Sucking disc structure for moving and taking large-size IC (integrated circuit) carrier plate

Abstract

The invention discloses a suction cup structure used for moving and taking a large-size IC carrier plate, and relates to the technical field of jigs, the suction cup structure comprises the IC carrier plate and a side suction cup structure, the side suction cup structure is installed on a frame, a middle suction cup structure is further installed on the frame, the IC carrier plate is divided into a center suction area and an edge suction area, and the side suction cup structure sucks the edge suction area. The middle suction cup structure adsorbs the center adsorption area, the suction nozzle is composed of a head part and a body part, a plurality of gas flow channels are formed in the body part, an auxiliary supporting structure is installed on the frame and comprises a rotating air cylinder and a rotating hook claw, a mounting plate is connected to the second inner frame body, the rotating air cylinder is installed on the mounting plate, and the rotating hook claw is installed on the rotating air cylinder. The output end of the rotating air cylinder is connected with a shaft rod, a plurality of connecting plates are evenly installed on the outer side of the second inner frame body at intervals, the shaft rod penetrates through the connecting plates and is rotationally connected with the connecting plates and the second inner frame body, a plurality of rotating hook claws are connected to the shaft rod in a clamped mode, and the rotating air cylinder drives the rotating hook claws to enable the rotating hook claws to be tightly attached to the surface of the IC carrier plate.

Description

Technical Field

[0001] The invention belongs to the technical field of jigs and tools, and in particular relates to a suction cup structure for removing a large-size IC carrier. Background Art

[0002] Chip fixtures play a vital role in chip R&D and production. Fixtures can significantly improve the efficiency and automation of testing, shorten the test cycle and improve test accuracy. Using fixtures for testing can avoid errors during manual testing and ensure the stability and accuracy of testing; fixtures can improve production efficiency, especially in mass production. Using fixtures for production can achieve fast, accurate, stable and continuous production and processing processes. Fixtures can make the processing process more standardized and standardized, thereby improving production efficiency while ensuring chip quality; fixtures help to ensure the quality of IC substrates, standardize and standardize production processes, accurately control the position of devices or chips, and avoid process problems caused by position deviations. In addition, fixtures can reduce the operator's direct contact with the chip, avoid problems such as human contamination and damage; chip test fixtures can save time and cost. It can test chips quickly and accurately, reducing the time and money required for chip testing; fixtures can improve test accuracy, reduce errors, and ensure the quality of IC substrates. By accurately controlling the position of the chip and the test environment, the fixture can effectively detect defects in the chip, improve the reliability and quality of the chip, and thus ensure the safety and reliability of the IC substrate.

[0003] For example, a Chinese patent application document with publication number CN102263050B discloses a device for moving semiconductor grains on a graphite boat, comprising: a handle with a cavity therein, a large cover plate, at least one small cover plate, an upper fixed plate and a lower fixed plate; an air nozzle connected to the cavity is provided at one end of the handle, and at least one first air vent connected to the cavity is provided on the lower surface of the handle; a first groove is provided on the small cover plate, and a second air vent corresponding to the first air vent is provided between the bottom of the first groove and the upper surface of the small cover plate, and the second air vent is connected to the first air vent through a gas connecting pipe; the large cover plate is provided with a second groove; the upper surface of the upper fixed plate is provided with a third groove and a limiting boss; the upper surface of the upper fixed plate is in contact with the lower surface of the large cover plate so that a second cavity is formed by the second groove and the third groove.

[0004] For another example, a Chinese patent application document with publication number CN103617961B discloses a suction cup mechanism for transferring semiconductor chips, including a handle and a cover plate, a bottom plate installed on the lower surface of the cover plate; a movable through-hole plug composed of an upper plug body and a lower plug body is installed in cooperation with the gap of the air leakage hole, the width of the upper air guide rib is greater than the width of the lower air guide rib, the diameters of the lower end surface and the upper end surface are greater than the diameter of the air leakage hole, and the distance between the upper end surface and the lower end surface of the movable through-hole plug is greater than the thickness of the air leakage hole, thereby ensuring that the movable through-hole plug can move up and down along the air leakage hole; when the lower plug body of the movable through-hole plug closes the air leakage hole, airflow flows in from the suction nozzle, and when the upper plug body of the movable through-hole plug closes the air leakage hole, airflow flows in from the air leakage hole.

