Leveling device, leveling apparatus, and leveling method for leveling apparatus

Abstract

The application provides a leveling device, a leveling equipment and a leveling method of the leveling equipment, and high-efficiency leveling can be realized. The leveling device comprises a bottom plate, a plurality of flexible leveling pieces, a bearing piece and a plurality of leveling fasteners. The bottom plate has a first surface, and the plurality of flexible leveling pieces are installed on the first surface. Each flexible leveling piece can be elastically deformed along the height direction of the flexible leveling piece. A second fixing hole of each flexible leveling piece is in communication with a first fixing hole of the bottom plate. The bearing piece is installed on the side of the plurality of flexible leveling pieces away from the first surface. The bearing piece has a bearing surface away from the plurality of flexible leveling pieces, and the bearing surface is used for bearing a piece to be leveled. Each third fixing hole of the bearing piece is in communication with the second fixing hole of one flexible leveling piece. Each leveling fastener is arranged in one third fixing hole, one second fixing hole and one first fixing hole. Each leveling fastener is used for adjusting the height of one flexible leveling piece.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a leveling device, a leveling equipment and a leveling method of the leveling equipment. BACKGROUND

[0002] With the continuous evolution of chip manufacturing technology, the features of chips to be detected are also becoming smaller and smaller. In chip manufacturing, in order to ensure the precision and accuracy of the wafer of the chip in the operation of detection or processing, it is necessary to use a leveling device to level the wafer. However, the existing leveling device is complex to operate and has low leveling efficiency, which reduces the production efficiency of the chip. SUMMARY

[0003] The present application provides a leveling device, a leveling equipment and a leveling method of the leveling equipment, which can realize efficient leveling and help to speed up the production rhythm of the chip and improve the production efficiency of the chip.

[0004] In a first aspect, the present application provides a leveling device, comprising a bottom plate, a plurality of flexible leveling members, a carrier and a plurality of leveling fasteners, the bottom plate has a first surface, the bottom plate is provided with a plurality of first fixing holes, the plurality of first fixing holes are arranged at intervals, and the opening of each fixing hole is located on the first surface; the plurality of flexible leveling members are installed on the bottom plate, each flexible leveling member can be elastically deformed along the height direction of the flexible leveling member, each flexible leveling member is provided with a second fixing hole, the second fixing hole penetrates the flexible leveling member along the height direction of the flexible leveling member, and communicates with the first fixing hole; the carrier is installed on the side of the plurality of flexible leveling members away from the first surface, the carrier has a carrier surface away from the plurality of flexible leveling members, the carrier surface is used for carrying a piece to be leveled, and the carrier is provided with a plurality of third fixing holes, each third fixing hole penetrates the carrier along the thickness direction of the carrier, and communicates with the second fixing hole of one flexible leveling member; each leveling fastener is arranged in one third fixing hole, one second fixing hole of a flexible leveling member and one first fixing hole, and each leveling fastener is used for adjusting the height of one flexible leveling member. In the leveling device provided by the present application, the distance between the carrier and the first surface of the bottom plate can be changed by fastening operation of the leveling fastener, so as to extrude the plurality of flexible leveling members, so that the height of the plurality of flexible leveling members changes, thereby providing leveling feed for the leveling device, changing the levelness of the carrier surface, and realizing leveling operation of the leveling device. Under this setting, on the one hand, the leveling device can realize integrated design of leveling and fastening, so that the leveling and fastening of the leveling device are completed at one time, thereby reducing the interference of fastening operation on leveling operation, realizing efficient leveling in limited space, thereby improving the leveling efficiency of the leveling device, thereby helping to speed up the production rhythm of chips and improve the production efficiency of chips, on the other hand, the leveling device only includes the bottom plate, the flexible leveling member, the carrier and the leveling fastener, and the assembly between the bottom plate, the flexible leveling member and the carrier can be realized by the leveling fastener, so that the structure of the leveling device is simple and compact, thereby facilitating the maintenance of the leveling device. At the same time, the integrated design of leveling and fastening of the leveling device can also make the acting force generated by leveling and the acting force generated by fastening be collinear, thereby avoiding the generation of external torsional moment, preventing the carrier from being deformed due to the bending torsional moment, and further reducing the influence of leveling and fastening operation on the appearance precision of the carrier, thereby ensuring the leveling effect of the leveling device on the piece to be leveled.

[0005] In a possible implementation, each of the flexible leveling members comprises a flexible base and a flexible ball table, the flexible base is mounted on the first surface, and the flexible base is provided with a first sub-hole penetrating the flexible base along a height direction of the flexible base and communicating with the first fixed hole, the flexible ball table is mounted on a side of the flexible base away from the first surface, the flexible ball table is provided with a second sub-hole penetrating the flexible ball table along a height direction of the flexible ball table and communicating with the first sub-hole, and the second fixed hole comprises the first sub-hole and the second sub-hole; the bearing member is located on a side of the flexible ball table away from the flexible base; and each of the leveling fasteners is arranged in one of the first sub-holes and one of the second sub-holes. With the flexible base and the flexible ball table, the machining precision of the flexible leveling member and the assembly precision between the flexible leveling member and the bottom plate can be reduced.

[0006] In a possible implementation, the flexible base is provided with a contact groove, an opening of the contact groove is located on a surface of the flexible base away from the first surface, and the contact groove communicates with the first sub-hole; the flexible ball table is located in the contact groove, and the flexible ball table has a contact surface facing the contact groove, and the contact surface abuts against a groove wall surface of the contact groove. With this arrangement, the assembly precision between the flexible ball table and the flexible base can be reduced, thereby helping to reduce the assembly difficulty of the flexible leveling member.

[0007] In a possible implementation, the groove wall surface of the contact groove comprises a groove bottom wall surface, a first groove side wall surface and a second groove side wall surface, the first groove side wall surface and the second groove side wall surface are respectively located on opposite sides of the groove bottom wall surface and connected with the groove bottom wall surface, and the distance between the first groove side wall surface and the second groove side wall surface gradually increases in a direction of the opening of the contact groove along the groove bottom wall surface; the contact surface is a circular arc surface, and the radius R of the contact surface is 20mm≤R≤60mm. The contact surface abuts against the first groove side wall surface and the second groove side wall surface. With this arrangement, the contact surface and the groove wall surface of the contact groove are always in point contact, which can reduce the machining precision of the flexible ball table and the flexible base, thereby reducing the assembly precision between the flexible ball table and the flexible base, and can also avoid the generation of bending and torsional moments on the flexible ball table, thereby preventing the bearing member placed on the flexible leveling member from being deformed due to the bending and torsional moments, and further helping to ensure that the leveling effect of the leveling device is better. Meanwhile, the contact surface and the groove wall surface of the contact groove are always in point contact during the leveling process, which can also make the maximum stress point of the flexible ball table always located on the contact surface of the flexible ball table, reduce local stress concentration, thereby also avoiding the generation of bending and torsional moments, and further helping to prevent the bearing member from being deformed due to the bending and torsional moments, and ensuring that the leveling effect of the leveling device is better.

