Wafer storage container cleaning device

Abstract

The invention provides a wafer storage container cleaning device which can efficiently clean and dry a wafer storage container. The wafer storage container cleaning device is provided with a cleaning tank, and the cleaning tank is provided with a tank which accommodates a main body of a wafer storage container and can be opened and closed through an opening and closing cover of a hinge; a door holding part which is arranged on the opening and closing cover and holds the door of the wafer storage container; a cleaning nozzle for supplying cleaning liquid to the main body and the door; a rotation mechanism that rotates the main body and the door; a circular frame that surrounds the outside of the door and has a height that covers a part of the thickness of the door when the opening / closing cover is in the closed state; and an inclined cover which is provided at a position on the opposite side of the opening / closing cover from the hinge across the circular frame when the opening / closing cover is in the closed state, is inclined so as to be heightened toward the circular frame, and guides the cleaning liquid which is supplied to the door and flies. The end part of the side of the inclined cover provided with the hinge is arranged at a position for guiding the cleaning liquid to the side surface of the circular frame when the opening and closing cover is transferred from the closed state to the open state.

Description

Technical Field

[0001] An embodiment of the present invention relates to a wafer storage container cleaning device. Background Art

[0002] Conventionally, there is a wafer storage container cleaning device that performs various processes such as cleaning and drying on a wafer storage container such as a front opening unified pod (FOUP) or a front opening shipping box (FOSB) that stores semiconductor wafers.

[0003] For example, there is a wafer storage container cleaning device as follows: a FOUP body is placed inside a tank for cleaning and drying the FOUP, and while the door of the FOUP is held by a door holding portion of a cover provided in a manner that allows the opening of the tank to be opened and closed, liquid is sprayed toward the FOUP body and the door in the tank, respectively, thereby cleaning the FOUP body and the door, and gas is sprayed in the tank, thereby drying the FOUP body and the door.

[0004] After this type of device has completed drying the FOUP body and door in the tank, the tank cover is opened and the FOUP body and door are removed from the tank by a robot. Sometimes, water droplets generated during cleaning are not completely dried and remain in the tank (including the cover). In the above case, when the tank cover is opened, water droplets attached to the cover sometimes fall into the tank and adhere to the FOUP body. In this way, since water droplets adhere to the FOUP that has completed the drying process, it sometimes contaminates the FOUP or causes contamination in the wafer storage container cleaning device. If the FOUP is contaminated, it must be cleaned again, and the cleaning efficiency will decrease.

[0005] [Prior art literature]

[0006] [Patent Document]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2005-109523 Summary of the invention

[0008] [Problems to be solved by the invention]

[0009] The present invention is made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer storage container cleaning device that can efficiently clean and dry a wafer storage container.

[0010] [Technical means to solve the problem]

[0011] In order to solve the above-mentioned problems and achieve the purpose, a wafer storage container cleaning device of an embodiment of the present invention cleans a wafer storage container, wherein the wafer storage container comprises: a main body having a storage space for storing semiconductor wafers and connected to an opening; and a door which can be loaded and unloaded relative to the opening, and the wafer storage container cleaning device comprises a cleaning tank for cleaning the wafer storage container, and the cleaning tank comprises: a tank having a main body storage area for accommodating the main body, and having a loading and unloading port at the upper part which can be opened and closed by an opening and closing cover via a hinge; a door holding part provided on the opening and closing cover for holding the door; a cleaning nozzle for supplying cleaning liquid to the main body accommodated in the main body storage area and to the door held by the door holding part; a rotating mechanism for rotating the main body and the door; and a circular frame for surrounding the main body held by the door holding part. The outer side of the door is arranged at a position that does not interfere with the door rotated by the rotating mechanism, and has a height that covers a part of the thickness of the door held by the door holding portion when the opening and closing cover is in a closed state; and an inclined cover is arranged at a position of the opening and closing cover on the opposite side of the hinge across the circular frame when the opening and closing cover is in a closed state, and is inclined so that the end on the opposite side to the hinge is the lowest and becomes higher toward the circular frame, so as to guide the cleaning fluid supplied and scattered from the cleaning nozzle to the door held by the door holding portion, and the end of the inclined cover on the side where the hinge is arranged is arranged at a position that guides the cleaning fluid to the side of the circular frame when the opening and closing cover is transferred from the closed state to the open state, and is arranged to have a portion overlapping with the circular frame when viewed from the side.

[0012] [Effects of the Invention]

[0013] According to an embodiment of the present invention, a wafer storage container cleaning apparatus capable of efficiently cleaning and drying a wafer storage container can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a plan view showing an example of a schematic structure of a wafer storage container cleaning apparatus according to an embodiment.

[0015] Figure 2 It is a perspective view showing the internal structure of the cleaning tank according to the embodiment.

[0016] Figure 3 This is a perspective view of a cleaning tank in an embodiment when the opening and closing cover is in an open state (a state in which the opening and closing cover is opened).

[0017] Figure 4 It is a side view showing the internal structure of the cleaning tank 5 when the opening and closing cover of the cleaning tank according to the embodiment is in an open state.

[0018] Figure 5 This is a diagram showing an example of the internal structure of the cleaning tank when the cleaning tank according to the embodiment is being cleaned.

[0019] Figure 6(A) to Figure 6(C) The diagram is for explaining the cleaning position and the standby position of the cleaning nozzle extending in the horizontal direction and the drying position and the standby position of the drying nozzle extending in the horizontal direction according to the embodiment.

[0020] Figure 7 It is a side view showing the internal structure of the cleaning tank 5 when the opening and closing cover of the cleaning tank according to the embodiment is in an open state.

[0021] Figure 8 This is a perspective view of the tilt cover as seen from the bottom.

[0022] Fig. 9 It is a side view of the inclined cover of the embodiment.

