Liquid cooling component and optical network equipment

Abstract

The present specification provides a liquid-cooled heat dissipation component and an optical network device, which relate to the field of heat exchange. A liquid-cooled heat dissipation component includes: at least two heat dissipation plate groups, each heat dissipation plate group is provided with a plurality of heat dissipation plates, the heat dissipation plates in at least two heat dissipation plate groups are arranged horizontally, and the heat dissipation plates in one heat dissipation plate group are separated by heat dissipation plates in other heat dissipation plate groups; at least two liquid cooling pipelines, one liquid cooling pipeline correspondingly connects to a heat dissipation plate in a heat dissipation plate group, and a height difference is formed between different liquid cooling pipelines; a plurality of brackets, corresponding to the heat dissipation plates in the heat dissipation plate group, used to fix the corresponding heat dissipation plates to the device to be cooled. Through the above structure, the deployment density of electrical components in network equipment can be improved.

Description

Technical Field

[0001] The present invention relates to the field of heat exchange technology, and in particular to a liquid cooling component and an optical network device. Background Art

[0002] With the development of electronic technology, the power of electrical components in electronic equipment has gradually increased, and the heat generated inside the electronic equipment has also increased accordingly, requiring higher heat dissipation efficiency. Air cooling has gradually reached a bottleneck. Therefore, liquid cooling has been applied to the heat dissipation of electronic equipment due to its higher heat dissipation efficiency.

[0003] In optical network equipment, the data transmission of optical signals relies on the connection between optical modules and optical module interfaces. When the bandwidth increases, the number and deployment density of optical module interfaces in optical network equipment will increase accordingly. Since liquid cooling requires the circulation of cold liquid through pipelines, when liquid cooling is required to dissipate heat from optical modules, the increase in the number and deployment density will undoubtedly increase the number of pipelines, thereby affecting the settings of other electrical components in optical network equipment and reducing the deployment density of electrical components in optical network equipment. Summary of the invention

[0004] In order to overcome the problems existing in the related art, this specification provides a liquid cooling heat dissipation component and an optical network device.

[0005] According to a first aspect of an embodiment of this specification, a liquid cooling heat dissipation assembly is provided, comprising:

[0006] At least two heat sink groups, each heat sink group is provided with a plurality of heat sinks, the heat sinks in at least two heat sink groups are arranged transversely, and the heat sinks in one heat sink group are spaced apart by heat sinks in other heat sink groups;

[0007] At least two liquid cooling pipelines, one liquid cooling pipeline is connected to a heat sink in a heat sink group, and a height difference is formed between different liquid cooling pipelines;

[0008] A plurality of brackets, corresponding to the heat sinks in the heat sink group, are used to fix the corresponding heat sinks to the device to be cooled.

[0009] Optionally, the heat sink includes:

[0010] plate body;

[0011] An abutment block formed on the lower surface of the plate body;

[0012] A pipeline accommodating groove is formed in the plate body and extends from the front end of the plate body to the rear end of the plate body.

[0013] Optionally, the heat sink includes:

[0014] plate body;

[0015] An abutment block formed on the lower surface of the plate body;

[0016] A liquid cooling channel is formed in the plate body;

[0017] A liquid cooling joint, fixed to the side of the plate body and connected to the liquid cooling channel;

[0018] Wherein, the liquid cooling joint is connected to the liquid cooling pipeline.

[0019] Optionally, a guide portion is provided at the front end of the abutment block.

[0020] Optionally, a bracket slot is also provided on the plate body.

[0021] Optionally, the plate body further includes:

[0022] a connecting portion; and

[0023] The linkage parts are respectively fixed to the connection parts of the heat sinks in the at least two heat sink groups.

[0024] Optionally, each of the brackets corresponds to a heat sink in the at least two heat sink groups.

[0025] Optionally, the bracket comprises:

[0026] two fixing parts, fixed on two sides of the heat sinks in the at least two heat sink groups; and

[0027] The limiting elastic arm is connected between the two fixing parts.

