Shielding assembly and semiconductor processing equipment

Abstract

The utility model discloses a shielding assembly and semiconductor processing equipment. The shielding assembly comprises a shielding baffle; the baffle arm is used for enabling the shielding baffle to move between the storage position and the shielding position; the baffle arm comprises a bearing part, the bearing part is provided with a horizontal bearing surface, a fixing pin is arranged on the bearing surface, and the fixing pin is in a prismatic table shape or a prism shape; the shielding baffle is located on the bearing face, a fixing groove matched with the fixing pin in shape is formed in the side, facing the baffle arm, of the shielding baffle, and the fixing pin is inserted into the fixing groove. At the shielding position, the projection, on the supporting surface of the base, of the shielding baffle completely covers the projection, on the supporting surface of the base, of the workpiece to be machined; and when the shielding baffle is at the storage position, the shielding baffle is not overlapped with the supporting surface of the base in the direction perpendicular to the supporting surface of the base. According to the shielding assembly and the semiconductor processing equipment, particulate matters generated by friction between the shielding baffle and the baffle arm can be effectively limited.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a shielding assembly and a semiconductor processing equipment. BACKGROUND

[0002] In a physical vapor deposition (PVD) process, process gas including inert gas and reactive gas is supplied into a chamber, and direct current or radio frequency power is applied to a target to excite plasma and bombard the target. Target particles sputtered from the target fall on a workpiece to form a film. While the target particles are deposited on the workpiece, the target particles are also deposited on chamber walls and other components. In order to prevent the sputtered material from being deposited directly on the chamber walls and other components, a process kit is usually added inside the PVD chamber to protect the chamber walls. In order to ensure the process results, when the deposited film on the process kit reaches a certain thickness, the process chamber needs to be opened to replace the process kit.

[0003] The process chamber needs to be kept in a vacuum state at all times. Only when the target or the process kit is replaced, the process chamber is opened, and after the replacement is completed, the chamber is restored to a vacuum state. The target exposed to the atmosphere will react with the atmosphere and be oxidized on the surface. Therefore, at the beginning of the chamber recovery, the surface of the target has defects and cannot be used for normal processes. Usually, a shutter disk is used to cover the pedestal, and then a burn-in process is performed to sputter the defective part of the target surface onto the shutter disk. After the defective part is sputtered away, the shutter disk is removed, and normal processes can be performed.

[0004] The shutter disk moves between the storage position and the shielding position through a shutter arm. However, during the movement of the shutter disk driven by the shutter arm, the shutter disk is prone to rotating relative to the shutter arm due to inertia. When the shutter disk rotates, it will rub against the shutter arm and generate particles, which will affect the chamber environment of the chamber where the shutter disk and the shutter arm are located.

[0005] The PVD technology mainly uses an electrostatic chuck (ESC) to support the workpiece. The particles generated by friction will pollute the environment of the process chamber, and the particles falling on the ESC will cause the back pressure of the workpiece to deteriorate. Although the rotation of the shutter disk can be suppressed and the generation of particles can be reduced by greatly reducing the moving speed of the shutter arm, the improvement effect of the back pressure of the workpiece is still not ideal.

[0006] Therefore, improvements need to be made to at least partially solve the above problems. CONTENT OF THE INVENTION

[0007] A series of simplified concepts are introduced in the utility model content part, which will be further described in detail in the specific embodiment part. The utility model content part of the utility model does not mean trying to limit the key features and necessary technical features of the claimed technical solution, nor does it mean trying to determine the protection scope of the claimed technical solution.

[0008] In order to at least partially solve the above problems, according to the first aspect of the utility model, a shielding assembly is provided, which comprises:

[0009] A shielding baffle; and

[0010] A baffle arm for moving the shielding baffle between a storage position and a shielding position;

[0011] The baffle arm comprises a bearing part, the bearing part has a horizontal bearing surface, a fixing pin is arranged on the bearing surface, the fixing pin is in the shape of a truncated pyramid or a prism; the shielding baffle is located on the bearing surface, and a fixing groove matched with the shape of the fixing pin is arranged on the side of the shielding baffle facing the baffle arm, and the fixing pin is inserted into the fixing groove.