[0023] [Explanation of Symbols]

[0024] 1: Wafer storage container cleaning device

[0025] 1a: Cover

[0026] 1b, 1c: Opening

[0027] 2: Loading port

[0028] 2a, 7a: Baffle

[0029] 2b, 7b, 90: Arrow

[0030] 3: Robots

[0031] 3a: Robotic Arm

[0032] 3b: Robotic Hand

[0033] 4: Buffer (disassembly / connection station)

[0034] 5: Cleaning tank

[0035] 6: Drying trough

[0036] 7: Unloading port

[0037] 8: Control Department

[0038] 20: FOUP

[0039] 20a: FOUP body

[0040] 20b: Door (cover)

[0041] 20c: Flange

[0042] 51: Slot

[0043] 51a: Main Containment Area

[0044] 51b: Moving in and moving out

[0045] 51c: Hinge

[0046] 51d: Cylinder

[0047] 51e: bottom

[0048] 52: Open and close cover

[0049] 52a: Door holding part

[0050] 52b: Rotating part

[0051] 52b_1: End portion (edge ​​portion)

[0052] 52c: Round frame

[0053] 53a, 53b: Rotating mechanism

[0054] 53c: Rotation axis

[0055] 54: Cleaning nozzle

[0056] 55: Drying nozzle

[0057] 56: Guide plate

[0058] 56_1: One end

[0059] 56a: First vertical portion

[0060] 56b: First inclined portion

[0061] 56c: Second vertical part

[0062] 56d: Second inclined portion

[0063] 57: The First Eaves

[0064] 57a, 58a: Hole

[0065] 58: Second Eaves

[0066] 59: Tilt hood

[0067] 59a: End

[0068] 60: Drainage outlet

[0069] P1: Cleaning position

[0070] P2, P4: Standby position

[0071] P3: Dry position

[0072] X, Y, Z: direction DETAILED DESCRIPTION

[0073] Hereinafter, the embodiment of the wafer storage container cleaning device disclosed in the present application will be described in detail with reference to the accompanying drawings. In addition, the wafer storage container cleaning device disclosed in the present application is not limited to the following embodiment. In the following embodiment, the case where the wafer storage container to be processed by various processes such as cleaning or drying is FOUP is cited for description, but the wafer storage container to be processed by various processes is not limited to this. For example, the wafer storage container to be processed by various processes may also be FOSB.

[0074] (Example)

[0075] Figure 1 1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus 1 according to an embodiment. The wafer container cleaning apparatus 1 is installed in, for example, a factory for manufacturing semiconductor wafers, and cleans and dries wafer containers after cleaning.

[0076] like Figure 1 As shown, the wafer storage container cleaning apparatus 1 includes a loading port 2 , a robot 3 , a buffer (disassembly / connection stage) 4 , a cleaning tank 5 , a drying tank 6 , an unloading port 7 and a control unit 8 .

[0077] The robot 3, buffer 4, cleaning tank 5, drying tank 6 and control unit 8 are provided inside the housing 1a of the wafer storage container cleaning apparatus 1. Meanwhile, the loading port 2 and the unloading port 7 are provided across the inside and outside of the housing 1a of the wafer storage container cleaning apparatus 1.

[0078] The loading port 2 carries the FOUP 20, which is placed on the outside of the cover 1a of the loading port 2 and is to be cleaned and dried, into the inside of the cover 1a. The FOUP 20 includes a FOUP body (shell) 20a and a door (cover) 20b. The FOUP body 20a has an opening (FOUP body opening) and a storage space for storing semiconductor wafers. The storage space exists on the inner side of the FOUP body opening and is connected to the FOUP body opening. The door 20b can be disassembled / connected to the FOUP body 20a, and is installed in the FOUP body opening in an openable and closable state when connected to the FOUP body 20a. That is, the door 20b can be loaded and unloaded relative to the FOUP body opening. The FOUP body 20a is an example of a main body. A flange 20c is provided on the FOUP body 20a. The flange 20c is a portion that is gripped (held) when the FOUP 20 is transported by an overhead hoist transport (OHT) or the robot 3, and is provided on a surface of the FOUP body 20a that intersects with a surface having the FOUP body opening.

[0079] For example, the FOUP 20 transported by the OHT is placed on the outer portion of the cover 1a of the load port 2. Figure 1 As shown in the figure, the FOUP 20 is placed in such a manner that the door 20b of the FOUP 20 faces the baffle 2a provided at the opening 1b of the housing 1a. When the FOUP 20 is placed on the loading port 2 in the above manner, the baffle 2a rises. Thus, the FOUP 20 can be carried into the interior of the housing 1a from the opening 1b. That is, the FOUP 20 can be carried into the interior of the wafer storage container cleaning apparatus 1. Furthermore, the FOUP 20 slides in the direction of the arrow 2b by the slide device of the loading port 2. Thus, the FOUP 20 is carried into the interior of the housing 1a.

[0080] The sliding performed by the sliding device is described. For example, the loading surface of FOUP 20 is fixed to the sliding device by inserting a pin equipped with the sliding device into a hole provided at the bottom (loading surface) of FOUP 20. In this state, by sliding the sliding device in the direction of arrow 2b, FOUP 20 also slides with the movement of the sliding device. As a result, FOUP 20 is placed on a prescribed portion inside the cover 1a of the loading port 2. When FOUP 20 is moved into the inside of the cover 1a in the above manner, the baffle 2a descends and the opening 1b of the cover 1a is closed. The sliding device descends together with the pin to a position lower than the lower end of the baffle 2a (loading surface of FOUP 20), and returns to the original position outside the cover 1a.

[0081] The robot 3 moves the FOUP 20 to various parts while holding the flange 20c of the FOUP 20. The robot 3 includes a robot arm 3a and a robot hand 3b (a holding part of the robot 3). The robot 3 moves the robot arm 3a by extending or rotating the robot hand 3b while holding the flange 20c, thereby moving the FOUP 20 to various parts. In addition, when the robot 3 moves the door 20b separated (disassembled) from the FOUP body 20a, it moves the door 20b by holding both sides.

[0082] The buffer 4 is a loading table for the FOUP 20 to be loaded, and disassembles (separates) the FOUP 20 into the FOUP body 20a and the door 20b, or connects the FOUP body 20a and the door 20b. For example, in the buffer 4, the FOUP 20 loaded into the inside of the housing 1a is transported by the robot 3. In this case, the buffer 4 disassembles the FOUP 20 into the FOUP body 20a and the door 20b. In addition, disassembly can be said to be unlocking, and connection can be said to be locking.

[0083] The cleaning tank 5 is a tank for cleaning the FOUP 20. For example, in the cleaning tank 5, the FOUP body 20a and the door 20b are respectively transported by the robot 3. Moreover, the cleaning tank 5 cleans the FOUP 20 while holding the FOUP body 20a and the door 20b respectively. That is, the cleaning tank 5 cleans the storage space while the FOUP body 20a and the door 20b are separated. For example, in the cleaning tank 5, the door 20b and the FOUP body 20a are rotated by the rotating mechanism, and the cleaning liquid (for example, pure water) is supplied (sprayed) to each of the FOUP body 20a and the door 20b by the cleaning nozzle, thereby cleaning the FOUP 20. In addition, in the cleaning tank 5, the FOUP opening of the FOUP body 20a is arranged to face downward in consideration of the discharge property of the cleaning liquid.

