Wafer multi-section cutting equipment and grinding fluid cooling process thereof
By using multiple abrasive spray heads in the multi-stage wafer cutting equipment, uniform cooling and lubrication of the cutting knife and cutting area is achieved, solving the problems of thermal damage and uneven cooling effects in traditional equipment, and improving the cutting quality and equipment life.
Patent Information
- Application Number
- CN202510127156.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-31
- Publication Date
- 2025-04-08
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Traditional wafer cutting equipment is prone to thermal damage during the cutting process, uneven cooling effect, and cannot effectively remove tiny fragments, resulting in a decrease in wafer quality and equipment life.
A multi-stage chip cutting equipment is designed, using multiple abrasive liquid spray heads to uniformly distribute them at the bottom of the spray tube, and uniform cooling and lubrication of the cutting knife and the cutting area are achieved through the abrasive liquid cooling process.
It realizes efficient and accurate wafer cutting, reduces the risk of thermal damage, improves cutting quality and yield, extends the service life of the cutting knife, and reduces maintenance costs.
Smart Images
Figure CN119773080A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of wafer processing, in particular to a wafer multi-segment cutting device and a grinding liquid cooling process thereof. Background Art
[0002] With the rapid development of the semiconductor industry, the processing and manufacturing technology of wafers is also constantly innovating and improving. In the processing of wafers, cutting is a crucial link, which directly determines the quality and yield of wafers. Traditional wafer cutting equipment mostly uses a single cutting method, which is easy to generate high heat during the cutting process, causing thermal damage to the edge of the wafer, affecting the performance and yield of the wafer. In addition, the tiny fragments generated during the cutting process will also affect the surface quality of the wafer and the service life of the equipment.
[0003] Some existing wafer cutting equipment uses coolant cooling technology, but the following shortcomings are common: (1) Uneven cooling effect: A single cooling nozzle cannot evenly cover the entire cutting area, resulting in excessively high local temperatures, affecting the cutting effect. (2) Thermal damage problem: During high-speed cutting, thermal damage is easily caused to the edge of the wafer due to insufficient coolant supply or untimely spraying. (3) Incomplete debris removal: Traditional coolant spraying methods cannot completely remove the tiny debris generated during the cutting process, affecting the surface quality of the wafer. (4) Severe wear of the cutting blade: The lack of effective lubrication measures causes severe wear of the cutting blade during high-speed rotary cutting, reducing the service life of the equipment. Summary of the invention
[0004] The present invention provides a wafer multi-segment cutting device that can achieve efficient and precise cutting and has good cooling and lubrication effects. It can not only improve the cutting quality and yield rate of wafers, but also effectively extend the service life of the cutting knife, reduce maintenance costs, and improve production efficiency.
[0005] The technical solution adopted by the present invention is: a multi-segment wafer cutting device, comprising a frame and a processing platform arranged on the top of the frame and fixedly connected thereto, a wafer cutting motor is installed at the lower part of the frame, an output end of the wafer cutting motor is provided with a first transmission wheel, two bearing seats are installed at the bottom of the processing platform and a rotating shaft is connected through the two bearing seats, one end of the rotating shaft is fixedly connected to a second transmission wheel, the first transmission wheel and the second transmission wheel are connected through a transmission belt, a plurality of wafer cutting knives are fixedly sleeved on the rotating shaft, a grinding liquid box and a pump body are installed at the lower part of the frame on one side of the wafer cutting motor, a fixing frame is fixedly connected to the top of the processing platform, a suction end of the pump body is provided with a suction pipe extending to the inside of the grinding liquid box, a discharge end of the pump body is provided with an infusion pipe passing through the fixing frame, one end of the infusion pipe is connected to a spray pipe, and a plurality of grinding liquid spray heads are provided at the bottom of the spray pipe.
[0006] As a further improvement of the present invention, four support blocks are fixedly connected to the bottom of the rack and the four support blocks are distributed at the four corners of the bottom of the rack in a rectangular shape.
[0007] As a further improvement of the present invention, a plurality of the wafer cutting knives pass through the processing platform, and a plurality of openings for the wafer cutting knives to pass through are provided on the processing platform.
[0008] As a further improvement of the present invention, both ends of the spray pipe are fixedly connected to the fixing frame through a connecting rod.
[0009] As a further improvement of the present invention, a plurality of the grinding liquid spray heads are evenly distributed at the bottom of the spray pipe and the grinding liquid spray heads are located obliquely above the wafer cutting knife.