[0012] In the shielding position, the projection of the shielding baffle on the support surface of the base completely covers the projection of the workpiece to be processed on the support surface of the base; in the storage position, the shielding baffle does not overlap with the support surface of the base in the direction perpendicular to the support surface of the base.

[0013] Illustratively, the fixing pin is in the shape of a three-truncated pyramid.

[0014] Illustratively, the fixing pin is in the shape of a four-truncated pyramid.

[0015] Illustratively, the fixing pin is in the shape of a five-truncated pyramid.

[0016] Illustratively, the fixing pin is in the shape of a three-prism.

[0017] Illustratively, the fixing pin is in the shape of a four-prism.

[0018] Illustratively, the fixing pin is in the shape of a five-prism.

[0019] Illustratively, the fixing pin is provided with a chamfer at the edge of the side away from the bearing surface;

[0020] The side edge of the fixing pin is provided with a chamfer.

[0021] Illustratively, the baffle arm is provided with a positioning hole penetrating through the fixing pin and the bearing part in the vertical direction.

[0022] According to the second aspect of the utility model, a kind of semiconductor processing equipment is provided, it includes chamber, the chamber includes pedestal and the shielding assembly described above.

[0023] According to the shielding assembly and the semiconductor processing equipment of the utility model, the fixed pin and the fixed slot are matched in shape with the fixed pin being prismatic or prism-shaped and the fixed slot being engaged with the shielding baffle by the baffle arm, the fixed pin and the fixed slot can effectively limit the shielding baffle from rotating relative to the baffle arm due to inertia during the movement of the baffle arm driving the shielding baffle, so that the generation of particulate matter caused by the friction between the shielding baffle and the baffle arm can be effectively avoided, the environment of the process chamber is improved, and the back pressure condition of the workpiece to be processed is improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The following drawings of the present application are hereby incorporated as part of the present application for the purpose of understanding the present application. The embodiments of the present application and their description shown in the drawings are used to explain the devices and principles of the present application. In the drawings,

[0025] Figure 1 It is a structural schematic view of the shielding assembly and the pedestal according to an embodiment of the present application.

[0026] Figure 2 It is a schematic view of the baffle arm moving the shielding baffle between the storage position and the shielding position.

[0027] Figure 3 It is a structural schematic view of the fixed pin according to an embodiment of the present application.

[0028] Figure 4 It is a structural schematic view of the fixed pin according to an embodiment of the present application.

[0029] Figure 5 It is a structural schematic view of the fixed pin according to an embodiment of the present application.

[0030] Figure 6 It is a structural schematic view of the fixed pin according to an embodiment of the present application.

[0031] Figure 7 It is a structural schematic view of the fixed pin according to an embodiment of the present application.

[0032] Figure 8 It is a structural schematic view of the fixed pin according to an embodiment of the present application.

[0033] Explanation of reference signs:

[0034] 100-shielding baffle, 110-fixed slot;

[0035] 200-baffle arm, 210-bearing part, 211-fixed pin, 2111-chamfer, 2112-chamfer, 212-positioning hole;

[0036] 300 - base. DETAILED DESCRIPTION

[0037] In the following description, numerous specific details are set forth to provide a more thorough understanding of the present application. However, it will be apparent to one of skill in the art upon

[0038] It should be understood that the present application can be carried out in various ways and that the application should not be interpreted as limited to the embodiments

[0039] It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these

[0040] Spatially relative terms such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device described is turned over in use, a

[0041] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0042] Embodiments of the application are described herein with reference to the drawings, which are intended to be exemplary only and not limiting to the scope of the application. In the drawings, the depicted shape of the features shown can be expected to vary as a result of, for example, manufacturing techniques and / or tolerances. Thus, embodiments of the application should not be limited to the particular shapes of elements as set forth herein, but should include deviations in shapes that result from manufacturing. The figures are generally drawn without intent for perspective, and thus, the shapes of the elements shown in the figures can not be intended to convey the actual shapes of the elements in practice and are not intended to limit the scope of the application.

[0043] Referring to the drawings Figure 1 , 2 An exemplary shielding assembly according to an embodiment of the application is described.