[0005] The existing chip suction cup mechanism uses multiple suction cups to adsorb the chip, and the adsorption of the chip depends only on the suction cup. When one of the suction cups is ineffective (leaking), the adsorption effect of the chip will be affected. In the transplanting process, if the adsorption force of the suction cup is insufficient, the chip transplanting will be unstable, which seriously affects the quality of the chip processing technology. Summary of the invention

[0006] In view of the above problems in the prior art, an object of the present invention is to provide a suction cup structure for removing a large-sized IC carrier to achieve stable adsorption of the suction cup.

[0007] The present invention provides the following technical solutions:

[0008] A suction cup structure for removing a large-size IC carrier comprises an IC carrier and a side suction cup structure, wherein the side suction cup structure is mounted on a frame, and the side suction cup structures are symmetrically arranged at both ends of the frame, and an intermediate suction cup structure is also mounted on the frame, and the IC carrier is divided into a central suction area and an edge suction area, wherein the side suction cup structure adsorbs the edge suction area, and the intermediate suction cup structure adsorbs the central suction area, and the side suction cup structure and the intermediate suction cup structure both comprise a suction nozzle, wherein the suction nozzle consists of a head and a body, and a plurality of gas flow channels are provided in the body.

[0009] As a further technical solution, the body includes a middle part and a tail part, a movable part is slidably connected between the middle part and the tail part, the head part is threadedly connected to the bottom end of the middle part, an intermediate flow channel is opened on the head part, the intermediate flow channel runs through the middle part, the movable part and the tail part, and the intermediate flow channel and the suction nozzle are coaxial.

[0010] As a further technical solution, an upper flow channel is opened in the tail part, a lower flow channel is opened in the middle part, and a pipe is connected between the lower flow channel and the head part, one end of the pipe extends into the head part and is connected with the middle flow channel, and a valve is installed on the pipe.

[0011] As a further technical solution, grooves are provided in the tail portion and the middle portion, the grooves are used to accommodate the movable portion, and rubber pads are bonded to the bottom end of the tail portion and the top end of the middle portion.

[0012] As a further technical solution, the frame includes two vertical frames and two horizontal frames, and an intermediate frame is installed in the frame. The intermediate frame divides the frame into two symmetrical areas. A mounting frame is symmetrically installed on one side of the intermediate frame, and multiple suction nozzles are installed in the mounting frame. The suction nozzles installed on the intermediate frame adsorb the intermediate adsorption area.

[0013] As a further technical solution, an inner frame body 2 is installed between the middle frame body and the horizontal frame body, a plurality of mounting frames are installed on the outer side of the inner frame body 2, a plurality of suction nozzles are installed on the mounting frames, and the suction nozzles installed on the inner frame body 2 adsorb the edge adsorption area.

[0014] As a further technical solution, an inner frame body 1 is installed between the middle frame body and the inner frame body 2, and a side shaft body is symmetrically installed on the inner frame body 1, and a bevel gear is sleeved on one end of the side shaft body, and a top connecting plate is installed on one side of the frame, and a robot flange is installed on the top connecting plate, and a servo motor is installed on one side of one of the vertical frames, and the output end of the servo motor is connected to the intermediate shaft body, and a reducer and a coupling are installed on the intermediate shaft body, and the reducer and the servo motor are connected, and the reducer and the coupling are respectively located on both sides of the vertical frame, and a bevel gear is sleeved on the intermediate shaft body, and the bevel gear on the intermediate shaft body is meshed with the bevel gear on the side shaft body, and the bevel gear is located in the first gear box, and a sliding sleeve is installed between the transverse frame body, the inner frame body 2 and the inner frame body 1, and one end of the sliding sleeve is connected to the side shaft body, and the transverse frame body and the inner frame body 1 are respectively rotatably connected to the sliding sleeve, and a nut is threadedly connected to the sliding sleeve, and the nut is fixedly connected to the inner frame body 2.

[0015] As a further technical solution, a second gear box is installed on the intermediate shaft, and the structure of the second gear box is the same as that of the first gear box.