[0008] In a possible implementation, an angle between the groove bottom wall surface and the first groove wall surface is 90°≤α≤120°, and / or, an angle between the groove bottom wall surface and the second groove wall surface is 90°≤β≤120°.

[0009] In a possible implementation, the flexible ball table is provided with a first through hole, which is located on a side of the flexible ball table close to the flexible base, penetrates the flexible ball table along a thickness direction of the flexible ball table, and is arranged at intervals with the second sub-hole. In this embodiment, the first through hole is a waist-shaped hole. The length direction of the first through hole is parallel to the contact surface. In this arrangement, the distance between the hole wall surface on the side of the first through hole close to the contact surface and the contact surface is the same, so as to ensure that the elastic force and the elastic recovery force generated when the flexible ball table is elastically deformed are basically the same, thereby avoiding large deformation of the flexible leveling member during leveling, making the modal of the flexible leveling member controllable, and helping to realize small deformation leveling of the leveling device.

[0010] In a possible implementation, the first through hole is two, and the two first through holes are respectively located on opposite sides of the second sub-hole. In this arrangement, more deformation space can be provided for the flexible ball table, so that the flexible ball table can better generate elastic force and elastic recovery force.

[0011] In a possible implementation, the flexible base is provided with a second through hole, which is located on a side of the flexible base close to the flexible ball table, penetrates the flexible base along a width direction of the flexible base, and is arranged at intervals with the first sub-hole. In this embodiment, the second through hole is a waist-shaped hole. The length direction of the second through hole is parallel to the groove wall surface of the contact groove. In this arrangement, the distance between the hole wall surface on the side of the second through hole close to the groove wall surface of the contact groove and the groove wall surface of the contact groove is the same, so as to ensure that the elastic force and the elastic recovery force generated when the flexible base is elastically deformed are basically the same, thereby avoiding large deformation of the flexible leveling member during leveling, making the modal of the flexible leveling member controllable, and helping to realize small deformation leveling of the leveling device.

[0012] In a possible implementation, the second through hole is two, and the two second through holes are respectively located on opposite sides of the first sub-hole. In this arrangement, more deformation space can be provided for the flexible base, so that the flexible base can better generate elastic force and elastic recovery force.

[0013] In a possible implementation, the flexible leveling member has an elastic modulus less than or equal to 60 Gpa, and the flexible base has a yield strength greater than or equal to 600 Mpa. For example, the flexible leveling member is made of a super-elastic nickel-titanium alloy material, so that the flexible leveling member has high rigidity and high elasticity.

[0014] In a possible implementation, each leveling fastener includes a head and a rod, the rod is arranged through one of the third fixing holes, one of the second fixing holes of the flexible leveling member, and one of the first fixing holes, and the head is fixedly connected to one end of the rod away from the carrier. The leveling device further includes a plurality of washers, each of the washers is sleeved on the rod of one of the leveling fasteners and clamped between the head of one of the leveling fasteners and the carrier. It can be understood that the washers can protect the carrier and prevent the surface of the carrier from being scratched due to friction with the leveling fasteners. At the same time, the washers are made of non-metallic materials, and the friction between the washers and the leveling fasteners in the leveling process is the friction between the metal material and the non-metallic material, so that metal chips or other particles are not generated, thereby reducing the pollution problem caused by metal friction in the leveling device and avoiding the impact on the environment.

[0015] In a possible implementation, the carrier further includes a plurality of assembly grooves, the assembly grooves are arranged at intervals, the opening of each assembly groove is located on the carrier surface, and each assembly groove is arranged around the circumferential side of one of the third fixing holes. The head of each leveling fastener is located in one of the assembly grooves, and the surface of the head of each leveling fastener away from the rod is located between the carrier surface and the groove bottom wall of the assembly groove. With this arrangement, the leveling fasteners can be prevented from protruding relative to the carrier surface, so that the leveling fasteners can prevent the connection reliability between the leveling object placed on the carrier and the carrier, prevent the leveling object from falling off the carrier, and thus ensure the normal performance of subsequent detection.

[0016] In a possible implementation, the carrier further includes a plurality of assembly grooves, the assembly grooves are arranged at intervals, the opening of each assembly groove is located on the carrier surface, and each assembly groove is arranged around the circumferential side of one of the third fixing holes. The head of each leveling fastener is located in one of the assembly grooves, and the surface of the head of each leveling fastener away from the rod is located between the carrier surface and the groove bottom wall of the assembly groove. With this arrangement, the leveling fasteners can be prevented from protruding relative to the carrier surface, so that the leveling fasteners can prevent the connection reliability between the leveling object placed on the carrier and the carrier, prevent the leveling object from falling off the carrier, and thus ensure the normal performance of subsequent detection.

[0017] In one possible implementation, the leveling device further includes a motion platform for driving the leveling device to move. In this configuration, the leveling device can move under the influence of the motion platform, thereby aligning the bearing surface of the leveling device with the testing instrument, facilitating the testing instrument's detection of the levelness of the bearing surface.

[0018] Thirdly, this application also provides a leveling method for a leveling device, comprising:

[0019] Step 1: Provide the leveling equipment as described above;

[0020] Step two: Use a testing instrument to check the levelness of the bearing surface;

[0021] Step 3: Adjust the multiple leveling fasteners according to the detection results of the detector to adjust the height of the multiple flexible leveling components.

[0022] In one possible implementation, after performing step one and before performing step two, the leveling method of the leveling device further includes: pre-tightening the plurality of leveling fasteners.