[0044] The shielding assembly can be applied in a semiconductor processing apparatus, such as a PVD apparatus, for shielding a susceptor 300 in the semiconductor processing apparatus from forming film layers on the susceptor 300 when performing a high-temperature burn-in process on a target material, so as to prevent the susceptor 300 from being damaged or scrapped. Exemplarily, the semiconductor processing apparatus can be a PVD apparatus, such as a magnetron sputtering apparatus, an ion beam sputtering apparatus, or a radio frequency sputtering apparatus, and the susceptor 300 can be an electro-static chuck (ESC). The electro-static chuck is a device for supporting a workpiece (such as a wafer) to be processed, which uses electrostatic attraction to adsorb the workpiece to be processed on the surface thereof, so as to keep the position of the workpiece stable in a semiconductor processing process (such as physical vapor deposition). In the process of performing a PVD process on the workpiece to be processed, the workpiece to be processed generally generates heat, and it is difficult for the heat in the vacuum to be dissipated. In order to dissipate the heat in the workpiece to be processed and achieve an ideal temperature, a back pressure is generally applied by using the electro-static chuck, that is, a specific gas (such as argon (Ar)) is blown between the back surface of the workpiece to be processed and the electro-static chuck, so as to control the pressure in the space region between the back surface of the workpiece to be processed and the electro-static chuck at a set pressure value. In the related art, when the shielding baffle 100 rotates, particles are generated by friction between the shielding baffle 100 and the baffle arm 200, which can cause environmental pollution of the process chamber, and the particles falling on the electro-static chuck can cause the back pressure of the workpiece to be processed to be poor, the pressure in the space region between the back surface of the workpiece to be processed and the electro-static chuck cannot reach the set pressure value, the quality of the film grown on the workpiece to be processed is affected, and the machine is shut down. Although the movement speed of the baffle arm can be greatly reduced at present to suppress the rotational movement of the shielding baffle and reduce the generation of particles, the back pressure still cannot reach the set pressure value.

[0045] In the present embodiment, the shielding assembly comprises a shielding baffle 100 and a baffle arm 200.

[0046] Referring to the drawings Figure 1The baffle arm 200 includes a support portion 210 for supporting the shielding baffle 100. The support portion 210 has a horizontal support surface. Figure 1 The upper surface of the bearing portion 210 has a fixing pin 211, which is in the shape of a frustum or a prism. For example, the fixing pin 211 and the bearing portion 210 can be integrally formed.

[0047] The shielding baffle 100 is located above the bearing surface. A fixing groove 110, matching the shape of the fixing pin 211, is provided on the side of the shielding baffle 100 facing the baffle arm 200. That is, the receiving space of the fixing groove 110 for accommodating the fixing pin 211 is also correspondingly frustum-shaped or prism-shaped. The fixing pin 211 is inserted into the fixing groove 110. Because the fixing pin 211 is frustum-shaped or prism-shaped, and the fixing groove 110 matches the shape of the fixing pin 211, when the fixing pin 211 is inserted into the fixing groove 110, the shielding baffle 100 cannot rotate relative to the baffle arm 200. This greatly reduces the amount of particulate matter generated due to friction, improves the environment of the process chamber, and solves the technical problem in the prior art where the back pressure cannot reach the set pressure value.

[0048] See appendix Figure 2 The baffle arm 200 is used to move the shielding baffle 100 between a storage position and a shielding position. Exemplarily, the baffle arm 200 also includes an actuating device (such as a motor, not shown) for driving the carrier 210 to rotate about a rotation axis extending in a vertical direction, so as to move the shielding baffle 100 located on the carrier surface between the storage position and the shielding position.

[0049] When the shielding baffle 100 is in the shielding position, the projection of the shielding baffle 100 on the support surface of the base 300 completely covers the workpiece (such as a wafer) on the support surface of the base 300. Figure 1 The projection of the workpiece onto the upper surface of the base 300. At this time, the lifting mechanism on the base 300 can rise to support the shielding baffle 100 and drive the shielding baffle 100 to rise a certain distance so that the fixing pin 211 separates from the fixing groove 110. Then, the baffle arm 200 moves away from below the shielding baffle 100, and the lifting mechanism drives the shielding baffle 100 down to the support surface of the base 300 to shield the support surface of the base 300. The shielded area is greater than or equal to the projection of the workpiece on the support surface of the base 300. Thus, when the shielding baffle 100 shields this area, it can effectively ensure that no film layer is formed in this area.