[0028] Optionally, the limiting elastic arm includes:

[0029] An extension section extending upward from an upper portion of the fixing portion along a side wall of the heat dissipation plate;

[0030] An avoidance section extends from the end of the extension section to the fixing portion on the opposite side;

[0031] The limiting sections abut against the upper surface of the heat dissipation plate and are respectively connected to the ends of the avoidance sections.

[0032] According to a second aspect of an embodiment of this specification, an optical network device is provided, including:

[0033] A plurality of optical module interfaces, wherein a hollow area is provided on the housing of the optical module interface;

[0034] an optical module, plugged into the optical module interface; and

[0035] The liquid cooling heat dissipation component described in any of the above items;

[0036] Wherein, each heat sink in at least two heat sink groups in the liquid-cooled heat dissipation assembly corresponds to an optical module interface, and the heat sink extends through the hollow area into the shell to abut against the upper side of the optical module as a device to be cooled.

[0037] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0038] In an embodiment of the present specification, a plurality of heat sinks are divided into at least two heat sink groups in a liquid-cooled heat dissipation component. Liquid cooling pipelines that connect the heat sinks in different heat sink groups are grouped through liquid cooling pipelines to form a height difference. Different liquid cooling pipelines are avoided, so that the heat sinks in the liquid-cooled heat dissipation component are connected in series with high density, reducing the space occupied by liquid cooling pipelines in the network device and improving the deployment density of electrical components in the network device.

[0039] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0041] Figure 1 It is a structural schematic diagram of a liquid cooling heat dissipation component involved in this application;

[0042] Figure 2 It is a schematic diagram of the upper structure of a liquid cooling and heat dissipation component involved in an embodiment of the present application;

[0043] Figure 3 It is a schematic diagram of the lower structure of a liquid cooling and heat dissipation component involved in an embodiment of the present application;

[0044] Figure 4 It is a structural schematic diagram of a liquid cooling heat dissipation component involved in an embodiment of the present application;

[0045] Figure 5 is a side cross-sectional schematic diagram of a liquid cooling heat dissipation component involved in an embodiment of the present application;

[0046] Figure 6 It is a structural schematic diagram of a liquid cooling heat dissipation component involved in an embodiment of the present application;

[0047] Figure 7 It is a structural schematic diagram of a bracket in a liquid cooling and heat dissipation assembly involved in an embodiment of the present application;

[0048] Figure 8 It is a structural schematic diagram of an optical network unit involved in this application. DETAILED DESCRIPTION

[0049] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

[0050] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. The singular forms "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0051] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0052] The present application provides a liquid cooling heat dissipation component 100, such as Figure 1 As shown, including:

[0053] At least two heat sink groups 1, each heat sink group 1 is provided with a plurality of heat sinks 10, and the heat sinks 10 in at least two heat sink groups 1 are arranged horizontally, that is, Figure 1 Arranged in the first direction X as shown, the heat sinks 10 in one heat sink group 1 are spaced apart by heat sinks 10 in other heat sink groups 1, and the number of heat sink groups 1 can be two, three or more, which can be deployed according to the actual situation in the network device and the carrying capacity of the space in the network device;

[0054] At least two liquid cooling pipelines 2, one liquid cooling pipeline 2 is connected to a heat sink 10 in the heat sink group 1, and a height difference is formed between different liquid cooling pipelines 2, that is, Figure 1There is a certain height difference in the second direction Y shown, and the number of liquid cooling pipes 2 corresponds to the number of heat sink groups 1, which can be two, three or more, and can be deployed according to the actual situation in the network device and the carrying capacity of the space in the network device;

[0055] A plurality of brackets 3, corresponding to the heat sink 10 in the heat sink group 1, are used to fix the corresponding heat sink 1 to the device to be cooled. The bracket 3 can cooperate with the fixed structure provided on the device to be cooled through the fixed structure at the edge to improve the reliability of the contact between the heat sink 10 and the device to be cooled and ensure the heat dissipation effect. In addition, the bracket 3 can also have a certain elasticity, so that when the device to be cooled is plugged in, the heat sink 10 can be lifted up, thereby improving the smoothness of the cooperation between the device to be cooled and the heat sink 10.

