Composite board, preparation method thereof, heat dissipation device and vehicle

Abstract

The composite plate is suitable for heat dissipation of a to-be-cooled part, and the composite plate comprises a main body part, the main body part comprises connected first and second alloy parts, the first alloy part has a density of p1, the second alloy part has a density of p2, and p1>p2 is satisfied; a maximum temperature change of the to-be-cooled part obtained through testing is AT, and 0<AT≤20K is satisfied; in a cross section of the first and second alloy parts passing through the composite plate in a thickness direction, thicknesses of the first and second alloy parts are δ0 and δ1 respectively, and Δδ=|δ1-δ0| is satisfied, and 0<Δδ<50mm is satisfied; a heat resistance value of the main body part is λ, λ=AT / 2Δδ is satisfied, and 1.07K / mm≤λ≤1.77K / mm is satisfied. The composite plate can meet the requirements of light weight and heat dissipation efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of composite materials, in particular to a composite plate, a preparation method thereof, a heat dissipation device and a vehicle. BACKGROUND

[0002] The existing composite plate as a heat dissipation piece cannot balance lightweight design and heat conduction efficiency. SUMMARY

[0003] The present application aims to provide a composite plate, a preparation method thereof, a heat dissipation device and a vehicle, and solve the problem of difficult balance between lightweight design and heat conduction efficiency of the composite plate.

[0004] To achieve the object of the present application, the present application provides the following technical solutions:

[0005] In a first aspect, the present application provides a composite plate, the composite plate being suitable for dissipating heat from a piece to be cooled, the composite plate comprising a main body part, the main body part comprising a first alloy piece and a second alloy piece, the first alloy piece having a density ρ1, the second alloy piece having a density ρ2, satisfying: ρ1>ρ2; the piece to be cooled having a maximum temperature variation △T obtained by testing, satisfying: 0<△T≤20K; in the thickness direction of the composite plate, the thickness of the first alloy piece and the second alloy piece in the cross section passing through the first alloy piece and the second alloy piece at the same time being δ0, the thickness of the first alloy piece being δ1, △δ=|δ1-δ0|, satisfying: 0mm<△δ<50mm; the main body part having a heat resistance value λ, λ=△T / 2△δ, satisfying: 1.07K / mm≤λ≤1.77K / mm.

[0006] In an embodiment, the first alloy piece is a copper alloy piece, and the second alloy piece is an aluminum alloy piece, preferably, the copper alloy piece comprises Cu and Ag, and preferably further comprises at least one of Bi, Sb, As, Fe, Pb and S; and / or, the aluminum alloy piece comprises Al, and preferably further comprises at least one of Si, Fe, Mg, Cu, Mn, B, Zn and Ti.

[0007] In one embodiment, the copper alloy piece satisfies: the mass fraction of Cu+Ag is a1, wherein 99.7%≤a1<100%; preferably, the mass fraction of Bi is a2, wherein 0

[0008] In one embodiment, the first alloy piece comprises an embedded piece, and the embedded piece of the first alloy piece is embedded in the second alloy piece; or, the second alloy piece comprises an embedded piece, and the embedded piece of the second alloy piece is embedded in the first alloy piece.

[0009] In one embodiment, the size of the embedded piece in the thickness direction of the composite plate is h1, and h1<δ0, and 0

[0010] In one embodiment, the embedded piece of the first alloy piece is multiple, and the multiple embedded pieces of the first alloy piece are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

[0011] Or, the embedded piece of the second alloy piece is multiple, and the multiple embedded pieces of the second alloy piece are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

[0012] In one embodiment, the composite plate further comprises a primer layer and a corrosion-resistant layer, and the primer layer wraps the main body, and the corrosion-resistant layer wraps the primer layer.

[0013] In a second aspect, the present application provides a preparation method of a composite plate, comprising the following steps:

[0014] providing a first alloy and a semi-molten second alloy;

[0015] providing a first alloy and a semi-molten second alloy;

[0016] In one embodiment, the semi-molten second alloy is provided, comprising:

[0017] providing an initial second alloy;

[0018] melting the initial second alloy to obtain a primary second alloy liquid;

[0019] adding chemical elements to the primary second alloy liquid to obtain a secondary second alloy liquid;

[0020] refining and degassing the secondary second alloy liquid to obtain a tertiary second alloy liquid;

[0021] resting the tertiary second alloy liquid to obtain the semi-molten second alloy.

[0022] In one embodiment, the first alloy is provided, comprising:

[0023] providing an initial first alloy;

[0024] degreasing the initial first alloy to obtain a primary processed first alloy;

[0025] deoxidizing the primary processed first alloy to obtain a secondary processed first alloy;

[0026] preheating the secondary processed first alloy to obtain the first alloy.

[0027] In one embodiment, the first alloy is provided, comprising:

[0028] In one embodiment, the heat dissipation device is provided, comprising a heat dissipation object and the composite plate according to any one of the embodiments of the first aspect, wherein the composite plate dissipates heat for the heat dissipation object.