[0023] In one possible implementation, step three includes: determining whether the levelness of the bearing surface is within a preset levelness range; if the levelness of the bearing surface is within the preset levelness range, stopping the adjustment of the plurality of leveling fasteners; if the levelness of the bearing surface is not within the preset levelness range, adjusting the plurality of leveling fasteners to adjust the height of the plurality of flexible leveling components, and then performing step two. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0025] Figure 1 This is a schematic diagram of the structure of a leveling device provided in this application;

[0026] Figure 2 yes Figure 1 A schematic diagram of the leveling device in the leveling equipment shown;

[0027] Figure 3 yes Figure 2 An exploded view of the leveling device shown.

[0028] Figure 4 yes Figure 2 A schematic diagram of the leveling device after it has been cut open along point AA;

[0029] Figure 5 yes Figure 3Structure diagram of the bottom plate in the leveling device shown in the figure;

[0030] Figure 6 is Figure 3 Structure diagram of the flexible leveling member in the leveling device shown in the figure;

[0031] Figure 7 is Figure 6 Structure diagram of the flexible leveling member shown in the figure after being cut along B-B;

[0032] Figure 8 is Figure 6 Structure diagram of the flexible base in the flexible leveling member shown in the figure;

[0033] Figure 9 is Figure 6 Structure diagram of the flexible ball table in the flexible leveling member shown in the figure;

[0034] Figure 10 is Figure 3 Structure diagram of the bearing member in the leveling device shown in the figure;

[0035] Figure 11 is a flow chart of a leveling method of a leveling device provided by the present application.

[0036] Explanation of reference signs:

[0037] 10 - bottom plate;

[0038] 100 - leveling device; 110 - shell; 120 - moving platform; 130 - leveling device; 140 - detector; 101 - first surface; 102 - second surface; 103 - contact groove; 104 - first fixed hole; 10a - first central axis;

[0039] 20 - flexible leveling member; 21 - flexible base; 22 - flexible ball table; 23 - second fixed hole;

[0040] 20a - second central axis; 231 - first sub-hole; 232 - second sub-hole; 211 - contact groove; 211a - first groove side wall surface; 211b - second groove side wall surface; 211c - groove bottom wall surface; 213 - second through hole; 22a - support part; 22b - abutting part; 222 - first side surface; 223 - second side surface; 224 - contact surface; 225 - first through hole;

[0041] 30 - bearing member;

[0042] 30a - bearing surface; 31 - third fixed hole; 32 - assembly sink;

[0043] 40 - leveling fastener;

[0044] 41 - head; 42 - rod part;

[0045] 50 - washer. DETAILED DESCRIPTION

[0046] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0047] Please refer to Figure 1 , Figure 1 is a structural schematic diagram of a leveling device 100 provided by the present application.

[0048] The leveling device 100 of the present application can be used for leveling a wafer of a chip, and can also be applied to an optical detection device, an atomic force microscope (AFM) and other devices that need to be leveled, and the embodiments of the present application do not make strict limitations thereon. For example, in the chip manufacturing process, the leveling device 100 can be used to level the wafer of the chip to ensure the precision and accuracy of the wafer in detection or processing operations. For another example, when using an optical detection device to detect performance parameters such as shape, size and surface quality of a to-be-detected piece, the leveling device 100 in the optical detection device can be used to adjust the position of the to-be-detected piece to reduce measurement errors and ensure the accuracy of the detection results of the optical detection device.

[0049] In the present embodiment, the leveling device 100 can include a housing 110, a moving platform 120, a leveling device 130 and a detector 140. The moving platform 120, the leveling device 130 and the detector 140 are all installed in the housing 110. The moving platform 120 can move relative to the housing 110. The leveling device 130 is installed on the moving platform 120 and can move relative to the housing 110 under the driving of the moving platform 120. The leveling device 130 is used for leveling to ensure that the detection precision and result accuracy of a to-be-leveled piece placed on the leveling device 130 are high. The detector 140 is located on the side of the leveling device 130 away from the moving platform 120. The detector 140 is used for detecting the levelness of the leveling device 130. The leveling device 100 can level the leveling device 130 according to the levelness result of the leveling device 130 detected by the detector 140. In some other embodiments, the number of the leveling devices 130 can also be multiple. At this time, the multiple leveling devices 130 can be leveled simultaneously or sequentially, and the embodiments of the present application do not make any limitations thereon.

[0050] Please refer to Figures 2 to 4 , Figure 2 is Figure 1 a structural schematic diagram of the leveling device 130 in the leveling device 100 shown in Figure 3 is Figure 2 an exploded structural schematic diagram of the leveling device 130 shown inFigure 4 is Figure 2 is shown in FIG. 13B. In the drawing, the phrase "cut along A-A" means cutting along the plane where the line A-A lies, and similar descriptions hereinafter can be understood in the same way.

[0051] In this embodiment, the leveling device 130 includes a base plate 10, a plurality of flexible leveling members 20, a carrier 30, a plurality of leveling fasteners 40, and a plurality of gaskets 50. Specifically, the plurality of flexible leveling members 20 are mounted on the base plate 10 and are spaced apart from each other. The carrier 30 is mounted on the side of the plurality of flexible leveling members 20 away from the base plate 10. In the height direction of the leveling device 130, the carrier 30 is spaced apart from the base plate 10. The carrier 30 is used to carry a leveling object (not shown in the drawing). The plurality of leveling fasteners 40 are used to assemble the base plate 10, the plurality of flexible leveling members 20, and the carrier 30. During the leveling process, the leveling fasteners 40 are rotated, and the force of the leveling fasteners 40 is transmitted to the flexible leveling members 20 through the carrier 30, so that the flexible leveling members 20 are elastically deformed to change the height of the flexible leveling members 20, thereby changing the distance between the carrier 30 and the base plate 10, and further adjusting the levelness of the carrier 30 to make the levelness of the carrier 30 meet the detection requirements. In this process, the gaskets 50 can protect the surface of the carrier 30 to avoid scratching the surface of the carrier 30 due to friction with the leveling fasteners 40.

[0052] Please refer to Figure 4 and Figure 5 , Figure 5 is Figure 3 is shown in FIG. 13B. In the drawing, the phrase "cut along A-A" means cutting along the plane where the line A-A lies, and similar descriptions hereinafter can be understood in the same way.

[0053] In this embodiment, the base plate 10 is mounted on the motion platform 120. In this embodiment, the base plate 10 is made of a metal material. For example, the base plate 10 can be made of an aluminum alloy material (such as Al 7075). Specifically, the base plate 10 has a first central axis 10a. The base plate 10 is rotationally symmetrical about the first central axis 10a. The base plate 10 also has a first surface 101 and a second surface 102. In the thickness direction of the base plate 10, the first surface 101 and the second surface 102 are oppositely arranged.

