A circuit board failure diagnosis system and method

Abstract

The application specifically relates to a circuit board fault diagnosis system, comprising a temperature acquisition module, a data processing module and a fault mode library of various types of circuit boards; the temperature acquisition module is used for collecting thermal radiation signals and visible light signals of the circuit board, converting the thermal radiation signals of the circuit board into temperature distribution dot array data, and sending the temperature distribution dot array data and the visible light signals of the circuit board to the data processing module; the data processing module is used for analyzing the received visible light signals of the circuit board, completing identification of the type of the circuit board, processing the received temperature distribution dot array data of the circuit board and completing fault diagnosis of the circuit board; the application also relates to a circuit board fault diagnosis method; the collected thermal radiation signals of the circuit board are processed and analyzed, comprehensive, efficient and accurate diagnosis of the circuit board fault is realized, and the application has strong popularization and universality.

Description

Technical Field

[0001] This invention relates to the field of circuit board condition detection technology, and in particular to a circuit board fault diagnosis system and method. Background Technology

[0002] Circuit boards are core components inside electronic and electrical devices. Whether they function properly directly affects the function and performance of the device. Therefore, fault diagnosis of circuit boards is a key step in equipment maintenance.

[0003] Using thermal imagers to collect thermal radiation signals from circuit boards for fault diagnosis is increasingly being applied in engineering practice. This method mainly has the following advantages:

[0004] 1. A non-contact testing method is adopted, avoiding damage to the circuit board caused by direct contact;

[0005] 2. Circuit board fault diagnosis can be completed without being familiar with the working principle of the circuit board, which reduces the professional technical requirements for maintenance personnel.

[0006] Currently, common methods for diagnosing circuit board faults using thermal radiation or infrared signals mainly involve temperature detection of specific components on the circuit board. By setting appropriate temperature thresholds or algorithms, the functionality of these components is determined. However, this method has the following main problems:

[0007] 1. There are many types of circuit boards on the market, and the number of components on the circuit boards is large. If the fault diagnosis of the circuit board is carried out by temperature detection of each component, the workload is huge and the scalability and universality are very poor.

[0008] 2. Typically, when a single component on a circuit board malfunctions, it will affect its associated upstream circuits, downstream circuits, power supplies, and other circuits, causing abnormalities in the components within those circuits. In such cases, analyzing only a single component will result in low efficiency and accuracy in diagnosing circuit board faults.

[0009] Based on the above problems, it is essential to develop a circuit board fault diagnosis technology that can achieve comprehensive, efficient, and accurate diagnosis of circuit board faults, and has strong scalability and versatility. Summary of the Invention

[0010] The purpose of this invention is to provide a circuit board fault diagnosis system and method, which can achieve comprehensive, efficient and accurate fault diagnosis of circuit boards by processing and analyzing the collected thermal radiation signals of circuit boards, and has strong scalability and versatility.

[0011] To achieve the above objectives, the present invention provides a circuit board fault diagnosis system, comprising:

[0012] The temperature acquisition module is used to acquire the thermal radiation signal and visible light signal of the circuit board; convert the thermal radiation signal of the circuit board into temperature distribution matrix data; and send the temperature distribution matrix data and visible light signal of the circuit board to the data processing module.

[0013] The data processing module is equipped with a fault mode library for various circuit board models. It is used to analyze the visible light signals of the received circuit boards to identify the circuit board model; and to process the temperature distribution matrix data of the received circuit boards to diagnose the circuit board faults.

[0014] In this invention, the temperature acquisition module includes:

[0015] Infrared detectors are used to collect thermal radiation signals from circuit boards, convert the thermal radiation signals from the circuit board into analog signals, and send them to the signal processing module.

[0016] A visible light camera is used to collect visible light signals from the circuit board and send them to the data processing module.

[0017] The signal processing module, connected to the data processing module via a data bus, is used to convert the received thermal radiation signal from the circuit board into temperature distribution matrix data and send it to the data processing module via the data bus.

[0018] In this invention, the data processing module processes the received temperature distribution matrix data of the circuit board and completes the fault diagnosis of the circuit board, including the following steps:

[0019] Step 1: Divide the temperature distribution matrix data of the circuit board into multiple first temperature analysis units, including the following steps:

[0020] The temperature distribution matrix data of the circuit board is uniformly divided into n parts along the horizontal axis and m parts along the vertical axis, so that the temperature distribution matrix data of the circuit board is divided into the first square array data composed of n×m square data; n and m are both natural numbers.

