the three PCBs (substrates 1210, 1220 and 1230); therefore, the wirelessly generated noise has no outlet to the external environment with respect to the assembly 100 (including the gate driver IC of the power stage). This makes the solution advantageously suitable for noise-sensitive applications.

[0146] In the event that it is desired to simplify the layout of the top substrate 1210 and / or the vertical substrate 1230, it is noted that this can be accomplished by Fig.13 The external copper clip shown routes the cross-inductor voltage regulator clip towards the bottom substrate 1220.

[0147] Fig.13 are example diagrams showing different views of a transformer assembly as discussed herein.

[0148] In this example, the TLVR winding is routed to the vertical substrate (PCB) through external clips (such as conductive paths 1321 and 1322) rather than through the top substrate 1210 (PCB), which can have a simpler layout than the layout discussed previously. In this way, the TLVR winding is not connected on the power stage substrate 1220, which has the benefit of preventing the risk of noise injection toward the driver IC inside the power stage.

[0149] Thus, in this example, a portion of the magnetically conductive material 111 is disposed between the conductive path 1321 and the substrate 1220. A portion of the magnetically conductive material 112 is disposed between the conductive path 1322 and the substrate 1220. The heat sink 1345 coupled to the substrate 1210 can be configured to provide electromagnetic shielding for noise emitted across the inductive voltage regulator winding or return path such as the conductive path 1321 and the conductive path 1322.

[0150] Fig.14 are example diagrams showing different views of a transformer assembly as discussed herein.

[0151] In this example, the TLVR routing to the bottom substrate 1220 is accomplished entirely through corresponding external clips (such as conductive paths 1421 and 1422), without the need for dedicated meshes inside the top substrate 1210 and the vertical substrate 1230. However, in these examples, the TLVR windings are also well shielded from the external environment by the substrate and the magnetic core (such as magnetically permeable material 111 and magnetically permeable material 112).

[0152] To simplify the module assembly 100 and manufacture it in high volume production, the collection of the inductor, vertical PCB and GND copper block can be as follows Fig.15 Depicted is overmolded into a single pick and place component such as assembly 1510. In such a case, portions (vertical portions) of conductive paths 1431 and 1432 reside between the first and second magnetically conductive materials.

[0153] Fig.15 is an example diagram illustrating an overmolded transformer assembly as discussed herein.

[0154] As shown, the assembly 100 or portions thereof may be implemented in an overmolded assembly 1510. The overmolded assembly 1510 includes a first circuit board such as a substrate 1230, a PGND conductive path, a first magnetic conductive material 111, a second magnetic conductive material 112, a first conductive path 121, a conductive path 123-1, a second conductive path 122, and a conductive path 123-2. The overmolded assembly 1510 may be configured to reside between a circuit board such as the substrate 1210 and a circuit board such as the substrate 1220. The circuit board 1230 in the overmolded assembly 1510 provides a connection between the substrate 1210 (circuit board) and the substrate 1220 (circuit board). The overmolded assembly 1510 may be configured to include a first magnetic conductive material 111 and a second magnetic conductive material 112 residing between the substrate 1210 and the substrate 1220.

[0155] Fig.16 are example diagrams showing different views of a transformer assembly as discussed herein.

[0156] As previously discussed, each of the different implementations discussed herein may be configured to include a component 1611 in a power stage (where the component 1611 includes components such as Fig.11 and switches, controllers, etc. in other figures), which are directly embedded in the top substrate 1210 or on one or more surfaces of the top substrate 1210, such as Fig.16 shown.

[0157] In this example, the axial end E2 of the conductive path 123-1 is directly coupled to the conductive path 1421; the axial end E4 of the conductive path 123-2 is directly coupled to the conductive path 1422. The combination of the conductive paths 1421 and 1431 provides a path from the top of the conductive path 123-1 to the substrate 1220; the combination of the conductive paths 1422 and 1432 provides a path from the top of the conductive path 123-2 to the substrate 1220.

[0158] Fig.17A , Fig. 17B and Fig. 17Care example diagrams showing different views of providing a series connection through multiple windings of multiple transformers as discussed herein.