[0054] The bottom plate 10 is also provided with a plurality of first fixing holes 104 and a plurality of contact grooves 103. The openings of the plurality of first fixing holes 104 and the plurality of contact grooves 103 are located on the first surface 101. Among them, the plurality of first fixing holes 104 are arranged at intervals. Each first fixing hole 104 is recessed from the first surface 101 to the direction away from the flexible leveling member 20. In the embodiment, the plurality of first fixing holes 104 all penetrate the bottom plate in the thickness direction of the bottom plate 10 and are arranged at intervals. For example, there are three first fixing holes 104. The diameter of the circumscribed circle formed by the centers of the three first fixing holes 104 is 230 mm, and the angle between the connecting line between the centers of the two adjacent first fixing holes 104 and the first central axis 10a of the bottom plate 10 is 120°. In the embodiment, each first fixing hole 104 is a threaded hole. Among them, the diameter of the internal thread of each first fixing hole 104 is 5 mm, and the pitch of each first fixing hole 104 is 0.5 mm.

[0055] The plurality of contact grooves 103 are recessed from the first surface 101 to the second surface 102. Each contact groove 103 is arranged around the circumferential side of a first fixing hole 104. In the embodiment, the plurality of contact grooves 103 are arranged at intervals around the first central axis 10a of the bottom plate 10. For example, there are three contact grooves 103. The three contact grooves 103 are rotationally symmetrical about the first central axis 10a of the bottom plate 10.

[0056] Please refer to Figure 4 、 Figure 6 and Figure 7 , Figure 6 is the structure diagram of the flexible leveling member 20 in the leveling device 130 shown in Figure 3 , Figure 7 is the cross-sectional structure diagram of the flexible leveling member 20 shown in Figure 6 along B-B.

[0057] The plurality of flexible leveling members 20 are located on the side of the second surface 102 facing the first surface 101. Among them, the plurality of flexible leveling members 20 are arranged at intervals around the first central axis 10a of the bottom plate 10. For example, there are three flexible leveling members 20. The three flexible leveling members 20 are arranged in a non-linear array. Among them, the "non-linear array" means that the three flexible leveling members 20 are not arranged in a straight line, but are arranged in a non-linear array in a complex and irregular manner. In other embodiments, the number of flexible leveling members 20 can also be two, four or more than four, and the embodiments of the present application do not strictly limit this. Among them, when the number of flexible leveling members 20 is two, the two flexible leveling members 20 are respectively located on the opposite sides of the first central axis 10a of the bottom plate 10. When the number of flexible leveling members 20 is four or more than four, the four or more than four flexible leveling members 20 can also be arranged in a non-linear array.

[0058] In the embodiment, each flexible leveling member 20 is installed in a contact groove 103 of the bottom plate 10, and is elastically deformed along the height direction of the flexible leveling member 20. In the embodiment, each flexible leveling member 20 has a second central axis 20a. In the length direction of the flexible leveling member 20, each flexible leveling member 20 is mirror-symmetrical about the second central axis 20a.

[0059] Specifically, each flexible leveling member 20 is provided with a second fixing hole 23. The second fixing hole 23 penetrates the flexible leveling member 20 along the height direction of the flexible leveling member 20, and is in communication with a first fixing hole 104 of the bottom plate 10. The center of the second fixing hole 23 coincides with the second central axis 20a of the flexible leveling member 20. Specifically, the second fixing hole 23 of each flexible leveling member 20 includes a first sub-hole 231 and a second sub-hole 232. The first sub-hole 231 is located on the side of the second sub-hole 232 facing the first surface 101 of the bottom plate 10, and is in communication with the second sub-hole 232.

[0060] Each flexible leveling member 20 includes a flexible base 21 and a flexible ball table 22. The flexible base 21 of each flexible leveling member 20 is installed on the first surface 101 and located in a contact groove 103 of the bottom plate 10. The flexible ball table 22 is installed on the side of the flexible base 21 away from the first surface 101 of the bottom plate 10. In addition, for example, the elastic modulus of each flexible leveling member 20 is less than or equal to 60 Gpa, and the yield strength of each flexible leveling member 20 is greater than or equal to 600 Mpa. Specifically, the elastic modulus of the flexible base 21 is less than or equal to 60 Gpa, and the yield strength of the flexible base 21 is greater than or equal to 600 Mpa, and / or the elastic modulus of the flexible ball table 22 is less than or equal to 60 Gpa, and the yield strength of the flexible ball table 22 is greater than or equal to 600 Mpa. In the embodiment, the flexible base 21 and the flexible ball table 22 are made of super-elastic inner titanium alloy material, so that the flexible base 21 and the flexible ball table 22 have high rigidity and high elasticity, and the flexible leveling member 20 as a whole has high rigidity and high elasticity. In other embodiments, the flexible base 21 and the flexible ball table 22 can also be made of other materials with low elastic modulus and high yield height, so that the flexible base 21 and the flexible ball table 22 can have high rigidity and high elasticity, and the embodiments of the present application do not make strict limitations in this regard.

[0061] Please refer to Figure 7 and Figure 8 , Figure 8 is Figure 6 the structure diagram of the flexible base 21 in the flexible leveling member 20 shown in

[0062] In the embodiment, the flexible base 21 is provided with a first sub-hole 231 and a contact groove 211. The first sub-hole 231 penetrates the flexible base 21 along the height direction of the flexible base 21 and is in communication with the first fixing hole 104. The center of the first sub-hole 231 coincides with the central axis of the flexible base 21. The opening of the contact groove 211 is located on the surface of the flexible base 21 away from the first surface 101. The contact groove 211 is recessed from the surface of the flexible base 21 facing the flexible ball table 22 to the direction away from the flexible ball table 22, penetrates the two surfaces in the width direction of the flexible base 21, and is in communication with the first sub-hole 231. For example, the cross-sectional shape of the contact groove 211 parallel to the height direction of the flexible base 21 is V-shaped.