[0050] When the shielding baffle 100 is in the storage position, the shielding baffle 100 does not overlap with the supporting surface of the base 300 in the direction perpendicular to the supporting surface of the base 300. At this time, the shielding baffle 100 does not shield the base 300, and the semiconductor processing equipment can normally perform the physical vapor deposition process.

[0051] According to the shielding assembly of the present application, the baffle arm 200 and the shielding baffle 100 are clamped by the prismatic or prism-shaped fixing pin 211 and the fixing groove 110 matched with the shape of the fixing pin 211. The fixing pin 211 and the fixing groove 110 can effectively limit the shielding baffle 100 from rotating relative to the baffle arm 200 due to inertia during the movement of the shielding baffle 100 driven by the baffle arm 200, so that the generation of particulate matter due to the friction between the shielding baffle 100 and the baffle arm 200 can be effectively avoided.

[0052] In the embodiment, the baffle arm 200 is provided with a positioning hole 212 penetrating the fixing pin 211 and the bearing part 210 in the vertical direction. The baffle arm 200 can be positioned at a specific position above the base 300 through the positioning hole 212, so as to ensure that the baffle arm 200 can accurately move the shielding baffle 100 to the shielding position. For example, a base positioning hole corresponding to the positioning hole 212 is arranged at a specific position of the base 300. When the baffle arm 200 accurately moves the shielding baffle 100 to the shielding position, the positioning hole 212 and the base positioning hole are coaxial in the vertical direction. When the equipment is maintained, the baffle arm 200 can be moved to the corresponding position (the position of the baffle arm 200 when the shielding baffle 100 is in the shielding position) without carrying the shielding baffle 100. A positioning rod is used to pass through the positioning hole 212 in the vertical direction, and it is observed whether the positioning rod can be inserted into the base positioning hole at the same time, so as to determine whether the positioning hole 212 and the base positioning hole are coaxial in the vertical direction. If they are not coaxial, the baffle arm 200 needs to be adjusted to ensure that the positioning hole 212 and the base positioning hole are coaxial in the vertical direction when the baffle arm 200 is moved to the corresponding position, that is, the positioning rod can be inserted into the positioning hole 212 and the base positioning hole at the same time.

[0053] Referring to FIG. 1, Figure 3In some embodiments, the fixing pin 211 is in the shape of a triangular prism (e.g. a right triangular prism), and the fixing pin 211 is provided with a chamfer 2111 at the edge of the fixing pin 211 away from the bearing surface, and is provided with a chamfer 2112 at the side edge of the fixing pin 211. The chamfers 2111 and 2112 can be round chamfers (also referred to as R chamfers) or bevel chamfers (also referred to as C chamfers). The round chamfer is a circular arc shape at the corner (edge or side edge), and the bevel chamfer is a flat surface with a specific angle at the corner (edge or side edge), which is usually 45°. By setting the fixing pin 211 in the shape of a triangular prism and providing the chamfers 2111 and 2112 at the edge and the side edge respectively, the fixing pin 211 can be more conveniently inserted into the fixing groove 110, and the fixing pin 211 and the fixing groove 110 are less likely to be deformed or damaged due to contact and collision during insertion and separation. For example, refer to FIG. 2A and FIG. 2B. Figure 3 For example, the chamfers 2111 and 2112 are round chamfers, the radius R1 of the chamfer 2112 can be 0.8mm-1.4mm (preferably 1.2mm), the radius R2 of the chamfer 2111 can be 0.4mm-0.8mm (preferably 0.6mm), the length L1 of the edge of the fixing pin 211 between adjacent chamfers 2112 on the side of the fixing pin 211 facing the bearing surface can be 4.2mm-4.6mm (preferably 4.39mm), the length L2 of the edge of the fixing pin 211 between adjacent chamfers 2112 on the side of the fixing pin 211 away from the bearing surface can be 2.6mm-3mm (preferably 2.78mm), the height of the triangular prism can be 3.7mm-4.1mm (preferably 3.89mm), and the diameter of the positioning hole 212 can be 2.0mm-2.4mm (preferably 2.2mm).