[0159] In this example, the TLVR winding is implemented using copper wire with multiple bends for ease of manufacturing.

[0160] The TLVR winding is shielded by the VOUT clamp for low noise radiation.

[0161] The TLVR windings are galvanically isolated.

[0162] Only the regulated VOUT clip is exposed to the customer's heat sink.

[0163] Floating disk heat dissipation can be achieved by stabilizing the potential VOUT clamp.

[0164] There is no need to reroute the TLVR net connections into the PCB to achieve the lowest noise injection towards the power stage I / Os.

[0165] The TLVR winding can optionally be completed with Litz wire to reduce the ACR.

[0166] Fig.18A is an example diagram of multiple individual components mounted on respective host substrates as discussed herein.

[0167] In this example, assembly 1801-1 and assembly 1801-2 are identical. Assembly 1801-1 includes a single phase, such as first conductive path 121, disposed in parallel with second conductive path 122 in a respective magnetically permeable material in a manner as previously discussed. A customer may purchase any number of instances of these individual assemblies 1801-1, 1801-2, etc., and mount them on respective main substrates 303 as shown. Conductive path 1820 provides a circuit path connection of respective conductive paths 123-1 and 123-2 (such as across an inductive voltage regulator path) in a series manner.

[0168] Fig.18B are illustrative diagrams of multiple instances of subassemblies forming a single multi-phase assembly mounted on respective primary substrates as discussed herein.

[0169] In this example, assembly 1803 includes: assembly 1801-1, assembly 1801-2, and assembly 1801-3, each of which is identical. Assembly 1801-1 includes a single phase, such as first conductive path 121, arranged in parallel with second conductive path 122 in a corresponding magnetically conductive material in a manner as previously discussed. In this example, a customer purchases a single assembly 1803, including any number of instances of these individual assemblies 1801-1, 1801-2, etc. on the substrate 302 of assembly 1803. As previously discussed, conductive paths 123-1, 123-2, 123-3, etc. provide a series connection of TLVR windings (conductive paths) through assembly 1803. The customer mounts assembly 1803 on a corresponding main substrate 303 as shown. Conductive paths 1821, 1822, etc. provide circuit path connections of the respective conductive paths 123-1 and 123-2 in series (such as across an inductive voltage regulator path) among components 1801-1, 1801-2, etc. Circuit paths 1821, 1822, etc. may reside in or on substrate 302 and / or reside in or on substrate 303.

[0170] Again, note that the techniques herein are well suited for use in circuit assembly applications such as providing power delivery to one or more loads. However, it should be noted that the disclosure of the subject matter herein is not limited to use in such applications, and the techniques discussed herein are also well suited for other applications.

[0171] Although the present invention has been specifically shown and described with reference to the preferred aspects of the present invention, it will be appreciated by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present application as defined by the appended claims. Such variations are intended to be covered by the scope of the present application. Therefore, the foregoing description of the present disclosure is not intended to be restrictive. Rather, any limitations to the present invention are set forth in the appended claims.

Claims

1. A device for a converter, comprising: a first conductive path extending through the first magnetically conductive material; as well as A second conductive path extends through the first magnetic conductive material, wherein the first conductive path and the second conductive path are arranged side by side and pass through the first magnetic conductive material in parallel.

2. The apparatus according to claim 1, further comprising: A component, the component comprising: the first conductive path; the second conductive path; a first substrate; wherein a first axial end of the first conductive path is directly coupled to a first node of the first substrate, and the first conductive path provides a first heat dissipation path between a second axial end of the first conductive path and the first node; wherein a first axial end of the second conductive path is directly coupled to a second node of the first substrate, and the second conductive path provides a second heat dissipation path between a second axial end of the second conductive path and the second node; wherein an axial length of the first conductive path extends substantially orthogonally to a planar surface of the first substrate; and The axial length of the second conductive path extends substantially perpendicular to the planar surface of the first substrate.

3. The apparatus according to claim 2, further comprising: Electronic circuitry is embedded in the first substrate, the electronic circuitry controlling the delivery of electrical current through the first conductive path.