[0063] Specifically, the groove wall surface of the contact groove 211 includes a first groove side wall surface 211a, a second groove side wall surface 211b, and a groove bottom wall surface 211c. The first groove side wall surface 211a and the second groove side wall surface 211b are respectively located on the opposite sides of the groove bottom wall surface 211c and are connected with the groove bottom wall surface 211c. In the direction from the groove bottom wall surface 211c to the opening of the contact groove 211, the distance between the first groove side wall surface 211a and the second groove side wall surface 211b gradually increases. In other words, the first groove side wall surface 211a and the second groove side wall surface 211b are both inclined relative to the groove bottom wall surface 211c. The included angle α between the groove bottom wall surface 211c and the first groove side wall surface 211a is 90°≤α≤120°, and / or the included angle β between the groove bottom wall surface 211c and the second groove side wall surface 211b is 90°≤β≤120°. For example, the included angle α between the groove bottom wall surface 211c and the first groove side wall surface 211a is 120°, and the included angle β between the groove bottom wall surface 211c and the second groove side wall surface 211b is 120°.

[0064] In addition, the flexible base 21 is further provided with a second through hole 213. The second through hole 213 penetrates the flexible base 21 along the width direction of the flexible base 21, and is located on the side of the flexible base 21 close to the flexible ball table 22, and is spaced apart from the contact groove 211 and the first sub-hole 231. In the embodiment, the second through hole 213 is a waist-shaped hole. The length direction of the second through hole 213 is parallel to the groove wall surface of the contact groove 211. Under this arrangement, the distance between the hole wall surface of the side of the second through hole 213 close to the groove wall surface of the contact groove 211 and the groove wall surface of the contact groove 211 is the same, so as to ensure that the elastic force and the elastic recovery force generated when the flexible base 21 elastically deforms are basically the same, thereby avoiding the occurrence of large deformation of the flexible leveling member 20 during the leveling process, making the modal of the flexible leveling member 20 controllable, and helping to realize small deformation leveling of the leveling device 130. For example, the second through hole 213 has two. Along the length direction of the flexible base 21, the two second through holes 213 are respectively located on the opposite sides of the first sub-hole 231. Among them, one second through hole 213 is arranged close to the first groove side wall surface 211a of the contact groove 211, and the other second through hole 213 is arranged close to the second groove side wall surface 211b of the contact groove 211. When the flexible base 21 is extruded, the flexible base 21 will elastically deform. At this time, the second through hole 213 can provide a deformation space for the flexible base 21, so that the flexible base 21 can better generate elastic force and elastic recovery force. In other embodiments, the number of second through holes 213 can also be one, three or more than three.

[0065] Please refer to Figure 6 , Figure 7 and Figure 9 , Figure 9 is Figure 6 the structure diagram of the flexible ball table 22 in the flexible leveling member 20 shown in FIG. 1.

[0066] In the embodiment, the flexible ball table 22 is located in the contact groove 211 of the flexible base 21. For example, the flexible ball table 22 is generally in the shape of a hemisphere. Specifically, the flexible ball table 22 is provided with a second sub-hole 232. The second sub-hole 232 penetrates the flexible ball table 22 along the height direction (the direction of the Z axis shown in the figure) of the flexible ball table 22, so as to communicate with the first sub-hole 231 of the flexible base 21. Among them, the center of the second sub-hole 232 coincides with the center axis of the flexible ball table 22. The flexible ball table 22 further includes a support part 22a and an abutting part 22b, and the abutting part 22b is fixedly connected to one side of the support part 22a in the thickness direction. Among them, the support part 22a is used to support the bearing member 30. The abutting part 22b is located on the side of the support part 22a facing the flexible base 21. For example, the abutting part 22b is generally in the shape of a semicircular plate.

[0067] In the embodiment, the abutting portion 22b is installed on the contact groove 211 of the flexible base 21, and the peripheral side surface of the abutting portion 22b abuts against the groove wall surface of the contact groove 211. The peripheral side surface of the abutting portion 22b includes a first side surface 222, a second side surface 223, and a contact surface 224. The first side surface 222 and the second side surface 223 are spaced apart and opposite to each other along the thickness direction of the abutting portion 22b. The contact surface 224 is located on the side of the flexible ball table 22 facing the contact groove 211, and is connected between the peripheral side surfaces of the first side surface 222, the second side surface 223, and the supporting portion 22a, and abuts against the groove wall surface of the contact groove 211. In the embodiment, the contact surface 224 abuts against the first groove side wall surface 211a and the second groove side wall surface 211b of the contact groove 211. For example, the contact surface 224 is a circular arc surface. The radius R of the contact surface 224 is 20mm≤R≤60mm. For example, the radius R of the contact surface 224 is 35mm.

[0068] It can be understood that, since the contact surface 224 is a circular arc surface, when the flexible ball table 22 is installed on the contact groove 211 of the flexible base 21, the contact surface 224 abuts against the first groove side wall surface 211a and the second groove side wall surface 211b of the contact groove 211, that is, the contact surface 224 always point contacts with the groove wall surface of the contact groove 211. On the one hand, the machining precision requirements of the flexible ball table 22 and the flexible base 21 can be reduced, thereby reducing the assembly precision requirements between the flexible ball table 22 and the flexible base 21. On the other hand, the bending and torsional moment of the flexible ball table 22 can be avoided, thereby preventing the deformation of the load bearing member 30 placed on the flexible leveling member 20 due to the bending and torsional moment, and further helping to ensure that the leveling effect of the leveling device 130 is better. At the same time, the maximum stress point of the flexible ball table 22 is always located on the contact surface 224 of the flexible ball table 22 during the leveling process, which reduces local stress concentration, thereby also avoiding the generation of bending and torsional moment, and further helping to prevent the deformation of the load bearing member 30 due to the bending and torsional moment, and ensuring that the leveling effect of the leveling device 130 is better.

[0069] In addition, the flexible ball table 22 is also provided with a first through hole 225. Specifically, the abutting portion 22b is provided with the first through hole 225. The first through hole 225 penetrates the abutting portion 22b of the flexible ball table 22 along the thickness direction of the abutting portion 22b of the flexible ball table 22, and is located on the side of the abutting portion 22b of the flexible ball table 22 close to the flexible base 21, and is spaced apart from the second sub-hole 232.

[0070] In this embodiment, the first through hole 225 is a waist-shaped hole. The length direction of the first through hole 225 is parallel to the contact surface 224. In this arrangement, the distance between the hole wall surface of the first through hole 225 on the side close to the contact surface 224 and the contact surface 224 is the same, so as to ensure that the elastic force and the elastic recovery force generated when the flexible ball table 22 is elastically deformed are basically the same, thereby avoiding large deformation of the flexible leveling member 20 during leveling, making the mode of the flexible leveling member 20 controllable, and helping to achieve small deformation leveling of the leveling device 130. For example, the first through hole 225 has two. The two first through holes 225 are respectively located on the opposite sides of the second sub-hole 232. When the flexible ball table 22 is pressed, the flexible ball table 22 will be elastically deformed. At this time, the first through hole 225 can provide a deformation space for the flexible ball table 22, so that the flexible ball table 22 can better generate elastic force and elastic recovery force. In other embodiments, the number of second through holes 213 can also be one, three or more than three.

