Ultrasonic sensor, control method thereof and electronic equipment

Abstract

The invention discloses an ultrasonic sensor, a control method thereof and electronic equipment. The ultrasonic sensor comprises a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe and a microprocessor, the microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe, the first transmitting probe is used for generating a first ultrasonic signal according to the square wave signal, and the second transmitting probe is used for generating a second ultrasonic signal according to the square wave signal; the first receiving probe is used for receiving a first ultrasonic signal, generating a first echo signal according to the first ultrasonic signal and sending the first echo signal to the microprocessor, and the second receiving probe is used for receiving a second ultrasonic signal, generating a second echo signal according to the second ultrasonic signal and sending the second echo signal to the microprocessor; the microprocessor is used for calculating the flow, temperature and bubble number of the fluid. The ultrasonic sensor provided by the invention can be used for simultaneously detecting a plurality of parameters such as the flow, the temperature and the number of bubbles of the fluid.

Description

Technical Field

[0001] The present invention relates to the field of sensor technology, and in particular to an ultrasonic sensor and a control method thereof, and an electronic device. Background Art

[0002] Ultrasonic sensors are sensors that use the characteristics of ultrasound for detection and are widely used in the fields of industry, medicine, and automobiles. Their working principle is to emit ultrasonic signals and detect parameters such as the position, distance, speed, thickness, and density of the object being measured based on information such as the reflection, attenuation, and Doppler effect of the ultrasonic signals.

[0003] For existing ultrasonic sensors, when detecting fluid parameters, multiple sensors need to be integrated inside the pipeline, and the pipeline needs to be destroyed for installation, which makes the sensor vulnerable to environmental influences such as wear and corrosion, reducing the service life of the sensor. In addition, existing ultrasonic sensors can only detect one parameter of the fluid, such as flow rate, temperature or bubbles. When multiple parameters of the fluid need to be measured, multiple sensors need to be set up for measurement, which leads to high costs and complex installation. Summary of the invention

[0004] The present invention provides an ultrasonic sensor and a control method thereof, and an electronic device, so as to solve the problem that the existing ultrasonic sensor is easily affected by the environment and can only detect a single parameter.

[0005] In a first aspect, the present invention provides an ultrasonic sensor, the ultrasonic sensor comprising: a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe and a microprocessor;

[0006] The first transmitting probe and the first receiving probe are arranged obliquely and relatively on both sides of the pipeline through which the fluid flows, and the second transmitting probe and the second receiving probe are arranged obliquely and relatively on both sides of the pipeline; the first transmitting probe and the second receiving probe are arranged at one side of the pipeline with a spacing, and the first receiving probe and the second transmitting probe are arranged at the other side of the pipeline with a spacing;

[0007] The first transmitting probe, the second transmitting probe, the first receiving probe and the second receiving probe are all connected to the microprocessor; the microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe, the first transmitting probe is used to generate a first ultrasonic signal according to the square wave signal, and the second transmitting probe is used to generate a second ultrasonic signal according to the square wave signal; the first receiving probe is used to receive the first ultrasonic signal, and generate a first echo signal to the microprocessor according to the first ultrasonic signal, and the second receiving probe is used to receive the second ultrasonic signal, and generate a second echo signal to the microprocessor according to the second ultrasonic signal; the microprocessor is used to calculate the flow rate, temperature and number of bubbles of the fluid.

[0008] Optionally, the first transmitting probe includes: a first inverter, a second inverter, a third inverter, a fourth inverter, a fifth inverter, a first resistor, a second resistor and a first transmitting transducer;

[0009] The input ends of the first inverter, the second inverter and the third inverter are all connected to the microprocessor, the output end of the first inverter is connected to the input ends of the fourth inverter and the fifth inverter, and the output ends of the fourth inverter and the fifth inverter are all connected to the first electrode of the first transmitting transducer; the first resistor is connected between the first electrode of the first transmitting transducer and the first power supply;

[0010] The output end of the second inverter and the output end of the third inverter are both connected to the second electrode of the first transmitting transducer, and the second resistor is connected between the second electrode of the first transmitting transducer and the first power supply; the first transmitting transducer is used to transmit the first ultrasonic signal.

[0011] Optionally, the second transmitting probe includes: a sixth inverter, a seventh inverter, an eighth inverter, a ninth inverter, a tenth inverter, a third resistor, a fourth resistor and a second transmitting transducer;

[0012] The input ends of the sixth inverter, the seventh inverter and the eighth inverter are all connected to the microprocessor, the output end of the sixth inverter is connected to the input ends of the ninth inverter and the tenth inverter, and the output ends of the ninth inverter and the tenth inverter are all connected to the first electrode of the second transmitting transducer; the third resistor is connected between the first electrode of the second transmitting transducer and the first power supply;

[0013] The output end of the seventh inverter and the output end of the eighth inverter are both connected to the second electrode of the second transmitting transducer, and the fourth resistor is connected between the second electrode of the second transmitting transducer and the first power supply; the second transmitting transducer is used to transmit the second ultrasonic signal.