[0029] The application changes the thickness ratio of the first alloy part in the main body part of the composite plate, reduces the weight and cost of the composite plate by using the second alloy part with smaller density than the first alloy part, and the heat resistance value of the main body part of the composite plate with the adjusted composition will also change the heat dissipation effect of the heat dissipation part, that is, the maximum temperature change amount ΔT of the heat dissipation part, and the range of ΔT is 0<ΔT≤20k, the heat resistance value of the composite plate of the application is λ, wherein λ=ΔT / 2Δδ, and 1.07K / mm≤λ≤1.77K / mm, when λ>1.77k / mm, the heat resistance value of the composite plate is too large, which cannot meet the heat dissipation requirement of the composite plate; when λ<1.07k / mm, the change value of the first alloy part is small, so the change value of the weight of the composite plate is small, which cannot realize the combination of heat dissipation performance and weight reduction performance; when 1.07K / mm≤λ≤1.77K / mm, the heat resistance value λ of the main body part of the composite plate with different thickness ratios is always in this range, so that the composite plate can obtain better heat dissipation effect, and the lightweight design is realized by using the second alloy part with small density, the unit mass power density is increased, and the actual vehicle requirement is matched, that is, the composite plate of the application can meet the requirements of lightweight and heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0031] Figure 1 is a schematic view of the main body part of the first embodiment;

[0032] Figure 2 is a schematic view of the main body part of the second embodiment;

[0033] Figure 3 is a schematic view of the main body part of the third embodiment;

[0034] Figure 4 is a schematic view of the main body part of the fourth embodiment;

[0035] Figure 5 is a flowchart of a preparation method of a composite plate of an embodiment;

[0036] Figure 6 is a flowchart of one step in the preparation method of the composite plate of an embodiment;

[0037] Figure 7 is a flowchart of another step in the preparation method of the composite plate of an embodiment.

[0038] Reference Signs List:

[0039] 10 - main body, 11 - first alloy piece, 111 - embedded piece, 12 - second alloy piece, 13 - transition layer. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0041] It should be noted that when a component is referred to as being "fixed" to another component, it can be directly on the other component or there can be an intervening component. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or there can be an intervening component.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety.

[0043] Some embodiments of the present application will be described in detail below with reference to the drawings. The following examples and features in the examples can be combined with each other without conflict.

[0044] Reference can be made to Figure 1 and Figure 2 The present application provides a composite plate suitable for dissipating heat from a heat-dissipating component, the composite plate comprising a main body 10, the main body 10 comprising a first alloy piece 11 and a second alloy piece 12 connected together, the first alloy piece 11 having a density ρ1 and the second alloy piece 12 having a density ρ2, satisfying ρ1 > ρ2; the heat-dissipating component having a maximum temperature change △T obtained by testing, satisfying 0 < △T ≤ 20 K.

[0045] In the cross section of the composite plate passing through the first alloy piece 11 and the second alloy piece 12 in the thickness direction of the composite plate, the thickness of the first alloy piece 11 and the second alloy piece 12 is δ0, the thickness of the first alloy piece 11 is δ1, and △δ = |δ1 - δ0|, satisfying 0 < △δ < 50 mm; the main body 10 has a heat resistance value λ, λ = △T / 2△δ, satisfying 1.07 K / mm ≤ λ ≤ 1.77 K / mm.

[0046] Reference can be made to Figure 1 and Figure 2 Optionally, when the main body part 10 comprises at least three alloy pieces, only the first alloy piece 11 and the second alloy piece 12 adjacent to and connected with each other are analyzed. When a transition layer 13 is arranged between the first alloy piece 11 and the second alloy piece 12, △δ corresponds to the total thickness of the second alloy piece 12 and the transition layer 13.

[0047] Reference can be made to Figure 1 and Figure 2 Optionally, when the first alloy piece 11 is a copper alloy piece and the second alloy piece 12 is an aluminum alloy piece, a transition layer 13 is further arranged between the first alloy piece 11 and the second alloy piece 12. The material of the transition layer 13 can be an intermetallic compound formed by Al and Cu, which can be formed by filling Cu atoms in the Al lattice or by filling Al atoms in the Cu lattice. Specifically, the material of the transition layer 13 can be Cu3Al2, Cu9Al4, CuAl, etc., without limitation.

[0048] Optionally, the first alloy piece 11 is a copper alloy piece and the second alloy piece 12 is an aluminum alloy piece; or, the first alloy piece 11 is a copper alloy piece and the second alloy piece 12 is a nickel alloy piece; or, the first alloy piece 11 is a silver alloy piece and the second alloy piece 12 is a copper alloy piece, etc., without limitation.

[0049] Optionally, △δ is 1 mm, 10 mm, 20 mm, 30 mm, 40 mm, etc., without limitation. λ is 1.07 K / mm, 1.27 K / mm, 1.47 K / mm, 1.67 K / mm, 1.77 K / mm, etc., without limitation.

[0050] Optionally, △T can be 1 K, 5 K, 10 K, 15 K, 20 K, etc., without limitation. The maximum temperature of the heat dissipation object after the heat dissipation object is cooled by the composite plate is T1, and the maximum temperature of the heat dissipation object after the heat dissipation object is cooled by the reference example is T2. The reference example is a plate made of pure first alloy piece, which can be a pure copper alloy piece. It satisfies: △T = T1 - T2.

[0051] Optionally, it also satisfies: 2 mm ≤ δ0 ≤ 25 mm, and δ0 can be 2 mm, 5 mm, 10 mm, 15 mm, 20 mm, 25 mm, etc.

[0052] Optionally, it also satisfies: 1% ≤ δ1 / δ0 ≤ 20%, and δ1 / δ0 can be 1%, 5%, 10%, 15%, 20%, etc.

[0053] Optionally, the first alloy piece 11 can be arranged on at least one end of the second alloy piece 12 in the width direction of the composite plate. Specifically, reference can be made to Figure 1, the second alloy piece 12 is provided with the first alloy piece 11 at one end in the width direction of the composite plate, or, referring to Figure 2 , the second alloy piece 12 is provided with the first alloy piece 11 at both ends in the width direction of the composite plate.

[0054] Optionally, the conductivity of the composite plate is m, satisfying: m≥65%IACS. In the description of the present application, the conductivity of the composite plate is the ratio of the conductivity of the composite plate to the standard conductivity of pure copper material, expressed in %IACS. The standard conductivity of the present application is 100%IACS. The standard conductivity is measured by using an annealed copper wire with a density of 8.89g / cm3, a length of 1m, a mass of 1g, and a resistance of 0.15328 ohms as a measurement standard. When the resistivity of the above annealed copper wire is 1.7241μΩ·cm (or the conductivity is 58.0MS / m) at 20 degrees Celsius, it is determined as 100%IACS (international annealed copper standard). Specifically, by connecting the binding posts of the direct current resistance tester with the composite plate to be measured, inputting the length and cross-sectional area of the composite plate to be measured, and reading the measurement value of the instrument, the conductivity of the composite plate is obtained.