[0071] Please refer to Figure 4 and Figure 10 , Figure 10 is Figure 3 the structure diagram of the bearing member 30 in the leveling device 130 shown in FIG. 1.

[0072] The bearing member 30 is located on the side of the plurality of flexible leveling members 20 away from the first surface 101 of the base plate 10. Specifically, the bearing member 30 is located on the side of the flexible ball table 22 of the plurality of flexible leveling members 20 away from the flexible base 21, and abuts against the support portion 22a of the flexible ball table 22 in the plurality of flexible leveling members 20. For example, the bearing member 30 is substantially disc-shaped. The central axis of the bearing member 30 coincides with the first central axis 10a of the base plate 10.

[0073] The bearing member 30 has a bearing surface 30a away from the plurality of flexible leveling members 20. The bearing surface 30a is used to bear the object to be leveled (not shown in the figure). In the height direction of the leveling device 100, the detector 140 is located on the side of the bearing surface 30a away from the plurality of flexible leveling members 20, and is spaced apart and opposite to the bearing surface 30a, so that the detector 140 can detect the levelness of the bearing surface 30a.

[0074] In this embodiment, the bearing member 30 is a wafer chuck. The bearing surface 30a is used to bear the wafer. In other embodiments, the bearing member 30 can also be other components used to bear the object to be leveled. For example, in an atomic force microscope, the bearing member 30 can also be a stage in a rotating device used for leveling.

[0075] In the embodiment, the carrier 30 is further provided with a plurality of third fixing holes 31 and a plurality of assembly grooves 32. The plurality of third fixing holes 31 are each penetrated through the carrier 30 along the thickness direction of the carrier 30 and are arranged at intervals. For example, the third fixing holes 31 are three in number. Each of the third fixing holes 31 is in communication with the second fixing hole 23 of a flexible leveling piece 20. In addition, the center of each of the third fixing holes 31 coincides with the second center axis 20a of a flexible leveling piece 20. In this arrangement, the center of each of the third fixing holes 31, the center of the second fixing hole 23 of a flexible leveling piece 20 and the center of a first fixing hole 104 all coincide.

[0076] The plurality of assembly grooves 32 are each open at the carrier surface 30a. The plurality of assembly grooves 32 are each recessed from the carrier surface 30a toward the flexible ball table 22. Each of the assembly grooves 32 is arranged around the circumferential side of a third fixing hole 31. The plurality of assembly grooves 32 are each used for mounting the gasket 50 of the leveling device 130.

[0077] Please refer to Figure 4 . Each of the leveling fasteners 40 is arranged through a third fixing hole 31 of the carrier 30, a second fixing hole 23 of a flexible leveling piece 20 and a first fixing hole of the bottom plate 10 and is fixed with the bottom plate 10, so that the carrier 30 and the flexible leveling piece 20 are assembled with the bottom plate 10. Each of the leveling fasteners 40 is arranged through the second sub-hole 232 and the first sub-hole 231 of the second fixing hole 23. Each of the leveling fasteners 40 is used for adjusting the height of a flexible leveling piece 20.

[0078] It can be understood that, since the center of each of the third fixing holes 31, the center of the second fixing hole 23 of a flexible leveling piece 20 and the center of a first fixing hole 104 all coincide, when the distance between the carrier 30 and the first surface 101 of the bottom plate 10 is adjusted by using the leveling fasteners 40, the bending and torsional moment can be prevented from being generated, so that the carrier 30 can be prevented from being deformed due to the bending and torsional moment, the influence of the leveling fasteners 40 on the appearance of the carrier 30 in the leveling and fastening process can be reduced, and further the small deformation leveling of the leveling device 130 can be facilitated.

[0079] In the embodiment, each leveling fastener 40 is made of metal material. For example, each leveling fastener 40 is made of titanium alloy material. In the embodiment, each leveling fastener 40 is a screw rod. Specifically, each leveling fastener 40 has a thread specification of M5 and a pitch of 0.5 mm. Each leveling fastener 40 includes a head 41 and a rod 42 fixedly connected to one side of the head 41. The rod 42 is sequentially arranged in one third fixing hole 31 of the carrier 30, one second fixing hole 23 of the flexible leveling piece 20, and one first fixing hole 104 of the bottom plate 10, and fixed to the bottom plate 10. The head 41 is fixedly connected to one end of the rod 42 away from the carrier 30. Specifically, the head 41 of each leveling fastener 40 is located in one assembly sink 32 of the carrier 30, and the surface of the head 41 of each leveling fastener 40 away from the rod 42 is located between the bottom wall of the assembly sink 32 and the carrier surface 30a. In this way, the leveling fastener 40 is prevented from protruding relative to the carrier surface 30a, thereby preventing the leveling fastener 40 from affecting the connection reliability between the to-be-leveled piece placed on the carrier 30 and the carrier 30, avoiding the to-be-leveled piece from falling off the carrier 30, and further ensuring the normal performance of subsequent detection.

[0080] Each gasket 50 is sleeved on one leveling fastener 40 and located in one assembly sink 32 of the carrier 30. Specifically, each gasket 50 is sleeved on the rod 42 of one leveling fastener 40 and clamped between the head 41 of one leveling fastener 40 and the carrier 30. For example, the gasket 50 is made of non-metal material to protect the surface of the carrier 30 and prevent the surface of the carrier 30 from being scratched due to friction with the leveling fastener 40. In addition, since the gasket 50 is made of non-metal material, the friction between the gasket 50 and the leveling fastener 40 during the leveling process is the friction between metal and non-metal materials, which does not generate metal chips or other particles, thereby reducing the pollution problem caused by metal friction in the leveling device 130 and avoiding the impact on the environment.