[0014] Optionally, the first receiving probe includes: a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first receiving chip and a first receiving transducer;

[0015] The first receiving transducer is used to receive the first ultrasonic signal, the first electrode of the first receiving transducer is connected to the first pin of the first receiving chip, and the second electrode of the first receiving transducer is grounded; the first capacitor is connected between the first pin of the first receiving chip and the ground, and the second capacitor is connected between the sixth pin of the first receiving chip and the ground; the fourth pin of the first receiving chip is grounded;

[0016] The third capacitor is connected between the third pin of the first receiving chip and the ground, the fourth capacitor is connected between the first end of the fifth resistor and the ground, and the second end of the fifth resistor is connected to the second pin of the first receiving chip; the sixth resistor is connected between the seventh pin of the first receiving chip and the second power supply, and the seventh resistor is connected between the eighth pin and the fifth pin of the first receiving chip; the seventh pin of the first receiving chip is used to output the first echo signal.

[0017] Optionally, the first receiving chip includes a CX20106 chip.

[0018] Optionally, the second receiving probe includes: an eighth resistor, a ninth resistor, a tenth resistor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a second receiving chip and a second receiving transducer;

[0019] The second receiving transducer is used to receive the second ultrasonic signal, the first electrode of the second receiving transducer is connected to the first pin of the second receiving chip, and the second electrode of the second receiving transducer is grounded; the fifth capacitor is connected between the first pin of the second receiving chip and the ground, and the sixth capacitor is connected between the sixth pin of the second receiving chip and the ground; the fourth pin of the second receiving chip is grounded;

[0020] The seventh capacitor is connected between the third pin of the second receiving chip and the ground, the eighth capacitor is connected between the first end of the eighth resistor and the ground, and the second end of the eighth resistor is connected to the second pin of the second receiving chip; the ninth resistor is connected between the seventh pin of the second receiving chip and the second power supply, and the tenth resistor is connected between the eighth pin and the fifth pin of the second receiving chip; the seventh pin of the second receiving chip is used to output the second echo signal.

[0021] Optionally, the second receiving chip includes a CX20106 chip.

[0022] Optionally, the ultrasonic sensor further includes: a display device;

[0023] The display device is connected to the microprocessor, and is used to display the data of the flow rate, temperature and bubble quantity of the fluid calculated by the microprocessor.

[0024] In a second aspect, the present invention provides a control method for an ultrasonic sensor, wherein the control method is applied to an ultrasonic sensor, wherein the ultrasonic sensor comprises a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe and a microprocessor; the first transmitting probe and the first receiving probe are tilted and relatively arranged on both sides of a pipeline through which a fluid flows, and the second transmitting probe and the second receiving probe are tilted and relatively arranged on both sides of the pipeline; the first transmitting probe and the second receiving probe are spaced apart and located on one side of the pipeline, and the first receiving probe and the second transmitting probe are spaced apart and located on the other side of the pipeline; the first transmitting probe, the second transmitting probe, the first receiving probe and the second receiving probe are all connected to the microprocessor;

[0025] Control methods include:

[0026] The microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe;

[0027] The first transmitting probe generates a first ultrasonic signal according to the square wave signal, and the second transmitting probe generates a second ultrasonic signal according to the square wave signal;

[0028] The first receiving probe receives the first ultrasonic signal, and generates a first echo signal to the microprocessor according to the first ultrasonic signal, and the second receiving probe receives the second ultrasonic signal, and generates a second echo signal to the microprocessor according to the second ultrasonic signal;

[0029] The microprocessor calculates the fluid flow rate, temperature and number of bubbles.

[0030] In a third aspect, the present invention provides an electronic device, wherein the electronic device includes the ultrasonic sensor provided in the first aspect.

[0031] The technical solution of the embodiment of the present invention sets the ultrasonic sensor as an external clamp-on ultrasonic sensor. The ultrasonic sensor does not need to be integrated inside the pipeline, and there is no need to damage the pipeline. It only needs to clamp the probe in the gastric part of the pipeline, so that the ultrasonic sensor is not affected by the environment such as fluid wear and corrosion, and can work stably for a long time, effectively increasing the service life of the sensor. At the same time, the ultrasonic sensor provided by the technical solution of the embodiment of the present invention can realize the simultaneous detection of multiple parameters such as flow rate, temperature and number of bubbles of the fluid, simplifying the measurement system, effectively reducing costs and facilitating installation. The external clamp-on ultrasonic sensor can be applied to the TOC analyzer. Since the magnetic levitation pump has high requirements for the medium temperature and bubble conditions when working, the ultrasonic sensor provided by the technical solution of the embodiment of the present invention can detect multiple parameters of the fluid. The operating status of the peripheral magnetic levitation pump provides supporting information, which can be used as the operating limit input of the magnetic levitation pump to ensure the safe and reliable operation of the TOC analyzer as a whole.

[0032] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 is a schematic structural diagram of an ultrasonic sensor provided by an embodiment of the present invention;

[0035] Figure 2 is a waveform diagram of a square wave signal, a first echo signal and a second echo signal provided by an embodiment of the present invention;

[0036] Figure 3 It is a structural schematic diagram of a first transmitting probe and a microprocessor connected according to an embodiment of the present invention;

[0037] Figure 4 It is a structural schematic diagram of a second transmitting probe and a microprocessor connected according to an embodiment of the present invention;

[0038] Figure 5 It is a structural schematic diagram of a first receiving probe and a microprocessor connected according to an embodiment of the present invention;

[0039] Figure 6 It is a structural schematic diagram of a second receiving probe and a microprocessor connected according to an embodiment of the present invention;

[0040] Figure 7 is a schematic diagram of the structure of another ultrasonic sensor provided by an embodiment of the present invention;

[0041] Figure 8 is a flow chart of a control method of an ultrasonic sensor provided by an embodiment of the present invention;

