A composite additive for electrolytic copper foil

Abstract

The invention discloses a composite additive for electrolytic copper foil, belonging to the technical field of electrolytic copper foil. The additive is an aqueous solution containing a brightener, a leveling agent, a wetting agent, cerium sulfate and a high resistance and high elongation agent; the brightener is sodium polydisulfide dipropane sulfonate, the leveling agent is at least one of protein powder, gelatin and leveling agent ADT-3, and the wetting agent is disodium fatty alcohol polyoxyethylene ether sulfonated succinic acid monoester. The additive of the invention can be used to prepare an electrolytic copper foil with high smoothness, high density, high tensile strength and high elongation, meeting higher use requirements.

Description

Technical Field

[0001] The invention relates to the technical field of electrolytic copper foil, and more specifically, to a composite additive for electrolytic copper foil. Background Art

[0002] In recent years, with the rapid development of portable electronic products and the use of large lithium-ion green electric vehicles, the lithium battery industry has developed rapidly, which has brought new development opportunities to electrolytic copper foil used as the negative electrode material of lithium batteries, but at the same time, it has also put forward higher requirements on the supply demand and performance demand of electrolytic copper foil. However, the tensile strength and elongation of electrolytic copper foil produced by conventional domestic additives cannot meet the development needs of thin and light copper foil and high performance. It still relies on imported additives from abroad, but the high cost and long supply cycle greatly limit the production of electrolytic copper foil. Therefore, it is necessary to find a better additive formula to make electrolytic copper foil reach a higher grade. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the above-mentioned prior art and provide an electrolytic copper foil composite additive to obtain an electrolytic copper foil with high smoothness, high density, high tensile strength and high elongation to meet higher usage requirements.

[0004] In order to achieve the above object, the present invention adopts the following technical solution:

[0005] A composite additive for electrolytic copper foil, which is an aqueous solution containing a brightener, a leveling agent, a wetting agent, cerium sulfate and a high resistance and high ductility agent; the brightener is sodium polydisulfide dipropane sulfonate, the leveling agent is at least one of protein powder, gelatin and leveling agent ADT-3, and the wetting agent is disodium fatty alcohol polyoxyethylene ether sulfonated succinic acid monoester.

[0006] The present invention is further configured that the high resistance and high ductility agent is the electrolytic copper foil high resistance and high ductility agent YL-001.

[0007] The present invention is further configured such that the concentration of the brightener is 0.4-1.6 mg / L.

[0008] The present invention is further configured such that the concentration of the leveling agent is 4-16 mg / L.

[0009] The present invention is further configured such that the concentration of the wetting agent is 2-14 mg / L.

[0010] The present invention is further configured such that the concentration of cerium sulfate is 3-6 mg / L.

[0011] The present invention is further configured such that the concentration of the high-anti-longevity agent is 0.2-0.6 mg / L.

[0012] The present invention is further configured that the leveling agent ADT-3 is prepared from dimethylimidazole and 1,4-butanediol diglycidyl ether as raw materials.

[0013] The present invention is further configured that the additive is an aqueous solution containing sodium polydipropylene sulfonate, gelatin, leveler ADT-3, disodium fatty alcohol polyoxyethylene ether sulfonated succinic acid monoester, cerium sulfate and electrolytic copper foil high resistance and high ductility agent YL-001.

[0014] In summary, the present invention has the following beneficial effects:

[0015] By rationally compounding the various materials of electrolytic copper foil additives, an electrolytic copper foil with high smoothness, high density, high tensile strength and high elongation is obtained; and when the leveling agent ADT-3, the electrolytic copper foil high resistance and high elongation agent YL-001, and cerium sulfate are compounded, the three materials have a synergistic effect, which can significantly improve the room temperature tensile strength and elongation of the copper foil. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] The electrolytic copper foil composite additive of the present invention is an aqueous solution containing brightener, leveler, wetting agent, cerium sulfate and high resistance and high extension agent; wherein the brightener concentration is 0.4-1.6 mg / L, the leveler concentration is 4-16 mg / L, the wetting agent concentration is 2-14 mg / L, the cerium sulfate concentration is 3-6 mg / L, and the high resistance and high extension agent concentration is 0.2-0.6 mg / L. The brightener, leveler, wetting agent, cerium sulfate and high resistance and high extension agent are added to water in proportion and mixed evenly to obtain the electrolytic copper foil composite additive of the present invention.

[0018] The brightener is sodium polydisulfide dipropane sulfonate; the leveling agent is at least one of protein powder, gelatin, and leveling agent ADT-3. The leveling agent ADT-3 is made of dimethylimidazole and 1,4-butanediol diglycidyl ether as raw materials and is prepared at a feeding temperature of 85°C. The specific preparation method refers to the paper: Synthesis and properties of copper plating leveling agent for blind holes in printed circuit boards. He Nian, Zeng Xiangjian, Lian Chunyan, Wang Jian, Feng Zhaohui, Zhou Zhongxin, Pan Zhanchang, Hu Guanghui, Zeng Qingming. Electroplating and Finishing. 2024, 43(11); the wetting agent is disodium fatty alcohol polyoxyethylene ether sulfonated succinic acid monoester; the high resistance and high ductility agent is preferably the electrolytic copper foil high resistance and high ductility agent YL-001 purchased from Hubei Yalong New Materials Co., Ltd.