[0054] In some other embodiments, the fixing pin 211 is in the shape of a triangular prism (e.g. a right triangular prism), and the fixing pin 211 is not provided with a chamfer 2111 at the edge of the fixing pin 211 away from the bearing surface, and is not provided with a chamfer 2112 at the side edge of the fixing pin 211. In this case, the length of the edge of the fixing pin 211 on the side of the fixing pin 211 facing the bearing surface can be 6.6mm-7mm (preferably 6.79mm), the length of the edge of the fixing pin 211 on the side of the fixing pin 211 away from the bearing surface can be 5mm-5.4mm (preferably 5.18mm), the height of the triangular prism can be 3.7mm-4.1mm (preferably 3.89mm), and the diameter of the positioning hole 212 can be 2.0mm-2.4mm (preferably 2.2mm).

[0055] For example, refer to FIG. 2A and FIG. 2B. Figure 4In some embodiments, the fixing pin 211 is in the shape of a quadrangular frustum (e.g. a regular quadrangular frustum), and the fixing pin 211 is provided with a chamfer 2111 at each edge away from the bearing surface side, and is provided with a chamfer 2112 at each side edge. The chamfers 2111 and 2112 can be round chamfers (also referred to as R chamfers) or bevel chamfers (also referred to as C chamfers), i.e. the corner parts (edge parts, side edge parts) are in the shape of a circular arc or a plane with a specific angle, usually 45°. By setting the fixing pin 211 in the shape of a quadrangular frustum and providing the chamfers 2111 and 2112 at the edge parts and the side edge parts respectively, the fixing pin 211 can be more conveniently inserted into the fixing groove 110, and the fixing pin 211 and the fixing groove 110 are less likely to be deformed or damaged due to contact and collision during insertion and separation. For example, see FIG. 2. Figure 4 For example, the chamfers 2111 and 2112 are round chamfers, the radius R1 of the chamfer 2112 can be 0.8-1.4 mm (preferably 1.2 mm), the radius R2 of the chamfer 2111 can be 0.4-0.8 mm (preferably 0.6 mm), the length L1 of the edge between adjacent chamfers 2112 on the side of the fixing pin 211 facing the bearing surface can be 4.4-4.8 mm (preferably 4.59 mm), the length L2 of the edge between adjacent chamfers 2112 on the side of the fixing pin 211 away from the bearing surface can be 3.1-3.5 mm (preferably 3.26 mm), the height of the quadrangular frustum can be 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 can be 2.0-2.4 mm (preferably 2.2 mm).

[0056] In some other embodiments, the fixing pin 211 is in the shape of a quadrangular frustum (e.g. a regular quadrangular frustum), and the fixing pin 211 is not provided with a chamfer 2111 at each edge away from the bearing surface side, and is not provided with a chamfer 2112 at each side edge. In this case, the length of the edge on the side of the fixing pin 211 facing the bearing surface can be 6.8-7.2 mm (preferably 6.99 mm), the length of the edge on the side of the fixing pin 211 away from the bearing surface can be 5.5-5.9 mm (preferably 5.66 mm), the height of the quadrangular frustum can be 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 can be 2.0-2.4 mm (preferably 2.2 mm).