[0042] Fig. 9 A schematic diagram of the structure of an electronic device that can be used to implement an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0044] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0045] Figure 1 is a schematic diagram of the structure of an ultrasonic sensor provided by an embodiment of the present invention, such as Figure 1 As shown, the ultrasonic sensor includes: a first transmitting probe 1, a second transmitting probe 2, a first receiving probe 3, a second receiving probe 4 and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are tilted and relatively arranged on both sides of the pipe 20 through which the fluid flows, and the second transmitting probe 2 and the second receiving probe 4 are tilted and relatively arranged on both sides of the pipe 20. The first transmitting probe 1 and the second receiving probe 4 are spaced apart on one side of the pipe 20, and the first receiving probe 3 and the second transmitting probe 2 are spaced apart on the other side of the pipe 20. The first transmitting probe 1, the second transmitting probe 2, the first receiving probe 3 and the second receiving probe 4 are all connected to the microprocessor 5; the microprocessor 5 sends a square wave signal TRIG to the first transmitting probe 1 and the second transmitting probe 2, the first transmitting probe 1 is used to generate a first ultrasonic signal according to the square wave signal TRIG, and the second transmitting probe 2 is used to generate a second ultrasonic signal according to the square wave signal TRIG. The first receiving probe 3 is used to receive the first ultrasonic signal, and generate a first echo signal ECHO1 to the microprocessor 5 according to the first ultrasonic signal, and the second receiving probe 4 is used to receive the second ultrasonic signal, and generate a second echo signal ECHO2 to the microprocessor 5 according to the second ultrasonic signal. The microprocessor 5 is used to calculate the flow rate, temperature and bubble quantity of the fluid.

[0046] Specifically, the ultrasonic sensor provided in the embodiment of the present invention is an external clamp-on ultrasonic sensor, which is clamped on a pipe 20 through which a fluid flows. The external clamp-on ultrasonic sensor includes two transmitting probes, two receiving probes, and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are arranged relative to each other at an angle of θ to the pipe 20. The second transmitting probe 2 and the second receiving probe 4 are also arranged relative to each other at an angle of θ to the pipe 20.

[0047] Figure 2 is a waveform diagram of a square wave signal, a first echo signal, and a second echo signal provided by an embodiment of the present invention, such as Figure 1 and Figure 2 As shown, the microprocessor 5 outputs a square wave signal TRIG to the first transmitting probe 1 and the second transmitting probe 2. The first transmitting probe 1 processes the square wave signal TRIG and then outputs a first ultrasonic signal. The first ultrasonic signal passes through the pipe wall of the pipe 20 and the fluid in the pipe 20, and interacts with the fluid and the pipe wall inside the pipe 20. The first receiving probe 3 receives the first ultrasonic signal, amplifies, filters, integrates, compares and shapes the first ultrasonic signal, and then outputs a first echo signal ECHO1 to the microprocessor 5. The second transmitting probe 2 processes the square wave signal TRIG and then outputs a second ultrasonic signal. The second ultrasonic signal passes through the pipe wall of the pipe 20 and the fluid in the pipe 20, and interacts with the fluid and the pipe wall inside the pipe 20. The second receiving probe 4 receives the second ultrasonic signal, amplifies, filters, integrates, compares and shapes the second ultrasonic signal, and then outputs a second echo signal ECHO2 to the microprocessor 5.

[0048] The microprocessor 5 calculates that the time difference between sending the square wave signal TRIG and receiving the first echo signal ECHO1 is t1, and the time difference between sending the square wave signal TRIG and receiving the second echo signal ECHO2 is t2. The flow direction of the fluid in the pipeline 20 is Figure 1 When the direction indicated by the arrow is t2, t2 is greater than t1, and the fluid flow direction in the pipe 20 is the same as Figure 1 When the direction indicated by the arrow is opposite, t2 is less than t1. The microprocessor 5 calculates the transmission time t0 of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipe 20 as:

[0049]

[0050] Wherein, d is the thickness of the tube wall, and c0 is the transmission speed of the first ultrasonic wave and the second ultrasonic wave in the tube wall.

[0051] The microprocessor 5 calculates the flow velocity v of the fluid according to the transmission time t0 of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipe 20, the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2:

[0052]

[0053] Wherein, L is the inner diameter of the pipe 20 .

[0054] The microprocessor 5 can calculate the flow rate of the fluid according to the flow velocity v of the fluid and the cross-sectional area of ​​the pipe 20. The microprocessor 5 also calculates the transmission speed c of the ultrasonic wave in the fluid when the fluid is stationary according to the transmission time t0 of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipe 20, the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2:

[0055]

[0056] The microprocessor 5 combines the relationship between temperature and ultrasonic transmission speed:

[0057] c=1468+3.68*(T-10)-0.0279(T-10) 2

[0058] The microprocessor 5 can calculate the temperature T of the fluid according to the transmission speed c of the ultrasonic wave in the fluid when the fluid is stationary.

[0059] The microprocessor 5 can detect the number of bubbles in the fluid according to the changes in the amplitude and waveform of the received first echo signal ECHO1 and the second echo signal ECHO2.

[0060] With the development of industrial automation and intelligence, higher requirements are placed on the real-time and multi-parameter monitoring capabilities of fluid monitoring. The external clamp-on ultrasonic sensor provided in the embodiment of the present invention is a non-contact sensor that can monitor multiple parameters of the fluid medium, such as temperature, flow rate, liquid level, and concentration. Applying the external clamp-on ultrasonic sensor to the total organic carbon (TOC) analyzer can realize multi-parameter detection of the outlet medium characteristics of the magnetic levitation pump in the TOC analyzer, improve the detection efficiency and accuracy, and provide a diagnostic basis for the operating status of the magnetic levitation pump in the TOC analyzer.