[0055] Optionally, the tensile strength of the composite plate is b, satisfying: b≥110MPa. According to GBT228.1-2010 Metal Materials Tensile Test Part 1: Room Temperature Tensile Requirements, the material is subjected to tensile load on a universal tensile testing machine, and the maximum stress value reached by the material before fracture when the load is continuously increased is the measured tensile strength.

[0056] Optionally, the composite plate also satisfies the requirement of no cracks in 90° bending (1t). According to YB / T5349-2014 Metal Material Bending Mechanical Property Test Method, a microcomputer-controlled electronic universal tensile testing machine is used to deform and bend the material under pressure load to 90°, and a metallographic microscope is used to observe the morphology of the bending part.

[0057] Optionally, the connection mode between the first alloy piece 11 and the second alloy piece 12 can be any one of lamination, cladding, and embedding. Specifically, the first alloy piece 11 can be embedded in the second alloy piece 12, or the second alloy piece 12 can be embedded in the first alloy piece 11; the first alloy piece 11 can clad the second alloy piece 12, or the second alloy piece 12 can clad the first alloy piece 11, without limitation.

[0058] Optionally, after cutting, shaping and other processes, the shape of the composite plate can be rectangular, cylindrical, oval, square, rhombus, etc., without limitation.

[0059] Optionally, when the first alloy piece 11 is a copper alloy piece and the second alloy piece 12 is an aluminum alloy piece, the density of the main body 10 of one embodiment of the present application is 3.94g / cm 3Compared with the pure copper alloy part, the density of the main body part 10 of one embodiment of the present application is 44% of the pure copper material, so the main body part 10 of the present application can reduce the weight of the pure copper material by about 40%. And adding the aluminum alloy part can reduce the cost of the main body part 10. Specifically, the comprehensive cost of the main body part 10 of one embodiment of the present application is about 15% of the comprehensive cost of the main body part 10 prepared by the pure copper material.

[0060] The present application changes the thickness ratio of the first alloy part 11 in the main body part 10 of the composite plate, and reduces the weight and cost of the composite plate by using the second alloy part 12 with a smaller density than the first alloy. Due to the adjustment of the composition of the main body part 10, the heat dissipation effect of the corresponding composite plate on the heat dissipation part, i.e. the maximum temperature change amount ΔT of the heat dissipation part, will also change, and the range of ΔT is 0 < ΔT ≤ 20k. The heat resistance value of the composite plate as a heat dissipation part satisfies λ, and correspondingly, λ = ΔT / 2Δδ, and 1.07K / mm ≤ λ ≤ 1.77K / mm. When λ > 1.77k / mm, the heat resistance value of the composite plate is too large to meet the heat dissipation requirements of the composite plate. When λ < 1.07k / mm, the change value of the Δδ of the corresponding first alloy part is small, so the change value of the weight of the composite plate is small, and the heat dissipation performance and weight reduction performance cannot be balanced. When 1.07K / mm ≤ λ ≤ 1.77K / mm, the heat resistance value λ of the main body part 10 of the composite plate with different thickness ratios is always within this range, so that the composite plate can obtain a better heat dissipation effect, realize lightweight design, increase the unit mass power density, and match the actual vehicle requirements, i.e. the composite plate of the present application can balance the requirements of lightweight and heat dissipation efficiency.

[0061] In one embodiment, the first alloy part 11 is a copper alloy part, and the second alloy part 12 is an aluminum alloy part. Preferably, the copper alloy part comprises Cu and Ag, and preferably further comprises at least one of Bi, Sb, As, Fe, Pb and S; and / or, the aluminum alloy part comprises Al, and preferably further comprises at least one of Si, Fe, Mg, Cu, Mn, B, Zn, Ti.

[0062] Optionally, the aluminum alloy part can be a wrought aluminum alloy of 1 series, 3 series, 4 series or 8 series according to the different added chemical elements. Further, the aluminum alloy part is a wrought aluminum alloy with a brand number of 1060, 1050, 1100, 3003, 8011 or 8030. Specifically, the 1060 aluminum alloy is an alloy formed by adding a small amount of magnesium and zinc to pure aluminum, with a mass fraction of Mg of 0.4%-1% and a mass fraction of Zn of 0.25%.

[0063] Optionally, depending on the chemical elements added, copper alloy parts are classified as follows: copper alloy parts with added Zn are brass, copper alloy parts with added Ni, Zn and other elements are cupronickel, and copper alloy parts with added Sn, Al, Zn and other elements are bronze.

[0064] Adding chemical elements to copper or aluminum to form alloys results in alloys that have advantages over pure aluminum or pure copper, such as high hardness, good heat resistance, and corrosion resistance.