[0010] According to the above-mentioned grinding liquid cooling process of the wafer multi-segment cutting equipment, the following steps are included:
[0011] S1, pre-circulation preparation: First, check whether the grinding liquid in the grinding liquid box is sufficient, and whether the pump body, suction pipe, infusion pipe, and spray pipe are unobstructed. Start the pump body and let the grinding liquid circulate in the system first to prepare for formal cutting;
[0012] S2, cooling before cutting: before starting to cut the wafer, spray an appropriate amount of grinding liquid evenly on the upper oblique position of the wafer cutting knife that is about to contact the wafer through the spray pipe, so as to lower the temperature of the cutting area in advance, reduce thermal damage, and increase the contact area between the cutting surface and the grinding liquid, so as to improve the cooling effect and grinding efficiency in the subsequent cutting process;
[0013] S3, start cutting: when all preparations of the equipment are completed, start the wafer cutting motor, drive the rotating shaft to rotate through the transmission belt between the first transmission wheel and the second transmission wheel, thereby driving multiple wafer cutting knives to perform rotary cutting;
[0014] S4, continuous cooling and lubrication: As the cutting progresses, the pump body continuously extracts the grinding liquid from the grinding liquid box and transports it to the spray pipe through the infusion pipe, and finally sprays it out from multiple grinding liquid spray heads, forming a uniform coverage of the wafer cutting knife and the cutting area, playing a cooling role, effectively removing tiny debris in the cutting process, and lubricating the wafer cutting knife to reduce its wear and extend its service life;
[0015] S5, cooling and cleaning after cutting: After completing the cutting of the wafer, temporarily stop the wafer cutting motor, but keep the pump body turned on, and continue to spray the grinding fluid to the cutting area until the wafer cutting knife stops rotating, clean the residual wafer material on the cutting knife surface, and further reduce the temperature of the cutting area.
[0016] The beneficial effects of the present invention are as follows: (1) Efficient and precise cutting: The present invention can achieve efficient and precise cutting of wafers through the coordinated operation of multiple wafer cutting knives. The cutting knives can evenly distribute the cutting force during the cutting process, reduce cutting errors, and improve the cutting quality and yield rate of the wafers. Especially in multi-stage cutting tasks, the equipment can significantly improve the cutting efficiency and is suitable for the needs of large-scale production lines.
[0017] (2) Uniform cooling effect: The present invention adopts a design in which multiple grinding liquid spray heads are evenly distributed at the bottom of the spray pipe, ensuring that the grinding liquid can be evenly sprayed onto the cutting knife and the cutting area, which can effectively reduce the temperature of the cutting area and reduce thermal damage. It can also increase the contact area between the cutting surface and the grinding liquid, thereby improving the cooling effect and grinding efficiency. Compared with the traditional single cooling nozzle, the cooling effect of the present invention is more uniform and stable, further improving the cutting quality.
[0018] (3) Extending the service life of the cutting blade: The grinding liquid cooling process of the present invention not only has a cooling function, but also has a lubricating effect. During the cutting process, the grinding liquid will continue to spray on the cutting blade, reducing the friction between the cutting blade and the wafer material, thereby reducing the wear of the cutting blade. It can significantly extend the service life of the cutting blade, reduce the maintenance cost of the equipment, and improve production efficiency. At the same time, continuing to spray the grinding liquid after cutting can thoroughly clean the cutting blade and prevent corrosion and wear caused by residual materials. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the overall structure of the wafer multi-stage cutting equipment and the grinding liquid cooling process thereof of the present invention;
[0020] Figure 2 The invention relates to a wafer multi-segment cutting device and a grinding liquid cooling process thereof. Figure 1 Schematic diagram from another perspective;
[0021] Figure 3 The schematic diagram of the local structure of the wafer multi-segment cutting equipment and the grinding liquid cooling process of the present invention is shown in FIG. Figure 1 ;
[0022] Figure 4 The schematic diagram of the local structure of the wafer multi-segment cutting equipment and the grinding liquid cooling process of the present invention is shown in FIG. Figure 2 .
[0023] As shown in the figure: 1. Frame; 2. Processing platform; 3. Wafer cutting motor; 4. First transmission wheel; 5. Bearing seat; 6. Rotating shaft; 7. Second transmission wheel; 8. Transmission belt; 9. Wafer cutting knife; 10. Grinding liquid box; 11. Pump body; 12. Fixed frame; 13. Suction pipe; 14. Infusion pipe; 15. Spray pipe; 16. Grinding liquid spray head; 17. Support block; 18. Connecting rod. DETAILED DESCRIPTION
[0024] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to their structure and are relative concepts. Therefore, they may change accordingly according to their different locations and different usage states; therefore, these or other directional terms should not be interpreted as restrictive terms.
[0025] The singular forms "a", "said" and "the" used in this specification are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0026] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and implementation methods. It should be understood that the implementation methods described herein are only used to explain this application and are not used to limit this application.