[0061] The technical solution of the embodiment of the present invention sets the ultrasonic sensor as an external clamp-on ultrasonic sensor. The ultrasonic sensor does not need to be integrated inside the pipeline, and there is no need to damage the pipeline. It only needs to clamp the probe in the gastric part of the pipeline, so that the ultrasonic sensor is not affected by the environment such as fluid wear and corrosion, and can work stably for a long time, effectively increasing the service life of the sensor. At the same time, the ultrasonic sensor provided by the technical solution of the embodiment of the present invention can realize the simultaneous detection of multiple parameters such as flow rate, temperature and number of bubbles of the fluid, simplifying the measurement system, effectively reducing costs and facilitating installation. The external clamp-on ultrasonic sensor can be applied to the TOC analyzer. Since the magnetic levitation pump has high requirements for the medium temperature and bubble conditions when working, the ultrasonic sensor provided by the technical solution of the embodiment of the present invention can detect multiple parameters of the fluid. The operating status of the peripheral magnetic levitation pump provides supporting information, which can be used as the operating limit input of the magnetic levitation pump to ensure the safe and reliable operation of the TOC analyzer as a whole.

[0062] Optionally, based on the above embodiments, Figure 3 FIG. 1 is a schematic diagram of a structure of a first transmitting probe and a microprocessor connected to each other according to an embodiment of the present invention. Figure 3 As shown, the first transmitting probe 1 includes: a first inverter N1, a second inverter N2, a third inverter N3, a fourth inverter N4, a fifth inverter N5, a first resistor R1, a second resistor R2 and a first transmitting transducer Tr1. The input ends of the first inverter N1, the second inverter N2 and the third inverter N3 are all connected to the microprocessor 5, the output end of the first inverter N1 is connected to the input ends of the fourth inverter N4 and the fifth inverter N5, and the output ends of the fourth inverter N4 and the fifth inverter N5 are all connected to the first electrode of the first transmitting transducer Tr1. The first resistor R1 is connected between the first electrode of the first transmitting transducer Tr1 and the first power supply V1. The output end of the second inverter N2 and the output end of the third inverter N3 are both connected to the second electrode of the first transmitting transducer Tr1, and the second resistor R2 is connected between the second electrode of the first transmitting transducer Tr1 and the first power supply V1. The first transmitting transducer Tr1 is used to transmit a first ultrasonic signal.

[0063] Specifically, the first transmitting probe 1 can be composed of five inverters, two resistors and a transmitting transducer. The five inverters can all use 74LS04 chips, the resistance of the first resistor R1 and the second resistor R2 can be 1kΩ, and the voltage of the first power supply V1 can be 3.3V. The I / O port of the microprocessor 5 can output a 40kHZ square wave signal TRIG, the square wave signal TRIG is sent to the second electrode of the first transmitting transducer Tr1 through a first-stage inverter composed of the second inverter N2 or the third inverter N3, and the square wave signal TRIG is sent to the first electrode of the first transmitting transducer Tr1 through a two-stage inverter composed of the first inverter N1 and the fourth inverter N4 or the fifth inverter N5. This push-pull connection mode adds the square wave signal TRIG to both ends of the first transmitting transducer Tr1, which can improve the emission intensity of the first ultrasonic signal. The fourth inverter N4 and the fifth inverter N5 are connected in parallel, and the second inverter N2 and the third inverter N3 are connected in parallel, which can improve the driving ability. The pull-up first resistor R1 and the second resistor R2 can improve the driving capability of the inverter to output a high level on the one hand, and can increase the damping effect of the first transmitting transducer Tr1 and shorten its free oscillation time on the other hand.

[0064] Optionally, based on the above embodiments, Figure 4 FIG. 1 is a schematic diagram of a structure of a second transmitting probe and a microprocessor connected to each other according to an embodiment of the present invention. Figure 4 As shown, the second transmitting probe 2 includes: a sixth inverter N6, a seventh inverter N7, an eighth inverter N8, a ninth inverter N9, a tenth inverter N10, a third resistor R3, a fourth resistor R4 and a second transmitting transducer Tr2. The input ends of the sixth inverter N6, the seventh inverter N7 and the eighth inverter N8 are all connected to the microprocessor 5, the output end of the sixth inverter N6 is connected to the input ends of the ninth inverter N9 and the tenth inverter N10, and the output ends of the ninth inverter N9 and the tenth inverter N10 are all connected to the first electrode of the second transmitting transducer Tr2. The third resistor R3 is connected between the first electrode of the second transmitting transducer Tr2 and the first power supply V1. The output end of the seventh inverter N7 and the output end of the eighth inverter N8 are both connected to the second electrode of the second transmitting transducer Tr2, and the fourth resistor R4 is connected between the second electrode of the second transmitting transducer Tr2 and the first power supply V1. The second transmitting transducer Tr2 is used to transmit a second ultrasonic signal.