4. The apparatus according to claim 2, further comprising: Electronic circuitry is secured to the first substrate, the electronic circuitry controlling the delivery of electrical current through the first conductive path.

5. The device according to claim 2, wherein: The components also include: a third conductive path extending through the second magnetically conductive material; a fourth conductive path extending through the second magnetic conductive material, the third conductive path and the fourth conductive path being arranged side by side and passing through the second magnetic conductive material in parallel; wherein a first axial end of the third conductive path is directly coupled to a third node of the first substrate, and the third conductive path provides a third heat dissipation path between a second axial end of the third conductive path and the third node; wherein the first axial end of the fourth conductive path is directly coupled to a fourth node of the first substrate, and the fourth conductive path provides a fourth heat dissipation path between the second axial end of the fourth conductive path and the fourth node; wherein an axial length of the third conductive path extends substantially orthogonally to a planar surface of the first substrate; and The axial length of the fourth conductive path extends substantially perpendicular to the planar surface of the first substrate.

6. The apparatus according to claim 5, further comprising: A conductive element connected between the second node and the fourth node is provided, the conductive element connecting the second conductive path and the fourth conductive path in series.

7. The device according to claim 6, wherein: The conductive element is fixed to the first substrate.

8. The apparatus according to claim 1, further comprising: A first component, the first component comprising: a first substrate; the first conductive path; the second conductive path; wherein a first axial end of the first conductive path is directly coupled to a first node of the first substrate, and the first conductive path provides a first heat dissipation path between a second axial end of the first conductive path and the first node; wherein a first axial end of the second conductive path is directly coupled to a second node of the first substrate, and the second conductive path provides a second heat dissipation path between a second axial end of the second conductive path and the second node; wherein an axial length of the first conductive path extends substantially orthogonally to a planar surface of the first substrate; and wherein an axial length of the second conductive path extends substantially orthogonally to a planar surface of the first substrate; A second component, the second component comprising: a second substrate; a third conductive path extending through the second magnetically conductive material; a fourth conductive path extending through the second magnetic conductive material, the third conductive path and the fourth conductive path being arranged side by side and passing through the second magnetic conductive material in parallel; wherein a first axial end of the third conductive path is directly coupled to a first node of the second substrate, and the third conductive path provides a third heat dissipation path between a second axial end of the third conductive path and the first node of the second substrate; wherein a first axial end of the fourth conductive path is directly coupled to a second node of the second substrate, and the fourth conductive path provides a fourth heat dissipation path between a second axial end of the fourth conductive path and the second node of the second substrate; wherein an axial length of the third conductive path extends substantially orthogonally to a planar surface of the second substrate; and Wherein, an axial length of the fourth conductive path extends substantially perpendicular to the planar surface of the second substrate.

9. The apparatus according to claim 8, further comprising: a third substrate; and Wherein, the first substrate and the second substrate are fixed to the third substrate.

10. The apparatus according to claim 9, further comprising: a conductive element providing a series connection of the second conductive path and the fourth conductive path; and Wherein, the conductive element is fixed to the third substrate.

11. The apparatus according to claim 1, further comprising: a third conductive path; a fourth conductive path, a combination of the third conductive path and the fourth conductive path extending through the second magnetic conductive material, the third conductive path and the fourth conductive path being arranged side by side and in parallel in the second magnetic conductive material; as well as A circuit path connects the second conductive path and the fourth conductive path in series.

12. The device according to claim 11, wherein The combination of the first conductive path and the second conductive path is a first transformer, wherein the first conductive path is inductively coupled to the second conductive path; and Wherein a combination of the third conductive path and the fourth conductive path is a second transformer, wherein the third conductive path is inductively coupled to the fourth conductive path.

13. The device according to claim 12, wherein: The first magnetically conductive material is not present in a first volume between the first conductive path and the second conductive path; and Wherein, the second magnetic conductive material does not exist in the second volume between the third conductive path and the fourth conductive path.