[0016] As a further technical solution, an auxiliary supporting structure is installed on the frame, the auxiliary supporting structure includes a rotating cylinder and a rotating hook, the inner frame body 2 is connected to a mounting plate, the rotating cylinder is installed on the mounting plate, the output end of the rotating cylinder is connected to a shaft rod, a plurality of connecting plates are evenly spaced apart on the outer side of the inner frame body 2, the shaft rod passes through the connecting plate and is rotatably connected to the connecting plate and the inner frame body 2, a plurality of rotating hooks are clamped on the shaft rod, and the rotating cylinder drives the rotating hook to make the rotating hook close to the surface of the IC carrier board.

[0017] As a further technical solution, a groove is provided on the transverse frame, and the groove is located directly above the rotating hook.

[0018] The beneficial effects of the present invention are:

[0019] The body part includes a middle part and a tail part, the middle part and the tail part are slidably connected to the movable part, and the head part is threadedly connected to the middle part, so that the nozzle can be detachably connected and replaced quickly;

[0020] A middle flow channel is provided on the head, and the middle flow channel runs through the middle part, the movable part and the tail part. An upper flow channel is provided in the tail part, and a lower flow channel is provided in the middle part. By providing another gas flow channel, a double channel is realized. When the middle flow channel at the body part leaks, the gas flow channel can be replaced in time without replacing the entire nozzle.

[0021] The frame is equipped with a side suction cup structure and a middle suction cup structure, which adsorbs the middle part of the suction cup to prevent the middle part of the suction cup from collapsing.

[0022] The inner frame body 2 is movably mounted on the frame, and the relative or opposite movement of the two inner frame bodies 2 is achieved through the meshing of bevel gears and the cooperation of the sliding sleeve nut, thereby adjusting the size range of the suction cup that can be adsorbed;

[0023] An auxiliary supporting structure is installed on the frame to further ensure the adsorption force of the suction cup. The rotary cylinder drives the rotating hook to rotate so that the rotating hook is close to the surface of the IC carrier. There is a certain friction between the rotating hook and the surface of the IC carrier, so that the suction cup structure used for removing large-size IC carriers is suitable for a variety of application scenarios, namely horizontal adsorption or vertical adsorption. During vertical adsorption, the auxiliary supporting structure can prevent the IC carrier from moving downward after adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0025] Figure 1 It is a schematic diagram of the top view of the structure of the present invention;

[0026] Figure 2 It is a schematic diagram of the axonometric structure of the suction cup of the present invention;

[0027] Figure 3 is an axonometric structural schematic diagram of the auxiliary support structure of the present invention;

[0028] Figure 4 It is a schematic diagram of the axonometric structure of the suction nozzle of the present invention;

[0029] Figure 5 is a schematic cross-sectional structural diagram of the suction nozzle of the present invention;

[0030] Figure 6 is a schematic diagram of the internal structure of the first gearbox of the present invention;

[0031] Figure 7 The present invention Figure 1 A schematic diagram of the enlarged structure of part A;

[0032] Figure 8 It is a schematic diagram of the axonometric structure of the present invention;

[0033] Fig. 9 It is a schematic diagram of the working state structure of the present invention during vertical adsorption;

[0034] Fig.10 It is a schematic diagram of the axonometric structure of the suction nozzle of the present invention.

[0035] The markings in the figure are: 100, frame; 101, top connecting plate; 102, mounting plate; 103, mounting frame; 104, inner frame 2; 105, inner frame 1; 106, vertical frame; 107, middle frame; 108, horizontal frame; 2, side suction cup structure; 201, nozzle; 2011, head; 2012, body; 2013, middle flow channel; 2014, valve; 2015, lower flow channel 1; 2016, rubber pad; 2017, upper flow channel 1; 2018, tail; 2019, groove; 2020, 20. movable part; 2021. middle part; 2022. pipeline; 3. middle suction cup structure; 4. robot flange; 5. reducer; 6. auxiliary supporting structure; 601. rotating hook; 602. slot body; 603. shaft; 604. connecting plate; 7. IC carrier board; 701. central adsorption area; 702. edge adsorption area; 8. middle shaft body; 9. side shaft body; 10. first gear box; 11. bevel gear; 14. servo motor; 16. coupling; 17. second gear box; 18. sleeve; 19. nut. DETAILED DESCRIPTION

