Solid laser circulating cooling heat dissipation system

Abstract

The application belongs to the technical field of solid-state lasers, and discloses a circulating cooling heat dissipation system for a solid-state laser, which comprises a shell, a heat-conducting plate and a top plate fixed in the shell, and a heat dissipation inner cavity formed between the heat-conducting plate and the top plate; a reflux cavity is formed in the heat-conducting plate, a refrigerating plate and an internal circulation fan are fixed on the top of the heat-conducting plate, and the refrigerating plate is used for mounting heat generating elements of the solid-state laser; a water cooling groove and a plurality of air cooling holes are formed in the refrigerating plate; the water cooling groove is in a serpentine extension shape, and the sidewalls at both ends of the water cooling groove are provided with openings; a water cooling pipeline is embedded in the water cooling groove, and a water cooling module connected with the water cooling pipeline is fixed outside the shell; the plurality of air cooling holes comprise air inlet holes and air outlet holes, and the heat dissipation inner cavity, the air inlet holes, the air outlet holes and the reflux cavity are sequentially communicated; the air inlet holes are air cooling holes not completely covered by the heat generating elements, and the air outlet holes are air cooling holes completely covered by the heat generating elements.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of solid-state lasers, and particularly relates to a circulating cooling and heat dissipation system of a solid-state laser. BACKGROUND

[0002] The solid-state laser has the characteristics of large output energy and high peak power, and is widely applied in the fields of industrial manufacturing, national defense, high-energy physics research and the like. With the progress of laser technology, high-power strong laser technology has become an important direction of the development of the solid-state laser. However, a large amount of heat is generated in the working process of the solid-state laser, which easily leads to the birefringence phenomenon of the gain medium. Therefore, the heat elements inside the laser need to be cooled and dissipated.

[0003] The existing solid-state laser usually adopts the water cooling and heat dissipation mode for temperature reduction. The water cooling pipeline is in contact with the heat elements. Therefore, when the cooling water passes through the water cooling pipeline, the heat is taken away through the heat exchange and the flow of the water flow. However, when the cooling water with low temperature passes through the water cooling pipeline, the temperature of the surface of the water cooling pipeline rapidly decreases. At this time, the moisture in the air near the water cooling pipeline will condense on the surface of the water cooling pipeline, thereby causing the problems of moisture and damage of the heat elements. SUMMARY

[0004] In view of this, in order to solve the problems in the background art, the purpose of the present application is to provide a circulating cooling and heat dissipation system of a solid-state laser.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme.

[0006] A circulating cooling and heat dissipation system of a solid-state laser comprises a shell, a heat conduction plate and a top plate fixed in the shell, and a heat dissipation inner cavity is formed between the heat conduction plate and the top plate.

[0007] A reflux cavity is formed in the heat conduction plate. A refrigeration plate and an internal circulation fan are fixed on the top of the heat conduction plate. The refrigeration plate is used for mounting the heat elements of the solid-state laser.

[0008] A water cooling groove and a plurality of air cooling holes are formed in the refrigeration plate.

[0009] The water cooling groove is in a serpentine extension shape. The side walls at both ends of the length direction of the water cooling groove are provided with openings. A water cooling pipeline is embedded in the water cooling groove. A water cooling module connected with the water cooling pipeline is fixed on the outside of the shell.

[0010] The plurality of air cooling holes comprise air inlet holes and air outlet holes. The heat dissipation inner cavity, the air inlet holes, the air outlet holes and the reflux cavity are sequentially communicated. The air inlet holes are the air cooling holes not completely covered by the heat elements. The air outlet holes are the air cooling holes completely covered by the heat elements.

[0011] Preferably, each of the air cooling holes comprises an end hole, a central hole coaxially arranged with the end hole and a guide hole communicated with the central hole and located outside the central hole.

[0012] Preferably, a threaded hole is connected between the central hole and the return flow cavity, and a movable valve is arranged in the threaded hole; an annular guide cavity coaxially matched with the outside of the threaded hole is arranged in the refrigeration plate, the annular guide cavity is communicated with the corresponding guide hole, and through holes are further connected between the annular guide cavities.

[0013] Preferably, the diameter of the threaded hole is larger than that of the central hole, and a sealing step is formed at the connection between the threaded hole and the central hole; the movable valve comprises a threaded valve body screw-connected in the threaded hole, and a valve hole capable of being sealed by the sealing step is arranged on the threaded valve body.