[0056] The network device may be an optical network device with optical signal processing capability, such as an optical fiber switch, or other network devices that require heat dissipation for high-density arranged devices, without limitation. The device to be cooled may be an optical module, a processor, an image processing unit, or others.

[0057] by Figure 1 Taking the liquid cooling heat dissipation component 100 shown as an example, it includes a plurality of heat dissipation plates 10 arranged in a first direction X. These heat dissipation plates 10 can be divided into two groups, namely, heat dissipation plate group 1A and heat dissipation plate group 1B. Each heat dissipation plate group 1 is configured with 4 heat dissipation plates 10, a total of eight heat dissipation plates 10, which are heat dissipation plates 10A, heat dissipation plates 10B, heat dissipation plates 10C, heat dissipation plates 10D, heat dissipation plates 10E, heat dissipation plates 10F, heat dissipation plates 10G, and heat dissipation plates 10H from left to right along the first direction X. Among them, the heat dissipation plate group 1A includes heat dissipation plates 10A, heat dissipation plates 10C, heat dissipation plates 10E and heat dissipation plates 10G, and the heat dissipation plate group 1B includes heat dissipation plates 10B, heat dissipation plates 10D, heat dissipation plates 10F and heat dissipation plates 10H.

[0058] The liquid cooling pipeline 2 can be divided into a liquid cooling pipeline 2A and a liquid cooling pipeline 2B, the liquid cooling pipeline 2A corresponds to the heat sink group 1A, and the liquid cooling pipeline 2B corresponds to the heat sink group 1B. A liquid cooling pipeline 2 can be integrally formed or split, and correspondingly, the connection between the liquid cooling pipeline 2 and the heat sink group 1 can be placed in a pipeline receiving groove provided on the heat sink 10 for contact, or it can be achieved by forming a liquid cooling channel in the heat sink 10 and providing a liquid cooling joint to connect the liquid cooling channel, and then plugging the liquid cooling pipeline 2 with the liquid cooling joint. The above method can realize the series connection of the liquid cooling channels of different heat sinks 10 in the same heat sink group 1. Of course, the specific implementation method is not limited to this, and the heat sink 10 can also be separately provided, a pipeline receiving groove is formed between the two, and the liquid cooling pipeline 2 is clamped by a combination of heat sinks 10.

[0059] Furthermore, in order to avoid interference between the liquid cooling pipes 2 corresponding to different heat sink groups 1, different liquid cooling pipes 2 can form a height difference on the side away from the heat sink 10. For example, the liquid cooling pipe 2A of the heat sink group 1A can be bent upwards to the heat sink 10, while the liquid cooling pipe 2B of the heat sink group 1B can extend in the horizontal direction of the heat sink 10, thereby achieving a height difference between the liquid cooling pipe 2A and the liquid cooling pipe 2B, and avoiding mutual interference between the two during deployment.

[0060] By grouping the heat sinks 10, each heat sink group 1 can be connected to a corresponding liquid cooling pipeline 2. Both ends of the liquid cooling pipeline 2 are connected to the manifold in the network device to form a cold liquid circulation. There is no need for each heat sink to be connected to the manifold, thereby reducing the number of liquid cooling pipelines in the network device, improving the space efficiency in the network device, and the deployment density of electrical components in the electronic equipment.

[0061] In addition, since the adjacent heat sinks 10 in a heat sink group 1 are spaced apart from each other, the liquid cooling pipeline 2 corresponding to a heat sink group 1 can have a smoother bending angle when realizing the connection between different heat sinks 10, avoiding the hidden danger of rupture of the liquid cooling pipeline 2 due to excessive bending angle, and since the liquid cooling pipeline 2 between the heat sinks 10 connected in series can have a larger distance than the method of directly connecting adjacent heat sinks in series. When the network equipment encounters vibration or changes in position up and down when the optical module is plugged in, the liquid cooling pipeline 2 in the turning section can have a larger floating space, thereby reducing the possibility of damage or breakage of the liquid cooling pipeline 2 when the network equipment vibrates or changes in position when the optical module is plugged in, further improving the reliability of liquid cooling of the network equipment.