[0036] like Figure 1 and Figure 2 As shown, it includes an IC carrier 7 and a side suction cup structure 2, the side suction cup structure 2 is installed on the frame 100, and the side suction cup structure 2 is symmetrically arranged at both ends of the frame 100. The edge of the IC carrier 7 is adsorbed by the side suction cup structure 2. The frame 100 is also equipped with a middle suction cup structure 3. The IC carrier 7 is divided into a central adsorption area 701 and an edge adsorption area 702. The side suction cup structure 2 adsorbs the edge adsorption area 702, and the middle suction cup structure 3 adsorbs the central adsorption area 701. Figure 3 and Figure 4 As shown, the side suction cup structure 2 and the middle suction cup structure 3 both include a suction nozzle 201, and the suction nozzle 201 is composed of a head 2011 and a body 2012. A plurality of gas flow channels are provided in the body 2012. Specifically, the bottom end of the head 2011 is tightly fitted to the surface of the IC carrier 7, and the gas in the gas flow channel is drawn outward to achieve the adsorption of the IC carrier 7.

[0037] Embodiment 1

[0038] like Figure 5 As shown, the body 2012 includes a middle portion 2021 and a tail portion 2018, and a movable portion 2020 is slidably connected between the middle portion 2021 and the tail portion 2018. The head 2011 is threadedly connected to the bottom end of the middle portion 2021, so as to facilitate the detachable connection of the suction nozzle 7 and quick replacement. An intermediate flow channel 2013 is provided on the head 2011, and the intermediate flow channel 2013 runs through the middle portion 2021, the movable portion 2020 and the tail portion 2018, and the intermediate flow channel 2013 is coaxial with the suction nozzle 201. When working, the gas in the intermediate flow channel 2013 is extracted to achieve a close fit between the head 2011 and the suction cup.

[0039] Furthermore, an upper flow channel 2017 is opened in the tail portion 2018, a lower flow channel 2015 is opened in the middle portion 2021, and a pipe 2022 is connected between the lower flow channel 2015 and the head portion 2011, one end of the pipe 2022 extends into the head portion 2011 and is connected to the middle flow channel 2013, and a valve 2014 is installed on the pipe 2022. By opening another gas flow channel, a dual channel is realized. When the middle flow channel 2013 located at the body portion 2012 leaks, the gas flow channel can be replaced in time without replacing the entire suction nozzle 7, thereby extending the service life of the suction nozzle and reducing maintenance costs.

[0040] Specifically, a groove 2019 is provided in the tail portion 2018 and the middle portion 2021, and the groove 2019 is used to accommodate the movable portion 2020. When the middle flow channel 2013 is working, Figure 5 As shown, the movable part 2020 is located on the outside of the groove 2019, and the head 2011 abuts the suction cup. At this time, the valve 2014 is in a closed state, and the gas in the middle flow channel 2013 is extracted to realize the adsorption of the suction cup; when the upper flow channel 2017 and the lower flow channel 2015 are working, the movable part 2020 is manually pushed into the groove 2019, so that the bottom end of the tail part 2018 and the top end of the middle part 2021 are tightly fitted, the head 2011 abuts the suction cup, the valve 2014 is opened, and the gas in the upper flow channel 2017 and the lower flow channel 2015 is extracted to realize the adsorption of the suction cup.

[0041] Furthermore, rubber pads 2016 are bonded to the bottom end of the tail portion 2018 and the top end of the middle portion 2021 to ensure the sealing performance of the contact between the bottom end of the tail portion 2018 and the top end of the middle portion 2021 when the upper flow channel 2017 and the lower flow channel 2015 are working, thereby ensuring the adsorption capacity of the suction nozzle and improving the stability of the suction cup adsorption.

[0042] During operation, the frame 100 moves downward, the bottom of the suction nozzle 201 adheres to the IC carrier 7, the side suction cup structure 2 adsorbs the central adsorption area 701 of the IC carrier 7, and the middle suction cup structure 3 adsorbs the edge adsorption area 702 of the IC carrier 7. The middle suction cup structure 3 adsorbs the middle part of the suction cup to prevent the middle part of the IC carrier 7 from collapsing.