[0014] Preferably, a top rod capable of penetrating through the central hole is fixed at the center of the top of the threaded valve body, and the diameter of the top rod is smaller than that of the central hole.

[0015] Preferably, a sliding sleeve is sleeved on the outside of the top rod, the diameter of the sliding sleeve is smaller than that of the central hole, and a spring is connected between the top of the top rod and the sliding sleeve.

[0016] Preferably, the solid laser circulating cooling heat dissipation system further comprises a bottom plate fixed in the inside of the shell, a heat dissipation outer cavity is formed between the heat conduction plate and the bottom plate, and an outer circulating fan is fixed on the bottom plate.

[0017] Preferably, a heat dissipation plate is further fixed on the bottom plate, a heat dissipation groove is arranged on the heat dissipation plate, the heat dissipation groove extends in a serpentine shape, the side walls at both ends of the heat dissipation groove are open, a heat dissipation pipeline is embedded in the heat dissipation groove, and the heat dissipation pipeline is connected with the water cooling module.

[0018] Preferably, a plurality of heat dissipation fins are fixed between the heat dissipation plate and the heat conduction plate, and a heat dissipation channel communicated with the outer circulating fan is formed between adjacent heat dissipation fins.

[0019] Preferably, the water cooling module comprises a first water pump, a cold water tank, a second water pump and a semiconductor refrigeration sheet, the first water pump is used to connect one end of the water cooling pipeline and the heat dissipation pipeline, the second water pump and the cold water tank are respectively connected with the other end of the water cooling pipeline and the heat dissipation pipeline, a flow guide pipe is connected between the second water pump and the cold water tank, and the cold end of the semiconductor refrigeration sheet extends into the cold water tank.

[0020] Compared with the prior art, the application has the following beneficial effects:

[0021] (1) The present application utilizes the water-cooled pipeline and multiple air-cooled holes to cooperate in heat dissipation, so as to effectively improve the heat dissipation efficiency of the solid laser, and utilizes the air-cooled hole and the backflow cavity to realize the internal circulation flow of the dry air in the heat dissipation inner cavity, so as to effectively avoid the moisture outside the shell into the heat dissipation inner cavity, and then avoid the water condensation phenomenon on the surface of the heating element during heat dissipation cooling.

[0022] (2) The movable valve is arranged in the air-cooled hole, and the flow path of the dry air in the air-cooled hole is changed by the movable valve and the installation of the heating element, so as to form the state that the air flow flows into the air-cooled hole through the surface of the heating element and flows out of the air-cooled hole through the bottom of the heating element, so as to effectively automatically adjust the air-cooled path according to the installation position of the heating element.

[0023] (3) The movable valve comprises a threaded valve body and a top rod, and a sliding sleeve capable of elastically lifting is further connected to the top of the top rod, so as to ensure that the movable valve is in contact with the bottom of the heating element, and the interference of the top rod on the installation of the heating element is avoided.

[0024] (4) The both sides of the heat-conducting plate are respectively arranged as a heat dissipation inner cavity and a heat dissipation outer cavity, and the outer circulation heat dissipation is realized by utilizing the external air flow in the heat dissipation outer cavity, so as to further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is the exploded view of the present application;

[0026] Figure 2 is the sectional view of the assembly of the heat-conducting plate and the refrigeration plate in the present application;

[0027] Figure 3 is the enlarged view of A in Figure 2 ;

[0028] Figure 4 is the enlarged view of B in Figure 2 ;

[0029] Figure 5 is the exploded view of the movable valve in the present application;

[0030] Figure 6 is the sectional view of the assembly of the heat-conducting plate and the bottom plate in the present application;

[0031] In the figure: shell-1; heat-conducting plate-2; refrigeration plate-21; water cooling tank-211; air cooling hole-212; end hole-213; center hole-214; guide hole-215; threaded hole-216; threaded valve body-2161; valve hole-2162; top rod-2163; sliding sleeve-2164; spring-2165; annular guide cavity-217; internal circulation fan-22; top plate-3; bottom plate-4; external circulation fan-41; heat dissipation plate-42; heat dissipation fin-43; first water pump-5; cold water tank-6; second water pump-7; semiconductor refrigeration sheet-8. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0033] As shown in Figure 1 The solid laser circulating cooling heat dissipation system provided by the present application specifically comprises a shell 1 and a top plate 3, a heat-conducting plate 2 and a bottom plate 4 fixed in the shell 1 from top to bottom. The heat-conducting plate 2 and the top plate 3 form a heat dissipation inner cavity, and the heat-conducting plate 2 and the bottom plate 4 form a heat dissipation outer cavity. In addition, a water cooling module is also fixed outside the shell 1.