[0062] In a possible implementation manner, optionally, the heat sink 10, such as Figure 2 , 3 As shown, including:

[0063] The plate body 40 can be set according to the actual shape. For example, for the optical module, the plate body 40 can be set as a rectangle;

[0064] The abutment block 41 is formed on the lower surface 40B of the plate body 40. The abutment block 41 is used to achieve the fit with the device to be cooled. The distance between the abutment block 41 and the bottom of the plug-in space can be slightly smaller than the height of the device to be cooled. When the device to be cooled is plugged in, the device to be cooled can lift the heat sink 10 to a certain height after contacting the abutment block 41, so as to achieve a tighter fit between the heat sink 10 and the device to be cooled.

[0065] The pipe receiving groove 42 is formed in the plate body 40 and extends from the front end 40C of the plate body 40 to the rear end 40D of the plate body 40. Generally speaking, the liquid cooling pipe 2 extends from the rear side of the network device to the area where the device to be cooled is located. In order to enable the heat dissipation plate 10 to have a better heat dissipation effect, the liquid cooling pipe 2 needs to cover the device to be cooled as much as possible. Therefore, the pipe receiving groove 42 also needs to extend to the front end 40C of the plate body 40 as much as possible.

[0066] The bracket slot 43 is formed on the upper surface 40B of the plate body 40 and is located above the pipe receiving slot 42. The bracket slot 43 can have a better fixing space with the bracket 3, so that the heat sink 10 and the bracket 3 fit more closely.

[0067] Optionally, a guide portion 44 is provided at the front end of the abutment block 41 .

[0068] The guide portion 44 may be in the form of a rounded corner. When the heat dissipation device is inserted, the guide portion 44 can guide the device to be cooled and the abutment block 41 to achieve a smooth transition.

[0069] In another possible implementation manner, optionally, the heat sink 10, such as Figure 4 , 5 As shown, including:

[0070] The plate body 50 can be set according to the actual shape. For example, for the optical module, the plate body 50 can be set as a rectangle;

[0071] An abutment block is formed on the lower surface of the plate body 50. The arrangement of the abutment block is similar to the abutment block 41, and will not be described again here.

[0072] A liquid cooling channel 51 is formed in the plate body 50;

[0073] The liquid cooling joint 52 is fixed to the side of the plate body 50 and communicated with the liquid cooling channel 51. Due to the requirement of airtightness of the liquid cooling channel 51, the plate body 50 can be formed by welding a plurality of metal plates, and the liquid cooling channel 51 is pre-set on the plate body 50;

[0074] The liquid cooling joint 52 is connected to the liquid cooling pipeline 2 to connect the liquid cooling pipeline 2 and the liquid cooling channel 51 so that the cooling liquid can flow into the heat sink 10 to dissipate the heat of the connected device to be cooled.

[0075] A guide portion is arranged at the front end of the abutment block.

[0076] The configuration of the guide portion may be similar to the guide portion 44 of the abutment block 41 in the embodiment, and will not be described again here.

[0077] The plate body 50 is also provided with a bracket slot 53 , through which the bracket slot 53 and the bracket 3 can have a better fixing space, so that the heat sink 10 and the bracket 3 are more closely fitted.

[0078] Optionally, the plate body 40, such as Figure 6 As shown, it also includes:

[0079] a connecting portion 60; and

[0080] The linkage members 61 are respectively fixed to the connection parts 60 of the heat sinks 10 in the at least two heat sink groups 1 .

[0081] by Figure 2 As shown in the example, a boss is provided on the upper surface 40A of the plate body 40 as a connecting portion 60, and the linkage member 61 can be provided as a strip plate with a through hole. The linkage member 61 can be fixed to the heat sink 10 of at least one heat sink group 1 by means of screws, locking rods, etc. When the heat sink group 1 needs to be installed, the heat sink 10 in the heat sink group 1 can be lifted integrally by the linkage member 61 and placed at the position of the device to be cooled, thereby realizing the rapid installation of the liquid cooling heat sink assembly 100.