[0043] Embodiment 2

[0044] On the basis of the above-mentioned embodiment 1, in order to further adjust the adsorbable range, as Figure 1 and Figure 3 As shown, the frame 100 includes two vertical frames 106 and two horizontal frames 108. A middle frame 107 is also installed in the frame 100. The middle frame 107 divides the frame 100 into two symmetrical areas. A mounting frame 103 is symmetrically installed on one side of the middle frame 107. A plurality of suction nozzles 201 are installed in the mounting frame 103. The suction nozzles 201 installed on the middle frame 107 adsorb the middle adsorption area 701. An inner frame 104 is installed between the middle frame 107 and the horizontal frame 108. A plurality of mounting frames 103 are installed on the outer side of the inner frame 104. A plurality of suction nozzles 201 are installed on the mounting frame 103. The suction nozzles 201 installed on the inner frame 104 adsorb the edge adsorption area 702.

[0045] like Figure 1 As shown, an inner frame 105 is installed between the middle frame 107 and the inner frame 2 104, and a side shaft 9 is symmetrically installed on the inner frame 105. A bevel gear 11 is sleeved on one end of the side shaft 9, and a top connecting plate 101 is installed on one side of the frame 100. A robot flange 4 is installed on the top connecting plate 101, and the frame 100 is moved up and down by an external robot grasping the robot flange 4.

[0046] A servo motor 14 is installed on one side of one of the vertical frames 106. The output end of the servo motor 14 is connected to the intermediate shaft 8. A reducer 16 and a coupling 16 are installed on the intermediate shaft 8. The reducer 16 is connected to the servo motor 14. The reducer 16 and the coupling 16 are respectively located on both sides of the vertical frame 106. Figure 6 As shown, a bevel gear 11 is sleeved on the intermediate shaft body 8, and the bevel gear 11 on the intermediate shaft body 8 is meshed with the bevel gear 11 on the side shaft body 9. The bevel gear 11 is located in the first gear box 10. The intermediate shaft body 8 is driven to rotate by the servo motor 14, and the power is transmitted to the side shaft body 9 through the meshing of the bevel gear 11 in the first gear box 10, so that the side shaft body 9 rotates.

[0047] Furthermore, if Figure 7As shown, a sleeve 18 is installed between the transverse frame 108, the second inner frame 104 and the first inner frame 105, one end of the sleeve 18 is connected to the side shaft 9, the sleeve 18 rotates with the side shaft 9, the transverse frame 108 and the first inner frame 105 are rotatably connected to the sleeve 18 respectively, the transverse frame 108 and the first inner frame 105 are fixed, the sleeve 18 rotates, a nut 19 is threadedly connected to the sleeve 18, while the sleeve 18 rotates, the nut 19 makes a rotational linear movement, the nut 19 is fixedly connected to the second inner frame 104, the movement of the second inner frame 104 is driven by the nut 19, since the side suction cup structure 2 is installed on the second inner frame 104, the position between the symmetrical side suction cup structures 2 can be adjusted.

[0048] In order to further ensure the stability of the movement of the inner frame 2 104, Figure 8 As shown, a second gear box 17 is installed on the intermediate shaft 8 , and the structure of the second gear box 17 is the same as that of the first gear box 10 .

[0049] During operation, when the size of the suction cup changes, the position of the side suction cup structure 2 can be adjusted, the servo motor 14 drives the intermediate shaft 8 to rotate, and the bevel gear 11 rotates. Through the engagement of the bevel gear 11, the rotational power of the intermediate shaft 8 is transmitted to the side shaft 9, so that the side shaft 9 rotates, and the sleeve 18 rotates with the side shaft 9. The transverse frame 108 and the inner frame 1 105 are fixed, the sleeve 18 rotates, and the nut 19 makes a rotational linear movement relative to the sleeve 18, and the movement of the inner frame 2 104 is driven by the nut 19.

[0050] Embodiment 3

[0051] On the basis of the above-mentioned embodiment 2, in order to further ensure the adsorption force of the suction cup, as Fig. 9 As shown, an auxiliary support structure 6 is installed on the frame 100, such as Figure 1 , Figure 3 and Fig.10As shown, the auxiliary support structure 6 includes a rotating cylinder 5 and a rotating hook 601, a mounting plate 102 is connected to the inner frame 104, the rotating cylinder 5 is mounted on the mounting plate 102, the output end of the rotating cylinder 5 is connected to a shaft 603, the rotating cylinder 5 drives the shaft 603 to rotate, and a plurality of connecting plates 604 are evenly installed at intervals on the outer side of the inner frame 104 for mounting the shaft 603 and supporting the shaft 603. The shaft 603 passes through the connecting plate 604 and is connected to the connecting plate 604 and the inner frame 104. Rotating connection, a plurality of rotating hooks 601 are clamped on the shaft 603, and the rotating cylinder 5 drives the rotating hooks 601 to rotate a certain angle, so that the rotating hooks 601 are in close contact with the surface of the IC carrier 7, which plays an auxiliary role in the adsorption of the IC carrier. At the same time, since the rotating hooks 601 are in close contact with the surface of the IC carrier 7, there is a certain friction between the rotating hooks 601 and the surface of the IC carrier 7. When the suction cup structure for removing large-size IC carriers is in a vertical working state, it can also prevent the IC carrier from moving downward after adsorption.