[0034] Water cooling:

[0035] Continuing to refer to Figure 1 and Figure 2 , the heat-conducting plate 2 is fixed with a refrigeration plate 21 at the top, the refrigeration plate 21 is used for mounting the heat generating elements of the solid laser, and the water cooling tank 211 is provided on the refrigeration plate 21; the water cooling tank 211 is in a serpentine extension shape, and the side walls at both ends of the length direction of the water cooling tank 211 are provided with openings, and a water cooling pipeline is embedded in the water cooling tank 211;

[0036] Continuing to refer to Figure 1 and Figure 6 , the bottom plate 4 is fixed with a heat dissipation plate 42, the heat dissipation plate 42 is provided with a heat dissipation groove, the heat dissipation groove is in a serpentine extension shape, and the side walls at both ends of the length direction of the heat dissipation groove are provided with openings, and a heat dissipation pipeline is embedded in the heat dissipation groove;

[0037] Continuing to refer to Figure 1As shown, the water cooling module comprises a first water pump 5, a cold water tank 6, a second water pump 7 and a semiconductor refrigeration sheet 8, the first water pump 5 is used to connect one end of the water cooling pipeline and the heat dissipation pipeline, the second water pump 7 and the cold water tank 6 are respectively connected to the other end of the water cooling pipeline and the heat dissipation pipeline, and a flow guide pipe is connected between the second water pump 7 and the cold water tank 6, and the cold end of the semiconductor refrigeration sheet 6 extends into the cold water tank 6.

[0038] As shown above, the semiconductor refrigeration sheet 8 is used for refrigeration to reduce the water temperature in the cold water tank 6; the second water pump 7 is used to transport the cooling water in the cold water tank 6 into the water cooling pipeline, so as to reduce the temperature of the overall refrigeration plate 21 and cool and dissipate heat of the heat generating element installed on the refrigeration plate 21; the first water pump 5 is used to transport the water with increased temperature after heat exchange into the heat dissipation pipeline, the heat dissipation pipeline preliminarily dissipates heat in the heat dissipation outer cavity, and then flows back to the cold water tank 6 for cooling. The cooling water circulates in the above path to realize water cooling and temperature reduction of the heat generating element of the solid-state laser.

[0039] In addition, a plurality of heat dissipation fins 43 are fixed between the heat dissipation plate 42 and the heat conduction plate 2, and a heat dissipation channel in communication with the outer circulating fan 41 is formed between adjacent heat dissipation fins 43, so as to improve the heat dissipation efficiency of the heat dissipation pipeline.

[0040] Internal circulation air cooling:

[0041] Continuing to refer to Figure 1 and Figure 2 As shown, the heat conduction plate 2 is internally provided with a backflow cavity, and the top of the heat conduction plate 2 is fixed with an internal circulation air fan 22 (symmetrically arranged on both sides of the refrigeration plate 21, one side is an air outlet fan, and the other side is an air inlet fan).

[0042] Continuing to refer to Figure 1 and Figure 2 As shown, the refrigeration plate 21 is used for installing the heat generating element of the solid-state laser, and a plurality of air cooling holes 212 (staggered with the water cooling groove 211) are formed in the refrigeration plate 21.

[0043] Continuing to refer to Figure 2 and Figure 3 As shown, each air cooling hole 212 comprises an end hole 213, a central hole 214 and a guide hole 215 communicated through the end hole 213, the central hole 214 is coaxially arranged with the end hole 213, and a plurality of guide holes 215 are arranged outside the central hole 214.

[0044] Continuing to refer to Figure 2 and Figure 3As shown, each of the central holes 214 is connected with a threaded hole 216 between the backflow cavity, and a movable valve is arranged in the threaded hole 216; the refrigeration plate 21 is provided with annular guide cavities 217 coaxially matched outside the threaded holes 216, the annular guide cavities 217 are communicated with the corresponding guide holes 215, and through holes are further connected between the annular guide cavities 217.

[0045] With reference to Figure 2 and Figure 3 shown, the diameter of the threaded hole 216 is greater than that of the central hole 214, and a sealing step is formed at the connection between the threaded hole 216 and the central hole 214; the movable valve comprises a threaded valve body 2161 screw-connected in the threaded hole 216, and a valve hole 2162 capable of being sealed by the sealing step is arranged on the threaded valve body 2161.

