Chip test fixture

Abstract

The present invention discloses a chip testing fixture, which includes a PCB board, a base, a turntable and a pressing plate. The base is arranged on the PCB board, and the base is provided with a mounting groove, a positioning hole, a conductive contact block and a first buckle structure. The mounting groove is used for mounting the chip. The provided mounting groove facilitates the quick and accurate installation of the chip in place. The cooperation of the turntable and several pressing plates enables the pressing plate to press different specifications of chips, facilitating the operator to quickly replace the pressing plate for the chip and test the chip. The provided pressing plates are evenly distributed along the circumferential direction of the turntable, which is convenient for switching the pressing plates when testing the chip. The provided elastic contact pins ensure reliable contact with the conductive contact blocks, reduce the error in the testing process, and also enable the elastic contact pins to be inserted into the positioning holes to facilitate the fixation of the turntable and also facilitate the provision of in-place perception. Due to the high efficiency and versatility of the entire fixture, the demand for testing fixtures for different types of chips can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and particularly relates to a chip test fixture. Background Art

[0002] A chip test fixture is a special device used to test the performance and functions of semiconductor chips, ensuring that the chips meet the design standards during the manufacturing process.

[0003] Existing chip test fixtures can usually only test single-type chips. When replacing chips, it is necessary to readjust or replace the fixture, resulting in low efficiency. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a chip test fixture, which can improve the test efficiency.

[0005] A chip test fixture according to an embodiment of the present invention includes a PCB board, a base, a turntable, and a pressing plate. The base is disposed on the PCB board. An installation groove, positioning holes, conductive contact blocks, and a first snap structure are provided on the base. The installation groove is used for installing a chip. A plurality of positioning holes are provided. The conductive contact blocks are disposed in the positioning holes and are arranged in one-to-one correspondence with the positioning holes. One end of each conductive contact block is electrically connected to the PCB board, and the other end of the conductive contact block is lower than the positioning hole. The turntable is rotatably connected to the base. A plurality of groups of elastic contact pins are provided at one end of the turntable close to the base. Each group of elastic contact pins includes a plurality of elastic contact pins. The elastic contact pins are used to insert into the positioning holes to contact the other ends of the conductive contact blocks. A plurality of pressing plates are provided. The pressing plates are hinged to the turntable. The plurality of pressing plates are evenly distributed along the circumferential direction of the turntable. A second snap structure is provided at one end of the pressing plate away from the turntable. The second snap structure is used for snap connection with the first snap structure. A plurality of contact feet are provided on the surface of the pressing plate for contacting the chip. One end of each contact foot is used to electrically connect to the elastic contact pin, and the other end of the contact foot is used to contact the contact points on the chip.

[0006] At least the following beneficial effects are achieved: the provided mounting groove facilitates quick and accurate installation of the chip; the cooperation between the turntable and the plurality of pressure plates enables the pressure plates to press-connect chips of different specifications, making it convenient for operators to quickly replace the pressure plates for the chips and test the chips; the provided pressure plates are evenly distributed along the circumference of the turntable, making it convenient to switch the pressure plates when testing the chips; because the pressure plates mainly serve to electrically connect the chips, different chips can be tested by switching different pressure plates; the provided elastic contact pins ensure reliable contact with the conductive contact blocks, reducing errors during the test process; and enable the elastic contact pins to be inserted into the positioning holes for easy fixation of the turntable and for providing in-place sensing; due to the efficiency and versatility of the entire jig, the demand for different types of chip testing jigs can be reduced, thereby reducing production costs, eliminating the trouble of jig replacement, and improving test efficiency.

[0007] According to some embodiments of the present invention, a pressure regulating device is further included, which is arranged on the base. The pressure regulating device is transmission-connected to the pressure plate, and is used to drive the pressure plate to press the chip in the installation slot. The pressure regulating device is set to adjust the pressure of the pressure plate, ensuring that the pressure of the pressure plate on the chip can be quantified, which is convenient for adjusting the pressure parameters when testing the chip.