[0065] In one embodiment, the copper alloy component satisfies the following: the mass fraction of Cu + Ag is a1, wherein 99.7% ≤ a1 < 100%; preferably, it also satisfies the following: the mass fraction of Bi is a2, wherein 0 < a2 ≤ 0.001%; ​​and / or, the mass fraction of Sb is a3, wherein 0 < a3 ≤ 0.002%; and / or, the mass fraction of As is a4, wherein 0 < a4 ≤ 0.002%; and / or, the mass fraction of Fe is a5, wherein 0 < a5 ≤ 0.005%; and / or, the mass fraction of Pb is a6, wherein 0 < a6 ≤ 0.005%; and / or, the mass fraction of S is a7, wherein 0 < a7 ≤ 0.005%; and / or; the aluminum alloy component satisfies the following: the mass fraction of Al... The mass fraction is b1, wherein 97.30% ≤ b1 < 100%; preferably, it also satisfies: the mass fraction of Si is b2, wherein 0 < b2 ≤ 0.75%; and / or, the mass fraction of Fe is b3, wherein 0 < b3 ≤ 0.35%; and / or, the mass fraction of Mg is b4, wherein 0 < b4 ≤ 1%; and / or, the mass fraction of Cu is b5, wherein 0 < b5 ≤ 0.1%; and / or, the mass fraction of Mn is b6, wherein 0 < b6 ≤ 0.1%; and / or, the mass fraction of B is b7, wherein 0 < b7 ≤ 0.1%; and / or, the mass fraction of Zn is b8, wherein 0 < b8 ≤ 0.25%; and / or, the mass fraction of Ti is b9, wherein 0 < b9 ≤ 0.05%.

[0066] By adjusting the mass fraction and type of added chemical elements, different types of alloys can be formed, thereby changing the heat resistance, hardness, and other properties of aluminum or copper alloy parts.

[0067] For reference Figure 3 and Figure 4 In one embodiment, the first alloy member 11 includes an insert 111, which is embedded in the second alloy member 12; or, the second alloy member 12 includes an insert 111, which is embedded in the first alloy member 11.

[0068] The shape of the insert 111 can be a cube, a column, etc., without limitation.

[0069] The embedded part 111 is embedded in the first alloy part 11 or the second alloy part 12, so that a better heat conduction effect can be obtained, thereby effectively improving the heat exchange efficiency, reducing the volume of the heat exchanger, making the structure compact, reducing the required occupied space, increasing the unit mass power density and thereby improving the efficiency, and matching the actual on-board demand.

[0070] For reference Figure 3 In an embodiment, the size of the embedded part 111 in the thickness direction of the composite plate is h1, which satisfies h1<δ0, and 0mm<h1≤10mm.

[0071] Optionally, h1 can be 1mm, 4mm, 6mm, 8mm, 10mm, etc., without limitation.

[0072] When there is only one embedded part 111 in the thickness direction of the composite plate, h1 is the size of the single embedded part 111 in the thickness direction of the composite plate; when there are multiple embedded parts 111 in the thickness direction of the composite plate, h1 is the sum of the sizes of the multiple embedded parts 111 in the thickness direction of the composite plate, and the multiple embedded parts 111 are arranged at intervals in the thickness direction of the composite plate.

[0073] The size of the embedded part 111 in the thickness direction of the composite plate is smaller than the size of the main body part 10 in the thickness direction, so that the first alloy part 11 and the second alloy part 12 always exist in the thickness direction of the composite plate, and the heat conduction performance of the composite plate in the thickness direction is good.

[0074] For reference Figure 3 and Figure 4 In an embodiment, the embedded part 111 of the first alloy part 11 is multiple, and the embedded parts 111 of the multiple first alloy parts 11 are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

[0075] Alternatively, the embedded part 111 of the second alloy part 12 is multiple, and the embedded parts 111 of the multiple second alloy parts 12 are arranged at intervals in the length direction of the composite plate and / or the width direction of the composite plate.

[0076] Optionally, the embedded parts 111 of the multiple first alloy parts 11 are arranged at intervals in the length direction of the composite plate, and / or the embedded parts 111 of the multiple first alloy parts 11 are arranged at intervals in the width direction of the composite plate; or, the embedded parts 111 of the multiple second alloy parts 12 are arranged at intervals in the length direction of the composite plate, and / or the embedded parts 111 of the multiple second alloy parts 12 are arranged at intervals in the width direction of the composite plate.

[0077] The embedded pieces 111 can be arranged at equal intervals in the length direction of the composite plate, or can be arranged at intervals in the length direction of the composite plate, without limitation. And / or, the embedded pieces 111 can be arranged at equal intervals in the width direction of the composite plate, or can be arranged at intervals in the width direction of the composite plate, without limitation.

[0078] The composite plate in which the embedded piece 111 is embedded in the first alloy piece 11 or the second alloy piece 12 corresponding one by one in the length and / or width direction of the composite plate can obtain a better heat conduction effect, thereby effectively improving the heat exchange efficiency, reducing the volume of the heat exchanger, compacting the structure, reducing the required occupied space, increasing the unit mass power density and thereby improving the efficiency, and matching the actual on-board demand.

[0079] Optionally, the second alloy piece 12 includes an embedded piece 111, which can be embedded in the first alloy piece 11. The embedded structure of the embedded piece 111 embedded in the second alloy piece 12 can be referred to the above-mentioned embedded structure of the embedded piece 111 embedded in the first alloy piece 11.

[0080] The above-mentioned embedded structure of the embedded piece 111 embedded in the first alloy piece 11 can be referred to. Figure 4 In an embodiment, the number of embedded pieces 111 in the width direction of the composite plate is (m-1), the size of the main body 10 in the width direction of the composite plate is W, the size of the i-th embedded piece 111 in the width direction of the composite plate is xi, which satisfies: 0 < xi ≤ 100 mm, and i ≤ m-1 and i is a positive integer; the distance between the i-th embedded piece 111 and the (i+1)-th embedded piece 111 in the width direction of the composite plate is di, which satisfies: 0 < di ≤ 100 mm; and the following conditions are satisfied:

[0081]

[0082] The di can be 5 mm, 20 mm, 40 mm, 60 mm, 80 mm, 100 mm, etc., without limitation.

[0083] The difference between the distances between the adjacent three embedded pieces 111 in the width direction of the composite plate is △d, which satisfies:

[0084] △d = |di-di+1|, when △d is equal to 0, the embedded pieces 111 are arranged at equal intervals, and when △d is greater than 0, the embedded pieces 111 are not arranged at equal intervals.

