Optical module

Abstract

In the optical module provided by the invention, one end of the optical fiber adapter is used for connecting an external optical fiber; the optical accommodating component is connected with the other end of the optical fiber adapter; the light emitting component comprises a second cavity, and one end of the second cavity is connected with the optical accommodating component; a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal output by the light emitting component are input into the optical accommodating component and are transmitted to an external optical fiber through the optical fiber adapter; according to the optical accommodating part, an accommodating inner cavity is formed in a first cavity, one end is connected with an optical fiber adapter, and the other end is connected with a second cavity; a second connecting hole, a third connecting hole and a fourth connecting hole are formed in the second side of the first cavity; the optical assembly is arranged in the accommodating inner cavity; the first light receiving part is connected with the second connecting hole; the second light receiving component is connected with the third connecting hole; a third light receiving member connected to the fourth connection hole; the circuit board is electrically connected with the light emitting component, the first light receiving component, the second light receiving component and the third light receiving component.

Description

optical modules

[0001] This application claims the priority of application number 202310339617.5 filed with the China Patent Office on March 31, 2023; the priority of application number 202310341937.4 filed with the China Patent Office on March 31, 2023; the priority of application number 202310344269.0 filed with the China Patent Office on March 31, 2023; the priority of application number 202310344262.9 filed with the China Patent Office on March 31, 2023; Priority is claimed on August 28, 2023, with application number 202311090731.5 filed with the China Patent Office; priority is claimed on August 28, 2023, with application number 202311094008.4 filed with the China Patent Office; priority is claimed on August 28, 2023, with application number 202311094022.4 filed with the China Patent Office; priority is claimed on August 28, 2023, with application number 202311090738.7 filed with the China Patent Office; all contents of which are incorporated by reference in this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, with the advancement of optical communication technology, the transmission rates of optical modules are constantly increasing. Some optical modules with higher transmission rates have higher integration densities than those with lower transmission rates. For example, multi-channel optical transceiver technology is used to transmit and receive multi-wavelength optical signals.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module comprising a fiber optic adapter, an optical receiving component, an optical emitting component, and a circuit board. One end of the fiber optic adapter is used to connect to an external optical fiber. The optical receiving component is connected to the other end of the fiber optic adapter to receive optical signals of a fourth wavelength, a fifth wavelength, and a sixth wavelength through the fiber optic adapter. The optical emitting component includes a second cavity, one end of which is connected to the optical receiving component. A laser assembly is disposed within the second cavity, which generates optical signals of a first wavelength, a second wavelength, and a third wavelength. These signals are input into the optical receiving component through one end of the second cavity and transmitted to the external optical fiber via the fiber optic adapter. The optical receiving component includes a first cavity, an optical assembly, a first light receiving component, a second light receiving component, and a third light receiving component. The interior of the first cavity forms a receiving inner cavity, one end of which is connected to the fiber optic adapter, and the other end of which is connected to the second cavity. A second connection hole, a third connection hole, and a fourth connection hole are disposed on the second side of the first cavity, each of which is connected to the receiving inner cavity. The first light receiving component is connected to the second connection hole and is used to receive a fourth wavelength optical signal. The second light receiving component is connected to the third connection hole and is used to receive a fifth wavelength optical signal. The third light receiving component is connected to the fourth connection hole and is used to receive a sixth wavelength optical signal. The circuit board electrically connects the optical emitting component, the first light receiving component, the second light receiving component, and the third light receiving component. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0007] FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0008] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0009] FIG3 is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0010] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0011] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0012] FIG6 is a schematic diagram of an exploded internal structure of an optical module according to some embodiments of the present disclosure;

[0013] FIG7 is a schematic diagram of an assembly of a fiber optic adapter and a first cavity according to some embodiments of the present disclosure;

[0014] FIG8 is an exploded diagram of a fiber optic adapter and a first cavity according to some embodiments of the present disclosure;

[0015] FIG9 is a cross-sectional view of a fiber optic adapter and a first cavity according to some embodiments of the present disclosure;

[0016] FIG10 is an exploded schematic diagram of a first cavity provided according to some embodiments of the present disclosure;

[0017] FIG11 is a first structural schematic diagram of a first housing according to some embodiments of the present disclosure;

[0018] FIG12 is a second structural schematic diagram of a first housing according to some embodiments of the present disclosure;

[0019] FIG13 is a third structural diagram of a first housing according to some embodiments of the present disclosure;

[0020] FIG14 is a fourth structural diagram of a first housing according to some embodiments of the present disclosure;

[0021] FIG15 is a first cross-sectional view of a first housing according to some embodiments of the present disclosure;

[0022] FIG16 is a second cross-sectional view of a first housing according to some embodiments of the present disclosure;

[0023] FIG17 is a diagram illustrating a first housing in use according to some embodiments of the present disclosure;

[0024] FIG18 is a cross-sectional view of a first housing in use according to some embodiments of the present disclosure;

[0025] FIG19 is a diagram illustrating a reflector bracket in use according to some embodiments of the present disclosure;

[0026] FIG20 is a diagram illustrating a state of an optical component according to some embodiments of the present disclosure;

[0027] FIG21 is a cross-sectional view of an assembly of a light receiving component and a first housing according to some embodiments of the present disclosure;

[0028] FIG22 is an exploded schematic diagram of a first housing and a light emitting component according to some embodiments of the present disclosure;

[0029] FIG23 is an exploded schematic diagram 1 of a light emitting component according to some embodiments of the present disclosure;

[0030] FIG24 is a diagram illustrating a connection state between a light emitting component and a first housing according to some embodiments of the present disclosure;

[0031] FIG25 is a second exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0032] FIG26 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0033] FIG27 is a second schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0034] FIG28 is a partially exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0035] FIG29 is a schematic structural diagram of a first circuit board provided according to some embodiments of the present disclosure;

[0036] FIG30 is a partial enlarged view of point M in FIG27;

[0037] FIG31 is a partial enlarged view of point N in FIG27;

[0038] FIG32 is a first structural diagram of a support plate according to some embodiments of the present disclosure;

[0039] FIG33 is a second structural diagram of a support plate provided according to some embodiments of the present disclosure;

[0040] FIG34 is a diagram illustrating a support plate in use according to some embodiments of the present disclosure;

[0041] FIG35 is a first structural diagram of a second housing according to some embodiments of the present disclosure;

[0042] FIG36 is a second structural schematic diagram of a second housing according to some embodiments of the present disclosure;

[0043] FIG37 is a light path diagram of a transmitted optical signal according to some embodiments of the present disclosure;

[0044] FIG38 is a first exploded schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0045] FIG39 is a second exploded schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0046] FIG40 is a schematic structural diagram of a first flexible circuit board provided according to some embodiments of the present disclosure;

[0047] FIG41 is a schematic structural diagram of a second flexible circuit board provided according to some embodiments of the present disclosure;

[0048] FIG42 is a schematic structural diagram of a third flexible circuit board provided according to some embodiments of the present disclosure;

[0049] FIG43 is a schematic diagram of a partial structure of an optical module according to some embodiments of the present disclosure;

[0050] FIG44 is a second schematic diagram of a partial structure of an optical module provided according to some embodiments of the present disclosure;

[0051] FIG45 is a first structural diagram of a circuit board according to some embodiments of the present disclosure;

[0052] FIG46 is a second structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0053] FIG47 is a pin definition diagram of a gold finger according to some embodiments of the present disclosure;

[0054] FIG48 is a third diagram illustrating a circuit board in use according to some embodiments of the present disclosure;

[0055] FIG49 is a fourth diagram illustrating a circuit board in use according to some embodiments of the present disclosure;

[0056] FIG50 is a high-frequency signal transmission circuit structure of a second driver according to some embodiments of the present disclosure;

[0057] FIG51 is a circuit schematic diagram according to some embodiments of the present disclosure;

[0058] FIG52 is a schematic diagram of a partial structure of a circuit board according to some embodiments of the present disclosure;

[0059] Figure 53 is a second schematic diagram of the partial structure of a circuit board provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0060] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0061] Optical communication technology enables information transmission between information processing devices. It loads information onto light and uses the propagation of light to achieve this transmission. Light loaded with information is an optical signal. The propagation of optical signals within information transmission equipment reduces optical power loss, enabling high-speed, long-distance, and low-cost information transmission. The information processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0062] The conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. A first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal, which is then transmitted into the optical network terminal. A second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal, which is then transmitted into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and not all types of information processing devices need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0063] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system partially comprises a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0064] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end connects to the optical interface of optical module 200. Optical signals can undergo total internal reflection within optical fiber 101, maintaining nearly their original optical power as they propagate in the direction of total internal reflection. Multiple total internal reflections within optical fiber 101 transmit optical signals from the direction of remote information processing device 1000 into optical module 200, or transmit light from optical module 200 toward remote information processing device 1000, enabling long-distance, low-power information transmission.

[0065] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0066] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0067] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0068] Common host computers include optical network units (ONUs), optical line terminals (OLTs), optical network devices (ONTs), and data center servers. One end of a network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. Network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0069] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0070] For example, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0071] Optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information remains unchanged, but the encoding and decoding methods of the information can change.

[0072] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown) disposed inside the cage 106. The heat sink 107 has a raised structure that increases the heat dissipation area. A fin-like structure is a common raised structure.

[0073] Optical module 200 is inserted into cage 106 of host computer 100. Cage 106 secures optical module 200, and heat generated by optical module 200 is transferred to cage 106 and then dissipated through heat sink 107. After optical module 200 is inserted into cage 106, the electrical interface of optical module 200 connects to the electrical connector inside cage 106.

[0074] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light-emitting component 400, and an optical receiving component 500. The optical receiving component 500 is provided with at least one light-receiving component.

[0075] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0076] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0077] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0078] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the end of the optical module 200 (the right end in FIG3 ), and the opening 204 is also located at the end of the optical module 200 (the left end in FIG3 ). Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located on the side of the optical module 200. The opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); the opening 204 is an optical port, which is configured to receive the optical fiber 101 so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0079] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, light-emitting component 400, and optical receiving component 500 into the housing. The upper and lower housings 201 and 202 provide encapsulation and protection for these components. Furthermore, during the assembly of components such as the circuit board 300, light-emitting component 400, and optical receiving component 500, the positioning, heat dissipation, and electromagnetic shielding components of these components are easily positioned, facilitating automated production. In some embodiments, the upper and lower housings 201 and 202 are typically constructed of metal to facilitate electromagnetic shielding and heat dissipation.

[0080] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0081] Exemplarily, the unlocking component 600 is located at the end of the lower housing 202 and has a snap-fitting component that mates with the host computer cage (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the host computer cage, the snap-fitting component of the unlocking component 600 secures the optical module 200 in the host computer cage. When the unlocking component 600 is pulled, it rotates, causing the snap-fitting component of the unlocking component 600 to move accordingly, thereby changing the connection between the snap-fitting component and the host computer, thereby releasing the snap-fitting relationship between the optical module 200 and the host computer, thereby allowing the optical module 200 to be removed from the host computer cage. In some embodiments, the unlocking component 600 is located on the outer walls of the two lower side panels 2022 of the lower housing 202 and has a snap-fitting component that mates with the host computer cage (e.g., the cage 106 of the optical network terminal 100).

[0082] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0083] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG4 ), or they can be provided on both the upper and lower surfaces of the circuit board 300 to accommodate applications requiring a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0084] In some embodiments, the optical emitting component 400 is configured to transmit optical signals, and the optical receiving component on the optical receiving component 500 is configured to receive optical signals. For example, the optical receiving component 500 combines the optical emitting component 400 and the optical receiving component to form an integrated optical transceiver that shares a common optical fiber adapter. Of course, in embodiments of the present application, the optical emitting component and the optical receiving component can also be separated, that is, the optical emitting component and the optical receiving component do not share a common housing.

[0085] FIG5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure, and FIG6 is a schematic diagram of the exploded internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in FIG5 and FIG6, one end of the optical receiving component 500 is connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 is connected to the optical emitting component 400. The optical signal generated by the optical emitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700; the external input optical signal is input to the optical receiving component 500 through the optical fiber adapter 700, so that the optical receiving component 500 and the optical emitting component 400 share the optical fiber adapter 700, thereby allowing the uplink optical signal and the downlink optical signal of the optical module to share the optical fiber 101.

[0086] In some embodiments, the optical emitting component 400 can generate optical signals of multiple wavelengths, which are then combined into a single optical signal. The optical receiving component 500 is provided with multiple optical receiving components, enabling the optical receiving component 500 to receive optical signals of multiple wavelengths. For example, the optical emitting component 400 generates optical signals of three wavelengths, and the optical receiving component 500 receives optical signals of three wavelengths.

[0087] As shown in Figures 5 and 6, in some embodiments, the optical receiving component 500 includes a first housing 510 and a first upper cover 520 that cover and connect to form a first cavity, and also includes a first light receiving component 530, a second light receiving component 540, and a third light receiving component 550. The first cavity has an internal cavity for accommodating components and enabling connections or communication between other components. In some embodiments, the first housing 510 has an internal cavity, so that the first upper cover 520 covers the first housing 510 to form the internal cavity.

[0088] In some embodiments, the first shell 510 connects the light emitting component 400, the first light receiving component 530, the second light receiving component 540 and the third light receiving component 550 to realize the packaging of the light emitting component 400, the first light receiving component 530, the second light receiving component 540 and the third light receiving component 550 through the first shell 510, and realize the optical connection between the light emitting component 400, the first light receiving component 530, the second light receiving component 540 and the third light receiving component 550 and the inside of the first cavity respectively.

[0089] In some embodiments, the optical module 200 is configured to receive an optical signal comprising three wavelengths and to transmit an optical signal comprising three wavelengths. For example, the optical transmitting component 400 is configured to output an optical signal comprising a first wavelength, a second wavelength, and a third wavelength. The first optical receiving component 530 is configured to receive an optical signal comprising a fourth wavelength. The second optical receiving component 540 is configured to receive an optical signal comprising a fifth wavelength. The third optical receiving component 550 is configured to receive an optical signal comprising a sixth wavelength.

[0090] In some embodiments, the light emitting component 400 utilizes a micro-optical package, and the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 utilize a coaxial package. Exemplarily, the light receiving axes of the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are parallel to each other. In some embodiments, the light emitting component 400, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 are electrically connected to the circuit board 300 via a flexible circuit board.

[0091] In some embodiments, the first side of the first housing 510 is connected to the fiber optic adapter 700, the second side of the first housing 510 is provided with the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550, and the third side of the first housing 510 is provided with the light emitting component 400. For example, the first side of the first housing 510 is adjacent to the optical port of the optical module, the second side of the first housing 510 is adjacent to the lower side plate 2022 of the lower housing 202, and the third side of the first housing 510 is adjacent to the electrical port of the optical module.