[0065] Specifically, the second transmitting probe 2 can be composed of five inverters, two resistors and a transmitting transducer. The five inverters can all use 74LS04 chips, the resistance of the third resistor R3 and the fourth resistor R4 can be 1kΩ, and the voltage of the first power supply V1 can be 3.3V. The I / O port of the microprocessor 5 can output a 40kHZ square wave signal TRIG, and the square wave signal TRIG is sent to the second electrode of the second transmitting transducer Tr2 through a first-stage inverter composed of the seventh inverter N7 or the eighth inverter N8, and the square wave signal TRIG is sent to the first electrode of the second transmitting transducer Tr2 through a two-stage inverter composed of the sixth inverter N6 and the ninth inverter N9 or the tenth inverter N10. This push-pull connection mode adds the square wave signal TRIG to both ends of the second transmitting transducer Tr2, which can improve the emission intensity of the second ultrasonic signal. The ninth inverter N9 and the tenth inverter N10 are connected in parallel, and the seventh inverter N7 and the eighth inverter N8 are connected in parallel, which can improve the driving ability. The pull-up third resistor R3 and the fourth resistor R4 can improve the driving capability of the inverter to output a high level on the one hand, and can increase the damping effect of the second transmitting transducer Tr2 and shorten its free oscillation time on the other hand.

[0066] Optionally, based on the above embodiments, Figure 5 is a schematic diagram of a structure of a first receiving probe and a microprocessor connected according to an embodiment of the present invention, such as Figure 5 As shown, the first receiving probe 3 includes: a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a first receiving chip U1 and a first receiving transducer Re1. The first receiving transducer Re1 is used to receive the first ultrasonic signal, the first electrode of the first receiving transducer Re1 is connected to the first pin of the first receiving chip U1, and the second electrode of the first receiving transducer Re1 is grounded GND. The first capacitor C1 is connected between the first pin of the first receiving chip U1 and the ground GND, the second capacitor C2 is connected between the sixth pin of the first receiving chip U1 and the ground GND; the fourth pin of the first receiving chip U1 is grounded GND. The third capacitor C3 is connected between the third pin of the first receiving chip U1 and the ground GND, the fourth capacitor C4 is connected between the first end of the fifth resistor R5 and the ground GND, and the second end of the fifth resistor R5 is connected to the second pin of the first receiving chip U1. The sixth resistor R6 is connected between the seventh pin of the first receiving chip U1 and the second power supply V2, and the seventh resistor R7 is connected between the eighth pin and the fifth pin of the first receiving chip U1. The seventh pin of the first receiving chip U1 is used to output the first echo signal ECHO1.

[0067] Specifically, the first receiving probe 3 can be composed of a first receiving chip U1 and three resistors and four capacitors on its periphery. The resistance values ​​of the fifth resistor R5 and the sixth resistor R6 can be 10kΩ, and the resistance value of the seventh resistor R7 can be 220kΩ. The capacitance value of the first capacitor C1 can be 56nF, the capacitance value of the second capacitor C2 can be 330uF, the capacitance value of the third capacitor C3 can be 3.3uF, and the capacitance value of the fourth capacitor C4 can be 1uF. The first receiving transducer Re1 receives the first ultrasonic signal sent by the first transmitting probe 1, and converts it into an electrical signal and outputs it to the first pin of the first receiving chip U1. After amplification, filtering, integral comparison and shaping processing are performed inside the first receiving chip U1, the seventh pin of the first receiving chip U1 outputs the first echo signal ECHO1 to the microprocessor 5 for processing. When the first echo signal ECHO1 is at a high level, it means that the first ultrasonic signal is not received. When the first ultrasonic signal is received, the first echo signal ECHO1 generates a falling edge. If the first ultrasonic signal is continuously received, the first echo signal ECHO1 is a periodic pulse wave.

[0068] Optional, continue to refer to Figure 5 , the first receiving chip U1 includes a CX20106 chip.

[0069] Specifically, the first receiving chip U1 can be a CX20106 chip, the first pin of the first receiving chip U1 corresponds to the first pin of the CX20106 chip, the second pin of the first receiving chip U1 corresponds to the second pin of the CX20106 chip, the third pin of the first receiving chip U1 corresponds to the third pin of the CX20106 chip, the fourth pin of the first receiving chip U1 corresponds to the fourth pin of the CX20106 chip, the fifth pin of the first receiving chip U1 corresponds to the fifth pin of the CX20106 chip, the sixth pin of the first receiving chip U1 corresponds to the sixth pin of the CX20106 chip, the seventh pin of the first receiving chip U1 corresponds to the seventh pin of the CX20106 chip, and the eighth pin of the first receiving chip U1 corresponds to the eighth pin of the CX20106 chip.

[0070] Optionally, based on the above embodiments, Figure 6 FIG. 1 is a schematic diagram of a structure of a second receiving probe and a microprocessor connected to each other according to an embodiment of the present invention. Figure 6As shown, the second receiving probe 4 includes: an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a second receiving chip U2 and a second receiving transducer Re2. The second receiving transducer Re2 is used to receive the second ultrasonic signal, the first electrode of the second receiving transducer Re2 is connected to the first pin of the second receiving chip U2, and the second electrode of the second receiving transducer Re2 is grounded GND. The fifth capacitor C5 is connected between the first pin of the second receiving chip U2 and the ground GND, the sixth capacitor C6 is connected between the sixth pin of the second receiving chip U2 and the ground GND; the fourth pin of the second receiving chip U2 is grounded GND. The seventh capacitor C7 is connected between the third pin of the second receiving chip U2 and the ground GND, the eighth capacitor C8 is connected between the first end of the eighth resistor R8 and the ground GND, and the second end of the eighth resistor R8 is connected to the second pin of the second receiving chip U2. The ninth resistor R9 is connected between the seventh pin of the second receiving chip U2 and the second power supply V2, and the tenth resistor R10 is connected between the eighth pin and the fifth pin of the second receiving chip U2; the seventh pin of the second receiving chip U2 is used to output the second echo signal.

