Semiconductor temperature control cleaning equipment

Abstract

The present invention provides a semiconductor temperature-controlled cleaning device, which belongs to the field of semiconductor processing technology, and includes: a cleaning component and a lifting component. The cleaning component includes a cleaning box, a partition is fixedly connected to the inner wall of the cleaning box, a rotating mechanism is provided in the middle of the partition, the lifting component is fixedly installed inside the cleaning component, a blowing component is rotatably connected to the inner wall of the cleaning box, and a flow guide component is fixedly installed inside the cleaning box. Since a large number of particles, organic matter, etc. will be attached during the production process of semiconductor materials, subsequent cleaning is required, but the attached impurities may be difficult to clean, and the attached objects cannot be completely removed. The present application uses dry ice cleaning and gas blowing to solve the problem that the attached objects are not easy to clean effectively, and can achieve contactless cleaning, and perform temperature control according to temperature changes. The closure of the carrier frame is achieved by rotating the heat insulation cover, and frost and impurities are removed by hot air blowing, which reduces the temperature change amplitude and improves the cleaning efficiency.

Description

Technical Field

[0001] The invention relates to semiconductor temperature control cleaning equipment, belonging to the technical field of semiconductor processing. Background Art

[0002] Semiconductors are materials with electrical conductivity between insulators and conductors. Their electrical conductivity is easily controlled and can be used as a component material for information processing. From the perspective of science and technology or economic development, semiconductors are very important. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use the changes in the conductivity of semiconductors to process information.

[0003] Silicon carbide has become an important semiconductor material due to its superior properties. It is a high-performance material component that is widely used in semiconductor manufacturing, optics, aerospace and other fields. It is formed into a solid material by condensing gaseous reactants on a substrate. In the process of preparing silicon carbide, the vapor of a gaseous precursor (such as trichloromethylsilane MTS, polymethylsilane PMS, etc.) is usually introduced into a reaction chamber where a substrate such as graphite is placed. A chemical reaction occurs under gaseous conditions to generate SiC, which is then deposited on the surface of the substrate to form the desired SiC.

[0004] After semiconductor materials are made, since many particles and organic matter will adhere to their surfaces, dry ice cleaning is currently commonly used for treatment. However, in actual operation, continuous flushing with dry ice will lead to low-temperature condensation, causing frost to cover impurities and reduce the efficiency of subsequent flushing. Continuous cleaning will not be able to clean completely, and it is necessary to heat up the material to melt the frost before cleaning. This will cause large temperature changes during the cleaning process, affecting the cleaning effect and making it difficult to perform efficient cleaning under constant temperature conditions. In addition, it is inconvenient to place the semiconductor materials during cleaning, affecting the operating efficiency. The heating operation during continuous cleaning will also affect the cleaning efficiency, reduce the processing quality of the semiconductor materials, and affect the subsequent processing of the semiconductor materials. Summary of the invention

[0005] The present invention provides a semiconductor temperature-controlled cleaning device to solve the technical problems that it is difficult to control the temperature during constant-temperature cleaning of semiconductors, and the cleaning effect is poor and the cleaning efficiency is low.

[0006] The present invention solves the above technical problems through the following technical solutions: The present invention provides a semiconductor temperature-controlled cleaning device, the semiconductor temperature-controlled cleaning device comprising: A cleaning assembly, the cleaning assembly comprises a cleaning box, a placement slot for placing semiconductor materials is provided inside the cleaning box, a partition is fixedly connected to the inner wall of the cleaning box at the bottom of the placement slot, a rotating mechanism is provided in the middle of the partition, and the semiconductor materials are placed on the rotating mechanism through a bracket assembly; A lifting component is fixedly installed inside the cleaning component, an inner wall of the cleaning box located on one side of the lifting component is rotatably connected with a blowing component, and a guide component is fixedly installed inside the cleaning box, the guide component is connected to the flushing component, and the flushing component is fixedly installed inside the cleaning box.

[0007] In the present technical solution, a top plate located inside the placement groove is fixedly installed on the top of the cleaning box. The top plate is a square hollow structure. Exhaust ports are provided on both sides of the partition located inside the cleaning box, and guide blocks are fixedly connected to the middle of both ends of the partition. A slope is provided on the side of the guide block close to the inner wall of the placement groove, and a temperature sensor and a sealing gasket are fixedly connected to the inner wall of the cleaning box.