[0092] In some embodiments, a first connection hole is provided on the first side of the first housing 510, a second connection hole is provided on the second side of the first housing 510, a third connection hole is provided on the third side of the first housing 510, and a fifth connection hole is provided on the third side of the first housing 510. The first connection hole, the second connection hole, the third connection hole, the fourth connection hole, and the fifth connection hole are respectively connected to the inner cavity of the first housing 510. The other end of the fiber optic adapter 700 is connected to the first connection hole; the first light receiving component 530 is connected to the second connection hole, the second light receiving component 540 is connected to the third connection hole, the third light receiving component 550 is connected to the fourth connection hole, and the light emitting component 400 is connected to the fifth connection hole. For example, the second connection hole, the third connection hole, and the fourth connection hole are arranged in sequence on the second side of the first housing 510.

[0093] Figure 7 is a schematic diagram illustrating the assembly of a fiber optic adapter and a first cavity according to some embodiments of the present disclosure. Figure 8 is an exploded schematic diagram illustrating the fiber optic adapter and the first cavity according to some embodiments of the present disclosure. Figure 9 is a cross-sectional view of the fiber optic adapter and the first cavity according to some embodiments of the present disclosure. As shown in Figures 7-9, a fiber optic adapter 700 is disposed on one side of the first housing 510. One end of the fiber optic adapter 700 is used to connect to an optical fiber, and the other end of the fiber optic adapter 700 communicates with the first housing 510, allowing the first housing 510 to optically connect to the optical fiber through the fiber optic adapter 700. Exemplarily, a first connection hole 5131 is disposed on one side of the first housing 510, and a connecting sleeve 710 is disposed on the other end of the fiber optic adapter 700. One end of the connecting sleeve 710 is embedded with the fiber optic adapter 700, and the other end of the connecting sleeve 710 connects to the first housing 510, connecting the fiber optic adapter 700 to the first connection hole 5131. The connecting sleeve 710 facilitates the connection of the fiber optic adapter 700 to the first housing 510. Exemplarily, the other end of the optical fiber adapter 700 is embedded in the connecting sleeve 710 , and the end of the optical fiber ferrule in the optical fiber adapter 700 is located in the connecting sleeve 710 .

[0094] In some embodiments, a lens assembly 570 is disposed within the first connection hole 5131. The lens assembly 570 is used to collimate / focus optical signals. For example, optical signals transmitted from the first housing 510 to the fiber optic adapter 700 are focused by the lens assembly 570, while optical signals transmitted from the fiber optic adapter 700 to the first housing 510 are collimated by the lens assembly 570. The placement of the lens assembly 570 within the first connection hole 5131 conserves the space otherwise occupied by the lens assembly 570 within the first housing 510, thereby reducing the volume of the optical housing 500 and facilitating its adaptation to the interior space of the optical module 200.

[0095] In some embodiments, the lens assembly 570 includes a lens 571 and a lens holder 572. The lens 571 is mounted on the lens holder 572. The lens holder 572 is connected to the first connection hole 5131, making it easier to assemble the lens 571 into the first connection hole 5131 through the lens holder 572. For example, a through hole is provided in the lens holder 572 along the axis of the first connection hole 5131. The through hole extends through the lens holder 572, allowing optical signals to be transmitted between the through hole and the lens 571. Optical signals transmitted from the first housing 510 to the fiber optic adapter 700 are transmitted through the lens 571 and the through hole to the fiber optic adapter 700. Optical signals transmitted from the fiber optic adapter 700 to the first housing 510 are transmitted through the through hole and the lens 571 to the inner cavity of the first housing 510. In some embodiments, the optical axis of the lens 571 is parallel to the optical axis of the fiber optic adapter 700, such as being aligned with the same straight line.

[0096] In some embodiments, the first connection hole 5131 is a stepped through-hole, meaning that it has different diameters at different locations along its length. This allows for connection between the first housing 510 and the fiber optic adapter 700, facilitates placement of optical devices within the first connection hole 5131, and facilitates control of the dimensions of the first connection hole 5131 where it connects to the accommodating cavity 511, thereby facilitating compatibility with the optical devices within the accommodating cavity 511. Exemplarily, the lens holder 572 includes a holder fixing portion 5721, a lens fixing portion 5722, and a third through-hole 5723. The third through-hole 5723 extends through the holder fixing portion 5721 and the lens fixing portion 5722 along the optical axis of the lens 571. The holder fixing portion 5721 connects to the sidewall of the first connection hole 5131, and the lens 571 is mounted on the lens fixing portion 5722. In some embodiments, the optical axis of the lens 571 is parallel to the central axis of the third through-hole 5723, e.g., aligned on the same straight line.

[0097] Illustratively, the first connection hole 5131 includes a front hole 5131A, a middle hole 5131B, and a rear hole 5131C, which are sequentially connected and have different inner diameters. The rear hole 5131C is connected to the inner cavity of the first housing 510. The bracket fixing portion 5721 is connected to the side wall of the front hole 5131A. The lens 571 is located in the middle hole 5131B. The optical axis of the lens 571 is aligned with the central axis of the rear hole 5131C.

[0098] The inner cavity of the first shell 510 is also used to set up optical components, which include optical devices such as reflectors and filters. The optical components are used to change the transmission optical path of the optical signal entering the first shell 510. Exemplarily, the optical signal input from the external optical module is transmitted to the first shell 510 through the optical fiber adapter 700, and is correspondingly transmitted to the first optical receiving component 530, the second optical receiving component 540 or the third optical receiving component 550 through the optical components in the first shell 510; the optical signal generated by the optical emitting component 400 is transmitted to the first shell 510, transmitted to the optical fiber adapter 700 through the optical components in the first shell 510, and then transmitted to the optical fiber through the optical fiber adapter 700.

[0099] Figure 10 is an exploded schematic diagram of a first cavity according to some embodiments of the present disclosure. As shown in Figure 10, the first cavity includes a first shell 510 and a first upper cover 520. The first upper cover 520 covers and connects to the first shell 510, forming a relatively sealed cavity structure with the first upper cover 520 and the first shell 510.

[0100] A housing 511 is formed within the first housing 510. A first connection hole, a second connection hole, a third connection hole, a fourth connection hole, and a fifth connection hole are respectively provided on the first housing 510 and communicate with the housing 511. An optical assembly 560 is disposed within the housing 511. The optical assembly 560 includes a first displacement prism, a reflector, a second displacement prism, and a third displacement prism. The combination of the first displacement prism, the reflector, the second displacement prism, and the third displacement prism is used to change the transmission path of an optical signal.

[0101] In some embodiments, a mounting surface 512 is provided on the first housing 510. The mounting surface 512 is lower than the top surface of the first housing 510 and is located on the side of the accommodating cavity 511. The bottom of the first upper cover 520 is connected to the mounting surface 512, so that the first upper cover 520 is fixedly connected to the first housing 510 through the mounting surface 512.

[0102] In some embodiments, as shown in FIG10 , one side of the other end of the first housing 510 is formed with a notch, and the other side of the other end is formed with a convex structure. A connection hole is provided on the side of the convex structure away from the notch, and the connection hole is connected to the accommodating cavity 511. The light receiving component is connected through the connection hole. In this way, when the same number of light receiving components are arranged on the first housing 510, compared to setting the first housing 510 in a relatively regular structure, the shape of the first housing 510 effectively reduces the volume of the first housing 510, thereby facilitating the control of the size of the first cavity, thereby saving the space occupied by the first cavity in the optical module.

[0103] Figure 11 is a structural schematic diagram 1 of a first shell provided according to some embodiments of the present disclosure, Figure 12 is a structural schematic diagram 2 of a first shell provided according to some embodiments of the present disclosure, Figure 13 is a structural schematic diagram 3 of a first shell provided according to some embodiments of the present disclosure, Figure 14 is a structural schematic diagram 4 of a first shell provided according to some embodiments of the present disclosure, Figure 15 is a cross-sectional view 1 of a first shell provided according to some embodiments of the present disclosure, and Figure 16 is a cross-sectional view 2 of a first shell provided according to some embodiments of the present disclosure. Figures 11 to 16 show the structure of a first shell 510 in detail.

[0104] In some embodiments, the first housing 510 includes a first side panel 513, a second side panel 514, a third side panel 515, and a fourth side panel 516. The first side panel 513, the second side panel 514, the third side panel 515, and the fourth side panel 516 are located at the edge of the accommodating cavity 511. The first side panel 513 is located on the first side of the first housing 510, the second side panel 514 is located on the second side of the first housing 510, the third side panel 515 is located on the third side of the first housing 510, and the fourth side panel 516 is located on the fourth side of the first housing 510. The fourth side of the first housing 510 is adjacent to the lower side panel 2022 of the lower housing 202 and is located on a different side of the first housing 510 from the second side of the first housing 510. A first connection hole 5131 is defined on the first side panel 513, a second connection hole 5141, a third connection hole 5142, and a fourth connection hole 5143 are defined on the second side panel 514, and a fifth connection hole 5151 is defined on the third side panel 515. Illustratively, the first side panel 513 , the second side panel 514 , the third side panel 515 and the fourth side panel 516 are integrally formed.

[0105] In some embodiments, a second connection hole 5141, a third connection hole 5142 and a fourth connection hole 5143 are provided on the second side panel 514 for setting the first light receiving component 530, the second light receiving component 540 and the third light receiving component 550, so as to realize the independence of the first light receiving component 530, the second light receiving component 540 and the third light receiving component 550, and reduce high-frequency crosstalk and thermal crosstalk between the first light receiving component 530, the second light receiving component 540 and the third light receiving component 550.

[0106] In some embodiments, the first housing 510 further includes a fifth side panel 517 and a sixth side panel 518. The fifth side panel 517 is located between the second side panel 514 and the third side panel 515. One end of the fifth side panel 517 is connected to the third side panel 515, the other end of the fifth side panel 517 is connected to one end of the sixth side panel 518, and the other end of the sixth side panel 518 is connected to the second side panel 514. Exemplarily, the fifth side panel 517 extends in the same direction as the second side panel 514, and the sixth side panel 518 extends in the same direction as the third side panel 515. In some embodiments, the fifth and sixth side panels 517, 518 are provided on the first housing 510 so that the first housing 510 forms a notch on the outside of the third side panel 515. Furthermore, the second side panel 514, the fifth side panel 517, and the sixth side panel 518 form a convex structure with a storage space on one side of the notch. This ensures that the accommodating cavity 511 provides sufficient space for assembling the optical component 560 and effectively reduces the volume of the first housing 510 to control the volume of the optical transceiver component within an appropriate range to meet the assembly space requirements of the optical module 200.

[0107] In some embodiments, the accommodating cavity 511 includes a first accommodating cavity 5111, a second accommodating cavity 5112, and a third accommodating cavity 5113. The first accommodating cavity 5111, the second accommodating cavity 5112, and the third accommodating cavity 5113 are interconnected so that optical signals can be transmitted from the first accommodating cavity 5111 to the second accommodating cavity 5112 and from the first accommodating cavity 5111 to the third accommodating cavity 5113.

[0108] In some embodiments, a baffle 519 is disposed within the accommodating cavity 511. The first side panel 513, the second side panel 514, and the baffle 519 surround a second accommodating cavity 5112, with the baffle 519 positioned between the first accommodating cavity 5111 and the second accommodating cavity 5112. One end of the baffle 519 is connected to the first side panel 513, while the second accommodating cavity 5112 communicates with the first accommodating cavity 5111 at the other end of the baffle 519. The baffle 519 can isolate the first accommodating cavity 5111 from the second accommodating cavity 5112 to a certain extent, thereby reducing unnecessary transmission of optical signals from the first accommodating cavity 5111 to the second accommodating cavity 5112. Exemplarily, the length of the baffle 519 extends parallel to the length of the second side panel 514. In some embodiments, the baffle 519 and the first side panel 513 are integrally formed.

[0109] In some embodiments, the second side plate 514 , the fifth side plate 517 and the sixth side plate 518 surround and form a third accommodating cavity 5113 , and the third accommodating cavity 5113 is connected to the first accommodating cavity 5111 at the edge of the third side plate 515 .

[0110] In some embodiments, the mounting surface 512 includes a first mounting surface 5121, a second mounting surface 5122, a third mounting surface 5123 and a fourth mounting surface 5124. The first mounting surface 5121 is formed by the top surface of the fourth side panel 516, the second mounting surface 5122 is formed by the top edge of the first side panel 513 sinking toward the bottom of the first shell 510, the third mounting surface 5123 is the top surface of the baffle 519, and the fourth mounting surface 5124 is formed by the top surface of the inner edge of the third side panel 515, the fifth side panel 517 and the top surface of the sixth side panel 518. The fourth mounting surface 5124 is lower than the top surface of the outer edge of the third side panel 515. Exemplarily, the first mounting surface 5121, the second mounting surface 5122, the third mounting surface 5123 and the fourth mounting surface 5124 are respectively used to fixedly connect the first upper cover 520, and the first upper cover 520 is positioned by the outer side of the first side panel 513 and the outer side of the third side panel 515 to facilitate the fixed connection between the first upper cover 520 and the first shell 510, and to ensure the firmness of the connection between the first upper cover 520 and the first shell 510.

[0111] In some embodiments, a first support platform 5114 is provided in the second accommodating cavity 5112, and a second support platform 5115 is provided in the third accommodating cavity 5113. The first support platform 5114 and the second support platform 5115 support and connect the first upper cover 520. Exemplarily, the first support platform 5114 and the second support platform 5115 are respectively provided on the inner side wall of the second side plate 514, and the first support platform 5114 is located between the second connection hole 5141 and the third connection hole 5142, and the second support platform 5115 is located between the third connection hole 5142 and the fourth connection hole 5143, so that the side surface of the first support platform 5114 can be used for assembling and positioning the optical device in the second accommodating cavity 5112, and the side surface of the second support platform 5115 can be used for assembling and positioning the optical device in the third accommodating cavity 5113.

[0112] In some embodiments, the top surface of the first support platform 5114 and the top surface of the second support platform 5115 are lower than the top surface of the second side plate 514, and the top surface of the first support platform 5114 and the top surface of the second support platform 5115 support and connect the first upper cover 520, and the first upper cover 520 is positioned and connected through the second side plate 514.

[0113] In some embodiments, a first supporting surface 5152 is provided on the inner sidewall of the third side panel 515, and a fifth connection hole 5151 extends through the first supporting surface 5152. The first supporting surface 5152 is used to support and secure the optical device. Exemplarily, the first supporting surface 5152 is an inclined surface, sloping from one end toward the other along the inner sidewall of the third side panel 515. That is, the central axis of the fifth connection hole 5151 is not perpendicular to the first supporting surface 5152.