[0021] Each block of data in the first block array is encoded according to its row and column numbers and used as a first temperature analysis unit;

[0022] Step 2: Based on the first temperature information in each first temperature analysis unit, calculate the first temperature feature vector matrix of the circuit board, including the following steps:

[0023] Collect each piece of first temperature information from each first temperature analysis unit; the first temperature information includes temperature value, temperature rise value, and temperature rise rate;

[0024] Calculate the average, maximum, and minimum values ​​corresponding to each piece of first temperature information in each first temperature analysis unit to form the first temperature characteristic value of each first temperature analysis unit;

[0025] The first temperature feature values ​​of each first temperature analysis unit are saved in the form of a vector matrix to form the first temperature feature vector matrix of the circuit board.

[0026] Step 3: Call the fault mode library of the circuit board model according to the circuit board model. The fault mode library of the circuit board model contains the second temperature feature vector matrix of each fault mode of the circuit board model.

[0027] The first temperature feature vector matrix is ​​matched with each of the second temperature feature vector matrices to determine the similarity, and the second temperature feature vector matrix with the highest matching degree with the first temperature feature vector matrix is ​​selected.

[0028] The fault mode corresponding to the second temperature eigenvector matrix that has the highest matching degree with the first temperature eigenvector matrix is ​​taken as the fault mode of the circuit board.

[0029] In this invention, the first temperature feature vector matrix and the second temperature characteristic vector are matched for similarity using a cosine similarity algorithm. The formula for the cosine similarity algorithm is as follows:

[0030]

[0031] Among them, a i Let b be the i-th element in the first temperature vector matrix. i Let θ be the i-th element in the second temperature vector matrix; cos(θ) is the cosine angle between the first and second temperature vector matrices; the closer cos(θ) is to 1, the higher the similarity between the first and second temperature vector matrices.

[0032] In this invention, the fault mode library for a circuit board model contains the second temperature feature vector matrix of each fault mode of that model circuit board; the second temperature feature vector matrix of a circuit board of a certain model and a fault mode is obtained through the following steps:

[0033] The temperature acquisition module acquires the thermal radiation signal of the circuit board of this model and fault mode; converts the thermal radiation signal of the circuit board of this model and fault mode into temperature distribution matrix data and sends it to the data processing module.

[0034] The data processing module processes the received temperature distribution matrix data of the circuit board of this model and fault mode to form the second temperature feature vector matrix of the circuit board of this model and fault mode.

[0035] In this invention, the data processing module processes the received temperature distribution matrix data of a circuit board of a certain model and a certain fault mode to form a second temperature feature vector matrix of the circuit board of that model and the fault mode, including the following steps:

[0036] Step 1: Divide the temperature distribution matrix data of this model of circuit board with this fault mode into multiple second temperature analysis units, including the following steps:

[0037] The temperature distribution matrix data of the circuit board of this model and this failure mode is uniformly divided into n parts along the horizontal axis and m parts along the vertical axis. The temperature distribution matrix data of the circuit board of this model and this failure mode is then divided into a second block array data consisting of n×m block data; n and m are both natural numbers.

[0038] Each block of data in the second block array is encoded according to its row and column numbers and used as a second temperature analysis unit;

[0039] Step 2: Based on the second temperature information in each second temperature analysis unit, calculate the second temperature feature vector matrix of this type of circuit board with this fault mode, including the following steps:

[0040] Collect each piece of second temperature information from each second temperature analysis unit; the second temperature information includes temperature value, temperature rise value, and temperature rise rate;

[0041] Calculate the average, maximum, and minimum values ​​corresponding to each piece of second temperature information in each second temperature analysis unit to form the second temperature characteristic value of each second temperature analysis unit;

[0042] The second temperature feature values ​​of each second temperature analysis unit are saved in the form of a vector matrix to form the second temperature feature vector matrix of the circuit board of this model and this fault mode.

[0043] In this invention, the data processing module also includes a normal mode library for each type of circuit board; the normal mode library for a type of circuit board contains the third temperature feature vector matrix of the normal mode circuit board of that type.