[0008] In the present technical solution, the rotating mechanism includes a rotating motor, which is fixedly installed to the bottom of the partition, and the output end of the rotating motor is fixedly connected to the turntable, the turntable is rotatably connected to the top of the partition, and the edge of the turntable is fixedly connected with a number of evenly distributed positioning pins, and the surface of the turntable is provided with a bracket assembly for placing the semiconductor material of the ring structure, and the bracket assembly is composed of a carrier frame and a bracket, the carrier frame is fitted and connected to the surface of the turntable, and the edge of the carrier frame is provided with positioning holes distributed corresponding to the positioning pins, both sides of the carrier frame are fixedly connected with symmetrically distributed hanging ears, and the middle part of the carrier frame between the hanging ears is fixedly installed with a bracket of an annular structure, and the semiconductor material is fitted and connected to the top surface of the bracket, and the edge of the bracket is fixedly connected with a number of evenly distributed limit blocks, and the limit blocks are in contact with the edge of the semiconductor material.

[0009] In the present technical solution, the lifting assembly includes an electric push rod, which is embedded and installed in the interior of the cleaning box, and the telescopic end of the electric push rod passes through the partition and is fixedly connected to the frame. The cross-section of the frame is a square hollow structure. The frame is located on the outside of the carrier frame, and the middle of both sides of the frame is fixedly connected to the top cover through the vertical plate. The corners around the frame and the vertical plate are respectively fixedly connected to the two ends of the vertical pole, and the vertical plate and the vertical pole are both located inside the top plate. The bottom edge of the top cover is fixedly connected to the sealing ring, and the sealing ring is fitted and connected to the surface of the top plate. A movable rod is horizontally slidable at the bottom of the vertical plate. The cross-section of the movable rod is a square hollow structure and is embedded and connected inside the notches on both sides of the bottom of the vertical plate. One end of the movable rod is connected to the vertical plate through a spring, and the other end of the movable rod is correspondingly arranged above the guide block.

[0010] In the present technical solution, the blowing assembly includes a driving motor, which is embedded and installed in the cleaning box. The output end of the driving motor is fixedly connected to a driving shaft, and the end of the driving shaft is fixedly connected to a round rod. A sleeve rod is rotatably sleeved on the surface of the round rod, and the two ends of the sleeve rod are respectively fixedly connected to a gear and a heat insulation cover. The driving shaft is rotatably connected to the inside of the side plate, and the side plate is fixedly installed to the inner wall of the cleaning box, and the side wall of the side plate is fixedly connected to a rack with an arc structure, the center of the arc where the rack is located coincides with the axis center of the driving shaft, and the rack and the gear are correspondingly distributed, a sealing gasket is provided above the side plate, and when the heat insulation cover rotates, the edge of the heat insulation cover fits the surface of the sealing gasket.

[0011] In the present technical solution, the heat insulation cover is a circular hollow structure, a heater is fixedly installed on the top of the heat insulation cover, the heater is fixedly connected to the inside of the heat insulation cover through a delivery pipe, and one end of the delivery pipe located inside the heat insulation cover is attached to the inner wall of the heat insulation cover, the heater is fixedly connected to the air inlet pipe, the bottom of the heat insulation cover is fixedly connected to the air outlet pipe, the air inlet pipe and the air outlet pipe are both L-shaped structures and are distributed in parallel, and the heat insulation cover is attached to the top surface of the carrier frame.

[0012] In the present technical solution, the guide assembly includes a ring, which is fixedly installed to the bottom of the cleaning box and fixedly connected to the bottom of the partition. A channel for gas collection is formed between the ring and the cleaning tank, and the channel is located below the exhaust port. A cavity connected to the outside is opened at the bottom of the cleaning box, and the cavity is connected to the channel. A box cover is hinged on the outer wall of the cleaning box on one side of the cavity, and a filter is fixedly connected to the inner wall of the cleaning box located inside the cavity.

[0013] In the present technical solution, a dry ice particle storage tank is fixedly installed on the outer wall of the cleaning box, and the top of the dry ice particle storage tank is fixedly connected to a connecting pipe through a delivery pump. The connecting pipe runs through the cleaning box and is connected to the flushing assembly. A pump body is fixedly installed on the outer wall of the cleaning box above the connecting pipe. The pump body is fixedly connected to the flushing assembly through a branch pipe, and a control valve is fixedly connected to the end of the branch pipe.

[0014] In the present technical solution, an air pump is fixedly installed inside the cleaning box, and the air pump is located inside the circle below the partition. An electric push rod and a rotating motor are also provided inside the circle. The partition is respectively connected with a first fixed tube and a second fixed tube, and the first fixed tube and the second fixed tube are respectively distributed corresponding to the outlet pipe and the inlet pipe. The first fixed tube, the second fixed tube, the inlet pipe and the outlet pipe ends are fixedly connected to the fitting block, and the first fixed tube and the second fixed tube both extend to the outside of the cleaning box.