[0085] In an embodiment, the number of the inserts 111 in the length direction of the composite plate is (n-1), the size of the main body 10 in the length direction of the composite plate is L, the size of the jth insert 111 in the length direction of the composite plate is yj, and 0 < yj≤ 1000 mm, j≤ n-1, and j is a positive integer; the distance between the jth insert 111 and the (j+1)th insert 111 in the length direction of the composite plate is pj, and 0 < pj≤ 100 mm; and the following conditions are met:

[0086]

[0087] yj can be 100 mm, 200 mm, 400 mm, 600 mm, 800 mm, 1000 mm, etc., without limitation.

[0088] The difference between the distances between any three adjacent inserts 111 in the length direction of the composite plate is Δp, and the following condition is met:

[0089] Δp = |pj-pj+1|, when Δp is equal to 0, the inserts 111 are arranged at equal distances, and when Δp is greater than 0, the inserts 111 are arranged at unequal distances.

[0090] The distribution of the inserts 111 in the length direction and the width direction of the composite plate meets the following conditions:

[0091]

[0092] The length, width, and thickness of the inserts 111 and the distance between the inserts 111 can be designed according to different heat dissipation components, and can match various application scenarios of systems. At the same time, compared with the continuous first alloy component 11, the inserts 111 can further reduce the weight of the composite plate and achieve the design requirement of lightweight.

[0093] In an embodiment, the composite plate further comprises a base layer and a corrosion-resistant layer, the base layer wraps the main body 10, and the corrosion-resistant layer wraps the base layer.

[0094] The material of the base layer can be copper, and the base layer can be formed on the outer side of the main body 10 by electroplating. During the electroplating process, copper metal ions in the positive state are reduced to metal atoms, adsorbed on the surface of the main body 10, and migrated on the surface of the main body 10 until they are incorporated into the crystal lattice to form the base layer. The electroplating process is "driven" by the difference between the reaction potential and the equilibrium potential, so that the base layer is dense, flat, and has good adhesion with the main body, ensuring the adhesion of the subsequent corrosion-resistant layer and preventing the corrosion-resistant layer from falling off.

[0095] The material of the corrosion-resistant layer can be nickel, and the corrosion-resistant layer can be formed on the outer side of the base layer by electroplating. Specifically, the thickness of the corrosion-resistant layer is 10 μm, and the peeling strength is 35 N / mm. By setting the corrosion-resistant layer, excellent corrosion resistance is ensured while a smooth surface layer is obtained, thereby further reducing the flow resistance and enhancing the heat radiation capability to the environment.

[0096] In an embodiment, the present application is different from the conventional single plane module heat conduction. The composite plate of the present application can form various three-dimensional shapes, realize omnidirectional multi-space heat conduction, and the vehicle system applies the composite plate as a heat dissipation member. Multiple composite plates can be connected in series and / or parallel. Specifically, the composite plate is connected and fixed with the heat dissipation member. The composite plate as a heat dissipation member has smaller volume and lighter weight while meeting the heat conduction capacity. The composite plate can also be used as a structural member material. The composite plate realizes multi-layer space three-dimensional layout connection and stress while completing the connection between the internal heat dissipation members of the system. The space utilization rate is high, and the production, installation, and disassembly are more convenient.

[0097] For reference Figure 5 The present application provides a preparation method of a composite plate, comprising the following steps:

[0098] Step S100, providing a first alloy and a semi-molten second alloy;

[0099] Step S200, setting the semi-molten second alloy on the first alloy and performing continuous casting and rolling to obtain a main body part 10 of the composite plate. The main body part 10 is the main body part 10 of the composite plate described in any one of the preceding embodiments.

[0100] In step S200, the continuous casting and rolling can be performed in an oxygen-free environment, and the rolling speed of the oxygen-free continuous casting and rolling can be 0.3 m / s-1.8 m / s, and specifically, can be 0.3 m / s, 0.8 m / s, 1 m / s, 1.8 m / s, etc. The present application performs continuous casting and rolling under high temperature and oxygen-free conditions, solves the problem of oxidation of the first alloy and the second alloy during the compounding of the first alloy piece 11 and the second alloy piece 12, and realizes 100% metallurgical compounding of the first alloy piece 11 and the second alloy piece 12 through equipment control and process adjustment, solves the problems of oxidation and eutectic defects of alloy compounding, and there is no brittle phase between the first alloy piece 11 and the second alloy piece 12; meets the accurate requirements of temperature and time for thermal penetration compounding between the two metals, controls the formation and expansion of the eutectic layer, i.e., the transition layer 13, realizes the continuous casting and semi-molten rolling compounding of the first alloy and the second alloy, and the thermal resistance value of the composite plate prepared by using the semi-molten rolling compounding is higher than that of the composite plate prepared by using conductive adhesive compounding or other forms of connection. The first alloy and the second alloy are prepared into an integral whole by the compounding and rolling method, and the brazing process is reduced. Since the thermal conductivity of the brazing material is much lower than that of the first alloy and the second alloy, the stability of the main body 10 is improved, and the thermal resistance of the main body 10 is also reduced.

[0101] Reference can be made to Figure 6 In an embodiment, step S100 comprises:

[0102] Step S11, providing an initial second alloy;

[0103] Step S12, melting the initial second alloy to obtain a primary second alloy liquid;

[0104] Step S13, adding chemical elements to the primary second alloy liquid to obtain a secondary second alloy liquid;

[0105] Step S14, refining and degassing the secondary second alloy liquid to obtain a tertiary second alloy liquid;

[0106] Step S15, standing the tertiary second alloy liquid to obtain a semi-molten second alloy.

[0107] When the second alloy in step S100 is an aluminum alloy, the initial second alloy is an aluminum ingot, and in step S12, the temperature for melting the aluminum ingot can be 700-850℃, and optionally, can be 700℃, 750℃, 800℃, 850℃, etc., without limitation.