[0071] Specifically, the second receiving probe 4 can be composed of a second receiving chip U2 and three resistors and four capacitors on its periphery. The resistance values ​​of the eighth resistor R8 and the ninth resistor R9 can be 10kΩ, and the resistance value of the tenth resistor R10 can be 220kΩ. The capacitance value of the fifth capacitor C5 can be 56nF, the capacitance value of the sixth capacitor C6 can be 330uF, the capacitance value of the seventh capacitor C7 can be 3.3uF, and the capacitance value of the eighth capacitor C8 can be 1uF. The second receiving transducer Re2 receives the second ultrasonic signal sent by the second transmitting probe 2, and converts it into an electrical signal and outputs it to the first pin of the second receiving chip U2. After amplification, filtering, integral comparison and shaping processing are performed inside the second receiving chip U2, the seventh pin of the second receiving chip U2 outputs the second echo signal ECHO2 to the microprocessor 5 for processing. When the second echo signal ECHO2 is at a high level, it means that the second ultrasonic signal is not received. When the second ultrasonic signal is received, the second echo signal ECHO2 generates a falling edge. If the second ultrasonic signal is continuously received, the second echo signal ECHO2 is a periodic pulse wave.

[0072] Optional, continue to refer to Figure 6 , the second receiving chip U2 includes a CX20106 chip.

[0073] Specifically, the second receiving chip U2 can be a CX20106 chip, the first pin of the second receiving chip U2 corresponds to the first pin of the CX20106 chip, the second pin of the second receiving chip U2 corresponds to the second pin of the CX20106 chip, the third pin of the second receiving chip U2 corresponds to the third pin of the CX20106 chip, the fourth pin of the second receiving chip U2 corresponds to the fourth pin of the CX20106 chip, the fifth pin of the second receiving chip U2 corresponds to the fifth pin of the CX20106 chip, the sixth pin of the second receiving chip U2 corresponds to the sixth pin of the CX20106 chip, the seventh pin of the second receiving chip U2 corresponds to the seventh pin of the CX20106 chip, and the eighth pin of the second receiving chip U2 corresponds to the eighth pin of the CX20106 chip.

[0074] Optionally, based on the above embodiments, Figure 7 is a schematic diagram of the structure of another ultrasonic sensor provided by an embodiment of the present invention, such as Figure 7 As shown, the ultrasonic sensor further includes: a display device 6. The display device 6 is connected to the microprocessor 5, and is used to display the data of the flow rate, temperature and number of bubbles of the fluid calculated by the microprocessor 5.

[0075] Specifically, the parameters such as the flow rate, temperature and number of bubbles of the fluid calculated by the microprocessor 5 can be displayed by the display device 6, so that the staff can understand the various parameters of the fluid in time.

[0076] Figure 8 is a flow chart of a control method of an ultrasonic sensor provided by an embodiment of the present invention, wherein the control method is applied to an ultrasonic sensor, such as Figure 1 As shown, the ultrasonic sensor includes a first transmitting probe 1, a second transmitting probe 2, a first receiving probe 3, a second receiving probe 4 and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are tilted and relatively arranged on both sides of the pipe 20 through which the fluid flows, and the second transmitting probe 2 and the second receiving probe 4 are tilted and relatively arranged on both sides of the pipe 20. The first transmitting probe 1 and the second receiving probe 4 are spaced apart on one side of the pipe 20, and the first receiving probe 3 and the second transmitting probe 2 are spaced apart on the other side of the pipe 20. The first transmitting probe 1, the second transmitting probe 2, the first receiving probe 3 and the second receiving probe 4 are all connected to the microprocessor 5. The control method includes:

[0077] S100: The microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe.

[0078] Specifically, Figure 1 and Figure 2As shown, the ultrasonic sensor provided in the embodiment of the present invention is an external clamp-on ultrasonic sensor, which is clamped on a pipe 20 through which a fluid flows. The external clamp-on ultrasonic sensor includes two transmitting probes, two receiving probes, and a microprocessor 5. The first transmitting probe 1 and the first receiving probe 3 are arranged relative to each other at an angle of θ to the pipe 20. The second transmitting probe 2 and the second receiving probe 4 are also arranged relative to each other at an angle of θ to the pipe 20. The microprocessor 5 outputs a square wave signal TRIG to the first transmitting probe 1 and the second transmitting probe 2.

[0079] S110: The first transmitting probe generates a first ultrasonic signal according to the square wave signal, and the second transmitting probe generates a second ultrasonic signal according to the square wave signal.

[0080] Specifically, Figure 1 As shown, the first transmitting probe 1 processes the square wave signal TRIG and then outputs a first ultrasonic signal, and the second transmitting probe 2 processes the square wave signal TRIG and then outputs a second ultrasonic signal.

[0081] S120: The first receiving probe receives the first ultrasonic signal, and generates a first echo signal to the microprocessor according to the first ultrasonic signal; the second receiving probe receives the second ultrasonic signal, and generates a second echo signal to the microprocessor according to the second ultrasonic signal.