[0046] In combination with Figure 2 , Figure 3 and Figure 4 , it can be known that:

[0047] When the heat generating element of the solid laser is installed on the refrigeration plate 21 (which can be installed by welding), the movable valve in the installation area is unlocked according to the installation position, and the specific unlocking manner is: rotating the threaded valve body 2161 so that the threaded valve body 2161 moves downward along the axis, that is, the top end of the threaded valve body 2161 is away from the sealing step, so that the valve hole 2162 can be communicated with the threaded hole 216, while the movable valves outside the installation area remain Figure 3 in the locked state shown;

[0048] After the installation of the heat generating element is completed, in combination with Figure 2 , Figure 3 and Figure 4 , it can be known that the end holes 213 in the air cooling holes 212 at a place not covered by the heat generating element and at a place partially covered by the heat generating element are both open, and thus both serve as air inlet holes. The end holes 213 in the air cooling holes 212 at a place completely covered by the heat generating element are all closed, and thus all serve as air outlet holes. After the internal circulation fan 22 is started, the dry air in the heat dissipation internal cavity flows to the heat generating element according to Figure 3 c in the above figure and Figure 4The air flow enters the end hole 213 and the guide hole 215 of the air cooling hole 212 (the air flow flows through the surface of the heating element) at the dotted arrow shown at a, then flows through the annular guide cavity 217 to the through hole at b, the air flow flows back to the end hole 213 through the guide hole 215 at b (and contacts the bottom of the heating element), then enters the valve hole 2162 through the center hole 214 and the threaded hole 216 at b, and finally flows into the backflow cavity through the valve hole 2162 and the threaded hole 216. After the air flow enters the backflow cavity, it is sent back to the heat dissipation inner cavity by the circulating fan 22, thereby realizing the internal circulation air cooling in the heat dissipation inner cavity.

[0049] As described above, the air flow of the internal circulation air cooling is dry air, so that after the heating element is cooled by the air flow (and the water cooling described above), the water condensation phenomenon does not occur. After the dry air flow contacts the surface and the bottom of the heating element, the temperature of the air flow is increased, and the air flow after the temperature is increased is mainly cooled in the backflow cavity, that is, the heat dissipation plate 2 is used for cooling. Preferably, a plurality of heat dissipation fins 43 are fixed between the heat dissipation plate 42 and the heat dissipation plate 2, and a heat dissipation channel in communication with the external circulation fan 41 is formed between adjacent heat dissipation fins 43, so as to improve the heat dissipation efficiency of the heat dissipation plate 2.

[0050] In addition, referring to Figure 3 , Figure 4 and Figure 5 , in order to facilitate the unlocking operation of the movable valve, a top rod 2163 capable of penetrating the center hole 214 is fixed at the center of the top of the threaded valve body 2161, and in order to avoid interference of the top rod 2163 with the installation of the heating element, a sliding sleeve 2164 is further sleeved on the outside of the top rod 2163, the diameters of the top rod 2163 and the sliding sleeve 2164 are both smaller than the diameter of the center hole 214, and a spring 2165 is connected between the top of the top rod 2163 and the sliding sleeve 2164. Therefore, in combination with Figure 3 and Figure 4 , it can be seen that:

[0051] At a in Figure 4 , the threaded valve body 2161 is in a locked state, and the spring 2165 is not compressed;

[0052] At b in Figure 4 , the threaded valve body 2161 is in an unlocked state, and the spring 2165 is not compressed;

[0053] At c in Figure 3 , the threaded valve body 2161 is in an unlocked state, and the spring 2165 is compressed.

[0054] External circulation air cooling:

[0055] Continuing to refer to Figure 6As shown, the bottom plate 4 is fixed with a heat dissipation plate 42 and an external circulation fan 41 (symmetrically arranged on both sides of the heat dissipation plate 42, one side is an air outlet fan, and the other side is an air inlet fan). Thus, by starting the external circulation fan 41, external airflow can pass through the heat dissipation outer cavity, thereby realizing air cooling heat dissipation of the heat dissipation outer cavity.

[0056] Further, a plurality of heat dissipation fins 43 are fixed between the heat dissipation plate 42 and the heat conduction plate 2, and a heat dissipation channel communicating with the external circulation fan 41 is formed between adjacent heat dissipation fins 43, thereby improving the air cooling heat dissipation efficiency of the heat dissipation outer cavity.