[0057] For example, see FIG. 2. Figure 5In some embodiments, the fixing pin 211 is pentagonal frustum (for example, regular pentagonal frustum), and the fixing pin 211 is provided with a chamfer 2111 at the edge of the side away from the bearing surface, and is provided with a chamfer 2112 at the side edge. The chamfers 2111 and 2112 can be round (also known as R chamfer) or bevel (also known as C chamfer), that is, the corner part (edge, side edge) is circular arc or plane with a specific angle, usually 45°. By setting the fixing pin 211 as a pentagonal frustum, and setting the chamfers 2111 and 2112 at the edge and side edge respectively, the fixing pin 211 can be more conveniently inserted into the fixing groove 110, and the fixing pin 211 and the fixing groove 110 are not easy to deform or damage due to contact and collision during insertion and separation. For example, see FIG. 2B. Figure 5 For example, the chamfers 2111 and 2112 are round, the radius R1 of the chamfer 2112 can be 0.8mm-1.4mm (preferably 1.2mm), the radius R2 of the chamfer 2111 can be 0.4mm-0.8mm (preferably 0.6mm), the length L1 of the edge between adjacent chamfers 2112 on the side of the fixing pin 211 facing the bearing surface can be 3.9mm-4.3mm (preferably 4.07mm), the length L2 of the edge between adjacent chamfers 2112 on the side of the fixing pin 211 away from the bearing surface can be 2.8mm-3.2mm (preferably 2.97mm), the height of the pentagonal frustum can be 3.7mm-4.1mm (preferably 3.89mm), and the diameter of the positioning hole 212 can be 2.0mm-2.4mm (preferably 2.2mm).

[0058] In other embodiments, the fixing pin 211 is pentagonal frustum (for example, regular pentagonal frustum), and the fixing pin 211 is not provided with a chamfer 2111 at the edge of the side away from the bearing surface, and is not provided with a chamfer 2112 at the side edge. In this case, the length of the edge of the fixing pin 211 on the side facing the bearing surface can be 6.3mm-6.7mm (preferably 6.47mm), the length of the edge of the fixing pin 211 on the side away from the bearing surface can be 5.2mm-5.6mm (preferably 5.37mm), the height of the pentagonal frustum can be 3.7mm-4.1mm (preferably 3.89mm), and the diameter of the positioning hole 212 can be 2.0mm-2.4mm (preferably 2.2mm).

[0059] For example, see FIG. 2B. Figure 6In some embodiments, the fixing pin 211 is in a triangular prism shape (e.g. a right triangular prism shape), and the fixing pin 211 is provided with a chamfer 2111 at each edge away from the bearing surface, and is provided with a chamfer 2112 at each side edge. The chamfers 2111 and 2112 can be round chamfers (also referred to as R chamfers) or bevel chamfers (also referred to as C chamfers), i.e. the corner portions (edges and side edges) are in a circular arc shape or a plane with a specific angle, usually 45°. By setting the fixing pin 211 in a triangular prism shape and providing the chamfers 2111 and 2112 at the edges and side edges respectively, the fixing pin 211 can be more conveniently inserted into the fixing groove 110, and the fixing pin 211 and the fixing groove 110 are less likely to be deformed or damaged due to contact and collision during insertion and separation. For example, see FIG. 2A. Figure 6 For example, the chamfers 2111 and 2112 are round chamfers, the radius R1 of the chamfer 2112 can be 0.8-1.4 mm (preferably 1.2 mm), the radius R2 of the chamfer 2111 can be 0.4-0.8 mm (preferably 0.6 mm), the length L1 of the edge between adjacent chamfers 2112 can be 4.2-4.6 mm (preferably 4.39 mm), the height of the triangular prism (i.e. the length of the side edge) can be 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 can be 2.0-2.4 mm (preferably 2.2 mm).

[0060] In other embodiments, the fixing pin 211 is in a triangular prism shape (e.g. a right triangular prism shape), and the fixing pin 211 is not provided with a chamfer 2111 at each edge away from the bearing surface, and is not provided with a chamfer 2112 at each side edge. In this case, the length of the edge (not the side edge) can be 6.6-7 mm (preferably 6.79 mm), the height of the triangular prism (i.e. the length of the side edge) can be 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 can be 2.0-2.4 mm (preferably 2.2 mm).