14. The apparatus according to claim 11, further comprising: first switch circuitry coupled to a first axial end of the first conductive path, the first switch circuitry being operable to control a magnitude of a first current passing through the first conductive path; as well as A second switch circuit system is coupled to the first axial end of the third conductive path, the second switch circuit system being operable to control a magnitude of a second current passing through the third conductive path.

15. The device according to claim 14, wherein: Control of the first switch circuitry is operable to produce a first output current output from a second axial end of the first conductive path; and The control of the second switch circuit system can be operated to generate a second output current output from a second axial end of the third conductive path.

16. The device according to claim 15, wherein: The second axial end of the first conductive path is directly connected to the second axial end of the third conductive path to jointly generate an output voltage.

17. The device according to claim 11, wherein: The circuit path including the second conductive path and the fourth conductive path in series is configured to carry only alternating current.

18. The device according to claim 17, wherein: The first axial end of the circuit path and the second axial end of the circuit path are both directly coupled to a reference voltage.

19. The apparatus according to claim 11, further comprising: substrate; A first axial end of the first conductive path is directly coupled to a first node of the substrate, and the first conductive path provides a first heat dissipation path between a second axial end of the first conductive path and the first node; and A first axial end of the third conductive path is directly coupled to a second node of the substrate, and the third conductive path provides a second heat dissipation path between a second axial end of the third conductive path and the second node.

20. The device according to claim 19, wherein An axial length of the first conductive path extends substantially normal to the planar surface of the substrate; and Wherein, the axial length of the third conductive path extends substantially perpendicular to the planar surface of the substrate.

21. The apparatus according to claim 19, further comprising: a first conductor element extending between a second axial end of the first conductive path and a third node of the substrate, the first conductor element being operable to transmit a first output current from the second axial end of the first conductive path to the substrate; as well as A second conductor element extends between the second axial end of the third conductive path and a fourth node of the substrate, the second conductor element being operable to transmit a second output current from the second axial end of the third conductive path to the substrate.

22. The device according to claim 21, wherein The second conductive path and the fourth conductive path are disposed in a series circuit path across an inductive voltage regulator.

23. The apparatus according to claim 11, further comprising: a metal layer coupled to the second axial end of the first conductive path and the second axial end of the third conductive path; and Part of the first magnetic conductive material and part of the second magnetic conductive material are disposed between the metal layer and the substrate, and the substrate is coupled to a first axial end of the first conductive path and a first axial end of the third conductive path.

24. The device according to claim 23, wherein: the metal layer being operable to electromagnetically shield noise emitted by a first return conductive path extending from an axial end of the second conductive path to the substrate; and The metal layer is operable to electromagnetically shield noise emitted by a second return conductive path extending from an axial end of the fourth conductive path to the substrate.

25. The apparatus of claim 11, further comprising: A metal shielding layer encapsulates a portion of the second conductive path, wherein the portion of the second conductive path is not disposed in either the first magnetically conductive material or the second magnetically conductive material.

26. The apparatus of claim 21, further comprising: An interposer operable to provide connection of the second conductive path to the fourth conductive path is disposed between a main substrate and a combination of the first and second magnetically conductive materials.

27. The device according to claim 21, wherein The first magnetically conductive material, the second magnetically conductive material, the first conductive path, the second conductive path, the third conductive path, and the fourth conductive path are disposed in an overmolded assembly.

28. The apparatus of claim 21, further comprising: an overmolded assembly comprising a first circuit board, the first magnetically conductive material, the second magnetically conductive material, the first conductive path, the second conductive path, the third conductive path, and the fourth conductive path; and The overmold assembly is operable to reside between a second circuit board and a third circuit board, and the first circuit board is operable to provide a connection between the second circuit board and the third circuit board.

29. The device according to claim 11, wherein The assembly including the first magnetic conductive material and the second magnetic conductive material is operable to reside between a first circuit board and a second circuit board, the apparatus further comprising: A conductive element is disposed between the assembly and the second circuit board, the conductive element providing a series connection of the second conductive path and the fourth conductive path.

30. The device according to claim 11, wherein A conductive element is disposed between the first magnetic conductive material and the second magnetic conductive material. The conductive element is a return path from an axial end of the second conductive path to the substrate.

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