[0008] According to some embodiments of the present invention, the pressure regulating device includes a bracket, a motor, a pressure block and a screw rod. The bracket is arranged on the base, the motor is arranged on the bracket, the pressure block is connected to the bracket along a vertical sliding manner, the motor is connected to the screw rod, the screw rod is rotatably connected to the bracket, the pressure block is threadedly connected to the screw rod, and the motor is used to drive the pressure block to press the pressure plate. The pressure regulating device has a simple structure and relies on the drive of the screw rod to make the pressure adjustment more precise. The pressure block is threadedly connected to the screw rod to reduce the shaking of the pressure block and ensure the smooth progress of the pressure regulation process.

[0009] According to some embodiments of the present invention, the pressure regulating device also includes a pressure sensor, which is arranged on the pressure plate. The pressure block is used to press the pressure sensor. The pressure sensor is electrically connected to the motor through the PCB board. The setting of the pressure sensor enables the motor to adaptively adjust the pressure according to demand, thereby facilitating automatic control of the pressure.

[0010] According to some embodiments of the present invention, a temperature regulating component is provided on the base, and the temperature regulating component is used to regulate the temperature in the mounting groove. The temperature regulating component is provided to simulate the temperature change of the environment and provide a temperature environment for chip testing.

[0011] According to some embodiments of the present invention, the temperature regulation component includes a radiator and a thermoelectric cooler. The thermoelectric cooler has two temperature ends, one of which is placed inside the base, and the other is placed on the radiator. The thermoelectric cooler is electrically connected to a temperature regulation component, and the temperature regulation component is arranged on a PCB board. The temperature regulation component is used to control the temperature of the thermoelectric cooler. The structure of the temperature regulation component is simple, and the temperature adjustment is realized by using the thermoelectric cooler.

[0012] According to some embodiments of the present invention, a heat dissipation copper mesh is embedded in the base. The heat dissipation copper mesh is arranged around the circumference of the installation groove. The heat dissipation copper mesh is connected to one of the temperature ends of the thermoelectric cooler, and the heat dissipation copper mesh is convenient for distributing the temperature to the base to make the temperature evenly distributed.

[0013] According to some embodiments of the present invention, a shielding cover is further included. The shielding cover is detachably connected to the base. The shielding cover is used to cover the base, the turntable and the pressing plate. The provided shielding cover avoids interference of external electromagnetic waves on the test process.

[0014] According to some embodiments of the present invention, a heat preservation layer is arranged in the installation groove. The provided heat preservation layer is convenient for heat preservation of the installation groove.

[0015] According to some embodiments of the present invention, a transition fillet is arranged at the edge of the positioning hole. The provided transition fillet is convenient for the elastic contact pin to enter the positioning hole.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, become obvious in part from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The following further describes the present invention in conjunction with the drawings and embodiments, where:

[0018] Figure 1 is a schematic structural view of a chip test fixture according to an embodiment of the present invention;

[0019] Figure 2 is an exploded view of a chip test fixture according to an embodiment of the present invention;

[0020] Figure 3 is Figure 2 an enlarged view of part A in

[0021] Figure 4 is a schematic structural view of a chip test fixture from a bottom view angle according to an embodiment of the present invention;

[0022] Figure 5Schematic diagram of the temperature adjustment component on the chip test fixture according to an embodiment of the present invention.

[0023] Reference numerals:

[0024] PCB board 100;

[0025] Base 200, mounting groove 210;

[0026] Positioning hole 220, transition fillet 221;

[0027] Conductive contact block 230, first buckle structure 240;

[0028] Temperature adjustment component 250, radiator 251, semiconductor refrigeration sheet 252;

[0029] Heat dissipation copper mesh 260, elastic contact pin 270;

[0030] Rotary table 300, pressing plate 400, second buckle structure 410, contact foot 420;

[0031] Voltage regulating device 500, bracket 510, motor 520, pressing block 530, screw rod 540, pressure sensor 550;

[0032] [[ID=3O]]Shielding cover 600. Detailed implementation manners

[0033] In the description of the present invention, it should be understood that for the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present invention.