[0108] In step S13, the chemical elements can be at least one of Si, Fe, Mg, Cu, Mn, B, Zn, and Ti, and the chemical elements are first heated to a molten state and then added to the primary aluminum alloy liquid.

[0109] In step S14, the refining and degassing temperature is 750℃-810℃, optionally 750℃, 770℃, 780℃, 810℃, etc., without limitation. The gas in the secondary aluminum alloy liquid is mainly hydrogen. Degassing methods include introducing inert gases such as nitrogen or argon. The gas forms small bubbles in the secondary aluminum alloy liquid. As the bubbles rise, they adsorb inclusions and hydrogen from the secondary aluminum alloy liquid. When the bubbles rise to the surface and are expelled, the purpose of degassing and slag removal is achieved.

[0110] Step S15: Allow the molten aluminum alloy to stand for three times, then pour it into a preheated casting nozzle. The cast molten aluminum alloy is cooled and crystallized to obtain a semi-molten aluminum alloy. The standing temperature is 650℃-850℃, optional, and can be 650℃, 750℃, 780℃, 850℃, etc., without limitation. The standing time is 5min-10min, optional, and can be 5min, 6min, 8min, 10min, etc., without limitation.

[0111] For reference Figure 7 In one embodiment, step S100 includes:

[0112] Step S21, provide the initial first alloy;

[0113] Step S22: Degrease the initial first alloy to obtain a first-processed first alloy;

[0114] Step S23: Deoxidize the first alloy after primary treatment to obtain the first alloy after secondary treatment;

[0115] Step S24: Preheat the first alloy for secondary treatment to obtain the first alloy.

[0116] In step S22, the degreasing process includes cleaning, pickling, and passivation. The working temperature for the degreasing process can be 40℃-60℃ to avoid damaging the copper surface due to excessively high temperatures.

[0117] In step S23, the deoxidation method can be mechanical, soaking and cleaning, solution method, passivation treatment, etc., without limitation.

[0118] In step S24, the preheating temperature is 230℃-250℃, and can be selected from 230℃, 2340℃, 238℃, 240℃, etc., without limitation.

[0119] In one embodiment, during the continuous casting and rolling process of obtaining the main body 10 in step S200, a billet is first obtained after continuous rolling. The billet is then annealed at a temperature of 180℃-360℃ for 1h-15h. The annealed billet is then subjected to homogenization heat treatment at a temperature of 520℃-580℃ for 8h-22h. After homogenization heat treatment, the billet is sawed and milled to remove the head and tail of the billet. The length of the removed part is not less than 100mm, and the oxide scale on the surface of the billet is milled off to a depth of not less than 5mm.

[0120] In one embodiment, the main body 10 can also be formed by directly welding a second alloy part 12 onto the surface of the first alloy part 11. The welding requirements are -40°C to 150°C (30 min), a transition time of less than 30 s, and a thermal resistance deviation of no more than 20% under 1000 cycles.

[0121] The present invention provides a heat dissipation device, including a component to be heatd and a composite plate as described in any of the foregoing embodiments, wherein the composite plate dissipates heat from the component to be heatd.

[0122] Optionally, the component to be cooled can be a battery, a chip, etc.

[0123] Optionally, the composite plate can serve as at least part of the heat sink to dissipate heat from the heat sink. The heat sink can be entirely or partially formed from the composite plate. The heat sink may include one composite plate or multiple composite plates stacked together.

[0124] This invention provides a vehicle including the heat dissipation device described in any of the foregoing embodiments. Using the heat dissipation device of this invention, while meeting the heat dissipation requirements of the components to be cooled, it is beneficial to improve the lightweight design of the vehicle's cooling system.

[0125] The technical solution of the present invention will be described in detail below through specific embodiments.

[0126] The thickness of the main body 10 in Examples 1-5 is the thickness δ0 of the first alloy part 11 and the second alloy part 12, and δ0 is 3mm in both cases. The first alloy part 11 in Examples 1-5 is a copper alloy part, and the second alloy part 12 is an aluminum alloy part.

[0127] Example 1

[0128] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 2.5mm, and Δδ=|δ1-δ0|=0.5mm; the highest temperature change ΔT of the heat dissipation component is measured to be 1.677K, and λ is calculated to be 1.677K / mm.

[0129] The copper alloy contains 99.9% Cu+Ag by mass, 0.001% Bi by mass, 0.001% Sb by mass, 0.001% As by mass, and 0.02% Fe by mass.

[0130] The aluminum alloy contains 99.49% Al, 0.2% Si, 0.3% Fe, 0.001% Mg, 0.001% Cu, and 0.003% Mn by mass.

[0131] Example 2

[0132] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 2mm, and Δδ=|δ1-δ0|=1mm; the highest temperature change ΔT of the heat dissipation component is measured to be 2.753K, and λ is calculated to be 1.377K / mm.

[0133] The copper alloy contains 99.9% Cu+Ag by mass, 0.001% Bi by mass, 0.001% Sb by mass, and 0.01% Fe by mass.

[0134] The aluminum alloy contains 99.39% Al, 0.23% Si, 0.35% Fe, 0.001% Mg, 0.001% Cu, and 0.006% Mn by mass.

[0135] Example 3

[0136] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 1.5mm, and Δδ=|δ1-δ0|=1.5mm; the highest temperature change ΔT of the heat dissipation component is measured to be 3.929K, and λ is calculated to be 1.310K / mm.

[0137] The copper alloy contains 99.9% Cu + Ag by mass, 0.001% Bi by mass, and 0.002% Sb by mass.

[0138] The aluminum alloy contains 99.6% Al, 0.1% Si, 0.2% Fe, 0.001% Mg, 0.001% Cu, and 0.001% Mn by mass.