[0084] After the cleaning of the FOUP 20 in the cleaning tank 5 is completed, the FOUP body 20a and the door 20b are rotated in the cleaning tank 5, and dry air is blown to them using a drying nozzle (air nozzle) to dry them. The drying in the cleaning tank 5 here is a process of removing the cleaning liquid attached to the FOUP 20 (temporary drying). After the temporary drying of the FOUP 20 in the cleaning tank 5 is completed, the robot 3 transports the FOUP body 20a and the door 20b in the cleaning tank 5 to the drying tank 6 respectively.

[0085] The drying tank 6 is a device for vacuum drying (main drying) the FOUP 20. When the vacuum drying of the FOUP 20 in the drying tank 6 is completed, the robot 3 transports the FOUP body 20a and the door 20b in the drying tank 6 to the buffer 4. Then, the buffer 4 connects the FOUP body 20a and the door 20b.

[0086] The unloading port 7 carries out the FOUP 20 that has been cleaned and vacuum-dried and placed by the robot 3 in the portion of the unloading port 7 inside the housing 1 a to the outside of the housing 1 a .

[0087] For example, after the vacuum drying process, the FOUP 20 is transported by the robot 3 and placed in the inner part of the cover 1a of the unloading port 7. In this way, when the FOUP 20 is placed in the unloading port 7, the baffle 7a provided in the opening 1c of the cover 1a rises. As a result, the FOUP 20 is in a state where it can be carried out from the opening 1c to the outside of the cover 1a. That is, the FOUP 20 is in a state where it can be carried out to the outside of the wafer storage container cleaning device 1. Moreover, by using the sliding device of the unloading port 7 (having the same mechanism as the sliding device of the loading port 2), the FOUP 20 is slid in the direction of the arrow 7b, so that the FOUP 20 is carried out to the outside of the cover 1a. In this way, when the FOUP 20 is carried out to the outside of the cover 1a, the baffle 7a descends and the opening 1c of the cover 1a is closed.

[0088] The control unit 8 controls the overall operation of the wafer storage container cleaning apparatus 1. For example, the control unit 8 controls the loading port 2, the robot 3, the buffer 4, the cleaning tank 5, the drying tank 6, and the unloading port 7 to operate the loading port 2, the robot 3, the buffer 4, the cleaning tank 5, the drying tank 6, and the unloading port 7 as described above.

[0089] For example, the control unit 8 includes a central processing unit (CPU), a read only memory (ROM), a random access memory (RAM), a hard disk drive (HDD), and a communication interface, which are connected via an internal bus.

[0090] The CPU executes various processes while using the storage area of ​​the RAM as a temporary storage area for data used for the various processes. The ROM and the HDD store programs for executing the various processes, various databases or various tables used when executing the various processes, etc. The communication interface is an interface for communicating with the various parts of the wafer storage container cleaning device 1 and communicating with an external device connected to the wafer storage container cleaning device 1 via a network. For example, the communication interface is a network interface card.

[0091] Next, an example of the structure of the cleaning tank 5 according to the present embodiment will be described. Figure 2 to Figure 5 It is a figure which shows an example of the structure of the cleaning tank 5 which concerns on embodiment. Figure 2 It is a perspective view showing the internal structure of the cleaning tank 5 according to the embodiment. Figure 3 This is a perspective view of a state where the opening and closing cover 52 of the cleaning tank 5 according to the embodiment is in an open state (a state where the opening and closing cover 52 is opened). Figure 4This is a side view showing an example of the internal structure of the cleaning tank 5 when the opening and closing cover 52 of the cleaning tank 5 according to the embodiment is in the open state. Figure 5 1 is a diagram showing an example of the internal structure of the cleaning tank 5 when the cleaning tank 5 of the embodiment is in the process of cleaning. Figure 2 to Figure 5 In the various figures, for the sake of convenience, the components constituting the cleaning tank 5 are appropriately omitted. Figure 2 In the figure, the opening and closing cover 52 of the cleaning tank 5 is omitted. Figure 2 The X direction, Y direction, and Z direction in the figure represent three directions orthogonal to each other. The X direction is parallel to the rotation axis of the hinge 51c described later, the Y direction is orthogonal to the X direction in the horizontal plane, and the Z direction is perpendicular to the X direction and the Y direction.

[0092] like Figure 2 to Figure 5 As shown, the cleaning tank 5 includes a tank 51, an opening and closing cover 52, a rotating mechanism 53a, a rotating mechanism 53b, a cleaning nozzle 54, a drying nozzle 55, a guide plate 56, a first eave 57, a second eave 58, and a tilting cover 59 (see Figure 8 ) and drain outlet 60.

[0093] The slot 51 is configured to accommodate the FOUP body 20a and the door 20b when the opening and closing cover 52 is in the closed state (the opening and closing cover 52 is closed). Figure 2 As shown, there is a main body storage area 51a and a loading and unloading port 51b. The main body storage area 51a is an area (space) that can store the FOUP main body 20a. In addition, the loading and unloading port 51b is an opening of the slot 51 through which the FOUP main body 20a passes when the FOUP main body 20a is loaded into the slot 51 or unloaded from the slot 51 by the robot 3. The main body storage area 51a is connected to the loading and unloading port 51b and is located at a position closer to the inside than the loading and unloading port 51b.

[0094] In addition, a hinge 51c and a cylinder 51d are provided in the groove 51 (see Figure 4 ) and an opening and closing cover 52 is installed via a hinge 51c.

[0095] The opening and closing cover 52 is attached to the tank 51 via a hinge 51c. The cylinder 51d is operated by the control unit 8, and the hinge 51c is operated. In conjunction with the operation of the hinge 51c, the opening and closing cover 52 is opened or closed relative to the loading and unloading port 51b of the tank 51. The opening and closing cover 52 is closed during the cleaning and drying of the FOUP 20, and is opened when the FOUP 20 is loaded into the tank 51 or unloaded from the tank 51. The opening and closing cover 52 is provided with a door holding portion 52a that holds the door 20b.