[0114] In some embodiments, a first recessed groove 5116 is further provided in the first accommodating cavity 5111. The first recessed groove 5116 is located on the bottom surface of the first housing 510 and extends toward the fourth side panel 516. The first recessed groove 5116 is used to position optical devices. The first recessed groove 5116 is provided at the bottom of the first accommodating cavity 5111, allowing the first recessed groove 5116 to adjust the relative heights between various positions at the bottom of the first accommodating cavity 5111 to facilitate the placement of optical devices. Exemplarily, the first recessed groove 5116 extends to the inner sidewall of the fourth side panel 516, forming a recess in the fourth side panel 516. This facilitates coordinating the usable space of the first accommodating cavity 5111 when placing devices through the first recessed groove 5116.

[0115] In some embodiments, a second recessed groove 5117 is further provided in the first accommodating cavity 5111. The second recessed groove 5117 is located at the connection between the first accommodating cavity 5112 and the first accommodating cavity 5113, and is used to accommodate optical devices. The second recessed groove 5117 is provided at the bottom of the first accommodating cavity 5111, allowing the second recessed groove 5117 to adjust the relative heights between various locations at the bottom of the first accommodating cavity 5111, thereby facilitating the placement of optical devices.

[0116] In some embodiments, a first avoidance groove 5132 is provided on the inner sidewall of the first side panel 513. The first avoidance groove 5132 is used to avoid optical components, facilitating assembly of the optical components in the first accommodating cavity 5111, such as positioning and dispensing. In some embodiments, the inner sidewall of the first side panel 513 is not limited to having a single first avoidance groove 5132; multiple first avoidance grooves 5132 may also be provided.

[0117] In some embodiments, a second avoidance groove 5153 is further provided on the inner sidewall of the third side panel 515. The second avoidance groove 5153 is used to avoid optical components, facilitating assembly of the optical component in the first accommodating cavity 5111, such as positioning and gluing. In some embodiments, the inner sidewall of the third side panel 515 is not limited to having a single second avoidance groove 5153, and multiple second avoidance grooves 5153 may be provided.

[0118] In some embodiments, the second connection hole 5141 , the third connection hole 5142 , the fourth connection hole 5143 and the fifth connection hole 5151 may be stepped through holes to facilitate the use of the second connection hole 5141 , the third connection hole 5142 , the fourth connection hole 5143 and the fifth connection hole 5151 .

[0119] Figure 17 is a diagram of a first housing in use according to some embodiments of the present disclosure, and Figure 18 is a cross-sectional view of a first housing in use according to some embodiments of the present disclosure. Figures 17 and 18 detail the assembly of the optical assembly 560 on the first housing 510. As shown in Figures 17 and 18, the optical assembly 560 includes a first displacement prism 561, a reflector 562, a first optical filter 563, a first wavelength division multiplexer 564, a second displacement prism 565, and a third displacement prism 566. The first displacement prism 561, the reflector 562, the first optical filter 563, the first wavelength division multiplexer 564, the second displacement prism 565, and the third displacement prism 566 are disposed within the accommodating cavity 511.

[0120] In some embodiments, the first displacement prism 561 is used to adjust the position of the optical signal in the AB direction of the first housing 510 so as to adapt to the requirements of the optical module for the assembly position of the optical fiber adapter 700 and provide sufficient space for setting the reflector 562 and the first filter 563.

[0121] In some embodiments, the first displacement prism 561 is located at the edge of the first connection hole 5131, so that the optical signal passing through the first connection hole 5131 is transmitted to the first displacement prism 561, and the optical signal output by the first displacement prism 561 is transmitted to the first connection hole 5131. Exemplarily, the first side surface 5611 of the first displacement prism 561 is in contact with the inner sidewall of the first side plate 513, or the first side surface 5611 of the first displacement prism 561 is sealed to the first connection hole 5131, and the first avoidance groove 5132 avoids the end of the first displacement prism 561, thereby facilitating a compact placement of the first displacement prism 561 within the first accommodating cavity 5111.

[0122] In some embodiments, the first side surface 5611 of the first displacement prism 561 is perpendicular or approximately perpendicular to the central axis of the first connection hole 5131, so that an optical signal incident on the first side surface 5611 through the first connection hole 5131 is transmitted perpendicularly or approximately perpendicularly to the first side surface 5611, and an optical signal output from the first side surface 5611 can be transmitted to the first connection hole 5131 along the central axis of the first connection hole 5131. Exemplarily, the first side surface 5611 seals the rear end hole 5131C, the optical axis of the lens 571 is perpendicular to the first side surface 5611, the first reflective surface of the first displacement prism 561 is in the rear end hole 5131C and covers the rear end hole 5131C, and the angle between the optical axis of the lens 571 and the first reflective surface is 45°.

[0123] In some embodiments, a first optical filter 563 is disposed on the first supporting surface 5152 and covers the fifth connecting hole 5151. The signal light output by the light emitting component 400 is transmitted to the first optical filter 563. The first optical filter 563 is configured to transmit the optical signal output by the light emitting component 400 and transmit it to the second side surface 5612 of the first displacement prism 561. The first optical filter 563 is also configured to reflect the optical signal output from the second side surface 5612 of the first displacement prism 561 to the reflector 562. Exemplarily, the first surface 5631 of the first optical filter 563 faces the first displacement prism 561, and the second surface 5632 of the first optical filter 563 rests on the first supporting surface 5152.

[0124] In some embodiments, a reflector 562 is disposed within the first sink 5116 and is configured to reflect the optical signal reflected by the first optical filter 563 toward the first wavelength division multiplexer 564. To facilitate the reflector 562 reflecting the optical signal toward the first wavelength division multiplexer 564, the reflector 562 is tilted within the first accommodating cavity 5111. The reflective surface 5621 of the reflector 562 is non-parallel to the second side surface 5612 of the first displacement prism 561, and the included angle is less than 90°. In some embodiments, an inclined second support surface is provided on the inner sidewall of the fourth side plate 516, against which the back surface of the reflector 562 rests. The second support surface is configured to ensure that the reflector 562 is tilted within the first accommodating cavity 5111.

[0125] In some embodiments, the side of the first wavelength division multiplexer 564 is against the inner wall of the third side plate 515 and contacts the second avoidance groove 5153. The second avoidance groove 5153 is used to avoid the first wavelength division multiplexer 564 to facilitate the positioning and assembly of the first wavelength division multiplexer 564.

[0126] In some embodiments, the optical assembly 560 further includes a reflector bracket 567. The bottom of the reflector bracket 567 is disposed within the first sink 5116. A support mechanism, such as a support slope, is disposed on the reflector bracket 567. The support mechanism supports and connects the reflector 562, allowing the reflector 562 to be tilted within the first accommodating cavity 5111. This facilitates adjustment of the position of the reflector 562 during the optical coupling process of the optical assembly 560.

[0127] In some embodiments, a first wavelength division multiplexer 564 is disposed at the bottom of the first accommodating cavity 5111, with the light input side of the first wavelength division multiplexer 564 facing the reflector 562 and the light splitting output side of the first wavelength division multiplexer 564 facing the second side plate 514. The first wavelength division multiplexer 564 is configured to split the optical signal reflected by the reflector 562 according to wavelength. For example, the first wavelength division multiplexer 564 splits a beam of optical signals including a fourth wavelength, a fifth wavelength, and a sixth wavelength into three beams according to wavelength.

[0128] In some embodiments, a second displacement prism 565 is disposed in the second housing cavity 5112, and the fourth wavelength optical signal output by the first wavelength division multiplexer 564 is transmitted to the second displacement prism 565. A third displacement prism 566 is disposed in the third housing cavity 5113, and the sixth wavelength optical signal output by the first wavelength division multiplexer 564 is transmitted to the third displacement prism 566. The second displacement prism 565 and the third displacement prism 566 are used to adjust the position of the optical signal in the CD direction of the first housing 510, so that the optical signal, after being split by the first wavelength division multiplexer 564, can be transmitted to the corresponding first light receiving component 530, second light receiving component 540, and third light receiving component 550.

[0129] In some embodiments, a side surface of the first support platform 5114 is fixedly connected to a second side surface of the second displacement prism 565 , and a side edge of the second support platform 5115 is fixedly connected to the third displacement prism 566 .

[0130] In some embodiments, multiple second optical filters are disposed within the second accommodating cavity 5112 and the third accommodating cavity 5113, such as a second filter disposed at the output end of the second displacement prism 565 and a second filter disposed at the output end of the third displacement prism 566. The second filters are used to filter the optical signal before it enters the corresponding optical accommodating component, reducing noise in the optical signal of the corresponding wavelength and ensuring the quality of optical signal reception. For example, a second optical filter 568 is disposed within the second sink 5117 and is located at the end of the third connecting hole 5142. The second filter 568 is located at the light input front end of the second light receiving component 540. The second filter 568 is used to filter out noise in the optical signal about to enter the second light receiving component 540, thereby improving the quality of the light entering the second light receiving component 540.

[0131] FIG19 illustrates a mirror bracket in use according to some embodiments of the present disclosure. As shown in FIG19 , the mirror bracket 567 includes a bracket base 5671 and a bracket support portion 5672. The bracket support portion 5672 is disposed on top of the bracket base 5671. A support slope 5673 is disposed on the bracket support portion 5672, and a support surface 5674 is disposed on the top of the bracket base 5671. The support slope 5673 and the support surface 5674 support the reflector 562. The bottom of the bracket base 5671 is connected to the first sink 5116. For example, in the orientation shown in FIG19 , the support slope 5673 supports the back surface of the reflector 562, and the support surface 5674 supports the bottom surface of the reflector 562. This facilitates assembly of the reflector 562 within the first housing 510 by using the mirror bracket 567.

[0132] FIG20 is a diagram illustrating an optical assembly according to some embodiments of the present disclosure, illustrating a transmission path for an optical signal between optical components. As shown in FIG20 , the optical signal output by the optical emitting component 400 passes through the first filter 563 and is transmitted to the second side surface 5612 of the first displacement prism 561. The optical signal then passes through the second side surface 5612 and is transmitted to the second reflective surface 5614, where it is reflected from the second reflective surface 5614 to the first reflective surface 5613. The optical signal then reflects from the first reflective surface 5613 and is transmitted to the first side surface 5611. The signal then passes through the first side surface 5611 and is transmitted to the lens assembly 570, where it is converged by the lens assembly 570.

[0133] As shown in FIG20 , a beam of received optical signals including a fourth wavelength, a fifth wavelength, and a sixth wavelength is collimated and transmitted to the first side surface 5611 through the lens assembly 570, transmitted through the first side surface 5611 to the first reflecting surface 5613, reflected by the first reflecting surface 5613 to the second reflecting surface 5614, reflected by the second reflecting surface 5614 to the second side surface 5612, and transmitted through the second side surface 5612; the incident optical signal is transmitted to the first optical filter 563, reflected by the first filter 563 to the reflector 562, and then reflected by the reflector 562 to the first wavelength division multiplexer 564; the incident optical signal is input into the first wavelength division multiplexer 564 and is split into a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal according to the wavelength of the optical signal.

[0134] The fourth wavelength optical signal is transmitted to the first side surface 5651 of the second displacement prism 565, passes through the first side surface 5651, and is transmitted to the first reflection surface 5652. It is then reflected by the first reflection surface 5652 and transmitted to the second reflection surface 5653. It is then reflected by the second reflection surface 5653 and transmitted to the second side surface 5654. It then passes through the second side surface 5654 and is then transmitted to the first light receiving element 530. The fifth wavelength optical signal is transmitted through the second optical filter 568 and is then transmitted to the second light receiving element 540. The sixth wavelength optical signal is transmitted to the first side surface 5661 of the third displacement prism 566, passes through the first side surface 5661, and is then transmitted to the first reflection surface 5662. It is then reflected by the first reflection surface 5662 and transmitted to the second reflection surface 5663. It is then reflected by the second reflection surface 5663 and transmitted to the second side surface 5664. It then passes through the second side surface 5664 and is then transmitted to the third light receiving element 550.

[0135] FIG21 is a cross-sectional view of an assembly of a light receiving component and a first housing according to some embodiments of the present disclosure. As shown in FIG21 , the top of the first light receiving component 530 is embedded in a second connection hole 5141, the top of the second light receiving component 540 is embedded in a third connection hole 5142, and the top of the third light receiving component 550 is embedded in a fourth connection hole 5143. The second connection hole 5141, the third connection hole 5142, and the fourth connection hole 5143 are separated from each other to achieve mutual isolation between the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550, effectively reducing high-frequency crosstalk, thermal crosstalk, etc. between the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550. Exemplarily, the first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 each include a cap, which is embedded in the corresponding connection hole.

[0136] As shown in FIG21 , the fourth wavelength optical signal is transmitted to the first optical receiving component 530, the fifth wavelength optical signal is transmitted to the second optical receiving component 540, and the sixth wavelength optical signal is transmitted to the third optical receiving component 550. Of course, in some embodiments, the optical signal transmitted to the first optical receiving component 530 is not limited to the fourth wavelength optical signal and may also include optical signals of other wavelengths, but is primarily the fourth wavelength optical signal; the optical signal transmitted to the second optical receiving component 540 is not limited to the fifth wavelength optical signal and may also include optical signals of other wavelengths, but is primarily the fifth wavelength optical signal; the optical signal transmitted to the third optical receiving component 550 is not limited to the sixth wavelength optical signal and may also include optical signals of other wavelengths, but is primarily the sixth wavelength optical signal.

[0137] In some embodiments, the wavelength of the fourth wavelength optical signal is smaller than the wavelength of the fifth wavelength optical signal, and the wavelength of the fifth wavelength optical signal is smaller than the wavelength of the sixth wavelength optical signal. For example, the wavelength range of the fourth wavelength optical signal received by the first optical receiving component 530 is 1260-1280 nm, such as the wavelength of the fourth wavelength optical signal is 1270 nm; the wavelength range of the fifth wavelength optical signal received by the second optical receiving component 540 is 1284-1288 nm, such as the wavelength of the fifth wavelength optical signal is 1286 nm; and the wavelength range of the sixth wavelength optical signal received by the third optical receiving component 550 is 1290-1330 nm, such as the wavelength of the sixth wavelength optical signal is 1310 nm.

[0138] The first light receiving component 530, the second light receiving component 540, and the third light receiving component 550 each include a photodetector, which is used to receive optical signals and convert them into electrical signals. In some embodiments, the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the first light receiving component 530, and the receiving rate of the photodetector in the second light receiving component 540 is greater than the receiving rate of the photodetector in the third light receiving component 550. This ensures that the optical path of the fifth wavelength optical signal with the highest transmission rate from the output of the first wavelength division multiplexer 564 to the photodetector is relatively short and the optical path is simplest, so that the photodetector in the second light receiving component 540 can receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first light receiving component 530 is 10G, the receiving rate of the photodetector in the second light receiving component 540 is 50G, and the receiving rate of the photodetector in the third light receiving component 550 is 2.5G.