[0044] The circuit board fault diagnosis system also includes a display module; the display module is used to display the fault mode of the circuit board and the first temperature characteristic value of each first temperature analysis unit of the circuit board; the first temperature analysis unit with a first abnormality of the first temperature characteristic value is highlighted with a first color, and the first temperature analysis unit with a second abnormality of the first temperature characteristic value is highlighted with a second color.

[0045] The data processing module is also used to compare the first temperature feature vector matrix of the circuit board with the third temperature feature vector matrix of the corresponding model normal mode circuit board; when the difference between the elements of the first temperature feature vector matrix and the corresponding elements of the third temperature feature vector matrix exceeds a set upper limit value, it is determined that the first temperature feature value of the first temperature analysis unit of the circuit board is first abnormal; when the difference between the elements of the first temperature feature vector matrix and the corresponding elements of the third temperature feature vector matrix exceeds a set lower limit value, it is determined that the first temperature feature value of the first temperature analysis unit of the circuit board is second abnormal.

[0046] In this invention, the third temperature feature vector matrix of a normal mode circuit board of a certain model is obtained through the following steps:

[0047] The temperature acquisition module acquires the thermal radiation signal of the circuit board in normal mode of this model; converts the thermal radiation signal of the circuit board in normal mode of this model into temperature distribution matrix data and sends it to the data processing module.

[0048] The data processing module processes the received temperature distribution matrix data of the normal mode circuit board of this model to form the third temperature feature vector matrix of the normal mode circuit board of this model.

[0049] In this invention, the data processing module processes the received temperature distribution matrix data of a normal mode circuit board of a certain model to form the third temperature feature vector matrix of the normal mode circuit board of that model, including the following steps:

[0050] Step 1: Divide the temperature distribution matrix data of the normal mode circuit board of this model into multiple third temperature analysis units, including the following steps:

[0051] The temperature distribution matrix data of the normal mode circuit board of this model is uniformly divided into n parts along the horizontal axis and m parts along the vertical axis. The temperature distribution matrix data of the normal mode circuit board of this model is then divided into a third block array data consisting of n×m square data; n and m are both natural numbers.

[0052] Each block of data in the third-party block array is encoded according to its row and column numbers and used as a third temperature analysis unit;

[0053] Step 2: Based on the third temperature information in each third temperature analysis unit, calculate the third temperature feature vector matrix of the normal mode circuit board of this model, including the following steps:

[0054] Collect each third temperature information from each third temperature analysis unit; the third temperature information includes temperature value, temperature rise value, and temperature rise rate;

[0055] Calculate the average, maximum, and minimum values ​​corresponding to each third temperature information in each third temperature analysis unit to form the third temperature characteristic value of each third temperature analysis unit;

[0056] The third temperature feature values ​​of each third temperature analysis unit are saved in the form of a vector matrix to form the third temperature feature vector matrix of the normal mode circuit board of this model.

[0057] In this invention, the temperature acquisition module is also used to acquire visible light signals of various circuit boards and send them to the data processing module;

[0058] The data processing module is also used to save the visible light signals received from various types of circuit boards;

[0059] The data processing module analyzes the visible light signal received from the circuit board to identify the circuit board model, including the following steps:

[0060] The visible light signal of the circuit board is matched with the visible light signals of various circuit board models, and the model corresponding to the matched visible light signal is the model of the circuit board.

[0061] To achieve the above objectives, the present invention also provides a circuit board fault diagnosis method, which, using the above-described circuit board fault diagnosis system, includes the following steps:

[0062] S1. System Self-Check: After the system is powered on, the status of each module inside the system is checked; if the status is normal, the system proceeds to the next step of the workflow; if an abnormality occurs, the system stops working and issues an alarm.

[0063] S2, System Startup: All modules within the system are now operational.

[0064] S3, Data Acquisition: The temperature acquisition module acquires the thermal radiation signal and visible light signal of the circuit board; converts the thermal radiation signal of the circuit board into temperature distribution matrix data; and sends the temperature distribution matrix data and visible light signal of the circuit board to the data processing module.

[0065] S4. Data Processing: The data processing module analyzes the visible light signal received from the circuit board to identify the circuit board model; processes the temperature distribution matrix data of the received circuit board and completes the fault diagnosis of the circuit board; and determines the first temperature analysis unit that the circuit board has an abnormal first temperature characteristic value.