[0139] Example 4

[0140] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 1mm, and Δδ=|δ1-δ0|=2mm; the highest temperature change ΔT of the heat dissipation component is measured to be 5.292K, and λ is calculated to be 1.323K / mm.

[0141] The compositions of the copper alloy and aluminum alloy are the same as in Example 1.

[0142] Example 5

[0143] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 0.5mm, and Δδ=|δ1-δ0|=2.5mm; the highest temperature change ΔT of the heat dissipation component is measured to be 6.913K, and λ is calculated to be 1.383K / mm.

[0144] The compositions of the copper alloy and aluminum alloy are the same as in Example 1.

[0145] Example 6

[0146] like Figure 3 The composite plate shown consists of six inserts made of copper alloy, which are embedded within an aluminum alloy component. There are six inserts along the width of the composite plate and one along its length. The thickness of the composite plate, δ0, is 3 mm, and the thickness of the copper alloy component, δ1, is 2.5 mm. Δδ = |δ1 - δ0| = 0.5 mm. The measured maximum temperature change ΔT of the component to be cooled is 1.758 K, and the calculated λ is 1.758 K / mm.

[0147] The compositions of the copper alloy and aluminum alloy are the same as in Example 1.

[0148] Reference Example

[0149] The main body 10 is entirely made of copper alloy, and the thickness δ1 of the copper alloy is 3mm. The copper alloy contains 99.9% Cu+Ag by mass, 0.001% Bi by mass, and 0.002% Sb by mass.

[0150] Comparative Example 1

[0151] like Figure 1The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 0.2mm, and Δδ=|δ1-δ0|=2.8mm; the highest temperature change ΔT of the heat dissipation component is measured to be 21.6K, and λ is calculated to be 3.857K / mm.

[0152] The compositions of the copper alloy and aluminum alloy are the same as in Example 1.

[0153] Comparative Example 2

[0154] like Figure 1 The composite plate shown is formed by stacking aluminum alloy parts on copper alloy parts. The thickness of the composite plate δ0 is 3mm, the thickness of the copper alloy parts δ1 is 2.7mm, and Δδ=|δ1-δ0|=0.3mm; the highest temperature change ΔT of the heat dissipation component is measured to be 0.56K, and λ is calculated to be 0.933K / mm.

[0155] The compositions of the copper alloy and aluminum alloy are the same as in Example 1.

[0156] The test method for the highest temperature change of the heat dissipation component is as follows: The heat dissipation performance of the composite plates in the examples, comparative examples, and reference examples is tested. A heat dissipation component of the same power is fixed at the geometric center of the surface of the composite plate. After running for 2 hours, the temperature at the geometric center of the surface of the heat dissipation component is measured and recorded; this is the highest temperature of the heat dissipation component. The test results are shown in Table 1. In Table 1, the highest temperature of the heat dissipation component after using the composite plate is T1, the highest temperature of the heat dissipation component after using the reference example is T2, and the highest temperature change of the first alloy component is ΔT, where ΔT = T1 - T2.

[0157] The weight reduction ratio is calculated as follows: the weight reduction ratio is the percentage reduction in weight of the main body 10 of the embodiment and comparative example compared to the weight of the main body 10 of the reference example. The test methods for the relevant data in Table 2 have been described in the foregoing embodiments. Table 2 shows the test results for properties such as conductivity and tensile strength of the embodiment and comparative example.

[0158] When the reference example is a pure copper alloy part, T2 is 129.743℃ and the weight of the reference example is 537g.

[0159] Table 1

[0160] T1(℃) ΔT (K) λ (K / mm) Weight (g) Weight loss ratio Example 1 131.420 1.677 1.677 473 12％ Example 2 132.496 2.753 1.377 410 24％ Example 3 133.672 3.929 1.310 347 35％ Example 4 135.035 5.292 1.323 288 46％ Example 5 136.656 6.913 1.383 220 59％ Example 6 131.501 1.758 1.758 443 18％ Comparative Example 1 151.343 21.6 3.857 187 65％ Comparative Example 2 130.311 0.56 0.933 508 5％

[0161] Table 2

[0162]

[0163] The temperature of the to-be-cooled part is below 150 DEG C, which can ensure the efficiency and safety. As shown in the test results in Table 1, the composite plate prepared by the main body part 10 of the embodiment 1-6 can meet the temperature requirement of the to-be-cooled part, effectively reduce the center temperature of the to-be-cooled part, and obviously improve the unit mass power density composite efficiency, which is beneficial to the system light weight and heat conduction. At the same time, the design requirements of light weight and low cost can be met, so the composite plate of the application is suitable for manufacturing the heat dissipation device of the vehicle, which is beneficial to improve the light weight and mileage of the vehicle.

[0164] As shown in Table 1, the λ of the comparative example 1 is greater than 1.77K / mm, and the corresponding ΔT is greater than 20k, which exceeds the maximum working temperature of the to-be-cooled part, so the comparative example 1 cannot meet the heat dissipation requirement; the λ of the comparative example 2 is less than 1.07K / mm, and the corresponding weight reduction ratio is 5%, and the corresponding ΔT is 0.56K. Compared with the embodiment 1-6, although the maximum temperature change of the to-be-cooled part does not change much, the mass of the composite plate is not obviously reduced, so it is considered that the comparative example 2 cannot realize the combination of heat dissipation effect and light weight.

[0165] As shown in Table 2, the composite plate of the embodiment 1-6 can ensure the heat dissipation effect and light weight, and the conductivity and tensile strength of the composite plate are good, and meet the 90° bending (1t) without cracks. The tensile strength of the comparative example 1 is poor and does not meet the requirement of 90° bending (1t) without cracks, and the comparative example 2 also does not meet the requirement of 90° bending (1t) without cracks. Therefore, the composite plate of the application is suitable for manufacturing the heat dissipation device of the vehicle.