[0096] like Figure 2 As shown in FIG. 1 , the rotation mechanism 53a is a mechanism for rotating the FOUP body 20a placed in the body storage area 51a. For example, the rotation mechanism 53a rotates the turntable in the body storage area 51a while the FOUP body 20a is placed on the turntable, thereby rotating the FOUP body 20a in conjunction with the rotation of the turntable. The rotation mechanism 53a rotates the FOUP body 20a during the cleaning and drying of the FOUP body 20a. The rotation mechanism 53a includes, for example, a motor as a driving source for rotating the turntable.

[0097] like Figure 4 As shown, the rotating mechanism 53b is a mechanism for rotating the door 20b held by the door holding portion 52a. For example, the rotating mechanism 53b is Figure 5 As shown in the figure, the door holding portion 52a (refer to Figure 4 ) When the door 20b is held, the rotating portion 52b that holds both the door holding portion 52a and the door 20b is rotated with the rotating shaft 53c extending perpendicularly to the two main surfaces of the door 20b as the rotation center, thereby rotating the door 20b. In addition, when the opening and closing cover 52 is in a closed state, the two main surfaces of the door 20b become planes parallel to the horizontal plane. Therefore, when the opening and closing cover 52 is in a closed state, the rotating shaft 53c is an axis extending perpendicularly to the horizontal plane. The rotating mechanism 53b rotates the door 20b during the cleaning of the FOUP body 20a and the drying of the FOUP body 20a. The rotating mechanism 53b includes, for example, a motor as a driving source for rotating the rotating portion 52b.

[0098] The cleaning nozzle 54 has a plurality of nozzles having different spraying directions (see Figure 2 ), the FOUP 20 (FOUP body 20a and door 20b) is cleaned by supplying (spraying) cleaning liquid to the FOUP body 20a stored in the body storage area 51a and the door 20b held by the door holding portion 52a. Figure 2 As shown, the cleaning nozzle 54 has a horizontal direction (in Figure 2 The cleaning nozzles 54 extend in the horizontal direction (in the example, in the X direction) and one nozzle extends in the Z direction. One of the cleaning nozzles 54 extending in the horizontal direction supplies cleaning liquid toward the door 20b, and the other supplies cleaning liquid toward the FOUP body 20a. The cleaning nozzle 54 extending in the Z direction supplies cleaning liquid toward the FOUP body 20a. The cleaning nozzle 54 is connected to a cleaning liquid supply device (cleaning liquid supply device) not shown in the figure. The cleaning nozzle 54 supplies the cleaning liquid supplied from the cleaning liquid supply device to the FOUP body 20a and the door 20b.

[0099] When the cleaning nozzle 54 cleans the FOUP 20, first, the moving mechanism for moving the cleaning nozzle 54 moves the cleaning nozzle 54 extending in the horizontal direction to the cleaning position P1 (refer to Figure 6 (B)), and the cleaning position P1 is a position where the cleaning nozzle 54 can supply cleaning liquid to the FOUP body 20a and the door 20b. Then, the cleaning nozzle 54 sprays cleaning liquid at the cleaning position P1 to the FOUP body 20a and the door 20b that are rotating by the rotating mechanism 53a and the rotating mechanism 53b. The cleaning nozzle 54 performs this cleaning process for a predetermined time. Then, after the cleaning process is completed, the moving mechanism moves the cleaning nozzle 54 to the standby position P2 (refer to Figure 6 (A)). Here, the cleaning position P1 is the position of the cleaning nozzle 54 during the cleaning process, and the standby position P2 is a position for the cleaning nozzle 54 that is not in the cleaning process to standby. In addition, the cleaning position P1 is not a point position, but an area of ​​a certain size. Figure 2 The middle shows a case where the cleaning nozzle 54 is located at the standby position P2.

[0100] The drying nozzle 55 has a plurality of nozzles having different ejection directions (see Figure 2 ), by blowing dry air to the FOUP body 20a stored in the body storage area 51a and the door 20b held by the door holding portion 52a, the FOUP 20 (FOUP body 20a and door 20b) is temporarily dried. Figure 2 As shown, the drying nozzle 55 has a Figure 2 In the example of the drying nozzles 55, two nozzles extending in the Y direction) and one nozzle extending in the Z direction. One of the drying nozzles 55 extending in the horizontal direction blows dry air toward the door 20b, and the other blows dry air toward the FOUP body 20a. The drying nozzle 55 extending in the Z direction blows dry air toward the FOUP body 20a. The drying nozzle 55 is connected to a dry air supply device (dry air supply device) not shown in the figure. The drying nozzle 55 supplies the dry air supplied from the dry air supply device to the FOUP body 20a and the door 20b.

[0101] When the drying nozzle 55 dries the FOUP 20, first, the moving mechanism for moving the drying nozzle 55 moves the drying nozzle 55 extending in the horizontal direction to the drying position, which is a position where dry air can be blown to the FOUP body 20a and the door 20b through the drying nozzle 55. Then, at the drying position, the drying nozzle 55 blows dry air to the FOUP body 20a and the door 20b that are rotating by the rotating mechanisms 53a and 53b. The drying nozzle 55 performs this drying process for a prescribed time. Then, after the drying process is completed, the moving mechanism moves the drying nozzle 55 to the standby position. That is, the drying position is the position of the drying nozzle 55 during the drying process, and the standby position is a position for making the drying nozzle 55 standby when it is not during the drying process. In addition, the drying position is an area within a certain size. Figure 2 The middle shows a case where the drying nozzle 55 is located at the standby position.

[0102] Figure 6(A) to Figure 6(C) This is a diagram for explaining the cleaning position and standby position of the cleaning nozzle 54 extending in the horizontal direction and the drying position and standby position of the drying nozzle 55 extending in the horizontal direction described above. Figure 6(A) to Figure 6(C) 1 is a top view of the cleaning tank 5 in which the FOUP body 20a is stored in the body storage area 51a. Figure 6(A) to Figure 6(C) 6(A) shows a state where the cleaning nozzle 54 is located at the standby position P2 and the drying nozzle 55 is located at the standby position P4. When the FOUP body 20a is moved into the tank 51, the cleaning nozzle 54 and the drying nozzle 55 are both located at the standby position as shown in FIG6(A).

[0103] Fig. 6(B) shows a state where the cleaning nozzle 54 is located at the cleaning position P1 and the drying nozzle 55 is located at the standby position P4. When the cleaning nozzle 54 supplies cleaning liquid to the FOUP body 20a and the door 20b for cleaning, the cleaning nozzle 54 and the drying nozzle 55 are located at the positions shown in Fig. 6(B).