[0081] Please continue to refer to Figure 4 During the assembly of the leveling device 130, the flexible base 21 of each flexible leveling piece 20 is first installed in the contact groove 103 of the bottom plate 10, and the first sub-hole 231 of the flexible base 21 corresponds to and communicates with the first fixing hole 104 in the contact groove 103. Then, the flexible ball table 22 of each flexible leveling piece 20 is installed in the contact groove 211 of the flexible base 21, and the second sub-hole 232 of the flexible ball table 22 corresponds to and communicates with the first sub-hole 231 of the flexible base 21, so that the second fixing hole 23 communicates with the first fixing hole 104, facilitating the subsequent installation of the leveling fastener 40.

[0082] After the plurality of flexible leveling pieces 20 are assembled with the bottom plate 10, the carrier 30 is placed on the side of the plurality of flexible leveling pieces 20 away from the bottom plate 10, and each third fixing hole 31 of the carrier 30 is correspondingly and communicatively connected with the second fixing hole 23 of one flexible leveling piece 20. Then, each gasket 50 is sleeved on the rod portion 42 of one leveling fastener 40. Then, the rod portion 42 of each leveling fastener 40 is sequentially inserted through the third fixing hole 31 of the carrier 30, the second sub-hole 232 of the flexible ball table 22, the first sub-hole 231 of the flexible base 21, and the first fixing hole 104 of the bottom plate 10. Finally, the leveling fastener 40 is tightened by the mutual cooperation between the threads of the leveling fastener 40 and the threads of the first fixing hole 104, so as to fix the leveling fastener 40 with the bottom plate 10, thereby realizing the assembly of the carrier 30 with the bottom plate 10 and the flexible leveling pieces 20. At this time, each gasket 50 is located in one assembly sink groove 32 of the carrier 30 and between the head portion 41 of one leveling fastener 40 and the groove bottom wall of one assembly sink groove 32, so as to avoid the surface of the carrier 30 being abraded by the leveling fastener 40 during the assembly process, thereby helping to prolong the service life of the carrier 30.

[0083] In the embodiment, when the leveling fastener 40 is tightened, the distance between the carrier 30 and the first face 101 of the bottom plate 10 changes, and the plurality of flexible leveling pieces 20 are pressed, so as to adjust the height of the plurality of flexible leveling pieces 20, and further adjust the levelness of the carrier face 30a of the carrier 30, so that the levelness of the carrier face 30a meets the detection requirements. In this process, the force of the leveling fastener 40 is transmitted to the flexible ball table 22 through the carrier 30, the flexible ball table 22 is elastically deformed under the pressure and presses the flexible base 21, so that the flexible base 21 is also elastically deformed, thereby changing the overall height of the flexible leveling piece 20, and realizing the adjustment of the levelness of the carrier face 30a of the carrier 30. Under this setting, the fastening operation of the leveling device 130 is also the leveling operation, which can simultaneously perform the fastening operation and the leveling operation, not only can realize the efficient leveling of the leveling device 130, but also can avoid the interference of the secondary fastening operation on the leveling result of the leveling device 130, realize the high-precision leveling of the leveling device 130, and ensure that the leveling effect of the leveling device 130 is better.

[0084] It should be noted that in the actual leveling process, the operator first installs a certain pre-tightening force to pre-tighten and fix each leveling fastener 40, and then uses the detector 140 to detect the levelness of the carrier 30. Then, according to the levelness result of the carrier 30 detected by the detector 140, the pre-tightening force of each leveling fastener 40 is adjusted in sequence, so as to adjust the height of the flexible leveling piece 20, thereby making the levelness of the carrier 30 meet the detection requirements.

[0085] The leveling device 130 provided in the present application can change the distance between the bearing part 30 and the first surface 101 of the base plate 10 by fastening the leveling fastener 40, thereby extruding the plurality of flexible leveling parts 20, changing the height of the plurality of flexible leveling parts 20, providing leveling feed for the leveling device 130, changing the levelness of the bearing surface 30a, and realizing the leveling operation of the leveling device 130. In this arrangement, on the one hand, the leveling device 130 can realize the integrated design of leveling and fastening, so that the leveling and fastening of the leveling device 130 are completed at one time, thereby reducing the interference of fastening operation on leveling operation, realizing efficient leveling in limited space, thereby improving the leveling efficiency of the leveling device 130, thereby helping to speed up the production rhythm of the chip and improve the production efficiency of the chip. On the other hand, the leveling device 130 has a simple and compact structure, thereby facilitating the maintainability of the leveling device 130 and facilitating the maintenance of the leveling device 130.

[0086] At the same time, the integrated design of leveling and fastening of the leveling device 130 can also make the acting force generated by leveling and the acting force generated by fastening be collinear, thereby avoiding the generation of external torsional moment, preventing the bearing part 30 from being deformed due to the bending torsional moment, and further reducing the influence of leveling and fastening operation on the topography precision of the bearing part 30, thereby ensuring the better leveling effect of the leveling device 130 on the to-be-leveled part.

[0087] In addition, the flexible ball table 22 and the flexible base 21 of the leveling device 130 have high rigidity, so that the rigidity of the flexible ball table 22 and the flexible base 21 is controllable, thereby the rigidity of the whole flexible leveling part 20 can be controlled, the modal of the whole leveling device 130 is controllable, thereby the leveling device 130 will not deform when it is driven by the motion platform 120 to move at high speed, on the one hand, the use reliability of the leveling device 130 can be improved, on the other hand, the measurement speed can also be improved, thereby the production rhythm of the chip can also be speeded up and the production efficiency of the chip can also be improved.

[0088] The present application also provides a leveling method of the leveling equipment 100.

[0089] Please refer to Figure 11 , Figure 11 is a flow chart of the leveling method of the leveling equipment 100 provided in the present application.

[0090] Step one S1, providing a leveling device 130.

[0091] Step two S2, detecting the levelness of the bearing surface 30a by using the detector 140.

[0092] After the step one S1 is performed, and before the step two S2 is performed, the leveling method of the leveling device 100 further comprises: pre-tightening the plurality of leveling fasteners 40.

[0093] Step three S3, adjusting the plurality of leveling fasteners 40 according to the detection result of the detector 140 to adjust the height of the plurality of flexible leveling members 20.

[0094] In the above step three S3, it comprises: judging whether the levelness of the bearing surface 30a is within a preset levelness range. When the levelness of the bearing surface 30a is within the preset levelness range, stop adjusting the plurality of leveling fasteners 40. When the levelness of the bearing surface 30a is not within the preset levelness range, adjust the plurality of leveling fasteners 40 to adjust the height of the plurality of flexible leveling members 20, and perform the step two S2.