[0066] S5. Data display: The display module displays the fault mode of the circuit board and the first temperature characteristic value of each first temperature analysis unit of the circuit board; the first temperature analysis unit with abnormal first temperature characteristic value is highlighted in color.

[0067] S6. Determine whether it is necessary to continue the circuit board temperature acquisition and analysis. If so, return to S3; otherwise, end the process.

[0068] Beneficial technical effects of the present invention:

[0069] The circuit board fault diagnosis system and method of this invention extracts the global temperature characteristics of different circuit board models, and uses quantitative modeling and analysis of the temperature characteristics of different circuit board models to reduce the concept of components, making it highly scalable and universal. By dividing the temperature distribution of the circuit board into sections, typical temperature characteristics are screened, atypical temperature characteristics are eliminated, and unnecessary information is filtered out, improving the efficiency and accuracy of data analysis. The system directly locates the fault mode of the circuit board, greatly improving the efficiency of circuit board repair. The system intuitively displays the global temperature characteristics of the circuit board and marks abnormal temperature areas, helping staff to intuitively understand the status of the circuit board. Attached Figure Description

[0070] Figure 1 This is a schematic diagram of a structure of an embodiment of the circuit board fault diagnosis system of the present invention;

[0071] Figure 2 A schematic diagram showing the normal temperature characteristics of the circuit board temperature analysis unit.

[0072] Figure 3 A schematic diagram illustrating abnormal temperature characteristics of a circuit board temperature analysis unit.

[0073] Figure 4 This is a flowchart illustrating an embodiment of the circuit board fault diagnosis system of the present invention. Detailed Implementation

[0074] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the specification, claims, and foregoing drawings are intended to cover non-exclusive inclusion. The terms "first," "second," "third," etc., in the specification, claims, or foregoing drawings are used to distinguish different objects and not to describe a particular order.

[0075] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0076] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings and specific embodiments.

[0077] refer to Figure 1 The diagram illustrates a structural schematic of an embodiment of a circuit board fault diagnosis system, which includes:

[0078] The temperature acquisition module is used to acquire the thermal radiation signal and visible light signal of the circuit board; convert the thermal radiation signal of the circuit board into temperature distribution matrix data; and send the temperature distribution matrix data and visible light signal of the circuit board to the data processing module.

[0079] The data processing module is equipped with a fault mode library for various circuit board models. It is used to analyze the visible light signals of the received circuit boards to identify the circuit board model; and to process the temperature distribution matrix data of the received circuit boards to diagnose the circuit board faults.

[0080] In this embodiment, the temperature acquisition module includes:

[0081] Infrared detectors are used to collect thermal radiation signals from circuit boards, convert the thermal radiation signals from the circuit board into analog signals, and send them to the signal processing module.

[0082] A visible light camera is used to collect visible light signals from the circuit board and send them to the data processing module.

[0083] The signal processing module, connected to the data processing module via a data bus, is used to convert the received thermal radiation signal from the circuit board into temperature distribution matrix data and send it to the data processing module via the data bus.

[0084] The data processing module receives a large amount of temperature distribution dot matrix data from the circuit board, with a resolution of 640*480. The calculated number of temperature pixels is 307,200, and the pixel size is 17 micrometers. In this embodiment, the data processing module processes the received temperature distribution dot matrix data from the circuit board and completes fault diagnosis of the circuit board, including the following steps:

[0085] Step 1: Divide the temperature distribution matrix data of the circuit board into multiple first temperature analysis units, including the following steps:

[0086] The temperature distribution matrix data of the circuit board is uniformly divided into 10 parts along the horizontal axis, and each row is named according to the Arabic numerals 1-10; it is also uniformly divided into 10 parts along the vertical axis, and each column is named according to the English letters AJ; finally, the temperature distribution matrix data of the circuit board is divided into the first block array data composed of 10×10 square data.

[0087] Each block of data in the first block array is encoded according to its row and column numbers and used as a first temperature analysis unit; each first temperature analysis unit contains multiple temperature pixels.