[0052] Furthermore, a groove 602 is provided on the transverse frame 108 , and the groove 602 is located directly above the rotating hook 601 to facilitate the rotation of the rotating hook 601 .

[0053] Specifically, when the suction cup structure for removing large-sized IC carriers is in a vertical working state, the rotating cylinder 5 drives the connecting rod 603 to rotate, so that the rotating hook 601 installed on the connecting rod 603 rotates a certain angle (greater than 90 degrees and less than 180 degrees), and the rotating hook 601 abuts against the surface of the IC carrier 7, thereby increasing the friction between the rotating hook 601 and the IC carrier 7. Similarly, when the suction cup structure for removing large-sized IC carriers is in a horizontal working state, an auxiliary supporting structure 6 can also be used to further ensure the reliability of the adsorption of the IC carrier 7 and ensure that the IC carrier 7 will not fall off during the transplanting process.

[0054] The working principle of the present invention is as follows: first, the distance between the two symmetrically installed inner frame bodies 104 is adjusted according to the size of the suction cup, the servo motor 14 drives the intermediate shaft body 8 to rotate, the bevel gear 11 rotates, and the rotational power of the intermediate shaft body 8 is transmitted to the side shaft body 9 through the meshing of the bevel gear 11. The side shaft body 9 rotates, and the sleeve 18 rotates with the side shaft body 9. The nut 19 performs a rotational linear movement relative to the sleeve 18, and the movement of the inner frame body 104 is driven by the nut 19. After the position of the inner frame body 104 is determined, the robot grabs the robot flange 4 and moves the frame 100 down. The suction cup 201 is moved until the bottom of the suction nozzle 201 is in contact with the IC carrier 7 (the side suction cup structure 2 adsorbs the central adsorption area 701 of the IC carrier 7, and the middle suction cup structure 3 adsorbs the edge adsorption area 702 of the IC carrier 7). Taking the operation of the middle flow channel 2013 as an example, the valve 2014 is in a closed state, and the gas in the middle flow channel 2013 is extracted to realize the adsorption of the suction cup. The rotating cylinder 5 drives the connecting rod 603 to rotate, so that the rotating hook 601 installed on the connecting rod 603 rotates a certain angle until the rotating hook 601 abuts against the surface of the IC carrier 7, completing the adsorption action of the suction cup.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A suction cup structure for removing a large-sized IC carrier, comprising an IC carrier (7) and a side suction cup structure (2), wherein the side suction cup structure (2) is mounted on a frame (100), characterized in that: The side suction cup structures (2) are symmetrically arranged at two ends of the frame (100); a middle suction cup structure (3) is also installed on the frame (100); the IC carrier (7) is divided into a central suction area (701) and an edge suction area (702); the side suction cup structures (2) adsorb the edge suction area (702); and the middle suction cup structure (3) adsorbs the central suction area (701); both the side suction cup structures (2) and the middle suction cup structures (3) include a suction nozzle (201); the suction nozzle (201) is composed of a head (2011) and a body (2012); and a plurality of gas flow channels are provided in the body (2012).

2. The suction cup structure for removing a large-size IC substrate according to claim 1, characterized in that: The body (2012) comprises a middle portion (2021) and a tail portion (2018), a movable portion (2020) being slidably connected between the middle portion (2021) and the tail portion (2018), the head (2011) being threadedly connected to the bottom end of the middle portion (2021), an intermediate flow channel (2013) being provided on the head (2011), the intermediate flow channel (2013) passing through the middle portion (2021), the movable portion (2020) and the tail portion (2018), and the intermediate flow channel (2013) and the suction nozzle (201) are coaxial.