[0027] The present invention provides the following Figure 1-4 The wafer multi-segment cutting equipment shown includes a frame 1 and a processing platform 2 arranged on the top of the frame 1 and fixedly connected thereto, a wafer cutting motor 3 is installed at the lower part of the frame 1, and a first transmission wheel 4 is provided at the output end of the wafer cutting motor 3, two bearing seats 5 are installed at the bottom of the processing platform 2 and a rotating shaft 6 is connected through the two bearing seats 5, one end of the rotating shaft 6 is fixedly connected to a second transmission wheel 7, the first transmission wheel 4 and the second transmission wheel 7 are connected through a transmission belt 8, and a plurality of wafer cutting knives 9 are fixedly sleeved on the rotating shaft 6, a grinding liquid box 10 and a pump body 11 are installed at the lower part of the frame 1 on one side of the wafer cutting motor 3, a fixing frame 12 is fixedly connected to the top of the processing platform 2, a suction end of the pump body 11 is provided with a suction pipe 13 extending to the inside of the grinding liquid box 10, and a discharge end of the pump body 11 is provided with a liquid infusion pipe 14 passing through the fixing frame 12, one end of the liquid infusion pipe 14 is connected to a spray pipe 15, and a plurality of grinding liquid spray heads 16 are provided at the bottom of the spray pipe 15.
[0028] like Figure 1-4 As shown, in the present invention, four support blocks 17 are fixedly connected to the bottom of the frame 1 and the four support blocks 17 are distributed in a rectangular shape at the four corners of the bottom of the frame 1. A plurality of wafer cutting knives 9 pass through the processing platform 2. The processing platform 2 is provided with a plurality of openings for the wafer cutting knives 9 to pass through. Both ends of the spray pipe 15 are fixedly connected to the fixed frame 12 through a connecting rod 18. A plurality of grinding liquid spray heads 16 are evenly distributed at the bottom of the spray pipe 15 and the grinding liquid spray heads 16 are located obliquely above the wafer cutting knives 9.
[0029] Example:
[0030] This embodiment utilizes the above-mentioned grinding liquid cooling process of the wafer multi-segment cutting equipment, including the following steps:
[0031] S1, pre-circulation preparation: First, check whether the grinding liquid in the grinding liquid box 10 is sufficient, and whether the pump body 11, the suction pipe 13, the infusion pipe 14, and the spray pipe 15 are unobstructed, start the pump body 11, and let the grinding liquid circulate in the system first to prepare for formal cutting;
[0032] S2, cooling before cutting: before starting to cut the wafer, a proper amount of grinding liquid is evenly sprayed on the upper oblique position of the wafer cutting blade 9 that is about to contact the wafer through the spray pipe 15, so as to lower the temperature of the cutting area in advance, reduce thermal damage, and increase the contact area between the cutting surface and the grinding liquid, so as to improve the cooling effect and grinding efficiency in the subsequent cutting process;
[0033] S3, start cutting: when all preparations of the equipment are completed, start the wafer cutting motor 3, drive the rotating shaft 6 to rotate through the transmission belt 8 between the first transmission wheel 4 and the second transmission wheel 7, thereby driving multiple wafer cutting knives 9 to perform rotary cutting;
[0034] S4, continuous cooling and lubrication: As the cutting proceeds, the pump body 11 will continuously extract the grinding liquid from the grinding liquid box 10 and transport it to the spray pipe 15 through the infusion pipe 14, and finally spray it out from the multiple grinding liquid spray heads 16, so as to form a uniform coverage of the wafer cutting blade 9 and the cutting area, play a cooling role, effectively remove the tiny debris in the cutting process, and lubricate the wafer cutting blade 9 to reduce its wear and extend its service life;
[0035] S5, cooling and cleaning after cutting: After completing the cutting of the wafer, temporarily stop the wafer cutting motor 3, but keep the pump body 11 in the open state, and continue to spray the grinding liquid to the cutting area until the wafer cutting knife 9 stops rotating, clean the wafer material remaining on the cutting knife surface, and further reduce the temperature of the cutting area.
[0036] It can be seen from the above embodiments that in the S1 pre-circulation preparation stage, it is ensured that the grinding fluid is sufficient and the circulation system is unobstructed, which lays a good foundation for formal cutting. The S2 pre-cutting cooling step effectively reduces the initial temperature of the cutting area by pre-spraying the grinding fluid, reduces the risk of thermal damage, and increases the contact area between the grinding fluid and the cutting surface, which provides a guarantee for the cooling and grinding efficiency in the subsequent cutting process. The S3 start-up cutting stage realizes the coordinated operation of multiple wafer cutting knives through a precise transmission system, ensuring the accuracy and efficiency of cutting. The S4 continuous cooling and lubrication step is the core of the entire process. By continuously spraying the grinding fluid, not only the uniform cooling of the cutting knife and the cutting area is achieved, but also the tiny fragments generated during the cutting process are effectively removed, and the cutting knife is lubricated, which significantly reduces the wear of the cutting knife and prolongs its service life. Finally, in the S5 post-cutting cooling and cleaning stage, by continuing to spray the grinding fluid, the residual material on the cutting knife surface is thoroughly cleaned, the temperature of the cutting area is further reduced, and preparations are made for the next cutting.