[0088] Step 2: Based on the first temperature information in each first temperature analysis unit, calculate the first temperature feature vector matrix of the circuit board, including the following steps:

[0089] Collect each piece of first temperature information from each first temperature analysis unit; the first temperature information includes temperature value, temperature rise value, and temperature rise rate;

[0090] Calculate the average, maximum, and minimum values ​​corresponding to each piece of first temperature information in each first temperature analysis unit to form the first temperature characteristic value of each first temperature analysis unit;

[0091] The first temperature feature values ​​of each first temperature analysis unit are saved in the form of a vector matrix to form the first temperature feature vector matrix of the circuit board.

[0092] Step 3: Call the fault mode library of the circuit board model according to the circuit board model. The fault mode library of the circuit board model contains the second temperature feature vector matrix of each fault mode of the circuit board model.

[0093] The first temperature feature vector matrix is ​​matched with each of the second temperature feature vector matrices to determine the similarity, and the second temperature feature vector matrix with the highest matching degree with the first temperature feature vector matrix is ​​selected.

[0094] The fault mode corresponding to the second temperature eigenvector matrix that has the highest matching degree with the first temperature eigenvector matrix is ​​taken as the fault mode of the circuit board.

[0095] In this embodiment, the first temperature feature vector matrix and the second temperature characteristic vector are matched using a cosine similarity algorithm. The formula for the cosine similarity algorithm is as follows:

[0096]

[0097] Among them, a i Let b be the i-th element in the first temperature vector matrix.i Let θ be the i-th element in the second temperature vector matrix; cos(θ) is the cosine angle between the first and second temperature vector matrices; the closer cos(θ) is to 1, the higher the similarity between the first and second temperature vector matrices.

[0098] In this embodiment, the fault mode library of a circuit board model contains the second temperature feature vector matrix of each fault mode of the circuit board model; the second temperature feature vector matrix of a circuit board model with a fault mode is obtained through the following steps:

[0099] The temperature acquisition module acquires the thermal radiation signal of the circuit board of this model and fault mode; converts the thermal radiation signal of the circuit board of this model and fault mode into temperature distribution matrix data and sends it to the data processing module.

[0100] The data processing module processes the received temperature distribution matrix data of the circuit board of this model and fault mode to form the second temperature feature vector matrix of the circuit board of this model and fault mode.

[0101] In this embodiment, the infrared detector collects the thermal radiation signal of a circuit board of one model and one fault mode at a time, converts the thermal radiation signal of the circuit board of one model and one fault mode from an image into an analog signal, and sends it to the signal processing module.

[0102] The signal processing module converts the received thermal radiation signal of the circuit board of this model and fault mode into temperature distribution matrix data and sends it to the data processing module through the data bus.

[0103] The data processing module processes the received temperature distribution matrix data of the circuit board of this model and fault mode to form the second temperature feature vector matrix of the circuit board of this model and fault mode.

[0104] In this embodiment, the data processing module processes the received temperature distribution matrix data of a circuit board of a certain model and a certain fault mode to form a second temperature feature vector matrix of the circuit board of that model and the fault mode, including the following steps:

[0105] Step 1: Divide the temperature distribution matrix data of this model of circuit board with this fault mode into multiple second temperature analysis units, including the following steps:

[0106] The temperature distribution matrix data of the circuit board of this model and this failure mode is evenly divided into 10 parts along the horizontal axis, and each row is named according to the Arabic numerals 1-10; it is also evenly divided into 10 parts along the vertical axis, and each column is named according to the English letters AJ; finally, the temperature distribution matrix data of the circuit board of this model and this failure mode is divided into a second block array data composed of 10×10 square data.

[0107] Each block of data in the second block array is encoded according to its row and column numbers and used as a second temperature analysis unit;

[0108] Step 2: Based on the second temperature information in each second temperature analysis unit, calculate the second temperature feature vector matrix of this type of circuit board with this fault mode, including the following steps:

[0109] Collect each piece of second temperature information from each second temperature analysis unit; the second temperature information includes temperature value, temperature rise value, and temperature rise rate;

[0110] Calculate the average, maximum, and minimum values ​​corresponding to each piece of second temperature information in each second temperature analysis unit to form the second temperature characteristic value of each second temperature analysis unit;

[0111] The second temperature feature values ​​of each second temperature analysis unit are saved in the form of a vector matrix to form the second temperature feature vector matrix of the circuit board of this model and this fault mode.