[0034] In the description of the present invention, if the first and second are described only for the purpose of distinguishing technical features, it should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0036] Refer to Figures 1 to 5, the present invention discloses a chip testing fixture, which includes a PCB board 100, a base 200, a turntable 300 and a pressing plate 400. The base 200 is arranged on the PCB board 100. An installation groove 210, positioning holes 220, conductive contact blocks 230 and a first buckle structure 240 are provided on the base 200. The installation groove 210 is used for installing the chip. There are several positioning holes 220. The conductive contact blocks 230 are arranged in the positioning holes 220 and are arranged in one-to-one correspondence with the positioning holes 220. One end of the conductive contact block 230 is electrically connected to the PCB board 100, and the other end of the conductive contact block 230 is lower than the positioning hole 220. The turntable 300 is rotatably connected to the base 200. Several groups of elastic contact pins 270 are provided at one end of the turntable 300 close to the base 200. Each group of elastic contact pins 270 includes several elastic contact pins 270. The elastic contact pins 270 are used for inserting into the positioning holes 220 to contact the other end of the conductive contact block 230. There are several pressing plates 400. The pressing plates 400 are hinged to the turntable 300. The several pressing plates 400 are evenly distributed along the circumference of the turntable 300. A second buckle structure 410 is provided at one end of the pressing plate 400 away from the turntable 300. The second buckle structure 410 is used for buckling and connecting with the first buckle structure 240. Several contact feet 420 are provided on the surface of the pressing plate 400 for contacting the chip. One end of the contact feet 420 is used for electrically connecting the elastic contact pins 270, and the other end of the contact feet 420 is used for contacting the contacts on the chip.

[0037] It should be understood that the provided installation groove 210 facilitates the quick and accurate installation of the chip in place. The cooperation of the turntable 300 and several pressing plates 400 enables the pressing plates 400 to press different specifications of chips, facilitating the operator to quickly replace the pressing plates 400 for different chips and test the chips. The provided pressing plates 400 are evenly distributed along the circumference of the turntable 300, which is convenient for switching the pressing plates 400 when testing the chips. Since the pressing plates 400 mainly play the role of electrically connecting the chips, testing different chips can be achieved by switching different pressing plates 400. The provided elastic contact pins 270 ensure reliable contact with the conductive contact blocks, reduce errors during the testing process, and also enable the elastic contact pins 270 to be inserted into the positioning holes 220 to facilitate the fixation of the turntable 300 and also facilitate the provision of in-place perception. Due to the high efficiency and versatility of the entire fixture, the demand for testing fixtures for different types of chips can be reduced, thereby reducing production costs, eliminating the trouble of replacing the fixture, and improving the testing efficiency.

[0038] It should be noted that each pressing plate 400 is connected to the turntable 300 through a standard interface, and the replacement time of a single pressing plate is ≤15s, which improves the overall disassembly and maintenance efficiency by 6 times.

[0039] Refer to Figure 2, also includes a pressure regulating device 500, the pressure regulating device 500 is arranged on the base 200, the pressure regulating device 500 is connected to the pressing plate 400, the pressure regulating device 500 is used to drive the pressing plate 400 to press the chip in the installation groove 210, the set pressure regulating device 500 realizes the pressure adjustment of the pressing plate 400, ensures that the pressure of the pressing plate 400 on the chip can be quantified, and facilitates the adjustment of pressure parameters when testing the chip. The pressure regulating device 500 includes a bracket 510, a motor 520, a pressing block 530 and a screw 540. The bracket 510 is arranged on the base 200, The motor 520 is set on the bracket 510, and the pressure block 530 is connected to the bracket 510 in a vertical sliding manner. The motor 520 is connected to the screw rod 540 for transmission, and the screw rod 540 is rotatably connected to the bracket 510. The pressure block 530 is threadedly connected to the screw rod 540. The motor 520 is used to drive the pressure block 530 to press the pressure plate 400. The pressure regulating device 500 has a simple structure and relies on the drive of the screw rod 540 to make the pressure adjustment more precise. The pressure block 530 is threadedly connected to the screw rod 540 to reduce the shaking of the pressure block 530 and ensure the smooth progress of the pressure regulation process.

[0040] In some embodiments, the pressure regulating device 500 can also be directly driven by a cylinder, using the cylinder shaft to drive the pressure block 530 to press the pressure plate 400, so that the pressure plate 400 presses the chip. In addition, the pressure regulating device 500 also includes a pressure sensor 550. The pressure sensor 550 is arranged on the pressure plate 400. The pressure block 530 is used to press the pressure sensor 550. The pressure sensor 550 is electrically connected to the motor 520 through the PCB board 100. The set pressure sensor 550 enables the motor 520 to adaptively adjust the pressure according to demand, which is convenient for automatic control of pressure. It can be understood that the PCB board 100 integrates a control module, and the pressure sensor 550 and the motor 520 are connected through the control module. The action of the motor 520 is controlled by preset parameters, thereby automatically regulating the pressure.