[0015] In the present technical solution, the flushing assembly includes a nozzle, which is fixedly installed to the inner wall of the cleaning box. An impeller is rotatably connected inside the nozzle. The impeller is rotatably connected to a bearing installed inside the nozzle, and the end of the impeller is fixedly connected to a stirring rod. The end of the nozzle is fixedly connected to a nozzle, and the nozzle is correspondingly arranged above the bracket assembly.

[0016] On the basis of being in accordance with the common sense in the art, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0017] The positive and progressive effects of the present invention are: The semiconductor temperature-controlled cleaning equipment proposed above adopts a cleaning box to perform constant temperature cleaning operations on semiconductor materials, and uses dry ice cleaning and gas blowing to achieve contactless cleaning. It can ensure the cleaning effect while avoiding the impact of the cleaning medium on the semiconductor material. At the same time, the rate of dry ice cleaning is adjusted by using the flushing component, and the temperature can be controlled according to the temperature change. The semiconductor material is rotated during cleaning to achieve a comprehensive cleaning function. After cleaning, the carrier frame can be closed by rotating the heat insulation cover, and frost and impurities can be removed by hot air blowing. At the same time, the temperature change amplitude is reduced, and the temperature change in the cleaning box is minimized as much as possible. The lifting component is used to realize the lifting of the bracket assembly, which is convenient for taking and placing semiconductor materials during cleaning, improving the cleaning efficiency, and avoiding the impact of dry ice cleaning on the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the internal front view structure of the present invention.

[0020] Figure 3 It is a schematic diagram of the three-dimensional structure of the partition of the present invention.

[0021] Figure 4 It is a schematic diagram of the internal side structure of the present invention.

[0022] Figure 5 For the present invention Figure 4 Schematic diagram of the local enlarged structure at point A in the middle.

[0023] Figure 6 It is a schematic diagram of the three-dimensional structure of the heat insulation cover of the present invention.

[0024] Figure 7 It is a schematic diagram of the three-dimensional structure of the bracket assembly of the present invention.

[0025] Figure 8 It is a schematic diagram of the three-dimensional structure of the lifting component of the present invention.

[0026] Fig. 9 It is a schematic diagram of the internal top view structure of the present invention.

[0027] Fig.10 It is a schematic diagram of the internal front view structure of the flushing component of the present invention.

[0028] Description of reference numerals: In the attached drawings: 100, cleaning assembly; 101, cleaning box; 102, placement slot; 103, top plate; 104, partition; 105, exhaust port; 106, rotating motor; 107, turntable; 108, positioning pin; 109, temperature sensor; 110, sealing pad; 111, guide block; 112, box cover; 200, lifting assembly; 201, electric push rod; 202, frame; 203, vertical plate; 204, vertical pole; 205, top cover; 206, sealing ring; 207, movable rod; 208, spring; 300, bracket assembly; 301, carrier frame; 302, hanging ear; 303, bracket; 304, limit block; 305, positioning hole; 400, blowing assembly; 40 1. Drive motor; 402. Drive shaft; 403. Round rod; 404. Sleeve rod; 405. Heat shield; 406. Gear; 407. Side plate; 408. Rack; 409. Heater; 410. Delivery pipe; 411. Exhaust pipe; 412. Inlet pipe; 500. Guide assembly; 501. Circle; 502. Cavity; 503. Dry ice pellet storage tank; 504. Connecting pipe; 505. Air pump; 506. First fixed pipe; 507. Second fixed pipe; 508. Fitting block; 600. Flushing assembly; 601. Spray pipe; 602. Impeller; 603. Bearing; 604. Stirring rod; 605. Nozzle; 606. Pump body; 607. Branch pipe; 608. Control valve. DETAILED DESCRIPTION

[0029] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0030] like Figure 1-10 As shown, the semiconductor temperature control cleaning equipment includes: The cleaning assembly 100 includes a cleaning box 101, wherein a placement slot 102 for placing semiconductor materials is provided inside the cleaning box 101, a partition 104 is fixedly connected to the inner wall of the cleaning box 101 at the bottom of the placement slot 102, a rotating mechanism is provided in the middle of the partition 104, and the semiconductor materials are placed on the rotating mechanism through a bracket assembly 300; A lifting component 200 is fixedly installed inside the cleaning component 100, and a blowing component 400 is rotatably connected to the inner wall of the cleaning box 101 located on one side of the lifting component 200, and a guide component 500 is fixedly installed inside the cleaning box 101, and the guide component 500 is connected to the flushing component 600, and the flushing component 600 is fixedly installed inside the cleaning box 101.