[0082] Optionally, each of the brackets 3 corresponds to a heat sink 10 in the at least two heat sink groups 1 .

[0083] The number of the bracket 3 can be set to one, that is, all the heat sinks 10 are fixed by one bracket 3 .

[0084] The number of the brackets 3 can be set to be less than the number of the heat sinks 10 , that is, a plurality of heat sinks 10 can be fixed by one bracket 3 .

[0085] The number of the brackets 3 can also be set to be the same as the number of the heat sinks 10 , that is, one bracket 3 fixes one heat sink 10 . When one bracket 3 corresponds to one heat sink 10 , the bracket 3 can have better elasticity and a flexible assembly method.

[0086] The corresponding relationship in quantity between the brackets 3 and the heat sinks 10 can be set according to actual needs.

[0087] Optionally, the support 3, such as Figure 7 As shown, including:

[0088] Two fixing parts 30 are fixed on both sides of the heat dissipation plates 10 in the at least two heat dissipation plate groups 1. According to the different quantitative relationships between the brackets 3 and the heat dissipation plates 10, the two fixing parts 30 are respectively abutted against both sides of the same heat dissipation plate 10 or one side of different heat dissipation plates 10. A fixing structure corresponding to the device to be cooled can be provided at the edge of the fixing part 30; and,

[0089] The limiting elastic arm 31 is connected between the two fixing parts 30 . The limiting elastic arm 31 can be one, two or more according to the requirement of fixing balance.

[0090] The limiting elastic arm 31 can be connected to the upper portion of the fixing portion 30 , and the limiting elastic arm 31 can be provided with multiple sections as required.

[0091] Optionally, the limiting elastic arm 31 includes:

[0092] An extension section 31A extends upward from the upper portion of the fixing portion 30 along the side wall of the heat dissipation plate 10;

[0093] The avoidance section 31B extends from the end of the extension section 31A to the fixing portion 30 on the opposite side;

[0094] The limiting sections 31C abut against the upper surface of the heat dissipation plate 10 and are respectively connected to the ends of the avoiding sections 31B.

[0095] The limit elastic arm 31 is extended to the top of the heat sink 10 and corresponds to the position of the bracket slot through the extension section 31A. The avoidance section 31B is connected to the end of the extension section 31A, and the avoidance section 31B extends a certain distance along the bracket slot toward the opposite end fixing portion 30 in one bracket 3. At the ends of the two avoidance sections 31B, they are bent and extended toward the heat sink 10 until they abut against the heat sink 10, and a portion parallel to the heat sink 10 is formed to support the heat dissipation device and the heat sink 10.

[0096] The bend between the avoidance section 31B and the limiting section 31C allows the bracket 3 to have a certain elasticity, and provides a certain floating space when the heat dissipation device abuts the heat dissipation plate 10, so that the heat dissipation device can be smoothly pushed into the specified position. In addition, since there is a certain distance between the avoidance section 31B and the heat dissipation plate 10, when the liquid cooling pipeline 2 is accommodated in the pipeline accommodating groove 42, the bracket 3 can avoid the liquid cooling pipeline 2 and retain the floating space, so that the liquid cooling pipeline 2 can buffer vibration and other situations, thereby improving the reliability of the liquid cooling heat dissipation component 100.

[0097] Correspondingly, the present application also provides an optical network device 200, such as Figure 8 As shown, including:

[0098] A plurality of optical module interfaces 70, wherein a hollow area 72 is provided on a housing 71 of the optical module interface 70;

[0099] An optical module 73 is plugged into the optical module interface 70; and

[0100] The liquid cooling heat dissipation assembly 100 as described in any one of the above items;

[0101] Among them, each heat sink 10 in the at least two heat sink groups 10 in the liquid-cooled heat dissipation component 100 corresponds to an optical module interface 70, and the heat sink 10 extends through the hollow area 72 to the shell 71 and abuts against the upper side of the optical module 73 as the heat dissipation device.