[0082] Specifically, Figure 1 and Figure 2 As shown, the first ultrasonic signal passes through the wall of the pipe 20 and the fluid in the pipe 20, interacts with the fluid and the wall inside the pipe 20, and the first receiving probe 3 receives the first ultrasonic signal, amplifies, filters, integrates, compares and shapes the first ultrasonic signal, and then outputs a first echo signal ECHO1 to the microprocessor 5. The second ultrasonic signal passes through the wall of the pipe 20 and the fluid in the pipe 20, interacts with the fluid and the wall inside the pipe 20, and the second receiving probe 4 receives the second ultrasonic signal, amplifies, filters, integrates, compares and shapes the second ultrasonic signal, and then outputs a second echo signal ECHO2 to the microprocessor 5.

[0083] S130: The microprocessor calculates the flow rate, temperature and bubbles of the fluid.

[0084] Specifically, Figure 1 and Figure 2 As shown, the microprocessor 5 calculates that the time difference between sending the square wave signal TRIG and receiving the first echo signal ECHO1 is t1, and the time difference between sending the square wave signal TRIG and receiving the second echo signal ECHO2 is t2. The flow direction of the fluid in the pipeline 20 is Figure 1 When the direction indicated by the arrow is t2, t2 is greater than t1, and the fluid flow direction in the pipe 20 is the same as Figure 1 When the direction indicated by the arrow is opposite, t2 is less than t1. The microprocessor 5 calculates the transmission time t0 of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipe 20 as:

[0085]

[0086] Wherein, d is the thickness of the tube wall, and c0 is the transmission speed of the first ultrasonic wave and the second ultrasonic wave in the tube wall.

[0087] The microprocessor 5 calculates the flow velocity v of the fluid according to the transmission time t0 of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipe 20, the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2:

[0088]

[0089] Wherein, L is the inner diameter of the pipe 20 .

[0090] The microprocessor 5 can calculate the flow rate of the fluid according to the flow velocity v of the fluid and the cross-sectional area of ​​the pipe 20. The microprocessor 5 also calculates the transmission speed c of the ultrasonic wave in the fluid when the fluid is stationary according to the transmission time t0 of the first ultrasonic signal and the second ultrasonic signal in the pipe wall of the pipe 20, the time difference t1 between sending the square wave signal TRIG and receiving the first echo signal ECHO1, and the time difference t2 between sending the square wave signal TRIG and receiving the second echo signal ECHO2:

[0091]

[0092] The microprocessor 5 combines the relationship between temperature and ultrasonic transmission speed:

[0093] c=1468+3.68*(T-10)-0.0279(T-10) 2

[0094] The microprocessor 5 can calculate the temperature T of the fluid according to the transmission speed c of the ultrasonic wave in the fluid when the fluid is stationary.

[0095] The microprocessor 5 can detect the number of bubbles in the fluid according to the changes in the amplitude and waveform of the received first echo signal ECHO1 and the second echo signal ECHO2.

[0096] An embodiment of the present invention provides an electronic device, Fig. 9A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0097] like Fig. 9 As shown, the electronic device 10 includes at least one microprocessor 5, and a memory connected to the at least one microprocessor 5 in communication, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., and also includes a first transmitting probe 1, a second transmitting probe 2, a first receiving probe 3, and a second receiving probe 4. The first transmitting probe 1, the second transmitting probe 2, the first receiving probe 3, and the second receiving probe 4 are connected to the microprocessor 5 in communication through a bus 14. The first transmitting probe 1 and the second transmitting probe 2 receive the square wave signal sent by the microprocessor 5, and the microprocessor 5 receives the first echo signal and the second echo signal generated by the first receiving probe 3 and the second receiving probe 4. Among them, the memory stores a computer program that can be executed by at least one microprocessor 5, and the microprocessor 5 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The microprocessor 5, the ROM 12, and the RAM 13 are connected to each other through the bus 14. An input / output (I / O) interface 15 is also connected to the bus 14 .

[0098] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0099] The microprocessor 5 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the microprocessor 5 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The microprocessor 5 performs the various methods and processes described above, such as the control method of the ultrasonic sensor.

[0100] In some embodiments, the control method of the ultrasonic sensor may be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the microprocessor 5, one or more steps of the control method of the ultrasonic sensor described above may be performed. Alternatively, in other embodiments, the microprocessor 5 may be configured to execute the control method of the ultrasonic sensor in any other appropriate manner (e.g., by means of firmware).

[0101] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0102] The computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer or other programmable data processing device, so that when the computer programs are executed by the microprocessor 5, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer programs may be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0103] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0104] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0105] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0106] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0107] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0108] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultrasonic sensor, characterized in that: include: A first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe and a microprocessor; The first transmitting probe and the first receiving probe are arranged on both sides of a pipeline through which fluid flows, and the second transmitting probe and the second receiving probe are arranged on both sides of the pipeline, and the first transmitting probe and the second receiving probe are arranged on one side of the pipeline, and the first receiving probe and the second transmitting probe are arranged on the other side of the pipeline, respectively. The first transmitting probe, the second transmitting probe, the first receiving probe and the second receiving probe are all connected to the microprocessor; the microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe, the first transmitting probe is used to generate a first ultrasonic signal according to the square wave signal, and the second transmitting probe is used to generate a second ultrasonic signal according to the square wave signal; the first receiving probe is used to receive the first ultrasonic signal and generate a first echo signal to the microprocessor according to the first ultrasonic signal, and the second receiving probe is used to receive the second ultrasonic signal and generate a second echo signal to the microprocessor according to the second ultrasonic signal; the microprocessor is used to calculate the flow rate, temperature and number of bubbles of the fluid.