[0031] As a preferred solution, the semiconductor material is placed on the bracket assembly 300 and above the cleaning assembly 100. The lifting assembly 200 can be used to stably place the semiconductor material inside the cleaning box 101, and the semiconductor material can be evenly rotated through a rotating mechanism. Dry ice flushing and gas blowing are performed alternately inside the cleaning box 101. The blowing assembly 400 is used to drive the heat insulation cover 405 to close the bracket assembly 300, which can reduce the temperature change range in the cleaning box 101 and facilitate temperature control during subsequent dry ice cleaning. The cleaned gas can carry impurities for collection and discharge, thereby realizing rapid cleaning operations of the semiconductor material.

[0032] A top plate 103 located inside the placement groove 102 is fixedly installed on the top of the cleaning box 101. The top plate 103 is a square hollow structure. Exhaust ports 105 are provided on both sides of the partition 104 located inside the cleaning box 101, and guide blocks 111 are fixedly connected to the middle of both ends of the partition 104. The guide block 111 has an inclined surface on one side close to the inner wall of the placement groove 102. The inner wall of the cleaning box 101 is respectively fixedly connected with a temperature sensor 109 and a sealing gasket 110.

[0033] By adopting such a scheme, the top plate 103 can cooperate with the lifting assembly 200 to achieve the closure of the top of the cleaning box 101. When placing semiconductor materials, the bracket assembly 300 can be moved to the top of the top plate 103 through the lifting assembly 200. At this time, the semiconductor materials can be conveniently placed, and the lifting assembly 200 can be quickly separated through the guide block 111 on the partition 104, so that it can correspond to the rotating mechanism after placement, and will not affect the normal operation of the subsequent rotating mechanism. The internal temperature of the cleaning box 101 is monitored by the temperature sensor 109.

[0034] The rotating mechanism includes a rotating motor 106, which is fixedly mounted to the bottom of the partition 104. The output end of the rotating motor 106 is fixedly connected to a turntable 107, which is rotatably connected to the top of the partition 104, and a plurality of evenly distributed positioning pins 108 are fixedly connected to the edge of the turntable 107. A bracket assembly 300 is provided on the surface of the turntable 107 for placing the semiconductor material of the annular structure. The bracket assembly 300 is composed of a carrier frame 301 and a bracket 303. The carrier The carrier frame 301 is fitted and connected to the surface of the turntable 107, and positioning holes 305 corresponding to the positioning pins 108 are opened on the edge of the carrier frame 301, symmetrically distributed ears 302 are fixedly connected on both sides of the carrier frame 301, and a ring-shaped bracket 303 is fixedly installed in the middle of the carrier frame 301 between the ears 302, and the semiconductor material is fitted and connected to the top surface of the bracket 303, and a number of evenly distributed limit blocks 304 are fixedly connected to the edge of the bracket 303, and the limit blocks 304 are in contact with the edge of the semiconductor material.

[0035] As a specific solution, when the lifting component 200 drives the bracket component 300 to move downward, the carrier frame 301 moves downward and the positioning hole 305 and the positioning pin 108 cooperate to ensure that the carrier frame 301 is stably placed on the surface of the turntable 107. At this time, the semiconductor material is supported by the bracket 303, and the semiconductor material is limited by the limit block 304. After the bracket assembly 300 is placed using the lifting component 200, when the rotating motor 106 is started to drive the turntable 107 to rotate, the turntable 107 drives the semiconductor material on the bracket assembly 300 to rotate slowly, and is fully cleaned during the flushing by the flushing component 600.

[0036] The lifting assembly 200 includes an electric push rod 201, which is embedded and installed inside the cleaning box 101. The telescopic end of the electric push rod 201 passes through the partition 104 and is fixedly connected to the frame 202. The cross-section of the frame 202 is a square hollow structure. The frame 202 is located outside the carrier frame 301. The middle of both sides of the frame 202 is fixedly connected to the top cover 205 through the vertical plate 203. The corners of the frame 202 and the vertical plate 203 are fixedly connected to the two ends of the vertical rod 204 respectively. The vertical plate 203 and the vertical rod 204 are both located inside the top plate 103, the bottom edge of the top cover 205 is fixedly connected to the sealing ring 206, and the sealing ring 206 is fitted and connected to the surface of the top plate 103, and a movable rod 207 is horizontally slidable at the bottom of the vertical plate 203. The cross-section of the movable rod 207 is a square hollow structure and is embedded and connected with the notches on both sides of the bottom of the vertical plate 203. One end of the movable rod 207 is connected to the vertical plate 203 through a spring 208, and the other end of the movable rod 207 is correspondingly arranged above the guide block 111.