[0037] In summary, the wafer multi-stage cutting equipment and the grinding liquid cooling process thereof of the present invention realize efficient cooling, precise cutting and long life of the cutting knife during the wafer cutting process through innovative cooling process and structural design.
[0038] The above implementation modes are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the implementation modes of the present invention.
Claims
1. A wafer multi-segment cutting device, comprising a frame (1) and a processing platform (2) arranged on the top of the frame (1) and fixedly connected thereto, characterized in that: A wafer cutting motor (3) is installed at the lower part of the frame (1); a first transmission wheel (4) is provided at the output end of the wafer cutting motor (3); two bearing seats (5) are installed at the bottom of the processing platform (2); a rotating shaft (6) is connected via the two bearing seats (5); a second transmission wheel (7) is fixedly connected to one end of the rotating shaft (6); the first transmission wheel (4) and the second transmission wheel (7) are connected via a transmission belt (8); a plurality of wafer cutting knives (9) are fixedly sleeved on the rotating shaft (6); and the frame (1) ) is located at the lower part of the wafer cutting motor (3) and is equipped with a grinding liquid box (10) and a pump body (11); the top of the processing platform (2) is fixedly connected to a fixing frame (12); the suction end of the pump body (11) is provided with a suction pipe (13) extending to the inside of the grinding liquid box (10); the discharge end of the pump body (11) is provided with an infusion pipe (14) passing through the fixing frame (12); one end of the infusion pipe (14) is connected to a spray pipe (15); and a plurality of grinding liquid spray heads (16) are provided at the bottom of the spray pipe (15).
2. The wafer multi-segment cutting device according to claim 1, characterized in that: Four support blocks (17) are fixedly connected to the bottom of the frame (1), and the four support blocks (17) are distributed in a rectangular shape at the four corners of the bottom of the frame (1).
3. The wafer multi-segment cutting device according to claim 1, characterized in that: The plurality of wafer cutting knives (9) pass through the processing platform (2), and the processing platform (2) is provided with a plurality of openings for the wafer cutting knives (9) to pass through.
4. The wafer multi-segment cutting device according to claim 1, characterized in that: Both ends of the spray pipe (15) are fixedly connected to the fixing frame (12) via connecting rods (18).
5. The wafer multi-segment cutting device according to claim 1, characterized in that: The plurality of grinding liquid spray heads (16) are evenly distributed at the bottom of the spray pipe (15), and the grinding liquid spray heads (16) are located obliquely above the wafer cutting knife (9).
6. The grinding liquid cooling process of the wafer multi-segment cutting equipment according to claims 1-5, characterized in that: The following steps are involved: S1, pre-circulation preparation: First, check whether the grinding liquid in the grinding liquid box (10) is sufficient, and whether the pump body (11), the suction pipe (13), the infusion pipe (14), and the spray pipe (15) are unobstructed, start the pump body (11), and let the grinding liquid circulate in the system in advance to prepare for formal cutting; S2, cooling before cutting: before starting to cut the wafer, a proper amount of grinding liquid is evenly sprayed on the upper oblique position of the wafer cutting knife (9) that is about to contact the wafer through the spray pipe (15), so as to lower the temperature of the cutting area in advance, reduce thermal damage, and increase the contact area between the cutting surface and the grinding liquid, thereby improving the cooling effect and grinding efficiency in the subsequent cutting process; S3, start cutting: when all preparations of the equipment are completed, start the wafer cutting motor (3), drive the rotating shaft (6) to rotate through the transmission belt (8) between the first transmission wheel (4) and the second transmission wheel (7), thereby driving the multiple wafer cutting knives (9) to perform rotational cutting; S4, continuous cooling and lubrication: as the cutting proceeds, the pump body (11) will continuously extract the grinding liquid from the grinding liquid box (10) and transport it to the spray pipe (15) through the liquid delivery pipe (14), and finally spray it out from multiple grinding liquid spray heads (16), so as to form a uniform coverage of the wafer cutting knife (9) and the cutting area, play a cooling role, effectively remove tiny debris in the cutting process, and lubricate the wafer cutting knife (9), reduce its wear and tear, and extend its service life; S5, cooling and cleaning after cutting: After the wafer is cut, the wafer cutting motor (3) is temporarily stopped, but the pump body (11) is still kept on, and the grinding liquid continues to be sprayed on the cutting area until the wafer cutting knife (9) stops rotating, so as to clean the wafer material remaining on the cutting knife surface and further reduce the temperature of the cutting area.