[0139] Figure 22 is an exploded schematic diagram of a first housing and light-emitting component according to some embodiments of the present disclosure. As shown in Figure 22, one end of the light-emitting component 400 is located within the notched corner of the first housing 510, and the side edge of one end of the light-emitting component 400 is close to the convex structure of the first housing 510, making the assembly of the light-emitting component 400 and the optical receiving component 500 more compact and effectively reducing the overall size of the light-emitting component 400 and the optical receiving component 500.

[0140] Figure 23 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure. As shown in Figures 22 and 23, light emitting component 400 includes a second cavity 410, which includes a second housing 411 and a second upper cover 412. The second housing 411 defines an inner cavity, and the second upper cover 412 covers and connects to the second housing 411, forming a relatively sealed cavity structure.

[0141] A connecting portion 4112 is provided on the side of the second cavity 410, and the second cavity 410 is connected to the first shell 510 via the connecting portion 4112, thereby facilitating the connection between the second cavity 410 and the first shell 510. Exemplarily, one end of the connecting portion 4112 is connected to the third side plate 515, and the other end is connected to the second shell 411. The connecting portion 4112 is also connected to the fifth connecting hole 5151, thereby enabling communication between the first shell 510 and the second shell 411. In some embodiments, the cross-sectional area of ​​the connecting portion 4112 is smaller than the area of ​​the outer wall of the third side plate 515, and the cross-sectional area of ​​the connecting portion 4112 is smaller than the area of ​​one side of the second shell 411. This facilitates the connection between the second shell 411 and the first shell 510, while also ensuring a sealed effect on the second cavity 410.

[0142] In some embodiments, the outer contour of the connecting portion 4112 is cylindrical. When the connecting portion 4112 is connected to the first housing 510 by laser welding, the cylindrical connecting portion 4112 facilitates the laser welding process and thus facilitates the connection between the connecting portion 4112 and the first housing 510.

[0143] As shown in Figure 23, a fixing surface 4111 is set on the top of the second shell 411, and the second upper cover 412 is fixedly connected to the fixing surface 4111; a first through hole 4113 is set on the second shell 411, and the first through hole 4113 is connected to the inner cavity of the second shell 411 and the first through hole 4113 is connected to the connecting part 4112. The first through hole 4113 is connected to the fifth connecting hole 5151 through the connecting part 4112, and the first through hole 4113 is used to output optical signals.

[0144] In some embodiments, the optical emitting component 400 includes an isolator 420. Exemplarily, the isolator 420 is disposed in the first through-hole 4113. The isolator 420 seals the first through-hole 4113 and is used to prevent the optical signal output from the first cavity through the fifth connection hole 5151 from entering the second cavity 410. For example, the isolator 420 is used to prevent the transmitted optical signal reflected by the first optical filter 563 from returning to the second cavity 410, or to prevent the received optical signal transmitted through the first optical filter 563 from entering the second cavity 410.

[0145] In some embodiments, a first circuit board 430 is disposed at the other end of the second housing 411. The first circuit board 430 is used to electrically connect the electrical components within the second cavity 410 to the circuit board 300. Exemplarily, the first circuit board 430 is embedded in the other end of the second housing 411, with one end of the first circuit board 430 extending into the second housing 411 and the other end of the first circuit board 430 located outside the second housing 411. The first circuit board 430 is electrically connected to the circuit board 300 via a flexible circuit board. In some embodiments, the first circuit board 430 is a ceramic board, but is not limited to ceramic boards.

[0146] Figure 24 illustrates the connection between an optical emitting component and a first housing according to some disclosed embodiments. As shown in Figure 24 , a first through-hole 4113 is provided on the side wall of the second housing 411. One end of a connecting portion 4112 is connected to the outer wall of the third side panel 515, and the other end of the connecting portion 4112 is embedded in the first through-hole 4113. Exemplarily, the other end of the connecting portion 4112 is sealedly connected to the first through-hole 4113. A second through-hole 4112A is provided on the connecting portion 4112. The second through-hole 4112A extends through the connecting portion 4112 in a direction parallel to the central axis of the first through-hole 4113, thereby connecting the fifth connecting hole 5151 to the inner cavity of the second housing 411 via the second through-hole 4112A. An isolator 420 is embedded in the second through-hole 4112A.

[0147] In some embodiments, as shown in Figure 24 , the left end surface of the connecting portion 4112 contacts the outer wall of the third side plate 515; the left end surface of the isolator 420 is located within the fifth connecting hole 5151, and the majority of the isolator 420 is located within the second through hole 4112A. Positioning the isolator 420 within the fifth connecting hole 5151 and the second through hole 4112A facilitates connection to the first housing 510 via the connecting portion 4112, effectively controls the package size of the light emitting component 400, and facilitates assembly of the light emitting component 400 within the optical module.

[0148] In some embodiments, the light emitting component 400 further includes a light window 440, which is used to transmit the transmitted light signal and seal the light hole. Exemplarily, the light window 440 is embedded in the second through hole 4112A to seal the second through hole 4112A; the light window 440 can be made of transparent glass. The light window 440 is used to relatively seal the second through hole 4112A, facilitating the passage of the transmitted light signal while also sealing the second through hole 4112A to ensure the sealing performance of the second cavity 410. The light window 440 can also be embedded in a connection with the first through hole 4113.

[0149] In some embodiments, the light window 440 is tiltedly disposed within the second through hole 4112A and is located at the end of the second through hole 4112A away from the isolator 420. Furthermore, by not being perpendicular to the central axis of the first through hole 4113, the transmitted light signal reflected by the light window 440 is reduced from returning to the original path of the transmitted light signal. Exemplarily, a mounting groove 4112B is provided at one end of the connecting portion 4112 embedded in the first through hole 4113, the bottom of the mounting groove 4112B is connected to the second through hole 4112A, and the bottom surface of the mounting groove 4112B is an inclined surface. The light window 440 is disposed in the mounting groove 4112B, and the light-transmitting surface of the light window 440 is connected to the bottom surface of the mounting groove 4112B. Exemplarily, the inclination angle of the bottom surface of the mounting groove 4112B is 2-7°.

[0150] Figure 25 is a second exploded schematic diagram of a light emitting component according to some disclosed embodiments. As shown in Figure 25 , the other end of the second housing 411 is provided with an opening 4114, which extends through the other end of the second housing 411. One end of the first circuit board 430 is embedded in the opening 4114, that is, one end of the first circuit board 430 passes through the opening 4114 and extends into the inner cavity of the second housing 411.

[0151] In some embodiments, a laser assembly 450 is disposed within the interior of the second housing 411. Laser assembly 450 is positioned near one end of the first circuit board 430 to facilitate electrical connection of laser assembly 450 to the first circuit board 430. Laser assembly 450 is configured to transmit multiple optical signals of varying wavelengths. Exemplarily, laser assembly 450 is connected to the first circuit board 430 by wire bonding.

[0152] In some embodiments, a second wavelength division multiplexer 460 is further disposed in the inner cavity of the second housing 411 . The second wavelength division multiplexer 460 is used to combine multiple optical signals of different wavelengths emitted by the laser assembly 450 into one optical transmission signal.

[0153] In some embodiments, the light emitting component 400 further includes a collimating lens 490 , which is disposed on the optical path from the laser assembly 450 to the second wavelength division multiplexer 460 , and is used to collimate the optical signal generated by the laser assembly 450 and transmit it to the light input port of the second wavelength division multiplexer 460 .

[0154] Figure 26 is a partial structural schematic diagram of a light emitting component provided according to some disclosed embodiments. In some embodiments, as shown in Figure 26, laser assembly 450 includes a first laser assembly 451, a second laser assembly 452, and a third laser assembly 453; second laser assembly 452 is located between first laser assembly 451 and third laser assembly 453, and the light emission directions of first laser assembly 451, second laser assembly 452, and third laser assembly 453 are toward second wavelength division multiplexer 460. In some embodiments, first laser assembly 451 emits a first wavelength optical signal, second laser assembly 452 emits a second wavelength optical signal, and third laser assembly 453 emits a third wavelength optical signal. The optical axes of the first, second, and third wavelength optical signals are parallel to the longitudinal extension direction of the second housing. Exemplarily, the wavelength range of the first wavelength optical signal is 1340-1344 nm, such as the wavelength of the first wavelength optical signal is 1342 nm; the wavelength range of the second wavelength optical signal is 1480-1500 nm, such as the wavelength of the second wavelength optical signal is 1490 nm; the wavelength range of the third wavelength optical signal is 1575-1580 nm, such as the wavelength of the third wavelength optical signal is 1577 nm.

[0155] In some embodiments, the transmission rate of the first laser assembly 451 is greater than the transmission rate of the third laser assembly 453, and the transmission rate of the third laser assembly 453 is greater than the transmission rate of the second laser assembly 452. For example, the transmission rate of the first laser assembly 451 is 50G, the transmission rate of the second laser assembly 452 is 2.5G, and the transmission rate of the third laser assembly 453 is 10G.

[0156] In some embodiments, the light-emitting end faces of the first laser assembly 451 , the second laser assembly 452 , and the third laser assembly 453 are not flush, that is, the light-emitting end faces of the first laser assembly 451 , the second laser assembly 452 , and the third laser assembly 453 are located on different length surfaces of the second shell 411 .

[0157] In some embodiments, the light emitting component 400 further includes a thermoelectric cooler (TEC) 470 . The TEC 470 is located below the laser assembly 450 and is used to adjust the temperature of the laser assembly 450 .

[0158] In some embodiments, the light emitting component 400 further includes a support plate 480 , the top of the TEC 470 is fixedly connected to the support plate 480 , and the first laser assembly 451 , the second laser assembly 452 and the third laser assembly 453 are disposed on the support plate 480 .

[0159] In some embodiments, the collimating lens 490 includes a first collimating lens 491, a second collimating lens 492, and a third collimating lens 493. The first collimating lens 491 is disposed on the optical transmission path from the first laser assembly 451 to the second wavelength division multiplexer 460, the second collimating lens 492 is disposed on the optical transmission path from the second laser assembly 452 to the second wavelength division multiplexer 460, and the third collimating lens 493 is disposed on the optical transmission path from the third laser assembly 453 to the second wavelength division multiplexer 460. In some embodiments, the first collimating lens 491, the second collimating lens 492, and the third collimating lens 493 are disposed on the support plate 480. Of course, the embodiments of the present disclosure are not limited to the first collimating lens 491, the second collimating lens 492, and the third collimating lens 493 being disposed on the support plate 480.

[0160] FIG27 is a second schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure. As shown in FIG27 , in some embodiments, the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 utilize a chip-on-carrier (COC) package, which can also be referred to as a chip-on-ceramic substrate. Therefore, the side profiles of the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 are relatively regular, such as rectangular side profiles.

[0161] In some embodiments, as shown in FIG27 , the left end of the first circuit board 430 is formed with multiple extensions, with spaces provided between the extensions, so that the left end of the first circuit board 430 forms multiple side surfaces. These side surfaces are used to coordinate with the side edges of the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453, thereby increasing the proximity area between the first circuit board 430 and the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453, and allowing the left end of the first circuit board 430 to surround the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453. Multiple solder pads are provided on the top edge of the left end of the first circuit board 430, distributed along the edge of the left side of the first circuit board 430, to facilitate wire bonding between the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453. Exemplarily, the three sides of the first laser assembly 451 are close to the three side sides of the left end of the first circuit board 430, so that the left end of the first circuit board 430 is semi-enclosed on the side of the first laser assembly 451; one side of the second laser assembly 452 is close to one side side of the left end of the first circuit board 430; and two sides of the third laser assembly 453 are close to two side sides of the left end of the first circuit board 430.

[0162] Figure 28 is a partially exploded schematic diagram of an optical emitting component provided according to some embodiments of the present disclosure, and Figure 29 is a schematic diagram of the structure of a first circuit board provided according to some embodiments of the present disclosure. As shown in Figures 28 and 29, the first circuit board 430 includes a first circuit board body 431, and a first extension portion 432 and a second extension portion 433 located at one end of the first circuit board body 431. The first extension portion 432 is located at an edge of the first circuit board 430, and the second extension portion 433 is located in the middle of the first circuit board 430. A second gap 434 is formed between the first extension portion 432 and the second extension portion 433. One end of the first circuit board body 431 is formed with a first side surface 435, a second side surface 436, a third side surface 437, a fourth side surface 4331, a fifth side surface 438 and a sixth side surface 439; the first side surface 435 is located at the edge of the first extension portion 432 close to the second gap 434, the second side surface 436 is located at the bottom of the second gap 434, the third side surface 437, the fourth side surface 4331 and the fifth side surface 438 are located at the edge of the second extension portion 433, the sixth side surface 439 is located on the side of the second extension portion 433 away from the first extension portion 432, and the sixth side surface 439 is connected to the fifth side surface 438.

[0163] The first side surface 435, the second side surface 436, and the third side surface 437 surround the side of the first laser assembly 451, so that the three sides of the first laser assembly 451 are correspondingly close to the first side surface 435, the second side surface 436, and the third side surface 437. The fourth side surface 4331 is located on the side of the second laser assembly 452, so that one side of the second laser assembly 452 is close to the fourth side surface 4331. The fifth side surface 438 and the sixth side surface 439 surround the side of the third laser assembly 453, so that two sides of the third laser assembly 453 are correspondingly close to the fifth side surface 438 and the sixth side surface 439.

[0164] A plurality of solder pads are provided along the edge of the top surface of the first circuit board 430, which is connected to the first side surface 435, the second side surface 436, the third side surface 437, the fourth side surface 4331, the fifth side surface 438, and the sixth side surface 439. The first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 are respectively wired to connect to some of the solder pads along the top edge of the first circuit board 430. The remaining solder pads are used for mounting electrical components, such as backlight detectors, resistors, capacitors, etc.

[0165] Figure 30 is a partial enlarged view of point M in Figure 27 . As shown in Figure 30 , the first laser assembly 451 includes a first laser chip 4511 and a first high-frequency transmission line 4512. The first high-frequency transmission line 4512 is a metal layer formed on the substrate of the first laser assembly 451 and extends toward the first side surface 435 . A first solder pad 4321 is provided on the top edge of the first extension portion 432 , and is located at the edge of the first side surface 435 . One end of the first high-frequency transmission line 4512 is bonded to the first laser chip 4511 , and the other end of the first high-frequency transmission line 4512 is bonded to the first solder pad 4321 . This is done to control the bonding length between the first laser chip 4511 and the first circuit board 430 , for example, to minimize the bonding length between the first laser chip 4511 and the first circuit board 430 , and to ensure impedance matching between the first laser chip 4511 and the first circuit board 430 . In some embodiments, the first high-frequency transmission line 4512 and the first pad 4321 are located at the same height, which facilitates bonding between the first high-frequency transmission line 4512 and the first pad 4321 and minimizes the bonding length.