[0041] Reference Figure 2 and Figure 5, a temperature regulation component 250 is provided on the base 200. The temperature regulation component 250 is used to regulate the temperature in the installation groove 210. The set temperature regulation component 250 simulates the temperature change of the environment and provides a temperature environment for chip testing. The temperature regulation component 250 includes a radiator 251 and a semiconductor refrigeration chip 252. The semiconductor refrigeration chip 252 has two temperature ends, one of which is placed inside the base 200 and the other is placed on the radiator 251. The semiconductor refrigeration chip 252 is electrically connected to the temperature regulation component 250. The temperature regulation component 250 is arranged on the PCB board 100. The temperature regulation component 250 is used to control the temperature of the semiconductor refrigeration chip 252. The structure of the temperature regulation component 250 is simple, and the temperature adjustment is realized by using the semiconductor refrigeration chip 252. It can be understood that the semiconductor refrigeration chip 252 can realize the switching between refrigeration and heating by changing the voltage direction. How to connect the wires specifically belongs to conventional technology. By switching the refrigeration and heating of the semiconductor refrigeration chip 252 and adjusting the refrigeration and heating power, the temperature in the installation groove 210 is always kept within the preset temperature range. That is, when the temperature rises during testing, the temperature can be lowered by the semiconductor refrigeration chip 252, and when the ambient temperature is too low, the temperature can be raised by the semiconductor refrigeration chip 252. The radiator 251 is a necessary component, and its function of temperature exchange is played. The radiator 251 not only includes heat dissipation fins, but also includes other necessary components such as a fan. That is, the components required for the normal operation of the semiconductor refrigeration chip 252 are all conventional settings.

[0042] In some embodiments, a heat dissipation copper mesh 260 is embedded in the base 200. The heat dissipation copper mesh 260 is arranged around the circumference of the installation groove 210. The heat dissipation copper mesh 260 is connected to one of the temperature ends of the semiconductor refrigeration chip 252. The heat dissipation copper mesh 260 is convenient for distributing the temperature to the base 200 and making the temperature evenly distributed. It can be understood that the heat dissipation copper mesh 260 enables the temperature generated by the semiconductor refrigeration chip 252 to be evenly distributed on the heat dissipation copper mesh 260. Due to the installation method of the heat dissipation copper mesh 260, the four sides of the installation groove 210 can all receive a certain temperature, ensuring the uniformity of the temperature in the installation groove 210 and reducing the error during the chip testing process.

[0043] Refer to Figures 1 to 4 , further including a shielding cover 600. The shielding cover 600 is detachably connected to the base 200. The shielding cover 600 is used to cover the base 200, the turntable 300 and the pressing plate 400. The set shielding cover 600 avoids interference from external electromagnetic waves during the testing process.

[0044] In some embodiments, a thermal insulation layer (not shown in the figure) is provided in the installation groove 210. The set thermal insulation layer is convenient for insulating the installation groove 210. It can be understood that the thermal insulation layer includes a microporous alumina coating, an aerogel composite coating or a graphene coating.

[0045] Reference Figure 3 , a transition fillet 221 is provided at the edge of the positioning hole 220. The provided transition fillet 221 facilitates the entry of the elastic contact pin 270 into the positioning hole 220. It can be understood that the transition fillet 221 can not only play a role in transitioning and guiding the elastic contact pin 270, but also make the elastic contact pin 270 enter the positioning hole 220 relatively smoothly, reduce the rigid collision between the positioning hole 220 and the elastic contact pin 270, make the perception generated by the elastic contact pin 270 in the positioning hole 220 softer, and facilitate the operation.