[0037] As a specific solution, when placing semiconductor materials, the electric push rod 201 is started to drive the frame 202 to rise, and the frame 202 drives the vertical plate 203 and the vertical rod 204 to rise. When the frame 202 moves to the bottom of the top plate 103, the bracket assembly 300 passes through the top plate 103 and moves to the outside of the cleaning box 101. After placing the semiconductor materials, the electric push rod 201 and the electric frame 202 are reset, and the sealing ring 206 on the top cover 205 is pressed against the edge of the top plate 103, thereby achieving the sealing of the inside of the cleaning box 101; when the electric push rod 201 is extended, the movable rod 207 moves on the inclined surface of the guide block 111, through The elasticity of the spring 208 pushes the movable rod 207 to move to the side close to the bracket assembly 300. The movable rod 207 realizes its stable translation through the limit at the bottom of the vertical plate 203, so that when one end of the movable rod 207 moves to below the hanging ear 302, the carrier frame 301 is lifted to the top plate 103. When the electric push rod 201 moves downward and the carrier frame 301 is placed on the turntable 107, the movable rod 207 moves to the guide block 111. When it continues to move downward, the movement is limited by the inclined surface of the guide block 111 to move to both sides, and then separates from the bracket assembly 300, which does not affect the rotation of the turntable 107 and the carrier frame 301, and can be quickly taken and placed.

[0038] The blowing component 400 includes a driving motor 401, which is embedded and installed in the cleaning box 101. The output end of the driving motor 401 is fixedly connected to a driving shaft 402, and the end of the driving shaft 402 is fixedly connected to a round rod 403. A sleeve rod 404 is rotatably sleeved on the surface of the round rod 403. The two ends of the sleeve rod 404 are respectively fixedly connected to a gear 406 and a heat insulation cover 405. The driving shaft 402 is rotatably connected to the inside of a side plate 407, and the side plate 407 is fixedly installed to the inner wall of the cleaning box 101. A rack 408 with an arc structure is fixedly connected to the side wall of the side plate 407. The center of the arc where the rack 408 is located coincides with the axis of the driving shaft 402, and the rack 408 is correspondingly distributed with the gear 406. A sealing gasket 110 is provided above the side plate 407, and when the heat insulation cover 405 rotates, the edge of the heat insulation cover 405 fits with the surface of the sealing gasket 110.

[0039] As a preferred solution, when the driving motor 401 is working, it drives the driving shaft 402 to rotate on the side plate 407, so that the driving shaft 402 drives the round rod 403 and the sleeve rod 404 to rotate synchronously, and then drives the heat insulation cover 405 to rotate to the side of the placement groove 102, which can not affect the normal lifting of the lifting component 200. At this time, the heat insulation cover 405 and the air inlet pipe 412 and the air outlet pipe 411 are all attached to the surface of the sealing gasket 110, and the blow-off component 400 will not be affected when dry ice cleaning is performed. Afterwards, when the driving shaft 402 drives the round rod 403 and the sleeve rod 404 to rotate, the gear 406 on the sleeve rod 404 contacts the rack 408 on the side plate 407. At this time, the gear 406 drives the sleeve rod 404 to rotate on the surface of the round rod 403. The sleeve rod 404 drives the heat shield 405 to rotate and then fits on the surface of the carrier frame 301, covering the semiconductor material and the bracket 303 inside the heat shield 405, and then heating gas is transported to the inside of the heat shield 405 to melt the dry ice and blow away impurities.

[0040] The heat insulation cover 405 is a circular hollow structure, and a heater 409 is fixedly installed on the top of the heat insulation cover 405. The heater 409 is fixedly connected to the inside of the heat insulation cover 405 through a delivery pipe 410, and one end of the delivery pipe 410 located inside the heat insulation cover 405 is attached to the inner wall of the heat insulation cover 405. The heater 409 is fixedly connected to an air inlet pipe 412, and the bottom of the heat insulation cover 405 is fixedly connected to an air outlet pipe 411. The air inlet pipe 412 and the air outlet pipe 411 are both L-shaped structures and are distributed in parallel. The heat insulation cover 405 is attached to the top surface of the carrier frame 301.