[0104] Fig. 6(C) shows a state where the cleaning nozzle 54 is located at the standby position P2 and the drying nozzle 55 is located at the drying position P3. When the drying nozzle 55 blows dry air to the FOUP body 20a and the door 20b to dry, the cleaning nozzle 54 and the drying nozzle 55 are located at the positions shown in Fig. 6(C).

[0105] That is, the standby positions of the cleaning nozzles 54 and the drying nozzles 55 are positions where the nozzles do not interfere with the FOUP body 20a when the FOUP body 20a is moved into or out of the tank 51. In addition, the cleaning position of the cleaning nozzles 54 and the drying position of the drying nozzles 55 are positions where cleaning liquid or dry air can be supplied to at least a portion of the stopped FOUP body 20a, and are positions where cleaning liquid or dry air can be supplied to the entire FOUP body 20a by rotating the FOUP body 20a.

[0106] like Figure 4 and Figure 5 As shown, the guide plate 56 is provided on the hinge 51c of the opening and closing cover 52 (see Figure 4 ) side is a member for guiding the cleaning liquid (water droplets of cleaning liquid) attached to the opening and closing cover 52 to the wall surface of the groove 51. That is, the guide plate 56 guides the cleaning liquid from the opening and closing cover 52 to the wall surface of the groove 51.

[0107] like Figure 5 As shown, one end 56_1 of the guide plate 56 is provided on the opening and closing cover 52. The guide plate 56 includes a first vertical portion 56a, a first inclined portion 56b, a second vertical portion 56c, and a second inclined portion 56d in the order of a first vertical portion 56a, a first inclined portion 56b, a second vertical portion 56c, and a second inclined portion 56d in a direction extending from the one end 56_1 of the guide plate 56.

[0108] like Figure 5 As shown, the surface of the first vertical portion 56a on the door 20b side and the surface of the second vertical portion 56c on the door 20b side are perpendicular to the horizontal plane when the opening and closing cover 52 is in the closed state. That is, the first vertical portion 56a and the second vertical portion 56c form a surface perpendicular to the horizontal plane when the opening and closing cover 52 is in the closed state.

[0109] like Figure 5 As shown, the first inclined portion 56b is disposed at a height position where, when the opening and closing cover 52 is in a closed state, it collides with the cleaning liquid splashed from the door 20b held by the door holding portion 52a and rotated by the rotating mechanism 53b. That is, the first inclined portion 56b is disposed so that, when the opening and closing cover 52 is in a closed state, in the Z direction, between the upper end and the lower end of the first inclined portion 56b, it includes a position where it collides with the cleaning liquid splashed due to the centrifugal force from the door 20b. The first inclined portion 56b has a height position where, when the opening and closing cover 52 is in a closed state, the upper end of the first inclined portion 56b is located closer to the inside of the groove 51 than the lower end of the first inclined portion 56b (rotating mechanism 53b (refer to Figure 4 ) side) in an inclined manner.

[0110] like Figure 5As shown, the first inclined portion 56b receives the cleaning liquid scattered from the door 20b in the centrifugal direction, and the door 20b receives the cleaning liquid supplied from the cleaning nozzle 54 while rotating. Here, since the surface of the first inclined portion 56b on the door 20b side is inclined as described above, even if the first inclined portion 56b receives the cleaning liquid scattered from the door 20b, it is possible to suppress the cleaning liquid from being reflected toward the FOUP body 20a side.

[0111] In addition, if Figure 5 As shown, the first inclined portion 56b may also be provided at a height position where the cleaning liquid scattered from the end portion (edge ​​portion) 52b_1 of the rotating portion 52b collides with the cleaning liquid when the opening and closing cover 52 is in the closed state. That is, the first inclined portion 56b is provided so that when the opening and closing cover 52 is in the closed state, in the height direction, the height position including the end portion 52b_1 of the rotating portion 52b is between the upper end and the lower end of the first inclined portion 56b. Therefore, similarly to the case of receiving the cleaning liquid scattered from the door 20b, even if the first inclined portion 56b receives the cleaning liquid scattered from the end portion 52b_1 of the rotating portion 52b, it is possible to suppress the cleaning liquid from being reflected toward the FOUP body 20a side.

[0112] The second inclined portion 56d is a component that is used to prevent the cleaning liquid attached to the open and close cover 52 and the door 20b from dripping onto the FOUP body 20a and guide the cleaning liquid attached to the open and close cover 52 and the door 20b to the wall surface of the tank 51 when the open and close cover 52 is opened (when the open and close cover 52 is transferred from a closed state to an open state) after cleaning and drying are completed in the cleaning tank 5.

[0113] The length of the second inclined portion 56d in the Z direction in the direction in which the second inclined portion 56d is inclined is as follows: Figure 5 As shown, when the opening and closing cover 52 of the tank 51 is in the closed state, the length does not interfere with the first eaves 57, the second eaves 58, the cleaning nozzle 54, the drying nozzle 55, etc. which will be described later. Figure 7 1 is a side view showing the internal structure of the cleaning tank 5 when the opening and closing cover 52 of the cleaning tank 5 of the embodiment is in an open state. Figure 7 51b of the slot 51. The length of the second inclined portion 56d in the direction in which the second inclined portion 56d is inclined is also as shown in FIG. Figure 7 When the opening and closing cover 52 is opened 90 degrees as shown, the cleaning liquid attached to the opening and closing cover 52 and the door 20 b does not leak out of the groove 51 but drips to the length of the first eaves 57 and the second eaves 58 provided in the groove 51 .

[0114] In addition, in Figure 4When the opening and closing cover 52 is opened 45 degrees as shown in the figure, the connection part of the second inclined portion 56d and the second vertical portion 56c is bent to the side opposite to the FOUP body 20a side so as to prevent the cleaning liquid attached to the opening and closing cover 52 and the door 20b from dripping onto the FOUP body 20a. Figure 4 When the opening and closing cover 52 is opened 45 degrees as shown in the figure, the surface of the second inclined portion 56d on the door 20b side becomes a surface perpendicular to the horizontal plane. That is, the second inclined portion 56d has a surface perpendicular to the horizontal plane when the opening and closing cover is opened 45 degrees. In addition, a wall for preventing water drops from falling may be provided at a portion of the guide plate 56 that is located outside the groove 51 when the opening and closing cover 52 is opened 90 degrees. That is, the first vertical portion 56a, the first inclined portion 56b, and the second vertical portion 56c may be respectively as shown in the figure. Figure 7 Even when the opening and closing cover 52 is opened 90 degrees, it is not necessary to provide a wall on the second inclined portion 56d which is located at a position overlapping the groove 51 in a plan view.