[0166] In the description of the embodiments of the application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the drawings described, and are only for the convenience of describing the application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application.

[0167] The above disclosure is only one preferred embodiment of the application, and of course cannot limit the scope of the application. Those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the claims of the application still belong to the scope covered by the application.​

Claims

1. A composite board, characterized in that, The composite plate is used to dissipate heat from the component to be cooled. The composite plate includes a main body, which includes a first alloy component and a second alloy component connected together. The density of the first alloy component is ρ1, and the density of the second alloy component is ρ2, satisfying: ρ1 > ρ2. The highest temperature change of the component to be cooled is ΔT, satisfying: 0 < ΔT ≤ 20K. In the cross-section of the composite plate passing through both the first alloy component and the second alloy component in the thickness direction, the thicknesses of the first alloy component and the second alloy component are δ0, and the thickness of the first alloy component is δ1. Δδ = |δ1 - δ0|, satisfying: 0 < Δδ < 50mm. The thermal resistance value of the main body is λ, λ = ΔT / 2Δδ, satisfying: 1.07K / mm ≤ λ ≤ 1.77K / mm.

2. The composite board according to claim 1, characterized in that, The first alloy component is a copper alloy component, and the second alloy component is an aluminum alloy component; and / or, the aluminum alloy component comprises Al.

3. The composite board according to claim 2, characterized in that, The copper alloy component includes Cu and Ag.

4. The composite board according to claim 3, characterized in that, The copper alloy component also includes at least one of Bi, Sb, As, Fe, Pb, and S.

5. The composite board according to claim 2, characterized in that, The aluminum alloy parts also include at least one of Si, Fe, Mg, Cu, Mn, B, Zn, and Ti.

6. The composite board according to claim 2, characterized in that, In the copper alloy component, the following condition must be met: the mass fraction of Cu+Ag is a1, wherein 99.7%≤a1<100%; and / or; In the aluminum alloy part, the following condition must be met: the mass fraction of Al is b1, where 97.30% ≤ b1 < 100%.

7. The composite board according to claim 6, characterized in that, The copper alloy component further satisfies the following conditions: the mass fraction of Bi is a2, where 0 < a2 ≤ 0.001%; ​​and / or, the mass fraction of Sb is a3, where 0 < a3 ≤ 0.002%; and / or, the mass fraction of As is a4, where 0 < a4 ≤ 0.002%; and / or, the mass fraction of Fe is a5, where 0 < a5 ≤ 0.005%; and / or, the mass fraction of Pb is a6, where 0 < a6 ≤ 0.005%; and / or, the mass fraction of S is a7, where 0 < a7 ≤ 0.005%.

8. The composite board according to claim 6, characterized in that, The aluminum alloy parts also satisfy the following conditions: the mass fraction of Si is b2, where 0 < b2 ≤ 0.75%; and / or, the mass fraction of Fe is b3, where 0 < b3 ≤ 0.35%; and / or, the mass fraction of Mg is b4, where 0 < b4 ≤ 1%; and / or, the mass fraction of Cu is b5, where 0 < b5 ≤ 0.1%; and / or, the mass fraction of Mn is b6, where 0 < b6 ≤ 0.1%; and / or, the mass fraction of B is b7, where 0 < b7 ≤ 0.1%; and / or, the mass fraction of Zn is b8, where 0 < b8 ≤ 0.25%; and / or, the mass fraction of Ti is b9, where 0 < b9 ≤ 0.05%.

9. The composite board according to claim 1, characterized in that, The first alloy component includes an insert, which is embedded in the second alloy component; Alternatively, the second alloy component may include an insert, which is embedded in the first alloy component.

10. The composite board according to claim 9, characterized in that, The dimension of the insert in the thickness direction of the composite plate is h1, which satisfies: h1 < δ0, and 0 < h1 ≤ 10 mm.

11. The composite board according to claim 9, characterized in that, The first alloy component has multiple inserts, and the multiple inserts of the first alloy component are spaced apart in the length direction and / or width direction of the composite plate. Alternatively, there may be multiple inserts of the second alloy component, with the multiple inserts of the second alloy component spaced apart along the length direction and / or the width direction of the composite plate.

12. The composite board according to claim 1, characterized in that, The composite board also includes a base layer and a corrosion-resistant layer, wherein the base layer wraps around the main body and the corrosion-resistant layer wraps around the base layer.

13. A method for preparing a composite board, characterized in that, Includes the following steps: Provide a first alloy and a semi-molten second alloy; The semi-molten second alloy is disposed on the first alloy and continuously cast and rolled to obtain the main body, wherein the main body is the main body of the composite plate as described in any one of claims 1 to 12.

14. The method for preparing the composite plate according to claim 13, characterized in that, Provide a semi-molten second alloy, comprising: Provide an initial second alloy; The initial second alloy is melted to obtain a primary second alloy liquid; Adding at least one of Si, Fe, Mg, Cu, Mn, B, Zn, and Ti to the primary second alloy liquid yields a secondary second alloy liquid. The secondary second alloy liquid is refined and degassed to obtain a tertiary second alloy liquid; The second alloy liquid was left to stand for three times to obtain the semi-molten second alloy.

15. The method for preparing the composite plate according to claim 13, characterized in that, The first alloy also includes: Provide the initial first alloy; The initial first alloy is degreased to obtain a first-processed first alloy; The first alloy undergoes deoxidation after primary treatment to obtain the second-treated first alloy. The first alloy is obtained by preheating the second-processed alloy.

16. A heat dissipation device, characterized in that, It includes a heat-dissipating component and a composite plate as described in any one of claims 1 to 12, wherein the composite plate dissipates heat from the heat-dissipating component.

17. A vehicle, characterized in that, Includes the heat dissipation device as described in claim 16.

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