[0112] In this embodiment, the data processing module is also provided with a normal mode library for each type of circuit board; the normal mode library for a type of circuit board contains the third temperature feature vector matrix of the normal mode circuit board of that type.

[0113] The circuit board fault diagnosis system also includes a display module; the display module is used to display the fault mode of the circuit board and the first temperature characteristic value of each first temperature analysis unit of the circuit board; the first temperature analysis unit with a first abnormality of the first temperature characteristic value is highlighted with a first color, and the first temperature analysis unit with a second abnormality of the first temperature characteristic value is highlighted with a second color.

[0114] The data processing module is also used to compare the first temperature feature vector matrix of the circuit board with the third temperature feature vector matrix of the corresponding model normal mode circuit board; when the difference between the elements of the first temperature feature vector matrix and the corresponding elements of the third temperature feature vector matrix exceeds a set upper limit value, it is determined that the first temperature feature value of the first temperature analysis unit of the circuit board is first abnormal; when the difference between the elements of the first temperature feature vector matrix and the corresponding elements of the third temperature feature vector matrix exceeds a set lower limit value, it is determined that the first temperature feature value of the first temperature analysis unit of the circuit board is second abnormal.

[0115] like Figure 2 As shown, the first row displays the maximum temperature value within the first temperature analysis unit of the circuit board, and the second row displays the maximum temperature rise value within the first temperature analysis unit of the circuit board; for example... Figure 3 As shown, the temperature value of temperature analysis unit 7F is significantly higher than normal, so this analysis unit is highlighted in red; the temperature value of temperature analysis unit 5E is significantly lower than normal, so this analysis unit is highlighted in yellow.

[0116] In this embodiment, the third temperature feature vector matrix of a normal mode circuit board of a certain model is obtained through the following steps:

[0117] The temperature acquisition module acquires the thermal radiation signal of the circuit board in normal mode of this model; converts the thermal radiation signal of the circuit board in normal mode of this model into temperature distribution matrix data and sends it to the data processing module.

[0118] The data processing module processes the received temperature distribution matrix data of the normal mode circuit board of this model to form the third temperature feature vector matrix of the normal mode circuit board of this model.

[0119] In this embodiment, the infrared detector collects the thermal radiation signal of a normal mode circuit board of one model at a time, converts the thermal radiation signal of the normal mode circuit board of one model from an image into an analog signal, and sends it to the signal processing module.

[0120] The signal processing module converts the received thermal radiation signal from the normal mode circuit board of this model into temperature distribution matrix data and sends it to the data processing module via the data bus.

[0121] The data processing module processes the received temperature distribution matrix data of the normal mode circuit board of this model to form the third temperature feature vector matrix of the normal mode circuit board of this model.

[0122] In this embodiment, the data processing module processes the received temperature distribution matrix data of a normal mode circuit board of a certain model to form the third temperature feature vector matrix of the normal mode circuit board of that model, including the following steps:

[0123] Step 1: Divide the temperature distribution matrix data of the normal mode circuit board of this model into multiple third temperature analysis units, including the following steps:

[0124] The temperature distribution matrix data of the normal mode circuit board of this model is uniformly divided into 10 parts along the horizontal axis, and each row is named according to the Arabic numerals 1-10; it is also uniformly divided into 10 parts along the vertical axis, and each column is named according to the English letters AJ; finally, the temperature distribution matrix data of the normal mode circuit board of this model is divided into a third-party block array data composed of 10×10 square data.

[0125] Each block of data in the third-party block array is encoded according to its row and column numbers and used as a third temperature analysis unit;

[0126] Step 2: Based on the third temperature information in each third temperature analysis unit, calculate the third temperature feature vector matrix of the normal mode circuit board of this model, including the following steps:

[0127] Collect each third temperature information from each third temperature analysis unit; the third temperature information includes temperature value, temperature rise value, and temperature rise rate;

[0128] Calculate the average, maximum, and minimum values ​​corresponding to each third temperature information in each third temperature analysis unit to form the third temperature characteristic value of each third temperature analysis unit;

[0129] The third temperature feature values ​​of each third temperature analysis unit are saved in the form of a vector matrix to form the third temperature feature vector matrix of the normal mode circuit board of this model.