[0057] Although embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A solid state laser circulating cooling heat sink system, characterized in that: The shell (1) and the heat-conducting plate (2) and the top plate (3) fixed inside the shell (1), and the heat-conducting plate (2) and the top plate (3) form a heat dissipation inner cavity; The heat-conducting plate (2) is internally provided with a reflux cavity, the top of the heat-conducting plate (2) is fixed with a refrigeration plate (21) and an internal circulation fan (22), and the refrigeration plate (21) is used for mounting the heat generating element of the solid-state laser; The refrigeration plate (21) is provided with a water cooling groove (211) and a plurality of air cooling holes (212); The water cooling groove (211) is in a serpentine extension shape, the side walls of the two ends of the water cooling groove (211) are provided with openings, a water cooling pipeline is embedded in the water cooling groove (211), and the shell (1) is externally fixed with a water cooling module connected with the water cooling pipeline. The plurality of air cooling holes (212) include air inlet holes and air outlet holes, and the heat dissipation inner cavity, the air inlet holes, the air outlet holes and the reflux cavity are sequentially communicated, the air inlet holes are the air cooling holes (212) not completely covered by the heat generating element, and the air outlet holes are the air cooling holes (212) completely covered by the heat generating element.

2. The solid state laser circulating cooling heat sink system of claim 1, wherein: Each air cooling hole (212) includes an end hole (213) and a central hole (214) and a guide hole (215) communicated through the end hole (213), the central hole (214) is coaxially arranged with the end hole (213), and the guide hole (215) is located outside the central hole (214).

3. The solid state laser circulating cooling heat sink system of claim 2, wherein: The central hole (214) is connected with a threaded hole (216) between the central hole (214) and the reflux cavity, and a movable valve is arranged in the threaded hole (216); the refrigeration plate (21) is internally provided with an annular guide cavity (217) coaxially matched outside the threaded hole (216), the annular guide cavity (217) is communicated with the corresponding guide hole (215), and a plurality of annular guide cavities (217) are further connected with through holes.

4. The solid state laser circulating cooling heat sink system of claim 3, wherein: The diameter of the threaded hole (216) is greater than that of the central hole (214), and a sealing step is formed at the connection between the threaded hole (216) and the central hole (214); the movable valve includes a threaded valve body (2161) screwed into the threaded hole (216), and the threaded valve body (2161) is provided with a valve hole (2162) capable of being sealed by the sealing step.

5. The solid state laser circulating cooling heat sink system of claim 4, wherein: A top rod (2163) capable of penetrating through the central hole (214) is fixed at the center of the top of the threaded valve body (2161), and the diameter of the top rod (2163) is smaller than that of the central hole (214).

6. The solid state laser circulating cooling heat sink system of claim 5, wherein: A sliding sleeve (2164) is slidably sleeved on the outside of the top rod (2163), the diameter of the sliding sleeve (2164) is smaller than that of the central hole (214), and a spring (2165) is connected between the top of the top rod (2163) and the sliding sleeve (2164).

7. The solid state laser circulating cooling heat sink system of claim 1, wherein: A bottom plate (4) fixed inside the shell (1) is further included, a heat dissipation outer cavity is formed between the heat-conducting plate (2) and the bottom plate (4), and an external circulation fan (41) is fixed on the bottom plate (4).

8. The solid state laser circulating cooling heat sink system of claim 7, wherein: The bottom plate (4) is further provided with a heat dissipation plate (42), the heat dissipation plate (42) is provided with a heat dissipation groove, the heat dissipation groove extends in a serpentine shape, the side walls of the two ends of the heat dissipation groove are open, a heat dissipation pipeline is embedded in the heat dissipation groove, and the heat dissipation pipeline is connected with a water cooling module.

9. The solid state laser circulating cooling heat sink system of claim 8, wherein: A plurality of heat dissipation fins (43) are fixed between the heat dissipation plate (42) and the heat conduction plate (2), and the adjacent heat dissipation fins (43) form a heat dissipation channel in communication with an external circulating fan (41).

10. The solid state laser circulating cooling heat sink system of claim 8, wherein: The water cooling module comprises a first water pump (5), a cold water tank (6), a second water pump (7) and a semiconductor refrigeration sheet (8), the first water pump (5) is used for connecting one end of a water cooling pipeline and a heat dissipation pipeline, the second water pump (7) and the cold water tank (6) are respectively connected with the other end of the water cooling pipeline and the heat dissipation pipeline, a flow guide pipe is connected between the second water pump (7) and the cold water tank (6), and the cold end of the semiconductor refrigeration sheet (8) extends into the cold water tank (6).

Images