[0166] In some embodiments, the first laser chip 4511 is an electrical absorption modulated laser (EML) and is packaged with a semiconductor laser amplifier. One end of the first high-frequency transmission line 4512 is wire-bonded to the positive electrode of the electro-absorption modulator of the EML.

[0167] In some embodiments, the first laser chip 4511 is tilted, but the direction of the first wavelength optical signal output by the first laser chip 4511 is parallel to the length direction of the second housing 411, so as to reduce the amount of optical signal generated by the first laser chip 4511 reflected back by the first collimating lens 491 from entering the first laser chip 4511, thereby effectively reducing the amount of optical signal reflected back from entering the first laser chip 4511 and interfering with the light emission of the first laser chip 4511.

[0168] Figure 31 is a partial enlarged view of point N in Figure 27 . As shown in Figure 31 , the third laser assembly 453 includes a third laser chip 4531 and a second high-frequency transmission line 4532. The second high-frequency transmission line 4532 is a metal layer formed on the substrate of the third laser assembly 453 and extends toward the fifth side surface 438. A second solder pad 4332 is provided on the top edge of the second extension portion 433, and is located at the edge of the fifth side surface 438. One end of the second high-frequency transmission line 4532 is bonded to the third laser chip 4531, and the other end of the second high-frequency transmission line 4532 is bonded to the second solder pad 4332. This ensures that the bond length between the third laser chip 4531 and the first circuit board 430 is controlled, for example, to be kept to the minimum possible length, and that impedance matching between the third laser chip 4531 and the first circuit board 430 is ensured. In some embodiments, the second high-frequency transmission line 4532 and the second pad 4332 are located at the same height, which facilitates bonding between the second high-frequency transmission line 4532 and the second pad 4332 and minimizes the bonding length.

[0169] In some embodiments, the third laser chip 4531 is an EML, and one end of the second high-frequency transmission line 4532 is connected to the positive electrode of the electro-absorption modulator of the EML by bonding.

[0170] In some embodiments, TEC 470 includes a first electrode 471 and a second electrode 472 , which are located at the edges of the TEC 470 package. Exemplarily, the first electrode 471 and the second electrode 472 are disposed on a side of the third laser assembly 453 away from the second laser assembly 452 and close to the sixth side 439 .

[0171] As shown in Figures 27 to 31, in some embodiments, the arrangement of the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453, combined with the structural form of the first circuit board 430, can make full use of the space of the second shell 411, facilitate the arrangement of the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453 in the second shell 411, and realize the electrical connection between the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453 and the circuit board 300.

[0172] Figure 32 is a schematic diagram of the structure of a support plate according to some embodiments of the present disclosure, and Figure 33 is a schematic diagram of the structure of a support plate according to some embodiments of the present disclosure. As shown in Figures 32 and 33, a support plate 480 includes a support plate body 481. A first spacer 484 is provided on one side of the support plate body 481. A first boss 482 is provided on one side of the first spacer 484 and at the top of the support plate body 481. A second boss 483 is provided on the other side of the first spacer 484 and at the top of the support plate body 481. The first boss 482 and the second boss 483 are higher than the top surface of the support plate body 481. In some embodiments, the first boss 482 and the second boss 483 have different heights.

[0173] FIG34 illustrates a support plate in use according to some embodiments of the present disclosure. As shown in FIG34 , a first laser assembly 451 is positioned on a first boss 482, a second laser assembly 452 is positioned on the top surface of the support plate body 481 near the edge of the first spacer 484, and a third laser assembly 453 is positioned on the second boss 483. The first boss 482 and the second boss 483 are used to coordinate the heights of the optical signals output by the first, second, and third laser assemblies 451, 452, and 453, ensuring that the optical signals output by the first, second, and third laser assemblies 451, 452, and 453 are at the same or similar heights. Furthermore, the first and second bosses 482 and 483 are used to coordinate the heights of the solder pads on the first, second, and third laser assemblies 451, 452, and 453, thereby controlling the bonding lengths between the first and second laser assemblies 451, 452, and 453. In addition, a first spacer 484 is provided between the first boss 482 and the second boss 483 to facilitate thermal isolation between the first laser assembly 451, the second laser assembly 452 and the third laser assembly 453, and to facilitate assembly with the first circuit board 430, saving assembly space.

[0174] FIG35 is a first schematic diagram of a second housing structure according to some embodiments of the present disclosure, and FIG36 is a second schematic diagram of a second housing structure according to some embodiments of the present disclosure. As shown in FIG35 and FIG36 , a first opening 4114a is defined on one side of the second housing 411, a second opening 4114b is defined on the other end of the second housing 411, and a third opening 4114c is defined on the other side of the second housing 411. The first opening 4114a, the second opening 4114b, and the third opening 4114c are sequentially connected and communicate with the inner cavity of the second housing 411. The first opening 4114a, the second opening 4114b, and the third opening 4114c form a U-shape, and the first opening 4114a extends less than the third opening 4114c in the EF direction of the second housing 411, thereby facilitating assembly and connection of the opening 4114 with the first circuit board 430. The first opening 4114 a is assembled and connected to an edge of the first circuit board body 431 , the second opening 4114 b is assembled and connected to a middle portion of the first circuit board body 431 , and the third opening 4114 c is assembled and connected to an edge of the first extension portion 432 .

[0175] FIG37 is an optical path diagram of an optical transmission signal provided according to some embodiments of the present disclosure. FIG37 illustrates a transmission optical path for an optical transmission signal. As shown in FIG37 , a first wavelength optical signal emitted by a first laser assembly 451 is transmitted to a first collimating lens 491, collimated by the first collimating lens 491, and transmitted to a second wavelength division multiplexer 460. A second wavelength optical signal emitted by a second laser assembly 452 is transmitted to a second collimating lens 492, collimated by the second collimating lens 492, and transmitted to a second wavelength division multiplexer 460. A third wavelength optical signal emitted by a third laser assembly 453 is transmitted to a third collimating lens 493, collimated by the third collimating lens 493, and transmitted to a second wavelength division multiplexer 460. The second wavelength division multiplexer 460 combines the first, second, and third wavelength optical signals into a single optical transmission signal and outputs it to the isolator 420. The optical signal is transmitted through the isolator 420 and transmitted through the fifth connection hole 5151 to the first optical filter 563, where it is then transmitted through the first filter 563.

[0176] The optical module provided in the embodiment of the present disclosure is encapsulated and connected by the first shell 510, the optical emitting component 400, the first optical receiving component 530, the second optical receiving component 540 and the third optical receiving component 550, and an optical component 560 is arranged in the second cavity 410, so that the optical module transmits a beam of transmitted optical signals including a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal through the optical fiber adapter 700, and receives a beam of received optical signals including a fourth wavelength optical signal, a fifth wavelength optical signal and a sixth wavelength optical signal, thereby realizing that the optical module can transmit and receive optical signals of three different wavelengths, thereby realizing the transmission and reception of multi-wavelength optical signals integrated in the optical module.

[0177] Figure 38 is a schematic diagram (I) of an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure, and Figure 39 is a schematic diagram (II) of an exploded view of the internal structure of an optical module according to some embodiments of the present disclosure. As shown in Figures 38 and 39, the optical module further includes a first flexible circuit board 320, a second flexible circuit board 330, and a third flexible circuit board 340. The end of the circuit board 300, away from the gold finger 310, is provided with a first electrical connection area 301, a second electrical connection area 302, and a third electrical connection area 303. One end of the first flexible circuit board 320 is connected to the first circuit board 430, and the other end of the first flexible circuit board 320 is connected to the first electrical connection area 301. One end of the second flexible circuit board 330 is connected to the first light receiving component 530 and the third light receiving component 550, respectively, and the other end of the second flexible circuit board 330 is connected to the second electrical connection area 302. One end of the third flexible circuit board 340 is connected to the second light receiving component 540, and the other end of the third flexible circuit board 340 is connected to the third electrical connection area 303.

[0178] In some embodiments, a notch 304 is formed at one end of the circuit board 300 away from the gold finger 310. This notch 304 makes one end of the circuit board 300 relatively longer and the other relatively shorter. The end of the first circuit board 430 is located within the notch 304, so that the relatively longer end of the circuit board 300 extends to the side of the first circuit board 430, and the relatively shorter end of the circuit board 300 extends to the end of the first circuit board 430. This allows the circuit board 300 to fully utilize the space within the housing and also allows the circuit board 300 to fit within the optical receiving component 500 and the light emitting component 400. Exemplarily, the notch 304 includes a first end face 3041 and a second end face 3042, the first end face 3041 extends along the width direction of the circuit board 300, and the second end face 3042 extends along the length direction of the circuit board 300, and the first end face 3041 and the second end face 3042 form an L-shaped notch at one end of the circuit board 300; the first end face 3041 is located on the side of the end of the first circuit board 430, and the second end face 3042 is located on the side of one side of the first circuit board 430.

[0179] In some embodiments, a first electrical connection region 301 is provided on the top surface of the side of the first end surface 3041, a second electrical connection region 302 is provided on the top surface of the side of the second end surface 3042, and a third electrical connection region 303 is provided on the bottom surface of the side of the second end surface 3042. The first electrical connection region 301, the second electrical connection region 302, and the third electrical connection region 303 are located at the edge of the surface of the circuit board 300, so that the first electrical connection region 301, the second electrical connection region 302, and the third electrical connection region 303 are as close as possible to the optical receiving component 500 and the light emitting component 400, thereby effectively controlling the area occupied by the circuit board 300 for connecting the first flexible circuit board 320, the second flexible circuit board 330, and the third flexible circuit board 340. Exemplarily, the third electrical connection region 303 is located on the back side of the second electrical connection region 302 to reduce crosstalk between signals transmitted on the second flexible circuit board 330 and the third flexible circuit board 340.

[0180] In some embodiments, the first electrical connection area 301 includes a first pad group 3011, which is soldered to the first flexible circuit board 320; the second electrical connection area 302 includes a second pad group 3021, which is soldered to the second flexible circuit board 330; and the third electrical connection area 303 includes a third pad group 3031, which is soldered to the third flexible circuit board 340. Exemplarily, the first pad group 3011, the second pad group 3021, and the third pad group 3031 each include a plurality of pads.

[0181] In some embodiments, the first electrical connection area 301 also includes a first support portion 3012, which is located on one side of the first solder pad group 3011 and close to the end of the first circuit board 430, and the first support portion 3012 supports the other end of the first flexible circuit board 320; the second electrical connection area 302 also includes a second support portion 3022, which is located on one side of the second solder pad group 3021 and close to the receiving component, and the second support portion 3022 supports the other end of the second flexible circuit board 330; the third electrical connection area 303 also includes a third support portion 3032, which is located on the third solder pad group 3031 and close to the receiving component, and the third support portion 3032 supports the other end of the third flexible circuit board 340.

[0182] Figure 40 is a schematic diagram of the structure of a first flexible circuit board according to some embodiments of the present disclosure. As shown in Figure 40 , a first soldering portion 321 is provided at one end of the first flexible circuit board 320, and a second soldering portion 322 is provided at the other end of the first flexible circuit board 320. The first soldering portion 321 and the second soldering portion 322 are each provided with multiple solder pads. The first soldering portion 321 is used for soldering to the first circuit board 430, and the second soldering portion 322 is used for soldering to the first solder pad group 3011.

[0183] In some embodiments, the first flexible circuit board 320 is further provided with a first supporting connection portion 323, one end of which is connected to the first connection portion 321, and the other end of which is connected to the second soldering portion 322. The first supporting portion 3012 supports and connects to the first supporting connection portion 323, thereby enhancing the connection reliability between the first flexible circuit board 320 and the circuit board 300. The second soldering portion 322 is relatively small, and when the second soldering portion 322 is soldered to the first solder pad group 3011, the connection strength between the second soldering portion 322 and the first solder pad group 3011 is limited. Therefore, the first supporting portion 3012 supports and connects to the first supporting connection portion 323, thereby enhancing the connection security between the first flexible circuit board 320 and the circuit board 300.

[0184] Figure 41 is a schematic diagram of the structure of a second flexible printed circuit board according to some embodiments of the present disclosure. As shown in Figure 41 , the second flexible printed circuit board 330 includes a third soldering portion 331, which is provided with multiple solder pads. The third soldering portion 331 is soldered to the second solder pad group 3021. A second supporting portion 332 is also provided at one end of the third soldering portion 331. The second supporting portion 3022 supports and connects to the second supporting portion 332, thereby enhancing the connection reliability between the second flexible printed circuit board 330 and the circuit board 300.

[0185] In some embodiments, the second flexible circuit board 330 includes a first branch 333 and a second branch 334. One end of the first branch 333 is electrically connected to the first light receiving component 530, and the other end of the first branch 333 is connected to one end of the second support and connection portion 332. One end of the second branch 334 is electrically connected to the third light receiving component 550, and the other end of the second branch 334 is connected to one end of the second support and connection portion 332. The other end of the first branch 333 and the other end of the second branch 334 are arranged side by side. The first branch 333 and the second branch 334 are arranged at one end of the second flexible circuit board 330, so that the portion of the second flexible circuit board 330 that is electrically connected to the first light receiving component 530 and the portion that is electrically connected to the third light receiving component 550 are separated, while the other end that is electrically connected to the circuit board 300 is integrated. This facilitates the electrical connection between the second flexible circuit board 330 and the first light receiving component 530, the second flexible circuit board 330 and the third light receiving component 550, and also facilitates the electrical connection of the second flexible circuit board 330 to the circuit board 300.

[0186] In some embodiments, the first branch 333 includes a first extension portion 3331, a second extension portion 3332, and a fourth welding portion 3333. The side of the fourth welding portion 3333 is connected to the side of one end of the first extension portion 3331. The fourth welding portion 3333 is used for welding and connecting the first light receiving component 530. The side of the other end of the first extension portion 3331 is connected to the side of one end of the second extension portion 3332. The other end of the second extension portion 3332 is connected to the second supporting connection portion 332. The length extension direction of the first extension portion 3331 and the length extension direction of the second extension portion 3332 are not aligned. The bend of one end of the first branch 333 from the fourth welding portion 3333 to the second extension portion 3332 positions the fourth welding portion 3333 on one side of the first extension portion 3331 and the second extension portion 3332 on the other side of the first extension portion 3331.

[0187] In some embodiments, the first branch 333 further includes a first bend 3334, one end of which is connected to a side of the fourth welding portion 3333, and the other end of which is connected to a side of one end of the first extension portion 3331. The first bend 3334 facilitates the bending between the fourth welding portion 3333 and the first extension portion 3331.

[0188] In some embodiments, the second branch 334 includes a fifth welding portion 3341 and a third extension portion 3342. The side of the fifth welding portion 3341 is connected to the side of one end of the third extension portion 3342, so that the fifth welding portion 3341 is located on one side of the third extension portion 3342; the other end of the third extension portion 3342 is connected to the second supporting connection portion 332; the fifth welding portion 3341 is used for welding and connecting the third light receiving component 550.