[0115] In addition, the second inclined portion 56d and the one end 56_1 (see Figure 5 The guide plate 56 is disposed on the opening and closing cover 52 in such a manner that the ends of the opening and closing cover 52 and the opening and closing cover 52 are both located above the first eaves 57 and the second eaves 58. Thus, the cleaning liquid can drip from the guide plate 56 to the first eaves 57 and the second eaves 58 regardless of whether the opening and closing cover 52 is in a closed state, a state of being opened 45 degrees, or a state of being opened 90 degrees.

[0116] The first eaves 57 is a member for receiving the cleaning liquid dripping from the guide plate 56, that is, the cleaning liquid along the guide plate 56, and guiding the cleaning liquid to the wall surface of the groove 51. The first eaves 57 is a flat member, and is disposed below the guide plate 56. One end of the first eaves 57 is disposed on the wall surface of the groove 51. The first eaves 57 is inclined in a manner that the height position becomes higher as it moves from one end of the first eaves 57 toward the other end. That is, the first eaves 57 is inclined in a manner that the other end becomes higher than the one end. In addition, a hole 57a (see FIG. 5A ) through which the cleaning liquid can pass is formed between one end of the first eaves 57 and the wall surface of the groove 51. Figure 4 ). Therefore, when the first eaves 57 receives the cleaning liquid dripping from the guide plate 56, the cleaning liquid advances toward the hole 57a on the first eaves 57 and passes through the hole 57a.

[0117] The second eaves 58 is a member for more reliably guiding the cleaning liquid dripping from the guide plate 56 to the wall surface of the groove 51. The second eaves 58 is a member for receiving the cleaning liquid along the guide plate 56 and guiding the cleaning liquid to the wall surface of the groove 51, similarly to the first eaves 57. The second eaves 58 is a flat plate-shaped member similarly to the first eaves 57, and is provided below the guide plate 56. However, the second eaves 58 is provided above the cleaning nozzle 54 when the cleaning nozzle 54 is located at the standby position P2. Therefore, the cleaning nozzle 54 stands by at the standby position P2 provided between the second eaves 58 and the first eaves 57 without supplying the cleaning liquid.

[0118] One end of the second eave 58 is provided on the wall surface of the groove 51. The second eave 58 is inclined so that the height position increases from one end of the second eave 58 toward the other end. That is, the second eave 58 is inclined so that the other end is at a higher position than the one end. In addition, a hole 58a (see FIG. 1 ) through which the cleaning liquid can pass is formed between one end of the second eave 58 and the wall surface of the groove 51. Figure 4 ). Therefore, when the second eaves 58 receives the cleaning liquid dripping from the guide plate 56, the cleaning liquid moves toward the hole 58a on the second eaves 58 and passes through the hole 58a. In addition, the second eaves 58 may not be provided and only the first eaves 57 may be provided. When the second eaves 58 are provided, the cleaning liquid can be more reliably guided to the wall surface of the groove 51.

[0119] The cleaning liquid that has passed through the hole 57a of the first eave 57 and the cleaning liquid that has passed through the hole 58a of the second eave 58 reach the bottom surface 51e of the groove 51 along the wall surface of the groove 51 (see Figure 2 and Figure 4 The cleaning liquid reaching the bottom surface 51e is discharged from the drain port 60 (see FIG. 1 ) provided on the bottom surface 51e. Figure 2 and Figure 4 ) is discharged (drained) to the outside of the tank 51 via a pipe (not shown). The drain port 60 is provided on the side of the bottom surface 51e opposite to the side where the guide plate 56 is located. The bottom surface 51e is inclined in a manner that gradually becomes lower from the side where the guide plate 56 is located to the drain port 60. Therefore, the cleaning liquid that reaches the bottom surface 51e or the cleaning liquid that falls to the bottom surface 51e flows toward the drain port 60. Therefore, in the present embodiment, the cleaning liquid that falls to the bottom surface 51e is not accumulated on the bottom surface 51e but is discharged.

[0120] Figure 8 and Fig. 9 This is a diagram showing an example of the inclined cover 59 according to the embodiment. Figure 8 This is a perspective view of the tilt cover 59 as viewed from the bottom. Fig. 9 is a side view of the inclined cover 59 of the embodiment. Fig. 9 In the figure, illustration of the parts other than the inclined cover 59 and a circular frame 52c described later is omitted.

[0121] The circular frame 52c is described below. Figure 8 and Fig. 9 As shown, the circular frame 52c is formed by surrounding the door holding portion 52a (refer to Figure 4 ) door 20b (refer to Figure 4 ) is provided on the outside of the opening and closing cover 52 in a circular shape. In addition, the circular frame 52c is provided at a position that does not interfere with the door 20b rotated by the rotating mechanism 53b. The circular frame 52c is provided to prevent the cleaning liquid from invading the inside of the door 20b from the hole (not shown) on the side of the door 20b. In addition, the door holding portion 52a rotates together with the door 20b by the rotating mechanism 53b, but the circular frame 52c does not rotate.

[0122] In addition, if Figure 5 As shown, the circular frame 52c has a height that covers a portion of the thickness of the door 20b held by the door holding portion 52a when the opening and closing cover 52 is in the closed state. The surface of the door 20b held by the door holding portion 52a, which is opposite to the surface facing the opening and closing cover 52, is located below the circular frame 52c in the height direction (Z direction) of the groove 51. Thus, the door 20b is fully cleaned by the cleaning liquid from the cleaning nozzle 54.

[0123] The tilted cover 59 is a flat plate-shaped member, and is tilted so that the end 59a opposite to the hinge 51c is the lowest when the opening and closing cover 52 is in the closed state, and the tilted cover 59 is inclined so as to become higher toward the center of the opening and closing cover 52. For example, when the opening and closing cover 52 is in the closed state, the tilted cover 59 is tilted so that the cleaning liquid attached to the tilted cover 59 does not drip onto the FOUP body 20a but drips onto the wall surface between the FOUP body 20a and the groove 51.