[0130] In this embodiment, the temperature acquisition module is also used to acquire visible light signals of various circuit boards and send them to the data processing module;

[0131] The data processing module is also used to save the visible light signals received from various types of circuit boards;

[0132] The data processing module analyzes the visible light signal received from the circuit board to identify the circuit board model, including the following steps:

[0133] The visible light signal of the circuit board is matched with the visible light signals of various circuit board models, and the model corresponding to the matched visible light signal is the model of the circuit board.

[0134] See Figure 4 The present invention also provides a circuit board fault diagnosis method, which, using the above-mentioned circuit board fault diagnosis system, includes the following steps:

[0135] S1. System Self-Check: After the system is powered on, the status of each module inside the system is checked; if the status is normal, the system proceeds to the next step of the workflow; if an abnormality occurs, the system stops working and issues an alarm.

[0136] S2, System Startup: All modules within the system are now operational.

[0137] S3, Data Acquisition: The temperature acquisition module acquires the thermal radiation signal and visible light signal of the circuit board; converts the thermal radiation signal of the circuit board into temperature distribution matrix data; and sends the temperature distribution matrix data and visible light signal of the circuit board to the data processing module.

[0138] S4. Data Processing: The data processing module analyzes the visible light signal received from the circuit board to identify the circuit board model; processes the temperature distribution matrix data of the received circuit board and completes the fault diagnosis of the circuit board; and determines the first temperature analysis unit that the circuit board has an abnormal first temperature characteristic value.

[0139] S5. Data display: The display module displays the fault mode of the circuit board and the first temperature characteristic value of each first temperature analysis unit of the circuit board; the first temperature analysis unit with abnormal first temperature characteristic value is highlighted in color.

[0140] S6. Determine whether it is necessary to continue the circuit board temperature acquisition and analysis. If so, return to S3; otherwise, end the process.

[0141] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A circuit board fault diagnosis system, characterized in that, include: Temperature acquisition module is used to acquire thermal radiation signals and visible light signals from the circuit board; The thermal radiation signal of the circuit board is converted into temperature distribution matrix data; the temperature distribution matrix data of the circuit board and the visible light signal are sent to the data processing module. The data processing module contains a fault mode library for various circuit board models. It analyzes the visible light signals from the received circuit boards to identify their model. It also processes the received temperature distribution matrix data of the circuit boards to diagnose faults, including the following steps: The temperature distribution matrix data of the circuit board is uniformly divided into n parts along the horizontal axis and m parts along the vertical axis to form n×m temperature analysis units, each of which contains multiple temperature pixels. Based on the temperature information in each temperature analysis unit, calculate the temperature characteristic value of each temperature analysis unit; The temperature feature values ​​of each temperature analysis unit are arranged in a matrix to form the first temperature feature vector matrix of the circuit board. Based on the circuit board model, the corresponding fault mode library is called, and the first temperature feature vector matrix is ​​matched with the second temperature feature vector matrix of each fault mode pre-stored in the fault mode library. The fault mode of the circuit board is determined based on the matching result.

2. The circuit board fault diagnosis system according to claim 1, characterized in that, The temperature acquisition module includes: Infrared detectors are used to collect thermal radiation signals from circuit boards, convert the thermal radiation signals from the circuit board into analog signals, and send them to the signal processing module. A visible light camera is used to collect visible light signals from the circuit board and send them to the data processing module. The signal processing module, connected to the data processing module via a data bus, is used to convert the received thermal radiation signal from the circuit board into temperature distribution matrix data and send it to the data processing module via the data bus.

3. The circuit board fault diagnosis system according to claim 1, characterized in that, The first temperature feature vector matrix and the second temperature characteristic vector are matched using a cosine similarity algorithm. The formula for the cosine similarity algorithm is as follows: ;in, The first temperature vector matrix is ​​the first... i One element, The second temperature vector matrix is ​​the first i One element; The cosine angle between the first temperature vector matrix and the second temperature vector matrix; The closer the value is to 1, the higher the similarity between the first temperature vector matrix and the second temperature vector matrix.

4. The circuit board fault diagnosis system according to claim 1, characterized in that, The fault mode library for a circuit board model contains the second temperature feature vector matrix of each fault mode of that model circuit board; the second temperature feature vector matrix of a circuit board model with a single fault mode is obtained through the following steps: The temperature acquisition module acquires the thermal radiation signal of the circuit board of this model and fault mode; converts the thermal radiation signal of the circuit board of this model and fault mode into temperature distribution matrix data and sends it to the data processing module. The data processing module processes the received temperature distribution matrix data of the circuit board of this model and fault mode to form the second temperature feature vector matrix of the circuit board of this model and fault mode.