[0189] In some embodiments, the third extension portion 3342 and the second extension portion 3332 are arranged side by side, and the length extension direction of the third extension portion 3342 and the length extension direction of the second extension portion 3332 are on the same straight line.

[0190] In some embodiments, the second branch 334 further includes a second bending portion 3343, one end of which is connected to a side of the fifth welding portion 3341, and one end of which is connected to a side of the third extension portion 3342. The second bending portion 3333 is used to facilitate the bending of the fifth welding portion 3341 to the third extension portion 3342.

[0191] Figure 42 is a schematic diagram of the structure of a third flexible circuit board provided according to some embodiments of the present disclosure. As shown in Figure 42, the third flexible circuit board 340 includes a sixth soldering portion 341, a fourth extension portion 342, and a seventh soldering portion 343. The side of the sixth soldering portion 341 connects to the side of one end of the fourth extension portion 342, and the other end of the fourth extension portion 342 connects to the seventh soldering portion 343, so that the sixth soldering portion 341 is located to one side of the extension direction of the fourth extension portion 342. The sixth soldering portion 341 is soldered to the second light receiving component 540; the seventh soldering portion 343 includes multiple solder pads and is soldered to the three-pad group 3031.

[0192] In some embodiments, the third flexible circuit board 340 further includes a third supporting connection portion 344. One end of the third supporting connection portion 344 is connected to the fourth extension portion 342, and the other end of the third supporting connection portion 344 is connected to the seventh soldering portion 343. The third supporting portion 3032 supports and connects the third supporting connection portion 344 to enhance the connection reliability between the third flexible circuit board 340 and the circuit board 300.

[0193] In some embodiments, the third flexible circuit board 340 further includes a third bend portion 345 , one end of which is connected to a side edge of the sixth soldering portion 341 , and the other end of which is connected to a side edge of one end of the fourth extension portion 342 . The third bend portion 345 facilitates bending from the sixth soldering portion 341 to the fourth extension portion 342 .

[0194] Figure 43 is a partial structural schematic diagram (I) of an optical module provided according to some embodiments of the present disclosure, and Figure 44 is a partial structural schematic diagram (II) of an optical module provided according to some embodiments of the present disclosure. Figures 43 and 44 illustrate the connection between a light emitting component, a light receiving component, and a circuit board. As shown in Figures 43 and 44, a second flexible circuit board 330 extends from one end of the circuit board 300 toward the top of the optical receiving component 500, then bends from the top toward the side of the optical receiving component 500, thereby connecting the second flexible circuit board 330 to the first light receiving component 530 and the third light receiving component 550. A third flexible circuit board 340 extends from one end of the circuit board 300 toward the bottom of the optical receiving component 500, then bends from the bottom toward the side of the optical receiving component 500, thereby connecting the third flexible circuit board 340 to the second light receiving component 540. The middle part of the second flexible circuit board 330 is mainly located at the top of the optical accommodating component 500, and the middle part of the third flexible circuit board 340 is mainly located at the bottom of the optical accommodating component 500. This can not only reduce the signal crosstalk between the second flexible circuit board 330 and the third flexible circuit board 340, but also effectively control the width of the second flexible circuit board 330 and the third flexible circuit board 340, so that the width of the second flexible circuit board 330 and the third flexible circuit board 340 is within an appropriate range, so as to facilitate the assembly of the second flexible circuit board 330 and the third flexible circuit board 340 in the optical module.

[0195] In some embodiments, the second extension portion 3332 and the third extension portion 3342 extend from one end of the circuit board 300 to the top of the first cavity respectively, the third extension portion 3342 is located at the edge of the top of the first cavity, and the first extension portion 3331 is located at the edge of the top of the first cavity; the second bending portion 3343 is located at the edge of the third light receiving component 550, and the second bending portion 3343 realizes the bending of the second branch 334 from the top of the first cavity to the side of the first cavity; the first bending portion 3334 is located at the edge of the first light receiving component 530, and the first bending portion 3334 realizes the bending of the first branch 333 from the top of the first cavity to the side of the first cavity.

[0196] In some embodiments, the fourth extension portion 342 extends from one end of the circuit board 300 to the bottom of the first cavity; the fourth extension portion 342 is located at the edge of the bottom of the optical accommodating component 500, and the third bending portion 345 is located at the edge of the second light receiving component 540, and the third bending portion 345 realizes the bending of the third flexible circuit board 340 from the bottom of the first cavity to the side of the first cavity.

[0197] In some embodiments, a reference ground is provided on the opposing surfaces of the second flexible circuit board 330 and the third flexible circuit board 340, which blocks electromagnetic radiation. Therefore, when the second light receiving element 540 has the highest reception rate among the three light receiving elements, the arrangement of the second and third flexible circuit boards 330 and 340 shown in Figures 43 and 44 can more effectively reduce crosstalk during signal transmission, effectively isolating the effect of the electrical signal transmitted on the second flexible circuit board 330 on the electrical signal transmitted on the third flexible circuit board 340, and ensuring the quality of the electrical signal output by the third light receiving element 550.

[0198] Figure 45 is a first diagram showing a circuit board in use according to some embodiments of the present disclosure, and Figure 46 is a second diagram showing a circuit board in use according to some embodiments of the present disclosure; Figures 45 and 46 show the layout of devices on a circuit board 300.

[0199] As shown in Figure 45 , a first driver 305 is disposed on the first surface of the circuit board 300 and is located to the side of the first electrical connection area 301. The first driver 305 is electrically connected to the first laser assembly 451, so that the first driver 305 drives and controls the first laser assembly 451 to generate an optical signal of a first wavelength. Exemplarily, the first driver 305 is disposed on a side of the first solder pad group 3011 away from the first support portion 3012, and the first driver 305 is electrically connected to the first laser assembly 451 via the first solder pad group 3011. The first driver 305 is arranged on the side of the first pad group 3011 and close to the first pad group 3011, which not only makes it easier to shorten the transmission line of the high-frequency driving signal from the first driver 305 to the first laser component 451, thereby reducing the insertion loss of the high-frequency driving signal from the first driver 305 to the first laser component 451 and ensuring the swing of the high-frequency driving signal to improve the extinction ratio and other optical properties of the first laser component 451; it can also effectively reduce the high-frequency driving signal output by the first driver 305 from generating spatial electromagnetic radiation and being subjected to electromagnetic radiation, thereby ensuring the quality of the electrical signal output by the first driver 305.

[0200] As shown in FIG45 , a DSP chip 306 is also disposed on the first surface of the circuit board 300. The DSP chip 306 is disposed on the side of and adjacent to the first driver 305 and is electrically connected to the first driver 305. The DSP chip 306 receives a first electrical signal transmitted from the host computer via the gold finger 310 and performs pre-processing such as shaping on the first electrical signal. The signal is then transmitted to the first driver 305 via the DSP chip 306, which then drives the first laser assembly 451 based on the received electrical signal.

[0201] As shown in FIG45 , a second driver 307 is also provided on the first surface of circuit board 300. Second driver 307 is located to the side of first driver 305 and to the side of first solder pad group 3011. Second driver 307 is electrically connected to third laser assembly 453, thereby driving third laser assembly 453 to generate a third wavelength optical signal. Exemplarily, second driver 307 is positioned obliquely on circuit board 300, with one corner of second driver 307 facing and adjacent to first driver 305. This corner has two sides including a first side surface and a second side surface, with the first side surface inclined toward one end of circuit board 300 and the second side surface inclined toward the other end of circuit board 300. The first side surface of second driver 307 is adjacent to first solder pad group 3011, and the second side surface of second driver 307 is adjacent to DSP chip 306. Second driver 307 is electrically connected to third laser assembly 453 via first solder pad group 3011.

[0202] The DSP chip 306 receives the third electrical signal transmitted from the host computer via the gold finger 310 and performs pre-processing such as shaping on the third electrical signal. The third electrical signal is then transmitted to the second driver 307 via the DSP chip 306, and the second driver 307 drives the third laser assembly 453 based on the received electrical signal. Alternatively, the third electrical signal transmitted by the gold finger 310 is directly transmitted to the second driver 307, which drives the third laser assembly 453 based on the received electrical signal. The second driver 307 is tilted to accommodate the first driver 305. This facilitates coordination of the circuit trace lengths between the second driver 307 and the third laser assembly 453, as well as the circuit trace lengths between the second driver 307 and the DSP chip 306 or gold finger 310. This also helps to keep the transmission path of the high-frequency electrical signal from the second driver 307 to the third laser assembly 453 relatively short, thereby reducing insertion loss of the high-frequency electrical signal from the second driver 307 to the third laser assembly 453.

[0203] In some embodiments, the second driver 307 is further electrically connected to the second pad group 3021, thereby being electrically connected to the first light receiving component 530 via the second pad group 3021. The second driver 307 is configured to amplify the fourth electrical signal output by the first light receiving component 530 after receiving the fourth wavelength optical signal, and transmit the fourth electrical signal after limited amplification to the gold finger 310. The second driver 307 is tilted to facilitate coordination of the circuit trace lengths between the second driver 307 and the first light receiving component 530, and between the second driver 307 and the gold finger 310, so as to ensure the quality of the fourth electrical signal. In some embodiments, a first row of gold fingers 310a and a second row of gold fingers 310b are provided on the first surface of the circuit board 300. The first row of gold fingers 310a and the second row of gold fingers 310b respectively include multiple pins, and the second row of gold fingers 310b are closer to the edge of the circuit board 300 than the first row of gold fingers 310a. A third row of gold fingers 310c and a fourth row of gold fingers 310d are provided on the second surface of the circuit board 300. The third row of gold fingers 310c and the fourth row of gold fingers 310d respectively include multiple pins, and the fourth row of gold fingers 310d are closer to the edge of the circuit board 300 than the third row of gold fingers 310c.

[0204] In some embodiments, the first row of gold fingers 310a includes a 33rd pin 311, a 34th pin 312, a 36th pin 313, and a 37th pin 314. The 33rd pin 311, the 34th pin 312, the 36th pin 313, and the 37th pin 314 are located near the DSP chip 306. The 33rd pin 311, the 34th pin 312, the 36th pin 313, and the 37th pin 314 are electrically connected to the DSP chip 306. Exemplarily, a plurality of high-frequency transmission lines are disposed on the first surface of the circuit board 300. The 33rd pin 311, the 34th pin 312, the 36th pin 313, and the 37th pin 314 are electrically connected to the DSP chip 306 via corresponding high-frequency transmission lines. The high-frequency transmission lines do not pass through the inner layers of the circuit board 300. The high-frequency transmission line electrically connecting the 33rd pin 311, the 34th pin 312, the 36th pin 313 and the 37th pin 314 to the DSP chip 306 only runs on the surface of the circuit board 300, so as to ensure the impedance continuity of the electrical connection line from the 33rd pin 311, the 34th pin 312, the 36th pin 313 and the 37th pin 314 to the DSP chip 306, thereby shortening the transmission line of the first electrical signal and reducing the transmission loss of the first electrical signal, thereby ensuring the transmission quality of the first electrical signal.

[0205] In some embodiments, the host computer sends the first electrical signal to the DSP chip 306 through the 33rd pin 311 , the 34th pin 312 , the 36th pin 313 and the 37th pin 314 in the form of an NRZ electrical signal or a PAM4 electrical signal. Taking the first wavelength optical signal with an emission rate of 50G by the first laser assembly 451 as an example, when the host computer adopts a 2x25G NRZ data transmission mode, the 36th pin 313 and the 37th pin 314 form a transmission channel 1, and the 33rd pin 311 and the 34th pin 312 form a transmission channel 2. Transmission channel 1 transmits one 25G NRZ electrical signal, and transmission channel 2 transmits one 25G NRZ electrical signal. The DSP chip 306 synthesizes the two 25G NRZ electrical signals into one 50G NRZ electrical signal and transmits it to the first driver 305. When the host computer adopts a 1x25G PAM4 data transmission mode, the 36th pin 313 and the 37th pin 314 are used to transmit one 25G PAM4 electrical signal. The DSP chip 306 converts the one 25G PAM4 electrical signal into one 50G NRZ electrical signal and transmits it to the first driver 305.

[0206] As shown in FIG46 , a third driver 308 is disposed on the second surface of the circuit board 300. The third driver 308 is located on the back side of the first electrical connection area 301. The third driver 308 is electrically connected to the second laser assembly 452 so that the third driver 308 drives and controls the second laser assembly 452 to generate a second wavelength optical signal. Exemplarily, the third driver 308 is electrically connected to the second laser assembly 452 via the first solder pad group 3011. The placement of the third driver 308 on the back side of the first electrical connection area 301 facilitates minimizing the transmission path of the high-frequency electrical signal from the third driver 308 to the second laser assembly 452, thereby reducing insertion loss of the high-frequency electrical signal from the third driver 308 to the second laser assembly 452.

[0207] In some embodiments, the third driver 308 is further electrically connected to the second pad group 3021 to be electrically connected to the third light receiving component 550 through the second pad group 3021. The third driver 308 is configured to amplify the sixth electrical signal output by the third light receiving component 550 when receiving the sixth wavelength optical signal, and transmit the limited and amplified sixth electrical signal to the gold finger 310.

[0208] In some embodiments, since the third driver 308 and the first driver 305 are the main heat-generating components in the optical module, the projection of the third driver 308 on the circuit board 300 does not intersect with the projection of the first driver 305 on the circuit board 300, thereby effectively reducing the thermal crosstalk between the third driver 308 and the first driver 305.

[0209] As shown in FIG46 , an LIA 309a is further provided on the second surface of the circuit board 300. The LIA 309a is located to the side of the third electrical connection region 303. The LIA 309a is electrically connected to the second optical receiving component 540, so that the LIA 309a limits and amplifies the fifth electrical signal output by the second optical receiving component 540 after receiving the fifth wavelength optical signal and transmits the amplified fifth electrical signal to the gold finger 310. Exemplarily, the LIA 309a is located on a side of the third pad group 3031 away from the third support portion 3032. The LIA 309a is electrically connected to the second optical receiving component 540 via the third pad group 3031. The placement of the LIA 309a to the side of the third pad group 3031 facilitates minimizing the transmission path of the fifth electrical signal from the LIA 309a to the second optical receiving component 540. The fifth electrical signal output by the second optical receiving component 540 is a small signal and is sensitive to impedance matching and signal insertion loss in the transmission line. Therefore, by controlling the transmission line from LIA309a to the second optical receiving component 540 to the shortest possible length, the transmission quality of the fifth electrical signal can be ensured.

[0210] In some embodiments, the electrical connection line between LIA309a and the third pad group 3031 is located on the bottom layer of the circuit board 300, that is, the electrical connection line between LIA309a and the third pad group 3031 does not run through the inner layer of the circuit board 300, so as to ensure the impedance continuity of the electrical connection line between LIA309a and the third pad group 3031, shorten the transmission line of the fifth electrical signal, reduce the transmission loss of the fifth electrical signal, and ensure the quality of the fifth electrical signal.