[0124] For example, when the opening and closing cover 52 is in the closed state, the inclined cover 59 receives the cleaning liquid scattered from the door 20b in the centrifugal direction, and the door 20b receives the cleaning liquid supplied from the cleaning nozzle 54 while rotating. As described above, a part of the cleaning liquid scattered from the door 20b is directed toward the first inclined portion 56b. At the same time, a part of the cleaning liquid is directed along the inclined cover 59. Here, since the inclined cover 59 is inclined as described above, the inclined cover 59 guides the cleaning liquid in such a manner that the cleaning liquid attached to the inclined cover 59 does not drip onto the FOUP body 20a, but drips between the FOUP body 20a and the wall surface of the groove 51. The cleaning liquid dripping between the FOUP body 20a and the wall surface of the groove 51 falls to the bottom surface 51e of the groove 51. The cleaning liquid falling to the bottom surface 51e is discharged from the drain port 60 as described above. Therefore, even if the inclined cover 59 receives the cleaning liquid scattered from the door 20b when the opening and closing cover 52 is in the closed state, the cleaning liquid can be prevented from dripping onto the FOUP body 20a.

[0125] In addition, from Fig. 9 When viewed from the side in the direction indicated by the arrow 90, the end of the central side of the opening and closing cover 52 of the inclined cover 59 is arranged in a manner having a portion overlapping with the circular frame 52c. In addition, the end of the central side of the opening and closing cover 52 of the inclined cover 59 is arranged at a position that guides the cleaning liquid to the side of the circular frame 52c when the opening and closing cover 52 is opened (when the opening and closing cover 52 is transferred from the closed state to the open state). Therefore, when the opening and closing cover 52 is transferred from the closed state to the open state, the cleaning liquid attached to the inclined cover 59 passes through the side of the circular frame 52c and is guided to the guide plate 56. The cleaning liquid guided to the guide plate 56 is finally discharged from the drain port 60 via the first eaves 57 or the second eaves 58. In this way, when the opening and closing cover 52 is transferred from the closed state to the open state, the inclined cover 59 guides the cleaning liquid supplied to the door 20b and scattered to the side of the circular frame 52c. Therefore, even when the opening and closing cover 52 is shifted from the closed state to the open state, the tilted cover 59 can suppress the cleaning liquid from dripping onto the FOUP body 20a.

[0126] As described above, the tilt cover 59 can prevent the cleaning liquid from dripping onto the FOUP body 20a in both cases when the opening and closing cover 52 is in the closed state and when the opening and closing cover 52 is shifted from the closed state to the open state. As a result, the cleaning liquid does not adhere to the FOUP 20 after the drying process is completed, so it is not necessary to clean the FOUP 20 again. Therefore, according to the wafer storage container cleaning apparatus 1 of this embodiment, the FOUP 20 can be cleaned and dried efficiently.

[0127] Next, the flow of the cleaning process and the drying process performed by the wafer storage container cleaning apparatus 1 of the present embodiment will be described. First, when the FOUP body 20a and the door 20b are moved into the tank 51, the cleaning nozzle 54 moves from the standby position P2 to the cleaning position P1 to perform the cleaning process on the FOUP 20. During the cleaning process, the FOUP body 20a and the door 20b are rotated by the rotating mechanism 53a and the rotating mechanism 53b.

[0128] When the cleaning process is completed, the cleaning nozzle 54 moves to the standby position P2, and the drying nozzle 55 moves from the standby position P4 to the drying position P3 to dry the FOUP 20. During the drying process by the drying nozzle 55, the cleaning nozzle 54 is located at the standby position P2, and the cleaning liquid remaining in the cleaning nozzle 54 falls, is guided to the wall surface of the tank 51 along the first eaves 57, and flows to the drain port 60. During this period, the drying process is performed by the drying nozzle 55, and the FOUP body 20a and the door 20b rotate in the same manner as in the cleaning process. Therefore, the gas from the drying nozzle 55 is filled into the tank 51 by centrifugal force. However, the cleaning liquid attached to the cleaning nozzle 54 flows efficiently to the drain port 60 along the wall surface of the tank 51 via the first eaves 57, thereby preventing the gas from the drying nozzle 55 from scattering in the tank 51 and attaching to the FOUP 20 again. When the drying process is completed, the drying nozzle 55 moves to the standby position P4.

[0129] When the drying process is completed, the opening and closing cover 52 of the tank 51 is opened. At this time, the cleaning liquid remaining in the opening and closing cover 52 is Figure 4 As shown in the figure, the cleaning liquid is discharged from the drain port 60 along the guide plate 56, the first eave 57, and the wall surface of the groove 51 in the direction indicated by the arrow. In this way, the cleaning liquid remaining in the opening and closing cover 52 is efficiently discharged along the wall surface of the groove 51, and can be prevented from falling into the FOUP body 20a.

[0130] Furthermore, even if the cleaning liquid dropped from the guide plate 56 adheres to the cleaning nozzle 54 located at the standby position P2, when the next FOUP 20 to be processed is moved into the cleaning tank 5, the same cleaning liquid as the cleaning liquid adhered to the cleaning nozzle 54 is supplied from the cleaning nozzle 54 to the FOUP 20, so there is essentially no problem.

[0131] The wafer storage container cleaning device 1 of the present embodiment has been described above. The wafer storage container cleaning device 1 has a cleaning tank 5 for cleaning the FOUP 20. The cleaning tank 5 has: a tank 51 having a main body storage area 51a for storing the FOUP main body 20a, and having a loading and unloading port 51b at the upper part that can be opened and closed by an opening and closing cover 52 via a hinge 51c; a door holding part 52a that is provided on the opening and closing cover 52 and holds the door 20b; a cleaning nozzle 54 that supplies cleaning liquid to the FOUP main body 20a stored in the main body storage area 51a and the door 20b held by the door holding part 52a; a rotating mechanism 53a, a rotating mechanism 53b that rotates the FOUP main body 20a and the door 20b; and a circular frame 52c that surrounds the door held by the door holding part 52a. 20b is arranged at a position that does not interfere with the door 20b rotated by the rotating mechanism 53b, and has a height that covers a part of the thickness of the door 20b held by the door holding portion 52a when the opening and closing cover 52 is in the closed state; and an inclined cover 59 is arranged at a position on the opposite side of the opening and closing cover 52 across the circular frame 52c from the hinge 51c when the opening and closing cover 52 is in the closed state, and is arranged in an inclined manner so that the end on the opposite side to the hinge 51c is the lowest and becomes higher toward the circular frame 52c, and guides the cleaning liquid supplied and scattered from the cleaning nozzle 54 to the door 20b held by the door holding portion 52a. In addition, the end of the inclined cover 59 on the side where the hinge 51c is arranged is arranged at a position that guides the cleaning liquid to the side of the circular frame 52c when the opening and closing cover 52 is transferred from the closed state to the open state, and is arranged to have a portion overlapping with the circular frame 52c when viewed from the side.