[0041] Further, before the heat shield 405 is attached to the carrier frame 301, the gear 406 is separated from the rack 408. At this time, the heat shield 405 smoothly covers the edge of the carrier frame 301. At this time, the rotating motor 106 stops working. When the heat shield 405 rotates, it drives the air inlet pipe 412 and the air outlet pipe 411 to correspond to the first fixed pipe 506 and the second fixed pipe 507. The sealing of the connection is achieved by squeezing the fitting block 508. At this time, the air pump 505 is started to extract the air inside it, so that the outside air is transported to the air inlet pipe 412 through the second fixed pipe 507, and the air is heated by the heater 409 and then transported to the heat shield 405 through the delivery pipe 410. Internally, the delivery pipe 410 is arranged on the inner wall of the heat insulation cover 405, so that a vortex state of heating gas is formed inside the heat insulation cover 405, and is discharged through the outlet pipe 411 and the first fixed pipe 506, so as to realize the circulation of hot air, melt the frost attached to the surface of the semiconductor material, and blow away the impurities. When the temperature rises, the rotating motor 106 drives the heat insulation cover 405 to fit the surface of the sealing gasket 110, and continues to perform the cleaning operation by dry ice cleaning, so as to realize the alternation of dry ice cleaning and hot air blowing and suction. At the same time, the heat insulation cover 405 can isolate the heat, avoid affecting the temperature in the placement groove 102, and reduce the temperature change amplitude to facilitate the subsequent temperature control cleaning.

[0042] The guide assembly 500 includes a ring 501, which is fixedly installed on the bottom of the cleaning box 101. The ring 501 is fixedly connected to the bottom of the partition 104. A channel for gas collection is formed between the ring 501 and the cleaning tank, and the channel is located below the exhaust port 105. A cavity 502 connected to the outside is opened at the bottom of the cleaning box 101, and the cavity 502 is connected to the channel. The outer wall of the cleaning box 101 on one side of the cavity 502 is hinged with a box cover 112, and the inner wall of the cleaning box 101 located inside the cavity 502 is fixedly connected with a filter.

[0043] With such a solution, the enclosure 501 is used to isolate the passage and other electrical equipment, so that the carbon dioxide gas during dry ice cleaning enters the passage from the exhaust ports 105 on both sides of the partition 104 and is discharged after passing through the cavity 502. A filter is provided inside the cavity 502 to filter impurities during cleaning, and a box cover 112 is provided to facilitate subsequent opening for cleaning.

[0044] A dry ice particle storage tank 503 is fixedly installed on the outer wall of the cleaning box 101. The top of the dry ice particle storage tank 503 is fixedly connected to a connecting pipe 504 via a delivery pump. The connecting pipe 504 runs through the cleaning box 101 and is connected to the flushing assembly 600. A pump body 606 is fixedly installed on the outer wall of the cleaning box 101 above the connecting pipe 504. The pump body 606 is fixedly connected to the flushing assembly 600 via a branch pipe 607, and a control valve 608 is fixedly connected to the end of the branch pipe 607.

[0045] Specifically, during cleaning, the delivery pump is started to deliver dry ice particles to the inside of the nozzle 601 through the connecting pipe 504. When the dry ice particles are sprayed out from the nozzle 605, they are mixed with the high-pressure gas to discharge the dry ice particles and the gas mixture, thereby quickly removing particulate matter and organic matter on the surface of the semiconductor material.

[0046] An air pump 505 is fixedly installed inside the cleaning box 101, and the air pump 505 is located inside the circle 501 below the partition 104. An electric push rod 201 and a rotating motor 106 are also arranged inside the circle 501. The partition 104 is respectively connected with a first fixed pipe 506 and a second fixed pipe 507, and the first fixed pipe 506 and the second fixed pipe 507 are respectively distributed corresponding to the outlet pipe 411 and the inlet pipe 412. The ends of the air pipe 412 and the air outlet pipe 411 are fixedly connected to the bonding block 508, and the first fixed pipe 506 and the second fixed pipe 507 are extended to the outside of the cleaning box 101. The air pump 505 can allow the outside air to enter the heat insulation cover 405 from the second fixed pipe 507, the air inlet pipe 412 and the delivery pipe 410. The heat insulation cover 405 is used for temperature isolation to avoid affecting the low temperature environment in the placement tank 102, and to allow the hot air to heat the semiconductor material and then be discharged from the air outlet pipe 411 and the first fixed pipe 506.

[0047] The flushing assembly 600 includes a nozzle 601, which is fixedly installed to the inner wall of the cleaning box 101. An impeller 602 is rotatably connected inside the nozzle 601. The impeller 602 is rotatably connected to a bearing 603 installed inside the nozzle 601, and the end of the impeller 602 is fixedly connected to a stirring rod 604. The end of the nozzle 601 is fixedly connected to a nozzle 605, and the nozzle 605 is correspondingly arranged above the bracket assembly 300.