[0211] In some embodiments, an MCU 309 b is further provided on the second surface of the circuit board 300. The MCU 309 b and the DSP chip 306 are the main heat-generating components in the optical module. By ensuring that the projection of the MCU 309 b on the circuit board 300 does not intersect with the projection of the DSP chip 306 on the circuit board 300, the thermal crosstalk between the MCU 309 b and the DSP chip 306 is effectively reduced.

[0212] In some embodiments, the third row of gold fingers 310 c includes a 14th pin 315, a 15th pin 316, a 17th pin 317, and an 18th pin 318. These pins are located near the LIA 309 a. These pins are electrically connected to the LIA 309 a. The fifth electrical signal, after limiting and amplifying by the LIA 309 a, is transmitted to the 14th pin 315, the 15th pin 316, the 17th pin 317, and the 18th pin 318, and then to a host computer via the pins 315, the 15th pin 316, the 17th pin 317, and the 18th pin 318.

[0213] In the disclosed embodiment, the 14th pin 315, the 15th pin 316, the 17th pin 317, and the 18th pin 318 of the gold finger 310 near the LIA 309a are defined to transmit the fifth electrical signal after the limiting amplification. This facilitates shortening the transmission path of the fifth electrical signal after the limiting amplification, ensuring impedance continuity on the transmission path, reducing transmission loss of the fifth electrical signal, and ensuring the transmission quality of the fifth electrical signal.

[0214] In some embodiments, the transmission rate of the optical signal received by the second optical receiving component 540 is 25G or 50G. Taking the example of the second optical receiving component 540 outputting a fifth electrical signal at a rate of 50G, when the fifth electrical signal is a 2x25G NRZ electrical signal, the 14th pin 315 and the 15th pin 316 form receiving channel 1, and the 17th pin 317 and the 18th pin 318 form receiving channel 2. Receiver channel 1 transmits one 25G NRZ electrical signal, and receive channel 2 transmits one 25G NRZ electrical signal. When the fifth electrical signal is a 1x25G PAM4 electrical signal, the 17th pin 317 and the 18th pin 318 transmit one 25G PAM4 electrical signal. When the fifth electrical signal is a 1x50G NRZ electrical signal, the 17th pin 317 and the 18th pin 318 transmit one 50G NRZ electrical signal.

[0215] In some embodiments, the second column of gold fingers 310b includes a 74th pin 353 and a 75th pin 354, which are electrically connected to the third driver 308 or the DSP chip 306. Exemplarily, the 74th pin 353 and the 75th pin 354 are electrically connected to the third driver 308. The host computer transmits the second electrical signal to the third driver 308 through the 74th pin 353 and the 75th pin 354. The third driver 308 drives the second laser assembly 452 according to the received second electrical signal.

[0216] In some embodiments, the first column of gold fingers 310a further includes a 21st pin 351 and a 22nd pin 352, and the 21st pin 351 and the 22nd pin 352 are electrically connected to the second driver 307. Exemplarily, the second driver 307 transmits the amplified fourth electrical signal to the 21st pin 351 and the 22nd pin 352, so as to be transmitted to the host computer through the 21st pin 351 and the 22nd pin 352.

[0217] In some embodiments, the third column of gold fingers 310c further includes a second pin 357 and a third pin 358, which are electrically connected to the second driver 307 or the DSP chip 306. Exemplarily, the second pin 357 and the third pin 358 are electrically connected to the second driver 307. The host computer transmits the third electrical signal to the second driver 307 through the second pin 357 and the third pin 358. The second driver 307 drives the third laser assembly 453 according to the received third electrical signal.

[0218] In some embodiments, the fourth column of gold fingers 310d includes a 55th pin and a 56th pin, and the 55th pin 355 and the 56th pin 356 are electrically connected to the third driver 308. Exemplarily, the third driver 308 transmits the amplified sixth electrical signal to the 55th pin 355 and the 56th pin 356, so as to be transmitted to the host computer through the 55th pin 355 and the 56th pin 356.

[0219] Figure 47 is a pin definition diagram for a gold finger according to some embodiments of the present disclosure. Figure 47 illustrates a gold finger usage definition. As shown in Figure 47, gold finger 310 includes 76 pins. The pins of gold finger 310 support hot swapping, and the 76 pins are evenly divided into four columns. The first column of gold fingers includes pins 20 through 38, and the second column of gold fingers includes pins 58 through 76. These first and second columns of gold fingers are located on the first surface of circuit board 300. The third column of gold fingers includes pins 1 through 19, and the fourth column of gold fingers includes pins 39 through 57. These third and fourth columns of gold fingers are located on the second surface of circuit board 300.

[0220] For example, the transmission rate of the first laser component 451 is 50G, the transmission rate of the second laser component 452 is 2.5G, the transmission rate of the third laser component 453 is 10G, the receiving rate of the photodetector in the first light receiving component 530 is 10G, the receiving rate of the photodetector in the second light receiving component 540 is 50G, and the receiving rate of the photodetector in the third light receiving component 550 is 2.5G. The definition of the pins in the gold finger 310 is shown in Figure 47.

[0221] Figure 48 is a third diagram illustrating a circuit board in use according to some embodiments of the present disclosure, and Figure 49 is a fourth diagram illustrating a circuit board in use according to some embodiments of the present disclosure. Figures 48 and 49 illustrate the wiring layout on a circuit board 300 and the connections between components and the circuit board 300. As shown in Figures 48 and 49, the first driver 305 is electrically connected to the circuit board 300 via pins, the DSP chip 306 is connected to the circuit board 300 via solder balls, the second driver 307 is connected to the circuit board 300 via pads, the third driver 308 is electrically connected to the circuit board 300 via pins, the LIA 309a is electrically connected to the circuit board via solder balls, and the MCU 309b is connected to the circuit board 300 via solder balls.

[0222] A first high-frequency transmission line group 371 and a second high-frequency transmission line group 372 are provided on the first surface of the circuit board 300. One end of the first high-frequency transmission line group 371 is electrically connected to the DSP chip 306, and the other end of the first high-frequency transmission line group 371 is electrically connected to the gold finger 310. One end of the second high-frequency transmission line group 372 is electrically connected to the first driver 305, and the other end of the second high-frequency transmission line group 372 is electrically connected to the DSP chip 306. The first high-frequency transmission line group 371 and the second high-frequency transmission line group 372 each include multiple high-frequency transmission lines. Exemplarily, the first high-frequency transmission line group 371 includes four high-frequency transmission lines, and the second high-frequency transmission line group 372 includes two high-frequency transmission lines. The high-frequency transmission lines electrically connecting the first driver 305 to the pads in the first pad group 3011 are located on the first surface of the circuit board, helping to reduce electrical loss in the high-frequency drive signals output by the first driver 305. The high-frequency transmission lines electrically connecting the second driver 307 to the pads in the first pad group 3011 are also located on the first surface of the circuit board, helping to reduce electrical loss in the high-frequency drive signals output by the second driver 307. The high-frequency transmission line electrically connecting LIA309a and the pads in the third pad group 3031 is located on the second surface of the circuit board, which helps reduce the electrical loss of the electrical signal output by the second light receiving component 540 from the third pad group 303 to the LIA309a.

[0223] Figure 50 illustrates a high-frequency signal transmission circuit structure for a second driver according to some embodiments of the present disclosure. As shown in Figure 50 , the second driver 307 includes a first side surface 3071, a second side surface 3072, a third side surface 3073, and a fourth side surface 3074. The first side surface 3071, the second side surface 3072, the third side surface 3073, and the fourth side surface 3074 are sequentially connected to form the side surfaces of the second driver. The first side surface 3071 is oriented obliquely toward the first pad group 3011, while the second side surface 3072 and the third side surface 3073 are oriented obliquely toward the gold finger 310. The second side surface 3072 is also oriented obliquely toward the DSP chip 306, and the fourth side surface 3074 is oriented obliquely toward the second pad group 3021. In this way, on the basis of adapting the first driver 305, the high-frequency signal transmission line between the first driver 305 and the first pad group 3011 is controlled within a shorter range, and the high-frequency signal transmission line between the first driver 305 and the second pad group 3021 can also be controlled within a shorter range, which is convenient for coordinating the length of the high-frequency signal transmission line between the first driver 305 and the first pad group 3011 and the second pad group 3021.

[0224] A first output pin 3075 is provided on the first side surface 3071, a first input pin 3076 is provided on the second side surface 3072, a second output pin 3077 is provided on the third side surface 3073, and a second input pin 3078 is provided on the fourth side surface 3074. The first output pin 3075 is electrically connected to the first pad group 3011 via a third high-frequency transmission line group 373, the first input pin 3076 is electrically connected to the gold finger 310 via a fourth high-frequency transmission line group 374, the second output pin 3077 is electrically connected to the gold finger 310 via a fifth high-frequency transmission line group 375, and the second input pin 3078 is electrically connected to the second pad group 3021 via a sixth high-frequency transmission line group 376. Exemplarily, the third high-frequency transmission line group 373 is located on the first surface of the circuit board 300, and the fourth high-frequency transmission line group 374, the fifth high-frequency transmission line group 375, and the sixth high-frequency transmission line group 376 are located on the same or different inner layers of the circuit board 300. The first output pin 3075 , the first input pin 3076 , the second output pin 3077 , and the second input pin 3078 each include at least one pin.

[0225] The third high-frequency transmission line group 373 is used to transmit a driving signal to the third laser assembly 451, the fourth high-frequency transmission line group 374 is used to transmit a third electrical signal to the second driver 307, the sixth high-frequency transmission line group 376 is used to transmit a fourth electrical signal to the second driver 307, and the fifth high-frequency transmission line group 375 is used to transmit the fourth electrical signal after limiting amplification.

[0226] FIG51 is a schematic diagram of a circuit according to some embodiments of the present disclosure. As shown in FIG51 , the first driver 305 includes 23 pins: pin 1 (GND1) is connected to ground; pin 2 (VDD1) is connected to the first power supply; pin 3 (VGC) is connected to the MCU 309b; pin 4 (VDD2) is connected to the second power supply; pin 6 (VPK) is connected to the MCU 309b; pin 7 (VC) is connected to the MCU 309b; pin 8 (VPRE) is connected to the MCU; pin 9 (VD2_CK) is connected to the second power supply; pin 10 (GND10) is connected to ground; pins 11 (RF_OUT) and 13 (VEML) are connected to the first laser assembly 451, respectively; and pins 22 (IN) and 23 (-IN) are connected to the DSP chip 306, respectively.

[0227] The first driver 305 receives the first electrical signal preprocessed by the DSP chip 306 through the 22nd pin IN and the 23rd pin -IN, and outputs a driving signal through the 11th pin RF_OUT and the 13th pin VEML according to the preprocessed first electrical signal to drive the first laser assembly 451 to emit a first wavelength optical signal.

[0228] During the operation of the first driver 305, variations in the magnitude of the first electrical signal input to the first driver 305 and the operating environment temperature of the first driver 305 can affect the parameters of the output drive signal of the first driver 305, causing instability in the output drive signal of the first driver 305 and fluctuations in parameters such as the extinction ratio of the first wavelength optical signal generated by the first laser assembly 451. In the disclosed embodiment, the voltage fed back from pin 6 VPK to the first driver 305 can reflect the amplitude variation of the output drive signal of the first driver 305. The MCU 309b monitors the amplitude variation of the output drive signal of the first driver 305 by monitoring the voltage fed back from pin 6 VPK. The MCU 309b then compensates for the amplitude variation of the output drive signal of the first driver 305 by adjusting the voltage applied to pin 3 VGC, thereby stabilizing the voltage fed back from pin 6 VPK at a target value. This stabilizes the amplitude of the output drive signal of the first driver 305 within a target range, such as stabilizing the amplitude of the drive signal to an optimal value.

[0229] The parasitic parameters of the first driver 305 are affected by the operating environment, causing the current drawn by the second power supply to drive the first driver 305 to vary, which in turn causes instability in the drive signal output by the first driver 305. In the disclosed embodiment, the MCU 309b monitors the current driving the first driver 305 and stabilizes the current driving the first driver 305 within a target range by adjusting the MCU 309b output to pin 7, VC.

[0230] In some embodiments, a sampling circuit 350 is provided between the second power supply and the fourth pin VDD2. The sampling circuit 350 is further connected to the MCU 309b, which is connected to the sampling circuit 350 so that the MCU 309b detects current changes caused by the second power supply driving the first driver 305 through the sampling circuit 350. Exemplarily, the sampling circuit 350 includes a sampling resistor 351, which is provided in series between the second power supply and the fourth pin VDD2. The MCU 309b detects current changes caused by the second power supply driving the first driver 305 by monitoring voltage changes across the sampling resistor 351. The sampling resistor 351 is a relatively small resistor, such as 0.5Ω.

[0231] In some embodiments, MCU309b obtains the current change of the second power supply driving the first driver 305, and MCU309b adjusts the voltage applied to the 7th pin VC. Through closed-loop control, the sampling voltage obtained by the sampling circuit 350 is maintained within the corresponding target range, thereby stabilizing the current of the second power supply driving the first driver 305 to work within the corresponding target range, ensuring that the first electrical signal output by the first driver 305 can provide a stable output to the first laser component 451 under different temperatures and different signal input conditions, thereby ensuring the stability of parameters such as the extinction ratio of the first laser component 451.

[0232] In some embodiments, sampling circuit 350 further includes a first shunt capacitor 352, one end of which is connected to pin 4 VDD2, and the other end of which is grounded. First shunt capacitor 352 is used to suppress low-frequency signals from interfering with pin 4 VDD2. Exemplarily, first shunt capacitor 352 is a relatively large capacitor, such as 1 μF. In some embodiments, first shunt capacitor 352 has a capacitance greater than 1 μF to ensure that first shunt capacitor 352 effectively suppresses low-frequency noise.

[0233] In some embodiments, a signal amplifying circuit 360 is further provided between the sampling circuit 350 and the MCU 309 b , and the signal amplifying circuit 360 is provided in series between the sampling circuit 350 and the MCU 309 b . The signal amplifying circuit 360 is used to amplify the sampling voltage input to the MCU 309 b . Exemplarily, the signal amplification circuit 360 includes an operational amplifier 361, a first resistor 362, a second resistor 363, a third resistor 364 and a fourth resistor 365; one end of the first resistor 362 is connected to one end of the sampling resistor 351, and the other end of the first resistor 362 is connected to the inverting end of the operational amplifier 361; one end of the second resistor 363 is connected between the other end of the first resistor 362 and the inverting end of the operational amplifier 361, and one end of the second resistor 363 is grounded; one end of the third resistor 364 is connected to the other end of the first resistor 362, and the other end of the third resistor 364 is connected to the non-inverting end of the operational amplifier 361; one end of the fourth resistor 365 is connected between the other end of the third resistor 364 and the non-inverting end of the operational amplifier 361, and the other end is connected to the output end of the operational amplifier 361; the output end of the operational amplifier 361 is connected to the MCU309b. In some embodiments, the resistance of the first resistor 362 is equal to the resistance of the third resistor 364 , and the resistance of the second resistor 363 is equal to the resistance of the fourth resistor 365 , so that the circuit parameters of the two input terminals of the operational amplifier 361 are consistent.