[0061] For example, see FIG. 2B. Figure 7In some embodiments, the fixing pin 211 is in a quadrangular prism shape (e.g. a regular quadrangular prism shape), and the fixing pin 211 is provided with a chamfer 2111 at each edge away from the bearing surface, and is provided with a chamfer 2112 at each side edge. The chamfers 2111 and 2112 can be round chamfers (also referred to as R chamfers) or bevel chamfers (also referred to as C chamfers), i.e. the corner portions (edges and side edges) are in a circular arc shape or a plane with a specific angle, usually 45°. By setting the fixing pin 211 in a quadrangular prism shape and providing the chamfers 2111 and 2112 at the edges and side edges respectively, the fixing pin 211 can be more conveniently inserted into the fixing groove 110, and the fixing pin 211 and the fixing groove 110 are less likely to be deformed or damaged due to contact and collision during insertion and separation. For example, see FIG. 2A. Figure 7 For example, the chamfers 2111 and 2112 are round chamfers, the radius R1 of the chamfer 2112 can be 0.8-1.4 mm (preferably 1.2 mm), the radius R2 of the chamfer 2111 can be 0.4-0.8 mm (preferably 0.6 mm), the length L1 of the edge between adjacent chamfers 2112 can be 4.4-4.8 mm (preferably 4.59 mm), the height of the quadrangular prism (i.e. the length of the side edge) can be 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 can be 2.0-2.4 mm (preferably 2.2 mm).

[0062] In other embodiments, the fixing pin 211 is in a quadrangular prism shape (e.g. a regular quadrangular prism shape), and the fixing pin 211 is not provided with a chamfer 2111 at each edge away from the bearing surface, and is not provided with a chamfer 2112 at each side edge. In this case, the length of the edge (not the side edge) can be 6.8-7.2 mm (preferably 6.99 mm), the height of the quadrangular prism (i.e. the length of the side edge) can be 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 can be 2.0-2.4 mm (preferably 2.2 mm).

[0063] For example, see FIG. 2A. Figure 8In some embodiments, the fixing pin 211 is in the shape of a pentagonal prism (e.g., a regular pentagonal prism), and the fixing pin 211 is provided with a chamfer 2111 at each edge away from the bearing surface and a chamfer 2112 at each side edge. The chamfers 2111 and 2112 can be rounded (also referred to as R chamfer) or beveled (also referred to as C chamfer), i.e., the corner (edge or side edge) is in the shape of a circular arc or a plane with a specific angle, typically 45°. By setting the fixing pin 211 in the shape of a pentagonal prism and providing the chamfers 2111 and 2112 at the edges and side edges, respectively, the fixing pin 211 can be more conveniently inserted into the fixing groove 110, and the fixing pin 211 and the fixing groove 110 are less likely to be deformed or damaged due to contact and collision during insertion and separation. For example, referring to FIG. 2, the fixing pin 211 is in the shape of a regular pentagonal prism, and the chamfers 2111 and 2112 are both rounded. The chamfer 2112 has a radius R1 of 0.8-1.4 mm (preferably 1.2 mm), the chamfer 2111 has a radius R2 of 0.4-0.8 mm (preferably 0.6 mm), the length L1 of the edge between adjacent chamfers 2112 is 3.9-4.3 mm (preferably 4.07 mm), the height of the pentagonal prism (i.e., the length of the side edge) is 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 is 2.0-2.4 mm (preferably 2.2 mm). Figure 8 , the chamfers 2111 and 2112 are both rounded, the chamfer 2112 has a radius R1 of 0.8-1.4 mm (preferably 1.2 mm), the chamfer 2111 has a radius R2 of 0.4-0.8 mm (preferably 0.6 mm), the length L1 of the edge between adjacent chamfers 2112 is 3.9-4.3 mm (preferably 4.07 mm), the height of the pentagonal prism (i.e., the length of the side edge) is 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 is 2.0-2.4 mm (preferably 2.2 mm).

[0064] In some other embodiments, the fixing pin 211 is in the shape of a pentagonal prism (e.g., a regular pentagonal prism), and the fixing pin 211 is not provided with a chamfer 2111 at each edge away from the bearing surface and a chamfer 2112 at each side edge. In this case, the length of the edge (not the side edge) can be 6.3-6.7 mm (preferably 6.47 mm), the height of the pentagonal prism (i.e., the length of the side edge) is 3.7-4.1 mm (preferably 3.89 mm), and the diameter of the positioning hole 212 is 2.0-2.4 mm (preferably 2.2 mm).

[0065] It should be noted that when the number of edges on one side of the fixing pin 211 is greater than 5, the overall shape of the fixing pin 211 is close to a circular truncated cone or a circular cylinder, and it is usually difficult to effectively limit the rotation of the shielding baffle 100 relative to the baffle arm 200 due to inertia.