5. The circuit board fault diagnosis system according to claim 1, characterized in that, The data processing module also includes a normal mode library for each type of circuit board; the normal mode library for a type of circuit board contains the third temperature feature vector matrix of the normal mode circuit board for that type of circuit board. The circuit board fault diagnosis system also includes a display module; the display module is used to display the fault mode of the circuit board and the first temperature characteristic value of each first temperature analysis unit of the circuit board; the first temperature analysis unit with abnormal first temperature characteristic value is highlighted. The data processing module is also used to compare the first temperature feature vector matrix of the circuit board with the third temperature feature vector matrix of the corresponding model normal mode circuit board; when the difference between the elements of the first temperature feature vector matrix and the corresponding elements of the third temperature feature vector matrix exceeds the set value, it is determined that the first temperature feature value of the first temperature analysis unit of the circuit board is abnormal.

6. The circuit board fault diagnosis system according to claim 5, characterized in that, The third temperature eigenvector matrix of a circuit board in normal mode is obtained through the following steps: The temperature acquisition module acquires the thermal radiation signal of the circuit board in normal mode of this model; converts the thermal radiation signal of the circuit board in normal mode of this model into temperature distribution matrix data and sends it to the data processing module. The data processing module processes the received temperature distribution matrix data of the normal mode circuit board of this model to form the third temperature feature vector matrix of the normal mode circuit board of this model.

7. The circuit board fault diagnosis system according to claim 6, characterized in that, The data processing module processes the received temperature distribution matrix data of a circuit board of a specific model and fault mode to form a second temperature feature vector matrix for that circuit board. This process includes the following steps: The temperature distribution matrix data of the circuit board of this model and this fault mode is cut into multiple second temperature analysis units; Based on the second temperature information in each second temperature analysis unit, calculate the second temperature feature vector matrix of the circuit board of this model and this fault mode. The data processing module processes the received temperature distribution matrix data of a normal mode circuit board of a certain model to form the third temperature feature vector matrix of that normal mode circuit board, including the following steps: The temperature distribution matrix data of the normal mode circuit board of this model is cut into multiple third temperature analysis units; Based on the third temperature information in each third temperature analysis unit, calculate the third temperature feature vector matrix of the normal mode circuit board of this model.

8. The circuit board fault diagnosis system according to claim 1, characterized in that, The temperature acquisition module is also used to acquire visible light signals from various circuit boards and send them to the data processing module. The data processing module is also used to save the visible light signals received from various types of circuit boards; The data processing module analyzes the visible light signal received from the circuit board to identify the circuit board model, including the following steps: The visible light signal of the circuit board is matched with the visible light signals of various circuit board models, and the model corresponding to the matched visible light signal is the model of the circuit board.

9. A method for diagnosing circuit board faults, characterized in that, Using the circuit board fault diagnosis system according to any one of claims 1-8 includes the following steps: S1. System Self-Check: After the system is powered on, the status of each module inside the system is checked; if the status is normal, the system proceeds to the next step of the workflow; if an abnormality occurs, the system stops working and issues an alarm. S2, System Startup: All modules within the system are now operational. S3, Data Acquisition: The temperature acquisition module acquires the thermal radiation signal and visible light signal of the circuit board; converts the thermal radiation signal of the circuit board into temperature distribution matrix data; and sends the temperature distribution matrix data and visible light signal of the circuit board to the data processing module. S4. Data Processing: The data processing module analyzes the visible light signal received from the circuit board to identify the circuit board model; processes the temperature distribution matrix data of the received circuit board and completes the fault diagnosis of the circuit board; and determines the first temperature analysis unit that the circuit board has an abnormal first temperature characteristic value. S5. Data display: The display module displays the fault mode of the circuit board and the first temperature characteristic value of each first temperature analysis unit of the circuit board; The first temperature analysis unit with an abnormal first temperature characteristic value is highlighted in color. S6. Determine whether it is necessary to continue the circuit board temperature acquisition and analysis. If so, return to S3; otherwise, end the process.

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