[0019] The preferred embodiments are as follows:

[0020] Example 1

[0021] Brightener sodium polydisulfide dipropane sulfonate, protein powder, gelatin, wetting agent disodium polyoxyethylene ether sulfonated succinate, cerium sulfate and electrolytic copper foil high resistance and high ductility agent YL-001 are added into water in proportion and mixed evenly to prepare electrolytic copper foil composite additive; in the electrolytic copper foil composite additive: the concentration of sodium polydisulfide dipropane sulfonate is 1.2 mg / L, the concentration of protein powder is 4 mg / L, the concentration of gelatin is 4 mg / L, the concentration of disodium polyoxyethylene ether sulfonated succinate is 10 mg / L, the concentration of cerium sulfate is 5 mg / L, and the concentration of electrolytic copper foil high resistance and high ductility agent YL-001 is 0.5 mg / L.

[0022] Example 2

[0023] Brightener sodium polydisulfide dipropane sulfonate, gelatin, leveler ADT-3, wetting agent disodium polyoxyethylene ether sulfonated succinate, cerium sulfate and high resistance and high ductility agent YL-001 are added to water in proportion and mixed evenly to prepare an electrolytic copper foil composite additive; in the electrolytic copper foil composite additive: the concentration of sodium polydisulfide dipropane sulfonate is 1.2 mg / L, the concentration of leveler ADT-3 is 4 mg / L, the concentration of gelatin is 4 mg / L, the concentration of disodium polyoxyethylene ether sulfonated succinate is 10 mg / L, the concentration of cerium sulfate is 5 mg / L, and the concentration of high resistance and high ductility agent YL-001 for electrolytic copper foil is 0.5 mg / L.

[0024] Example 3

[0025] Brightener sodium polydisulfide dipropane sulfonate, protein powder, leveler ADT-3, wetting agent disodium polyoxyethylene ether sulfonated succinate, cerium sulfate and high resistance and high ductility agent YL-001 are added to water in proportion and mixed evenly to prepare an electrolytic copper foil composite additive; in the electrolytic copper foil composite additive: the concentration of sodium polydisulfide dipropane sulfonate is 1.2 mg / L, the concentration of leveler ADT-3 is 4 mg / L, the concentration of protein powder is 4 mg / L, the concentration of disodium polyoxyethylene ether sulfonated succinate is 10 mg / L, the concentration of cerium sulfate is 5 mg / L, and the concentration of high resistance and high ductility agent YL-001 for electrolytic copper foil is 0.5 mg / L.

[0026] Comparative Example 1

[0027] The electrolytic copper foil composite additive was prepared according to the method of Example 2, except that the electrolytic copper foil high resistance and high ductility agent YL-001 was replaced by thiourea in equal amounts.

[0028] Comparative Example 2

[0029] The electrolytic copper foil composite additive was prepared according to the method of Example 2, except that an equal amount of cerium sulfate was replaced by sodium tungstate.

[0030] Copper sulfate pentahydrate, sulfuric acid and hydrochloric acid were added to the electrolytic copper foil composite additives prepared in Examples 1 to 3 and Comparative Examples 1 to 2 to prepare electrolytes respectively, and the copper ion concentration in the five electrolytes was controlled to be 65 g / L, the sulfuric acid concentration was 90 g / L, and the chloride ion concentration was 40 g / L. Then, electrolytic copper foils with a thickness of 6 μm were prepared using each electrolyte under the same conditions (wherein the deposition current density was 50 A·dm -2 ), the obtained electrolytic copper foil was subjected to performance tests, and the results are shown in Table 1.

[0031] Table 1

[0032]

[0033] As can be seen from Table 1, a smooth, dense copper foil with high tensile strength and high elongation can be prepared by using the composite additive of the present invention; and when the leveling agent ADT-3, the electrolytic copper foil high resistance and high ductility agent YL-001, and cerium sulfate are added for compounding, the flatness, room temperature tensile strength and elongation of the copper foil can be significantly improved; although when gelatin is added to the additive, the high temperature tensile strength of the copper foil will be reduced to a greater extent, when the leveling agent ADT-3, the electrolytic copper foil high resistance and high ductility agent YL-001, and cerium sulfate are added for compounding, the high temperature tensile strength of the copper foil is reduced less.

[0034] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A composite additive for electrolytic copper foil, characterized in that: The additive is an aqueous solution containing a brightener, a leveling agent, a wetting agent, cerium sulfate and a high resistance and high extension agent; the brightener is sodium polydisulfide dipropane sulfonate, the leveling agent is at least one of protein powder, gelatin and leveling agent ADT-3, and the wetting agent is disodium fatty alcohol polyoxyethylene ether sulfonated succinic acid monoester.

2. The electrolytic copper foil composite additive according to claim 1, characterized in that: The high resistance and high ductility agent is the electrolytic copper foil high resistance and high ductility agent YL-001.

3. The electrolytic copper foil composite additive according to claim 1, characterized in that: The brightener concentration is 0.4-1.6 mg / L.

4. The electrolytic copper foil composite additive according to claim 1, characterized in that: The concentration of the leveler is 4-16 mg / L.

5. The electrolytic copper foil composite additive according to claim 1, characterized in that: The wetting agent concentration is 2-14 mg / L.

6. The electrolytic copper foil composite additive according to claim 1, characterized in that: The concentration of cerium sulfate is 3-6 mg / L.

7. The electrolytic copper foil composite additive according to claim 1, characterized in that: The concentration of the high-anti-high-extending agent is 0.2-0.6 mg / L.

8. The electrolytic copper foil composite additive according to claim 1, characterized in that: The leveling agent ADT-3 is prepared from dimethylimidazole and 1,4-butanediol diglycidyl ether as raw materials.

9. The electrolytic copper foil composite additive according to claim 1, characterized in that: The additive is an aqueous solution containing sodium polydisulfide dipropane sulfonate, gelatin, leveler ADT-3, disodium fatty alcohol polyoxyethylene ether sulfonated succinic acid monoester, cerium sulfate and electrolytic copper foil high resistance and high ductility agent YL-001.

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