[0102] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0103] In an embodiment of the present specification, in a liquid-cooled heat dissipation component, a plurality of heat sinks are divided into at least two heat sink groups. Liquid cooling pipelines that connect the heat sinks in different heat sink groups are grouped through liquid cooling pipelines to form a height difference. Different liquid cooling pipelines are avoided, so that the heat sinks in the liquid-cooled heat dissipation component are connected in series at a high density, reducing the network impact of liquid cooling pipelines.

[0104] Those skilled in the art will readily appreciate other embodiments of the specification after considering the specification and practicing the invention claimed herein. The specification is intended to cover any variations, uses or adaptations of the specification that follow the general principles of the specification and include common knowledge or customary techniques in the art that are not claimed in the specification. The specification and examples are to be considered exemplary only, and the true scope and spirit of the specification are indicated by the following claims.

[0105] It should be understood that the present description is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0106] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A liquid cooling heat dissipation component, characterized in that: include: At least two heat sink groups, each heat sink group is provided with a plurality of heat sinks, the heat sinks in at least two heat sink groups are arranged transversely, and the heat sinks in one heat sink group are spaced apart by heat sinks in other heat sink groups; At least two liquid cooling pipelines, one liquid cooling pipeline is connected to a heat sink in a heat sink group, and a height difference is formed between different liquid cooling pipelines; A plurality of brackets, corresponding to the heat sinks in the heat sink group, are used to fix the corresponding heat sinks to the device to be cooled.

2. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The heat sink comprises: plate body; An abutment block formed on the lower surface of the plate body; A pipeline accommodating groove is formed in the plate body and extends from the front end of the plate body to the rear end of the plate body.

3. The liquid cooling heat dissipation assembly according to claim 1, characterized in that: The heat sink comprises: plate body; An abutment block formed on the lower surface of the plate body; A liquid cooling channel is formed in the plate body; A liquid cooling joint, fixed to the side of the plate body and connected to the liquid cooling channel; Wherein, the liquid cooling joint is connected to the liquid cooling pipeline.

4. The liquid cooling heat dissipation assembly according to claim 2 or 3, characterized in that: A guide portion is arranged at the front end of the abutment block.

5. The liquid cooling heat dissipation assembly according to claim 2 or 3, characterized in that: A bracket slot is also provided on the plate body.

6. The liquid cooling heat dissipation assembly according to claim 2 or 3, characterized in that: The plate body further comprises: a connecting portion; and The linkage parts are respectively fixed to the connection parts of the heat sinks in the at least two heat sink groups.

7. The liquid cooling heat dissipation assembly according to claim 2 or 3, characterized in that: Each of the brackets corresponds to a heat sink in the at least two heat sink groups.

8. The liquid cooling heat dissipation assembly according to claim 7, characterized in that: The support comprises: two fixing parts, fixed on two sides of the heat sinks in the at least two heat sink groups; and The limiting elastic arm is connected between the two fixing parts.

9. The liquid cooling heat dissipation assembly according to claim 8, characterized in that: The limiting elastic arm comprises: An extension section extending upward from an upper portion of the fixing portion along a side wall of the heat dissipation plate; An avoidance section extends from the end of the extension section to the fixing portion on the opposite side; The limiting sections abut against the upper surface of the heat dissipation plate and are respectively connected to the ends of the avoidance sections.

10. An optical network device, characterized in that: include: A plurality of optical module interfaces, wherein a hollow area is provided on the housing of the optical module interface; an optical module, plugged into the optical module interface; and The liquid cooling heat dissipation component according to any one of claims 1 to 9 above; Wherein, each heat sink in at least two heat sink groups in the liquid-cooled heat dissipation assembly corresponds to an optical module interface, and the heat sink extends through the hollow area into the shell to abut against the upper side of the optical module as a device to be cooled.

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