[0234] In some embodiments, the signal amplification circuit 360 further includes a second parallel capacitor 366 connected in parallel with the fourth resistor 365. The second parallel capacitor 366 is used to suppress low-frequency signal interference. Exemplarily, the capacitance of the second parallel capacitor 366 is 0.04-0.004 μF.

[0235] Figure 52 is a schematic diagram of a partial structure of a circuit board according to some embodiments of the present disclosure, and Figure 53 is a schematic diagram of a partial structure of a circuit board according to some examples of the present disclosure. Figures 52 and 53 illustrate a device layout on a circuit board. As shown in Figure 52, a first parallel capacitor 352 is provided on the first surface of the circuit board 300. The first parallel capacitor 352 is provided on the side of the first driver 305 and on the side of the fourth pin VDD2. The fourth pin VDD2 is electrically connected to the first parallel capacitor 352.

[0236] As shown in Figure 53, the second surface of the circuit board 300 is provided with a sampling resistor 351, a signal amplifying circuit 360, and the like. The sampling resistor 351, the signal amplifying circuit 360, and the like are located on the back side of the first driver 305. Pin 4 VDD2 is connected to the sampling resistor 351 via a via to minimize the connection distance between the sampling resistor 351 and the first driver 305. For example, the sampling resistor 351 is located on the side of the first driver 305 projected in the direction of the second surface of the circuit board 300; the signal amplifying circuit 360 is located on the side of the sampling resistor 351 close to the third driver 308; and the first resistor 362, the second resistor 363, the third resistor 364, and the fourth resistor 365 are located on the side of the signal amplifying circuit 360. In some embodiments, the first resistor 362 and the second resistor 363 are located between the third driver 308 and the signal amplifying circuit 360, and the third resistor 364 and the fourth resistor 365 are located between the signal amplifying circuit 360 and the side edge of the circuit board 300.

[0237] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Fiber optic adapter, one end of which is used to connect to an external optical fiber; an optical receiving component connected to the other end of the optical fiber adapter to receive the received optical signals of the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal through the optical fiber adapter; The light emitting component comprises a second cavity, one end of which is connected to the optical containing component; A laser component is arranged in the second cavity, and a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal generated by the laser component are input into the optical accommodation component through one end of the second cavity and transmitted to the external optical fiber through the optical fiber adapter; Wherein, the optical receiving component comprises: A first cavity, wherein a receiving inner cavity is formed inside, one end of which is connected to the optical fiber adapter, and the other end of which is connected to the second cavity; a second connecting hole, a third connecting hole and a fourth connecting hole are arranged on the second side of the first cavity, and the second connecting hole, the third connecting hole and the fourth connecting hole are connected to the receiving inner cavity respectively; An optical component, disposed in the accommodating inner cavity, for adjusting the transmission direction of the optical signal; a first light receiving component connected to the second connecting hole, wherein the first light receiving component is used to receive a fourth wavelength optical signal; a second light receiving component connected to the third connecting hole, wherein the second light receiving component is used to receive a fifth wavelength optical signal; A third light receiving component connected to the fourth connecting hole, wherein the second light receiving component is used to receive a sixth wavelength optical signal; A circuit board electrically connects the light emitting component, the first light receiving component, the second light receiving component and the third light receiving component.

2. The optical module according to claim 1, wherein: The optical assembly includes a first displacement prism, a reflector, a first filter, a first wavelength division multiplexer, a second displacement prism and a third displacement prism; The first reflection surface of the first displacement prism is located on the optical path of the optical fiber adapter, the first filter is located on the reflection optical path of the first reflection surface of the first displacement prism, the reflector is located on the reflection optical path of the first filter, the first wavelength division multiplexer is located on the reflection optical path of the reflector, the first emission surface of the second displacement prism is located on the first output optical path of the first wavelength division multiplexer, and the third displacement prism is located on the third output optical path of the first wavelength division multiplexer; The first light receiving component is located on the reflected light path of the second emitting surface of the second displacement prism; the second light receiving component is located on the second output light path of the first wavelength division multiplexer, and the third light receiving component is located on the reflected light path of the third displacement prism.

3. The optical module according to claim 2, wherein: The first cavity comprises a first shell and a first upper cover, and a receiving cavity is formed on the first shell; the first upper cover is connected to the first shell to form the receiving inner cavity; The first shell includes a first side plate, a second side plate and a third side plate, and the first side plate, the second side plate and the third side plate surround the edge of the accommodating cavity; a first connecting hole is provided on the first side plate, the second connecting hole, the third connecting hole and the fourth connecting hole are provided on the second side plate, and a fifth connecting hole is provided on the third side plate; The other end of the optical fiber adapter is connected to the first connection hole, and one end of the second cavity is connected to the fifth connection hole.

4. The optical module according to claim 3, wherein: The accommodating cavity includes a first accommodating cavity, a second accommodating cavity and a third accommodating cavity, the first accommodating cavity, the second accommodating cavity and the third accommodating cavity are connected to each other, and the second accommodating cavity and the third accommodating cavity are located on one side of the second side plate; the first displacement prism, the reflector, the first filter and the first wavelength division multiplexer are located in the first accommodating cavity, the second displacement prism is located in the second accommodating cavity, and the third displacement prism is located in the third accommodating cavity.

5. The optical module according to claim 4, wherein: The first shell further includes a fourth side plate, a fifth side plate and a sixth side plate, and a baffle is arranged in the accommodating cavity; the first side plate, the baffle, the third side plate and the fourth side plate surround to form the first accommodating cavity; the first side plate, the second side plate and the baffle surround to form the second accommodating cavity; the second side plate, the fifth side plate and the sixth side plate surround to form the third accommodating cavity; the second connecting hole passes through the second accommodating cavity, and the fourth connecting hole is connected to the third accommodating cavity; The first shell forms a notch on the outer sides of the third side plate and the fifth side plate, and one end of the light emitting component is located in the notch; a first supporting surface is arranged on the inner side wall of the third side plate, and the fifth connecting hole passes through the first supporting surface and the central axis of the fifth connecting hole is not perpendicular to the first supporting surface.

6. The optical module according to claim 1, wherein: The laser assembly comprises a first laser assembly, a second laser assembly and a third laser assembly, the first laser assembly generates a first wavelength optical signal, the second laser assembly generates a second wavelength optical signal, and the third laser assembly generates a third wavelength optical signal; the first laser assembly, the second laser assembly and the third laser assembly have different transmission rates, the first laser assembly comprises a first high-frequency transmission line, the first high-frequency signal line extends in the width direction of the second cavity, the third laser assembly comprises a second high-frequency transmission line, and the second high-frequency transmission line extends in the width direction of the second cavity; The light emitting component also includes a first circuit board, which is embedded and connected to the second cavity, so that one end of the first circuit board is located in the second cavity and the other end is located outside the second cavity; one end of the first circuit board is formed with multiple side faces, and the multiple side faces correspondingly surround the sides of the first laser component, the second laser component and the third laser component, and some side faces are located at the end of the first high-frequency transmission line, and some side faces are located at the end of the second high-frequency transmission line.

7. The optical module according to claim 6, wherein: The first circuit board includes a first circuit board body, a first elongated portion and a second elongated portion are disposed at one end of the first circuit board body, and a second interval is disposed between the first elongated portion and the second elongated portion; A first side surface is formed on the first extension portion at one side of the second interval, a second side surface is formed at the bottom of the second interval, a third side surface is formed on the second extension portion at one side of the second interval, a fourth side surface is formed on the top of the second extension portion, a fifth side surface is formed on the other side of the second extension portion away from the second interval, and a sixth side surface is also formed at one end of the first circuit board, and the sixth side surface is connected to the fifth side surface.

8. The optical module according to claim 7, wherein: The three side surfaces of the first laser component are correspondingly close to the first side surface, the second side surface and the third side surface, and the first high-frequency transmission line extends in the direction of the first side surface; a first soldering pad is arranged on the top surface of the edge of the first side surface, and the first laser component includes a first laser chip, and one end of the first high-frequency transmission line is connected to the first laser chip by wire bonding, and the other end of the first high-frequency transmission line is connected to the first soldering pad by wire bonding.

9. The optical module according to claim 7, wherein: The two side surfaces of the third laser assembly are close to the fifth side surface and the sixth side surface, and the second high-frequency transmission line extends in the direction of the fifth side surface; a second pad is arranged on the top surface of the edge of the fifth side surface, and the third laser assembly includes a third laser chip, one end of the second high-frequency transmission line is connected to the third laser chip by wire bonding, and the other end of the second high-frequency transmission line is connected to the second pad by wire bonding.

10. The optical module according to claim 7, wherein: One side surface of the second laser assembly is close to the fourth side surface; the transmission rate of the first laser assembly is greater than the transmission rate of the third laser assembly, and the transmission rate of the third laser assembly is greater than the transmission rate of the second laser assembly; The light emitting component also includes a TEC and a support plate, wherein the TEC and the support plate are arranged in the second cavity, and the support plate is located on the top of the TEC; the support plate includes a support plate body, a first spacer is arranged on one side of the support plate body, a first boss is arranged on one side of the first spacer, and a second boss is arranged on the other side of the first spacer; the first laser assembly is arranged on the first boss, the second laser assembly is arranged on the support plate body and located at the edge of the first spacer, and the third laser assembly is arranged on the second boss; the side edge of the first boss is cooperatively connected to the second spacer, and the second extension portion is cooperatively connected to the first spacer.

11. The optical module according to claim 10, wherein: The light emitting component further comprises a collimating lens and a second wavelength division multiplexer, and the collimating lens and the second wavelength division multiplexer are arranged in the second cavity; The collimating lens includes a first collimating lens, a second collimating lens and a third collimating lens, the first collimating lens is located between the first laser assembly and the second wavelength division multiplexer, the second collimating lens is arranged between the second laser assembly and the second wavelength division multiplexer, and the third collimating lens is arranged between the third laser assembly and the second wavelength division multiplexer.

12. The optical module according to claim 1, wherein: The surface of the circuit board is provided with a first electrical connection area, a second electrical connection area and a third electrical connection area; the optical module further comprises: a first flexible circuit board, one end of which is electrically connected to the light emitting component, and the other end of which is electrically connected to the first electrical connection area; A second flexible circuit board, one end of which is electrically connected to the first light receiving component and the third electrical connection component, the middle of which is located at the top of the first cavity, and the other end of which is electrically connected to the second electrical connection area. The third flexible circuit board has one end electrically connected to the second light receiving component, a middle portion thereof is located at the bottom of the first cavity, and the other end thereof is electrically connected to the third electrical connection area.

13. The optical module according to claim 12, wherein: The first electrical connection area is arranged on the first surface of the circuit board, and a first driver and a DSP chip are also arranged on the first surface. The first electrical connection area is located on a side of the first driver close to the light emitting component, and the first electrical connection area includes a first solder pad group. The DSP chip is located on a side of the first driver away from the light emitting component; the second laser component is electrically connected to the first driver through the first solder pad group, and the first driver is electrically connected to the DSP chip. The first driver drives the first laser component to generate a first wavelength optical signal according to the electrical signal received from the DSP chip.

14. The optical module according to claim 13, wherein: The first surface is also provided with a first high-frequency transmission line group, a second high-frequency transmission line group and a gold finger; one end of the first high-frequency transmission line group is electrically connected to the DSP chip, and the other end is electrically connected to the gold finger; one end of the second high-frequency transmission line group is electrically connected to the first pad group to electrically connect to the first laser component through the first pad group; the other end of the second high-frequency transmission line group is electrically connected to the DSP chip.

15. The optical module according to claim 13, wherein: The second electrical connection area is arranged on the first surface, the first surface is also provided with a second driver, the second electrical connection area includes a second pad group, the second driver includes a first side surface, a second side surface, a third side surface and a fourth side surface connected in sequence; a gold finger is arranged on the end surface of the circuit board; The first side surface is obliquely oriented toward the first pad group, the second side surface is obliquely oriented toward the DSP chip and the gold finger, the third side surface is obliquely oriented toward the gold finger, and the fourth side surface is obliquely oriented toward the second pad group; a first output pin is arranged on the first side surface, a first input pin is arranged on the second side surface, a second output pin is arranged on the third side surface, and a second input pin is arranged on the fourth side surface; The first output pin is electrically connected to the first pad group through the third high-frequency transmission line group, and the first input pin is electrically connected to the gold finger through the fourth high-frequency transmission line group, so that the second driver is electrically connected to the third laser component through the pad in the first pad group, and drives the third laser component to emit a third wavelength optical signal according to the third electrical signal transmitted through the gold finger; the second output pin is electrically connected to the gold finger through the fifth high-frequency transmission line group, and the second input pin is electrically connected to the second pad group through the sixth high-frequency transmission line group, so that the second driver is electrically connected to the first light receiving component through the pad in the second pad group, and amplifies the fourth electrical signal output by the first light receiving component receiving the fourth wavelength optical signal and transmits it to the gold finger.

16. The optical module according to claim 1, wherein: The first light receiving component, the second light receiving component and the third light receiving component are respectively coaxially packaged light receiving components, and the receiving light axes of the first light receiving component, the second light receiving component and the third light receiving component are parallel to each other.

17. The optical module according to claim 3, wherein: The optical component also includes a second filter, which is located on the second output optical path of the first wavelength division multiplexer; the optical component also includes a lens component, which includes a lens and a lens holder, the lens is arranged on the lens holder, and the lens holder is embedded in the first connecting hole.

18. The optical module according to claim 3, wherein: A first supporting surface is arranged on the inner side wall of the third side plate, the fifth connecting hole passes through the first supporting surface, and the central axis of the fifth connecting hole is not perpendicular to the first supporting surface.

19. The optical module according to claim 4, wherein: A first supporting surface is arranged on the inner side wall of the third side plate, the fifth connecting hole passes through the first supporting surface, and the central axis of the fifth connecting hole is not perpendicular to the first supporting surface.

20. The optical module according to claim 3, wherein: A first groove is arranged at the bottom of the first accommodating cavity, a reflector bracket is arranged in the first groove, and the reflector bracket supports and connects the reflector; the reflector bracket includes a bracket base and a bracket support part, the bracket support part is arranged on the top of the bracket base, and the bottom surface of the bracket base is connected to the first groove.

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