[0132] With this structure, as described above, when the opening and closing cover 52 of the cleaning tank 5 is moved from the closed state to the open state, the droplets of the cleaning liquid existing on the back of the opening and closing cover 52 flow from the inclined cover 59 along the circular frame 52c to the hinge 51c side. Therefore, according to the wafer storage container cleaning apparatus 1 of this embodiment, it is possible to suppress the droplets of the cleaning liquid from adhering to the FOUP body 20a held below the opening and closing cover 52, and thus the FOUP 20 can be cleaned and dried efficiently.

[0133] In addition, a space for the robot 3 to enter the tank 51 is provided on the front side of the tank 51 of the cleaning tank 5 (the side to which the flange 20c of the FOUP body 20a faces when the FOUP body 20a is moved into the cleaning tank 5). The space is the space required for the robot 3 to be placed in the tank 51 with the FOUP opening of the FOUP body 20a facing downward while holding the flange 20c of the FOUP body 20a. Since the tank 51 has the space, the area of ​​the opening and closing cover 52 has to be increased, and the blank area other than the part where the door 20b is held becomes larger. Therefore, it becomes a problem to efficiently recover the cleaning liquid while suppressing the cleaning liquid attached to the blank area from dripping onto the FOUP body 20a. According to the wafer storage container cleaning device 1 of this embodiment, the problem can be solved by having the tilted cover 59 as described above.

[0134] In the wafer storage container cleaning apparatus 1 of the present embodiment, the surface of the door 20b held by the door holding portion 52a, which is opposite to the surface facing the opening and closing cover 52, is located below the circular frame 52c in the height direction of the groove 51. In addition, a guide plate 56 for guiding the cleaning liquid from the opening and closing cover 52 to the wall surface of the groove 51 is provided between the circular frame 52c of the opening and closing cover 52 and the hinge 51c. The guide plate 56 has a first inclined portion 56b, which is provided at a height position including a height position where the cleaning liquid scattering from the door 20b held by the door holding portion 52a collides when the opening and closing cover 52 is in the closed state, and has a surface inclined so that the upper end is located on the inner side of the groove 51 than the lower end.

[0135] With this structure, as described above, the cleaning liquid scattered from the door 20b hits the first inclined portion 56b of the guide plate 56 and is guided to the wall surface of the tank 51. This can prevent the dirt removed from the door 20b from being attached to the FOUP body 20a due to the cleaning liquid hitting other parts in the tank 51 and rebounding toward the FOUP body 20a.

Claims

1. A wafer storage container cleaning device for cleaning a wafer storage container, wherein the wafer storage container comprises: a main body having a storage space for storing semiconductor wafers and communicating with an opening; and a door capable of being attached to and detached from the opening, The wafer storage container cleaning device comprises a cleaning tank for cleaning the wafer storage container. The cleaning tank has: A tank having a main body receiving area for receiving the main body and having an inlet and outlet at the upper portion that can be opened and closed by an opening and closing cover via a hinge; A door holding portion, provided on the opening and closing cover, for holding the door; a cleaning nozzle for supplying cleaning liquid to the main body accommodated in the main body accommodating area and the door held by the door holding portion; A rotating mechanism for rotating the main body and the door; a circular frame, which is provided at a position not to interfere with the door rotated by the rotating mechanism so as to surround the outer side of the door held by the door holding portion, and has a height covering a part of the thickness of the door held by the door holding portion when the opening and closing cover is in a closed state; and The tilted cover is disposed at a position of the opening and closing cover opposite to the hinge across the circular frame when the opening and closing cover is in a closed state, and is tilted so that the end opposite to the hinge is the lowest and becomes higher toward the circular frame, so as to guide the cleaning liquid supplied and scattered from the cleaning nozzle to the door held by the door holding portion, The end of the tilted cover on the side where the hinge is provided is arranged at a position to guide the cleaning fluid to the side of the circular frame when the opening and closing cover is transferred from the closed state to the open state, and is arranged to have a portion overlapping with the circular frame when viewed from the side.

2. The wafer storage container cleaning device according to claim 1, wherein: The surface of the door held by the door holding portion, which is opposite to the surface facing the opening and closing cover, is located below the circular frame in the height direction of the groove. A guide plate is provided between the circular frame of the opening and closing cover and the hinge to guide the cleaning liquid from the opening and closing cover to the wall surface of the tank. The guide plate has a first inclined portion, which is arranged at a height position including a height position where the first inclined portion collides with the cleaning liquid scattered from the door held by the door holding portion when the opening and closing cover is in a closed state, and has a surface inclined in such a manner that the upper end is located closer to the inner side of the groove than the lower end.

3. The wafer storage container cleaning device according to claim 2, wherein: One end of the guide plate is disposed on the opening and closing cover, The guide plate includes the first vertical portion, the first inclined portion, the second vertical portion, and the second inclined portion in the order of the first vertical portion, the first inclined portion, the second vertical portion, and the second inclined portion in a direction extending from the one end of the guide plate. The first vertical portion and the second vertical portion form a surface perpendicular to a horizontal plane when the opening and closing cover is in a closed state. The second inclined portion has a surface that is perpendicular to a horizontal plane when the opening and closing cover is opened at 45 degrees.

4. The wafer storage container cleaning device according to claim 2 or 3, comprising a first eave, One end of the first eave is disposed on the wall surface of the groove below the guide plate, and the first eave receives the cleaning liquid along the guide plate and guides the cleaning liquid to the wall surface of the groove. The first eaves are inclined so that the other end is located higher than the one end, and a hole through which the cleaning liquid can pass is formed between the one end and the wall surface.

5. The wafer storage container cleaning device according to claim 4 further comprises a second eaves, One end of the second eave is disposed on the wall surface of the groove between the lower end of the guide plate and the first eave, the second eave is inclined so that the other end is higher than the one end, and a hole is provided between the one end and the wall surface through which the cleaning liquid can pass. The cleaning nozzle stands by at a standby position provided between the second eaves and the first eaves when the cleaning liquid is not supplied.

Images