[0048] Furthermore, when the dry ice particles and high-pressure gas entering the nozzle 601 are ejected from the nozzle 605, the gas drives the impeller 602 to rotate, so that the impeller 602 drives the stirring rod 604 to rotate synchronously, thereby further crushing the dry ice particles to make them finer before ejecting them. During the cleaning process, the pump body 606 works to transport the gas from the branch pipe 607 to the inside of the nozzle 601, thereby adjusting the gas discharge rate in the nozzle 601 and changing the dry ice discharge amount within the corresponding time to perform temperature control. The temperature can be controlled according to the cleaning situation to achieve a constant temperature cleaning function.

[0049] The present invention is not limited to the above-mentioned embodiments. Any changes in shape or structure are within the protection scope of the present invention. The protection scope of the present invention is defined by the attached claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, but these changes and modifications are within the protection scope of the present invention.

Claims

1. A semiconductor temperature control cleaning device, characterized in that: The semiconductor temperature control cleaning equipment comprises: A cleaning assembly (100), the cleaning assembly (100) comprising a cleaning box (101), the cleaning box (101) having a placement groove (102) for placing semiconductor materials therein, a partition (104) being fixedly connected to the inner wall of the cleaning box (101) at the bottom of the placement groove (102), a rotating mechanism being provided in the middle of the partition (104), and the semiconductor materials being placed on the rotating mechanism via a bracket assembly (300); A lifting component (200) is fixedly mounted inside the cleaning component (100); a blowing component (400) is rotatably connected to the inner wall of the cleaning box (101) located on one side of the lifting component (200); a flow guide component (500) is fixedly mounted inside the cleaning box (101); the flow guide component (500) is connected to the flushing component (600); and the flushing component (600) is fixedly mounted inside the cleaning box (101).

2. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: A top plate (103) located inside the placement groove (102) is fixedly installed on the top of the cleaning box (101); the top plate (103) is a square hollow structure; exhaust ports (105) are provided on both sides of a partition (104) located inside the cleaning box (101); guide blocks (111) are fixedly connected to the middle of both ends of the partition (104); a slope is provided on one side of the guide block (111) close to the inner wall of the placement groove (102); and a temperature sensor (109) and a sealing gasket (110) are fixedly connected to the inner wall of the cleaning box (101), respectively.

3. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The rotating mechanism comprises a rotating motor (106), the rotating motor (106) being fixedly mounted to the bottom of the partition (104), the output end of the rotating motor (106) being fixedly connected to a turntable (107), the turntable (107) being rotatably connected to the top of the partition (104), and a plurality of evenly distributed positioning pins (108) being fixedly connected to the edge of the turntable (107), the surface of the turntable (107) being provided with a bracket assembly (300) for placing semiconductor materials in an annular structure, the bracket assembly (300) being composed of a carrier frame (301) and a bracket (303), the carrier The carrier frame (301) is fitted and connected to the surface of the rotating disk (107), and positioning holes (305) distributed corresponding to the positioning pins (108) are opened on the edge of the carrier frame (301), symmetrically distributed hanging ears (302) are fixedly connected to both sides of the carrier frame (301), and a bracket (303) with an annular structure is fixedly installed in the middle of the carrier frame (301) between the hanging ears (302), and the semiconductor material is fitted and connected to the top surface of the bracket (303), and a plurality of uniformly distributed limiting blocks (304) are fixedly connected to the edge of the bracket (303), and the limiting blocks (304) are in contact with the edge of the semiconductor material.

4. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The lifting assembly (200) comprises an electric push rod (201), the electric push rod (201) being embedded and installed inside the cleaning box (101), the telescopic end of the electric push rod (201) passing through the partition (104) and being fixedly connected to the surrounding frame (202), the cross section of the surrounding frame (202) being a square hollow structure, the surrounding frame (202) being located outside the carrier frame (301), the middle of both sides of the surrounding frame (202) being fixedly connected to the top cover (205) via the vertical plates (203), the surrounding corners of the surrounding frame (202) and the vertical plates (203) being fixedly connected to the two ends of the vertical rod (204), the vertical plates The top plate (203) and the vertical rod (204) are both located inside the top plate (103); the bottom edge of the top cover (205) is fixedly connected to the sealing ring (206), and the sealing ring (206) is connected to the surface of the top plate (103) in a fitting manner; a movable rod (207) is provided at the bottom of the vertical plate (203) for horizontal sliding; the movable rod (207) has a square hollow structure in cross section and is connected to the inside of the notches on both sides of the bottom of the vertical plate (203); one end of the movable rod (207) is connected to the vertical plate (203) via a spring (208), and the other end of the movable rod (207) is correspondingly arranged above the guide block (111).

5. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The blow-off assembly (400) comprises a drive motor (401), the drive motor (401) being mounted in a chimney mounted inside a cleaning box (101), the output end of the drive motor (401) being fixedly connected to a drive shaft (402), the end of the drive shaft (402) being fixedly connected to a round rod (403), a sleeve rod (404) being rotatably sleeved on the surface of the round rod (403), the two ends of the sleeve rod (404) being fixedly connected to a gear (406) and a heat shield (405), respectively, the drive shaft (402) being fixedly connected to a side plate (406). 7) Internal rotation connection, the side plate (407) is fixedly mounted to the inner wall of the cleaning box (101), and the side wall of the side plate (407) is fixedly connected with a rack (408) with an arc structure, the center of the arc where the rack (408) is located coincides with the axis of the drive shaft (402), and the rack (408) and the gear (406) are distributed correspondingly, a sealing gasket (110) is provided above the side plate (407), and when the heat insulation cover (405) rotates, the edge of the heat insulation cover (405) fits with the surface of the sealing gasket (110).

6. The semiconductor temperature control cleaning equipment according to claim 5, characterized in that: The heat insulation cover (405) is a circular hollow structure. A heater (409) is fixedly mounted on the top of the heat insulation cover (405). The heater (409) is fixedly connected to the inside of the heat insulation cover (405) via a delivery pipe (410). One end of the delivery pipe (410) located inside the heat insulation cover (405) is fitted to the inner wall of the heat insulation cover (405). The heater (409) is fixedly connected to an air inlet pipe (412). The bottom of the heat insulation cover (405) is fixedly connected to an air outlet pipe (411). Both the air inlet pipe (412) and the air outlet pipe (411) are L-shaped structures and are distributed in parallel. The heat insulation cover (405) is fitted to the top surface of the carrier frame (301).

7. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The flow guide assembly (500) comprises a ring (501), the ring (501) being fixedly mounted to the bottom of the cleaning box (101), the ring (501) being fixedly connected to the bottom of the partition (104), a channel for collecting gas being formed between the ring (501) and the cleaning tank, and the channel being located below the exhaust port (105), a cavity (502) being arranged at the bottom of the cleaning box (101) and being connected to the outside, the cavity (502) being connected to the channel, a box cover (112) being hingedly connected to the outer wall of the cleaning box (101) on one side of the cavity (502), and a filter screen being fixedly connected to the inner wall of the cleaning box (101) located inside the cavity (502).

8. The semiconductor temperature control cleaning equipment according to claim 7, characterized in that: A dry ice particle storage tank (503) is fixedly mounted on the outer wall of the cleaning box (101); the top of the dry ice particle storage tank (503) is fixedly connected to a connecting pipe (504) via a delivery pump; the connecting pipe (504) passes through the cleaning box (101) and is in communication with the flushing assembly (600); a pump body (606) is fixedly mounted on the outer wall of the cleaning box (101) above the connecting pipe (504); the pump body (606) is fixedly connected to the flushing assembly (600) via a branch pipe (607); and a control valve (608) is fixedly connected to the end of the branch pipe (607).

9. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: An air pump (505) is fixedly installed inside the cleaning box (101). The air pump (505) is located inside the enclosure (501) below the partition (104). An electric push rod (201) and a rotating motor (106) are also provided inside the enclosure (501). The partition (104) is connected to a first fixed pipe (506) and a second fixed pipe (507) through each other, respectively. The first fixed pipe (506) and the second fixed pipe (507) are respectively distributed corresponding to the air outlet pipe (411) and the air inlet pipe (412). The ends of the first fixed pipe (506), the second fixed pipe (507), the air inlet pipe (412) and the air outlet pipe (411) are fixedly connected to the fitting block (508), and the first fixed pipe (506) and the second fixed pipe (507) are both extended to the outside of the cleaning box (101).

10. The semiconductor temperature control cleaning equipment according to claim 1, characterized in that: The flushing assembly (600) comprises a spray pipe (601), wherein the spray pipe (601) is fixedly mounted to the inner wall of the cleaning box (101), and an impeller (602) is rotatably connected inside the spray pipe (601), wherein the impeller (602) is rotatably connected to a bearing (603) mounted inside the spray pipe (601), and an end of the impeller (602) is fixedly connected to a stirring rod (604), and an end of the spray pipe (601) is fixedly connected to a nozzle (605), and the nozzle (605) is correspondingly arranged above the bracket assembly (300).

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