[0046] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0047] Certainly, the present invention is not limited to the above-described embodiments. Those skilled in the art can also make equivalent deformations or substitutions without departing from the spirit of the present invention. These equivalent variations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A chip test fixture, characterized in that: include: PCB board (100); A base (200) is arranged on the PCB board (100), and the base (200) is provided with a mounting groove (210), a positioning hole (220), a conductive contact block (230) and a first snap-fit structure (240), wherein the mounting groove (210) is used to mount a chip, a plurality of positioning holes (220) are provided, and the conductive contact blocks (230) are arranged in the positioning holes (220) and are arranged in a one-to-one correspondence with the positioning holes (220), one end of the conductive contact block (230) is electrically connected to the PCB board (100), and the other end of the conductive contact block (230) is lower than the positioning hole (220); A turntable (300) is rotatably connected to the base (200), and a plurality of groups of elastic contact pins (270) are provided at one end of the turntable (300) close to the base (200), each group of the elastic contact pins (270) including a plurality of elastic contact pins (270), and the elastic contact pins (270) are used to be inserted into the positioning holes (220) to contact the other end of the conductive contact block (230); A plurality of pressure plates (400) are provided, wherein the pressure plates (400) are hinged on the turntable (300), and the plurality of pressure plates (400) are evenly distributed along the circumference of the turntable (300); a second snap-fit structure (410) is provided at one end of the pressure plate (400) away from the turntable (300), and the second snap-fit structure (410) is used for snap-fit connection with the first snap-fit structure (240); a plurality of contact pins (420) are provided on one side of the pressure plate (400) for contacting the chip, one end of the contact pin (420) is used for electrically connecting to the elastic contact pin (270), and the other end of the contact pin (420) is used for contacting a contact point on the chip.

2. The chip testing fixture according to claim 1, characterized in that: It also includes a pressure regulating device (500), which is arranged on the base (200) and is connected to the pressing plate (400) in a transmission manner. The pressure regulating device (500) is used to drive the pressing plate (400) to press the chip in the installation groove (210).

3. The chip testing fixture according to claim 2, characterized in that: The pressure regulating device (500) comprises a bracket (510), a motor (520), a pressure block (530) and a screw rod (540), wherein the bracket (510) is arranged on the base (200), the motor (520) is arranged on the bracket (510), the pressure block (530) is connected to the bracket (510) in a vertical sliding manner, the motor (520) is connected to the screw rod (540) in a transmission manner, the screw rod (540) is connected to the bracket (510) in a rotational manner, the pressure block (530) is threadedly connected to the screw rod (540), and the motor (520) is used to drive the pressure block (530) to press the pressure plate (400).

4. The chip testing fixture according to claim 3, characterized in that: The pressure regulating device (500) further comprises a pressure sensor (550), the pressure sensor (550) being arranged on the pressing plate (400), the pressing block (530) being used to press the pressure sensor (550), and the pressure sensor (550) being electrically connected to the motor (520) via the PCB board (100).

5. The chip testing fixture according to any one of claims 1 to 4, characterized in that: A temperature regulating component (250) is provided on the base (200), and the temperature regulating component (250) is used to regulate the temperature in the installation groove (210).

6. The chip testing fixture according to claim 5, characterized in that: The temperature regulating component (250) comprises a radiator (251) and a semiconductor refrigeration plate (252). The semiconductor refrigeration plate (252) has two temperature ends, one of which is placed in the base (200) and the other is placed in the radiator (251). The semiconductor refrigeration plate (252) is electrically connected to the temperature regulating component (250). The temperature regulating component (250) is arranged on a PCB board (100). The temperature regulating component (250) is used to control the temperature of the semiconductor refrigeration plate (252).

7. The chip testing fixture according to claim 6, characterized in that: A heat dissipation copper mesh (260) is embedded in the base (200), the heat dissipation copper mesh (260) is arranged around the circumference of the installation groove (210), and the heat dissipation copper mesh (260) is connected to one of the temperature ends of the semiconductor refrigeration plate (252).

8. The chip testing fixture according to claim 7, characterized in that: It also includes a shielding cover (600), which is detachably connected to the base (200), and is used to shield the base (200), the turntable (300), and the pressing plate (400).

9. The chip testing fixture according to claim 1, characterized in that: A heat-insulating layer is provided in the installation groove (210).

10. The chip testing fixture according to claim 1, characterized in that: The edge of the positioning hole (220) is provided with a transition fillet (221).

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