3. The suction cup structure for removing a large-size IC substrate according to claim 2, characterized in that: An upper flow channel (2017) is provided in the tail portion (2018), a lower flow channel (2015) is provided in the middle portion (2021), and a pipeline is connected between the lower flow channel (2015) and the head portion (2011), one end of the pipeline extends into the head portion (2011) and is connected to the middle flow channel (2013), and a valve (2014) is installed on the pipeline.

4. The suction cup structure for removing a large-size IC substrate according to claim 3, characterized in that: A groove (2019) is provided in the tail portion (2018) and the middle portion (2021), and the groove (2019) is used to accommodate the movable portion (2020), and a rubber pad (2016) is bonded to the bottom end of the tail portion (2018) and the top end of the middle portion (2021).

5. The suction cup structure for removing a large-size IC carrier according to claim 1, characterized in that: The frame (100) comprises two vertical frames (106) and two horizontal frames (108). An intermediate frame (107) is also installed in the frame (100). The intermediate frame (107) divides the frame (100) into two symmetrical areas. A mounting frame (103) is symmetrically installed on one side of the intermediate frame (107). A plurality of suction nozzles (201) are installed in the mounting frame (103). The suction nozzles (201) installed on the intermediate frame (107) adsorb the intermediate adsorption area (701).

6. The suction cup structure for removing a large-size IC substrate according to claim 5, characterized in that: An inner frame body 2 (104) is installed between the middle frame body (107) and the horizontal frame body (108); a plurality of mounting frames (103) are installed on the outer side of the inner frame body 2 (104); a plurality of suction nozzles (201) are installed on the mounting frames (103); and the suction nozzles (201) installed on the inner frame body 2 (104) adsorb the edge adsorption area (702).

7. The suction cup structure for removing a large-size IC substrate according to claim 6, characterized in that: An inner frame (105) is installed between the middle frame (107) and the inner frame (104), and a side shaft (9) is symmetrically installed on the inner frame (105), and a bevel gear (11) is sleeved on one end of the side shaft (9). A top connecting plate (101) is installed on one side of the frame (100), and a robot flange (4) is installed on the top connecting plate (101). A servo motor (14) is installed on one side of one of the vertical frames (106), and the output end of the servo motor (14) is connected to an intermediate shaft (8), and a reducer (16) and a coupling (16) are installed on the intermediate shaft (8), and the reducer (16) and the servo motor (14) are connected, and the reducer (16) and the coupling are connected. The devices (16) are respectively located on both sides of the vertical frame (106); a bevel gear (11) is sleeved on the intermediate shaft (8); the bevel gear (11) on the intermediate shaft (8) is meshed with the bevel gear (11) on the side shaft (9); and the bevel gear (11) is located in the first gear box (10); a sliding sleeve (18) is installed between the transverse frame (108), the second inner frame (104) and the first inner frame (105); one end of the sliding sleeve (18) is connected to the side shaft (9); the transverse frame (108) and the first inner frame (105) are respectively rotatably connected to the sliding sleeve (18); a nut (19) is threadedly connected to the sliding sleeve (18); and the nut (19) is fixedly connected to the second inner frame (104).

8. The suction cup structure for removing a large-size IC carrier according to claim 7, characterized in that: A second gear box (17) is installed on the intermediate shaft (8), and the structure of the second gear box (17) is the same as that of the first gear box (10).

9. The suction cup structure for removing a large-size IC substrate according to claim 5, characterized in that: An auxiliary support structure (6) is installed on the frame (100), and the auxiliary support structure (6) includes a rotating cylinder (5) and a rotating hook (601). The inner frame body (104) is connected to a mounting plate (102), and the rotating cylinder (5) is installed on the mounting plate (102). The output end of the rotating cylinder (5) is connected to a shaft (603). A plurality of connecting plates (604) are evenly installed on the outer side of the inner frame body (104). The shaft (603) passes through the connecting plate (604) and is rotatably connected to the connecting plate (604) and the inner frame body (104). A plurality of rotating hooks (601) are clamped on the shaft (603). The rotating cylinder (5) drives the rotating hook (601) to make the rotating hook (601) close to the surface of the IC carrier (7).

10. The suction cup structure for removing a large-size IC carrier according to claim 9, characterized in that: The transverse frame (108) is provided with a groove (602), and the groove (602) is located directly above the rotating hook (601).

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