2. The ultrasonic sensor according to claim 1, characterized in that: The first transmitting probe comprises: a first inverter, a second inverter, a third inverter, a fourth inverter, a fifth inverter, a first resistor, a second resistor and a first transmitting transducer; The input ends of the first inverter, the second inverter and the third inverter are all connected to the microprocessor, the output end of the first inverter is connected to the input ends of the fourth inverter and the fifth inverter, and the output ends of the fourth inverter and the fifth inverter are all connected to the first electrode of the first transmitting transducer; the first resistor is connected between the first electrode of the first transmitting transducer and a first power supply; The output end of the second inverter and the output end of the third inverter are both connected to the second electrode of the first transmitting transducer, and the second resistor is connected between the second electrode of the first transmitting transducer and the first power supply; the first transmitting transducer is used to transmit the first ultrasonic signal.

3. The ultrasonic sensor according to claim 1, characterized in that: The second transmitting probe comprises: a sixth inverter, a seventh inverter, an eighth inverter, a ninth inverter, a tenth inverter, a third resistor, a fourth resistor and a second transmitting transducer; The input ends of the sixth inverter, the seventh inverter and the eighth inverter are all connected to the microprocessor, the output end of the sixth inverter is connected to the input ends of the ninth inverter and the tenth inverter, and the output ends of the ninth inverter and the tenth inverter are all connected to the first electrode of the second transmitting transducer; the third resistor is connected between the first electrode of the second transmitting transducer and the first power supply; The output end of the seventh inverter and the output end of the eighth inverter are both connected to the second electrode of the second transmitting transducer, and the fourth resistor is connected between the second electrode of the second transmitting transducer and the first power supply; the second transmitting transducer is used to transmit the second ultrasonic signal.

4. The ultrasonic sensor according to claim 1, characterized in that: The first receiving probe includes: a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first receiving chip and a first receiving transducer; The first receiving transducer is used to receive the first ultrasonic signal, the first electrode of the first receiving transducer is connected to the first pin of the first receiving chip, and the second electrode of the first receiving transducer is grounded; the first capacitor is connected between the first pin of the first receiving chip and the ground, and the second capacitor is connected between the sixth pin of the first receiving chip and the ground; the fourth pin of the first receiving chip is grounded; The third capacitor is connected between the third pin of the first receiving chip and ground, the fourth capacitor is connected between the first end of the fifth resistor and ground, and the second end of the fifth resistor is connected to the second pin of the first receiving chip; the sixth resistor is connected between the seventh pin of the first receiving chip and the second power supply, and the seventh resistor is connected between the eighth pin and the fifth pin of the first receiving chip; the seventh pin of the first receiving chip is used to output the first echo signal.

5. The ultrasonic sensor according to claim 4, characterized in that: The first receiving chip includes a CX20106 chip.

6. The ultrasonic sensor according to claim 1, characterized in that: The second receiving probe includes: an eighth resistor, a ninth resistor, a tenth resistor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a second receiving chip and a second receiving transducer; The second receiving transducer is used to receive the second ultrasonic signal, the first electrode of the second receiving transducer is connected to the first pin of the second receiving chip, and the second electrode of the second receiving transducer is grounded; the fifth capacitor is connected between the first pin of the second receiving chip and the ground, and the sixth capacitor is connected between the sixth pin of the second receiving chip and the ground; the fourth pin of the second receiving chip is grounded; The seventh capacitor is connected between the third pin of the second receiving chip and ground, the eighth capacitor is connected between the first end of the eighth resistor and ground, and the second end of the eighth resistor is connected to the second pin of the second receiving chip; the ninth resistor is connected between the seventh pin of the second receiving chip and the second power supply, and the tenth resistor is connected between the eighth pin and the fifth pin of the second receiving chip; the seventh pin of the second receiving chip is used to output the second echo signal.

7. The ultrasonic sensor according to claim 6, characterized in that: The second receiving chip includes a CX20106 chip.

8. The ultrasonic sensor according to claim 1, characterized in that: Also includes: Display device; The display device is connected to the microprocessor, and is used to display the data of flow rate, temperature and bubble quantity of the fluid calculated by the microprocessor.

9. A control method for an ultrasonic sensor, characterized in that: The control method is applied to the ultrasonic sensor, which includes a first transmitting probe, a second transmitting probe, a first receiving probe, a second receiving probe and a microprocessor; the first transmitting probe and the first receiving probe are tilted and relatively arranged on both sides of a pipeline through which a fluid flows, and the second transmitting probe and the second receiving probe are tilted and relatively arranged on both sides of the pipeline; the first transmitting probe and the second receiving probe are spaced apart and located on one side of the pipeline, and the first receiving probe and the second transmitting probe are spaced apart and located on the other side of the pipeline; the first transmitting probe, the second transmitting probe, the first receiving probe and the second receiving probe are all connected to the microprocessor; The control method comprises: The microprocessor sends a square wave signal to the first transmitting probe and the second transmitting probe; The first transmitting probe generates a first ultrasonic signal according to the square wave signal, and the second transmitting probe generates a second ultrasonic signal according to the square wave signal; The first receiving probe receives the first ultrasonic signal, and generates a first echo signal to the microprocessor according to the first ultrasonic signal, and the second receiving probe receives the second ultrasonic signal, and generates a second echo signal to the microprocessor according to the second ultrasonic signal; The microprocessor calculates the flow rate, temperature and number of bubbles of the fluid.

10. An electronic device, characterized in that: The ultrasonic sensor comprises the ultrasonic sensor according to any one of claims 1 to 8.

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