[0095] The above is only part of the embodiments and implementations of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A levelling device characterised in that, The leveling device comprises a base plate, a plurality of flexible leveling members, a carrier and a plurality of leveling fasteners, the base plate has a first surface, the base plate is provided with a plurality of first fixing holes, the first fixing holes are arranged at intervals, and the opening of each fixing hole is located on the first surface; The flexible leveling members are installed on the first surface, each flexible leveling member can be elastically deformed along the height direction of the flexible leveling member, each flexible leveling member is provided with a second fixing hole, the second fixing hole penetrates the flexible leveling member along the height direction of the flexible leveling member and communicates with the first fixing hole, each flexible leveling member comprises a flexible base and a flexible ball table, the flexible base is installed on the first surface, the flexible base is provided with a first sub-hole, the first sub-hole penetrates the flexible base along the height direction of the flexible base and communicates with the first fixing hole, the flexible ball table is installed on the side of the flexible base away from the first surface, the flexible ball table is provided with a second sub-hole, the second sub-hole penetrates the flexible ball table along the height direction of the flexible ball table and communicates with the first sub-hole, wherein the second fixing hole comprises the first sub-hole and the second sub-hole; The flexible ball table is further provided with a first through hole, the first through hole is located on the side of the flexible ball table close to the flexible base, penetrates the flexible ball table along the thickness direction of the flexible ball table, and is arranged at intervals with the second sub-hole, and / or the flexible base is provided with a second through hole, the second through hole is located on the side of the flexible base close to the flexible ball table, penetrates the flexible base along the width direction of the flexible base, and is arranged at intervals with the first sub-hole; The carrier is installed on the side of the flexible leveling members away from the first surface and located on the side of the flexible ball table away from the flexible base, the carrier has a carrier surface away from the flexible leveling members, the carrier surface is used for carrying a leveling member to be adjusted, and the carrier is provided with a plurality of third fixing holes, each third fixing hole penetrates the carrier along the thickness direction of the carrier and communicates with the second fixing hole of one flexible leveling member; Each leveling fastener is arranged in one third fixing hole, one second fixing hole of one flexible leveling member and one first fixing hole, and each leveling fastener is used for adjusting the height of one flexible leveling member.

2. Levelling device according to claim 1, characterized in that The flexible base is provided with a contact groove, the opening of the contact groove is located on the surface of the flexible base away from the first surface, and the contact groove communicates with the first sub-hole; The flexible ball table is located in the contact groove, the flexible ball table has a contact surface facing the contact groove, and the contact surface abuts against the groove wall surface of the contact groove.

3. Levelling device according to claim 2, characterized in that The slot wall surface of the contact slot comprises a slot bottom wall surface, a first slot side wall surface and a second slot side wall surface, the first slot side wall surface and the second slot side wall surface are respectively located at opposite sides of the slot bottom wall surface, and are connected with the slot bottom wall surface, and the distance between the first slot side wall surface and the second slot side wall surface gradually increases in the direction of the slot bottom wall surface to the opening of the contact slot; The contact surface is a circular arc surface, and the contact surface abuts against the first slot side wall surface and the second slot side wall surface.

4. Levelling device according to claim 3, characterized in that The radius R of the contact surface is 20 mm≤R≤60 mm.

5. Levelling device according to claim 3 or 4, characterized in that The included angle α between the slot bottom wall surface and the first slot side wall surface is 90°≤α≤120°, and / or the included angle β between the slot bottom wall surface and the second slot side wall surface is 90°≤β≤120°.

6. Levelling device according to claim 1, characterized in that When the flexible ball table is provided with the first through hole, the first through hole has two, and the two first through holes are respectively located at opposite sides of the second sub-hole.

7. Levelling device according to claim 1, characterized in that When the flexible base is provided with the second through hole, the second through hole has two, and the two second through holes are respectively located at opposite sides of the first sub-hole.

8. Levelling device according to claim 1, characterized in that The elastic modulus of the flexible leveling member is less than or equal to 60 Gpa, and the yield strength of the flexible leveling member is greater than or equal to 600 Mpa.

9. Levelling device according to claim 8, characterized in that The flexible leveling member is made of super-elastic nickel-titanium alloy material.

10. Levelling device according to claim 1, characterized in that Each leveling fastener comprises a head and a rod portion, the rod portion is arranged in one third fixing hole, one second fixing hole of the flexible leveling member and one first fixing hole, and the head is fixedly connected to one end of the rod portion away from the bearing member; The leveling device further comprises a plurality of gaskets, each gasket is sleeved on the rod portion of one leveling fastener, and is clamped between the head of one leveling fastener and the bearing member.

11. Levelling device according to claim 10, characterized in that The bearing member is further provided with a plurality of assembly grooves, the plurality of assembly grooves are arranged at intervals, the opening of each assembly groove is located on the bearing surface, and each assembly groove is arranged around the circumferential side of one third fixing hole; The head of each leveling fastener is located in one assembly groove, and the surface of the head of each leveling fastener away from the rod portion is located between the bearing surface and the slot bottom wall surface of the assembly groove.

12. Levelling apparatus characterised in that The leveling device comprises a detector and a leveling device as claimed in any one of claims 1 to 11, and the detector is located on the side of the bearing surface away from the plurality of flexible leveling members in the height direction of the leveling equipment, and is used for detecting the levelness of the bearing surface.

13. Levelling apparatus according to claim 12, characterised in that The leveling equipment further comprises a movement platform for driving the leveling device to move.

14. A leveling method of a leveling apparatus, characterized by, The leveling method of the leveling equipment comprises the following steps: Step one, providing the leveling equipment as claimed in claim 12 or 13; Step two, detecting the levelness of the bearing surface by using a detector; Step three, adjusting the plurality of leveling fasteners according to the detection result of the detector to adjust the height of the plurality of flexible leveling members.

15. Levelling method of a levelling device according to claim 14, characterized in that After the step one is performed, and before the step two is performed, the leveling method of the leveling equipment further comprises: pre-tightening the plurality of leveling fasteners.

16. The leveling method of a leveling apparatus according to claim 14, wherein The step three comprises: judging whether the levelness of the bearing surface is within a preset levelness range; when the levelness of the bearing surface is within the preset levelness range, stopping adjusting the leveling fasteners; when the levelness of the bearing surface is not within the preset levelness range, adjusting the leveling fasteners to adjust the height of the flexible leveling members, and performing the step two.

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