[0066] The present application also provides a semiconductor processing apparatus, which comprises a chamber, the chamber comprising the susceptor 300 as described above and the shielding assembly as described above, i.e. the chamber is provided with the susceptor 300 as described above and the shielding assembly as described above. Exemplarily, the semiconductor processing apparatus can be a magnetron sputtering apparatus, an ion beam sputtering apparatus, a radio frequency sputtering apparatus, or the like PVD apparatus, the chamber can be a deposition reaction chamber, and the susceptor 300 can be an electrostatic chuck.

[0067] While example embodiments have been described herein with reference to the attached drawings, it is to be understood that the example embodiments are merely exemplary and are not intended to limit the scope of the application. Many variations and modifications of the example embodiments can be made by those skilled in the art without departing from the scope and spirit of the application. All such variations and modifications are intended to be included within the scope of the application as defined by the appended claims.

[0068] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been described in detail in order to not obscure the understanding of this description.

[0069] Similarly, it is to be understood that the various features of the application described herein are sometimes grouped together in a single embodiment, figure or description of a related art for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various aspects, features and embodiments of the application. However, this method of disclosure should not be interpreted as reflecting an intention that the application requires more features than are explicitly recited in each claim. Rather, inventive aspects lie in less than all features of any single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim acting as a separate embodiment of the application.

[0070] Those skilled in the art will appreciate that all features described herein (including all accompanying claims, abstract and drawings), and steps of any method or process so disclosed, can be combined in any combination, except where features are mutually exclusive (in which case a combination of only those features which are not mutually exclusive would be permitted). Particular embodiments of the application will now be described with reference to the drawings, of which:

[0071] Furthermore, those skilled in the art will recognize that, in the practice of the embodiments described herein, certain steps described as sequential in nature are actually performed in parallel. Moreover, those skilled in the art will appreciate that the explicit claims hereinafter are indicative of combinations of features that are within the scope of the application and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0072] It is to be understood that the above-referenced examples do not limit the application in scope to the specific embodiments described in this document, but describe embodiments that, together with the claims, define the scope of the application. Those skilled in the art will recognize that other embodiments or changes can be made to the application without departing from the scope of the application, and it is the intent, therefore, to be limited only as described in the following claims.

Claims

1. A screening assembly, characterized by The shielding assembly comprises: a shielding baffle; and a baffle arm for moving the shielding baffle between a storage position and a shielding position; the baffle arm comprises a bearing part having a horizontal bearing surface, a fixing pin is arranged on the bearing surface, the fixing pin is in the shape of a trapezoidal prism or a prism; the shielding baffle is located on the bearing surface, a fixing groove matching the shape of the fixing pin is arranged on the side of the shielding baffle facing the baffle arm, and the fixing pin is inserted into the fixing groove; wherein, in the shielding position, the projection of the shielding baffle on the support surface of the base completely covers the projection of the workpiece to be processed on the support surface of the base; in the storage position, the shielding baffle does not overlap with the support surface of the base in the direction perpendicular to the support surface of the base.

2. The shielding assembly according to claim 1, wherein the fixing pin is in the shape of a trapezoidal prism.

3. The shielding assembly according to claim 1, wherein the fixing pin is in the shape of a quadrangular prism.

4. The shielding assembly according to claim 1, wherein the fixing pin is in the shape of a pentagonal prism.

5. The shielding assembly according to claim 1, wherein the fixing pin is in the shape of a trapezoidal prism.

6. The shielding assembly according to claim 1, wherein the fixing pin is in the shape of a quadrangular prism.

7. The shielding assembly according to claim 1, wherein the fixing pin is in the shape of a pentagonal prism.

8. The shielding assembly according to any one of claims 1-7, wherein a chamfer is arranged at the edge of the fixing pin away from the bearing surface; a chamfer is arranged at the side edge of the fixing pin.

9. The shielding assembly according to any one of claims 1-7, wherein a positioning hole is arranged on the baffle arm and penetrates the fixing pin and the bearing part in the vertical direction.

10. A semiconductor processing apparatus, characterized by comprising: The chamber comprises a base and a shielding assembly according to any one of claims 1-9.

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